MC74HCT4066A Quad Analog Switch/ Multiplexer/Demultiplexer with LSTTL Compatible Inputs http://onsemi.com High-Performance Silicon-Gate CMOS The MC74HCT4066A utilizes silicon-gate CMOS technology to achieve fast propagation delays, low ON resistances, and low O F F -c h a n n e l l e a k a g e c u r r e n t . T h i s b i l a t e r a l s w i t c h / multiplexer/demultiplexer controls analog and digital voltages that may vary across the full power-supply range (from VCC to GND). The HCT4066A is identical in pinout to the metal-gate CMOS MC14016 and MC14066. Each device has four independent switches. The device has been designed so the ON resistances (RON) are more linear over input voltage than RON of metal-gate CMOS analog switches. The ON/OFF control inputs are compatible with standard CMOS and LSTTL outputs. For analog switches with voltage-level translators, see the HC4316A. Features * * * * * * * * * * Fast Switching and Propagation Speeds High ON/OFF Output Voltage Ratio Low Crosstalk Between Switches Diode Protection on All Inputs/Outputs Wide Power-Supply Voltage Range (VCC - GND) = 4.5 to 5.5 V Analog Input Voltage Range (VCC - GND) = 0 to 5.5 V Improved Linearity and Lower ON Resistance over Input Voltage than the MC14016 or MC14066 Low Noise Chip Complexity: 44 FETs or 11 Equivalent Gates These are Pb-Free Devices (c) Semiconductor Components Industries, LLC, 2010 November, 2010 - Rev. 1 1 MARKING DIAGRAMS 14 SOIC-14 D SUFFIX CASE 751A 14 1 HCT4066AG AWLYWW 1 14 14 1 TSSOP-14 DT SUFFIX CASE 948G 1 A L, WL Y, YY W, WW G or HCT40 66A ALYW = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Publication Order Number: MC74HCT4066A/D MC74HCT4066A XA 1 14 VCC YA 2 13 A ON/OFF CONTROL YB 3 12 D ON/OFF CONTROL XB 4 11 XD B ON/OFF CONTROL 5 10 YD C ON/OFF CONTROL 6 9 YC GND 7 8 XC XA A ON/OFF CONTROL XB B ON/OFF CONTROL XC C ON/OFF CONTROL Figure 1. Pin Assignment FUNCTION TABLE On/Off Control Input State of Analog Switch L H Off On XD D ON/OFF CONTROL 1 2 YA 13 4 3 YB 5 8 9 YC ANALOG OUTPUTS/INPUTS 6 11 10 YD 12 ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD PIN 14 = VCC PIN 7 = GND Figure 2. Logic Diagram ORDERING INFORMATION Package Shipping MC74HCT4066ADG SOIC-14 (Pb-Free) 55 Units / Rail MC74HCT4066ADR2G SOIC-14 (Pb-Free) 2500 / Tape & Reel TSSOP-14* 2500 / Tape & Reel Device MC74HCT4066ADTR2G For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 2 MC74HCT4066A MAXIMUM RATINGS Symbol Parameter Value Unit -0.5 to +14.0 V Analog Input Voltage (Referenced to GND) -0.5 to VCC + 0.5 V Digital Input Voltage (Referenced to GND) -0.5 to VCC + 0.5 V 25 mA 500 450 mW -65 to +150 C VCC Positive DC Supply Voltage (Referenced to GND) VIS Vin I DC Current Into or Out of Any Pin PD Power Dissipation in Still Air, Tstg Storage Temperature SOIC Package TSSOP Package This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Derating - SOIC Package: - 7 mW/C from 65C to 125C TSSOP Package: - 6.1 mW/C from 65C to 125C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.5 5.5 V VCC Positive DC Supply Voltage (Referenced to GND) VIS Analog Input Voltage (Referenced to GND) GND VCC V Vin Digital Input Voltage (Referenced to GND) GND VCC V VIO* Static or Dynamic Voltage Across Switch - 1.2 V -55 +125 C 0 500 TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time, ON/OFF Control Inputs (Figure 10) ns VCC = 4.5 V *For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. DC ELECTRICAL CHARACTERISTIC Digital Section (Voltages Referenced to GND) Guaranteed Limit VCC V - 55 to 25C v 85C v 125C Unit VIH Minimum High-Level Voltage ON/OFF Control Inputs Ron = Per Spec 4.5 to 5.5 2.0 2.0 2.0 V VIL Maximum Low-Level Voltage ON/OFF Control Inputs Ron = Per Spec 4.5 to 5.5 0.8 0.8 0.8 V Iin Maximum Input Leakage Current ON/OFF Control Inputs Vin = VCC or GND 5.5 0.1 1.0 1.0 A ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND VIO = 0 V 5.5 2 20 40 A ICC Additional Quiescent Supply Current (per Input) Vin = VCC - 2.1 V Other control inputs at VCC or GND 4.5 to 5.5 360 450 490 A Symbol Parameter Test Conditions http://onsemi.com 3 MC74HCT4066A DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND) Guaranteed Limit Symbol Ron Parameter VCC V - 55 to 25C v 85C v 125C Unit Vin = VIH VIS = VCC to GND IS v 2.0 mA (Figures 3, 4) 4.5 120 160 200 Vin = VIH VIS = VCC or GND (Endpoints) IS v 2.0 mA (Figures 3, 4) 4.5 70 85 120 Test Conditions Maximum "ON" Resistance Ron Maximum Difference in "ON" Resistance Between Any Two Channels in the Same Package Vin = VIH VIS = 1/2 (VCC - GND) IS v 2.0 mA 4.5 20 25 30 Ioff Maximum Off-Channel Leakage Current, Any One Channel Vin = VIL VIO = VCC or GND Switch Off (Figure 5) 5.5 0.1 0.5 1.0 A Ion Maximum On-Channel Leakage Current, Any One Channel Vin = VIH VIS = VCC or GND (Figure 6) 5.5 0.1 0.5 1.0 A AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, ON/OFF Control Inputs: tr = tf = 6 ns) Guaranteed Limit Parameter Symbol VCC V - 55 to 25C v 85C v 125C Unit tPLH, tPHL Maximum Propagation Delay, Analog Input to Analog Output (Figures 10 and 11) 4.5 10 13 15 ns tPLZ, tPHZ Maximum Propagation Delay, ON/OFF Control to Analog Output (Figures 12 and 13) 4.5 30 38 45 ns tPZL, tPZH Maximum Propagation Delay, ON/OFF Control to Analog Output (Figures 12 and 13) 4.5 25 32 37 ns ON/OFF Control Input - 10 10 10 pF Control Input = GND Analog I/O Feedthrough - - 35 1.0 35 1.0 35 1.0 C Maximum Capacitance Typical @ 25C, VCC = 5.0 V CPD 15 Power Dissipation Capacitance (Per Switch) (Figure 15)* *Used to determine the no-load dynamic power consumption: PD = CPD VCC 2f + ICC VCC . http://onsemi.com 4 pF MC74HCT4066A IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIII IIIIIIIIIIIIII III IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIII IIIIIIIIIIIIII III IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIII IIIIIIIIIIIIII III IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) Symbol Parameter Test Conditions BW Maximum On-Channel Bandwidth or Minimum Frequency Response (Figure 7) fin = 1 MHz Sine Wave Adjust fin Voltage to Obtain 0 dBm at VOS Increase fin Frequency Until dB Meter Reads - 3 dB RL = 50 , CL = 10 pF - - - THD Off-Channel Feedthrough Isolation (Figure 8) VCC V Limit* 25C 54/74HCT 4.5 150 dB fin Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 , CL = 50 pF 4.5 -50 fin = 1.0 MHz, RL = 50 , CL = 10 pF 4.5 -40 Feedthrough Noise, Control to Switch (Figure 9) Vin v 1 MHz Square Wave (tr = tf = 6 ns) Adjust RL at Setup so that IS = 0 A RL = 600 , CL = 50 pF 4.5 60 RL = 10 k, CL = 10 pF 4.5 30 Crosstalk Between Any Two Switches (Figure 14) fin Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 , CL = 50 pF 4.5 -70 fin = 1.0 MHz, RL = 50 , CL = 10 pF 4.5 -80 Total Harmonic Distortion (Figure 16) fin = 1 kHz, RL = 10 k, CL = 50 pF THD = THDMeasured - THDSource VIS = 4.0 VPP sine wave *Guaranteed limits not tested. Determined by design and verified by qualification. http://onsemi.com 5 Unit MHz mVPP dB % 4.5 0.10 MC74HCT4066A 200 +25 C +125C -55C 180 RON @ 4.5 V 160 140 120 100 80 60 40 20 0 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND Figure 3. Typical On Resistance, VCC = 4.5 V PLOTTER PROGRAMMABLE POWER SUPPLY - MINI COMPUTER DC ANALYZER + VCC DEVICE UNDER TEST ANALOG IN COMMON OUT GND Figure 4. On Resistance Test Set-Up VCC VCC VCC VCC 14 GND 14 A VCC A OFF 7 SELECTED CONTROL INPUT N/C ON GND VIL 7 Figure 5. Maximum Off Channel Leakage Current, Any One Channel, Test Set-Up SELECTED CONTROL INPUT VIH Figure 6. Maximum On Channel Leakage Current, Test Set-Up http://onsemi.com 6 MC74HCT4066A VOS VCC VCC VIS 14 fin ON 0.1F CL* 7 VOS 14 SELECTED CONTROL INPUT fin dB METER OFF 0.1F CL* RL dB METER SELECTED CONTROL INPUT VCC 7 *Includes all probe and jig capacitance. *Includes all probe and jig capacitance. Figure 7. Maximum On-Channel Bandwidth Test Set-Up VCC VCC/2 Figure 8. Off-Channel Feedthrough Isolation, Test Set-Up VCC/2 14 RL RL OFF/ON VOS IS VCC CL* 3.0 V GND Vin 1 MHz tr = tf = 6 ns 7 ANALOG IN (VI) tPLH SELECTED CONTROL INPUT CONTROL ANALOG OUT 50% GND tPHL 50% *Includes all probe and jig capacitance. Figure 9. Feedthrough Noise, ON/OFF Control to Analog Out, Test Set-Up Figure 10. Propagation Delays, Analog In to Analog Out http://onsemi.com 7 MC74HCT4066A VCC tr tf 14 ANALOG IN ANALOG OUT ON TEST POINT VCC 90% CONTROL (VI) Vm 10% GND CL* 7 SELECTED CONTROL INPUT tPZL tPLZ HIGH IMPEDANCE 50% VCC ANALOG OUT tPZH 10% VOL 90% VOH tPHZ 50% *Includes all probe and jig capacitance. HIGH IMPEDANCE VI = GND to 3.0 V Vm = 1.3 V Figure 11. Propagation Delay Test Set-Up Figure 12. Propagation Delay, ON/OFF Control to Analog Out VIS 1 POSITIONWHEN TESTING tPHZ AND tPZH VCC 2 POSITIONWHEN TESTING tPLZ AND tPZL 1 14 RL 2 VCC VCC fin TEST POINT ON/OFF 2 0.1 F 1 k 14 1 VOS ON OFF VCC OR GND CL* RL RL SELECTED CONTROL INPUT SELECTED CONTROL INPUT CL* VCC/2 RL CL* VCC/2 7 7 VCC/2 *Includes all probe and jig capacitance. *Includes all probe and jig capacitance. Figure 13. Propagation Delay Test Set-Up Figure 14. Crosstalk Between Any Two Switches, Test Set-Up VCC A VIS VCC 14 N/C OFF/ON VOS 0.1 F N/C fin ON RL 7 CL* TO DISTORTION METER VCC/2 SELECTED CONTROL INPUT 7 SELECTED CONTROL INPUT VCC ON/OFF CONTROL *Includes all probe and jig capacitance. Figure 15. Power Dissipation Capacitance Test Set-Up Figure 16. Total Harmonic Distortion, Test Set-Up http://onsemi.com 8 MC74HCT4066A 0 -10 FUNDAMENTAL FREQUENCY -20 dBm -30 -40 -50 DEVICE -60 SOURCE -70 -80 -90 1.0 3.0 2.0 FREQUENCY (kHz) Figure 17. Plot, Harmonic Distortion APPLICATION INFORMATION analog signal of twelve volts peak-to-peak can be controlled. When voltage transients above VCC and/or below GND are anticipated on the analog channels, external diodes (Dx) are recommended as shown in Figure 17. These diodes should be small signal, fast turn-on types able to absorb the maximum anticipated current surges during clipping. An alternate method would be to replace the Dx diodes with MOSORB(R) (MOSORB is an acronym for high current surge protectors). MOSORBs are fast turn-on devices ideally suited for precise DC protection with no inherent wear out mechanism. Unused analog inputs/outputs may be left floating (not connected). However, it is advisable to tie unused analog inputs and outputs to VCC or GND through a low value resistor. This minimizes crosstalk and feedthrough noise that may be picked-up by the unused I/O pins. The maximum analog voltage swings are determined by the supply voltages VCC and GND. The positive peak analog voltage should not exceed VCC. Similarly, the negative peak analog voltage should not go below GND. In the example below, the difference between VCC and GND is twelve volts. Therefore, using the configuration in Figure 16, a maximum VCC VCC = 5 V +5V 14 ANALOG I/O ON ANALOG O/I Dx +5V SELECTED CONTROL INPUT 16 Dx ON 0V 0V VCC Dx VCC OTHER CONTROL INPUTS Dx SELECTED CONTROL INPUT OTHER CONTROL INPUTS 7 7 Figure 18. 5 V Application Figure 19. Transient Suppressor Application http://onsemi.com 9 MC74HCT4066A +5 V +5 V 14 ANALOG SIGNALS R* R* R* R* HC4066A LSTTL/ NMOS 6 15 ANALOG SIGNALS HCT4066A LSTTL/ NMOS 5 14 14 ANALOG SIGNALS ANALOG SIGNALS 5 6 CONTROL INPUTS 14 CONTROL INPUTS 15 7 7 R* = 2 TO 10 k a. Using Pull-Up Resistors with HC Device b. Using HCT Buffer Figure 20. LSTTL/NMOS to HCTMOS Interface CHANNEL 4 1 OF 4 SWITCHES CHANNEL 3 1 OF 4 SWITCHES CHANNEL 2 1 OF 4 SWITCHES CHANNEL 1 1 OF 4 SWITCHES COMMON I/O INPUT 1 OF 4 SWITCHES + OUTPUT LF356 OR EQUIVALENT 0.01 F 1 2 3 4 CONTROL INPUTS Figure 21. 4-Input Multiplexer Figure 22. Sample/Hold Amplifier http://onsemi.com 10 MC74HCT4066A PACKAGE DIMENSIONS SOIC-14 CASE 751A-03 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 14 8 -B- P 7 PL 0.25 (0.010) M 7 1 G -T- 0.25 (0.010) M T B S A DIM A B C D F G J K M P R J M K D 14 PL F R X 45 C SEATING PLANE B M S SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 MC74HCT4066A PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 M B -U- L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U 0.25 (0.010) 8 S DETAIL E K A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. EEE CCC CCC EEE K1 J J1 SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 --- 1.20 --- 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0 8 0 8 SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 12 MC74HCT4066A ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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