L6210
July 2003
DUAL SCHOTTKY DIODE BRIDGE
®
.MONOLITHIC ARRAY OF EIGHT SCHOTTKY
DIODES
.HIGH EFFICIEN CY
.4A PEAK CURRENT
.LOW FOR WAR D VOLTAGE
.FAST RECOVERY TIME
.TWO SEPARATED DIODE BRIDGES
DESCRIPTION
The L6210 is a monolithic IC containing eight Schot-
tky diodes arranged as two separated diode
bridges.
T his dio des c onnec ti on mak es t his dev ic e v er s atile
in m any applic at io ns .
They are used particular in bipolar stepper motor ap-
plications, where high efficient operation, due to low
forward voltage drop and fast reverse recovery time,
are required.
The L6210 is available in a 16 Pin Powerdip Pack-
age (12 + 2 + 2) designed for the 0 to 70xC ambient
te mp er atur e ra nge.
N
DIP16
(Plastic Package))
ORDER ING NUMBE R : L6210
PIN CONNECTION (top view)
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BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATIN GS
Symbol Parameter Value Unit
IfRepetitive Forward Current Peak 2 A
VrPeak Reverse Voltage (per diode) 50 V
Tamb Operating Ambient Temperature 70 oC
Tstg Storage Temperature Range –55 to +150 oC
THERMAL DATA
Symbol Parameter Value Unit
Rth j-case Thermal Impedance Junction-case Max. 14 oC/W
Rth j-amb Thermal Impedance Junction-ambient without External Heatsink M ax. 65 oC/W
ELECTRICAL CHARACTERISTICS (Tj = 25oC unles s otherwise spec ified)
Symbol Parameter Test Conditions Min. Typ. Max. Un it
VfForward Voltage Drop If = 100 mA 0.65 0.8
if = 500 mA 0.8 1 V
If = 1 A 1 1.2
ILLeakage Current VR = 40 V, Tamb = 25oC1mA
Note : At forward currents of greater than 1A, a parasitic current of approximately 10mA may be collected by adiacent di-
odes.
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Figure 1 : Reverse Current verus Voltage Figure 2 : Forward Voltage versus Current
T he Rth j-am b o f the L62 10 can be re duced by s ol-
dering the GND pins to suitable copper area of the
printed circuit boards as shown in figure 3 or to an
external heatsink (figure 4). During soldering the pin
temperature must not exceed 260oC and the solder-
ing time must not be longer then 12s. The external
heatsi nk or printed circu it cop per area must be con-
nected to e lec tri ca l gr ound.
Figure 3 : Example of P.C. Board Copper Area
which is used as Heatsink Figure 4 : Example of an External Heatsink
MOUNTING INSTRUCTIONS
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DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.85 1.40 0.033 0.055
b 0.50 0.020
b1 0.38 0.50 0.015 0.020
D 20.0 0.787
E 8.80 0.346
e 2.54 0.100
e3 17.78 0.700
F 7.10 0.280
I 5.10 0.201
L 3.30 0.130
Z 1.27 0.050
Powerdip 16
OUTLINE AND
MECHANICAL DATA
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the conse-
quences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this
publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMi-
croelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroel ectro nics. The ST logo is a r egistered t rademark of S TMicroelec troni cs
© 2003 STMi croelect ronics – P rinted in Italy – All Right s Reser ved
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