L6210 (R) DUAL SCHOTTKY DIODE BRIDGE . .. .. . MONOLITHIC ARRAY OF EIGHT SCHOTTKY DIODES HIGH EFFICIENCY 4A PEAK CURRENT LOW FORWARD VOLTAGE FAST RECOVERY TIME TWO SEPARATED DIODE BRIDGES DESCRIPTION The L6210 is a monolithic IC containing eight Schottky diodes arranged as two separated diode bridges. This diodes connection makes this device versatile in many applications. They are used particular in bipolar stepper motor applications, where high efficient operation, due to low forward voltage drop and fast reverse recovery time, are required. The L6210 is available in a 16 Pin Powerdip Package (12 + 2 + 2) designed for the 0 to 70xC ambient temperature range. ) s ( ct PIN CONNECTION (top view) c u d N DIP16 (Plastic Package)) o s b O - e t le ) s t( o r P ORDERING NUMBER : L6210 u d o r P e t e l o s b O July 2003 1/5 L6210 BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter If Repetitive Forward Current Peak Vr Peak Reverse Voltage (per diode) Tamb Operating Ambient Temperature Tstg Storage Temperature Range 2 Rth j-case Rth j-amb Unit A d o r 50 THERMAL DATA Symbol uc Value ) s t( Parameter Thermal Impedance Junction-case P e let o s b O - Thermal Impedance Junction-ambient without External Heatsink ) s ( ct V 70 o -55 to +150 o C C Value Max. Max. Unit 14 o C/W 65 o C/W ELECTRICAL CHARACTERISTICS (Tj = 25oC unless otherwise specified) Symbol IL o r P e Leakage Current t e l o Note : odes. s b O 2/5 Parameter du Forward Voltage Drop Vf Typ. Max. If = 100 mA Test Conditions 0.65 0.8 if = 500 mA 0.8 1 1 1.2 If = 1 A VR = 40 V, Tamb = 25oC Min. 1 Unit V mA At forward currents of greater than 1A, a parasitic current of approximately 10mA may be collected by adiacent di- L6210 Figure 1 : Reverse Current verus Voltage Figure 2 : Forward Voltage versus Current MOUNTING INSTRUCTIONS o c u d ) s t( The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper area of the printed circuit boards as shown in figure 3 or to an external heatsink (figure 4). During soldering the pin temperature must not exceed 260 C and the soldering time must not be longer then 12s. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 3 : Example of P.C. Board Copper Area which is used as Heatsink Figure 4 : Example of an External Heatsink ) s ( ct e t le o r P o s b O - u d o r P e t e l o s b O 3/5 L6210 mm DIM. MIN. a1 0.51 B 0.85 b TYP. inch MAX. MIN. TYP. 0.020 1.40 0.033 0.055 0.50 b1 MAX. 0.38 0.020 0.50 D 0.015 0.020 20.0 0.787 E 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 F 7.10 0.280 I 5.10 0.201 L 3.30 Z 0.050 ) s ( ct u d o r P e t e l o 4/5 c u d o r Powerdip P 16 e let 0.130 1.27 s b O OUTLINE AND MECHANICAL DATA o s b O - ) s t( L6210 c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5