PACKAGE INFORMATION
Page
Index ----
DIP ----
LQFP ----
QFP ----
SIL ----
SO ----
SSOP ----
VSO ----
Soldering ----
1997 Apr 02 2
Philips Semiconductors
Package information Package outlines
INDEX
NAME DESCRIPTION VERSION PAGE
DIP (dual in-line package)
DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1
DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1
DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1
LQFP (low profile quad flat package)
LQFP64 plastic low profile quad flat package; 64 leads; body 10 ×10 ×1.4 mm SOT314-2
LQFP100 plastic low profile quad flat package; 100 leads; body 14 ×14 ×1.4 mm SOT407-1
LQFP128 plastic low profile quad flat package; 128 leads; body 14 ×20 ×1.4 mm SOT425-1
QFP (quad flat package)
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 ×10 ×1.75 mm SOT307-2
SIL (single in-line)
SIL9MP plastic single in-line medium power package; 9 leads SOT142-1
SO (small outline)
SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
SO8 plastic small outline package; 8 leads; body width 7.5 mm SOT176-1
SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
SSOP (shrink small outline package)
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
VSO (very small outline)
VSO40 plastic very small outline package; 40 leads SOT158-1
VSO56 plastic very small outline package; 56 leads SOT190-1
1997 Apr 02 3
Philips Semiconductors
Package information Package outlines
DIP
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1997 Apr 02 4
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 (1) (1)
b1cD (1)
Z
Ee M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1 92-11-17
95-03-11
A
min. A
max. bmax.
w
ME
e1
1.73
1.13 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.24.2 0.51 3.2
0.068
0.044 0.021
0.015 0.77
0.73
0.014
0.009 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0870.17 0.020 0.13
050G04 MO-001AA
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
14
1
8
7
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
1997 Apr 02 5
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1 92-10-02
95-01-19
A
min. A
max. bmax.
w
ME
e1
1.40
1.14
0.055
0.045
0.53
0.38 0.32
0.23 21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15 0.021
0.015 0.013
0.009 0.010.100.0200.19
050G09 MO-001AE
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
1997 Apr 02 6
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 92-11-17
95-05-24
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.04.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0780.17 0.020 0.13
SC603
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1997 Apr 02 7
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT101-1 92-11-17
95-01-23
A
min. A
max. bw
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 32.0
31.4 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 2.25.1 0.51 4.0
0.066
0.051 0.021
0.015 0.013
0.009 1.26
1.24 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0870.20 0.020 0.16
051G02 MO-015AD
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
24
1
13
12
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Z
max.
(1)
(1)(1)
DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1
1997 Apr 02 8
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1(1)
(1) (1)
cD E weM
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT117-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 36.0
35.0 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 1.75.1 0.51 4.0
0.066
0.051 0.020
0.014 0.013
0.009 1.41
1.34 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0670.20 0.020 0.16
051G05 MO-015AH
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
28
1
15
14
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
1997 Apr 02 9
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
w
ME
e1
1.70
1.14 0.53
0.38 0.36
0.23 52.50
51.50 14.1
13.7 3.60
3.05 0.2542.54 15.24 15.80
15.24 17.42
15.90 2.254.7 0.51 4.0
0.067
0.045 0.021
0.015 0.014
0.009 2.067
2.028 0.56
0.54 0.14
0.12 0.010.10 0.60 0.62
0.60 0.69
0.63 0.089 0.19 0.020 0.16
051G08 MO-015AJ
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
40
1
21
20
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1)(1)
DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
1997 Apr 02 10
Philips Semiconductors
Package information Package outlines
LQFP
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.20
0.05 1.45
1.35 0.25 0.27
0.17 0.18
0.12 10.1
9.9 0.5 12.15
11.85 1.45
1.05 7
0
o
o
0.12 0.11.0 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2 95-12-19
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.15
11.85
E
Z
1.45
1.05
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
16
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
64
49
48 33
32
17
y
pin 1 index
wM
wM
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2
1997 Apr 02 11
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.6 0.20
0.05 1.5
1.3 0.25 0.28
0.16 0.18
0.12 14.1
13.9 0.5 16.25
15.75 1.15
0.85 7
0
o
o
0.12 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT407-1 95-12-19
97-08-04
D(1) (1)(1)
14.1
13.9
HD
16.25
15.75
E
Z
1.15
0.85
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
25
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
100
7675 5150
26
y
pin 1 index
wM
wM
0 5 10 mm
scale
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1
1997 Apr 02 12
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 1.45
1.35 0.25 0.27
0.17 0.20
0.09 14.1
13.9 0.5 16.15
15.85 0.81
0.59 7
0
o
o
0.120.2 0.11.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT425-1 96-04-02
97-08-04
D(1) (1)(1)
20.1
19.9
HD
22.15
21.85
E
Z
0.81
0.59
D
0 5 10 mm
scale
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
c
bp
E
HA2
D
HvMB
D
ZD
A
ZE
e
vMA
X
102
103
y
wM
wM
A
max.
1.6
LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1
6564
38
39
1
128
pin 1 index
1997 Apr 02 13
Philips Semiconductors
Package information Package outlines
QFP
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 1.85
1.65 0.25 0.40
0.20 0.25
0.14 10.1
9.9 0.8 1.3
12.9
12.3 1.2
0.8 10
0
o
o
0.15 0.10.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2 95-02-04
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
ZE
e
vMA
X
1
44
34 33 23 22
12
y
θ
A1
A
Lp
detail X
L
(A )
3
A2
pin 1 index
D
HvMB
bp
bp
wM
wM
0 2.5 5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
A
max.
2.10
1997 Apr 02 14
Philips Semiconductors
Package information Package outlines
SIL
UNIT A A3b1D1
b2
bcD
(1) E(1) eL
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 12
11 1.8
1.4 1.40
1.14 0.67
0.50 1.40
1.14 0.48
0.38 21.8
21.4 21.4
20.7
D2
18.6
18.2 6.48
6.20 2.54 3.9
3.4
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT142-1 95-02-09
97-12-16
0 5 10 mm
scale
Z(1)
1.0
0.25
wmax.
D
E
A
A
c
A2
3
L
Q
wM
b
b1
b2
D1
D2
Ze
19
seating plane
pin 1 index
SIL9MP: plastic single in-line medium power package; 9 leads SOT142-1
A
max.
2
3.7
1997 Apr 02 15
Philips Semiconductors
Package information Package outlines
SO
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1997 Apr 02 16
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) Z(1)
eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 7.65
7.45 7.6
7.4 1.27 10.65
10.00 1.1
1.0 2.0
1.8 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.45
SOT176-1 95-02-25
97-05-22
X
4
8
θ
A
A1
A2
wM
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
5
1
(A )
3
A
y
0.25
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.30
0.29 0.30
0.29 0.050
1.45
0.057
0.25
0.01
0.419
0.394 0.043
0.039 0.079
0.071
0.01 0.004
0.043
0.018
0.01
0 5 10 mm
scale
pin 1 index
SO8: plastic small outline package; 8 leads; body width 7.5 mm SOT176-1
1997 Apr 02 17
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013AA
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
95-01-24
97-05-22
1997 Apr 02 18
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
95-01-24
97-05-22
1997 Apr 02 19
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 15.6
15.2 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
13
(A )
3
A
y
0.25
075E05 MS-013AD
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.61
0.60 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
95-01-24
97-05-22
1997 Apr 02 20
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 18.1
17.7 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
e
15
1
(A )
3
A
y
0.25
075E06 MS-013AE
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.71
0.69 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
95-01-24
97-05-22
1997 Apr 02 21
Philips Semiconductors
Package information Package outlines
SSOP
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
01.4
1.2 0.32
0.20 0.20
0.13 6.6
6.4 4.5
4.3 0.65 1.0 0.2
6.6
6.2 0.65
0.45 0.48
0.18 10
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
SOT266-1 90-04-05
95-02-25
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
y
0.25
110
20 11
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
A
max.
1.5
1997 Apr 02 22
Philips Semiconductors
Package information Package outlines
VSO
UNIT A1A2A3bpcD
(1) E(2) Z(1)
eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 2.45
2.25 0.25 0.42
0.30 0.22
0.14 15.6
15.2 7.6
7.5 0.762 2.25
12.3
11.8 1.15
1.05 0.6
0.3 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-1 92-11-17
95-01-24
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004 0.096
0.089 0.017
0.012 0.0087
0.0055 0.61
0.60 0.30
0.29 0.03 0.089
0.48
0.46 0.045
0.041 0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.010
0 5 10 mm
scale
VSO40: plastic very small outline package; 40 leads SOT158-1
A
max.
2.70
0.11
1997 Apr 02 23
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 3.0
2.8 0.25 0.42
0.30 0.22
0.14 21.65
21.35 11.1
11.0 0.75 15.8
15.2 1.45
1.30 0.90
0.55 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1.6
1.4
SOT190-1 96-04-02
97-08-11
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
y
56 29
281
pin 1 index
0.012
0.004 0.12
0.11 0.017
0.012 0.0087
0.0055 0.85
0.84 0.44
0.43 0.0295
2.25
0.089
0.62
0.60 0.057
0.051 0.035
0.022
0.004
0.2
0.008 0.004
0.063
0.055
0.01
0 5 10 mm
scale
VSO56: plastic very small outline package; 56 leads SOT190-1
A
max.
3.3
0.13
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
