IrDA® Data 1.2 Compliant
115.2 Kb/s Infrared Transceiver
HSDL-3200
Technical Data
Features
• Fully Compliant to IrDA
Data 1.2 Low Power
Specifications
• Ultra Small Package
• Minimal Height: 2.5 mm
• 2.7 to 3.6 VCC
• Low Shutdown Current
– 10 nA Typical
• Complete Shutdown
– TXD, RXD, PIN Diode
• Three External Components
• Temperature Performance
Guaranteed, –25˚C to +85˚C
• 25 mA LED Drive Current
• Integrated EMI Shield
• IEC825-1 Class 1 Eye Safe
• Edge Detection Input
– Prevents the LED from
Long Turn-On Time
Applications
• Mobile Telecom
– Cellular Phones
– Pagers
– Smart Phones
• Data Communication
– PDAs
– Portable Printers
• Digital Imaging
– Digital Cameras
– Photo-Imaging Printers
• Electronic Wallet
Description
The HSDL-3200 is a new
generation of low-cost Infrared
(IR) transceiver module from
Agilent Technologies. It features
the smallest footprint in the
industry at 2.5 H x 8.0 W x 3.0 D
mm. The supply voltage can
range from 2.7 V to 3.6 V. The
LED drive current of 25 mA
assures that link distances meet
the IrDA Data 1.2 (low power)
physical layer specification.
The HSDL-3200 meets the link
distance of 20 cm to other low
power devices, and 30 cm to
standard 1 meter IrDA devices.
R1
47 Ω
V
CC
TXD 7
LED
DRIVER
RXD 6
SHUT DOWN 5
RIX PULSE
SHAPER
TXD
8 LEDA
4 AGND
SD
RXD
V
CC
3V
CC
2CX
1 GND
C1
6.8 µF C2
100 nF
SHIELD
2
Recommended Application Circuit Components
Component Recommended Value Note
R1 47 Ω, ±1%, 0.125 Watt
C1 6.8 µF, ±20%, Tantalum 4
C2 100 nF, ±20%, X7R Ceramic
Note:
4. C1 must be placed within 0.7 cm of the HSDL-3200 to obtain optimum noise
immunity.
I/O Pins Configuration Table
Pin Description Symbol Active Note
1 Ground GND
2 Pin Bypass Capacitor CX
3 Supply Voltage VCC
4 Analog Ground AGND
5 Shut Down SD High 1
6 Receiver Data Output RXD Low
7 Transmitter Data Input TXD High
8 LED Anode LEDA
Note:
1. The shutdown pin (SD) must be driven either high or low. Do NOT float the pin.
Transceiver I/O Truth Table
Inputs Outputs
TXD Light Input to Receiver SD LED RXD Notes
High Don’t Care Low On Not Valid
Low High Low Off Low 2, 3
Low Low Low Off High
Don’t Care Don’t Care High Off High
Notes:
2. In-Band IrDA signals and data rates ≤115.2 Kb/s.
3. RXD Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident
intensity.
Caution: The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
3
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance ≤ 50˚C/W.
Parameter Symbol Min. Max. Units Conditions
Storage Temperature TS–40 100 ˚C
Operating Temperature TA–25 85 ˚C
DC LED Current ILED 20 mA
(DC)
Peak LED Current ILED 80 mA ≤ 90 µs Pulse Width,
(PK) ≤25% Duty Cycle
LED Anode Voltage VLEDA –0.5 7 V
Supply Voltage VCC 07V
Input Voltage TXD, SD VI0V
CC +0.5 V
Output Voltage RXD VO–0.5 VCC +0.5 V
Recommended Operating Conditions
Parameter Symbol Min. Max. Units Conditions Notes
Operating Temperature TA–25 85 ˚C
Supply Voltage VCC 2.7 3.6 V
Logic High Voltage VIH 2/3 VCC VCC V
TXD, SD
Logic Low Voltage VIL 0 1/3 VCC V
TXD, SD
Logic High Receiver EIH0.0081 500 mW/cm2For in-band signals. 5
Input Irradiance
Logic Low Receiver EIL0.3 µW/cm2For in-band signals. 5
Input Irradiance
LED Current Pulse ILEDA 25 80 mA Guaranteed at 25˚C
Amplitude
Receiver Signal Rate 2.4 115.2 Kb/s
Ambient Light See “Test Methods”
on page 12 for
details
Note:
5. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤λp ≤900 nm, and the pulse
characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
4
Electrical and Optical Specifications
Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test
conditions can be anywhere in their operating range. All typical values are at 25˚C and 3.0 V unless
otherwise noted.
Parameter Symbol Min. Typ. Max. Units Conditions Note
Receiver
RXD Logic Low VOL 0 0.4 V IOL = 200 µA, For in-band EI 6
Output Voltage
Logic High VOH VCC VCC VI
OH = –200 µA, For in-band
–0.2 EI ≤0.3 µW/cm2
Viewing Angle 2φ1/2 30 ˚
Peak Sensitivity Wavelength λp 880 nm
RXD Pulse Width tpw 1.5 2.5 4.0 µs6
RXD Rise and Fall Times tr, tf 25 100 ns tpw (EI) = 1.6 µs, CL = 10 pF
Receiver Latency Time tL25 50 µs6
Receiver Wake Up Time tW50 100 µs7
Transmitter
Radiant Intensity EIH4 8 28.8 mW/Sr ILEDA = 25 mA, TA = 25˚C,
θ1/2 ≤15˚
Peak Wavelength λp 875 nm
Spectral Line Half Width ∆λ1/2 35 nm
Viewing Angle 2θ1/2 30 60 ˚
Optical Pulse Width tpw 1.5 1.6 2 µs tpw (TXD) = 1.6 µs
Optical Rise and Fall Times tr (EI) 600 ns tpw (TXD) = 1.6 µs
tf (EI)
Maximum Optical tpw 20 50 µs TXD pin stuck high
Pulse Width (max)
LED Anode On State VON 1.6 V ILEDA = 25 mA,
Voltage (LEDA) VIH (TXD) = 2.7 V
LED Anode Off State ILK 0.01 1.0 µAV
LEDA = VCC = 3.6 V,
Leakage (LEDA) VI (TXD) ≤ 1/3 VCC
Transceiver
TXD and Logic Low IL–1 –0.01 1 µA0 ≤V
I
≤1/3 VCC
SD Input
Current Logic High IH0.01 1 µAV
I
≥2/3 VCC
Supply Current Shutdown ICC1 10 200 nA VCC = 3.6 V, VSD ≥VCC –0.5
Idle ICC2 2.5 4 mA VCC = 3.6 V,
VI (TXD) ≤ 1/3 VCC, EI = 0
Active ICC3 2.6 5 mA VCC = 3.6 V, 8, 9
Receiver VI (TXD) ≤1/3 VCC
Notes:
6. For in-band signals ≤115.2 Kb/s where 8.1 µW/cm2 ≤EI ≤500 mW/cm2.
7. Wake up time is measured from SD pin high to low transition or VCC power on to valid RXD output.
8. Typical value is at EI = 10 mW/cm2.
9. Maximum value is at EI = 500 mW/cm2.
5
Package Outline with Dimensions for Recommended PC Board Pad Layout
Tape and Reel Dimensions
16.4 + 2
0
21 ± 0.8
UNIT: mm
AB
R1.0
∅13.0 ± 0.5
2.0 ± 0.5
2 ± 0.5
LABEL
3.4 ± 0.1
8.4 ± 0.1
8 ± 0.1
4 ± 0.1
1.5 ± 0.1
7.5 ± 0.1 16.0 ± 0.2
1.75 ± 0.1
∅1.5+ 0.1
0
0.4 ± 0.05
2.8 ± 0.1
POLARITY
PIN 8: LEDA
PIN 1: GND
OPTION # DIMENSION A
(± 1 mm) DIMENSION B
(± 2 mm) QUANTITY
(POS/REEL)
0S1
0L1 178
330 60
80 500
2500
EMPTY PARTS MOUNTED LEADER
EMPTY
(40 mm MIN.) (400 mm MIN.)
(40 mm MIN.)
PROGRESSIVE DIRECTION
TAPE DIMENSIONS
0.6
1.25
1.425
2.85
1.35
1.75
0.775
0.475
1.425
2.375
3.325
C
L
MOUNTING
CENTER EXTERNAL
GROUND
MOUNTING
CENTER 4
1.025
SOLDERING PATTERN
UNIT: mm
TOLERANCE: ± 0.2mm
C
L
2.5
4
8
2.05
2.55
EMITTERRECEIVER
0.35
0.65
0.80
C
L
3.325
P0.95X7 = 6.65
0.6
87654321
1
GND 5SD
2CX 6RXD
3VCC 7TXD
4AGND 8LEDA
2.93 1.85
1.05
1.25
1.175
2.2
0.60
1.25
1.75
1.35
0.475 1.425 2.375 3.325
C
L
MOUNTING
CENTER EXTERNAL GROUND
2.05
0.775
UNIT: mm
TOLERANCE ± 0.2 mm
6
Reflow Profile
The reflow profile is a straight
line representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each
with different ∆T/∆time
temperature change rates. The
∆T/∆time rates are detailed in the
above table. The temperatures
are measured at the component
to printed circuit board
connections.
In process zone P1, the PC
board and HSDL-3200
castellation I/O pins are heated to
a temperature of 125˚C to
activate the flux in the solder
paste. The temperature ramp up
rate, R1, is limited to 4˚C per
second to allow for even heating
of both the PC board and
HSDL-3200 castellation I/O pins.
Process zone P2 should be of
sufficient time duration
(> 60 seconds) to dry the solder
paste. The temperature is raised
to a level just below the liquidus
point of the solder, usually 170˚C
(338˚F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230˚C (446˚F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170˚C (338˚F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25˚C (77˚F) should not exceed
3˚C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3200
castellation I/O pins to change
dimensions evenly, putting
minimal stresses on the
HSDL-3200 transceiver.
0
t-TIME (SECONDS)
T – TEMPERATURE – (°C)
200
170
125
100
50
50 150100 200 250 300
150
183
230
P1
HEAT
UP
P2
SOLDER PASTE DRY P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3 R4
R5
90 sec.
MAX.
ABOVE
183°C
MAX. 245°C
PROCESS ZONE SYMBOL ∆T
HEAT UP
SOLDER PASTE DRY
SOLDER REFLOW
COOL DOWN
P1, R1
P2, R2
25°C TO 125°C
125°C TO 170°C
MAXIMUM ∆T/∆TIME
4°C/s
0.5°C/s
P3, R3
P3, R4
P4, R5
170°C TO 230°C (245°C MAX.)
230°C TO 170°C
170°C TO 25°C
4°C/s
-4°C/s
-3°C/s
7
Moisture Proof Packaging
The HSDL-3200 is shipped in
moisture proof packaging. Once
opened, moisture absorption
begins.
Recommended Storage
Conditions
Storage 10˚C to 30˚C
Temperature
Relative below 60%
Humidity
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within 2
days if stored at the
recommended storage conditions.
If times longer than 2 days are
needed, the parts must be stored
in a dry box.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
In Reels 60˚C, t ≥48 hours
100˚C, t ≥ 4 hours
In Bulk 125˚C, T ≥2 hours
150˚C, T ≥1 hour
Baking should only be done once.
Solder Pad, Mask and Metal Stencil
Recommended Land Pattern
METAL STENCIL
FOR SOLDER PASTE
PRINTING
LAND
PATTERN
PCB
STENCIL
APERTURE
SOLDER
MASK
SHIELD SOLDER PAD
a
b
Y
f
d
e
g
Rx LENS
Tx LENS
theta
FIDUCIAL
X
c
8x PAD FIDUCIAL
DIMENSION mm INCHES
a
b
c (PITCH)
d
e
f
g
1.75
0.60
0.95
1.25
2.70
2.20
2.28
0.069
0.024
0.037
0.049
0.106
0.087
0.089
8
Recommended Metal
Solder Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
w, the width of aperture is fixed
at 0.55 mm (0.022 inches).
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land.
Adjacent Land Keepout
and Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
“h” is the minimum solder resist
strip width required to avoid
solder bridging adjacent pads.
It is recommended that two
fiducial crosses be placed at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Recommended Solder
Paste/Cream Volume for
Castellation Joints
Based on calculation and
experiment, the printed solder
paste volume required per
castellation pad is 0.22 cubic
mm (based on either no-clean or
aqueous solder cream types with
typically 60% to 65% solid
content by volume). Using the
recommended stencil will result
in this volume of solder paste.
t, nominal stencil thickness l, length of aperture
mm inches mm inches
0.152 0.006 2.60 ± 0.05 0.102 ± 0.002
0.127 0.005 3.00 ± 0.05 0.118 ± 0.002
h
Y
X
m
k
j
DIMENSION mm INCHES
h
k
j
m
MIN. 0.2
8.2
2.6
3.0
MIN. 0.008
0.323
0.102
0.118
APERTURES AS PER
LAND DIMENSIONS
lw
t
9
Pick and Place
Misalignment Tolerance
and Self-Alignment after
Solder Reflow
If the printed solder paste volume
is adequate, the HSDL-3200
will self-align after solder
reflow. Units should be properly
reflowed in IR/Hot Air convection
oven using the recommended
reflow profile. The direction of
board travel does not matter.
Tolerance for X-Axis
Alignment of Castellation
Misalignment of castellation to
the land pad should not exceed
0.2 mm (0.008 in.), or about one
half the width of the castellation
during placement of the unit. The
castellations will self-align to the
pads during solder reflow.
Tolerance for Rotational
(Theta) Misalignment
Units when mounted should not
be rotated more than ± 3 degrees
with reference to center X-Y as
shown in the recommended land
pattern. Units with rotational
misalignment of more than
± 3 degrees will not completely
self-align after reflow. Units with
less than a ± 3 degree
misalignment will self-align after
solder reflow.
Y-Axis Misalignment of
Castellation
In the Y direction, the
HSDL-3200 does not self-align
after solder reflow. It is
recommended that it be placed in
line with the fiducial mark (mid-
length of land pad). This will
enable sufficient land length
(minimum of 1/2 land length) to
form a good joint. See the
drawing below.
Allowable Misalignment
Direction Tolerance
x ≤0.2 mm
(0.008 inches)
Theta ± 3 degrees
011 Taped in a short
strip (no reel),
10 per strip
001 Taped and 7” Reel
packaging,
500 per reel
021 Taped and 13” Reel
Packaging,
2500 per reel
Marking Information
The unit is marked with the
datecode “YYWW” on the shield.
YY is the year, and WW is the
workweek.
Ordering Information
Specify the part number followed
by an option number.
HSDL-3200 #XXX
There are three options available:
MINIMUM 1/2 THE LENGTH
OF THE LAND PAD
LENS
EDGE
FIDUCIAL
10
Window Design
To insure IrDA compliance, there
are some constraints on the
height and width of the optical
window. The minimum
dimensions ensure that the IrDA
cone angles are met, and there is
no vignetting, and the maximum
dimensions ensure that the
effects of stray light are
minimized. The minimum size
corresponds to a cone angle of
30 degrees, the maximum to a
cone angle of 60 degrees.
The drawing below shows the
module positioned in front of a
window.
X is the width of the window, Y is
the height of the window, and Z is
the distance from the HSDL-3200
to the back of the window.
The distance from the center of
the LED lens to the center of the
photodiode lens is 5.1 mm.
The equations that determine the
size of the window are as follows:
X = 5.1 + 2(Z + D) tan θ
Y = 2(Z + D) tan θ
Where θ is the required half angle
for viewing. For the IrDA
minimum, it is 15 degrees, for the
IrDA maximum it is 30 degrees.
(D is the depth of the LED image
inside the part, 3.17 mm.) These
equations result in the following
tables and graphs:
Minimum and Maximum Window Sizes
Dimensions are in mm.
Depth (Z) Y Min. X Min. Y Max. X Max.
0 1.70 6.80 3.66 8.76
1 2.23 7.33 4.82 9.92
2 2.77 7.87 5.97 11.07
3 3.31 8.41 7.12 12.22
4 3.84 8.94 8.28 13.38
5 4.38 9.48 9.43 14.53
6 4.91 10.01 10.59 15.69
7 5.45 10.55 11.74 16.84
8 5.99 11.09 12.90 18.00
9 6.52 11.62 14.05 19.15
10 7.06 12.16 15.21 20.31
Window Height Y vs. Module Depth Z
Window Width X vs. Module Depth Z
WINDOW WIDTH X – mm
22
MODULE DEPTH Z – mm
12
48
6
8
20
010
16
26
18
14
10
ACCEPTABLE
RANGE
WINDOW HEIGHT Y – mm
16
MODULE DEPTH Z – mm
6
48
0
2
14
010
10
26
12
8
4
ACCEPTABLE
RANGE
Y
X
Z
11
Shape of the Window
From an optics standpoint, the
window should be flat. This
ensures that the window will not
alter either the radiation pattern
of the LED, or the receive pattern
of the photodiode.
If the window must be curved for
mechanical design reasons, place
a curve on the back side of the
window that has the same radius
as the front side. While this will
not completely eliminate the lens
effect of the front curved surface,
it will reduce the effects. The
amount of change in the radiation
pattern is dependent upon the
material chosen for the window,
the radius of the front and back
curves, and the distance from the
back surface to the transceiver.
Once these items are known, a
lens design can be made which
will eliminate the effect of the
front surface curve.
The following drawings show the
effects of a curved window on the
radiation pattern. In all cases, the
center thickness of the window is
1.5 mm, the window is made of
polycarbonate plastic, and the
distance from the transceiver to
the back surface of the window is
3 mm.
Flat Window Curved Front and Back
Curved Front, Flat Back
Test Methods
Background Light and
Electromagnetic Field
There are four ambient
interference conditions in which
the receiver is to operate
correctly. The conditions are to
be applied separately:
1. Electromagnetic field:
3 V/m maximum (please refer
to IEC 801-3, severity level 3
for details).
2. Sunlight:
10 kilolux maximum at the
optical port. This is simulated
with an IR source having a
peak wavelength within the
range of 850 nm to 900 nm
and a spectral width of less
than 50 nm biased to provide
490 µW/cm2 (with no
modulation) at the optical
port. The light source faces the
optical port.
This simulates sunlight within
the IrDA spectral range. The
effect of longer wavelength
radiation is covered by the
incandescent condition.
3. Incandescent Lighting:
1000 lux maximum. This is
produced with general service,
tungsten-filament, gas-filled,
inside frosted lamps in the 60
Watt to 100 Watt range to
generate 1000 lux over the
horizontal surface on which
the equipment under test rests.
The light sources are above the
test area. The source is
expected to have a filament
temperature in the 2700 to
3050 Kelvin range and a
spectral peak in the 850 to
1050 nm range.
4. Fluorescent Lighting:
1000 lux maximum. This is
simulated with an IR source
having a peak wavelength
within the range of 850 nm to
900 nm and a spectral width of
less than 50 nm biased and
modulated to provide an
optical square wave signal
(0 µW/cm2 minimum and
0.3 µW/cm2 peak amplitude
with 10% to 90% rise and fall
times less than or equal to
100 ns) over the horizontal
surface on which the
equipment under test rests.
The light sources are above the
test area. The frequency of the
optical signal is swept over the
frequency range from 20 kHz
to 200 kHz.
Due to the variety of
fluorescent lamps and the
range of IR emissions, this
condition is not expected to
cover all circumstances. It will
provide a common floor for
IrDA operation.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
November 28, 2001
Obsoletes 5980-2915EN (11/00)
5988-5012EN
