SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
1
1
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1
Features
Surface Mount
No Wire Bonding Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
RoHS Compliant* and 260º Reflow Compatible
Description
This device is a Silicon-Glass PIN diode chip
fabricated with M/A-COM Technology Solutions
patented HMICTM process. This device features two
silicon pedestals embedded in a low loss, low dis-
persion glass. The diode is formed on the top of one
pedestal and connections to the backside of the
device are facilitated by making the pedestal side-
walls electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical topology provides for
exceptional heat transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
Applications
These surmount devices are suitable for usage in
moderate incident power (10W C.W.) or higher
incident peak power (500W) series, shunt, or
series-shunt switches. Lower parasitic inductance,
0.1 to 0.2nH, and excellent RC constant (0.45pS),
make the devices ideal for higher frequency switch
ele m ents com par ed to the ir pl a s t ic devic e
counterparts.
INCHES MM
DIM MIN. MAX. MIN. MAX.
A 0.040 0.042 1.025 1.075
B 0.021 0.023 0.525 0.575
C 0.004 0.008 0.102 0.203
D 0.013 0.015 0.325 0.375
E 0.011 0.013 0.275 0.325
F 0.013 0.015 0.325 0.375
G 0.019 0.021 0.475 0.525
Parameter Absolute Maximum
Forward Current 250mA
Reverse Voltage -200V
Operating Temperature -55°C to +125°C
Storage Temperature -55°C to +150°C
Junction Temperature +175°C
Dissipated Power
( RF & DC ) 1.8W
Mounting Temperature +280°C for 30 seconds
Absolute Maximum Ratings @ TA = 25°C
(unless otherwise specified)
MA4SPS421 MA4SPS422
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate backside ohmic gold
contacts.
3. All devices have the same outline dimensions (A to G).
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
2
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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For further information and support please visit:
https://www.macom.com/support
2
Electrical Specifications @ TA = +25°C
1. Total Capacitance, CT, is equivalent to the sum of Junction Capacitance and Parasitic Capacitance.
CT = CJ (Junction Capacitance) + CPAR (Parasitic Capacitance)
2. Series resistance RS is equivalent to the total diode resistance:
RS = RJ (Junction Capacitance Junction Resistance) + RO (Ohmic Resistance)
3 RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package.
.
4. Steady-state RØJL measured with die mounted in an ODS-186 package.
Parameter Symbol Conditions Units
MA4SPS421 MA4SPS422
Typ. Max. Typ. Max.
Capacitance CT 0V, 1MHz 1 pF 0.130 0.175 0.340 0.500
Capacitance CT 0V, 1GHz 1,3 pF 0.080 0.140
Capacitance CT - 40V, 1MHz 1 pF 0.090 0.125 0.180 0.300
Capacitance CT - 40V, 1GHz 1,3 pF 0.070 0.130
Resistance RS +10mA, 1GHz 2,3 Ω 6.200 3.100
Forward Voltage VF +10mA V 0.900 0.950 0.840 0.900
Reverse Leakage
Current IR -200V μA |-10| |-10|
Input Third Order
Intercept Point IIP3
F1 = 1000MHz
dBm 50 50
F2 = 1010MHz
Input Power = +10dBm
I bias = +10mA
Minority Carrier
Lifetime TL
+10mA / -6mA
µS 5 10
(50% - 90% V)
C.W. Thermal
Resistance RØJL IH = 0.5A, IL = 10mA4 °C/W 80 70
SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
3
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
3
Typical Performance @ TAMB = +25°C
Rp vs Voltage (@ 100MHz & 1GHz)
MA4SPS421
1
10
100
1000
10000
100000
1000000
010 20 30 40
Voltage (V)
Rp (ohms)
1GHz
100MHz
Rp vs Voltage (@ 100MHz & 1GHz)
MA4SPS422
1
10
100
1000
10000
100000
1000000
010 20 30 40
Voltage (V)
Rp (ohms)
1GHz
100MHz
Rs vs. Current @ 100MHz & GHz
MA4SPS422
Ct vs Voltage (@ 100MHz & 1GHz)
MA4SPS421
0.0E+00
5.0E-14
1.0E-13
1.5E-13
2.0E-13
2.5E-13
3.0E-13
010 20 30 40
Voltage (V)
Ct (F)
100MHz
1GHz
Ct vs Voltage (@ 100MHz & 1GHz)
MA4SPS422
0.0E+00
5.0E-14
1.0E-13
1.5E-13
2.0E-13
2.5E-13
3.0E-13
010 20 30 40
Voltage (V)
Ct (F)
100MHz
1GHz
1.00
10.00
100.00
1.00E-03 1.00E-02 1.00E-01
100MHz
1 GHz
Rs vs. Current (100MHz & 1GHz)
MA4SPS421
1.00
10.00
100.00
1.00E-03 1.00E-02 1.00E-01
Current (A)
Rs (ohms)
100MHz
1 GHz
Rs vs. Current (100MHz & 1GHz)
MA4SPS422
Rs (ohms)
SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
4
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
4
Typical Performance @ TA = +25°C
Ct vs Frequency (@ 0, 5 & 40V)
MA4SPS421
0.0E+00
5.0E-14
1.0E-13
1.5E-13
2.0E-13
2.5E-13
3.0E-13
0.0E+00 5.0E+08 1.0E+09 1.5E+09 2.0E+09
Frequency (Hz)
Ct (F)
0V
40V
Ct vs Frequency (@ 0, 5 & 40V)
MA4SPS422
0.0E+00
5.0E-14
1.0E-13
1.5E-13
2.0E-13
2.5E-13
3.0E-13
0.0E+00 5.0E+08 1.0E+09 1.5E+09 2.0E+09
Frequency (Hz)
Ct (F)
0V
40V
Ls vs Frequency (@ 10mA & 100mA)
MA4SPS421
0.00E+00
5.00E-11
1.00E-10
1.50E-10
2.00E-10
2.50E-10
3.00E-10
0.0E+00 5.0E+08 1.0E+09 1.5E+09 2.0E+09
Frequency (Hz)
Ls (H)
100mA
10mA
Ls vs Frequency (@ 10mA & 100mA)
MA4SPS422
0.00E+00
5.00E-11
1.00E-10
1.50E-10
2.00E-10
2.50E-10
3.00E-10
0.0E+00 5.0E+08 1.0E+09 1.5E+09 2.0E+09
Frequency (Hz)
Ls (H)
100mA
10mA
0
1
2
3
4
5
6
7
8
0.00E+00 2.00E+08 4.00E+08 6.00E+08 8.00E+08 1.00E+09
10mA
100mA
Frequency (Hz)
Rs (ohms)
Rs vs. Frequency (@10mA & 100mA)
MA4SPS422
Rs vs. Frequency (@10mA&100mA)
MA4SPS421
0
2
4
6
8
10
1.00E+06 2.51E+08 5.01E+08 7.50E+08 1.00E+09
Frequency(Hz)
Rs(ohms)
10mA
100mA
5V
5V
SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
5
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
5
MA4SPS421 ADS SPICE Model
PinDiodeModel
NLPINM1
Ffe=1.0
Af=1.0
Kf=0.0
Imax=3.1 E+8 A/m^2
Fc=0.5
M=0.5
Vj=0.7V
Cj0=0.07pF
Rs=0.1Ω
Tau= 5μS
Cmin=0.06pF
Rr=11KΩ
Wi=100μm
Un=900cm^2/V-sec
Vi=0.0V
Is=3.5E-12A
wPmax=1.6W
wBv=260V
MA4SPS421 Schematic Diagram
Notes
:
Rs = 2 * Rvia + Rp
Rp
Cp
Ls
Rvia
Rvia
+
SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
6
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
6
MA4SPS422 ADS SPICE
Model
PinDiodeModel
NLPINM1
Ffe=1.0
Af=1.0
Kf=0.0
Imax=7.8E+7 A/m^2
Fc=0.5
M=0.5
Vj=0.7V
Cj0=0.13pF
Rs=0.1Ω
Tau= 10μS
Cmin=0.12pF
Rr=9 KΩ
Wi=100μm
Un=900cm^2/V-sec
Vi=0.0V
Is=3.5E-12A
wPmax=1.8W
wBv=340V
MA4SPS422 Schematic Diagram
Notes :
Rs = 2 * Rvia + Rp
Rp
Cp
Ls
Rvia
Rvia
+
RVIA RVIA
SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
7
7
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
7
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,
60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but
could result in an increase in series and thermal resistance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit
trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die.
The solder joint must not be made one at a time, creating unequal heat flow and thermal stress. Solder reflow
should not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is
transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after
attach is completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538 , “Surface Mounting Instructions“. Application Note M541 “Bonding and Handling
Procedures for Chip Diode Devices” provides handling and assembly recommendations.
Ordering Information
The MA4SPS42X series of SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located
on the M/A-COM Tech website @ www.macomtech.com.
Part Number
Gel Pack Tape and Reel
Pocket Tape
MA4SPS421 MADP-000421-12940P
MA4SPS422 MADP-000422-12950P
SURMOUNTTM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V8
MA4SPS42X Series
8
8
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
8
M/A-COM Technology Solutions Inc. All rights reserved.
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products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
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INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
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WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
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