Product Folder Sample & Buy Support & Community Tools & Software Technical Documents Reference Design LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 LP2996-N, LP2996A DDR Termination Regulator 1 Features * 1 * * * * * * * * Minimum VDDQ: - 1.8 V (LP2996-N) - 1.35 V (LP2996A) Source and Sink Current Low Output Voltage Offset No External Resistors Required for Setting Output Voltage Linear Topology Suspend to Ram (STR) Functionality Stable With Ceramic Capacitors With Appropriate ESR Low External Component Count Thermal Shutdown An additional feature found on the LP2996-N and LP2996A is an active-low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high impedance output, but VREF remains active. A power savings advantage can be obtained in this mode through lower quiescent current. TI recommends the LP2998 and LP2998-Q1 devices for automotive applications and DDR applications that require operating at temperatures below zero. WEBENCH(R) design tools can be used by application designers to generate, optimize, and simlulate applications using the LP2998 and LP2998-Q1. Device Information(1) PART NUMBER LP2996-N PACKAGE SOIC (8) BODY SIZE (NOM) 4.90 mm x 3.90 mm 2 Applications LP2996-N, LP2996A WSON (8) 4.90 mm x 3.90 mm * * LP2996-N 4.00 mm x 4.00 mm * * * * LP2996-N: DDR1 and DDR2 Termination Voltage LP2996A: DDR1, DDR2, DDR3, and DDR3L Termination Voltage FPGA Industrial and Medical PC SSTL-2 and SSTL-3 Termination HSTL Termination 3 Description The LP2996-N and LP2996A linear regulators are designed to meet the JEDEC SSTL-2 specifications for termination of DDR-SDRAM. The device also supports DDR2, while LP2996A supports DDR3 and DDR3L VTT bus termination with VDDQ minimum of 1.35 V. The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 1.5-A continuous current and transient peaks up to 3 A in the application as required for DDR-SDRAM termination. The LP2996-N and LP2996A also incorporate a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs. WQFN (16) (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic LP2996A SD + VDDQ = 1.5 V VDDQ VDD = 2.5 V AVIN VSENSE PVIN VTT 47 PF + VREF = 0.75 V VREF SD GND 0.01PF VTT = 0.75 V 36 220 PF Copyright (c) 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 5 6.1 6.2 6.3 6.4 6.5 6.6 5 5 5 5 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 10 7.1 7.2 7.3 7.4 Overview ................................................................. Functional Block Diagram ...................................... Feature Description................................................. Device Functional Modes........................................ 10 10 11 11 8 Applications and Implementation ...................... 12 8.1 Application Information............................................ 12 8.2 Typical Applications ................................................ 12 9 Power Supply Recommendations...................... 18 10 Layout................................................................... 19 10.1 Layout Guidelines ................................................. 19 10.2 Layout Examples................................................... 19 10.3 Thermal Considerations ........................................ 20 11 Device and Documentation Support ................. 23 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 23 23 23 23 23 23 23 12 Mechanical, Packaging, and Orderable Information ........................................................... 23 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision J (March 2013) to Revision K Page * Added Device Information table, Specifications section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...................................................................................................................... 1 * Added LP2996A throughout data sheet ................................................................................................................................. 1 * Added DDR3 support throughout data sheet ......................................................................................................................... 1 * Deleted Lead temperature (260C maximum) from Absolute Maximum Ratings .................................................................. 5 * Changed Thermal Resistance, RJA, values in Thermal Information From: 151C/W To: 119.5C/W (SOIC), From: 151C/W To: 56.5C/W (SO), and From: 151C/W To: 52.7C/W (WQFN)........................................................................... 5 Changes from Revision I (March 2013) to Revision J Page * Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1 * Added VDDQ Range ................................................................................................................................................................. 1 2 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 5 Pin Configuration and Functions D Package 8-Pin SOIC Top View DDA Package 8-Pin SO With PowerPAD Top View GND 1 8 VTT SD 2 7 PVIN GND 1 SD 2 8 VTT 7 PVIN PowerPAD VSENSE 3 6 AVIN VREF 4 5 VDDQ VSENSE 3 6 AVIN VREF 4 5 VDDQ Not to scale Not to scale VTT NC 13 3 10 AVIN 4 9 7 8 VDDQ SD 14 PVIN VREF NC VTT 11 Thermal Pad 6 2 15 PVIN NC GND NC 12 5 1 VSENSE NC 16 NHP Package 16-Pin WQFN Top View NC Not to scale Pin Functions PIN NAME SO PowerPAD SOIC WQFN I/O DESCRIPTION Analog input pin. AVIN is used to supply all the internal control circuitry. This pin has the capability to work from a supply separate from PVIN depending on the application. For SSTL-2 applications, a good compromise would be to connect the AVIN and PVIN directly together at 2.5 V. This eliminates the requirement for bypassing the two supply pins separately. The only limitation on input voltage selection is that PVIN must be equal to or lower than AVIN. AVIN 6 6 10 I GND 1 1 2 -- PVIN 7 7 11, 12 Ground Power input pin. PVIN is used exclusively to provide the rail voltage for the output stage used to create VTT. This pin has the capability to work from a supply separate from PVIN depending on the application. Higher voltages on PVIN increases the maximum continuous output current because of output RDS(ON) limitations at voltages close to VTT. The disadvantage of high values of PVIN is that the internal power loss also increases, thermally limiting the design. For SSTL-2 applications, a good compromise would be to connect the AVIN and PVIN directly together at 2.5 V. This eliminates the requirement for bypassing the two supply pins separately. The only limitation on input voltage selection is that PVIN must be equal to or lower than AVIN. TI recommends connecting PVIN to voltage rails equal to or less than 3.3 V to prevent the thermal limit from tripping because of excessive internal power dissipation. If the junction temperature exceeds the thermal shutdown then the part enters a shutdown state identical to the manual shutdown where VTT is tri-stated and VREF remains active. I Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 3 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com Pin Functions (continued) PIN SO PowerPAD NAME SD 2 VDDQ 5 VREF 4 VSENSE 3 SOIC 2 5 4 3 WQFN 4 8 7 5 I/O DESCRIPTION I Shutdown. The LP2996-N and LP2996A contain an active low shutdown pin that can be used to tristate VTT. During shutdown VTT must not be exposed to voltages that exceed AVIN. With the shutdown pin asserted low the quiescent current of the LP2996-N and LP2996A drops, however, VDDQ always maintains its constant impedance of 100 k for generating the internal reference. Therefore, to calculate the total power loss in shutdown, both currents must be considered. See Thermal Considerations for more information. The shutdown pin also has an internal pullup current, therefore to turn the part on, the shutdown pin can either be connected to AVIN or left open. I Input for internal reference equal to VDDQ / 2. VDDQ is the input used to create the internal reference voltage for regulating VTT. The reference voltage is generated from a resistor divider of two internal 50-k resistors. This ensures that VTT tracks VDDQ / 2 precisely. The optimal implementation of VDDQ is as a remote sense. This can be achieved by connecting VDDQ directly to the 2.5-V rail at the DIMM instead of AVIN and PVIN. This ensures that the reference voltage tracks the DDR memory rails precisely without a large voltage drop from the power lines. For SSTL2 applications VDDQ is a 2.5-V signal, which creates a 1.25-V termination voltage at VTT. See Electrical Characteristics for exact values of VTT over temperature. O Buffered internal reference voltage of VDDQ / 2. VREF provides the buffered output of the internal reference voltage VDDQ / 2. This output must be used to provide the reference voltage for the Northbridge chipset and memory. Because these inputs are typically an extremely high impedance, there must be little current drawn from VREF. For improved performance, an output bypass capacitor can be placed close to the pin to help reduce noise. TI recommends a ceramic capacitor from 0.1 F to 0.01 F. This output remains active during the shutdown state and thermal shutdown events for the suspend to RAM functionality. I Feedback pin for regulating VTT. The purpose of the sense pin is to provide improved remote load regulation. In most motherboard applications the termination resistors connect to VTT in a long plane. If the output voltage was regulated only at the output of the device then the long trace causes a significant IR drop resulting in a termination voltage lower at one end of the bus than the other. The VSENSE pin can be used to improve this performance by connecting it to the middle of the bus. This provides a better distribution across the entire termination bus. If remote load regulation is not used then the VSENSE pin must still be connected to VTT. Take care when a long VSENSE trace is implemented in close proximity to the memory. Noise pickup in the VSENSE trace can cause problems with precise regulation of VTT. A small 0.1-F ceramic capacitor placed next to the VSENSE pin can help filter any high frequency signals and preventing errors. VTT 8 8 14, 15 O Output voltage for connection to termination resistors. VTT is the regulated output that is used to terminate the bus resistors. It is capable of sinking and sourcing current while regulating the output precisely to VDDQ / 2. The LP2996-N and LP2996A are designed to handle peak transient currents of up to 3 A with a fast transient response. The maximum continuous current is a function of VDD and can be seen in Typical Characteristics. If a transient above the maximum continuous current rating is expected to last for a significant amount of time then the output capacitor must be large enough to prevent an excessive voltage drop. Despite the fact that the device is designed to handle large transient output currents it is not capable of handling these for long durations under all conditions. The reason for this is the standard packages are not able to thermally dissipate the heat as a result of the internal power loss. If large currents are required for longer durations, then ensure that the maximum junction temperature is not exceeded. Proper thermal derating must always be used (see Thermal Considerations). If the junction temperature exceeds the thermal shutdown point then VTT tri-states until the part returns below the hysteretic trip-point. NC -- -- 1, 3, 6, 9, 13, 16 -- No internal connection PowerPAD -- Thermal Pad -- Exposed pad thermal connection. Connect to Ground. Thermal Pad 4 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT -0.3 6 V PVIN to GND -0.3 AVIN V Input voltage (VDDQ) (3) -0.3 6 V 150 C 150 C AVIN to GND Junction temperature, TJ Storage temperature, Tstg (1) (2) (3) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. VDDQ voltage must be less than 2 x (AVIN - 1) or 6 V, whichever is smaller. 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT 1000 V The human body model is a 100-pF capacitor discharged through a 1.5-k resistor into each pin. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN AVIN to GND TJ (1) MAX UNIT 2.2 5.5 V PVIN supply voltage 0 AVIN V SD input voltage 0 AVIN V Junction temperature (1) 0 125 C At elevated temperatures, devices must be derated based on thermal resistance. 6.4 Thermal Information LP2996-N, LP2996A THERMAL METRIC D (SOIC) DDA (SO) NHP (WQFN) 8 PINS 8 PINS 16 PINS UNIT RJA Junction-to-ambient thermal resistance 119.5 56.5 52.7 C/W RJC(top) Junction-to-case (top) thermal resistance 65.3 65.1 50.1 C/W RJB Junction-to-board thermal resistance 59.8 36.5 30.1 C/W JT Junction-to-top characterization parameter 16.7 15.9 0.7 C/W JB Junction-to-board characterization parameter 59.3 36.5 30.2 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- 8.4 9.8 C/W Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 5 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com 6.5 Electrical Characteristics Minimum and maximum limits apply over the full operating temperature range (TJ = 0C to 125C) and are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm (TJ = 25C), and are provided for reference purposes only. Unless otherwise specified, AVIN = PVIN = 2.5 V and VDDQ = 2.5 V. (1) PARAMETER VREF voltage (DDR I) VREF VREF voltage (DDR II) VREF voltage (DDR III) ZVREF VREF output impedance MIN TYP MAX VDD = VDDQ = 2.3 V TEST CONDITIONS 1.135 1.158 1.185 VDD = VDDQ = 2.5 V 1.235 1.258 1.285 VDD = VDDQ = 2.7 V 1.335 1.358 1.385 PVIN = VDDQ = 1.7 V 0.837 0.86 0.887 PVIN = VDDQ = 1.8 V 0.887 0.91 0.937 PVIN = VDDQ = 1.9 V 0.936 0.959 0.986 PVIN = VDDQ = 1.35 V 0.669 0.684 0.699 PVIN = VDDQ = 1.5 V 0.743 0.758 0.773 PVIN = VDDQ = 1.6 V 0.793 0.808 0.823 VDD = VDDQ = 2.3 V 1.12 1.159 1.19 VDD = VDDQ = 2.5 V 1.21 1.259 1.29 VDD = VDDQ = 2.7 V 1.32 1.359 1.39 VDD = VDDQ = 2.3 V 1.125 1.159 1.19 VDD = VDDQ = 2.5 V 1.225 1.259 1.29 VDD = VDDQ = 2.7 V 1.325 1.359 1.39 PVIN = VDDQ = 1.7 V 0.822 0.856 0.887 PVIN = VDDQ = 1.8 V 0.874 0.908 0.939 PVIN = VDDQ = 1.9 V 0.923 0.957 0.988 PVIN = VDDQ = 1.7 V 0.82 0.856 0.89 IOUT = 0.5 A, AVIN = 2.5 V PVIN = VDDQ = 1.8 V 0.87 0.908 0.94 PVIN = VDDQ = 1.9 V 0.92 0.957 0.99 PVIN = VDDQ = 1.35 V 0.656 0.677 0.698 PVIN = VDDQ = 1.5 V 0.731 0.752 0.773 PVIN = VDDQ = 1.6 V 0.781 0.802 0.823 IOUT = 0.2 A, AVIN = 2.5 V, PVIN = VDDQ = 1.35 V 0.667 0.688 0.71 IOUT = -0.2 A, AVIN = 2.5 V, PVIN = VDDQ = 1.35 V 0.641 0.673 0.694 IOUT = 0.4 A, AVIN = 2.5 V, PVIN = VDDQ = 1.5 V 0.74 0.763 0.786 IOUT = -0.4 A, AVIN = 2.5 V, PVIN = VDDQ = 1.5 V 0.731 0.752 0.773 IOUT = 0.5 A, AVIN = 2.5 V, PVIN = VDDQ = 1.6 V 0.79 0.813 0.836 IOUT = -0.5 A, AVIN = 2.5 V, PVIN = VDDQ = 1.6 V 0.781 0.802 0.823 IOUT = 0 A -30 0 30 IOUT = -1.5 A -30 0 30 IOUT = 1.5 A -30 0 30 IOUT = 0 A -30 0 30 IOUT = -0.5 A -30 0 30 IOUT = 0.5 A -30 0 30 IOUT = 0 A -30 0 30 IOUT = 0.2 A -30 0 30 IOUT = 0.4 A -30 0 30 IOUT = 0.5 A -30 IREF = -30 to 30 A IOUT = 0 A VTT output voltage (DDR I) (2) VTT IOUT = 1.5 A IOUT = 0 A, AVIN = 2.5 V VTT output voltage (DDR II) (2) IOUT = 0 A, AVIN = 2.5 V VTT output voltage (DDR III) (2) VTT output voltage offset (VREF - VTT) for DDR I (2) VOSVtt VTT output voltage offset (VREF - VTT) for DDR II (2) VTT output voltage offset (VREF - VTT) for DDR III (2) IQ (1) (2) (3) 6 Quiescent current (3) 2.5 IOUT = 0 A UNIT V V V k 0 30 320 500 V V V mV mV mV A VDD is defined as VDD = AVIN = PVIN. VTT load regulation is tested by using a 10-ms current pulse and measuring VTT. Quiescent current defined as the current flow into AVIN. Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 Electrical Characteristics (continued) Minimum and maximum limits apply over the full operating temperature range (TJ = 0C to 125C) and are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm (TJ = 25C), and are provided for reference purposes only. Unless otherwise specified, AVIN = PVIN = 2.5 V and VDDQ = 2.5 V.(1) PARAMETER TEST CONDITIONS ZVDDQ VDDQ input impedance ISD Quiescent current in shutdown (3) SD is low IQ_SD Shutdown leakage current SD is low VIH Minimum shutdown, high level VIL Maximum shutdown, low level IV VTT leakage current in shutdown ISENSE VSENSE input current TSD Thermal shutdown TSD_HYS Thermal shutdown hysteresis MIN TYP MAX 100 UNIT k 115 150 A 2 5 A 1.9 V SD is low, VTT = 1.25 V 1 0.8 V 10 A 13 nA 165 C 10 C 6.6 Typical Characteristics 400 1050 350 900 300 750 250 600 IQ (uA) IQ (uA) Unless otherwise specified, AVIN = PVIN = 2.5 V. 200 450 150 300 100 150 50 0 2 2.5 3 3.5 4 4.5 5 5.5 2 2.5 3 3.5 AVIN (V) 4 4.5 5 5.5 20 30 AVIN (V) Figure 1. IQ vs AVIN In Shutdown Figure 2. IQ vs AVIN 4 1.40 3.5 1.35 3 VREF (V) VSD (V) 1.30 2.5 2 1.25 1.20 1.5 1.15 1 0.5 2 2.5 3 3.5 4 4.5 5 5.5 1.10 -30 -20 -10 0 10 AVIN (V) IREF (uA) Figure 3. VIH and VIL Figure 4. VREF vs IREF Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 7 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com Typical Characteristics (continued) 3 1.275 2.5 1.270 2 1.265 VTT (V) VREF (V) Unless otherwise specified, AVIN = PVIN = 2.5 V. 1.5 1.260 1 1.255 0.5 1.250 0 0 1 2 3 4 5 1.245 -100 -75 6 -50 VDDQ (V) -25 0 25 50 75 100 IOUT (mA) Figure 5. VREF vs VDDQ Figure 6. VTT vs IOUT 400 3 350 2.5 0oC 300 IQ (uA) VTT (V) 2 1.5 125oC 250 200 1 150 0.5 100 50 0 0 1 2 3 4 5 2 6 2.5 3 3.5 4 4.5 5 5.5 AV IN (V) VDDQ (V) Figure 8. IQ vs AVIN in Shutdown Temperature Figure 7. VTT vs VDDQ 1.4 1050 85oC 1.2 IQ (uA) 750 OUTPUT CURRENT (A) 900 25oC 600 0oC 450 300 1 0.8 0.6 0.4 0.2 150 0 0 5.5 2 Figure 9. IQ vs AVIN Temperature VDDQ = 2.5 V 2 2.5 3 3.5 4 4.5 5 AVIN (V) 2.5 3 3.5 4 4.5 5 5.5 AVIN (V) PVIN = 1.8 V Figure 10. Maximum Sourcing Current vs AVIN 8 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 Typical Characteristics (continued) Unless otherwise specified, AVIN = PVIN = 2.5 V. 1.8 3 1.7 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 2.8 1.6 1.5 1.4 1.3 2.6 2.4 2.2 1.2 1.1 2 2 2.5 3 3.5 4 4.5 5 5.5 3 3.5 4 AVIN (V) VDDQ = 2.5 V PVIN = 2.5 V VDDQ = 2.5 V Figure 11. Maximum Sourcing Current vs AVIN 5 5.5 3.0 1.4 2.8 1.2 2.6 1 2.4 2.2 2.0 PVIN = 3.3 V Figure 12. Maximum Sourcing Current vs AVIN OUTPUT CURRENT (A) OUTPUT CURRENT (A) 4.5 AVIN (V) 1.8 0.8 0.6 0.4 0.2 1.6 0 2 2.5 3 3.5 4 4.5 5 5.5 2 2.5 3 AVIN (V) 3.5 4 4.5 5 5.5 AVIN (V) VDDQ = 2.5 V VDDQ = 1.8 V Figure 13. Maximum Sinking Current vs AVIN PVIN = 1.8 V Figure 14. Maximum Sourcing Current vs AVIN 2.4 3 2.2 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 2.8 2 1.8 1.6 1.4 2.6 2.4 2.2 1.2 1 2 2 2.5 3 3.5 4 4.5 5 5.5 3 AVIN (V) 3.5 4 4.5 5 5.5 AVIN (V) VDDQ = 1.8 V VDDQ = 1.8 V Figure 15. Maximum Sinking Current vs AVIN PVIN = 3.3 V Figure 16. Maximum Sourcing Current vs AVIN Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 9 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com 7 Detailed Description 7.1 Overview The LP2996-N and LP2996A devices can be used to provide a termination voltage for additional logic schemes such as SSTL-3 or HSTL. Series Stub Termination Logic (SSTL) was created to improve signal integrity of the data transmission across the memory bus. This termination scheme is essential to prevent data error from signal reflections while transmitting at high frequencies encountered with DDR-SDRAM. The most common form of termination is Class II single parallel termination. This involves one RS series resistor from the chipset to the memory and one RT termination resistor. Typical values for RS and RT are 25 , although these can be changed to scale the current requirements from the LP2996-N or LP2996A. This implementation is shown in Figure 17. VDD VTT RT MEMORY RS CHIPSET VREF Figure 17. SSTL-Termination Scheme 7.2 Functional Block Diagram VDDQ SD PVIN AVIN 50k VREF - + - 50k VTT + VSENSE GND Copyright (c) 2016, Texas Instruments Incorporated 10 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 7.3 Feature Description The LP2996-N and LP2996A are linear bus termination regulators designed to meet the JEDEC requirements of SSTL-2. The output (VTT) is capable of sinking and sourcing current while regulating the output voltage equal to VDDQ / 2. The output stage is designed to maintain excellent load regulation while preventing shoot through. The LP2996-N and LP2996A also incorporate two distinct power rails that separates the analog circuitry from the power output stage. This allows a split rail approach to be used to decrease internal power dissipation. It also permits the LP2996-N to provide a termination solution for DDR2-SDRAM, while the LP2996A supports DDR3SDRAM and DDR3L-SDRAM memory. TI recommends the LP2998 and LP2998-Q1 for all DDR applications that require operation at below-zero temperatures. 7.4 Device Functional Modes 7.4.1 Start-Up During start up when VDDQ is enabled, the error amplifier senses the output voltage is low and drives the pass element hard causing a large inrush current. If this inrush current is too large, the device shuts down and restarts due to the internal current limit. Two solutions to prevent large inrush current during start up: 1. Slow down the slew rate of VDDQ. When the slew rate of VDDQ is fast (approximately 60 s), the input current can reach over 5 A which exceeds the device's current limit thus causing a restart. If VDDQ start-up slew rate is 300 s, the inrush current can be reduced by 90% limiting the input rush current to less than 500mA. 2. In some cases the system designers have very little to no control over the VDDQ voltage supply slew rate, whether using linear or switching regulators. Some step down voltage regulators do not have soft-start feature. VDDQ voltage source requires only 18 A current to enable the DDRII termination voltage. Therefore placing an RC filter at VDDQ pin can conveniently increase the output voltage slew rate, allowing a slow rise in capacitor charge current. To keep the VDDQ voltage losses minimum, the resistor value must be chosen carefully. Using a 100- resistor keeps the VDDQ supply voltage losses down to 1.8 mV, because the current through VDDQ is only 18 A for DDRIII configuration. See Limiting DDR Termination Regulators' Inrush Current (SNVA758) for more information relating to the inrush current during start up. 7.4.2 Normal Operation The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 1.5-A continuous current and transient peaks up to 3 A in the application as required for DDR-SDRAM termination. The LP2996-N and LP2996A also incorporate a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs. See Electrical Characteristics and Application Information. 7.4.3 Shutdown The LP2996-N and LP2996A feature an active-low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low, the VTT output tri-states providing a high impedance output, but VREF remains active. A power savings advantage can be obtained in this mode through lower quiescent current. During shutdown, VTT must not be exposed to voltages that exceed AVIN. With the shutdown pin asserted low the quiescent current of the LP2996-N and LP2996A drops, however, VDDQ always maintains its constant impedance of 100 k for generating the internal reference. Therefore, to calculate the total power loss in shutdown, both currents must be considered. The shutdown pin also has an internal pullup current, therefore to turn the part on, the shutdown pin can either be connected to AVIN or left open. Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 11 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com 8 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LP2996 has split rails to allow flexibility in powering the device. It has a control circuitry rail (AVIN) and an output power stage rail (PVIN), both separate from the reference voltage input (VDDQ). This allows for different setups which cater to specific requirements such as high current capabilities, lower thermal dissipation, or minimum component count. Because the output is always VDDQ / 2 due to two internal 50-k resistors, the only necessary external components are bypass capacitors. 8.2 Typical Applications 8.2.1 Typical SSTL-2 Application Circuit This circuit permits termination in a minimum amount of board space and component count. Capacitor selection can be varied depending on the number of lines terminated and the maximum load transient. However, with motherboards and other applications where VTT is distributed across a long plane, it is advisable to use multiple bulk capacitors and addition to high frequency decoupling. LP2996A SD VDDQ = 1.5 V VDDQ VDD = 2.5 V AVIN + 47 PF 0.01PF VSENSE VTT PVIN + VREF = 0.75 V VREF SD GND VTT = 0.75 V 36 220 PF Copyright (c) 2016, Texas Instruments Incorporated Figure 18. Typical SSTL-2 Application Circuit Diagram 8.2.1.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters 12 PARAMETER VALUE VDDQ 1.5 V Input to AVIN and PVIN, VDD 2.5 V VREF 0.75 V VTT 0.75 V Input bypass capacitor, CIN 47 F Output bypass capacitor, COUT 220 F Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 8.2.1.2 Detailed Design Procedure The LP2996 requires voltage be applied to three pins for proper operation: VDDQ, AVIN, and PVIN. VDDQ sets the internal reference voltage and is divided across two 50-k resistors. Therefore, VDDQ must be set at exactly twice the appropriate DDR termination. AVIN powers the internal control circuitry and must be from 2.2 V to 5.5 V. PVIN is the supply for the power output stage and must be larger than or equal to VDDQ while smaller than or equal to AVIN. When picking PVIN, note that smaller values reduce internal power dissipation but reduce the maximum continuous current as well. It is acceptable to tie PVIN to either VDDQ or AVIN to minimize the number of supplies and bypass capacitors required. To prevent voltage dips on the output, a bypass capacitor must be placed on the VTT line. The size of this capacitor does not affect stability, but larger values improve the transient response and must be sized according to the design requirements. When using ceramic capacitors on the output, large load steps can cause ringing on VTT. Table 2 shows the range of acceptable equivalent series resistance (ESR) that can be added to dampen and improve the response. Table 2. Approximate ESR Values for VTT Capacitors VTT CAPACITANCE (F) RECOMMENDED ESR (m) 100 50 150 42 220 36 330 30 Another bypass capacitor on PVIN is recommended to keep current spikes from pulling down the input voltage. This is especially important if PVIN and VDDQ are on the same supply. A small 0.01-F capacitor can be placed on VREF to reduce noise. VSENSE provides a feedback path necessary for regulating the output voltage; Therefore, it must be connected to VTT. If a long VSENSE trace is necessary, a small ceramic capacitor may be required to filter out any high frequency noise picked up from switching I/O signals. 8.2.1.2.1 Input Capacitor The LP2996-N and LP2996A do not require a capacitor for input stability, but it is recommended for improved performance during large load transients to prevent the input rail from dropping. The input capacitor must be placed as close as possible to the PVIN pin. Several recommendations exist dependent on the application required. A typical value recommended for aluminum electrolytic capacitors is 50 F. Ceramic capacitors can also be used, a value approximately 10 F with X5R or better would be an ideal choice. The input capacitance can be reduced if the LP2996-N or LP2996A is placed close to the bulk capacitance from the output of the 2.5-V DC-DC converter. If the two supply rails (AVIN and PVIN) are separated then the 47-F capacitor must be placed as close to possible to the PVIN rail. An additional 0.1-F ceramic capacitor can be placed on the AVIN rail to prevent excessive noise from coupling into the device. 8.2.1.2.2 Output Capacitor The LP2996-N and LP2996A have been designed to be insensitive of output capacitor size or ESR. This allows the flexibility to use any capacitor desired. The choice for output capacitor is determined solely on the application and the requirements for load transient response of VTT. TI recommends the output capacitor be sized above 100 F with a low ESR for SSTL applications with DDR-SDRAM. The value of ESR is determined by the maximum current spikes expected and the extent at which the output voltage is allowed to droop. Several capacitor options are available on the market and a few of these are discussed: Aluminum Electrolytics, Ceramic Capacitors, and Hybrid Capacitors. 8.2.1.2.2.1 Aluminum Electrolytics Aluminum electrolytics often only specify impedance at a frequency of 120 Hz, indicating poor high frequency performance. Only aluminum electrolytics that specified an impedance at higher frequencies, from 20 kHz to 100 kHz, must be used for the LP2996-N and LP2996A. To improve the ESR, many aluminum electrolytics may be combined in parallel for an overall reduction. Be aware of the extent at which the ESR changes over temperature. Aluminum electrolytic capacitors' ESR may rapidly increase at cold temperatures. Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 13 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com 8.2.1.2.2.2 Ceramic Capacitors Ceramic capacitors typically have a low capacitance, from 10 F to 100 F, but they have excellent AC performance for bypassing noise due to very low ESR (typically less than 10 m). However, some dielectric types do not have good capacitance characteristics as a function of voltage and temperature. Because of the typically low value of capacitance, TI recommends using ceramic capacitors in parallel with another capacitor such as an aluminum electrolytic. TI recommends dielectric of X5R or better for all ceramic capacitors. 8.2.1.2.2.3 Hybrid Capacitors Hybrid capacitors offer a large capacitance while maintaining a low ESR. These are the best solution when size and performance are critical, although their cost is typically higher than any other capacitor. 8.2.1.2.2.4 PC Application Considerations With motherboards and other applications where VTT is distributed across a long plane, it is advisable to use multiple bulk capacitors and addition to high frequency decoupling. Figure 19 shows an example circuit where two bulk output capacitors could be situated at both ends of the VTT plane for optimal placement. Large aluminum electrolytic capacitors are used for their low ESR and low cost. In most PC applications an extensive amount of decoupling is required because of the long interconnects encountered with the DDR-SDRAM DIMMs mounted on modules. As a result bulk aluminum electrolytic capacitors approximately 1000 F are typically used. LP2996 SD VDDQ = 2.5 V VDDQ VDD = 2.5 V AVIN + 0.01 PF VSENSE PVIN + 47 PF VREF = 1.25 V VREF SD VTT GND VTT = 1.25 V 36 36 220 PF 220 PF Copyright (c) 2016, Texas Instruments Incorporated Figure 19. Typical SSTL-2 Application Circuit for Motherboards 8.2.1.3 Application Curves Figure 20. 0.5-A Load Transient With 220-F VTT Capacitor 14 Submit Documentation Feedback Figure 21. 1.5-A Load Transient With 220-F VTT Capacitor Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 8.2.2 Other Application Circuits Several different application circuits are shown to illustrate some of the options that are possible in configuring the LP2996-N or LP2996A. 8.2.2.1 SSTL-2 Applications For the majority of applications that implement the SSTL-2 termination scheme, TI recommends connecting all the input rails to the 2.5-V rail. This provides an optimal trade-off between power dissipation and component count and selection. An example of this circuit can be seen in Figure 22. LP2996 VREF = 1.25 V VREF SD SD + VDDQ = 2.5 V VDDQ VDD = 2.5 V AVIN VSENSE PVIN VTT + CREF VTT = 1.25 V GND CIN ROUT COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 22. Recommended SSTL-2 Implementation If power dissipation or efficiency is a major concern, then the LP2996-N or LP2996A has the ability to operate on split power rails. The output stage (PVIN) can be operated on a lower rail such as 1.8 V and the analog circuitry (AVIN) can be connected to a higher rail such as 2.5 V, 3.3 V, or 5 V. This allows the internal power dissipation to be lowered when sourcing current from VTT. The disadvantage of this circuit is that the maximum continuous current is reduced because of the lower rail voltage, although it is adequate for all motherboard SSTL-2 applications. Increasing the output capacitance can also help if periods of large load transients are encountered. LP2996 VREF = 1.25 V VREF SD SD + VDDQ = 2.5 V VDDQ AVIN = 2.2 V to 5.5 V AVIN VSENSE PVIN VTT PVIN = 1.8 V CIN + GND CREF VTT = 1.25 V ROUT COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 23. Lower Power Dissipation SSTL-2 Implementation The third option for SSTL-2 applications in the situation that a 1.8-V rail is not available and it is not desirable to use 2.5 V, is to connect the LP2996-N or LP2996A power rail to 3.3 V. In this situation AVIN is limited to operation on the 3.3-V or 5-V rail as PVIN can never exceed AVIN. This configuration has the ability to provide the maximum continuous output current at the downside of higher thermal dissipation. Prevent the device from experiencing large current levels which cause the junction temperature to exceed the maximum. Because of this risk, TI recommends not supplying the output stage with a voltage higher than a nominal 3.3-V rail. Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 15 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com LP2996 VREF = 1.25 V VREF SD SD + VDDQ = 2.5 V VDDQ AVIN = 3.3V or 5 V AVIN VSENSE PVIN VTT PVIN = 3.3 V CIN + GND CREF VTT = 1.25 V ROUT COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 24. SSTL-2 Implementation with Higher Voltage Rails 8.2.2.2 DDR-II Applications With the separate VDDQ pin and an internal resistor divider it is possible to use the LP2996-N and LP2996A in applications utilizing DDR-II memory. Figure 25 and Figure 26 show implementations of recommended circuit configurations for DDR-II applications. The output stage is connected to the 1.8-V rail and the AVIN pin can be connected to either a 3.3-V or 5-V rail. TI recommends the LP2996A, LP2998, or LP2998-Q1 for DDR-III and DDR-III low power designs. LP2996 VDDQ = 1.8 V VDDQ AVIN = 2.2V to 5.5 V AVIN + CREF VSENSE VTT PVIN PVIN = 1.8 V VREF = 0.9 V VREF SD SD + VTT = 0.9 V GND CIN ROUT COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 25. Recommended DDR-II Termination If it is not desirable to use the 1.8-V rail it is possible to connect the output stage to a 3.3-V rail. Take care not to exceed the maximum junction temperature as the thermal dissipation increases with lower VTT output voltages. For this reason, TI does not recommend powering PVIN from a rail higher than the nominal 3.3 V. The advantage of this configuration is that it has the ability to source and sink a higher maximum continuous current. LP2996 VDDQ = 1.8 V VDDQ AVIN = 3.3V or 5.5 V AVIN + CREF VSENSE VTT PVIN PVIN = 3.3 V + CIN VREF= 0.9 V VREF SD SD GND VTT = 0.9 V ROUT COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 26. DDR-II Termination with Higher Voltage Rails 16 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 8.2.2.3 DDR-III Applications With the separate VDDQ pin and an internal resistor divider it is possible to use the LP2996A in applications utilizing DDR-III memory. The output stage is connected to the 1.5-V rail and the AVIN pin can be connected to a 2.2-V to 5.5-V rail. LP2996A VREF = 0.75V VREF SD SD + VDDQ = 1.5V VDDQ AVIN = 2.2V to 5.5V AVIN VSENSE PVIN VTT PVIN = 1.5V + CIN CREF VTT = 0.75V + GND COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 27. Recommended DDR-III Termination Using the LP2996A If it is not desirable to use the 1.5-V to 2.5-V rail it is possible to connect the output stage to a 3.3-V rail. Do not exceed the maximum junction temperature as the thermal dissipation increases with lower VTT output voltages. For this reason, TI recommends not to power PVIN off a rail higher than the nominal 3.3-V. The advantage of this configuration is that it has the ability to source and sink a higher maximum continuous current. 8.2.3 Level Shifting If standards other than SSTL-2 are required, such as SSTL-3, it may be necessary to use a different scaling factor than VDDQ / 2 for regulating the output voltage. Several options are available to scale the output to any voltage required. One method is to level shift the output by using feedback resistors from VTT to the VSENSE pin. This is shown in Figure 28 and Figure 29. Figure 28 shows how to use two resistors to level shift VTT above the internal reference voltage of VDDQ / 2. Calculate the exact voltage at VTT with Equation 1. V R1 o ae VTT = DDQ c 1 + / 2 R2 e o (1) LP2996 VDDQ VDDQ VDD AVIN VTT PVIN CIN + VTT R1 VSENSE GND R2 ROUT COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 28. Increasing VTT by Level Shifting Conversely, the R2 resistor can be placed between VSENSE and VDDQ to shift the VTT output lower than the internal reference voltage of VDDQ / 2. Equation 2 shows the relation of VTT to the resistors. V R1 o ae VTT = DDQ c 1 2 R2 /o e (2) Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 17 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com LP2996 VDDQ VDDQ VDD AVIN R1 VTT PVIN + CIN R2 VSENSE VTT ROUT GND COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 29. Decreasing VTT by Level Shifting 8.2.4 HSTL Applications The LP2996-N and LP2996A can be easily adapted for HSTL applications by connecting VDDQ to the 1.5-V rail. This produces a VTT and VREF voltage of approximately 0.75 V for the termination resistors. AVIN and PVIN must be connected to a 2.5-V rail for optimal performance. LP2996 + VDDQ = 1.5 V VDDQ VDD = 2.5 V AVIN VSENSE PVIN VTT CIN + VREF = 0.75 V VREF SD SD GND CREF VTT = 0.75 V ROUT COUT Copyright (c) 2016, Texas Instruments Incorporated Figure 30. HSTL Application 8.2.5 QDR Applications Quad data rate (QDR) applications use multiple channels for improved memory performance. However, this increase in bus lines increases the current levels required for termination. TI recommends using a dedicated LP2996-N or LP2996A for each channel to terminate multiple channels. This simplifies layout and reduces the internal power dissipation for each regulator. Separate VREF signals can be used for each DIMM bank from the corresponding regulator with the chipset reference provided by a local resistor divider or one of the LP2996-N or LP2996A signals. Because VREF and VTT are expected to track and the part to part variations are minor, there must be little difference between the reference signals of each device. 9 Power Supply Recommendations There are several recommendations for the LP2996-N and LP2996A input power supply. Although not required, TI recommends an input capacitor for improved performance during large load transients to prevent the input rail from dropping. The input capacitor must be placed as close as possible to the PVIN pin. A typical value recommended for aluminum electrolytic capacitors is 50 F. Ceramic capacitors can also be used, a value approximately 10 F with X5R or better would be an ideal choice. The input capacitance can be reduced if the LP2996-N or LP2996A is placed close to the bulk capacitance from the output of the 2.5-V DC-DC converter. If the two supply rails (AVIN and PVIN) are separated then the 47-F capacitor must be placed as close to possible to the PVIN rail. An additional 0.1-F ceramic capacitor can be placed on the AVIN rail to prevent excessive noise from coupling into the device. 18 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 10 Layout 10.1 Layout Guidelines * * * * * * The input capacitor for the power rail must be placed as close as possible to the PVIN pin. VSENSE must be connected to the VTT termination bus at the point where regulation is required. For motherboard applications an ideal location would be at the center of the termination bus. VDDQ can be connected remotely to the VDDQ rail input at either the DIMM or the chipset. This provides the most accurate point for creating the reference voltage. For improved thermal performance excessive top side copper can be used to dissipate heat from the package. Numerous vias from the ground connection to the internal ground plane helps. Additionally these can be placed underneath the package if manufacturing standards permit. Take care when routing the VSENSE trace to avoid noise pickup from switching I/O signals. A 0.1-F ceramic capacitor placed close to VSENSE can also be used to filter any unwanted high frequency signal. This can be an issue especially if long VSENSE traces are used. VREF must be bypassed with a 0.01-F or 0.1-F ceramic capacitor for improved performance. This capacitor must be placed as close as possible to the VREF pin. 10.2 Layout Examples Figure 31. Layout Example of the SO PowerPAD Package (Top Layer) Figure 32. Layout Example of the WQFN Package (Top Layer) Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 19 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com 10.3 Thermal Considerations Because the LP2996-N and LP2996A are linear regulators, any current flow from VTT results in internal power dissipation generating heat. To prevent damaging the part from exceeding the maximum allowable junction temperature, derate the part according to the maximum expected ambient temperature and power dissipation. The maximum allowable internal temperature rise (TR(MAX)) can be calculated with Equation 3 given the maximum ambient temperature (TA(MAX)) of the application and the maximum allowable junction temperature (TJ(MAX)). TR(MAX) = TJ(MAX) - TA(MAX) (3) From this equation, the maximum power dissipation (PD(MAX)) of the part can be calculated with Equation 4. PD(MAX) = TR(MAX) / RJA (4) The RJA of the LP2996-N and LP2996A is dependent on several variables: the package used; the thickness of copper; the number of vias and the airflow. For instance, the RJA of the SOIC is 163C/W with the package mounted to a standard 8x4 2-layer board with 1-oz copper, no airflow, and 0.5-W dissipation at room temperature. This value can be reduced to 151.2C/W by changing to a 3x4 board with 2-oz copper that is the JEDEC standard. Figure 33 shows how the RJA varies with airflow for the two boards mentioned. 180 170 160 150 SOP Board JA 140 130 120 110 JEDEC Board 100 90 80 0 200 400 600 800 1000 AIRFLOW (Linear Feet per Minute) Figure 33. RJA vs Airflow (SOIC) Additional improvements can be made by the judicious use of vias to connect the part and dissipate heat to an internal ground plane. Using larger traces and more copper on the top side of the board can also help. With careful layout, it is possible to reduce the RJA further than the nominal values shown in Figure 33 Layout is also extremely critical to maximize the output current with the WQFN package. By simply placing vias under the thermal pad, the RJA can be lowered significantly. Figure 34 shows the WQFN thermal data when placed on a 4-layer JEDEC board with copper thickness of 0.5 oz, 1 oz, 1 oz, and 0.5 oz (respectively). The number of vias with a pitch of 1.27 mm is increased to the maximum of 4, where a RJA of 50.41C/W can be obtained. Via wall thickness for this calculation is 0.036 mm for 1-oz copper. 20 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 Thermal Considerations (continued) 100 90 JA(C/ W) 80 70 60 50 40 0 1 2 3 4 NUMBER OF VIAS NUMBER OF VIAS 4-layer JEDEC board Figure 34. WQFN-16 RJA vs Number of Vias Additional improvements in lowering the RJA can be achieved with a constant airflow across the package. Maintaining the same conditions as above and utilizing the 2x2 via array, Figure 35 shows how the RJA varies with airflow. 51 50 qJA (oC/W) 49 48 47 46 45 0 100 200 300 400 500 600 AIRFLOW (Linear Feet Per Minute) JEDEC board with 4 vias Figure 35. RJA vs Airflow Speed Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 21 LP2996-N, LP2996A SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 www.ti.com Thermal Considerations (continued) Optimizing the RJA and placing the device in a section of a board exposed to lower ambient temperature allows the part to operate with higher power dissipation. The internal power dissipation can be calculated by summing the three main sources of loss: output current at VTT, either sinking or sourcing, and quiescent current at AVIN and VDDQ. During the active state, when the shutdown pin (SD) is not held low, the total internal power dissipation can be calculated with Equation 5. PD = PAVIN + PVDDQ + PVTT where * * PAVIN = IAVIN x VAVIN PVDDQ = VVDDQ x IVDDQ = VVDDQ2 x RVDDQ (5) To calculate the maximum power dissipation at VTT both conditions (sinking and sourcing current) at VTT must be examined. Although only one equation is added into the total, because VTT cannot source and sink current simultaneously. Calculate sinking with Equation 6. PVTT = VVTT x ILOAD (6) Or calculate sourcing with Equation 7. PVTT = ( VPVIN - VVTT) x ILOAD (7) The power dissipation of the LP2996-N and LP2996A can also be calculated during the shutdown state. During this condition the output (VTT) is tri-stated; Therefore, that term in the power equation disappears as it cannot sink or source any current, and leakage is negligible. The only losses during shutdown are the reduced quiescent current at AVIN and the constant impedance that is seen at the VDDQ pin. PD = PAVIN + PVDDQ where * * 22 PAVIN = IAVIN x VAVIN PVDDQ = VVDDQ x IVDDQ = VVDDQ2 x RVDDQ Submit Documentation Feedback (8) Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A LP2996-N, LP2996A www.ti.com SNOSA40K - NOVEMBER 2002 - REVISED DECEMBER 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: Limiting DDR Termination Regulators' Inrush Current (SNVA758) 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LP2996-N Click here Click here Click here Click here Click here LP2996A Click here Click here Click here Click here Click here 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks E2E is a trademark of Texas Instruments. WEBENCH is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LP2996-N LP2996A Submit Documentation Feedback 23 PACKAGE OPTION ADDENDUM www.ti.com 1-Jul-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LP2996AMR/NOPB ACTIVE SO PowerPAD DDA 8 95 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 LP2996 AMR LP2996AMRE/NOPB ACTIVE SO PowerPAD DDA 8 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 LP2996 AMR LP2996AMRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 LP2996 AMR LP2996LQ/NOPB ACTIVE WQFN NHP 16 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 L00006B LP2996LQX/NOPB ACTIVE WQFN NHP 16 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 L00006B LP2996M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 2996M LP2996M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 2996M NRND SO PowerPAD DDA 8 95 TBD Call TI Call TI 0 to 125 LP2996 ACTIVE SO PowerPAD DDA 8 95 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 LP2996 SO PowerPAD DDA 8 2500 TBD Call TI Call TI 0 to 125 LP2996 ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 LP2996 D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 2996M LP2996MR LP2996MR/NOPB LP2996MRX LP2996MRX/NOPB LP2996MX/NOPB NRND ACTIVE SOIC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Jul-2014 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP2996AMRE/NOPB SO Power PAD DDA 8 250 178.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP2996AMRX/NOPB SO Power PAD DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP2996LQ/NOPB WQFN NHP 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LP2996LQX/NOPB WQFN NHP 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LP2996MRX SO Power PAD DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP2996MRX/NOPB SO Power PAD DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP2996MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP2996AMRE/NOPB SO PowerPAD DDA LP2996AMRX/NOPB SO PowerPAD DDA 8 250 210.0 185.0 35.0 8 2500 367.0 367.0 35.0 LP2996LQ/NOPB WQFN NHP 16 1000 210.0 185.0 35.0 LP2996LQX/NOPB WQFN NHP 16 4500 367.0 367.0 35.0 LP2996MRX SO PowerPAD DDA 8 2500 367.0 367.0 35.0 LP2996MRX/NOPB SO PowerPAD DDA 8 2500 367.0 367.0 35.0 LP2996MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DDA0008A PowerPAD TM SOIC - 1.7 mm max height SCALE 2.400 PLASTIC SMALL OUTLINE C 6.2 TYP 5.8 SEATING PLANE PIN 1 ID AREA A 0.1 C 6X 1.27 8 1 2X 3.81 5.0 4.8 NOTE 3 4 5 B 8X 4.0 3.8 NOTE 4 0.51 0.31 0.25 1.7 MAX C A B 0.25 TYP 0.10 SEE DETAIL A 5 4 EXPOSED THERMAL PAD 0.25 GAGE PLANE 2.34 2.24 8 1 0 -8 0.15 0.00 1.27 0.40 DETAIL A 2.34 2.24 TYPICAL 4218825/A 05/2016 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MS-012. www.ti.com EXAMPLE BOARD LAYOUT DDA0008A PowerPAD TM SOIC - 1.7 mm max height PLASTIC SMALL OUTLINE (2.95) NOTE 9 SOLDER MASK DEFINED PAD (2.34) SOLDER MASK OPENING 8X (1.55) SEE DETAILS 1 8 8X (0.6) SYMM (1.3) TYP (2.34) SOLDER MASK OPENING (4.9) NOTE 9 6X (1.27) 5 4 (R0.05) TYP METAL COVERED BY SOLDER MASK SYMM ( 0.2) TYP VIA (1.3) TYP (5.4) LAND PATTERN EXAMPLE SCALE:10X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4218825/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004). 9. Size of metal pad may vary due to creepage requirement. 10. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN DDA0008A PowerPAD TM SOIC - 1.7 mm max height PLASTIC SMALL OUTLINE (2.34) BASED ON 0.125 THICK STENCIL 8X (1.55) (R0.05) TYP 1 8 8X (0.6) (2.34) BASED ON 0.125 THICK STENCIL SYMM 6X (1.27) 5 4 METAL COVERED BY SOLDER MASK SYMM (5.4) SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:10X STENCIL THICKNESS SOLDER STENCIL OPENING 0.1 0.125 0.150 0.175 2.62 X 2.62 2.34 X 2.34 (SHOWN) 2.14 X 2.14 1.98 X 1.98 4218825/A 05/2016 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. www.ti.com MECHANICAL DATA NHP0016A LQA16A (REV A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LP2996LQ/NOPB LP2996LQX/NOPB LP2996M LP2996M/NOPB LP2996MR LP2996MR/NOPB LP2996MRX LP2996MRX/NOPB LP2996MX/NOPB