Solution Highlights
Cost-effective, single-chip flash
programmable platform solution
QCC300x includes low-power audio DSP with on-chip
ROM and RAM, audio codec, battery charger, switch mode
and linear regulators, and LED drivers all in one chip. It is
optimized to support reduced development time with its
fixed-function and customizable SoCs.
Differentiated, production quality,
software and development tools
Oers a combination of proprietary features and flash
programmability at fixed-function ROM price points, and
a purpose-built development kit designed to support a
flexible and comprehensive development environment.
Support for Over-the-Air updates
Over-the-Air (OTA) update of external Flash supports
updates of file partitions of the external Quad SPI Flash.
Combine multiple features, for example update voice
prompts or make updates to the application running in
external Flash memory.
8th generation cVc noise
cancellation technology
cVc technology is a suite of algorithms designed to work
on the transmit and receive paths to help deliver optimum
audio quality and echo cancellation on headsets, speakers,
speakerphones, and other hands-free devices.
QCC300x flexible
System-on-Chips (
SoCs)
support increased OEM customization and
are engineered to oer a rich set of audio
features which have not typically been
associated with mid to low tier Bluetooth
wireless audio devices.
The QCC300x family includes eight SoC
devices – five (QCC3001 – QCC3005) which
support Bluetooth headset applications, and
three (QCC3006 – QCC3008) for Bluetooth
speaker applications. Coupled with the
audio development kit (ADK) and tools,
these devices help to provide a flexible, cost
eective platform for designing high quality
Bluetooth audio products.
A single-chip dual-mode Bluetooth 5
system, QCC300x SoCs feature 8th
generation Qualcomm
®
cVc™ Noise
Cancellation Technology with one and two
microphone inputs; an enhanced GAIA
designed for better communication with
mobile devices; and has external QSPI
flash memory for configuration and voice
prompts.
More consumers are making the move to
wireless due to disruptive industry events
like the removal of the headphone jack.
By oering a wider range of what were
once considered premium features at a
competitive price point, the QCC300x
platform supports expansion of the overall
wireless audio market and potential of
increased unit sales.
Qualcomm QCC300x and Qualcomm cVc are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
This material is subject to change without notice.
87-CF481-1 Rev. B
Programmable entry-level flash audio SoCs
designed for optimizing Bluetooth® headset
and speaker applications.
Qualcomm® QCC300x Family
Bluetooth Audio SoCs
Home Entertainment Toys
QCC300x Block Diagram
Dual-mode Bluetooth 5 qualified radio
Variants designed to address both headsets/
headphones and speaker applications
Low-power Qualcomm
®
Kalimba™ DSP
with on-chip ROM and RAM, stereo codec,
battery charger, switch mode and linear
regulators and LED drivers in a single
chip solution
Customizable application code
Access to technologies such as Link Layer
and Dual Mode topologies (LLT/DMT),
Qualcomm
®
aptX™, cVc noise cancellation
technology and Qualcomm TrueWireless™
Stereo (depending on variant)
A rich set of features, use cases and
programmability at more cost-eective
price points
Pin compatible with CSRA63xxx and
CSRA64xxx family of products
Supports OTA updates
Integrated Qualcomm TrueWireless
Stereo technology
Qualcomm
®
meloD™ Expansion audio
processing: 3D stereo widening
aptX and aptX Low Latency capabilities to
help deliver high quality, synchronized stereo
audio for wireless audio/video applications.
(QCC3002, QCC3005 and QCC3008 only)
SBC and AAC codecs
Promotes reduced development time with
support of application image and source
code, IDE and configuration
Updated Generic Application Interface
Architecture (GAIA) protocol v3
Features
Bluetooth Headset and Speaker Applications
• Stereo Bluetooth Headphones
• Bluetooth Earbuds
• Bluetooth Car Speakers
• Portable Speakers
• Bluetooth Speakers
Qualcomm Kalimba, Qualcomm TrueWireless, Qualcomm aptX, Qualcomm meloD, GAIA, QCC3002 QCC3003, QCC3005,
QCC3007, QCC3008, CSRA3xxx and CSRA64xxx are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
QCC300x Specifications
Bluetooth
Integrated dual-mode radio and balun (50 Ω)
Bluetooth 5.0 qualified
HFP v1.7, A2DP v1.3, AVRCP v1.6
MCU
80MHz RISC CPU
DSP
Integrated 24-bit fixed-point 80 MHz Kalimba DSP
Memory Architecture
On-chip ROM, RAM and QSPI external Flash memory
Audio Interfaces
I2S/PCM outputs and inputs (QCC3003 and above)
SPDIF inputs (QCC3007 & 3008 only)
USB audio enumeration (dual)
Stereo audio ADC with line input
Stereo audio DAC (except QCC3001, 02 & 06 with mono DAC)
Analog and digital microphone inputs
Serial Interfaces
USB 2.0, I2C, SPI; UART (QCC3003 and above)
up to 16x GPIOs (BGA package), 3x LED drivers
Battery Support
USB charging architecture
Modes: Disable, Trickle Charge, Fast Charge, Standby, Error
200mA Charger current with external BJT option
USB Charging spec enumeration compliant
Power Management
1V8 (185mA) and 1V35 (160mA) SMPS regulators
(can be combined in parallel for single 1V8 (340mA) output)
USB 3.3V regulator; integrated 1V35 linear regulators
To learn more visit: qualcomm.com
Home Entertainment Smart Home
Toys
To learn more visit: qualcomm.com
©2018 Qualcomm Technologies International, Ltd. All Rights Reserved. Qualcomm is a trademark of Qualcomm Incorporated,
registered in the United States and other countries. Qualcomm TrueWireless is a trademark of Qualcomm Incorporated. aptX,
meloD, cVc and Kalimba are trademarks of Qualcomm Technologies International, Ltd., registered in the United States and
other countries. The Bluetooth® word mark and logos are registered trademarks owned by the Bluetooth SIG, Inc. and any
use of such marks by Qualcomm Technologies International, Ltd. is under license. Other products and brand names may be
trademarks or registered trademarks of their respective owners. 0318A
Headset/Headphone/Earbuds Speaker
QCC3001 QCC3002 QCC3003 QCC3004 QCC3005 QCC3006 QCC3007 QCC3008
aptX /
aptX Low Latency YES YES YES
DAC output Mono Mono Stereo Stereo Stereo Mono Stereo Stereo
# of Mics 2-mic 2-mic 1-mic 2-mic 2-mic 1-mic 1-mic 1-mic
cVc Noise Reduction
Technology YES YES YES YES YES YES YES YES
High End Platform YES YES
Qualcomm
TrueWireless Stereo YES YES YES YES YES
Package WLCSP/
BGA
WLCSP/
BGA 6x6 QFN BGA BGA 8x8 QFN 8x8 QFN 8x8 QFN
CSRA6xxxx
Pin Compatibility CSRA63120 CSRA63120
+ aptX CSRA63210 CSRA63220 CSRA63225 CSRA64110 CSRA64210 CSRA64215
QCC300x Feature Comparison
QCC300x SoCs and Development Kits Ordering Information
QCC300x Bluetooth Audio SoCs
Device Package Order Number Dev Kit P/N Dev Board P/N
HEADSET/HEADPHONE/BUD
QCC3001 WLCSP QCC3001-1-48WLCSP DK-QCC3001-WLCSP-CE752-1A DB-QCC3001-WLCSP-CE752-1A
QCC3001 BGA QCC3001-2-68CSP DK-QCC3001-BGA-CE889-1A DB-QCC3001-BGA-CE889-1A
QCC3002 WLCSP QCC3002-1-48WLCSP DK-QCC3002-WLCSP-CE751-1A DB-QCC3002-WLCSP-CE751-1A
QCC3002 BGA QCC3002-2-68CSP DK-QCC3002-BGA-CE890-1A DB-QCC3002-BGA-CE890-1A
QCC3003 6x6 QFN QCC3003-0-52MQFN DK-QCC3003-6x6QFN-CE690-1A DB-QCC3003-6x6QFN-CE690-1A
QCC3004 BGA QCC3004-1-68CSP DK-QCC3004-BGA-CE742-1A DB-QCC3004-BGA-CE742-1A
QCC3005 BGA QCC3005-1-68CSP DK-QCC3005-BGA-CE729-1A DB-QCC3005-BGA-CE729-1A
SPEAKERS
QCC3006 8x8 QFN QCC3006-0-68CMQFN DK-QCC3006-8x8QFN-CE680-1A DB-QCC3006-8x8QFN-CE680-1A
QCC3007 8x8 QFN QCC3007-0-68CMQFN DK-QCC3007-8x8QFN-CE679-1A DB-QCC3007-8x8QFN-CE679-1A
QCC3008 8x8 QFN QCC3008-0-68CMQFN DK-QCC3008-8x8QFN-CE678-1A DB-QCC3008-8x8QFN-CE678-1A
QCC3001, QCC3004, QCC3006, CSRA63120, CSRA63210, CSRA63220, CSRA63225, CSRA64110, CSRA64210 and
CSRA631215 are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Programmable entry-level flash audio SoCs
designed for optimizing Bluetooth headset and
speaker applications.
