© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 8
1Publication Order Number:
MC10H164/D
MC10H164
8−Line Multiplexer
Description
The MC10H164 is a MECL 10H™ part which is a functional/pinout
duplication of the standard MECL 10K™ family part, with 100%
improvement in propagation delay, and no increase in power supply
current.
The MC10H164 is designed to be used in data multiplexing and
parallel to serial conversion applications. Full parallel gating provides
equal delays through any data path. The MC10H164 incorporates an
output buffer, eight inputs and an enable. A high on the enable forces
the output low. The open emitter output allows the MC10H164 to be
connected directly to a data bus. The enable line allows an easy means
of expanding to more than 8 lines using additional MC10H164’s.
Features
•Propagation Delay, 1.0 ns Typical
•Power Dissipation, 310 mW Typical (same as MECL 10K)
•Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•Voltage Compensated
•MECL 10K−Compatible
•Pb−Free Packages are Available*
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
CDIP−16
L SUFFIX
CASE 620A
MARKING DIAGRAMS*
PDIP−16
P SUFFIX
CASE 648
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
SOEIAJ−16
CASE 966
16
1
16
1
MC10H164P
AWLYYWWG
1
16
MC10H164L
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G= Pb−Free Package
10H164
ALYWG
PLLC−20
FN SUFFIX
CASE 775
20 110H164G
AWLYYWW
120
MC10H164
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2
LOGIC DIAGRAM
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
A 7
B 9
C 10
Enable 2
X0 6
X1 5
X2 4
X3 3
X4 11
X5 12
X6 13
X7 14
Z
15
DIP PIN ASSIGNMENT
VCC1
ENABLE
X3
X2
X1
X0
A
VEE
VCC2
Z
X7
X6
X5
X4
C
B
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
TRUTH TABLE
ADDRESS INPUTS
ENABLE CBAZ
L
L
L
L
L
L
L
L
L
L
H
H
L
H
L
H
X0
X1
X2
X3
HXLXX
L
L
L
L
H
H
H
H
L
L
H
H
L
H
L
H
X4
X5
X6
X7
Table 1. MAXIMUM RATINGS
Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) −8.0 to 0 Vdc
VIInput Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current − Continuous
− Surge
50
100
mA
TAOperating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
MC10H164
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3
Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
IEPower Supply Current −83 −75 −83 mA
IinH Input Current High −512 −320 −320 mA
IinL Input Current Low 0.7 −0.7 −0.7 −mA
VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc
VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc
VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc
VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50 W resistor to −2.0 V.
Table 3. AC PARAMETERS
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
tpd Propagation Delay
Enable
Data
Address
0.4
0.7
1.0
1.45
2.4
2.8
0.4
0.8
1.1
1.5
2.5
2.9
0.5
0.9
1.2
1.7
2.6
3.2
ns
trRise Time 0.5 1.5 0.5 1.6 0.5 1.7 ns
tfFall Time 0.5 1.5 0.5 1.6 0.5 1.7 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
MC10H164
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4
FIGURE 2 − 1−OF−64 LINE MULTIPLEXER
FIGURE 1 − HIGH SPEED 16−BIT MULTIPLEXER/DEMULTIPLEXER
TYPICAL APPLICATIONS
The Bit chosen is dependent on six−bit
code present on inputs 7, 9, 14 of the
MC10H161 and the A, B, C inputs of the
MC10H164.
MC10H161
MC10H164
E1
C
B
A
MC10H136
MC10H161
MC10H162
S0
S1
CR
ABCD
E1
C
B
A
E0
MC10H164
76543210
E1
C
B
AD0
Control Selection
MC10H136
MC10H164
S0
S1
CR
ABCD
15 14 13 12 11 10 9 8
76543210
E1
C
B
AD0
Start/Stop
S0
15 14 1312 11 10 9 8
E0
S1
CR
Dout
Dout
Dout
Dout
Dout
Dout
ABC
E
MC10H164
ABC
E
MC10H164
Dout
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
MC10H161
Dout
ABC
MSB
LSB
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
14
9
7
E
MC10H164
MC10H164
http://onsemi.com
5
ORDERING INFORMATION
Device Package Shipping†
MC10H164FN PLLC−20 46 Units / Rail
MC10H164FNG PLLC−20
(Pb−Free)
46 Units / Rail
MC10H164FNR2 PLLC−20 500 / Tape & Reel
MC10H164FNR2G PLLC−20
(Pb−Free)
500 / Tape & Reel
MC10H164L CDIP−16 25 Unit / Rail
MC10H164M SOEIAJ−16 50 Unit / Rail
MC10H164MG SOEIAJ−16
(Pb−Free)
50 Unit / Rail
MC10H164MEL SOEIAJ−16 2000 / Tape & Reel
MC10H164MELG SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
MC10H164P PDIP−16 25 Unit / Rail
MC10H164PG PDIP−16
(Pb−Free)
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC10H164
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6
PACKAGE DIMENSIONS
−M−
−N−
−L−
Y BRK
W
V
D
D
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D−D
20 1
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
−T−SEATING
PLANE
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
20 LEAD PLLC
CASE 775−02
ISSUE E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 −−− 0.51 −−−
K0.025 −−− 0.64 −−−
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y−−− 0.020 −−− 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____
MC10H164
http://onsemi.com
7
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
HE
A1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 0.78 −−− 0.031
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
F
E
N
K
C
SEATING
PLANE
A
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C−−− 0.200 −−− 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
A
B
A
B
16
1
9
8
G
16X D
B
M
0.25 (0.010) T
T
16X J
MC10H164
http://onsemi.com
8
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
B
FC
S
H
GD
J
L
M
16 PL
SEATING
18
916
K
PLANE
−T−
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
MC10H164/D
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
LITERATURE FULFILLMENT:
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