MMA6260Q
Rev. 2, 10/2004
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2004. All rights reserved.
±1.5g Dual Axis
Micromachined Accelerometer
The MMA6200 series of low cost capacitive micromachined accelerometers
feature signal conditioning, a 1-pole low pass filter and temperature compen-
sation. Zero-g offset full scale span and filter cut-off are factory set and require
no external devices. A full system self-test capability verifies system function-
ality.
Features
• High Sensitivity
• Low Noise
• Low Power
• 2.7 V to 3.6 V Operation
• 6mm x 6mm x 1.98 mm QFN
• Integral Signal Conditioning with Low Pass Filter
• Linear Output
• Ratiometric Performance
•Self-Test
• Robust Design, High Shocks Survivability
Typical Applications
• Tilt Monitoring
• Position & Motion Sensing
• Freefall Detection
• Impact Monitoring
• Appliance Control
• Vibration Monitoring and Recording
• Smart Portable Electronics
ORDERING INFORMATION
Device Name Bandwidth
Response IDD Case No. Package
MMA6260Q 50 Hz 1.2 mA 1477-01 QFN- 16, Tube
MMA6260QR2 50 Hz 1.2 mA 1477-01 QFN-16,Tape & Reel
MMA6261Q 300 Hz 1.2 mA 1477-01 QFN-16, Tube
MMA6261QR2 300 Hz 1.2 mA 1477-01 QFN-16,Tape & Reel
MMA6262Q 150 Hz 2.2 mA 1477-01 QFN-16,Tube
MMA6262QR2 150 Hz 2.2 mA 1477-01 QFN-16,Tape & Reel
MMA6263Q 900 Hz 2.2 mA 1477-01 QFN-16, Tube
MMA6263QR2 900 Hz 2.2 mA 1477-01 QFN-16,Tape & Reel
MMA6260Q Series: X-Y AXIS SENSITIVITY
MICROMACHINED ACCELEROMETER
±1.5 g
Bottom View
N/C
N/C
VDD
VSS N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
1
2
3
4
16 15 14
12
11
10
9
756 8
ST
XOUT
YOUT
N/C
13
Pin Assignment
MMA6260Q
MMA6261Q
MMA6262Q
MMA6263Q
16 LEAD QFN
CASE 1477-01
Top View
Sensor Device Data
2Freescale Semiconductor
MMA6200 SERIES
Figure 1. Simplified Accelerometer Functional Block Diagram
MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic
discharge.
Although the Freescale Semiconductor accelerome-
ters contain internal 2000 V ESD protection circuitry, ex-
tra precaution must be taken by the user to protect the
chip from ESD. A charge of over 2000 volt s can accumu-
late on the human body or associated test equipment. A
charge of this magnitude
can alter the performance or cause failure of the chip.
When handling the accelerometer, proper ESD precau-
tions should be followed to avoid exposing the device to
discharges which may be detrimental to its performance.
Rating Symbol Value Unit
Maximum Acceleration (all axis) gmax ±2000 g
Supply Voltage VDD -0.3 to +3.6 V
Drop Test1Ddrop 1.2 m
Storage Temperature Range Tstg -40 to +125 °C
Note:
1. Dropped onto concrete surface from any axis.
Y-GAIN
G-CELL
SENSOR X-INTEGRATOR X-GAIN X-FILTER X-TEMP
COMP
SELF-TEST CONTROL LOGIC &
EEPROM TRIM CIRCUITS CLOCK GEN
OSCILLATOR
VDD
XOUT
VSS
ST
Y-INTEGRATOR Y-FILTER Y-TEMP
COMP YOUT
Sensor Device Data
Freescale Semiconductor 3
MMA6200 SERIES
Operating Characteristics
Unless otherwise noted: -20°C < TA < 85°C, 3.0 V < VDD < 3.6 V, Acceleration = 0g, Loaded output1
Characteristic Symbol Min Typ Max Unit
Operatin g Ra ng e 2
Supply Voltage3VDD 2.7 3.3 3.6 V
Supply Current
MMA6260Q, MMA6261Q IDD —1.21.5 mA
MMA6262Q, MMA6263Q IDD —2.23.0 mA
Operating Temperature Range TA-20 — +85 °C
Accelera tion Range gFS —1.5 — g
Output Signal
Zero g (TA = 25°C, VDD = 3.3 V)4 VOFF 1.485 1.65 1.815 V
Zero g VOFF, TA—2.0 —mg/°C
Sensitivity (TA = 25°C, VDD = 3.3 V) S 740 800 860 mV/g
Sensitivity S, TA— 0.015 — %/°C
Bandwidth Response
MMA6260Q f_3dB —50 — Hz
MMA6261Q f_3dB —300 — Hz
MMA6262Q f_3dB —150 — Hz
MMA6263Q f_3dB —900 — Hz
Nonlinearity NLOUT -1.0 — +1.0 % FSO
Noise
MMA6260Q RMS (0.1 Hz – 1 kHz) nRMS —1.8 —mVrms
MMA6261Q RMS (0.1 Hz – 1 kHz) nRMS —3.5 —
MMA6262Q RMS (0.1 Hz – 1 kHz) nRMS —1.3 —
MMA6263Q RMS (0.1 Hz – 1 kHz) nRMS —2.5 —
Power Spectral Density RMS (0.1 Hz – 1 kHz)
MMA6260Q, MMA6261Q nPSD —300 — ug/√Hz
MMA6262Q, MMA6263Q nPSD —200 —
Self-Test
Output Response VST 0.9 VDD —VDD V
Input Low VIL ——
0.3 VDD V
Input High VIH 0.7 VDD —VDD V
Pull-Down Resistance5RPO 43 57 71 kΩ
Response Time6tST —2.0 — ms
Output Stage Perfo rmance
Full-Scale Output Range (IOUT = 200 µA) VFSO VSS +0.25 —VDD -0.25 V
Capacitive Load Drive7CL——100 pF
Output Impedance ZO—50300 Ω
Power-Up Response Time
MMA6260Q tRESPONSE —14 — ms
MMA6261Q tRESPONSE —2.0 — ms
MMA6262Q tRESPONSE —4.0 — ms
MMA6263Q tRESPONSE —0.7 — ms
Mechanical Characteristics
Transverse Sensitivity8VZX, YX, ZY -5.0 — +5.0 % FSO
Notes:
1. For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 kΩ resistor and a 0.1 µF capacitor to ground.
2. These limits define the range of operation for which the part will meet specification.
3. Within the supply range of 2.7 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device
may operate as a linear device but is not guaranteed to be in calibration.
4. The device can measure both + and - acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.
5. The digital input pin has an internal pull-down resistance to prevent inadvertent self-test initiation due to external board level leakages.
6. Time for the output to reach 90% of its final value after a self-test is initiate.
7. Preserves phase margin (60°) to guarantee output amplifier stability.
8. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.
Sensor Device Data
4Freescale Semiconductor
MMA6200 SERIES
PRINCIPLE OF OPERATION
The Freescale Semiconductor acce lerometer is a surface-
micromachined integrated-circuit accelero meter.
The device consists of a surface micromachined capacitive
sensing cell (g-cell) and a signal conditioning ASIC contained in
a single integrated circuit package. The sensing element is
sealed hermetically at the wafer level using a bulk microma-
chined cap wafer.
The g-cell is a mechanical structure formed from semicon-
ductor materials (polysilicon ) using semiconductor processes
(masking and etching). It can be modeled as a set of beams at-
tached to a movable central mass that move between fixed
beams. The movable beams can be deflected from their rest
position by subjecting the system to an acceleration (Figure 2).
As the beams attached to the central mass move, the di s-
tance from them to the fixed beams on one side will increase by
the same amount that the distance to the fixed beams on the
other side decreases. The change in distance is a measure of
acceleration.
The g-cell plates form two back-to-back capacitors
(Figure 2). As the center plate moves with acceleration, the dis-
tance between the plates changes and each capacitor's value
will change, (C = Aε/D). Where A is the area of the plate,
ε is the dielectric constant, and D is the distance between
the plates.
The ASIC uses switched capacitor techniques to measure
the g-cell capacitors and extract the acceleration data from the
difference between the two capacitors. The ASIC also signal
conditions and filters (switched capacitor) the signal, providing
a high level output voltage that is ratiometric and proportional to
acceleration.
Figure 2. Simplified Transducer Physical Model
SPECIAL FEATURES
Filtering
These Freescale Semiconductor accelerometers contain an
onboard single-pole switched capacitor filter. Because the filter
is realized using switched capacitor techniques, there is no re-
quirement for external passive components (resistors and ca-
pacitors) to set the cut-off frequency.
Self-Test
The sensor provides a self-test featu r e allowing the verifica-
tion of the mechanical and electrical integrity of the accelerom-
eter at any time before or after installation. A fourth plate is used
in the g-cell as a self-test plate. When a logic high input to the
self-test pin is applied, a calibrated potential is applied across
the self-test plate and the moveable plate. The resulting electro-
static force (Fe = 1/2AV2/d2) causes the center plate to deflect.
The resultant deflection is measured by the accelerometer's
ASIC and a proportional output voltage results. This procedure
assures both the mechanical (g-cell) and electronic sections of
the accelerometer are functioning.
Freescale Semiconductor accelerometers include fault de-
tection circuitry and a fault latch. Parity of the EEPROM bits be-
comes odd in number.
Self-test is disabled when EEPROM parity error occurs.
Ratiometricity
Ratiometricity simply means the output offset voltage and
sensitivity will scale linearly with applied supply voltage. That is,
as supply voltage is increased, the sensitivity and offset in-
crease linearly; as supply voltage decreases, offset and sensi-
tivity decrease linearly . This is a key feature when interfacing to
a microcontroller or an A/D converter because it provides sys-
tem level cancellation of supply induced errors in the analog to
digital conversion process.
Acceleration
Sensor Device Data
Freescale Semiconductor 5
MMA6200 SERIES
Figure 3. Pinout Description
Figure 4. Accelerometer with Recommended Connection
Diagram
Figure 5. Recommend PCB Layout for Interfacing
Accelerometer to Microcontroller
Notes:
1. Use 0.1 µF capacitor on VDD to decouple the power
source.
2. Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
3. Flag underneath package is connected to ground .
4. Place a ground plane beneath the accelerometer to
reduce noise, the ground pla ne should be attached to all
of the open ended terminals shown in Figure 5.
5. Use an RC filter with 1.0 kΩ and 0.1 µF on the outputs of
the accelerometer to minimize clock noise (from the
switched capacitor filter circuit).
6. PCB layout of power and ground should not couple power
supply noise.
7. Accelerometer and microcontroller should not be a high
current path.
8. A/D sampling rate and any external power supply
switching frequency should be selected such that they do
not interfere with the internal accelerome ter sampling
frequency (16 kHz for Low IDD and 52 kH z for Standard
IDD for the sampling frequency). This will prevent aliasing
errors.
Pin No. Pin
Name Description
1, 5 - 7, 13, 16 N/C No internal connection.
Leave unconnected.
14 YOUT Output voltage of the accelerometer. Y
Direction.
15 XOUT Output voltage of the accelerometer. X
Direction.
3V
DD Power supply input.
4V
SS The power supply ground.
2, 8 - 11 N/C Used for factory trim.
Leave unconnected.
12 ST Logic input pin used to initiate
self-test.
BASIC CONNECTIONS
Top View
N/C
N/C
VDD
VSS N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
1
2
3
4
16 15 14
12
11
10
9
756 8
ST
XOUT
YOUT
N/C
13
MMA6260Q
Series
ST
VDD
VSS
0.1 µF
3
4
VDD
0.1 µF
14
0.1 µF
15
12
Logic
Input
XOUT
YOUT
1 kΩ
1 kΩ
P0
A/D IN
VRH
VSS
VDD
ST
YOUT
VSS
VDD
0.1 µF
1 kΩ
0.1 µF
0.1 µF
POWER SUPPLY
0.1 µF
A/D IN
XOUT 0.1 µF
1 kΩ
MICROCONTROLLER
ACCELEROMETER
C
C
C
R
RC
C
Sensor Device Data
6Freescale Semiconductor
MMA6200 SERIES
Direction of Earth's gravity field.*
* When
p
ositioned as shown, the Earth's
g
ravit
y
will result in a
p
ositive 1
g
out
p
ut
Top View
XOUT @ 0g = 1.65V
YOUT @ -1g = 0.85V
XOUT @ -1g = 0.85V
YOUT @ 0g = 1.65V
XOUT @ 0g = 1.65V
YOUT @ +1g = 2.45V
XOUT @ +1g = 2.45V
YOUT @ 0g = 1.65V
DYNAMIC ACCELERATION
STATIC ACCELERATION
16-Pin QFN Package
+X -X
1
2
3
4
56 8
16 15 14 13
12
11
10
9
7
+Y
-Y
Top View
Sensor Device Data
Freescale Semiconductor 7
MMA6200 SERIES
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The fo otpr int for the su rfac e mou nt packag-
es must be th e cor rect size to ensu re pro per s older co n-
nection interface between the board and the package.
With the correct footprint, the packages will self-align
when subjected to a solder reflow process. It is always
recommended to design bo ards with a solde r mask layer
to avoid bridging and shorting between solder pads.
CASE 1477-01
ISSUE O
NOTES:
1.
2.
3.
4.
5.
6.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
THIS DIMENSION APPLIES TO METALLIZED
TERMINAL AND IS MEASURED BETWEEN 0.25MM
AND 0.30MM FROM TERMINAL TIP.
THIS DIMENSION REPRESENTS TERMINAL FULL
BACK FROM PACKAGE EDGE UP TO 0.1MM IS
ACCEPTABLE.
COPLANARITY APPLIES TO THE EXPOSED HEAT
SLUG AS WELL AS THE TERMINAL.
RADIUS ON TERMINAL IS OPTIONAL.
(45˚)
16X
0.1
4
DETAIL M
PIN 1
INDEX AREA
6
B
C
0.15
2X
2X
C0.15
A
6
G
M
M
(0.203)
C
0.1
C0.08
C
SEATING PLANE
5
DETAIL G
VIEW ROTATED 90˚ CLOCKWISE
(1)
(0.5)
(0.102)
1.98+0.1
EXPOSED DIE
ATTACH PAD
13
4
1
16
12X
9
12
85
M
0.1 C
M
0.05 C
A B
16X
0.63
0.43
C
0.1 A B
VIEW M-M
DETAIL M
PIN 1 INDEX
C0.1 A B
16X
0.60
0.40
1
4.24
4.04
4.24
4.04
0.5
3
Pin 1 ID (non metallic)
1 4
12 9
5 8
16 13
Solder areas
0.50
0.55
1.00
4.25
6.0
6.0
Pin 1 ID (non metallic)
1 4
12 9
5 8
16 13
Solder areas
0.50
0.55
1.00
4.25
6.0
6.0
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MMA6260Q
Rev. 2
10/2004
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