TPD1018F
2006-10-31
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TOSHIBA Intelligent Power Device Silicon Monolithic Power MOS Integrated Circuit
TPD1018F
High-side Power Switch for Motors, Solenoids, and Lamp Drivers
The TPD1018F is a monolithic power IC for high-side switches. The IC
has a vertical MOS FET output that can be directly driven from a CMOS
or TTL logic circuit (e.g., an MPU). The device is equipped with intelligent
self-protection and diagnostic functions.
Features
z A monolithic power IC with a new structure combining a control block
(Bi-CMOS) and a vertical power MOS FET (π-MOS) on a single chip
z One side of load can be grounded to a high-side switch
z Can directly drive a power load from a microprocessor.
z Built-in protection against overvoltage, thermal shutdown, and load
short-circuiting
z Incorporates a diagnosis function that allows diagnosis output to be
read externally in the event of load short-circuiting, overvoltage, or
overheating.
z Low on-resistance : RDS (ON) = 0.8 (max)
z Low operating current : IDD = 120μA (typ.) (@VDD = 13.2V, VIN = 0V)
z 10-pin SSOP package for surface mounting
Block Diagram
Pin Assignment (top view)
Note: Due to its MOS structure, this product is sensitive to static electricity.
Marking
Weight: 0.08g (typ.)
1018
Lot No.
A
dot indicates
lead (Pb)-free..
Part No. (or abbreviation code)
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Pin Description
Pin No. Symbol Function
1 OUT
Output pin.
When the load is short-circuited and current in excess of the detection current (0.5A min) flows to the
output pin, the current limiter operates to protect the IC.
2, 3, 4 GND Ground pins.
5 VDD
Power pin.
Incorporates an overvoltage protection function which turns off the output when the voltage applied
exceeds 25V (min). Protects IC and load.
Incorporates 2V (typ.) hysteresis.
6 IN
Input is CMOS-compatible, with pull-down resistor connected.
Even if the input is open, output will not accidentally turn on.
7, 8, 9 GND Ground pins.
10 DIAG
Self-diagnosis detection pin. Goes low when overcurrent, overheating, or overvoltage is detected.
n-channel open drain.
Timing Chart
Truth Table
Input Signal Output Signal Diagnosis Output State
H H H
L L H
Normal
H L L
L L H
Overcurrent
H L L
L L H
Overtemperature
H L L
L L H
Overvoltage
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Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Drain-source Voltage VDS 60 V
DC VDD (1) 25 V
Supply Voltage
Pulse VDD (2) 60 (Rs = 1, τ = 250ms) V
DC VIN (1) -0.5~25 V
Input Voltage
Pulse VIN (2) V
DD (1) + 1.5 (t = 100ms) V
Output Current IO 0.5 A
Input Current IIN ±10 mA
Power Dissipation PD 300 mW
Operating Temperature Topr -40~125 °C
Junction Temperature Tj 150 °C
Storage Temperature Tstg -55~150 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Electrical Characteristics (Tj = -40~125°C)
Characteristics Symbol
Test
Circuit Test Condition Min Typ. Max Unit
Operating Supply Voltage VDD (opr) 5 12 25 V
IDD (1) VDD = 13.2V, VIN = 0V,
Tj = 85°C 120 300 μA
Supply Current
IDD (2)
VDD = 13.2V, VIN = 5V 1 1.5 mA
VIH V
DD = 13.2V, IO = 300mA 3.5 V
Input Voltage
VIL V
DD = 13.2V, IO = 100μA 1.5 V
IIN (1) V
DD = 13.2V, VIN = 5V 10 100 μA
Input Current
IIN (2)
VDD = 13.2V, VIN = 0V -0.2 0.2 μA
On-voltage VDS (ON) VDD = 13.2V, IO = 300mA,
Tj = 25°C 0.21 0.24 V
RDS (ON)(1) VDD = 13.2V, IO = 300mA,
Tj = 25°C 0.7 0.8
On-resistance
RDS (ON)(2)
VDD = 13.2V, IO = 300mA,
Tj = -40~85°C 1.2
Diagnosis Output
Voltage “L” Level VDL V
DD = 13.2V, IDL = 1mA 0.4 V
Diagnosis Output
Current “H” Level IDH V
DD = 25V, IDH = 25V 10 μA
Output Leakage Current IOL V
DD = 25V, VIN = 0V 100 μA
Overcurrent Protection IS V
DD = 13.2V, Tj = 25°C 0.5 3 A
Temperature TS 150 160 200 °C
Thermal Shutdown
Hysteresis ΔTS
20 50 °C
Voltage VDDS 25 V
Overvoltage
Protection Hysteresis ΔVDDS
2 7 V
tON 50 μs
Switching Time
tOFF
1 VDD = 13.2V, RL = 40
Tj = 25°C 10 μs
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Test Circuit 1
Switching Time
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Precaution:
1. Since there is no built-in protection against reverse connection of batteries, etc., provide such protection using
external circuits.
2. Since this IC does not include a negative bias protection circuit for the output pin, connect a freewheeling diode
(FWD) between OUT and GND when negative bias is applied to the output pin.
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Package Dimensions
Weight: 0.08g (typ.)
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RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL
The information contained herein is subject to change without notice.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
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set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
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