DATA SH EET
Preliminary specification
Supersedes data of March 1993
File under Integrated Circuits, IC01
1997 Sep 04
INTEGRATED CIRCUITS
TDA1545A
Stereo continuous calibration DAC
1997 Sep 04 2
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
FEATURES
•Space saving packages
•Low power consumption
•Low total harmonic distortion
•Wide dynamic range (16-bit resolution)
•Continuous calibration concept
•Easy application: single 3 to 5.5 V rail power supply and
output- and bias current are proportional to the supply
voltage
•Fast settling time permits 2×, 4×and 8×oversampling
(serial input) or double speed operation at 4×
oversampling
•Internal bias current ensures maximum dynamic range
•Wide operating temperature range of −40 to +85 °C
•Compatible with most of the Japanese input formats:
time multiplexed, two's complement and TTL
•No zero crossing distortion.
GENERAL DESCRIPTION
The TDA1545A is the first device of a new generation of
the digital-to-analog converters which embodies the
innovative technique of continuous calibration. The largest
bit-currents are repeatedly generated by one single
current reference source. This duplication is based upon
an internal charge storage principle having an accuracy
insensitive to ageing, temperature and process variations.
The device is fabricated in a 1.0 µm CMOS process and
features an extremely low power dissipation, small
package size and easy application. Furthermore, the
accuracy of the high coarse current combined with the
implemented symmetrical offset decoding method
preclude zero-crossing distortion and ensures high quality
audio reproduction. Therefore, the continuous calibration
digital-to-analog converter is eminently suitable for use in
(portable) digital audio equipment.
ORDERING INFORMATION
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA1545A DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TDA1545AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA1545ATT TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
1997 Sep 04 3
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VDD supply voltage 3 5 5.5 V
IDD supply current VDD =5V;
at code 0000H −3.0 4.0 mA
IFS full-scale output current VDD = 5 V 0.9 1.0 1.1 mA
VDD =3V −0.6 −mA
THD total harmonic distortion including noise
at 0 dB −−88 −78 dB
at 0 dB −0.004 0.01 %
at −60 dB −−33 −24 dB
at −60 dB −2.2 6 %
at −60 dB; −−35 −dB
A-weighting
at −60 dB; −1.7 −%
A-weighting
at −60 dB; −1.4 −%
A-weighting;
R3=R4=11kΩ;
I
FS =2mA
S/N signal-to-noise ratio at bipolar zero A-weighting;
at code 0000H 86 98 −dB
R3=R4=11kΩ;
I
FS =2mA −101 −dB
tcs current settling time to ±1 LSB −0.2 −µs
BR input bit rate at data input −−18.4 Mbits/s
fBCK clock frequency at clock input −−18.4 MHz
TCFS full-scale temperature coefficient at
analog outputs (IOL; IOR) −±400 −ppm
Ptot total power dissipation at code 0000H
VDD =5V −15 20 mW
VDD =3V −6−mW
Tamb operating ambient temperature −40 −+85 °C
1997 Sep 04 4
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
k
, full pagewidth
BCK
WS
DATA
MCD287 - 1
LEFT INPUT LATCH
LEFT BIT SWITCHES
LEFT OUTPUT LATCH
RIGHT INPUT LATCH
RIGHT BIT SWITCHES
RIGHT OUTPUT LATCH
1 CALIBRATED
SPARE
SOURCE
32 (5-BIT)
CALIBRATED
CURRENT
SOURCES
11-BIT
PASSIVE
DIVIDER
11-BIT
PASSIVE
DIVIDER
CONTROL
AND
TIMING
IBR
IBL
REFERENCE
SOURCE
IBL IBR
3.9 kΩ
1 nF C1
R1
IOL
VREF
3.9 kΩ
1 nF C2
R2
IOR
VREF
OP1
OP2
Vout
right
Vout
left
33 kΩ
R4
22 kΩ
R3
VREF
VDD
100 nF
C3
ground
(9) 5
(7) 4
(10) 6
(14) 8
(13) 7
1 (1)
2 (2)
3 (6)
TDA1545A
IREF
RREF
11 kΩ
IREF (E24)
(E24)
C4
1 µF
AND AND
1 CALIBRATED
SPARE
SOURCE
32 (5-BIT)
CALIBRATED
CURRENT
SOURCES
IREF
IREF
Fig.1 Block diagram.
The numbers given in parenthesis refer to the TDA1545ATT (SOT402-1) version.
1997 Sep 04 5
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
PINNING
SYMBOL PIN DESCRIPTION
SOT96-1;
SOT97-1 SOT402-1
BCK 1 1 bit clock input
WS 2 2 word select input
DATA 3 6 data input
GND 4 7 ground
VDD 5 9 positive supply voltage
IOL 6 10 left channel output
IREF 7 13 reference current input
IOR 8 14 right channel output
n.c. −3, 4, 5, 8, 11, 12 not connected
Fig.2 Pin configuration (SOT96-1; SOT97-1).
handbook, halfpage
1
2
3
4
8
7
6
5
MCD288 - 1
BCK
WS
DATA
GND
IOR
IREF
IOL
DD
V
TDA1545A
Fig.3 Pin configuration (SOT402-1).
handbook, halfpage
TDA1545ATT
MBK230
1BCK IOR
WS IREF
n.c. n.c.
n.c. n.c.
n.c. IOL
DATA VDD
GND n.c.
2
3
4
5
6
7
14
13
12
11
10
9
8
1997 Sep 04 6
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
FUNCTIONAL DESCRIPTION
The basic operation of the continuous calibration DAC is
illustrated in Fig.4. The figure shows the calibration
principle (Fig.4a) and operation principle (Fig.4b). During
calibration of the MOS current source (Fig.4a) transistor
M1 is connected as a diode by applying a reference
current. The voltage Vgs on the intrinsic gate-source
capacitance Cgs of M1 is then determined by the transistor
characteristics. After calibration of the drain current to the
reference value IREF, the switch S1 is opened and S2 is
switched to the other position (Fig.4b). The gate-to-source
voltage Vgs of M1 is not changed because the charge on
Cgs is preserved. Therefore the drain current of M1 will still
be equal to IREF and this exact duplicate of IREF is now
available at the Iout terminal. The 32 current sources and
the spare current source of the TDA1545A are
continuously calibrated (see Fig.1).
The spare current is included to allow for continuous
convertor operation. The output of one calibrated source is
connected to an 11-bit binary current divider consisting of
2048 transistors. A symmetrical offset decoding principle
is incorporated and arranges the bit switching in such a
way that the zero-crossing is performed only by the LSB
currents.
The TDA1545A accepts input serial data formats of 16-bit
word length. Left and right data words are time
multiplexed. The most significant bit (bit 1) must always be
first. The format of data input is shown in Figs 5 and 6.
With a LOW level on the word select input (WS) input data
is placed in the right input register and with a HIGH level
on the WS input data is placed in the left input register.
The data in the input registers is simultaneously latched in
the output registers which control the bit switches.
An internal bias current Ibias (see IBL and IBR in Fig.1) is
added to the full-scale output current IFS in order to
achieve the maximum dynamic range at the outputs of
OP1 and OP2 (see Fig.1). The reference input current IREF
controls with gain AFS the current IFS which is a sink
current and with gain Abias the Ibias which is a source
current (note 1). The current IREF is proportional to VDD so
the IFS and Ibias will also be proportional to VDD (note 2)
because AFS and Abias are constant.
The reference output voltage VREF in Fig.1 is2⁄3VDD. In this
way the maximum dynamic range is achieved over the
entire power supply range. The tolerance of the reference
input current in Fig.1 depends on the tolerance of the
resistors R3, R4 and RREF (note 3).
Notes to the functional description
1. IFS =A
FS ×IREF and Ibias =A
bias ×IREF
2.
3.
VDD1
VDD2
------------- IFS1
IFS2
---------- Ibias1
Ibias2
--------------
==
∆I
REF I=REF VDD
R3 ∆R3 R4 ∆R4 RREF ∆RREF
++++ +
---------------------------------------------------------------------------------------------------------
–
1997 Sep 04 7
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
2. Machine model; C = 200 pF, L = 0.5 µH, R = 10 Ω, 3 zaps positive and negative.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPpositive supply voltage −6V
T
xtal(max) maximum crystal temperature −+150 °C
Tstg storage temperature −55 +150 °C
Tamb operating ambient temperature −40 +85 °C
Ves electrostatic handling note 1 −2000 +2000 V
note 2 −200 +200 V
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air
SOT97-1 100 K/W
SOT96-1 160 K/W
SOT402-1 155 K/W
Fig.4 Calibration principle; (a) calibration, (b) operation.
handbook, full pagewidth
S2
S1 M1
Cgs Vgs
IREF
(a)
S2
S1 M1
Cgs Vgs
IREF
(b)
IREF
MCD289 - 1
out out
1997 Sep 04 8
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
CHARACTERISTICS
VDD =5V; T
amb =25°C; measured in the circuit of Fig.1; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VDD supply voltage 3.0 5.0 5.5 V
IDD supply current note 1 −3.0 4.0 mA
RR ripple rejection note 2 −30 −dB
Digital inputs (WS; BCK; DATA)
|IIL| input leakage current LOW VI= 0.8 V −−10 µA
|IIH| input leakage current HIGH VI= 2.4 V −−10 µA
fBCK bit clock input frequency −−18.4 MHz
BR bit rate data input −−18.4 Mbits/s
fWS word select input −−384 kHz
Timing (see Fig.5)
trrise time −−12 ns
tffall time −−12 ns
tCY bit clock cycle time 54 −−ns
tHB bit clock HIGH time 15 −−ns
tLB bit clock LOW time 15 −−ns
tSU;DAT data set-up time 12 −−ns
tHD;DAT data hold time 2 −−ns
tHD;WS word select hold time 2 −−ns
tSU;WS word select set-up time 12 −−ns
Analog input (IREF)
RREF reference resistor see Fig.1 7.4 11.0 14.6 kΩ
Analog outputs (IOL and IOR)
RES resolution −−16 bit
VDCC DC output voltage compliance 2.0 −VDD −1V
I
FS full-scale current 0.9 1.0 1.1 mA
TCFS full-scale temperature coefficient −±400 −ppm
Ibias bias current 643 714 785 µA
AFS reference input current to
full-scale output current gain −13.2 −
Abias reference input current to bias
current gain −9.42 −
1997 Sep 04 9
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
Notes
1. At code 0000H.
2. Vripple = 1% of supply voltage and fripple = 100 Hz.
3. Measured with 1 kHz sinewave generated at a sampling rate of 192 kHz.
4. Measured with 1 kHz sinewave over a 20 Hz to 20 kHz bandwidth generated at a sampling rate of 192 kHz.
5. R3 = R4 = 11 kΩ; see Fig.1; IFS = 2 mA.
THD total harmonic distortion including noise at 0 dB; −−88 −78 dB
note 3; see Fig.7 −0.004 0.01 %
including noise at −60 dB; −−33 −24 dB
note 3; Fig.7 −2.2 6 %
including noise at −60 dB, −−35 −dB
A-weighting −1.8 −%
R3=R4=11kΩ see Fig.1;
IFS =2mA −1.4 −%
including noise at 0 dB; note 4 −−84 −70 dB
−0.006 0.03 %
tcs settling time ±1 LSB −0.2 −µs
αchannel separation 86 95 −dB
|dIO| unbalance between outputs note 3 −0.2 0.3 dB
|td| delay time between outputs −±0.2 −µs
S/N signal-to-noise ratio
(A-weighting) at bipolar zero
note 1 86 98 −dB
note 5 −101 −dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1997 Sep 04 10
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
TEST AND APPLICATION INFORMATION
Fig.5 Timing and input signals.
handbook, full pagewidth
MLB001
MSB
DATA
BCK
WS
LEFT
RIGHT
LSB
tr
tHB
12
15
tf12
tLB
15
tHD;WS
2tSU;WS
12
tHD;DAT
2
tSU;DAT
12
tCY 54
SAMPLE OUT
1997 Sep 04 11
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
handbook, full pagewidth
MLB002
LSB LSB
MSBDATA
BCK
WS LEFT RIGHT
MSB
SAMPLE OUT
Fig.6 Format of input signals.
1997 Sep 04 12
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
APPLICATION INFORMATION
full pagewidth
0.01
1
0.1
10
MGA054
THD
(%)
frequency (Hz)
10 103
90
70
20
THD
(dB)
102104
50
80
40
60
30 (1)
(2)
Fig.7 Total harmonic distortion as a function of frequency (4FS).
(1) Measured including all distortion plus noise at a level of −60 dB.
(2) Measured including all distortion plus noise at a level of −0 dB.
The sample frequency 4FS: 176.4 kHz.
The graphs are constructed from average values of a small amount of engineering samples therefore no guarantee for typical values
is implied.
1997 Sep 04 13
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
Fig.8 Total harmonic distortion as a function of
signal level (4FS).
The sample frequency 4FS: 176.4 kHz.
The graphs are constructed from average values of a small amount
of engineering samples therefore no guarantee for typical values is
implied.
handbook, halfpage
100 0
100
0
20
MGA055
40
60
80
80 60 40 20
THD
(dB)
signal level (dB)
Fig.9 Total harmonic distortion as a function of
supply voltage VDD (4FS).
(1) Measured within the specified operating supply voltage range.
(2) Measured outside the specified operating supply voltage range.
The sample frequency 4FS: 176.4 kHz.
The graphs are constructed from average values of a small
amount of engineering samples therefore no guarantee for
typical values is implied.
handbook, halfpage
16
50
100
90
MGA056
80
70
60
2345
V (V)
DD
THD
(dB)
(2)
(1)
1997 Sep 04 14
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1997 Sep 04 15
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1997 Sep 04 16
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.72
0.38 8
0
o
o
0.13 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153 94-07-12
95-04-04
wM
bp
D
Z
e
0.25
17
14 8
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
A
max.
1.10
pin 1 index
1997 Sep 04 17
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO and TSSOP
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and
TSSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method.
Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering can be used for all SO packages. Wave
soldering is not recommended for TSSOP packages,
because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering is used - and cannot be avoided for
TSSOP packages - the following conditions must be
observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder
thieves at the downstream end.
Even with these conditions, do not consider wave
soldering TSSOP packages with 48 leads or more, that
is TSSOP48 (SOT362-1) and TSSOP56 (SOT364-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1997 Sep 04 18
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1997 Sep 04 19
Philips Semiconductors Preliminary specification
Stereo continuous calibration DAC TDA1545A
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1997 SCA55
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2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Printed in The Netherlands 547027/1200/03/pp20 Date of release: 1997 Sep 04 Document order number: 9397 750 02703
