SFH4543-V - OSRAM Opto Semiconductors

SFH 4542

SFH 4543

IR-Lumineszenzdiode (940nm) mit hoher Ausgangsleistung in SMR® Gehäuse

High Power Infrared Emitter (940nm) in SMR® Package

Lead (Pb) Free Product - RoHS CompliantLead (Pb) Free Product - RoHS

SFH 4542 SFH 4543

2009-09-08 1

Wesentliche Merkmale

• Infrarot LED mit hoher Ausgangsleistung

•SMR

® (Surface Mount Radial) Gehäuse

• Gehäusegleich mit Fotodiode SFH 2500

• Kurze Schaltzeiten

Anwendungen

• Sensorik

• Diskrete Lichtschranken

• Diskrete Optokoppler

Sicherheitshinweise

Je nach Betriebsart emittieren diese Bauteile

hochkonzentrierte, nicht sichtbare Infrarot-

Strahlung, die gefährlich für das menschliche

Auge sein kann. Produkte, die diese Bauteile

enthalten, müssen gemäß den Sicherheits-

richtlinien der IEC-Normen 60825-1 und 62471

behandelt werden.

Typ

Type Bestellnummer

Ordering Code Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)

Radiant Intensity Grouping1)

Ie (mW/sr)

SFH 4542 Q65110A8093 ≥ 63 (typ. 180)

SFH 4543 Q65110A8094 ≥ 63 (typ. 180)

1) gemessen bei einem Raumwin ke l Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr

Features

• High Power Infrared LED

•SMR

® (Surface Mount Radial) package

• Same package as photodiode SFH 2500

• Short switching ti mes

Applications

• Sensor technol ogy

• Discrete interrupters

• Discrete optocouplers

Safety Advices

Depending on the mode of operation, these

devices emit highly concentrated non visible

infrared light which can be hazardous to the

human eye. Products which incorporate these

devices have to follow the safety precautions

given in IEC 60825-1 and IEC 62471.

2009-09-08 2

SFH 4542, SFH 4543

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top , Tstg – 40 … + 85 °C

Sperrspannung

Reverse voltage VR5 V

Vorwärtsgleichstrom

Forward current IF100 mA

Stoßstrom, tp = 60 μs, D = 0

Surge current IFSM 1.5 A

Verlustleistung

Power dissipation Ptot 180 mW

Wärmewiderstand Sperrschicht - Umgebung bei

Montage auf FR4 Platine, Padgröße je 20 mm2

Thermal resistance junction - ambient mounted

on PC-board (FR4), padsize 20 mm2 each

RthJA

300

K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 100 mA

λpeak 950 nm

Centroid-Wellenlänge der Strahlung

Centroid wavelength

IF = 100 mA

λcentroid 940 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 100 mA

Δλ 42 nm

Abstrahlwinkel

Half angle ϕ± 10 Grad

deg.

Aktive Chipfläche

Active chip area A0.09 mm2

Abmessungen der aktiven Chipfläche

Dimension of the active chip area L × B

L × W0.3 × 0.3 mm²

SFH 4542, SFH 4543

2009-09-08 3

Schaltzeiten, Ie von 10% auf 90% und von 90%

auf 10%, bei IF = 100 mA, RL = 50 Ω

Switching times, Ιe from 10% to 90% and from

90% to 10%, IF = 100 mA, RL = 50 Ω

tr, tf11 ns

Durchlassspannung

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tp = 100 µs

1.5 (< 1.8)

2.4 (< 3.0)

Sperrstrom

Reverse current IRnot designed for

reverse

operation

μA

Gesamtstrahlungsfluss

Total radiant flux

IF = 100 mA, tp = 20 ms

Φe typ 50 mW

Temperaturkoeffizient von Ie bzw. Φe,

IF = 100 mA

Temperature coefficient of Ie or Φe, IF = 100 mA

TCI– 0.5 %/K

Temperaturkoeffizient von VF, IF = 100 mA

Temperature coefficient of VF, IF = 100 mA TCV– 3 mV/K

Temperaturkoeffizient von λ, IF = 100 mA

Temperature coefficient of λ, IF = 100 mA TCλ+ 0.3 nm/K

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

2009-09-08 4

SFH 4542, SFH 4543

Abstrahlcharakteristik

Radiation Characteristics Irel = f (ϕ)

Strahlstärke Ie in Achsrichtung1)

gemessen bei einem Raumwinkel Ω = 0.01 sr

Radiant Intensity Ie in Axial Direction

at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol Werte

Values Einheit

Unit

-V -AW -BW

Strahlstärke

Radiant intensity

IF = 100 mA, tp = 20 ms

Ie min

Ie max

125 100

200 160

320 mW/sr

mW/sr

Strahlstärke

Radiant intensity

IF = 1 A, tp = 25 μs

Ie typ 680 1080 1700 mW/sr

1) Nur eine Gruppe in einer Verpackungseinheit (Streu ung kleiner 2:1) /

Only one bin in one packing unit (variation lower 2:1)

OHL03768

0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0

100˚

90˚

80˚

70˚

60˚

50˚

0˚10˚20˚30˚40˚

0.2

0.4

0.6

0.8

1.0

SFH 4542, SFH 4543

2009-09-08 5

Relative Spectral Emission

Irel = f (λ)

Forward Current

IF = f (VF), single pulse, tp = 100 μs

800

0nm

OHF04134

100

rel

850 900 950 1025

OHF03820

-4

0.5 1 1.5 2 2.5 V3

-3

-2

-1

Radiant Intensity

Single pulse, tp = 25 μs

Permissible Pulse Handling

Capability IF = f (τ), TA = 25 °C,

duty cycle D = parameter

Ie 100 mA = f (IF)

OHF03819

-3

-1

-2

10 5

(100 mA)

10 5

1010

-2-3-4-5

1010 10

210-1

10 s10

OHF03812

0.02

0.3

0.2

0.05

0.1

0.005

0.01

0.5

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Max. Permissible Forward Current

IF = f (TA), RthJA = 300 K/W

Permissible Pulse Handling

Capability IF = f (τ), TA = 85 °C,

duty cycl e D = parameter

0˚C

OHF03814

10 20 30 40 50 60 70 80 100

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.11

1010

-2-3-4-5

1010 10

210-1

10 s10

OHF03813

0.02

0.3

0.2

0.05

0.1

0.005

0.01

0.5

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

2009-09-08 6

SFH 4542, SFH 4543

Maßzeichnungen

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

GEOY6960

3.9 (0.154)

4.5 (0.177)

Cathode

7.1 (0.280)

7.7 (0.303)

2.54 (0.100)

spacing

13.1 (0.516)

14.7 (0.579)

5.5 (0.217)

7.5 (0.295)

1.95 (0.077)

2.05 (0.081)

R((3.2) (0.126))

5.4 (0.213)

6.0 (0.236)

((3.2) (0.126))

2.7 (0.106)

2.4 (0.094)

4.4 (0.173)

4.8 (0.189)

((R2.8 (0.110))

(-0.004...0.008)

3.7 (0.146)

3.3 (0.130)

2.8 (0.110)

2.4 (0.094)

Chip position

3.9 (0.154)

4.5 (0.177)

-0.1...0.2

SFH 4542

GEOY6961

3.9 (0.154)

4.5 (0.177)

Cathode

7.1 (0.280)

7.7 (0.303)

2.54 (0.100)

spacing

14.7 (0.579)

15.5 (0.610)

7.4 (0.291)

8.0 (0.315) ((3.2) (0.126))

5.4 (0.213)

6.0 (0.236)

((3.2) (0.126))

2.7 (0.106)

2.4 (0.094)

4.4 (0.173)

4.8 (0.189)

((R2.8 (0.110))

R2.05 (0.081)

1.95 (0.077)

Chip position

3.9 (0.154)

4.5 (0.177)

(-0.006...0.006)

-0.15...0.15

SFH 4543

SFH 4542, SFH 4543

2009-09-08 7

Empfohlenes Lötpaddesign

Recommended Solder Pad

Maße in mm (inch) / Dimensions in mm (inch).

SFH 4542

OHFY2449

5.3 (0.209)

1.3 (0.051)

2.54 (0.100)

7 (0.276)

3 (0.118)

Lötpad

Cu-Fläche > 20 mm

Cu-area > 20 mm

Paddesign for

verbesserte Wärmeableitung

improved heat dissipation

Padgeometrie für

Lötstopplack

Solder resist

Bauteil positioniert

Component Location on Pad

SFH 4543

OHF02450

5.9 (0.232)

1.3 (0.051)

2.54 (0.100)

7 (0.276)

3 (0.118)

Cu-Fläche > 20 mm

Cu-area > 20 mm

Paddesign for

verbesserte Wärmeableitung

improved heat dissipation

Padgeometrie für

Lötstopplack

Solder resist

Component Location on Pad

Bauteil positioniert

Aussparung 4.85 (0.191)

5.2 (0.205)

Lötpad (1 (0.039))

1.5 (0.059)

±0.05 (0.002)

2009-09-08 8

SFH 4542, SFH 4543

Lötbedingungen Vorbehandlung nach JEDEC Level 3

Soldering Conditions Preconditioning acc. to JEDEC Level 3

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as as sured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be use d in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered .

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

245 ˚C

±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C

-0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min

min. condition for IR Reflow Soldering:

solder point temperature ≥ 235 °C for at least 10 sec.