BD6964FE2 - ROHM SEMICONDUCTOR

Datasheet

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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DC Brushless Fan Motor Driver

Standard Single-phase Full wave

Fan motor driver

BD6964F

Description

This is the summary of application for BD6964F. BD6964F can drive FAN motor silently by BTL soft switching, and it can

control rotational speed by PWM signal.

Features

■ BTL soft switching drive

■ PWM speed control

■ Quick start function

■ Lock protection and auto restart

(without external capacitor)

■ Lock alarm signal (AL) output

Application

 PC, PC peripheral component

(Power supply, VGA card, case FAN etc.)

 BD player, Projector etc.

Package W(Typ) x D(Typ) x H(Max)

SOP8 5.00mm x 6.20mm x 1.71mm

Absolute Maximum Ratings

Parameter Symbol

Limit Unit

Supply Voltage V

15 V

Power Dissipation Pd 0.78

(Note 1)

Operating Temperature Topr -40 to +105 °C

Storage Temperature Tstg -55 to +150 °C

Output Voltage V

OMAX

15 V

Output Current I

OMAX

1000

(Note 2)

AL Signal Output Voltage V

15 V

AL Signal Output Current I

10 mA

Junction Temperature Tjmax 150 °C

(Note 1) Reduce by 6.24mW/°C over 25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board)

(Note 2) This value is not to exceed Pd.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

SOP8

Datasheet

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BD6964F

Recommended Operating Conditions

Parameter Symbol

Limit Unit

Operating supply voltage range

3.3 to 14 V

Hall input voltage range V

0 to V

/3 V

Electrical Characteristics (Unless otherwise specified Ta=25°C, Vcc=12V)

Parameter Symbol

Limits Unit Conditions Characteristics

Min Typ Max

Circuit Current 1 I

1 1 3 5 mA PWM=GND Figure 1

Circuit Current 2 I

2 2 5 8 mA PWM=OPEN Figure 2

Input Offset Voltage V

HOFS

- - ±6 mV -

PWM Input H Level V

PWMH

2.0 - Vcc+0.3

V -

PWM Input L Level V

PWML

-0.3 - 0.8 V -

PWM Input Current

PWMH

11 22 33 µA PWM=5V Figure 3

PWML

-42 -28 -14 µA PWM=GND Figure 3

Input Frequency F

PWM

0.02 - 50 kHz -

Output Voltage V

- 0.4 0.6 V I

=300mA

Upper and Lower total

Figure 4 to 7

Input-output Gain G

45 48 51 dB -

AL Low Voltage V

ALL

- - 0.4 V I

=5mA Figure 8,9

AL Leak Current I

ALL

- - 20 µA V

=15V Figure 10

Lock Detection ON time t

0.35 0.50 0.65 s Figure 11

Lock Detection OFF time

OFF

3.5 5.0 6.5 s Figure 12

Truth Table

H+ H- PWM OUT1 OUT2

H L H(OPEN) H L

L H H(OPEN) L H

H L L L L AL normal operation :L(output is ON)

L H L L L lock detection :H(output is OFF)

Datasheet

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BD6964F

Reference Data

3.0

4.0

5.0

6.0

7.0

0 3 6 9 12 15

Supply voltage, VCC [V]

Lock detection OFF time.tOFF [s]

300

400

500

600

700

0 3 6 9 12 15

Supply voltage, VCC [V]

Lock detection ON time, tON [ms]

0.0

0.2

0.4

0.6

0.8

1.0

0 3 6 9 12 15

Supply voltage, VCC [V]

AL leak current, IALL [µA]

0.0

0.3

0.6

0.9

1.2

1.5

0 2 4 6 8 10

AL current, I

[mA]

AL low voltage, V

ALL

[V]

0.0

0.2

0.4

0.6

0.8

1.0

0 0.2 0.4 0.6 0.8 1

Output current, IO [A]

Output H voltage [V]

0.0

0.3

0.6

0.9

1.2

1.5

0246810

AL current,IAL[mA]

AL low voltage, VALL [V]

0.0

0.2

0.4

0.6

0.8

1.0

0 0.2 0.4 0.6 0.8 1

Output current, IO [A]

Output L voltage [V]

0.0

0.2

0.4

0.6

0.8

1.0

0 0.2 0.4 0.6 0.8 1

Output current, IO [A]

Output L voltage [V]

0.0

0.2

0.4

0.6

0.8

1.0

0 0.2 0.4 0.6 0.8 1

Output current, Io [A]

Output H voltage [V]

-60

-30

120

0 3 6 9 12 15

PWM voltage, VPWM [V]

PWM input current, IPWM [µA]

0.0

2.0

4.0

6.0

8.0

0 3 6 9 12 15

Supply voltage, VCC [V]

Circuit current, ICC [mA]

0.0

2.0

4.0

6.0

8.0

0 3 6 9 12 15

Supply voltage, VCC [V]

Circuit current, ICC [mA]

Figure 3. PWM Input Current

Figure 2. Circuit Current 2

Figure 1. Circuit Current 1

Figure 4. Output L Voltage

(Voltage Characteristics)

Figure 7. Output H Voltage

(Temperature Characteristics)

Figure 6. Output H Voltage

(Voltage Characteristics)

Figure 5. Output L Voltage

(Temperature Characteristics)

Figure 8. AL L Voltage

(Voltage Characteristics)

Figure 9. AL L Voltage

(Temperature Characteristics)

Figure 10. AL Leak Current Figure 12. Lock Detection OFF Time

Figure 11. Lock Detection ON time

3.3V

12V

14V

-40°C Operating Voltage Range

25°C

105°C

Operating Voltage Range

-40°C

105°C

25°C

3.3V

14V

12V

-40°C

25°C

105°C

14V

12V

3.3V

-40°C

25°C

105°C

-40°C

25°C

105°C

3.3V

12V

14V

105°C

25°C

-40°C Operating Voltage Range

105°C

-40°C

25°C

Operating Voltage Range

105°C

25°C

-40°C

Datasheet

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BD6964F

Block Diagram, Application Circuit, and Pin Assignment

Pin No. Pin Name Function

1 OUT2 Motor output

2 VCC Power supply

3 H+ Hall input +

4 H- Hall input -

5 AL Lock alarm signal output

6 PWM PWM signal input

7 OUT1 Motor output

8 GND GND

HALL

OSC : Internal reference oscillation circuit

TSD : Thermal shutdown(head rejection circuit)

Take a measure against Vcc

voltage rise due to reverse

connection of power supply

and back electromotive force.

Incorporates soft switching

function. Adjust at an optimum

value because gradient of

switching of output waveform

depends on hall element

output.

Ω

to 5kΩ

Speed control by PWM input is

enabled. Input frequency must

be 50kHz at the maximum.

This is an open drain output.

Connect a pull-up resistor.

VCC

H+

OUT2

90kΩ

2.8V

10kΩ

OSC

Lock

Protection

Control

OUT1

PWM

GND

TSD

P.8

P.5

P.6

P.9

Datasheet

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BD6964F

Description of Operations

1) Lock Protection and Automatic Restart Circuit

Motor rotation is detected by hall signal, and lock detection ON time (t

) and lock detection OFF time (t

OFF

) are set

by IC internal counter. External part (C or R) is not required. Timing chart is shown in Figure 13.

Figure 13. Lock Protection Timing Chart

2) Soft Switching (silent drive setting)

Input signal to hall amplifier is amplified to produce an output signal.

When the hall element output signal is small, the gradient of switching of output waveform is gentle; When it is large,

the gradient of switching of output waveform is steep. Enter an appropriate hall element output to IC where output

waveform swings sufficiently.

Figure 14. Relation between Hall Element Output Amplitude and Output Waveform

3) Hall Input Setting

Hall input voltage range is shown in operating conditions.

Figure 15. Hall Input Voltage Range

Adjust the value of hall element bias resistor R1 in Figure 16 so that the input voltage of a hall amplifier is input in

"Hall Input Voltage Range" including signal amplitude.

(H+)-(H-)

OUT1

Hall input voltage range

upper limit

Vcc

GND

Hall input voltage range

lower limit

H+

tOFF

tON

Idling

Output Tr OFF

Motor

locking

Lock

detection

Lock

release

Recovers

normal

operation

OUT2

Hi(open collector)

OUT1

Datasheet

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BD6964F

○Reducing the Noise of Hall Signal

Hall element may be affected by Vcc noise depending on the wiring pattern of board. In this case, place a

capacitor like C1 in Figure 16. In addition, when wiring from the hall element output to IC hall input is long, noise

may be loaded on wiring. In this case, place a capacitor like C2 in Figure 16.

Figure 16. Application near of Hall Signal

4) PWM Input

Rotation speed of motor can be changed by controlling ON/OFF of the upper output depending on duty of the signal

input to PWM terminal.

Figure 17. Timing Chart in PWM Control

When the voltage input to PWM terminal applies H logic : normal operation

L logic : H side output is off

When PWM terminal is open, H logic is applied. PWM terminal has hysteresis of 100mV (Typ.).

*If H logic is applied to PWM terminal before VCC voltage is applied to IC, current flows to VCC terminal through ESD

protection diode inside PWM terminal, resulting in malfunction may possibly occur.

When VCC voltage is not apply to IC, do not apply voltage to PWM terminal.

5) Quick Start, Stand-by Function

The function can start motor at once regardless of the detection time of lock protection function when the PWM signal

is input. Lock protection function is turned off when the time of PWM = L has elapsed more than 66.5 ms in order to

disable lock protection function when the motor is stopped by PWM signal.

When H level duty of PWM input signal is close to 0%, lock protection function does not work at an input frequency

slower than 15Hz, therefore enter a frequency faster than 20Hz.

H+

PWM

OUT1

OUT2

Bias Current

= Vcc / (R1 + RH)

Hall element

H-

H+

VCC

Datasheet

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BD6964F

Equivalent Circuit

1) Hall Input 2) Motor Output

3) PWM Signal Input 4) AL Output

OUT1

VCC

GND

OUT2

H+、H-

PWM

Datasheet

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BD6964F

Safety Measure

1) Reverse Connection Protection Diode

Reverse connection of power results in IC destruction as shown in Figure 18. When reverse connection is possible,

reverse connection destruction preventive diode must be added between power supply and VCC.

Figure 18. Flow of Current when Power is Connected Reversely

2) Measure against VCC voltage Rise by Back Electromotive Force

Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse

connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power

supply.

Figure 19. VCC Voltage Rise by Back Electromotive Force

When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place

(A) Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C).

Figure 20. Measure against VCC voltage rise

Vcc

GND

Vcc

GND

Vcc

GND

Internal circuit impedance high

 amperage small

Circuit

block

Each

In normal energization

Large current flows

 Thermal destruction

Each

Circuit

block

Reverse power connection

No destruction

Each

Circuit

block

After reverse connection

destruction prevention

Phase

switching

(A) Capacitor (B) Zener diode

ON ON

Datasheet

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3) Problem of GND Line PWM Switching

Do not perform PWM switching of GND line because the potential of GND terminal cannot be kept at the minimum.

Figure 21. GND Line PWM Switching Prohibited

4) AL Output

AL output is an open drain and requires pull-up resistor.

The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when AL output terminal is

directly connected to power supply, could damage the IC.

Fig.22 Protection of AL terminal

Thermal derating curve

Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal

resistance θja.

Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,

wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured

at a specified condition. Figure 23 shows a thermal derating curve.

* Reduce by 6.24 mW/°C over 25°C.

(70.0mm x 70.0mm x 1.6mm glass epoxy board)

Figure 23. Thermal Derating Curve

Protection

Resistor R1

Pull-up

resistor

VCC

Connector

of board

PWM input

Prohibited

VCC

Motor

Driver

GND

Controller

0.4

0.8

1.0

Pd(W

)

0 25

100

125

150

Ta(°C)

0.2

0.78

Datasheet

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BD6964F

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,

pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground

due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below

ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions

such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Datasheet

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 24. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

Datasheet

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BD6964F

Ordering Information

6 9 6 4 F

- E2

Part Number

Package

F: SOP8

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

SOP8

(TOP VIEW)

D6964

D6964D6964

D6964

Lot No.

1PIN MARK

Datasheet

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Physical Dimension, Tape and Reel Information

Package Name SOP8

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

( )

Direction of feed

Reel 1pin

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

(Max 5.35 (include.BURR))

Datasheet

Notice – GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred b y you or third parti es arising from the use of an y ROHM’s Prod ucts for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radi ation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in an y way responsible or lia ble for failure induced under deviant conditio n from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specificati on

Datasheet

Notice – GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportati on

1. Product performance and sol dered connections may deteriorate if the Products are store d in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before us ing Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

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When disposing Products pl ease dispose them properly using an authorized industr y waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under an y intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limited to, the developm ent of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.

Datasheet

Part Number bd6964f

Package SOP8

Unit Quantity 2500

Minimum Package Quantity 2500

Packing Type Taping

Constitution Materials List inquiry

RoHS Yes

bd6964f - Web Page

Distribution Inventory

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