PC1602ARU-HWB-G-Q Rev.0(DK) Page16
3.2 Inspection Specification
Inspection Standard:MIL-STD-105E Table Normal Inspection Single Sampling Level Ⅱ。
Equipment:Gauge、MIL-STD、Powertip Tester、Sample。
IQC Defect Level:Major Defect AQL 0.4; Minor Defect AQL 1.5。
FQC Defect Level:100% Inspection。
OUT Going Defect Level:Sampling。
Specification:
NO Item Specification Judge Level
1 Part Number
The part number is inconsistent with work order o
production N.G. Major
2 Quantity
The quantity is inconsistent with work order of
production N.G. Major
The display lacks of some patterns. N.G. Major
Missing line. N.G. Major
The size of missing dot, A is>1/2 Dot size N.G. Major
There is no function. N.G. Major
3
Electronic
characteristics of
LCM
A=( L + W )÷2 Output data is error N.G. Major
Material is different with work order of production N.G. Major
LCD is assembled in inverse direction N.G. Major
Bezel is assembled in inverse direction N.G. Major
Shadow is within LCD viewing area + 0.5 mm N.G. Major
The diameter of dirty particle, A is>0.4 mm N.G. Minor
Dirty particle length is >3.0mm, and 0.01mm<width
≦0.05mm N.G. Minor
Display is without protective film N.G. Minor
Conductive rubber is over bezel 1mm N.G. Minor
Polarizer exceeds over viewing area of LCD N.G. Minor
Area of bubble in polarizer, A>1.0mm, the number of
bubble is >1 piece. N.G. Minor
4
Appearance of
LCD
A=( L + W )÷2
Dirty particle
(Including
scratch、bubble )
0.4mm<Area of bubble in polarizer, A<1.0mm, the
number of bubble is >4 pieces. N.G. Minor
Burned area or wrong part number is on PCB N.G. Major
The symbol, character, and mark of PCB are
unidentifiable. N.G Minor
The stripped solder mask , A is>1.0mm N.G. Minor
0.3mm<stripped solder mask or visible circuit, A <
1.0mm, and the number is ≧4 pieces N.G. Minor
There is particle between the circuits in solder mask N.G Minor
The circuit is peeled off or cracked N.G Minor
There is any circuits risen or exposed. N.G Minor
0.2mm<Area of solder ball, A is ≦0.4mm
The number of solder ball is ≧3 pieces N.G Minor
5
Appearance of
PCB
A=( L + W )÷2
The magnitude of solder ball, A is >0.4mm. N.G Minor