LITE-ON DCC
RELEASE
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
IR Emitter and Detector
Product Data Sheet
LTE-C9501
Spec No.: DS50-2013-0070
Effective Date: 01/08/2014
Revision: A
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
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Part No. : LTE-C9501
BNS-OD-FC 002/A4
IR Emitter and Detector
LTE-C9501
1. Description
Lite-On offers a broad range of discrete infrared components for application such as remote control, IR wireless data
transmission, security alarm & etc. Customers need infrared solutions featuring high power, high speed and wide viewing
angels. The product line includes GaAs 940nm IREDs, AlGaAs high speed 850nm IREDs, PIN Photodiodes and
Phototransistors. Photodiodes and Phototransistors can be provided with a filter that reduces digital light noise in the sensor
function, which enables a high signal-to-noise ratio.
1. 1. Features
Meet RoHS, Green Product.
Package In 12mm Carrier Tape On 7" Diameter
Reels..
Compatible With Automatic Placement Equipment.
Compatible With Infrared Reflow Solder Process.
EIA STD package.
Peak wavelength λp=940nm
Water clear plastic with top view lens.
1.2. Applications
Infrared emitter
PCB Mounted Infrared Sensor
2. Outline Dimensions
Notes :
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1mm (.004") unless otherwise noted.
3. Specifications are subject to change without notice.
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Part No. : LTE-C9501
BNS-OD-FC 002/A4
IR Emitter and Detector
LTE-C9501
3. Absolute Maximum Ratings at TA=25℃
Parameter
Maximum Rating
Unit
Power Dissipation
100
mW
Peak Forward Current(300pps, 10μs pulse)
800
mA
DC Forward Current
60
mA
Reverse Voltage
5
V
Operating Temperature Range
-40°C to + 85°C
Storage Temperature Range
-55°C to + 100°C
Infrared Soldering Condition
260°C for 10 Seconds Max.
Suggestion IR Reflow Profile For Pb Free Process:
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Part No. : LTE-C9501
BNS-OD-FC 002/A4
IR Emitter and Detector
LTE-C9501
4. Electrical / Optical Characteristics at TA=25℃
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
Radiant Intensity
IE
1.0
-
6.0
mW/sr
IF = 20mA
Peak Emission Wavelength
λPeak
-
940
-
nm
IF = 20mA
Spectral Line Half-Width
Δλ
-
50
-
nm
IF = 20mA
Forward Voltage
VF
1.1
1.2
1.5
V
IF = 20mA
Reverse Current
IR
-
-
10
μA
VR = 5V
Viewing Angle
2θ1/2
-
20
-
deg
Note:
1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.
3. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation.
5. Bin Code List
Bin Code
Radiant Intensity
mW/sr @ IF=20mA
Min
Max
BIN A
1.0
2.0
BIN B
2.0
3.0
BIN C
3.0
6.0
Tolerance on each intensity bin is +/-15%
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Part No. : LTE-C9501
BNS-OD-FC 002/A4
IR Emitter and Detector
LTE-C9501
6. Typical Electrical / Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
100
80
60
40
20
0
0.5
1.0
1040940840
120
100
80
60
40
20
Relative Radiant Intensity
Wavelength (nm)
FIG.1 SPECTRAL DISTRIBUTION
0
Forward Current IF (mA)
AMBIENT TEMPERATURE
FIG.2 FORWARD CURRENT VS.
Ambient Temperature Ta ( C)
o
100-40 0-20 20 6040 80
Ambient Temperature Ta ( C)
VS. AMBIENT TEMPERATURE
FIG.4 RELATIVE RADIANT INTENSITY
-20
Output Power Relative To
Value at IF=20mA
0.6
0.2
0
0.4
0.8
1.0
1.2
6040200
o
80
Forward Current (mA)
01.6
FORWARD VOLTAGE
FIG.3 FORWARD CURRENT VS.
Forward Voltage (V)
1.2
0 2.8
2.4
2.0
Value at IF=20mA
Output Power Relative To
2.0
4.0
0
6.0
8.0
10.0
80
VS. FORWARD CURRENT
FIG.5 RELATIVE RADIANT INTENSITY
Foward Current (mA)
400160120 200
Relative Radiant Intensity
FIG.6 RADIATION DIAGRAM
0.60.5 0.3 0.1 0.2 0.4
02010oo o
80o
90o
70
60
o
o
50
40
o
o
30o
0.9
0.7
0.8
1.0
70
60
50
40
30
20
10
Forward Current IF (mA)
AMBIENT TEMPERATURE
FIG.2 FORWARD CURRENT VS.
Ambient Temperature Ta ( C)
o
100-40 0-20 20 6040 80
Value at IF=20mA
Output Power Relative To
1.0
2.0
0
3.0
4.0
5.0
40
VS. FORWARD CURRENT
FIG.5 RELATIVE RADIANT INTENSITY
Foward Current (mA)
2008060 100
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Part No. : LTE-C9501
BNS-OD-FC 002/A4
IR Emitter and Detector
LTE-C9501
7. Suggest Soldering Pad Dimensions
8. Package Dimensions Of Tape And Reel
Note: All dimensions are in millimeters (inches).
Hole
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Part No. : LTE-C9501
BNS-OD-FC 002/A4
IR Emitter and Detector
LTE-C9501
Note:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel- 1500 pieces per reel.
3. The maximum number of consecutive missing parts is two.
4. In accordance with ANSI/EIA 481-1-A-1994 specifications.
8. CAUTIONS
8.1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication
equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional
reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in
aviation, transportation, traffic control equipment, medical and life support systems and safety devices).
8.2. Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within
one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week hrs.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with
appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than one week hrs should be baked at about 60 deg C for at least 20
hours before solder assembly.
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Part No. : LTE-C9501
BNS-OD-FC 002/A4
IR Emitter and Detector
LTE-C9501
8.3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
8.4. Soldering
Recommended soldering conditions:
Reflow Soldering
Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 seconds Max.
260°C Max.
10 seconds Max.(Max. two times)
Temperature
Soldering time
300°C Max.
3 seconds Max.
(one time one)
Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no
single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific
characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface
mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste
manufacturer to avoid damaging the device and create a reliable solder joint.
8.5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as
shown in Circuit A below.
Circuit model (A) Circuit model (B)
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
