®
1/11
Table 1: Main Features
DESCRIPTION
Available either in sensitive (TS12) or standard
(TN12 / TYN) gate triggering levels, the 12A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.
Symbol Value Unit
IT(RMS) 12 A
VDRM/VRRM 600 to 1000 V
IGT 0.2 to 15 mA
TN12, TS12 and TYNx12 Series
12A SCRS
REV. 5October 2005
SENSITIVE & STANDARD
Table 2: Order Codes
Part Numbers Marking
TN1215-x00B TN1215x00
TN1215-x00B-TR TN1215x00
TN1215-x00G TN1215x00G
TN1215-x00G-TR TN1215x00G
TN1215-x00H TN1215x00
TS1220-x00B TS1220x00
TS1220-x00B-TR TS1220x00
TS1220-x00H TS1220x00
TYNx12RG TYNx12
TYNx12TRG TYNx12T
A
A
K
GA
K
G
A
IPAK
(TN12-H / TS12-H)
TO-220AB
(TYNx12RG)
A
K
G
A
K
G
A
A
K
G
A
DPAK
(TN12-B / TS12-B)
D2PAK
(TN12-G)
TN12, TS12 and TYNx12 Series
2/11
Table 3: Absolute Ratings (limiting values)
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
■SENSITIVE
Symbol Parameter
Value
Unit
TN12-G
TYN12
TN12-B/H
TS12-B/H
IT(RMS) RMS on-state current (180° conduction angle) Tc = 105°C 12 A
IT(AV) Average on-state current (180° conduction
angle) Tc = 105°C 8A
ITSM Non repetitive surge peak on-
state current
tp = 8.3 ms
Tj = 25°C 145 115
A
tp = 10 ms 140 110
I²tI
²t Value for fusing tp = 10 ms Tj = 25°C 98 60 A2S
dI/dt Critical rate of rise of on-state
current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125°C 50 A/µs
IGM Peak gate current tp = 20 µs Tj = 125°C 4A
PG(AV) Average gate power dissipation Tj = 125°C 1W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125 °C
VRGM Maximum peak reverse gate voltage (for TN12 & TYN12 only) 5 V
Symbol Test Conditions TS1220 Unit
IGT VD = 12 V RL = 140 ΩMAX. 200 µA
VGT MAX. 0.8 V
VGD VD = VDRM RL = 3.3 kΩ RGK = 1 kΩTj = 125°C MIN. 0.1 V
VRG IRG = 10 µA MIN. 8 V
IHIT = 50 mA RGK = 1 kΩMAX. 5 mA
ILIG = 1 mA RGK = 1 kΩMAX. 6 mA
dV/dt VD = 65 % VDRM RGK = 220 ΩTj = 125°C MIN. 5 V/µs
VTM ITM = 24 A tp = 380 µs Tj = 25°C MAX. 1.6 V
Vt0 Threshold voltage Tj = 125°C MAX. 0.85 V
RdDynamic resistance Tj = 125°C MAX. 30 mΩ
IDRM
IRRM
VDRM = VRRM RGK = 220 Ω
Tj = 25°C
MAX.
5µA
Tj = 125°C 2mA
TN12, TS12 and TYNx12 Series
3/11
■STANDARD
Table 6: Thermal resistance
Symbol Test Conditions TN1215 TYN Unit
B / H G x12T x12
IGT VD = 12 V RL = 33 Ω
MIN. 2 0.5 2 mA
MAX. 15 5 15
VGT MAX. 1.3 V
VGD VD = VDRM RL = 3.3 kΩTj = 125°C MIN. 0.2 V
IH IT = 500 mA Gate open MAX. 40 30 15 30 mA
ILIG = 1.2 IGT MAX. 80 60 30 60 mA
dV/dt VD = 67 % VDRM Gate open Tj =125°C MIN. 200 40 200 V/µs
VTM ITM = 24 A tp = 380 µs Tj = 25°C MAX. 1.6 V
Vt0 Threshold voltage Tj = 125°C MAX. 0.85 V
RdDynamic resistance Tj = 125°C MAX. 30 mΩ
IDRM
IRRM
VDRM = VRRM
Tj = 25°C
MAX. 5µA
Tj = 125°C 2mA
Symbol Parameter Value Unit
Rth(j-c) Junction to case (DC) 1.3 °C/W
Rth(j-a) Junction to ambient (DC)
S = 0.5 cm²DPAK 70
°C/W
S = 1 cm²D2PAK 45
IPAK 100
TO-220AB 60
S = Copper surface under tab.
Figure 1: Maximum average power dissipation
versus average on-state current
Figure 2: Average and D.C. on-state current
versus case temperature
0123456789
0
1
2
3
4
5
6
7
8
9
10
11
12
P(W)
I (A)
T(AV)
α= 180°
360°
α
0 25 50 75 100 125
0
2
4
6
8
10
12
14
I (A)
T(AV)
T (°C)
case
α= 180°
D.C.
TN12, TS12 and TYNx12 Series
4/11
Figure 3: Average and D.C. on-state current
versus ambient temperature (device mounted
on FR4 with recommended pad layout) (DPAK)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration
Figure 5: Relative variation of thermal
impedance junction to ambient versus pulse
duration (recommended pad layout, FR4 PC
board for DPAK)
Figure 6: Relative variation of gate trigger
current and holding current versus junction
temperature for TS8 series
Figure 7: Relative variation of gate trigger
current and holding current versus junction
temperature for TN8 & TYN08 series
Figure 8: Relative variation of holding current
versus gate-cathode resistance (typical
values) for TS8 series
0 25 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I (A)
T(AV)
T (°C)
amb
α= 180°
D.C.
DPAK
2
DPAK
1E-3 1E-2 1E-1 1E+0
0.1
0.2
0.5
1.0
K=[Z /R
th(j-c) th(j-c)
]
t (s)
p
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.01
0.10
1.00
K=[Z /R
th(j-a) th(j-a)
]
t (s)
p
DPAK
TO-220AB / IPAK
DPAK
2
-40 -20 0 20 40 60 80 100 120 140
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
T (°C)
j
I,I,I[T] /
GT H L j
I ,I ,I [T =25°C]
GT H L j
IGT
IH& I
R= 1k
L
GK Ω
-40 -20 0 20 40 60 80 100 120 140
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
I,I,I[T] /
GT H L j I ,I ,I [T =25°C]
GT H L j
T (°C)
j
IGT
IH& IL
1E-2 1E-1 1E+0 1E+1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R(k)
GK Ω
I [R ] / I [ =1k ]
HGK H ΩRGK
Tj= 25°C
TN12, TS12 and TYNx12 Series
5/11
Figure 9: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical
values) for TS8 series
Figure 10: Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical
values) for TS8 series
Figure 11: Surge peak on-state current versus
number of cycles
Figure 12: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of I²t
Figure 13: On-state characteristics (maximum
values)
Figure 14: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy printed circuit board FR4, copper
thickness: 35µm) (DPAK and D2PAK)
0 200 400 600 800 1000 1200
0.1
1.0
10.0
R(k)
GK Ω
dV/dt[R ] / dV/dt[ =220 ]
GK Ω
RGK
Tj= 125°C
V = 0.67 x V
D DRM
0 25 50 75 100 125 150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
C (nF)
GK
dV/dt[C ] / dV/dt[ =220 ]
GK
ΩR
GK
T
V = 0.67 x V
= 125°C
R = 220
D DRM
GK
j
Ω
1 10 100 1000
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
I (A)
TSM
Number of cycles
Non repetitive
T initial=25°C
j
Repetitive
T =105°C
C
TS12
TN12 / TYN12 t =10ms
p
One cycle
0.01 0.10 1.00 10.00
10
100
1000
2000
I (A), I t (A s)
TSM 22
t (ms)
p
I t
2
ITSM
T initial = 25°C
j
TS12
TS12
TN12 / TYN12
TN12 / TYN12
dI/dt limitation
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1
10
100
200
I (A)
TM
V (V)
TM
Tj=max
T =25°C
j
V =0.85V
R =30m
T max.:
j
t0
dΩ
0 2 4 6 8 10 12 14 16 18 20
0
20
40
60
80
100
S(cm²)
R (°C/W)
th(j-a)
DPAK
DPAK
2
TN12, TS12 and TYNx12 Series
6/11
Figure 15: Ordering Information Scheme (TN8 series)
Figure 16: Ordering Information Scheme (TS8 series)
Figure 17: Ordering Information Scheme (TYN08 series)
TN 12 15 - 600 B (-TR)
Standard SCR series
Sensitivity
Voltage
Package
Packing mode
Current
12 = 12A
D PAK)
15 = 15mA
600 = 600V
800 = 800V
1000 = 1000V
B = DPAK
G = D PAK
H = IPAK
Blanck = Tube
-TR = Tape & Reel (DPAK and
2
2
TS 12 20 - 600 B (-TR)
Sensitive SCR series
Sensitivity
Voltage
Package
Packing mode
Current
12 = 12A
20 = 200µA
600 = 600V
700 = 700V
B = DPAK
H = IPAK
Blanck = Tube
-TR = Tape & Reel
TYN 6 12 T RG
Standard SCR series
Packing mode
Voltage
Current
Sensitivity
6 = 600V
8 = 800V
10 = 100V
12 = 12A
Blanck = 30mA
T = 15mA
RG = Tube
TN12, TS12 and TYNx12 Series
7/11
Table 7: Product Selector
Figure 18: DPAK Package Mechanical Data
Figure 19: DPAK Foot Print Dimensions
(in millimeters)
Part Numbers Voltage (xxx) Sensitivity Package
600 V 700 V 800 V 1000 V
TN1215-xxxB X X 15 mA DPAK
TN1215-xxxG X X X 15 mA D2PAK
TN1215-xxxH X X 15 mA IPAK
TS1220-xxxB X X 0.2 mA DPAK
TS1220-xxxH X X 0.2 mA IPAK
TYNx12 X X X 15 mA TO-220AB
TYNx12T X X X 5 mA TO-220AB
H
L4
G
B
L2
E
B2
D
A1
R
R
C
A
C2
0.60 MIN.
V2
A2
6.7
6.7 3 3 1.6
1.6
2.3
2.3
REF.
DIMENSIONS
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
TN12, TS12 and TYNx12 Series
8/11
Figure 20: D2PAK Package Mechanical Data
Figure 21: D2PAK Foot Print Dimensions
(in millimeters)
G
L
L3
L2
B
B2
E
2mm min.
FLAT ZONE
A
C2
D
R
A2
V2
C
A1
16.90
10.30
8.90 3.70
5.08
1.30
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0° 8° 0° 8°
TN12, TS12 and TYNx12 Series
9/11
Figure 22: IPAK Package Mechanical Data
Figure 23: TO-220AB Package Mechanical Data
H
LL1
G
eB5
B
V1
D
C
A1
A3
A
C2
B3
L2
E
B2
C
b2
c2
F
Ø I
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A3 0.70 1.30 0.027 0.051
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
B3 0.95 0.037
B5 0.30 0.035
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.019 0.023
D 6 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
e 2.28 0.090
G 4.40 4.60 0.173 0.181
H 16.10 0.634
L 9 9.40 0.354 0.370
L1 0.8 1.20 0.031 0.047
L2 0.80 1 0.031 0.039
V1 10° 10°
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
TN12, TS12 and TYNx12 Series
10/11
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type Marking Package Weight Base qty Delivery mode
TN1215-x00B TN1215x00 DPAK 0.3 g 75 Tube
TN1215-x00B-TR TN1215x00 DPAK 0.3 g 2500 Tape & reel
TN1215-x00G TN1215x00G D2PAK 1.5 g 50 Tube
TN1215-x00G-TR TN1215x00G D2PAK 1.5 g 1000 Tape & reel
TN1215-x00H TN1215x00 IPAK 0.3 g 75 Tube
TS1220-x00B TS1220x00 DPAK 0.3 g 75 Tube
TS1220-x00B-TR TS1220x00 DPAK 0.3 g 2500 Tape & reel
TS1220-x00H TS1220x00 IPAK 0.3 g 75 Tube
TYNx12RG TYNx12 TO-220AB 2.3 g 50 Tube
TYNx12TRG TYNx12T TO-220AB 2.3 g 50 Tube
Note: x = voltage
Table 9: Revision History
Date Revision Description of Changes
Sep-2000 3 Last update.
25-Mar-2005 4 TO-220AB delivery mode changed from bulk to tube.
14-Oct-2005 5
Changed sensitivity values in Table 7 for TYNx12 (30 to
15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK
statement
TN12, TS12 and TYNx12 Series
11/11
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
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