Revision: D 3/27/2013
Sheet 1 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
Amplified Zero-Height SiSonicTM Microphone
With Enhanced RF Protection
The SPM0408LE5H-TB is a miniature, high-
performance, low power, bottom port
silicon microphone. Using Knowles’ proven
high performance SiSonicTM MEMS
technology, the SPM0408LE5H-TB consists
of an acoustic sensor, a low noise input
buffer, and an output amplifier. These
devices are suitable for applications such as
cellphones, smart phones, laptop
computers, sensors, digital still cameras,
portable music recorders, and other
portable electronic devices where excellent
wideband audio performance and RF
immunity are required.
Features:
Up to 20dB of Gain
Enhanced RF protection
Flat Frequency Response
Zero-Height MicTM
Operation to 5v
Ultra-Stable Performance
Standard SMD Reflow
Omnidirectional
Revision: D 3/27/2013
Sheet 2 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
1. ABSOLUTE MAXIMUM RATINGS
Parameter
Absolute Maximum Rating
Units
VDD to Ground
-0.5, +7.0
V
OUT to Ground
-0.3, VDD + 0.3
V
Input Current to Any Pin
±5
mA
Temperature Range
-40 to +100
°C
Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic
& Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical
Specifications” for extended periods may affect device reliability.
2. ACOUSTIC & ELECTRICAL SPECIFICATIONS
TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD(min) < VDD < VDD(max), no load, Gain = 20dB,
unless otherwise indicated
Parameter
Symbol
Conditions
Max
Units
Supply Voltage1
VDD
5.5
V
Supply Current1,2
IDD
350
µA
Sensitivity1
S
94 dB SPL @ 1 kHz
-15
dBV/Pa
Signal to Noise Ratio
SNR
94 dB SPL @ 1 kHz, A-weighted
-
dB(A)
Total Harmonic
Distortion
THD
94 dB SPL @ 1 kHz,
S = Typ, Rload > 2 k
1
%
Acoustic Overload
Point
AOP
10% THD @ 1 kHz, Gain = 0dB,
S = Typ, VDD = 5.5V, Rload > 2 k
-
dB SPL
Output Impedance
ZOUT
@ 1 kHz
200

Directivity
Omnidirectional
Polarity
Increasing sound pressure
Increasing output voltage
1 100% tested.
2 Maximum specifications are measured at maximum VDD. Typical specifications are measured at VDD = 1.8V.
3 For gain = 20dB, AOP(min) = 95 dB SPL.
Revision: D 3/27/2013
Sheet 3 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
3. FREQUENCY RESPONSE CURVE
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
2
4
6
8
10
12
14
16
18
20
100 1,000 10,000
Sensitivity (dB)
Frequency (Hz)
Typical Free Field Response
Normalized to 1 kHz (C1 = 2.2mF, R1 = 0)
Revision: D 3/27/2013
Sheet 4 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
4. INTERFACE CIRCUIT
Gain
GAIN Pin Termination
Unity Gain (0dB)
Connect GAIN to OUTPUT
Max Gain (20dB)
Set R1 = 0Set C1 according to equation below:
Highpass corner frequency =

Adjustable Gain
(0dB to 20dB)
Set R1 and C1 according to the equations below:
Gain(dB) = 󰇛

󰇜
Highpass corner frequency =
󰇛󰇜
Note: Capacitors near the microphone should not contain Class 2 dielectrics.
Detailed information on acoustic, mechanical, and system integration can be found in
the latest SiSonicTM Design Guide application note.
RF = 22k
GROUND
VDD
VDD
OUTPUT
R1 (Set By User)
GAIN
RS = 2.44k
Dotted Section
Represents
SiSonicTM
Microphone
.1mf
C1 (Set By User)
Revision: D 3/27/2013
Sheet 5 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
5. MECHANICAL SPECIFICATIONS
Item
Dimension
Tolerance
Length (L)
4.72
±0.10
Width (W)
3.76
±0.10
Height (H)
1.25
±0.10
Acoustic Port (AP)
Ø0.25
±0.08
Pin #
Pin Name
Type
Description
1
OUTPUT
Signal
Output Signal
2
GAIN
Signal
Connect resistor to set gain
3
GROUND
Power
Ground
4
GROUND
Power
Ground
5
GROUND
Power
Ground
6
VDD
Power
Power Supply
7
GROUND
Power
Ground
8
GROUND
Power
Ground
Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified.
Dimensions are in millimeters unless otherwise specified.
Tolerance is ±0.15mm unless otherwise specified
Revision: D 3/27/2013
Sheet 6 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
6. EXAMPLE LAND PATTERN
7. EXAMPLE SOLDER STENCIL PATTERN
Notes: Dimensions are in millimeters unless otherwise specified.
Detailed information on AP size considerations can be found in the latest SiSonicTM
Design Guide application note.
Further optimizations based on application should be performed.
Revision: D 3/27/2013
Sheet 7 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
8. PACKAGING & MARKING DETAIL
Model Number
Suffix
Reel Diameter
Quantity Per Reel
SPM0408LE5H-TB
-6
13”
4,800
Alpha Character A:
“S”: Knowles SiSonicTM Production
“E”: Knowles Engineering Samples
“P”: Knowles Prototype Samples
“JIN NUMBER”:
Unique Job Identification Number
for product traceability
Notes: Dimensions are in millimeters unless otherwise specified.
Vacuum pickup only in the pick area indicated in Mechanical Specifications.
Tape & reel per EIA-481.
Labels applied directly to reel and external package.
Shelf life: Twelve (12) months when devices are to be stored in factory supplied,
unopened ESD moisture sensitive bag under maximum environmental conditions of
30°C, 70% R.H.
Pin 1
Revision: D 3/27/2013
Sheet 8 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
9. RECOMMENDED REFLOW PROFILE
Profile Feature
Pb-Free
Average Ramp-up rate (TSMAX to TP)
3°C/second max.
Preheat
Temperature Min (TSMIN)
Temperature Max (TSMAX)
Time (TSMIN to TSMAX) (tS)
150°C
200°C
60-180 seconds
Time maintained above:
Temperature (TL)
Time (tL)
217°C
60-150 seconds
Peak Temperature (TP)
260°C
Time within 5°C of actual Peak Temperature (tP)
20-40 seconds
Ramp-down rate (TP to TSMAX)
6°C/second max
Time 25°C to Peak Temperature
8 minutes max
Notes: Based on IPC/JDEC J-STD-020 Revision C.
All temperatures refer to topside of the package, measured on the package body
surface.
Time 25°C to Peak
Ramp-down
Ramp-up
TSMIN
TSMAX
TL
TP
tL
tP
tS Preheat
Time
25°C
Temperature
Revision: D 3/27/2013
Sheet 9 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
10. ADDITIONAL NOTES
(A) MSL (moisture sensitivity level) Class 1.
(B) Maximum of 3 reflow cycles is recommended.
(C) In order to minimize device damage:
Do not board wash or clean after the reflow process.
Do not brush board with or without solvents after the reflow process.
Do not directly expose to ultrasonic processing, welding, or cleaning.
Do not insert any object in port hole of device at any time.
Do not apply over 30 psi of air pressure into the port hole.
Do not pull a vacuum over port hole of the microphone.
Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.
11. MATERIALS STATEMENT
Meets the requirements of the European RoHS directive 2011/65/EC as amended.
Meets the requirements of the industry standard IEC 61249-2-21:2003 for halogenated
substances and Knowles Green Materials Standards Policy section on Halogen-Free.
Ozone depleting substances are not used in the product or the processes used to make the
product, including compounds listed in Annex A, B, and C of the “Montreal Protocol on
Substances That Deplete the Ozone Layer.”
Revision: D 3/27/2013
Sheet 10 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
12. RELIABILITY SPECIFICATIONS
Test
Description
Thermal Shock
100 cycles air-to-air thermal shock from -40oC to +125oC with 15
minute soaks. (IEC 68-2-4)
High Temperature Storage
1,000 hours at +105oC environment (IEC 68-2-2 Test Ba)
Low Temperature Storage
1,000 hours at -40oC environment (IEC 68-2-2 Test Aa)
High Temperature Bias
1,000 hours at +105oC under bias (IEC 68-2-2 Test Ba)
Low Temperature Bias
1,000 hours at -40oC under bias (IEC 68-2-2 Test Aa)
Temperature / Humidity Bias
1,000 hours at +85oC/85% R.H. under bias. (JESD22-A101A-B)
Vibration
4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak
acceleration lasting 12 minutes in X, Y, and Z directions.
(Mil-Std-883E, Method 2007.2 A)
ESD-HBM
3 discharges of ±2 kV direct contact to I/O pins.
(MIL 883E, Method 3015.7)
ESD-LID/GND
3 discharges of ±8 kV direct contact to lid while unit is grounded.
(IEC 61000-4-2)
ESD-MM
3 discharges of ±200 V direct contact to I/O pins.
(ESD STM5.2)
Reflow
5 reflow cycles with peak temperature of +260oC
Mechanical Shock
3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea)
Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate
more than 3 dB from its initial value.
Revision: D 3/27/2013
Sheet 11 of 11 ©2013 Knowles Electronics
SPM0408LE5H-TB
13. SPECIFICATION REVISIONS
Revision
Specification Changes
Date
A
Updated old format
8/14/09
B
Update Section 2, 3, 7, 8, 11; misc cleanup
10/21/10
C
New RoHS statement (C10114438); updated humidity conditions and ESD
descriptions (C10114466); released in new format (C10114628)
2/28/12
D
Fixed typos in Reliability Section 12 (C10114690)
3/27/13
Information contained herein is subject to change without notice. It may be used by a party at their own discretion
and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not
to be taken as a license to operate under any existing patents.
Mouser Electronics
Authorized Distributor
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