SPA2000-0.015-AC-98 - Bergquist Company

www.bergquistcompany.com

All statements, technical information and recommendations herein are based on tests we believe to be reliable, and

THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING THE IMPLIED

WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE.Sellers’ and manufacturer s’ only obligation shall be to

replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product

for its intended use, and the user assumes all r isks and liability whatsoever in connection therewith. NEITHER SELLER NOR

MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE,DIRECT,

INCIDENTAL, OR CONSEQUENTIAL,INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR

THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not

contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.

PDS_SP_A2000_12.08

The Bergquist Company -

North American Headquarters

18930 West 78th Street

Chanhassen, MN 55317

Phone: 800-347-4572

Fax: 952-835-0430

The Bergquist Company -

European Headquarters

Bramenber g 9a, 3755 BT Eemnes

Netherlands

Phone: 31-35-5380684

Fax: 31-35-5380295

The Bergquist Company - Asia

Room 15,8/F W ah Wai Industrial Centre

No.38-40,Au Pui Wan Street

Fotan, Shatin, N.T. Hong Kong

Ph: 852.2690.9296

Fax: 852.2690.2344

Sil-Pad

A2000

Higher Performance, High Reliability Insulator

Features and Benefits

• Thermal impedance:

0.32°C-in2/W (@50 psi)

• Optimal heat tr ansfer

• High thermal conductivity: 3.0 W/m-K

Sil-Pad A2000 is a confor mable elastomer

with very high ther mal conductivity that acts

as a ther mal interface between electrical

components and heat sinks. Sil-Pad A2000 is

for applications where optimal heat transfer is

a requirement.

This thermally conductive silicone elastomer is

formulated to maximize the thermal and

dielectr ic performance of the filler/binder

matr ix.The result is a grease-free , con-

fo rmab le material capable of meeting or

exceeding the ther mal and electrical require-

ments of high reliability electronic packaging

applications.

Typical Applications Include:

• Motor drive controls

• A vionics

• High-voltage power supplies

• Power transistor / heat sink interface

Configurations Available:

• Sheet form, die-cut parts and roll for m

• With or without pressure sensitive adhesive

Building a Part Number Standard Options

Sil-Pad®: U.S.Patents 4,574,879;4,602,125; 4,602,678;4,685,987; 4,842,911 and others

Section A

Section B

Section C

Section D

Section E

NA = Selected standard option. If not selecting a standard

option, insert company name, drawing number, and

revision level.

SPA2000 = Sil-Pad A2000 Material

SPA2000 0.015 00 1012 NA

Note: To build a part number, visit our website at www.bergquistcompany.com.

Standard thicknesses available: 0.015", 0.020"

AC = Adhesive, one side

00 = No adhesive

_ _ _ = Standard configuration dash number,

1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or

00 = custom configuration

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TYPICAL PROPERTIES OF SIL-PAD A2000

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD

Color White White Visual

Reinforcement Carr ier Fiberglass Fiberglass —

Thickness (inch) / (mm) 0.015 to 0.020 0.381 to 0.508 ASTM D374

Hardness (Shore A) 90 90 ASTM D2240

Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269

Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —

ELECTRICAL

Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149

Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150

Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257

Flame Rating V-O V-O U.L.94

THERMAL

Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470

THERMAL PERFORMANCE vs PRESSURE

Pressure (psi) 10 25 50 100 200

TO-220 Ther mal Performance (°C/W) 0.015" 2.05 1.94 1.86 1.79 1.72

Thermal Impedance (°C-in2/W) 0.015" (1) 0.53 0.40 0.32 0.28 0.26

1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance .These values are provided for

reference only.Actual application perfor mance is directly related to the surface roughness, flatness and pressure applied.