a FEATURES 0.8 Max On Resistance @125C 0.28 Max On Resistance Flatness @125C 1.8 V to 5.5 V Single Supply 200 mA Current Carrying Capability Automotive Temperature Range: -40C to +125C Rail-to-Rail Operation 8-Lead MSOP Package 33 ns Switching Times Typical Power Consumption (<0.01 W) TTL/CMOS Compatible Inputs Pin Compatible with ADG721/722/723 APPLICATIONS Power Routing Battery-Powered Systems Communication Systems Data Acquisition Systems Audio and Video Signal Routing Cellular Phones Modems PCMCIA Cards Hard Drives Relay Replacement <1 CMOS 1.8 V to 5.5 V, Dual SPST Switches ADG821/ADG822/ADG823 FUNCTIONAL BLOCK DIAGRAM ADG822 ADG821 S1 S1 IN1 IN1 D1 D1 D2 D2 IN2 IN2 S2 S2 ADG823 S1 IN1 D1 D2 IN2 S2 SWITCHES SHOWN FOR A LOGIC "0" INPUT GENERAL DESCRIPTION PRODUCT HIGHLIGHTS The ADG821, ADG822, and ADG823 are monolithic CMOS SPST (single pole, single throw) switches. These switches are designed on an advanced submicron process that provides low power dissipation, yet gives high switching speed, low on resistance, and low leakage currents. 1. Very Low On Resistance (0.5 typ) The ADG821, ADG822, and ADG823 are designed to operate from a single 1.8 V to 5.5 V supply, making them ideal for use in battery-powered instruments. 5. Low Power Dissipation. CMOS construction ensures low power dissipation. Each switch of the ADG821/ADG822/ADG823 conducts equally well in both directions when on. The ADG821, ADG822, and ADG823 contain two independent SPST switches. The ADG821 and ADG822 differ only in that both switches are normally open and normally closed, respectively. In the ADG823, Switch 1 is normally open and Switch 2 is normally closed. The ADG823 exhibits break-before-make switching action. 2. On Resistance Flatness (RFLAT(ON)) (0.15 typ) 3. Automotive Temperature Range -40C to +125C 4. 200 mA Current Carrying Capability 6. 8-Lead MSOP Package The ADG821, ADG822, and ADG823 are available in an 8-lead MSOP package. REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2002 10%, GND = 0 V. All specifications ADG821/ADG822/ADG823-SPECIFICATIONS1 (V-40C= 5toV+125C, unless otherwise noted.) DD Parameter 25C ANALOG SWITCH Analog Signal Range On Resistance (RON) -40C to +85C -40C to +125C2 0 V to VDD 0.5 0.6 On Resistance Match Between Channels (RON) On Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH 0.16 0.2 0.15 0.23 0.01 0.25 0.01 0.25 0.01 0.25 0.7 0.8 0.25 0.28 0.26 0.3 Test Conditions/Comments V typ max VS = 0 V to VDD, IS = 100 mA; Test Circuit 1 typ max typ max VS = 0 V to VDD, IS = 100 mA VS = 0 V to VDD, IS = 100 mA VDD = 5.5 V VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = VD = 1 V, or VS = VD = 4.5 V; Test Circuit 3 3 25 3 25 3 25 nA typ nA max nA typ nA max nA typ nA max 2.0 0.8 V min V max 0.1 A typ A max pF typ VIN = VINL or VINH ns typ ns max ns typ ns max ns typ ns min pC typ RL = 50 , CL = 35 pF, VS = 3 V; Test Circuit 4 RL = 50 , CL = 35 pF, VS = 3 V; Test Circuit 4 RL = 50 , CL = 35 pF, VS1 = VS2 = 3 V; Test Circuit 5 VS = 2.5 V; RS = 0 , CL = 1 nF; Test Circuit 6 RL = 50 , CL = 5 pF, f =1 MHz; Test Circuit 7 RL = 50 , CL = 5 pF f = 1 MHz; Test Circuit 9 RL = 50 , CL = 5 pF; Test Circuit 8 f =1 MHz f =1 MHz f =1 MHz 0.005 CIN, Digital Input Capacitance Unit 4 3 DYNAMIC CHARACTERISTICS tON tOFF 33 45 11 16 32 48 52 19 21 Break-Before-Make Time Delay, tBBM (ADG823 Only) Charge Injection 15 1 Off Isolation -52 dB typ Channel-to-Channel Crosstalk -82 dB typ Bandwidth -3 dB 24 MHz typ CS (OFF) CD (OFF) CD, CS (ON) 85 98 230 pF typ pF typ pF typ VDD = 5.5 V Digital Inputs = 0 V or 5.5 V POWER REQUIREMENTS IDD 0.001 1.0 2.0 A typ A max NOTES 1 Temperature range: Automotive range: -40C to +125C. 2 On resistance parameters tested with I S = 10 mA. 3 Guaranteed by design, not subject to production test. Specifications subject to change without notice. -2- REV. 0 (VDD = 2.7 V to 3.6 V, GND = 0 V. All specifications -40C to +125C, unless otherwise noted.)1 Parameter 25C ANALOG SWITCH Analog Signal Range On Resistance (RON) -40C to +85C -40C to +125C2 0 V to VDD On Resistance Match Between Channels (RON) On Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) 0.7 1.4 0.16 0.2 0.3 0.01 0.25 0.01 0.25 0.01 0.25 Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH 1.5 1.6 0.25 0.28 0.33 Test Conditions/Comments V typ max typ max typ VS = 0 V to VDD, IS = 100 mA VS = 0 V to VDD, IS = 100 mA VDD = 3.6 V VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2 VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2 VS = VD = 1 V, or 3.3 V; Test Circuit 3 VS = 0 V to VDD, IS = 100 mA; Test Circuit 1 3 15 3 25 3 25 nA typ nA max nA typ nA max nA typ nA max 2.0 0.8 V min V max 0.1 A typ A max pF typ VIN = VINL or VINH RL = 50 , CL = 35 pF, VS = 1.5 V; Test Circuit 4 RL = 50 , CL = 35 pF, VS = 1.5 V; Test Circuit 4 RL = 50 , CL = 35 pF, VS1 = VS2 = 1.5V; Test Circuit 5 VS =1.5 V; RS = 0 , CL = 1 nF; Test Circuit 6 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 7 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 9 RL = 50 , CL = 5 pF; Test Circuit 8 f =1 MHz f =1 MHz f =1 MHz 0.005 CIN, Digital Input Capacitance Unit ADG821/ADG822/ADG823 4 3 DYNAMIC CHARACTERISTICS tON Break-Before-Make Time Delay, tBBM (ADG823 Only) Charge Injection 2 ns typ ns max ns typ ns max ns typ ns min pC typ Off Isolation -52 dB typ Channel-to-Channel Crosstalk -82 dB typ Bandwidth -3 dB 24 MHz typ CS (OFF) CD (OFF) CD, CS (ON) 85 98 230 pF typ pF typ pF typ tOFF 48 67 12 18 40 74 78 20 23 1 VDD = 3.6 V Digital Inputs = 0 V or 3.6 V POWER REQUIREMENTS IDD 0.001 1.0 2.0 A typ A max NOTES 1 Temperature range: Automotive range: -40C to +125C. 2 On resistance parameters tested with I S = 10 mA. 3 Guaranteed by design, not subject to production test. Specifications subject to change without notice. REV. 0 -3- Spec RIGHT ADG821/ADG822/ADG823 ABSOLUTE MAXIMUM RATINGS 1 JCThermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300C IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235C (TA = 25C, unless otherwise noted.) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +7 V Analog Inputs2 . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First Digital Inputs2 . . . . . . . . . . . . . . . . . . -0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 200 mA Operating Temperature Range Automotive . . . . . . . . . . . . . . . . . . . . . . . -40C to +125C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Junction Temperature (Tj max) . . . . . . . . . . . . . . . . . . . 150C Package Power Dissipation . . . . . . . . . . . . . . (Tj max - TA)/JA 8-Lead MSOP Package JAThermal Impedance . . . . . . . . . . . . . . . . . . . . . 206C/W NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. Table I. Truth Table for the ADG821/ADG822 Table II. Truth Table for the ADG823 ADG821 INx ADG822 INx Switch x Condition IN1 IN2 Switch S1 Switch S2 0 1 1 0 OFF ON 0 0 1 1 0 1 0 1 OFF OFF ON ON ON OFF ON OFF ORDERING GUIDE Model Option Temperature Range Brand* Package Description Package ADG821BRM ADG822BRM ADG823BRM -40C to +125C -40C to +125C -40C to +125C SQB SRB SSB MSOP (microSmall Outline IC) MSOP (microSmall Outline IC) MSOP (microSmall Outline IC) RM-8 RM-8 RM-8 * Branding on MSOP packages is limited to three characters due to space constraints. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG821/ADG822/ADG823 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. -4- WARNING! ESD SENSITIVE DEVICE REV. 0 ADG821/ADG822/ADG823 PIN CONFIGURATION 8-Lead MSOP (RM-8) S1 1 V TOP VIEW 8 DD (Not to Scale) D1 2 7 IN1 IN2 3 GND 4 ADG821/ ADG822/ ADG823 6 D2 5 S2 TERMINOLOGY VDD Most Positive Power Supply Potential GND Ground (0 V) Reference IDD Positive Supply Current S Source Terminal. May be an input or output. D Drain Terminal. May be an input or output. IN Logic Control Input RON Ohmic Resistance between D and S RON On Resistance Match between any Two Channels (i.e., RON max - RON min) RFLAT(ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range. IS (OFF) Source Leakage Current with the Switch OFF ID (OFF) Drain Leakage Current with the Switch OFF ID, IS (ON) Channel Leakage Current with the Switch ON VD (VS) Analog Voltage on Terminals D and S VINL Maximum Input Voltage for Logic "0" VINH Minimum Input Voltage for Logic "1" IINL (IINH) Input Current of the Digital Input CS (OFF) OFF Switch Source Capacitance CD (OFF) OFF Switch Drain Capacitance CD, CS (ON) ON Switch Capacitance tON Delay between Applying the Digital Control Input and the Output Switching ON tOFF Delay between Applying the Digital Control Input and the Output Switching OFF tBBM OFF time or ON time measured between the 90% points of both switches, when switching from one address state to another. Charge Injection It is a measure of the glitch impulse transferred from the digital input to the analog output during switching. Crosstalk It is a measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A Measure of Unwanted Signal Coupling through an OFF Switch Bandwidth The Frequency at which the Output Is Attenuated by -3 dBs On Response The Frequency Response of the ON Switch Insertion Loss The Loss due to the On Resistance of the Switch REV. 0 -5- ADG821/ADG822/ADG823-Typical Performance Characteristics 0.8 0.8 5.0 0.7 VDD = 3.0V TA = 25C VDD = 2.7V VDD = 5V TA = 25C 4.5 0.7 ON RESISTANCE - VDD = 4.5V 0.5 0.4 0.3 VDD = 5.0V 0.2 3.5 3.0 2.5 2.0 1.5 VDD = 5.5V 0 0 1 2 3 VD (VS) - V 4 5 5 TPC 1. On Resistance vs. VD (VS) 8 0.7 7 0.5 0.4 0.3 0.1 1.5 2.0 VD (VS) - V 2.5 TPC 3. On Resistance vs. VD (VS) for Different Temperatures TA = 25C IS, I D (ON) 4 ID (OFF) 3 2 3.0 50 VDD = 3V 0 -50 -100 -150 IS (OFF) -200 0 20 40 60 80 100 TEMPERATURE - C 120 125 0 TA = 25C -10 VDD = 3V 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Vs - V TPC 6. Charge Injection vs. Source Voltage 0 60 VDD = 5V 100 TPC 5. Leakage Currents vs. Temperature TPC 4. On Resistance vs. VD (VS) for Different Temperatures 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VD (VS) - V 150 5 -1 1.0 -40C 0 VDD = 5V, 3V 0 VDD = 3V 0.5 0.2 200 1 0 0.3 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VD (VS) - V -40C 0.2 0.4 0 0 6 CURRENT - nA ON RESISTANCE - +125C +85C +25C +85C 0.5 +25C TPC 2. On Resistance vs. VD (VS) 0.8 0.6 0.6 0.1 0.5 0 +125C 1.0 0.1 0 VDD = 1.8V CHARGE INJECTION - pC ON RESISTANCE - 0.6 VDD = 3.3V ON RESISTANCE - 4.0 0 VDD = 3V, 5V TA = 25C -1 tON VDD = 5V 30 20 VDD = 3V, 5V tOFF 10 0 -40 -20 ATTENUATION - dB TIME - ns 40 ATTENUATION - dB -2 -20 -30 -40 -50 20 40 60 80 100 1200 TEMPERATURE - C TPC 7. tON/tOFF vs. Temperature -4 -5 -6 -7 -60 0 -3 -70 0.2 -8 VDD = 3V, 5V TA = 25C -9 1 10 FREQUENCY - MHz 100 TPC 8. Off Isolation vs. Frequency -6- 0.1 1 10 FREQUENCY - MHz 100 TPC 9. On Response vs. Frequency REV. 0 ADG821/ADG822/ADG823 LOGIC THRESHOLD VOLTAGE - V -20 ATTENUATION - dB -30 -40 -50 -60 -70 -80 -90 -100 -110 0.1 1 10 FREQUENCY - MHz TPC 10. Crosstalk vs. Frequency REV. 0 100 1.8 0.050 1.6 0.045 0.040 1.4 1.0 VS = 5V VP-P = 2V RL = 600 0.035 VIN RISING 1.2 THD - % -10 VIN FALLING 0.8 0.6 0.030 0.025 0.020 0.015 0.4 0.010 0.4 0.005 0 0 1 2 3 VDD - V 4 5 TPC 11. Logic Threshold Voltage vs. Suppply Voltage -7- 6 20 100 1K FREQUENCY - Hz TPC 12. THD 10K ADG821/ADG822/ADG823 Test Circuits IDS IS (OFF) V1 S D VS D ID (ON) ID (OFF) S A S NC A D A VD VD NC = NO CONNECT VS RON = V1/IDS Test Circuit 2. Off Leakage Test Circuit 1. On Resistance Test Circuit 3. On Leakage VDD 0.1F VIN ADG821 VDD S VS VOUT D RL 50 IN VIN ADG822 50% 50% 50% 50% CL 35pF 90% 90% VOUT GND tOFF tON Test Circuit 4. Switching Times VDD 0.1F VIN VDD VS1 VS2 S1 D1 S2 D2 VOUT2 RL2 50 IN1, IN2 VIN 50% 0V VOUT1 RL1 50 90% 90% VOUT1 CL1 35pF 50% 0V CL2 35pF GND 90% VOUT2 90% 0V tBBM tBBM Test Circuit 5. Break-Before-Make Time Delay, tBBM (ADG823 only) VDD SW ON VDD RS VS S D SW OFF VIN VOUT CL 1nF IN VOUT GND VOUT QINJ = CL VOUT Test Circuit 6. Charge Injection -8- REV. 0 ADG821/ADG822/ADG823 VDD VDD 0.1F 0.1F NETWORK ANALYZER VDD S VDD S 50 50 IN RL 50 GND VOUT VIN GND VOUT INSERTION LOSS = 20 LOG VS Test Circuit 7. Off Isolation 0.1F NETWORK ANALYZER VDD S1 RL 50 D S2 R 50 IN VS GND CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG VOUT VS Test Circuit 9. Channel-to-Channel Crosstalk REV. 0 RL 50 -9- VOUT VOUT WITH SWITCH VOUT WITHOUT SWITCH Test Circuit 8. Bandwidth VDD 50 VS D VIN VOUT 50 IN VS D OFF ISOLATION = 20 LOG NETWORK ANALYZER ADG821/ADG822/ADG823 OUTLINE DIMENSIONS 8-Lead MSOP Package [MSOP] (RM-8) Dimensions shown in millimeters 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 0.23 0.08 8 0 0.80 0.40 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA -10- REV. 0 -11- -12- PRINTED IN U.S.A. C02851-0-8/02(0)