This is information on a product in full production.
October 2017 DocID026906 Rev 8 1/31
SP1ML
SPIRIT1 868 and 915 MHz low power RF modules with integrated
microcontroller
Datasheet - production data
Features
Complete RF-ready SPIRIT1 module based
on:
SPIRIT1 low data rate, low power sub-GHz
transceiver
STM32L1 Ultra low power microcontroller
at 32 MHz (16 kB RAM and 128 kB Flash)
BALF-SPI-01D3 868/915 MHz balun with
integrated harmonic filter
Integrated antenna and crystal
Compact size: 14 mm x 13.4 mm x 2.5 mm
863 to 870 MHz operation (SP1ML-868)
902 to 928 MHz operation (SP1ML-915)
Operates from a single 1.8 V to 3.6 V supply
Output power up to +11.6 dBm
Data rates up to 500 kbps
Modulation schemes: 2-FSK, GFSK, GMSK,
OOK, and ASK
Operating temperature: -40 °C to 85 °C
UART interface with AT comman d set
FCC and CE regulator y ap pr ovals
Applications
Home & building automation
Wireless sensor network
Data acquisition equipment
Security systems
Mobile health and medical
Industrial monitor and control
Wireless metering, WMBUS
Internet of things (IoT)
Description
The SP1ML-868 and SP1ML-915 are ultra-low
power & fully integrated RF modules operating
respectively in the 868 MHz SRD and 915 MHz
ISM bands.
The SP1ML module is a compact-size module,
integrating an o n-boa rd ante nna with easy- to-use
interface, allowing users to easily add wireless
connectivity in designs without requiring in-depth
RF experience, and has all necessary FCC
modular approvals and CE compliance, reducing
time-to-market.
These modules are based on the SPIRIT1 RF
sub-GHz transceiver (with integrated SMPS),
STM32L1 microcontroller, integrated filter/balun
and chip antenna. The UART host interface
allows simple connection to an external
microcontrolle r with a standard firmware, allo wing
AT commands to facilitate RF configuration, data
transmission and reception, using simple poin t-to-
point communication. Selected STM32L1 GPIO
and peripherals are available for interfacing to
external devices in the user application.
Advanced features of the SPIRIT1 radio are also
accessible. The serial wire debug interface
(SWD) is also available. T he SP1ML ca n be used
as an open platform, replacing the default
firmware with its own application firmware.
The modules are CE compliant and FCC certified
(FCC ID S9NSP1ML).
www.st.com
Contents SP1ML
2/31 DocID026906 Rev 8
Contents
1 Hardware specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.3 I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.4 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.5 RF compliance limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.6 Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.7 Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.8 Internal hardware connection for open platform . . . . . . . . . . . . . . . . . . . . . 9
1.9 Hardware block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.1 Pin usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.2 Typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Optional functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3 Layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4 Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5 Module reflow installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Module operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 Operating mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2 Command mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3 Command reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4 Configuration registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.5 Information registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.6 Example command sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DocID026906 Rev 8 3/31
SP1ML Contents
31
6.1 CE Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.2 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.3 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.4 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7 Module traceability and marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
List of tables SP1ML
4/31 DocID026906 Rev 8
List of tables
Table 1. Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. I/O operating characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. RF compliance limits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. Module pin usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 8. Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Command reference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 10. Configuration registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 11. Information registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 12. Example configuration AT sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 13. Module Product ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 14. Ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 15. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
DocID026906 Rev 8 5/31
SP1ML List of figures
31
List of figures
Figure 1. Pin placement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 2. Internal hardware connection for open platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3. Hardware block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 4. Typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. Package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 9. CE marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 10. SP1ML top side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 11. SP1ML bottom side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 12. SP1ML QR-code laser marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Hardware specification SP1ML
6/31 DocID026906 Rev 8
1 Hardware specification
General conditions (VIN = 3 V and TA = 25 °C ).
1.1 Recommended operating conditions
1.2 Absolute maximum ratings
1.3 I/O operating characteristics
Table 1. Recommended operat ing conditions
Symbol Parameter Min. Typ. Max. Unit
TAOperating ambient temperature range -40 - 85 ˚C
VDD Operating supply voltage 1.8 3 3.6 V
FREQ RF frequency (SP1ML-868) 863 - 870 MHz
FREQ RF frequency (SP1ML-915) 902 - 928 MHz
Table 2. Absolute maximum ratings
Symbol Parameter Min. Typ. Max. Unit
TSTG Storage temperature range -40 - 85 ˚C
VDD Operating supply voltage -0.3 - 3.9 V
VIO I/O pin voltage -0.3 - 5.5 V
Table 3. I/O operating characteristics
Symbol Parameter Min.Typ.Max.Unit
VIL(1) I/O input low level voltage -0.3 - 0.3 VDD V
VIH(1) I/O input high level voltage 0.7 VIN -V
DD+0.3 V
1. For more details see the STM32L151RB datasheet, I/O port characteristics.
DocID026906 Rev 8 7/31
SP1ML Hardware specification
31
1.4 Current consumption
1.5 RF compliance limits
The RF compliance limits are those tested for FCC and CE certification. These limits are
enforced by the factory loaded firmware. Care must be taken with custom firmware to
ensure these limits are not exceeded, voiding the FCC and CE certification.
Table 4. Current consumption
Symbol Parameter Test conditions Typ. Unit
IDD Supply current
Operating mode
Tx, +11 dBm, 2-FSK, 915 MHz 20 mA
Operating mode
Tx, -7 dBm, 2-FSK, 915 MHz 8mA
Operating mode
Rx, 915 MHz 13.5 mA
Command mode 2.2 mA
Standby 1.4 µA
Table 5. RF compliance limits
Modulation Standards Parameter Max. Unit
2-FSK
GFSK
MSK
FCC Part 15.207 (1)
FCC Part 15.247 (1)
EN 300 220-2 V2.4.1 (2)
EN 301 489-01 V1.9.2 (2)
EN 301 489-03 V1.4.1 (2)
Data rate 500 kbps
Output power +11.6 dBm
OOK
ASK
FCC Part 15.207 (1)
FCC Part 15.249 (1)
EN 300 220-2 V2.4.1 (2)
EN 301 489-01 V1.9.2 (2)
EN 301 489-03 V1.4.1 (2)
Data rate 250 kbps
Output power +8.5 dBm
1. FCC standards are only applicable to the SP1ML-915 module.
2. EN standards are only applicable to the SP1ML-868 module.
Hardware specification SP1ML
8/31 DocID026906 Rev 8
1.6 Pin assignment
Table 6. Pin assignment
Pin Name Type Description STM32L pin(1)
1 TXRXLED O Active low Tx/Rx LED drive(2) PA2
2 SHDN I Shutdown PA0
3 GPIO0 I/O General purpose input/output 0(3) PB15
4 GPIO1 I/O General purpose input/output 1 (3) PB14
5 MODE0 I Protocol mode selection 0(2) PB13
6 MODE1 I Protocol mode selection 1(2) PB12
7 VDD Power Supply input voltage -
8 GND Power Ground -
9 SW D IO I/O Serial wire I/O PA13
10 SWCLK I Serial wire clock PA14
11 BOOTMODE I Boot mode selection BOOT0
12 RESET I Reset input, active low NRST
13 TXD O UART transmit data PA9
14 RXD I UART receive data PA10
15 GPIO2 I/O General input/output 2 (3) PB6
16 GPIO3 I/O General purpose input/output 3 (3) PB7
1. For further details, see the STM32L151RB datasheet, Pin descriptions section. Alternate functions of any given pin are
dependent on the user application firmware that is loaded into the module and is beyond the scope of this document.
2. Refer to Hardware design section for details regarding TXRXLED and protocol mode selection.
3. The GPIO signals are not used by the default firmware integrated in the module. They are accessible with user application
firmware. See note 1.
DocID026906 Rev 8 9/31
SP1ML Hardware specification
31
1.7 Pin placement
Figure 1. Pin placement
1.8 Internal hardware connection for open platform
Figure 2. Internal hardwar e connection for open platform







*63*6*
670/
63,5,7
3$
3$
3%
3%
3%
3%
3$ 3$ 3$ 3$ 3$ 3& 3&
6'1
&6
6&/.
0,62
026, *3,2
*3,2
*3,2
3%
7;5;/('
6+'1
*3,2
*3,2
02'(
02'(
9''
*1'
*3,2
*3,2
5;'
7;'
5(6(7
%22702'(
6:&/.
6:',2
3%
3%
3$
3$
Q567
%227
3$
3$
*63*6*
Hardware specification SP1ML
10/31 DocID026906 Rev 8
1.9 Hardware block diagram
Figure 3. Hardware block diagram
Spirit1 Filter/Balun
STM32L
Microcontroller
SPI
GPIO
UART
XTAL
1.8V to 3.6V Supply
GPIO TX
RXp
RXn
SMPS
GSPG1409141831SMD
DocID026906 Rev 8 11/31
SP1ML Hardware design
31
2 Hardware design
2.1 Pin usage
If used with the default firmware and interfaced to a host MCU, at a minimum the SP1ML
module requires power, ground and UART transmit and receive signals to be connected.
Other signals are optional and p rovid e additiona l functionality. These signals are outlined in
Table 7 below. Unused signals must not be connected.
Table 7. Module pin usage
Pin Name Description Optional
1 TXRXLED An active-low open drain output that can drive an external LED for
TX/RX activity status indication. TXRXLED must be enabled by setting
the value to 1 in register S24. Yes
2 SHDN Drive this signal low to put the module into a low powe r shutdown
mode. Drive the signal high to wake the module. Yes
3 GPIO0 Reserved for future use, do not connect. Yes
4 GPIO1 Reserved for future use, do not connect. Yes
5MODE0
Drive this signal high to force the module into opera ting mode. Drive
this signal low to force the module into command mode. This enables
faster switching between modes and obviates the nee d for escape
sequences. After setting the MODE0 value, do a RESET to make the
new setting effective.
Yes
6 MODE1 Reserved for future use, do not connect. Yes
7 VDD Connect to power supply, 1.8V to 3.6V. No
8 GND Connect to system ground. No
9SWDIO
These signals are the serial wire debug (SWD) interfa c e to the
STM32L microcontroller, supporting the development and loading of
custom firmware.
Yes
10 SWCLK Yes
11 BOOTMODE Drive this signal hig h at power up or reset to start the boot loader and
allow device firmware update over the UART interface. Yes
12 RESET Drive this signal low to hold the module in reset. Drive this signal high
to release the module from reset. Yes
13 TXD Connect to the host system UART RXD input. No
14 RXD Connect to the host system UART TXD output. No
15 GPIO2 Reserved for future use. Yes
16 GPIO3 Reserved for future use. Yes
Hardware design SP1ML
12/31 DocID026906 Rev 8
2.2 Typical application circuit
In a typical application the SP1ML module is connected to a host MCU using a standard
UART, with transmit and receive signals. This is illustrated in Figure 4.
Figure 4. Typical application circuit
Optional functionality
1. When the TXRX_LED (S24) configuration register (see Table 10) is set to 1, the
TXRXLED signal is an active-low open drain output tha t can be used to drive an
external LED for status indication when data is sent or received.
2. The MODE0 signal provides a hardwar e method for switching betwe en command and
operating modes. The SHDN signal allows the mod ule to be placed into a low power
shutdown mo de and woken up again.
3. The BOOTMODE AND RESET signals should be connected if module firmware will
need to be updated over the UART interface.
4. To support custom module firmware, the serial wire d ebug signals need to be
accessible for programming and debugging.
2.3 Layout guidelines
The application PCB requires a flooded ground plane. Care must be t aken to ensure there
are no trace s or gr ou n d pla ne s un der the area surrounding the antenna, with the exception
SP1ML
MODULE
HOST
MCU
TXD TXD
RXD RXD
RTS
CTS
GPIO
GPIO
BOOTMODE
RESET
GPIO
GPIO
MODE0
SHDN
TXRXLED
1
2
3
VDD
RESET
SWCLK
SWDIO
4
SWD
HEADER
VDD
VDD
VDD
GND
10uF
DocID026906 Rev 8 13/31
SP1ML Hardware design
31
of minimal width traces from pins 1, 2, 3, 4, 13 and 14 of the module if these are used. It is
appropriate to place the module toward the edge of the PCB with no traces or ground planes
from the antenna to the board edge.
Figure 5. Layout guidelines
App lica ti on PCB
No copper on any layer surr ounding antenna , ex c ept
minimal traces from pins 1,2,3,4,13 and14
Flooded ground plane required
(signal traces allowed)
min .
6 mm min .
6 mm
Hardware design SP1ML
14/31 DocID026906 Rev 8
2.4 Recommended footprint
Figure 6. Recommended footprint
2.5 Module reflow installation
The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final
assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD-
020C, July 2004 recommendations.
Table 8. Soldering profile
Profile feature Lead-free assembly
Average ramp-up rate (TSMAX to TP) 3 °C/sec max
Preheat:
– Temperature min. (TS min.)
– Temperature max. (TS max.)
– Time (ts min. to ts max.)(ts)
150 °C
200 °C
60-100 sec
DocID026906 Rev 8 15/31
SP1ML Hardware design
31
Figure 7. Soldering profile
Time maintained above:
– Temperature TL
– Temperature TL
217 °C
60-70 sec
Peak temperature (TP) 240 °C
Time within 5 °C of actual peak temperature (TP) 10-20 sec
Ramp-down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max.
Table 8. Soldering profile (continued)
Profile feature Lead-free assembly
GSPG1409141835SMD
Module operation SP1ML
16/31 DocID026906 Rev 8
3 Module operation
The SP1ML module is provided with firmware that supports wireless serial cable
replacement. There are two operational modes, command mod e and operating mode. The
command mode allows module configuration and status interrogation using an extended
‘AT’ style command set. In operating mode the module serves its primary purpo se as a
wireless transceiver. Following power-up or reset, the module starts in operating mode with
the current configuration load ed from EEPROM.
3.1 Operating mode
In operating mode, data received from the host on the UART interface will be wirelessly
transmitted by the SPIRIT1 r adio using the curr ent configur ation settings for fr equency, data
rate, modulation and output power. Conversely, any data received by the SPIRIT1 that
meets the configured filtering criteria will be output to the UART interface.
Care must be taken to ensure that the escape sequence to enter command mode does not
occur in the data stream sent by the host to the UART interface.
3.2 Command mode
In command mode, the module will accept commands to configure module settings and
interrogate modu le status. To enter command mode, the ‘+++’ escape sequence is issued to
the module from operating mode. The escape sequence should be preceded by minimum
delay of 500 milliseconds where no other data is transmitted. The three ‘+’ characters of the
sequence must be sent within 500 milliseconds of each other. The module issues the
response ‘OK’ if command mode is entered successfully.
Commands issued to th e module are in ‘AT’ style format, and use ASCII characters, st arting
with ‘A’ and ‘T’, then one or more characters for the specific command, followed by any
additional command specific data and terminated with a carriage return <CR>.
The delay between each consecutive character of a command must be less than 8 seconds,
else the module will time out and discard any characters already received.
If the module receives an invalid command, it will send the ‘ERROR’ response. All
responses issued by the module are terminated with a line feed and carriage return,
<LF><CR>.
3.3 Command reference
Table 9: Command reference provides a summary of the AT commands available for
module configuration. A detailed description of each command is pr ovided following the list.
DocID026906 Rev 8 17/31
SP1ML Module operation
31
Table 9. Command reference
Command Description
ATO
Enter operating mode
This command is issued to exit command mode and enter operating mode where the
module fulfills its primary purpose as a wireless transceiver usin g the current configuration.
Response: OK
AT/V
Read module version information
Reports the module hardware and firmware version information.
Response:
SP1ML-xxx HW:Vy FW:V y.zz
Where xxx is 868 or 915, y is a single digit major version number and zz is a double digit
minor version number.
ATIn
Read an information register
Reads the current value from an information register, where n is the information register
number.
See information registers table.
Response:
<REGISTER NUMBER>:<REGISTER NAME>=<VALUE>
ERROR PARAM if an invalid register is specified.
ATSnn?
Read a configuration register
Reads the current value from a configuration register, where nn is the configuration register
number.
See configuration registers section.
Response:
<REGISTER NUMBER>:<REGISTER NAME>=<VALUE>
ERROR PARAM if an invalid register number is specified.
ATSnn=x
Write a configuration register
Writes a new value to a configuration register, where nn is the configuration register number
and x is the value. The new configuration will be in effect until the next module reset.
See configuration registers section.
Response: OK if the value is written successfully.
ERROR PARAM if an invalid register number is specified.
ERROR VALUE if an invalid value is specified.
AT/S
Read all configuration registers
Reads the current values of all configuration registers.
See the configuration registers section.
Response: (one line for each register)
<REGISTER NUMBER>:<REGISTER NAME>=<VALUE>
AT/C
Store the current configuration
Stores the current module configuration registers. The stored configuration will be reloaded
anytime the mo du l e is rese t.
Response: OK if the configuration is stored successfully.
ERROR if storing the configuration failed.
Module operation SP1ML
18/31 DocID026906 Rev 8
3.4 Configuration registers
The configuration registers contain the radio, packet and general configuration settings for
the module. They are read and written in command mode. Table 10 details each
configuratio n re gis te r.
ATR
Reset configuration to the de fault values
This command resets all module configuration registers to their factory default values.
Response: OK
ERROR if resetting the configuration failed.
ATZ
Restart the module
Restarts the module and reloads the current configuration. This generates a soft reset of the
microcontroller and start execution of the firmware from the reset vector.
Response: OK
AT/SRnn?
Read a SPIRIT1 radio register
Reads the current value from a SPIRIT1 radio register, where nn is the two digit
hexadecimal register address.
Response:
<ADDRESS>=<VALUE>
ERROR PARAM if an invalid register number is specified.
ERROR if reading the register failed.
AT/SRnn=xx
Write a SPIRIT1 radio register
Writes a new value to a SPIRIT1 radio register, where nn is the two digit hexadecimal
register address and xx is the two digit hexadecimal value to write.
Response: OK
ERROR PARAM if an invalid register number is specified.
ERROR if writing the register failed.
AT/Tn
Set RF test mode
Set the RF test mode, where n is the test mode number from one of the following options:
0 = Disable RF test mode.
1 = Pseudorandom binary sequence RF test mode (PN9).
2 = Continuous wave RF test mode (CW).
Response: OK if the test mode is set successfully
ERROR PARAM if an invalid test mode number is specified.
Table 9. Command reference (continued)
Command Description
DocID026906 Rev 8 19/31
SP1ML Module operation
31
Table 10. Configuration registers
# Name Description
S00 BAUD_RATE
General: Baud rate of the UART interface in bps. The baud rate is
stored when the configuration is stored.
Values:
Most standard baud rates from 9600 to 921600.
Default: 115200
S01 FREQUENCY
Radio: Frequency in Hz.
Values:
Must be within the operating frequency range of the modu le.
Default:
868000000 (for SP1ML-868)
915000000 (for SP1ML-915)
S02 DATA_RATE
Radio: Data rate in bps. The data rate for OOK and ASK modulation
schemes is limited to 250000bps.
Values:
From 1000 to 500000
Default: 38400
S03 MODULATION
Radio: Mo du l a ti on sche m e .
Values:
0 = 2-FSK
1 = GFSK05
2 = GFSK1
3 = GMSK
4 = OOK
5 = ASK
Default: 0
S04 OUTPUT_POWER Radio: Output power in dBm.
Values: -34 to +11.6
Default: +11.6
S05 FREQ_DEVIATION Radio: Frequency deviation in kHz.
Values: Up to 732
Default: 20
S06 RX_FILTER Radio: RX digital filter cutoff frequency in kHz.
Values: Up to 769
Default: 100
S07 CS_MODE
Radio: Carrier sense mode.
Values:
0 = Static sensing
1 = Dynamic sensing with 6 dB dynamic threshold
2 = Dynamic sensing with 12 dB dynamic threshold
3 = Dynamic sensing with 18 dB dynamic threshold
Default: 0
Module operation SP1ML
20/31 DocID026906 Rev 8
S08 RSSI_THRESHOLD Radio: Carrier sense RSSI threshold in dBm.
Values: -130 to -3
Default: -130
S09 PREAMBLE_LEN Packet: Preamble length in bytes.
Values: 1 to 32 bytes.
Default: 8
S10 SYNC_LENGTH Packet: Sync leng th in bytes.
Values: 1 to 4
Default: 4
S11 SYNC_VALUE Packet: 32-bit sync value.
Values: Any 32-bit hexadecimal value.
Default: 0x88888888
S12 CRC_MODE
Packet: CRC mode.
Values:
1 = POLY_0x07
2 = POLY_0x8005
3 = POLY_0x1021
4 = POLY_0x864CFB
Default: 2
S13 WHITENING
Packet: Data whitening mode.
Values:
0 = Disabled
1 = Enabled
Default: 1
S14 FEC
Packet: Forward error correction.
Values:
0 = Disabled
1 = Enabled
Default: 0
S15 SOURCE_ADDR
Address: The 8-bit address for the module, used to indicate the
source of transmitted packets and for destination filtering of received
packets.
Values: Any 8-bit hexadecimal value.
Default: 0x00
S16 DESTINATION_ADDR
Address: The 8-bit destination address, used to indicate the
destination for transmitted packets and for source filtering of received
packets.
Values: Any 8-bit hexadecimal value.
Default: 0xff
S17 MULTICAST_ADDR
Address: The 8-bit multicast addre ss, used for multicast filtering on
received packets.
Values: Any 8-bit hexadecimal value.
Default: 0xee
Table 10. Configuration registers (continued)
# Name Description
DocID026906 Rev 8 21/31
SP1ML Module operation
31
S18 BROADCAST_ADDR
Address: The 8-bit broadcast address, used for broadca st filtering on
received packets.
Values: Any 8-bit hexadecimal value.
Default: 0xff
S19 FILTER_CRC
Address: Filter packets that have an invalid CRC.
Values:
0 = Disabled, 1 = Enabled
Default: 0
S20 FILTER_SOURCE
Address: Filter packets that do not have a source address that
matches the address specified in register S16.
Values:
0 = Disabled, 1 = Enabled
Default: 0
S21 FILTER_DESTINATION
Address: Filter packets that do not have a destination address that
matches the modules source address specified in register S15.
Values:
0 = Disabled, 1 = Enabled
Default: 0
S22 FILTER_MULTICAST
Address: Filter packets that do not have a destination address that
matches the multicast address in specified in registe r S17.
Values:
0 = Disabled, 1 = Enabled
Default: 0
S23 FILTER_BROADCAST
Address: Filter packets that do not have a destination address that
matches the broadcast address in specified in register S18.
Values:
0 = Disabled, 1 = Enabled
Default: 0
S24 TXRX_LED
General: Enable or disable the TX/RX LED output on module pin 1.
When enabled, the LED output will be flashed when data is sent or
received by the radio.
Values:
0 = Disabled, 1 = Active-Low Open Drain Output, 2 = Push Pull Output
Default: 0
S26 ESCAPE_SEQ
General: Enable or disable the ‘+++’ escape sequence used to enter
command mode. This configuration is never stored and will be enabled
at module reset.
Values:
0 = Disabled, 1 = Enabled
Default: 1
Table 10. Configuration registers (continued)
# Name Description
Module operation SP1ML
22/31 DocID026906 Rev 8
3.5 Information registers
3.6 Example command sequence
Table 12 shows a typical command sequence to enter command mode, issue AT
commands to configure settings of the SPIRIT1 radio and then exit back to operating mode.
S27 Source_FILT_MASK
Address: An 8-bit source filter mask, used when source filtering is
enabled.
Values: Any 8-bit hexadecimal value.
Default: 0x00
S28 PAYLOAD_SIZE Packet: Packet payload size in bytes.
Values: 1 to 96
Default: 32
Table 10. Configuration registers (continued)
# Name Description
Table 11. Information registers
# Name Description
I0 PER Packet error rate (%).
I1 RSSI Received signal strength indicator.
I2 LQI Link quality indicator.
I3 PQI Preamble quality indicator.
I4 SQI Synchronizati on quality indicator.
I5 PACKET_COUNT Count of packets received.
I6 PACKETS_LOST Count of packets lost.
Table 12. Example configuration AT sequence
Host comm an d Mo du le response Descript io n
+++ OK<LF><CR> Escape sequence to put module into command mode
from operating mode.
ATS02=38400 OK<LF> <CR> Set the radio data rate to 38400 bps.
ATS03=2 OK<LF><CR> Set the modulation scheme to GFSK1.
ATS04=+8 OK<LF><CR> Set the output power to +8 dBm.
AT/C OK<LF><CR> Write configuration to EEPROM.
ATO OK<LF><CR> Return to operating mode.
DocID026906 Rev 8 23/31
SP1ML ECOPACK®
31
4 ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5 Package mechanical data
Figure 8. Package mechanical data
 PP
PP
PP
 PP
PP
 PP
5PP
PP
PD[
*63*60'
Regulatory compliance SP1ML
24/31 DocID026906 Rev 8
6 Regulatory compliance
6.1 CE Certification
The SP1ML-868 module has been certified according to the following certification rules:
EN 300 328 V 2.1.1 (2016-11) (a)
ETSI EN 301 489-17 V3.1.1 (2017-02) (b)
ETSI EN 301 489-1 V2.1.1 (2017-02) (c)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 (d)
EN 62479:2010
a) EN 300 328 V 2.1.1 (2016 11): "electromagnetic compatibility and radio spectrum
Matters (ERM); Wideband transmission systems; data tra nsmission equipment
operating in the 2.4 GHZ ISM band and using wideband modulation techniques;
harmonized EN covering essential requirements under article 3.2 of the R&TTE
directive".
b) EN 301 489-17 V 3.1.1 (2017 02): "electromagnetic compatibility and radio
spectrum Matters (ERM); electromagnetic compatibility (EMC) standard for radio
equipment and services; part 17: specific condition for 2.4 GHz wideband
transmission systems and 5 GHz high performance RLAN equipment".
c) ETSI EN 301 489-1 V2.1.1 (2017 02): "electromagnetic compatibility and radio
spectrum Matters (ERM); electromagnetic compatibility (EMC) standard for radio
equipment and services; part 1: Common technical requirements".
d) EN60950-1:2006 +A11:2009+A1:2010+A12:2011+A2:2013: "Information
technology equipme nt - safety"
The module is provided by CE marking:
Figure 9. CE marking
The SP1ML-868 module has obtained the RED certificate: No. 0051-RED-0036 REV. 0"
The certified module prod uction firmware release is:
1.X
For additional information please refer to:
STMicroelectronics Via C. Olivetti 2, Agrate Brianza 20864 (ITALY)
DocID026906 Rev 8 25/31
SP1ML Regu lato ry co mp li an c e
31
6.2 FCC certification
This module has been tested and found to comply with the FCC part 15 rules. These limits
are designed to provide reasonab le protection against harmful interference in approved
installations. This equipment generates, uses, and can radiate radio fre quency energy and,
if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics
may render void the user's authority to operate this equipment.
Modular approval
FCC ID: S9NSP1ML
In accordance with FCC part 15, the SP1ML-915 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with collocation and RF exposure requirements in accordance
with FCC multi-transmitter pro duct procedures. Collocated transmitters operating in portable
RF exposure conditions (e.g. <20 cm from persons including but not limited to body-worn
and hand-held devices) may require separate approval.
6.3 Labeling instructions
When integrating the SP1M L-915 into the final pr od uct, th e OEM must en su re that th e FCC
labeling requirement s are satisfied . A statement mu st be included on the exterio r of the final
product which indicates the product includes a certified module. The label should state the
following (or similar wording that conveys the same meaning):
Contains FCC ID: S9NSP1ML
OR
This product contains FCC ID: S9NSP1ML
The OEM must include the followin g statemen ts on th e exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including any interference that may
cause undesired operation.
Regulatory compliance SP1ML
26/31 DocID026906 Rev 8
6.4 Product manual instructions
This section applies to OEM final products containing the SP1ML-915 module, subject to
FCC compliance. The final product manual must contain the following statement (or a
similar statement that conveys the same meaning):
WARNING: Chang es or modifications not expressly approve d by the p arty resp onsible
for compliance could void the user ’s authority to operate the equipment
In cases where an OEM se eks Cla ss B ( re siden tia l) l i mits for the final pr odu ct, the fo llowing
statement must be included in the final product manual:
NOTE: This equipment has b een tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. Th ese limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy and, if not
installed and use d in accordance with the instructions, may cause ha rmful interfer ence
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which ca n be determined by turning the equipment off an d
on, the user is encouraged to try to correct the interference by one or more of the
following measures:
Reorient or reloca te the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experien ced radio/TV technician for help.
In cases where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
NOTE: This equipment has b een tested and found to comply with the limits for a Class
A digital device, pursuant to part 15 of the FCC Rules. Th ese limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference
in which case the user will be required to correct the interference at his expense.
DocID026906 Rev 8 27/31
SP1ML Module traceability and marking
31
7 Module traceability and marking
The standard top-side laser label contains the following information:
FCC ID: “S9NSP1ML”. FCC certification information, valid only for SP1ML-9 15 product
family.
Model: “MODEL: SP1ML”. Product family identification, SP1ML-868 or SP1ML-915.
Figure 10. SP1ML top side
Each module is univocally identified by serial number stored in a 2D data matri x laser
marked on the bottom side of the module itself.
Figure 11. SP1ML bottom side
Module traceability and marking SP1ML
28/31 DocID026906 Rev 8
The figure below shows the standard botto m-side QR-code laser marking.
Figure 12. SP1ML QR-code laser marking
The serial number has the following format: WW YY K PP NNN
where:
WW - Production week
YY - Production year
K - Product ID (refer to Table 13 below)
PP - internal ST use only
NNN - internal ST use on ly
Each module bulk package is identified by a bulk ID.
The Bulk ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used .
Table 13. Module Product ID
K Product family identification
N SPSGRF-868
O SPSGRF-915
DocID026906 Rev 8 29/31
SP1ML Ordering information
31
8 Ordering information
Table 14. Ordering information
Order code Description
SP1ML-868 868 MHz SPIRIT1 antenna module (Region 1, Europe)
SP1ML-915 915 MHz SPIRIT1 antenna module (Region 2, The Americas)
Revision history SP1ML
30/31 DocID026906 Rev 8
9 Revision history
Table 15. Document revision history
Date Revision Changes
24-Oct-2014 1 Initial release.
17-Dec-2014 2 Document st atus promoted from preliminary to production data.
Updated operating temperature range in Features and Table 1.
27-Apr-2015 3 Updated: Features and Description.
26-Jun-2015 4 Updated: Features.
29-Jun-2016 5
Updated Description.
Added Section 1.8: Internal hard ware connection for open
platform and Section 7: Module traceability and marking.
Updated Figure 6: Recommended footprint.
23-Sep-2016 6 Updated Figure 1: Pin placement.
08-Nov-2016 7 Updated: Figure 1: Pin placement and Figure 2: Internal
hardware connection for open platform.
09-Oct-2017 8 Updated: Section 6.1: CE Certification.
DocID026906 Rev 8 31/31
SP1ML
31
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelec tronics NV and its subsidiaries ( “ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvement s to ST pro ducts and/o r to this document at any time withou t notice. Purcha sers should obtain the lat est relevant information on
ST products before placing or ders. ST products are sold pursuant to ST’s terms an d conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein sh all void any warranty granted by ST for s uch produ ct.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and rep laces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved