IR-Lumineszenzdiode (940nm) mit hoher Ausgangsleistung in SMR(R) Gehause High Power Infrared Emitter (940nm) in SMR(R) Package Lead (Pb) Free Product - RoHS CompliantLead (Pb) Free Product - RoHS SFH 4542 SFH 4543 SFH 4542 SFH 4543 Wesentliche Merkmale Features * * * * * * * * Infrarot LED mit hoher Ausgangsleistung SMR(R) (Surface Mount Radial) Gehause Gehausegleich mit Fotodiode SFH 2500 Kurze Schaltzeiten High Power Infrared LED SMR(R) (Surface Mount Radial) package Same package as photodiode SFH 2500 Short switching times Anwendungen Applications * Sensorik * Diskrete Lichtschranken * Diskrete Optokoppler * Sensor technology * Discrete interrupters * Discrete optocouplers Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4542 Q65110A8093 63 (typ. 180) SFH 4543 Q65110A8094 63 (typ. 180) 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2009-09-08 1 SFH 4542, SFH 4543 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg - 40 ... + 85 C Sperrspannung Reverse voltage VR 5 V Vorwartsgleichstrom Forward current IF 100 mA Stostrom, tp = 60 s, D = 0 Surge current IFSM 1.5 A Verlustleistung Power dissipation Ptot 180 mW 300 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 20 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 20 mm2 each Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA peak 950 nm Centroid-Wellenlange der Strahlung Centroid wavelength IF = 100 mA centroid 940 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 42 nm Abstrahlwinkel Half angle 10 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm 2009-09-08 2 SFH 4542, SFH 4543 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr , tf 11 ns VF VF 1.5 (< 1.8) 2.4 (< 3.0) V V Sperrstrom Reverse current IR not designed for A reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e typ 50 mW Temperaturkoeffizient von Ie bzw. e, TCI IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV -3 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2009-09-08 3 SFH 4542, SFH 4543 Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit -V -AW -BW Strahlstarke Ie min Radiant intensity Ie max IF = 100 mA, tp = 20 ms 63 125 100 200 160 320 mW/sr mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 25 s 680 1080 1700 mW/sr 1) Ie typ Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 OHL03768 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2009-09-08 0.8 0.6 0.4 0 20 40 60 80 4 100 120 SFH 4542, SFH 4543 Relative Spectral Emission Irel = f () I rel Single pulse, tp = 25 s OHF04134 100 Ie = f (IF) Ie 100 mA Radiant Intensity OHF03819 101 % Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W Ie IF I e (100 mA) OHF03814 0.11 A 80 100 0.08 5 0.07 60 0.06 10-1 0.05 5 40 0.04 10 20 0.03 -2 5 0.02 0.01 0 800 850 900 950 10-3 0 10 nm 1025 5 10 1 5 10 2 Forward Current IF = f (VF), single pulse, tp = 100 s IF Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter OHF03820 IF 100 5 1.4 tP IF T 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0.6 0.4 0.5 1 1.5 2 2.5 V 3 0.8 0.6 0.4 0.2 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 VF 2009-09-08 1.4 1.0 0.2 0 IF 1.6 A tp 5 OHF03813 tP tP IF D= T T 1.2 D= 0.8 10-3 5 tP D= T 1.0 10-2 5 T Permissible Pulse Handling Capability IF = f (), TA = 85 C, duty cycle D = parameter OHF03812 1.6 A 1.2 10-1 5 10-4 0 10 20 30 40 50 60 70 80 C 100 IF 101 A 0 5 10 3 mA 10 4 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4542, SFH 4543 Mazeichnungen Package Outlines SFH 4542 2.54 (0.100) spacing 14.7 (0.579) 13.1 (0.516) Cathode 4.5 (0.177) 3.9 (0.154) 2.7 (0.106) 2.4 (0.094) 4.8 (0.189) 4.4 (0.173) 3.7 (0.146) 3.3 (0.130) 2.05 (0.081) R 1.95 (0.077) -0.1...0.2 (-0.004...0.008) 7.5 (0.295) 5.5 (0.217) 2.8 (0.110) 2.4 (0.094) Chip position 4.5 (0.177) 3.9 (0.154) 7.7 (0.303) 7.1 (0.280) ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213) GEOY6960 SFH 4543 2.54 (0.100) spacing 15.5 (0.610) 14.7 (0.579) Cathode 4.5 (0.177) 3.9 (0.154) 7.7 (0.303) 7.1 (0.280) ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213) GEOY6961 Mae in mm (inch) / Dimensions in mm (inch). 2009-09-08 -0.15...0.15 (-0.006...0.006) 2.7 (0.106) 2.4 (0.094) 4.8 (0.189) 4.4 (0.173) 8.0 (0.315) 7.4 (0.291) Chip position 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077) 6 SFH 4542, SFH 4543 5.3 (0.209) 2.54 (0.100) SFH 4542 1.3 (0.051) Empfohlenes Lotpaddesign Recommended Solder Pad Bauteil positioniert Component Location on Pad Padgeometrie fur verbesserte Warmeableitung Lotpad Paddesign for improved heat dissipation 3 (0.118) Lotstopplack Solder resist 7 (0.276) 5.9 (0.232) 2.54 (0.100) SFH 4543 1.3 (0.051) Cu-Flache > 20 mm 2 Cu-area > 20 mm 2 OHFY2449 Bauteil positioniert Component Location on Pad Lotpad Padgeometrie fur verbesserte Warmeableitung (1 (0.039)) 1.5 (0.059) Paddesign for improved heat dissipation 5.2 (0.205) 3 (0.118) Lotstopplack Solder resist Aussparung 4.85 (0.191) 0.05 (0.002) 7 (0.276) Cu-Flache > 20 mm 2 Cu-area > 20 mm 2 Mae in mm (inch) / Dimensions in mm (inch). 2009-09-08 7 OHF02450 SFH 4542, SFH 4543 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C T Vorbehandlung nach JEDEC Level 3 Preconditioning acc. to JEDEC Level 3 (nach J-STD-020C) (acc. to J-STD-020C) 255 C 240 C 250 C 260 C +0 -5 C 245 C 5 C C 235 C +5 -0 C 217 C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 min. condition for IR Reflow Soldering: solder point temperature 235 C for at least 10 sec. 25 C 0 0 50 100 150 200 250 s 300 t Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2009-09-08 8