Qualcomm QCC300x Family Bluetooth Audio SoCs (R) Programmable entry-level flash audio SoCs designed for optimizing Bluetooth(R) headset and speaker applications. Solution Highlights QCC300x flexible System-on-Chips (SoCs) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices. Cost-effective, single-chip flash programmable platform solution The QCC300x family includes eight SoC devices - five (QCC3001 - QCC3005) which support Bluetooth headset applications, and three (QCC3006 - QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices help to provide a flexible, cost effective platform for designing high quality Bluetooth audio products. A single-chip dual-mode Bluetooth 5 system, QCC300x SoCs feature 8th generation Qualcomm(R) cVcTM Noise Cancellation Technology with one and two microphone inputs; an enhanced GAIA designed for better communication with mobile devices; and has external QSPI flash memory for configuration and voice prompts. More consumers are making the move to wireless due to disruptive industry events like the removal of the headphone jack. By offering a wider range of what were once considered premium features at a competitive price point, the QCC300x platform supports expansion of the overall wireless audio market and potential of increased unit sales. This material is subject to change without notice. 87-CF481-1 Rev. B QCC300x includes low-power audio DSP with on-chip ROM and RAM, audio codec, battery charger, switch mode and linear regulators, and LED drivers all in one chip. It is optimized to support reduced development time with its fixed-function and customizable SoCs. Differentiated, production quality, software and development tools Offers a combination of proprietary features and flash programmability at fixed-function ROM price points, and a purpose-built development kit designed to support a flexible and comprehensive development environment. Support for Over-the-Air updates Over-the-Air (OTA) update of external Flash supports updates of file partitions of the external Quad SPI Flash. Combine multiple features, for example update voice prompts or make updates to the application running in external Flash memory. 8th generation cVc noise cancellation technology cVc technology is a suite of algorithms designed to work on the transmit and receive paths to help deliver optimum audio quality and echo cancellation on headsets, speakers, speakerphones, and other hands-free devices. Qualcomm QCC300x and Qualcomm cVc are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Bluetooth Headset and Speaker Applications * Stereo Bluetooth Headphones * Bluetooth Earbuds * Bluetooth Car Speakers Home Entertainment * Portable Speakers * Bluetooth Speakers Toys Features zz Dual-mode Bluetooth 5 qualified radio zz Variants designed to address both headsets/ headphones and speaker applications zz Low-power Qualcomm(R) KalimbaTM DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single chip solution zz Customizable application code zz Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm(R) aptXTM, cVc noise cancellation technology and Qualcomm TrueWirelessTM Stereo (depending on variant) zz A rich set of features, use cases and programmability at more cost-effective price points zz Pin compatible with CSRA63xxx and CSRA64xxx family of products zz Supports OTA updates zz Integrated Qualcomm TrueWireless Stereo technology zz Qualcomm(R) meloDTM Expansion audio processing: 3D stereo widening zz aptX and aptX Low Latency capabilities to help deliver high quality, synchronized stereo audio for wireless audio/video applications. (QCC3002, QCC3005 and QCC3008 only) zz SBC and AAC codecs zz Promotes reduced development time with support of application image and source code, IDE and configuration zz Updated Generic Application Interface Architecture (GAIA) protocol v3 QCC300x Block Diagram QCC300x Specifications Bluetooth MCU DSP Memory Architecture Integrated dual-mode radio and balun (50 ) Bluetooth 5.0 qualified HFP v1.7, A2DP v1.3, AVRCP v1.6 80MHz RISC CPU Integrated 24-bit fixed-point 80 MHz Kalimba DSP On-chip ROM, RAM and QSPI external Flash memory Audio Interfaces I2S/PCM outputs and inputs (QCC3003 and above) SPDIF inputs (QCC3007 & 3008 only) USB audio enumeration (dual) Stereo audio ADC with line input Stereo audio DAC (except QCC3001, 02 & 06 with mono DAC) Analog and digital microphone inputs Serial Interfaces USB 2.0, I2C, SPI; UART (QCC3003 and above) up to 16x GPIOs (BGA package), 3x LED drivers Battery Support USB charging architecture Modes: Disable, Trickle Charge, Fast Charge, Standby, Error 200mA Charger current with external BJT option USB Charging spec enumeration compliant Power Management 1V8 (185mA) and 1V35 (160mA) SMPS regulators (can be combined in parallel for single 1V8 (340mA) output) USB 3.3V regulator; integrated 1V35 linear regulators To learn more visit: qualcomm.com Qualcomm Kalimba, Qualcomm TrueWireless, Qualcomm aptX, Qualcomm meloD, GAIA, QCC3002 QCC3003, QCC3005, QCC3007, QCC3008, CSRA3xxx and CSRA64xxx are products of Qualcomm Technologies, Inc. and/or its subsidiaries. QCC300x Bluetooth Audio SoCs Programmable entry-level flash audio SoCs designed for optimizing Bluetooth headset and speaker applications. Home Entertainment Smart Home Toys QCC300x Feature Comparison Headset/Headphone/Earbuds QCC3001 aptX / aptX Low Latency QCC3002 QCC3003 QCC3004 YES Speaker QCC3005 QCC3006 QCC3007 QCC3008 YES YES DAC output Mono Mono Stereo Stereo Stereo Mono Stereo Stereo # of Mics 2-mic 2-mic 1-mic 2-mic 2-mic 1-mic 1-mic 1-mic YES YES YES YES YES YES YES YES cVc Noise Reduction Technology High End Platform YES Qualcomm TrueWireless Stereo YES YES WLCSP/ BGA WLCSP/ BGA 6x6 QFN BGA CSRA63120 CSRA63120 + aptX CSRA63210 CSRA63220 Package CSRA6xxxx Pin Compatibility YES YES YES YES BGA 8x8 QFN 8x8 QFN 8x8 QFN CSRA63225 CSRA64110 CSRA64210 CSRA64215 QCC300x SoCs and Development Kits Ordering Information Device Package Order Number Dev Kit P/N Dev Board P/N HEADSET/HEADPHONE/BUD QCC3001 WLCSP QCC3001-1-48WLCSP DK-QCC3001-WLCSP-CE752-1A DB-QCC3001-WLCSP-CE752-1A QCC3001 BGA QCC3001-2-68CSP DK-QCC3001-BGA-CE889-1A DB-QCC3001-BGA-CE889-1A QCC3002 WLCSP QCC3002-1-48WLCSP DK-QCC3002-WLCSP-CE751-1A DB-QCC3002-WLCSP-CE751-1A QCC3002 BGA QCC3002-2-68CSP DK-QCC3002-BGA-CE890-1A DB-QCC3002-BGA-CE890-1A QCC3003 6x6 QFN QCC3003-0-52MQFN DK-QCC3003-6x6QFN-CE690-1A DB-QCC3003-6x6QFN-CE690-1A QCC3004 BGA QCC3004-1-68CSP DK-QCC3004-BGA-CE742-1A DB-QCC3004-BGA-CE742-1A QCC3005 BGA QCC3005-1-68CSP DK-QCC3005-BGA-CE729-1A DB-QCC3005-BGA-CE729-1A QCC3006 8x8 QFN QCC3006-0-68CMQFN DK-QCC3006-8x8QFN-CE680-1A DB-QCC3006-8x8QFN-CE680-1A QCC3007 8x8 QFN QCC3007-0-68CMQFN DK-QCC3007-8x8QFN-CE679-1A DB-QCC3007-8x8QFN-CE679-1A QCC3008 8x8 QFN QCC3008-0-68CMQFN DK-QCC3008-8x8QFN-CE678-1A DB-QCC3008-8x8QFN-CE678-1A SPEAKERS To learn more visit: qualcomm.com QCC3001, QCC3004, QCC3006, CSRA63120, CSRA63210, CSRA63220, CSRA63225, CSRA64110, CSRA64210 and CSRA631215 are products of Qualcomm Technologies, Inc. and/or its subsidiaries. (c)2018 Qualcomm Technologies International, Ltd. All Rights Reserved. Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm TrueWireless is a trademark of Qualcomm Incorporated. aptX, meloD, cVc and Kalimba are trademarks of Qualcomm Technologies International, Ltd., registered in the United States and other countries. The Bluetooth(R) word mark and logos are registered trademarks owned by the Bluetooth SIG, Inc. and any use of such marks by Qualcomm Technologies International, Ltd. is under license. Other products and brand names may be trademarks or registered trademarks of their respective owners. 0318A