LM49450
LM49450 I2S Input, 2.5W/Channel, Low EMI, Stereo, Class D Audio Sub-System
withGround Referenced Headphone Amplifier, 3D Enhancement, and Headphone
Sense
Literature Number: SNAS440C
LM49450August 4, 2011
I2S Input, 2.5W/Channel, Low EMI, Stereo, Class D Audio
Sub-System with Ground Referenced Headphone
Amplifier, 3D Enhancement, and Headphone Sense
General Description
The LM49450 is a fully integrated audio subsystem designed
for portable media player applications. The LM49450 com-
bines a 24-bit I2S digital-to-analog converter (DAC), 2.5W/
channel stereo Class D speaker drivers, 36mW stereo ground
referenced headphone drivers, volume control, and
National’s unique 3D sound enhancement into a single de-
vice.
The filterless Class D amplifiers deliver 1.25W/channel into
an 8 load with <1% THD+N with a 5V supply. The LM49450
offers two logic selectable modulation schemes, fixed fre-
quency mode, and an EMI reducing spread spectrum mode.
The 36mW/channel headphone drivers feature National’s
ground referenced architecture that creates a ground-refer-
enced output from a single supply, eliminating the need for
bulky and expensive DC-blocking capacitors, saving space
and minimizing system cost. A headphone sense input (HPS)
automatically detects the presence of a headphone, and con-
figures the device accordingly.
The LM49450 stereo, 24-bit DAC supports a wide range of
sample rates (including 192kHz, 96kHz, 48kHz, and
44.1kHz). The digital audio signal path features better than
100dB SNR, and low 0.05% THD+N when measured at the
headphone outputs. The flexible 3-wire I2S interface supports
left or right justified audio data.
The LM49450 features separate 32-step volume control for
the headphones and speaker outputs. 3D enhancement,
mode selection, shutdown control, and volume are controlled
through an I2C compatible interface.
Output short circuit and thermal overload protection prevent
the device from being damaged during fault conditions. Su-
perior click and pop suppression eliminates audible transients
on power-up/down and during shutdown. The LM49450 is
available in a space saving 32-pin LLP package.
Key Specifications
■ SNR at Headphone Output 102dBA (typ)
■ Speaker Amplifier Efficiency
at 3.6V, 650mW/channel into 887% (typ)
■ Speaker Amplifier Efficiency
at 5V, 1.1W/channel into 880% (typ)
■ Quiescent Power Supply Current
Line Inputs:
Speaker Mode at LSVDD = 3.6V 7.5mA (typ)
Headphone Mode at HPVDD = 2.5V 5.3mA (typ)
■ Output Power/Channel
Speaker at LSVDD = 5V:
RL = 4Ω, THD+N 10% 2.5W (typ)
RL = 8Ω, THD+N 1% 1.25W (typ)
Headphone at HPVDD = 2.5V:
RL = 16Ω, THD+N 1% 34mW (typ)
RL = 32Ω, THD+N 1% 36mW (typ)
■ PSRR at 1kHz
Speaker Mode
Headphone Mode
67dB ( typ)
77dB (typ)
■ Shutdown current 0.02μA (typ)
Features
24–Bit Stereo DAC
Stereo Filterless Class D Operation
Selectable spread spectrum mode reduces EMI
Ground Referenced Headphone Amplifiers with 100dB
SNR
I2S Compatible Audio Interface
Audio Sample Rates up to 192kHz
National’s 3D Enhancement
32-step Digital Volume Control
I2C Compatible Control Interface
Headphone Sense Input
Stereo Analog Line Inputs
Output Short Circuit Protection
Thermal Overload Protection
Minimum external components
Click and Pop suppression
Micro-power shutdown
Available in space-saving 32 pin LLP package
Applications
Portable Media Players
Portable Navigation Devices
Multi-Media Monitors
Laptops
Portable Gaming Devices
Mobile Handsets
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2011 National Semiconductor Corporation 300455 www.national.com
LM49450 I2S Input, 2.5W/Channel, Low EMI, Stereo, Class D Audio Sub-System with Ground
Referenced Headphone Amplifier, 3D Enhancement, and Headphone Sense
Typical Application
300455a8
FIGURE 1. Typical Audio Amplifier Application Circuit
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LM49450
Connection Diagrams
SQ Package
5mm x 5mm x 0.8mm
300455a7
Top View
Order Number LM49450SQ
See NS Package Number SQA32A
SQ Marking
5mm x 5mm x 0.8mm
30045533
Top View
NS - NS Logo
U - Wafer Fab Code
Z - Assembly Plant
XY - 2 Digit Date Code
TT - Lot Traceability
L49450 - LM49450SQ
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LM49450
Absolute Maximum Ratings (Note 1, Note
2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 1) 6.0V
Storage Temperature −65°C to +150°C
Input Voltage –0.3V to VDD +0.3V
Power Dissipation (Note 3) Internally Limited
ESD Susceptibility(Note 4) 2000V
ESD Susceptibility (Note 5) 200V
Junction Temperature (TJMAX)150°C
Thermal Resistance
 θJC 2.4°C/W
 θJA 28.4°C/W
Operating Ratings (Note 1, Note 2)
Temperature Range
TMIN TA TMAX −40°C TA +85°C
Supply Voltage
(VDD, LSVDD)2.7V VDD 5.5V
Headphone Supply Voltage
(CPVDD, HPVDD)1.8V VDD 2.7V
Digital Core Supply Voltage
(DVDD)2.7V DVDD 4.5V
Digital IO Supply Voltage
(IOVDD)1.8V IOVDD 4.5V
Electrical Characteristics VDD = LSVDD = 3.6V, HPVDD = CPVDD = 2.5V (Note 2,
Note 8)The following specifications apply for Headphone: AV = 0dB, RL(LS) = 8Ω, RL(HP) = 32Ω, f = 1kHz, C1 = C2 = 2.2μF, unless
otherwise specified. Limits apply for TA = 25°C.
Symbol Parameter Conditions
LM49450 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
DIDD Digital Core Supply Current DVDD = 2.7V, fS = 48kHz,
fMCLK = 12.28MHz 9 11.2 mA (max)
ISD Shutdown Supply Current Digital Current
Analog Current
0.03
0.02
1
1
μA (max)
μA (max)
SPEAKER AMPLIFIERS (Headphone Amplifiers Disabled, HPS = 0)
IDDLS Analog Supply Current fS = 48kHz, DAC Active, No Load
Line Inputs Active, No Load
9.8
7
13
10
mA (max)
mA (max)
VOS Output Offset Voltage DAC Active
Line Inputs Active
8
8
45 mV (max)
mV (max)
POUT Output Power
RL = 4Ω, f = 1kHz
THD+N = 1%
THD+N = 10%
1
1.2
W
W
RL = 8Ω, f = 1kHz
THD+N = 1%
THD+N = 10%
625
725
525 mW (min)
W
THD+N Total Harmonic Distortion
PO = 300mW, f = 1kHz, RL = 8Ω
DAC Active 0.06 %
Line Inputs Active 0.07 %
PSRR Power Supply Rejection Ratio
VRIPPLE = 200mVP-P, f = 1kHz
DAC Active, Internal Reference 59 45 dB (min)
DAC Active, External Reference 62 dB
Line Inputs Active 67 dB
ηEfficiency PO = 650, f = 1kHz
RL = 8Ω 87 %
Xtalk Crosstalk
PO = 500mW, f = 1kHz, RL = 8Ω
DAC Active,
Line Inputs Active
81
77 dB
dB
PO = 500mW, f = 10kHz, RL = 8Ω
DAC Active,
Line Inputs Active
60
60 dB
dB
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LM49450
Symbol Parameter Conditions
LM49450 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
SNR Signal to Noise Ratio
PO = 500mW, f = 1kHz, A-weighted
DAC Active, Internal Reference 89 dB
DAC Active, External Reference 92 dB
Line Inputs Active 90 dB
AVDigitally Controlled Gain Level
Maximum Gain Setting, Line Inputs
Active 23.6 22.5
24.1
dB (min)
dB (max)
Minimum Gain Setting, Line Inputs
Active –48 –49
–46
dB (min)
dB (max)
Mute Mute Attenuation Line Inputs Active –91 dB
ΔACH-CH
Channel-to-Channel Gain
Matching
0.3 dB
εOS Output Noise
Input Referred, A-weighted
DAC Active, Internal Reference 43.5 μV
DAC Active, External Reference 45.4 μV
Line Inputs Active 40 μV
tON Turn-On Time 27 ms
tOFF Turn-Off Time 1 ms
HEADPHONE AMPLIFIERS (Speaker Amplifiers Disabled, HPS = 1)
IDDHP Analog Supply Current fS = 48kHz, DAC active
Line Inputs Active
7.2
5.3
8.25
6.5
mA (max)
mA (max)
VOS Output Offset Voltage DAC active, AV = –6dB
Line Inputs Active, , AV = –6dB
7
530 mV
mV (max)
POOutput Power
RL = 16Ω, f = 1kHz
THD+N = 1%, Single Channel 66 mW
THD+N = 1%, Two Channels in
Phase 34 mW
RL = 32Ω, f = 1kHz
THD+N = 1%, Single Channel 49 42 mW (min)
THD+N = 1%, Two Channels in
Phase 36 27 mW (min)
THD+N Total Harmonic Distortion
f = 1kHz, DAC Active
RL = 16Ω, PO = 5mW 0.05 %
RL = 32Ω, PO = 5mW 0.03 %
PSRR Power Supply Rejection Ratio
VRIPPLE = 200mVP-P, f = 1kHz
DAC Active, Internal Reference 71.2 56 dB (min)
DAC Active, External Reference 71.3 dB
Line Inputs Active 76.9 dB
Xtalk Crosstalk
PO = 5mW, f = 1kHz, RL = 32Ω
DAC Active,
Line Inputs Active
82
79 dB
dB
PO = 5mW, f = 10kHz, RL = 32Ω
DAC Active,
Line Inputs Active
78
76 dB
dB
SNR Signal to Noise Ratio
PO = 5mW, f = 1kHz, A-weighted
DAC Active, Internal Reference 99 dB
DAC Active, External Reference 102 dB
Line Inputs Active 98 dB
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LM49450
Symbol Parameter Conditions
LM49450 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
AVDigitally Controlled Gain Level
Maximum Gain Setting, Line Inputs
Active 17.8 17.0
18.5
dB (min)
dB (max)
Minimum Gain Setting, Line Inputs
Active –53.8 –56
–52
dB (min)
dB (max)
Mute Mute Attenuation Line Inputs Active –102 dB
ΔACH-CH
Channel-to-Channel Gain
Matching 0.3 dB
εOS Output Noise
Input Referred, A-weighted
DAC Active, Internal Reference 10 μV
DAC Active, External Reference 10 μV
Line Inputs Active 10 μV
VOUT_FS
Full-Scale Headphone Amplifier
Output Voltage RL = No Load 942 850 mVRMS
(min)
tON Turn-On Time 27 ms
tOFF Turn-Off Time 1 ms
HEADPHONE SENSE INPUT (HPS)
VIH Input High Voltage 1 V
VIL Input Low Voltage 0.6 V
DIGITAL INTERFACE
VIH Input High Voltage 2.8 V (min)
VIL Input Low Voltage 0.8 V (max)
VOH Output High Voltage 2 V (min)
VOL Output Low Voltage 1 V (max)
Electrical Characteristics VDD = LSVDD = 5.0V (Note 2, Note 8)The following specifications apply
for Headphone: AV = 0dB, RL(LS) = 8Ω, RL(HP) = 32Ω, f = 1kHz, unless otherwise specified. Limits apply for TA = 25°C.
Symbol Parameter Conditions
LM49450 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
SPEAKER AMPLIFIERS (Headphone Amplifiers Disabled, HPS = 0)
IDDLS Analog Supply Current fS = 48kHz, DAC Active
Line Inputs Active
14
10.4
18
16
mA (max)
mA (max)
VOS Output Offset Voltage DAC Voltage
AV = 0dB, Line Inputs Active
15
12
50
48
mV (max)
mV (max)
POUT Output Power
RL = 4Ω, f = 1kHz
THD+N = 1%
THD+N = 10%
1.9
2.5
W
W
RL = 8Ω, f = 1kHz
THD+N = 1%
THD+N = 10%
1.25
1.54
mW (min)
W
THD+N Total Harmonic Distortion
PO = 635mW, f = 1kHz, RL = 8Ω
DAC Active 0.06 %
Line Inputs Active 0.04 %
PSRR Power Supply Rejection Ratio
VRIPPLE = 200mVP-P, f = 1kHz
DAC Active, Internal Reference 60 dB
DAC Active, External Reference 60 dB
Line Inputs Active 70 dB
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LM49450
Symbol Parameter Conditions
LM49450 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
ηEfficiency PO = TBDmW, f = 1kHz
RL = 8Ω 80 %
Xtalk Crosstalk
PO = 500mW, f = 1kHz, RL = 8Ω
DAC Active,
Line Inputs Active
74
79 dB
dB
PO = 500mW, f = 10kHz, RL = 8Ω
DAC Active,
Line Inputs Active
60
60 dB
dB
SNR Signal to Noise Ratio
PO = 500mW, f = 1kHz, A-weighted
DAC Active, Internal Reference 88 dB
DAC Active, External Reference 89 dB
Line Inputs Active 98 dB
AVDigitally Controlled Gain Level
Maximum Gain Setting, Line Inputs
Active 24.2 22.5
24.2
dB (min)
dB (max)
Minimum Gain Setting, Line Inputs
Active –48 –49
–46
dB (min)
dB (max)
Mute Mute Attenuation Line Inputs Active –92 dB
ΔACH-CH
Channel-to-Channel Gain
Matching
0.3 dB
εOS Output Noise
Input Referred, A-weighted
DAC Active, Internal Reference 60 μV
DAC Active, External Reference 85 μV
Line Inputs Active 40 μV
tON Turn-On Time 27 ms
tOFF Turn-Off Time 1 ms
Timing Characteristics (Note 2, Note 8)The following specifications apply for Headphone: AV = 0dB, RL(LS) =
8Ω, RL(HP) = 32Ω, f = 1kHz, unless otherwise specified. Limits apply for TA = 25°C.
Symbol Parameter Conditions
LM49450 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
AUDIO INTERFACE TIMING
tMCLKL MCLK Pulse Width Low 16 ns (min)
tMCLKH MCLK Pulse Width High 16 ns (min)
tMCLKY MCLK Period 32 ns (min)
tBCLKR BCLK Rise Time 3ns (max)
tBCLKCF BCLK Fall Time 3 ns (max)
tBCLKDS BCLK Duty Cycle 50 %
tDL
LRC Propagation Delay from
BCLK falling edge 10 ns (max)
tDST
DATA Setup Time to BCLK Rising
Edge
10 ns (min)
tDHT
DATA Hold Time from BCLK
Rising Edge
10 ns (min)
CONTROL INTERFACE TIMING
SCLK Frequency 400 kHz (max)
1Hold Time (repeated START
Condition)
0.6 μs (min)
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LM49450
Symbol Parameter Conditions
LM49450 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
2Clock Low Time 1.3 μs (min)
3 Clock High Time 600 ns (min)
4Setup Time for a Repeated
START Condition
600 ns (min)
5
Data Hold Time Output 300 ns (min)
Input 0
900
ns (min)
ns (max)
6 Data Setup Time 100 ns (min)
7 Rise Time of SDA and SCL 20+0.1CB
300
ns (min)
ns (max)
8Fall Time of SDA and SCL 15+0.1CB
300
ns (min)
ns (max)
9 Setup Time for STOP Condition 600 ns (min)
10 Bus Free time Between a STOP
and START Condition
1.3 μs ( min)
CB
Bus Capacitance 10
200
pF (min)
pF (max)
Note 1: Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified
Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX , θJA, and the ambient temperature, TA. The maximum
allowable power dissipation is PDMAX = (TJMAX – TA) / θJA or the number given in Absolute Maximum Ratings, whichever is lower.
Note 4: Human body model, applicable std. JESD22-A114C.
Note 5: Machine model, applicable std. JESD22-A115-A.
Note 6: Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed.
Note 7: Datasheet min/max specification limits are guaranteed by test or statistical analysis.
Note 8: RL is a resistive load in series with two inductors to simulate an actual speaker load. For RL = 8Ω, the load is 15µH + 8Ω +15µH. For RL = 4Ω, the load
is 15µH + 4Ω + 15µH.
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LM49450
Pin Descriptions
TABLE 1.
Pin Name Description
1 C1P Charge Pump Flying Capacitor Positive Terminal
2 CPGND Charge Pump Ground
3 SDA I2C Serial Data Input
4 DGND Digital Ground
5 I2S_WS I2S Word Select Input
6 I2S_SDI I2S Serial Data Input
7 I2S_CLK I2S Clock Input
8 MCLK Master Clock
9 SCL I2C Clock Input
10 DVDD Digital Core Power Supply
11 IOVDD Digital Interface Power Supply
12 GND Analog Ground
13 REF DAC Reference Bypass
14 INR Right Channel Analog Input
15 INL Left Channel Analog Input
16 VDD Analog Power Supply
17 BYPASS Mid-Rail Bias Bypass
18, 24 LSVDD Speaker Power Supply
19 LLS+ Left Channel Non-Inverting Speaker Output
20 LLS- Left Channel Inverting Speaker Output
21 LSGND Speaker Ground
22 RLS- Right Channel Inverting Speaker Output
23 RLS+ Right Channel Non-Inverting Speaker Output
25 HPGND Headphone Amplifier Ground
26 HPS Headphone Sense Input
27 HPR Right Channel Headphone Amplifier Output
28 HPVDD Headphone Amplifier Power Supply
29 HPL Left Channel Headphone Amplifier Output
30 HPVSS Charge Pump Output and Headphone Amplifier Negative Power Supply.
31 C1N Charge Pump Flying Capacitor Negative Terminal
32 CPVDD Charge Pump Power Supply
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LM49450
Typical Performance Characteristics
THD+N vs Frequency
VDD = 3.0V, POUT = 50mW, RL = 4Ω
DAC Input, Internal Reference, Speaker Mode
300455b6
THD+N vs Frequency
VDD = 3.0V, POUT = 150mW, RL = 8Ω
DAC Input, Internal Reference, Speaker Mode
300455b9
THD+N vs Frequency
VDD = 3.0V, POUT = 50mW, RL = 4Ω
DAC Input, External Reference, Speaker Mode
300455c4
THD+N vs Frequency
VDD = 3.0V, POUT = 150mW, RL = 8Ω
DAC Input, External Reference, Speaker Mode
300455c7
THD+N vs Frequency
VDD = 3.0V, POUT = 100mW, RL = 4Ω
Analog Input, Speaker Mode
300455d2
THD+N vs Frequency
VDD = 3.0V, POUT = 80mW, RL = 8Ω
Analog Input, Speaker Mode
300455d5
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LM49450
THD+N vs Frequency
VDD = 3.6V, POUT = 100mW, RL = 4Ω
DAC Input, Internal Reference, Speaker Mode
300455b7
THD+N vs Frequency
VDD = 3.6V, POUT = 100mW, RL = 4Ω
DAC Input, External Reference, Speaker Mode
300455c5
THD+N vs Frequency
VDD = 3.6V, POUT = 100mW, RL = 8Ω
Analog Input, Speaker Mode
300455d6
THD+N vs Frequency
VDD = 3.6V, POUT = 200mW, RL = 8Ω
DAC Input, Internal Reference, Speaker Mode
300455c0
THD+N vs Frequency
VDD = 3.6V, POUT = 200mW, RL = 8Ω
DAC Input, External Reference, Speaker Mode
300455c8
THD+N vs Frequency
VDD = 3.6V, POUT = 100mW, RL = 4Ω
Analog Input, Speaker Mode
300455d3
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LM49450
THD+N vs Frequency
VDD = 5.0V, POUT = 750mW, RL = 4Ω
DAC Input, Internal Reference, Speaker Mode
300455b8
THD+N vs Frequency
VDD = 5.0V, POUT = 750mW, RL = 4Ω
DAC Input, External Reference, Speaker Mode
300455c6
THD+N vs Frequency
VDD = 5.0V, POUT = 800mW, RL = 8Ω
DAC Input, Internal Reference, Speaker Mode
300455c1
THD+N vs Frequency
VDD = 5.0V, POUT = 800mW, RL = 8Ω
DAC Input, External Reference, Speaker Mode
300455c9
THD+N vs Frequency
VDD = 5.0V, POUT = 700mW, RL = 8Ω
Analog Input, Speaker Mode
300455d7
THD+N vs Frequency
VDD = 5.0V, POUT = 1.0W, RL = 4Ω
Analog Input, Speaker Mode
300455d4
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LM49450
THD+N vs Frequency
HPVDD = 2.0V, POUT = 10mW, RL = 16Ω
DAC Input, Internal Reference, Headphone Mode
300455f2
THD+N vs Frequency
HPVDD = 2.5V, POUT = 25mW, RL = 16Ω
DAC Input, Internal Reference, Headphone Mode
300455f3
THD+N vs Frequency
HPVDD = 2.0V, POUT = 15mW, RL = 32Ω
DAC Input, Internal Reference, Headphone Mode
300455f4
THD+N vs Frequency
HPVDD = 2.5V, POUT = 25mW, RL = 32Ω
DAC Input, Internal Reference, Headphone Mode
300455f5
THD+N vs Frequency
HPVDD = 2.0V, POUT = 10mW, RL = 16Ω
DAC Input, External Reference, Headphone Mode
300455f8
THD+N vs Frequency
HPVDD = 2.5V, POUT = 25mW, RL = 16Ω
DAC Input, External Reference, Headphone Mode
300455f9
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LM49450
THD+N vs Frequency
HPVDD = 2.0V, POUT = 15mW, RL = 32Ω
DAC Input, External Reference, Headphone Mode
300455g0
THD+N vs Frequency
HPVDD = 2.0V, POUT = 25mW, RL = 32Ω
DAC Input, External Reference, Headphone Mode
300455g1
THD+N vs Frequency
HPVDD = 2.0V, POUT = 10mW, RL = 16Ω
Analog Input, Headphone Mode
300455g7
THD+N vs Frequency
HPVDD = 2.0V, POUT = 10mW, RL = 32Ω
Analog Input, Headphone Mode
300455g9
THD+N vs Frequency
HPVDD = 2.5V, POUT = 15mW, RL = 16Ω
Analog Input, Headphone Mode
300455g8
THD+N vs Frequency
HPVDD = 2.5V, POUT = 15mW, RL = 32Ω
Analog Input, Headphone Mode
300455h0
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LM49450
THD+N vs Output Power
AV = 12dB, RL = 4Ω, f = 1kHz
DAC Input, Internal Reference, Speaker Mode
300455b4
THD+N vs Output Power
AV = 12dB, RL = 4Ω, f = 1kHz
DAC Input, External Reference, Speaker Mode
300455c2
THD+N vs Output Power
AV = 12dB, RL = 8Ω, f = 1kHz
DAC Input, Internal Reference, Speaker Mode
300455b5
THD+N vs Output Power
AV = 12dB, RL = 8Ω, f = 1kHz
DAC Input, External Reference, Speaker Mode
300455c3
THD+N vs Output Power
AV = 6dB, RL = 4Ω, f = 1kHz
Analog Input, Speaker Mode
300455d0
THD+N vs Output Power
AV = 6dB, RL = 8Ω, f = 1kHz
Analog Input, Speaker Mode
300455d1
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LM49450
THD+N vs Output Power
AV = 9dB, RL = 16Ω, f = 1kHz
DAC Input, Internal Reference, Headphone Mode
300455f0
THD+N vs Output Power
AV = 9dB, RL = 16Ω, f = 1kHz
DAC Input, External Reference, Headphone Mode
300455f6
THD+N vs Output Power
AV = 9dB, RL = 32Ω, f = 1kHz
DAC Input, External Reference, Headphone Mode
300455f7
THD+N vs Output Power
AV = 0dB, RL = 16Ω, f = 1kHz
Analog Input, Headphone Mode
300455g5
THD+N vs Output Power
AV = 0dB, RL = 32Ω, f = 1kHz
Analog Input, Headphone Mode
300455g6
PSRR vs Frequency
VDD = 3.6V, VRIPPLE = 200mVP-P, RL = 8Ω
DAC Input, Internal Reference, Speaker Mode
300455e4
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LM49450
PSRR vs Frequency
VDD = 3.6V, VRIPPLE = 200mVP-P, RL = 8Ω
DAC Input, External Reference, Speaker Mode
300455e5
PSRR vs Frequency
VDD = 3.6V, VRIPPLE = 200mVP-P, RL = 8Ω
Analog Input, Speaker Mode
300455e7
PSRR vs Frequency
HPVDD = 2.5V, VRIPPLE = 200mVP-P, RL = 32Ω
DAC Input, Internal Reference, Headphone Mode
300455g2
PSRR vs Frequency
HPVDD = 2.5V, VRIPPLE = 200mVP-P, RL = 32Ω
Analog Input, Headphone Mode
300455h5
Efficiency vs Output Power
RL = 4Ω, f = 1kHz, Speaker Mode
300455d8
Efficiency vs Output Power
RL = 8Ω, f = 1kHz, Speaker Mode
30045520
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LM49450
Power Dissipation vs Output Power
RL = 4Ω, f = 1kHz, Speaker Mode
300455e0
Power Dissipation vs Output Power
RL = 8Ω, f = 1kHz, Speaker Mode
300455e1
Power Dissipation vs Output Power
RL = 16Ω, f = 1kHz, Headphone Mode
300455h1
Power Dissipation vs Output Power
RL = 32Ω, f = 1kHz, Headphone Mode
300455h2
Output Power vs Supply Voltage
RL = 4Ω, f = 1kHz, Speaker Mode
300455e2
Output Power vs Supply Voltage
RL = 8Ω, f = 1kHz, Speaker Mode
300455e3
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LM49450
Output Power vs Supply Voltage
RL = 16Ω, f = 1kHz, Headphone Mode
300455h3
Output Power vs Supply Voltage
RL = 32Ω, f = 1kHz, Headphone Mode
300455h4
Output Noise vs Frequency
VDD = 3.6V, RL = 8Ω
DAC Input, Internal Reference, Speaker Mode
300455e6
Output Noise vs Frequency
VDD = 3.6V, RL = 8Ω
Analog Input, Speaker Mode
300455e8
Output Noise vs Frequency
VDD = 2.5V, RL = 32Ω
DAC Input, Internal Reference, Headphone Mode
300455g4
Output Noise vs Frequency
HPVDD = 2.5V, RL = 32Ω
Analog Input, Headphone Mode
300455h6
19 www.national.com
LM49450
Crosstalk vs Frequency
VDD = 3.6V, VRIPPLE = 1VP-P, RL = 8Ω
Analog Input, Speaker Mode
300455e9
Crosstalk vs Frequency
VDD = 2.5V, VRIPPLE = 1VP-P, RL = 8Ω
Analog Input, Headphone Mode
300455h7
www.national.com 20
LM49450
Application Information
I2C COMPATIBLE INTERFACE
The LM49450 is controlled through an I2C compatible serial
interface that consists of a serial data line (SDA) and a serial
clock (SCL). The clock line is uni-directional. The data line is
bi-directional (open collector). The LM49450 and the master
can communicate at clock rates up to 400kHz. Figure 2 shows
the I2C interface timing diagram. Data on the SDA line must
be stable during the HIGH period of SCL. The LM49450 is a
transmit/receive slave-only device, reliant upon the master to
generate the SCL signal. Each transmission sequence is
framed by a START condition and a STOP condition (Figure
3). Each data word, register address and register data, trans-
mitted over the bus is 8 bits long as is always followed by and
acknowledge pulse (Figure 3). The LM49450 device address
is 1111101.
300455h8
FIGURE 2. I2C Timing Diagram
300455h9
FIGURE 3. START and STOP Diagram
300455b0
FIGURE 4. Example I2C Write Cycle
BUS FORMAT
The I2C bus format is shown in Figure 4. The START signal,
the transition of SDA from HIGH to LOW while SDA is HIGH,
is generated, altering all devices on the bus that a device ad-
dress is being written to the bus.
The 7-bit device address is written to the bus, most significant
bit (MSB) first, followed by the R/W bit (R/W = 0 indicates the
master is writing to the LM49450, R/W = 1 indicates the mas-
ter wants to read data from the LM49450). The data is latched
in on the rising edge of the clock. Each address bit must be
stable while SDA is HIGH. After the last address bit is trans-
mitted, the master device releases SDA, during which time,
an acknowledge clock pulse is generated by the slave device.
If the LM49450 receives the correct address, the device pulls
the SDA line low, generating and acknowledge bit (ACK).
Once the master device registers the ACK bit, the 8-bit reg-
ister address word is sent. Each data bit should be stable
while SCL is HIGH. After the 8-bit register address is sent, the
LM49450 sends another ACK bit. Following the acknowl-
edgement of the register address, the 8-bit register data word
is sent. Each data bit should be stable while SCL is HIGH.
After the 8-bit register data is sent, the LM49450 sends an-
21 www.national.com
LM49450
other ACK bit. Following the acknowledgement of the register
data word, the master issues a STOP bit, allowing SDA to go
high while SDA is high.
I2S DATA FORMAT
The LM49450 supports three I2S formats: Normal Mode (Fig-
ure 5), Left Justified Mode (Figure 6), and Right Justified
Mode (Figure 7). In Normal Mode, the audio data is transmit-
ted MSB first, with the unused bits following the LSB. In Left
Justified Mode, the audio data format is similar to the Normal
Mode, without the delay between the LSB and the change in
I2S_WS. In Right Justified Mode, the audio data MSB is trans-
mitted after a delay of a preset number of bits.
300455a9
FIGURE 5. I2S Normal Input Format
300455b2
FIGURE 6. I2S Left Justified Input Format
300455b3
FIGURE 7. I2S Right Justified Input Format
GENERAL AMPLIFIER FUNCTION
Class D Amplifier
The LM49450 features a high-efficiency stereo Class D audio
power amplifier that utilizes National’s filterless modulation
scheme which reduces external component count, conserves
board space and reduces system cost. The Class D outputs
transition between VDD and GND with a 300kHz switching
frequency. With no signal applied, the outputs switch with a
50% duty cycle, in phase, causing the two outputs to cancel.
This cancellation results in no net voltage across the speaker,
thus there is no current to the load in the idle state.
With the input signal applied, the duty cycle (pulse width) of
the LM49450 outputs changes. For increasing output voltage,
the duty cycle of V_LS+ increases while the duty cycle of
V_LS- decreases. For decreasing output voltages, the con-
verse occurs. The difference between the two pulse widths
yield the differential output voltage.
www.national.com 22
LM49450
Fixed Frequency Mode
The LM49450 features two modulation schemes, a fixed fre-
quency mode and a spread spectrum mode. Select the fixed
frequency mode by setting the SS bit (B3) in the Mode Control
Register (0x00h) to 0. In fixed frequency mode, the speaker
amplifier outputs switch at a constant 300kHz. The output
spectrum in fixed frequency mode consists of the fundamen-
tal and its associated harmonics (see Typical Performance
Characteristics).
Spread Spectrum
The logic selectable spread spectrum mode eliminates the
need for output filters, ferrite beads or chokes. In spread
spectrum mode, the switching frequency varies randomly by
30% about a 300kHz center frequency, reducing the wide-
band spectral content, improving EMI emissions radiated by
the speaker and associated cables and traces. Where a fixed
frequency class D exhibits large amounts of spectral energy
at multiples of the switching frequency, the spread spectrum
architecture of the LM49450 spreads that energy over a larger
bandwidth (see Typical Performance Characteristics). The
cycle-to-cycle variation of the switching period does not affect
the audio reproduction, efficiency, or PSRR. Set the SS bit
(B3) in the Mode Control Register (0x00h) to 1 to select
spread spectrum mode.
Headphone Amplifier
The LM49450 headphone amplifiers feature National’s
ground referenced architecture that eliminates the large DC-
blocking capacitors required at the outputs of traditional head-
phone amplifiers. A low-noise inverting charge pump creates
a negative supply (HPVSS) from the positive supply voltage
(CPVDD). The headphone amplifiers operate from these bipo-
lar supplies, with the amplifier outputs biased about GND,
instead of a nominal DC voltage (typically VDD/2), like tradi-
tional amplifiers. Because there is no DC component to the
headphone output signals, the large DC-blocking capacitors
(typically 220µF) are not necessary, conserving board space
and system cost, while improving frequency response.
Power Supplies
The LM49450 uses different power supplies for each portion
of the device, allowing for the optimum combination of head-
room, power dissipation and noise immunity. The analog
input, and gain (volume control) stages for both speaker and
headphones are powered from VDD. The speaker output
stage is powered from LSVDD. The headphone amplifiers and
charge pump are powered from HPVDD. The separate power
supplies allow the class D amplifiers to operate from a higher
voltage, maximizing headroom, while the headphones oper-
ate from a lower voltage, improving power dissipation, as well
as minimizing switching noise coupling between the speaker
and headphone amplifiers. The digital portion of the device is
powered from DVDD, including the 3D processing core and
DAC. IOVDD powers the I2S and I2C, allowing the LM49450
to interface with lower voltage digital controllers.
National's 3D Enhancement
The LM49450 digital audio path features National’s 3D en-
hancement that widens or narrows the perceived soundstage
of a stereo audio signal. The 3D enhancement either increas-
es or decreases the apparent stereo channel separation,
improving audio reproduction whenever the placement of
both left and right speakers is not ideal.
The LM49450 3D function is controlled through the I2C inter-
face. The headphone and speakers have independent 3D
controls, allowing each signal path to have its own individual
3D configuration. The LM49450 3D features two effect
modes, a narrow effect that decreases the channel separa-
tion, making the speakers sound closer together, and a wide
effect that makes the speakers sound farther apart. Because
the narrow effect mode adds a portion of the left and right
signals together, a selectable 6dB attenuation mode is pro-
vided to maintain a constant output amplitude when the nar-
row effect mode is active without changing the volume level.
The high pass 3dB roll off frequency, 3D gain (amount chan-
nel mixing), and narrow/wide effect selection is done through
registers 0x05h (headphone) and 0x06h (speaker. See the
Headphone 3D Configuration Register and Loudspeaker 3D
Control Register sections for more information.
Headphone Sense
The LM49450 features a headphone sense input (HPS) that
monitors the headphone jack and configures the device de-
pending on the presence of a headphone. When the HPS pin
is low, indicating that a headphone is not present, the
LM49450 speaker amplifiers are active and the headphone
amplifiers are disabled. When the HPS pin is high, indicating
that a headphone is present, the headphone amplifiers are
active while the speaker amplifiers are disabled.
300455b1
FIGURE 8. HPS Connection
Volume Control
The LM49450 features two separate 32-step volume controls,
one for the speaker channels and one for the headphone
channels. This allows for the gain of the headphone and
speakers to be set independently of each other.
23 www.national.com
LM49450
External Reference
The LM49450 can be used with an external reference. Dis-
able the internal reference by setting bit B7 of the Mode
Control Register (0x00h) to 1. This allows an external refer-
ence voltage to be applied to REF. For proper operation, do
not allow the VREF to exceed VDD.
Low Power Shutdown
The LM49450 features an I2C selectable low power shutdown
mode that disables the entire device, reducing quiescent cur-
rent consumption to 0.05µA (digital + analog current). Set bit
B0 in the mode control register (0x00h) to 0 to disable the
device. Set B0 to 1 to enable the device.
I2S CLOCK CONTROL
The LM49450 features the ability to derive multiple clock sig-
nals, including the DAC clock, I2S clock and word select clock
in master mode, and the charge pump oscillator frequency,
from the MCLK input.
DAC Clock Divider (RDIV)
Bits B5-B0 in the CLOCK CONTROL register (0x01h) are the
RDIV bits that set the DAC clock divider ratio. The DAC clock
derived from MCLK needs to match the DAC sampling rate.
For example, with fMCLK = 12.288MHz and a 64*fS oversam-
pling ratio (fS = 48kHz), the DAC requires a 6.144MHz clock.
In this case, set the RDIV ratio to divide by 2. In other in-
stances, there may not be a suitable divider ratio for a given
sampling rate and MCLK frequency. In this case, fMCLK may
need to be altered. See the Clock Control Register section for
more information.
I2S WS Clock Dividers (I2S_CLK, WS_CLK)
In I2S master mode, the LM49450 I2S CLOCK CONTROL
register (0x04h) can be used to set the I2S clock and WS clock
frequency. In I2S clock master mode, bits B7-B4 of the I2S
CLOCK CONTROL register, the I2S_CLK bits, set the I2S
clock divider ratio. The LM49450 derives the I2S clock from
DAC clock based on the ratio set by the I2S_CLK bits. The
I2S clock is output on I2S_CLK.
In I2S master mode, bits B3 and B2 (I2S_WS) of the I2S
CLOCK CONTROL register set the bit length per data word
of the I2S WS.
Charge Pump Clock Divider (CPDIV)
The ground referenced headphone amplifiers charge pump
derives its clock from MCLK. Bits B7-B0 of the CHARGE
PUMP CLOCK register (0x02h) set the charge pump clock
divider ratio. See the Charge Pump Clock Register section for
more information.
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LM49450
CONTROL REGISTERS — Register Map
Register
Addess
Register
Name
B7 B6 B5 B4 B3 B2 B1 B0
0x00h MODE
CONTROL EXT_REF DAC_MODE_1 DAC_MODE_ 0 COMP SS MUTE LINE_IN ENABLE
0x01h CLOCK DAC_DITHER
_OFF
DAC_DITHER
_ON RDIV_5 RDIV_4 RDIV_3 RDIV_2 RDIV_1 RDIV_0
0x02h CHARGE PUMP CLOCK
FREQUENCY CPDIV_7 CPDIV_6 CPDIV_5 CPDIV_4 CPDIV_3 CPDIV_2 CPDIV_1 CPDIV_0
0x03h I2S MODE RESERVED I2S_WRD_2 I2S_WRD_1 I2S_WRD_0 I2S STEREO
_REVERSE
I2S_WORD
_ORDER I2S_MODE_1_ I2S_MODE_0
0x04h I2S CLOCK I2S_CLK_3 I2S_CLK_2 I2S_CLK_1 I2S_CLK_0 I2S_WS_1 I2S_WS_0 I2S_WS_MS I2S_CLK_MS
0x05h HEADPHONE 3D
CONTROL RESERVED HP_3DATTN HP_3DFREQ_1 HP_3DFREQ_0 HP_3D_GAIN_1 HP_3D_GAIN_0 HP_3D_MODE HP_3DEN
0x06h SPEAKER 3D CONTROL RESERVED LS_3DATTN LS_3DFREQ_1 LS_3DFREQ_0 LS_3DGAIN_1 LS_3DGAIN_0 LS_3D_MODE LS_3DEN
0x07h HEADPHONE VOLUME
CONTROL RESERVED RESERVED RESERVED HP4 HP3 HP2 HP1 HP0
0x08h SPEAKER VOLUME
CONTROL RESERVED RESERVED RESERVED LS4 LS3 LS2 LS1 LS0
0x09h CMP_0_LSB C0_7 C0_6 C0_5 C0_4 C0_3 C0_2 C0_1 C0_0
0x0Ah CMP_0_MSB C0_15 C0_14 C0_13 C0_12 C0_111 C0_10 C0_09 C0_08
0x0Bh CMP_1_LSB C1_7 C1_6 C1_5 C1_4 C1_3 C1_2 C1_1 C1_0
0x0Ch CMP_1_MSB C1_15 C1_14 C1_13 C1_12 C1_11 C1_10 C1_09 C1_08
0x0Dh CMP_2_LSB C2_7 C2_6 C2_5 C2_4 C2_3 C2_2 C2_1 C2_0
0x0Eh CMP_2_MSB C2_15 C2_14 C2_13 C2_12 C2_11 C2_10 C2_09 C2_08
25 www.national.com
LM49450
MODE CONTROL REGISTER (0x00h)
Default value is 0x00h.
TABLE 2. Mode Control Register
Bit Name Value Description
B7 EXT_REF
0 Internal reference selected
1External reference selected. See External Reference
section.
B6:B5 DAC_MODE_1 (B6)
DAC_MODE_0 (B5)
B6 B5 Select DAC over sampling Rate
0 0 125
0 1 128
1 0 64
1 1 32
B4 COMP
0 Default DAC compensation filter selected
1Programmable DAC compensation filter selected. See
DAC Compensation Filter section.
B3 SS 0 Fixed frequency oscillator selected
1 Spread spectrum oscillator selected
B2 MUTE 0 Un-mute device
1 Mute device
B0 ENABLE 0 Device shutdown. Default state during a POR event
1 Device enabled.
CLOCK CONTROL REGISTER (0x01h)
Default value is 0x00h.
TABLE 3. Clock Control Register
Bit Name Value Description
B7 DAC_DITHER_OFF 0 Default DAC state
1 Permanently disables DAC dither
B6 DAC_DITHER_ON 0 Default DAC state
1 Permanently enables DAC dither
B5:B0
RDIV_5 (B5)
RDIV_4 (B4)
RDIV_3 (B3)
RDIV_2 (B2)
RDIV_1 (B1)
RDIV_0 (B0)
B5 B4 B3 B2 B1 B0 Sets MCLK divider ratio
0 0 0 0 0 0 Bypass divider
0 0 0 0 0 1 1
0 0 0 0 1 0 1.5
0 0 0 0 1 1 2
0 0 0 1 0 0 2.5
0 0 0 1 0 1 5
TO In 0.5 increments
1 1 1 1 0 1 31
1 1 1 1 1 0 31.5
1 1 1 1 1 1 32
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LM49450
CLK NETWORK
30045559
CLK Network Diagram
LM49450 Clock Structure
The MCLK input is first divided by the R divider to product the
clock at point B; this is then decoded according to the
DAC_MODE to produce a signal which goes to both the DAC
digital and the I2S interface, and a signal which goes to the
DAC analog.
This table describes the relationship between the clocks, for
each of the four possible DAC modes in terms of audio input
sampling frequency fs.
TABLE 4. Relationship between clocks for each of the four DAC modes
DAC MODE Description
OSR CLK at B DAC Digital CLK DAC Analog CLK
00 125 250fs 250fs 125fs
01 128 256fs 128fs 128fs
10 64 128fs 128fs 64fs
11 32 128fs 128fs 32fs
Common Clock Settings for the DAC
In DAC_MODE 0, the DAC has an oversampling rate (OSR)
of 125 but requires a 250xfs clock at point B. This allows a
simple clocking solution as it will work from 12.000MHz (com-
mon in most systems with Bluetooth or USB) at 48kHz exact-
ly. In the other DAC modes, the DAC requires a conventional
2^Nxfs clock for conversation. The following table describes
the clock required at point B for various clock sample rates in
the different DAC modes:
TABLE 5. Common DAC Clock Frequencies
Sample Rate Clock Required at B (MHz)
DAC MODE = 2b00
(OSR = 125fs, Clock
Required = 250fs)
DAC MODE = 2b01 (OSR
= 128fs, Clock Required =
256fs)
DAC MODE = 2b10
(OSR = 64fs, Clock
Required = 128fs)
DAC MODE = 2b11
(OSR = 32fs, Clock
Required = 128fs)
8 2 2.048
11.025 2.75625 2.8224
12 3 3.072
16 4 4.096
22.05 5.5125 5.6448
24 6 6.144
32 8 8.192
44.1 11.025 11.2896
48 12.288
88.2 11.2896
96 12.288
176.4 22.5792
192 24.576
27 www.national.com
LM49450
CHARGE PUMP CLOCK REGISTER (0x02h)
The charge pump clock register sets the charge pump fre-
quency derived from MCLK when the LM49450 is in DAC
mode. Default value is for register 02h is 0x49h.
TABLE 6. Charge Pump Clock Register
Bit Name Value Description
B7:B0
CPDIV_7
(B7)
CPDIV_6
(B6)
CPDIV_5
(B5)
CPDIV_4
(B4)
CPDIV_3
(B3)
CPDIV_2
(B2)
CPDIV_1
(B1)
CPDIV_0
(B0)
B7 B6 B5 B4 B3 B2 B1 B0 Sets charge pump oscillator
frequency in DAC mode
(derived from MCLK).
0 0 0 0 0 0 0 0 Bypass divider
00000001 1
0 0 0 0 0 0 1 0 1.5
00000011 2
0 0 0 0 0 1 0 0 2.5
00000101 3
TO In 0.5 increments
1 1 1 1 1 1 0 1 127
1 1 1 1 1 1 1 0 127.5
1 1 1 1 1 1 1 1 128
CP_DIV REGISTER
LM49450 Clock Structure
This register is used to control the charge pump clock when
the register field LINE_IN_ENABLE is low i.e. DAC mode.
When the register field LINE_IN_ENABLE is high, the Clocks
module is held in reset and as a result no CP_CLOCK_C is
produced.
TABLE 7. CP_DIV Default Value 0x49h
Bits Field Description
7:0 CP_DIV Programs the CP divider (devides from an expected 12.000MHz
input).
CP_DIV Divide Value
0 Bypass
1 1
2 1.5
3 2
4 2.5
5 to 253 3 to 127
254 127.5
255 128
Examples of CP_DIV Values one might use for various
sample rates and DAC modes
TABLE 8. Typical CP_DIV Values for DAC Mode 00
MCLK (MHZ) CP_DIV Nominal Frequency (Hz)
2 11 333333
2.75625 16 324265
3 17 333333
4 23 333333
5.5125 33 324264
6 36 324324
8 48 326530
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LM49450
MCLK (MHZ) CP_DIV Nominal Frequency (Hz)
11.025 67 324265
12 73 324324
TABLE 9. Typical CP_DIV Values for DAC Mode 01
MCLK (MHZ) CP_DIV Nominal Frequency (Hz)
2.048 11 341333
2.8224 17 313600
3.072 18 323368
4.096 24 327680
5.6448 33 332047
6.144 37 323368
8.192 49 327680
11.2896 68 327234
12.288 75 323368
TABLE 10. Typical CP_DIV Values for DAC Mode 10
MCLK (MHZ) CP_DIV Nominal Frequency (Hz)
11.2896 68 327234
12.288 75 323368
TABLE 11. Typical CP_DIV Values for DAC Mode 11
MCLK (MHZ) CP_DIV Nominal Frequency (Hz)
22.5792 138 324881
24.576 150 325510
I2S MODE CONTROL REGISTER (0x03h)
Default value is 0x00h.
TABLE 12. I2S Mode Control Register
Bit Name Value Description
B7 RESERVED X Unused
B6:B4
I2S_WRD_2 (B6)
I2S_WRD_1 (B5)
I2S_WRD_0 (B5)
B6 B5 B4 Sets I2S word size in Right Justified Mode
0 0 0 16
0 0 1 18
0 1 0 20
0 1 1 22
1 0 0 24
1 0 1 25
1 1 0 26
1 1 1 32
B3 I2S_STEREO
_REVERSE
0
Normal mode.
Left channel data goes to left channel output
Right channel data goes to right channel output.
1
Reverse mode.
Left channel data goes to right channel output
Right channel data goes to left channel output
29 www.national.com
LM49450
Bit Name Value Description
B2 I2S_WORD_ORD
ER
0
Normal mode.
I2S_WS = 0 indicates left channel audio
I2S_WS = 1 indicates right channel audio
1
Reverse mode.
I2S_WS = 0 indicates right channel audio
I2S_WS = 1 indicates left channel audio.
B1:B0 I2S_MODE_1 (B1)
I2S_MODE_0 (B0)
B1 B0 Sets I2S operating mode
0 0 Normal Mode
0 1 Left Justified Mode
1 0 Right Justified Mode
1 1 Unused
I2S CLOCK REGISTER (0x04h)
Default value is 0x00h.
TABLE 13. I2S Clock Register
Bit Name Value Description
B7:B4
I2S_CLK_3
(B7)
I2S_CLK_2
(B6)
I2S_CLK_1
(B5)
I2S_CLK_0
(B4)
B7 B6 B5 B4
Sets divider ratio to derive the I2S clock from the divided MCLK in
I2S master mode
DIVIDE BY RATIO
0 0 0 0 1
0 0 0 1 2
0 0 1 0 4
0 1 1 1 6
0 0 0 0 8
0 0 1 1 10
0 1 0 0 16
0 1 1 1 20
1 0 0 0 2.5 2.5
1 0 0 1 3 1:3
1 0 1 0 3.90625 32:125
1 0 1 1 5 1:5
1 1 0 0 7.8125 16:125
1 1 0 1
1 1 1 0
1 1 1 1
B3:B2
I2S_WS_1
(B3)
I2S_WS_0
(B2)
B3 B2 Determines the bit length per data word of I2S_WS in I2S master
mode
0 0 16
0 1 25
1 0 32
1 1
B1 I2S_WS_M
S
0I2S WS slave mode. The LM49450 drives the I2S WS signal from
the I2S_WS line.
1I2S WS master mode. The LM49450 generates the I2S WS signal.
I2S_WS line is driven by the LM49450
B0 I2S_CLK_
MS
0I2S clock slave mode. The LM49450 derives its I2S clock from the
I2S_CLK line.
1I2S clock master mode. The LM49450 generates the I2S clock
signal. I2S_CLK line is driven by the LM49450.
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LM49450
HEADPHONE 3D CONFIGURATION REGISTER (0x05h)
Default value is 0x00h.
TABLE 14. Headphone 3D Configuration Register
Bit Name Value Description
B7 RESERVED X UNUSED
B6 HP_3DATTN 0 No Attenuation
1 Output signals are attenuated by 6dB
B5:B4 HP_3DFREQ_1 (B5)
HP_3DFREQ_0 (B4)
B5 B4 Sets 3D high pass filter -3dB (roll-off) frequency
0 0 0
0 1 300Hz
1 0 600Hz
1 1 900Hz
B3:B2 HP_3DFREQ_1 (B3)
HP_3DFREQ_0 (B2)
B3 B2 Sets the 3D mix level, ie the amount of the left channel
signal that appears on the right channel and visa versa.
0 0 25%
0 1 37.5%
1 0 50%
1 1 75%
B1 HP_3D 0 Narrow 3D effect
1 Wide 3D effect
B0 HP_3DEN 0 Headphone 3D disabled
1 Headphone 3D enabled
LOUDSPEAKER 3D CONFIGURATION REGISTER
(0x06h)
Default value is 0x00h.
TABLE 15. Loudspeaker 3D Configuration Register
Bit Name Value Description
B7 RESERVED X UNUSED
B6 LS_3DATTN 0 No Attenuation
1 Output signals are attenuated by 6dB
B5:B4 LS_3DFREQ_1 (B5)
LS_3DFREQ_0 (B4)
B5 B4 Sets 3D high pass filter -3dB (roll-off) frequency
0 0 0
0 1 300Hz
1 0 600Hz
1 1 900Hz
B3:B2 LS_3DFREQ_1 (B3)
LS_3DFREQ_0 (B2)
B3 B2 Sets the 3D mix level, ie the amount of the left channel
signal that appears on the right channel and visa versa.
0 0 25%
0 1 37.5%
1 0 50%
1 0 75%
B1 HP_3D 0 Narrow 3D effect
1 Wide 3D effect
B0 HP_3DEN 0 Loudspeaker 3D disabled
1 Loudspeaker 3D enabled
31 www.national.com
LM49450
HEADPHONE VOLUME CONTROL REGISTER (0x07h)
Default value is 0x00h.
TABLE 16. Headphone Volume Control Register
Bit Name Value Description
B7:B5 RESERVED X UNUSED
B4:B0
HP4 (B4)
HP3 (B3)
HP2 (B2)
HP1 (B1)
HP0 (B0)
See Headphone Volume
Control Table
Controls gain/attenuation of the audio signal in the
headphone path.
VOLUME
STEP HP4 HP3 HP2 HP1 HP0 HP GAIN (dB)
1 0 0 0 0 0 –59
2 0 0 0 0 1 –48
3 0 0 0 1 0 –40.5
4 0 0 0 1 1 –34.5
5 0 0 1 0 0 –30
6 0 0 1 0 1 –27
7 0 0 1 1 0 –24
8 0 0 1 1 1 –21
9 0 1 0 0 0 –18
10 0 1 0 0 1 –15
11 0 1 0 1 0 –13.5
12 0 1 0 1 1 –12
13 0 1 1 0 0 –10.5
14 0 1 1 0 1 –9
15 0 1 1 1 0 –7.5
16 0 1 1 1 1 –6
17 1 0 0 0 0 –4.5
18 1 0 0 0 1 –3
19 1 0 0 1 0 –1.5
20 1 0 0 1 1 0
21 1 0 1 0 0 1.5
22 1 0 1 0 1 3
23 1 0 1 1 0 4.5
24 1 0 1 1 1 6
25 1 1 0 0 0 7.5
26 1 1 0 0 1 9
27 1 1 0 1 0 10.5
28 1 1 0 1 1 12
29 1 1 1 0 0 13.5
30 1 1 1 0 1 15
31 1 1 1 1 0 16.5
32 1 1 1 1 1 18
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LM49450
LOUDSPEAKER VOLUME CONTROL REGISTER (0x08h)
Default value is 0x00h.
TABLE 17. Loudspeaker Volume Control Register
Bit Name Value Description
B7:B5 RESERVED X UNUSED
B4:B0
LS4 (B4)
LS3 (B3)
LS2 (B2)
LS1 (B1)
LS0 (B0)
See Loudspeaker Volume
Control Table
Controls gain/attenuation of the audio signal in the
loudspeaker path.
VOLUME
STEP LS4 LS3 LS2 LS1 LS0 LS GAIN (dB)
1 0 0 0 0 0 –53
2 0 0 0 0 1 –42
3 0 0 0 1 0 –34.5
4 0 0 0 1 1 –28.5
5 0 0 1 0 0 –24
6 0 0 1 0 1 –21
7 0 0 1 1 0 –18
8 0 0 1 1 1 –15
9 0 1 0 0 0 –12
10 0 1 0 0 1 –9
11 0 1 0 1 0 –7.5
12 0 1 0 1 1 –6
13 0 1 1 0 0 –4.5
14 0 1 1 0 1 –3
15 0 1 1 1 0 –1.5
16 0 1 1 1 1 0
17 1 0 0 0 0 1.5
18 1 0 0 0 1 3
19 1 0 0 1 0 4.5
20 1 0 0 1 1 6
21 1 0 1 0 0 7.5
22 1 0 1 0 1 9
23 1 0 1 1 0 10.5
24 1 0 1 1 1 12
25 1 1 0 0 0 13.5
26 1 1 0 0 1 15
27 1 1 0 1 0 16.5
28 1 1 0 1 1 18
29 1 1 1 0 0 19.5
30 1 1 1 0 1 21
31 1 1 1 1 0 22.5
32 1 1 1 1 1 24
33 www.national.com
LM49450
DAC COMPENSATION FILTER REGISTERS (0x09h to
0x0Eh)
DAC Compensation Filter
The LM49450 DAC features a 5 band FIR filter that can be
used as an equalizer for the digital audio path. Registers
0x09h, 0x0Ah, 0x0Bh, 0x0Ch, 0x0Dh, and 0x0Eh provide an
8-bit control for each individual FIR filter.
EXTERNAL COMPONENT SELECTION
The LM49450 uses different supplies for each portion of the
device, allowing for the optimum combination of headroom,
power dissipation and noise immunity. The speaker amplifier
gain stage is powered from VDD, while the output stage is
powered from LSVDD. The headphone amplifiers, input am-
plifiers and volume control stages are powered from HPVDD.
The separate power supplies allow the speakers to operate
from a higher voltage for maximum headroom, while the
headphones operate from a lower voltage, improving power
dissipation. HPVDD may be driven by a linear regulator to fur-
ther improve performance in noisy environments. The I2C
portion if powered from I2CVDD, allowing the I2C portion of the
LM49450 to interface with lower voltage digital controllers.
PROPER SELECTION OF EXTERNAL COMPONENTS
Power Supply Bypassing and Filtering
Proper power supply bypassing is critical for low noise per-
formance and high PSRR. Place the supply bypass capaci-
tors as close to the device as possible. Typical applications
employ a voltage regulator with 10µF and 0.1µF bypass ca-
pacitors that increase supply stability. These capacitors do
not eliminate the need for bypassing of the LM49450 supply
pins. A 1µF ceramic capacitor placed close to each supply pin
is recommended.
Bypass Capacitor Selection
The LM49450 internally generates a VDD/2 common-mode
bias voltage. The BYPASS capacitor CBYPASS, improves
PSRR and THD+N by reducing noise at the BYPASS node.
Use a 2.2µF ceramic placed as close to the device as possi-
ble.
REF Capacitor Selection
The LM49450 generates an internal low noise reference volt-
age used by the DAC. For best THD+N performance, bypass
REF with 10µF and 0.1µF ceramic capacitors.
Charge Pump Capacitor Selection
Use low ESR ceramic capacitors (less than 100m) for opti-
mum performance.
Charge Pump Flying Capacitor (C1)
The flying capacitor (C1) affects the load regulation and out-
put impedance of the charge pump. A C1 value that is too low
results in a loss of current drive, leading to a loss of amplifier
headroom. A higher valued C1 improves load regulation and
lowers charge pump output impedance to an extent. Above
2.2µF, the RDS(ON) of the charge pump switches and the ESR
of C1 and C2 dominate the output impedance. A lower value
capacitor can be used in systems where low maximum output
power requirements.
Charge Pump Hold Capacitor (C2)
The value and ESR of the hold capacitor (C2) directly affects
the ripple on CPVSS. Increasing the value of C2 reduces out-
put ripple. Decreasing the ESR of C2 reduces both output
ripple and charge pump output impedance. A lower value ca-
pacitor can be used in systems where low maximum output
power requirements.
Input Capacitor Selection
The LM49450 analog inputs require input coupling capaci-
tors. Input capacitors block the DC component of the audio
signal, eliminating any conflict between the DC component of
the audio source and the bias voltage of the LM49450. The
input capacitors create a high-pass filter with the input resis-
tors RIN. The -3dB point of the high pass filter is found using
Equation (1) below.
f = 1 / 2πRINCIN (1)
Where the value of RIN is typically 20kΩ.
The input capacitors can also be used to remove low fre-
quency content from the audio signal. Small speakers cannot
reproduce, and may even be damaged by low frequencies.
High pass filtering the audio signal helps protect the speakers.
When the LM49450 is using a single-ended source, power
supply noise on the ground is seen as an input signal. Setting
the high-pass filter point above the power supply noise fre-
quencies, 217Hz in a GSM phone, for example, filters out the
noise such that it is not amplified and heard on the output.
Capacitors with a tolerance of 10% or better are recommend-
ed for impedance matching and improved CMRR and PSRR.
www.national.com 34
LM49450
PCB Layout Guidelines
Minimize trace impedance of the power, ground and all output
traces for optimum performance. Voltage loss due to trace
resistance between the LM49450 and the load results in de-
creased output power and efficiency. Trace resistance be-
tween the power supply and ground has the same effect as a
poorly regulated supply, increased ripple and reduced peak
output power. Use wide traces for power supply inputs and
amplifier outputs to minimize losses due to trace resistance,
as well as route heat away from the device. Proper grounding
improves audio performance, minimizes crosstalk between
channels and prevents switching noise from interfering with
the audio signal. Use of power and ground planes is recom-
mended.
Place all digital components and route digital signal traces as
far as possible from analog components and traces. Do not
run digital and analog traces in parallel on the same PCB lay-
er. If digital and analog signal lines must cross either over or
under each other, ensure that they cross in a perpendicular
fashion.
Exposed DAP Mounting
Considerations
The LM49450 LLP package features an exposed die-attach
(thermal) pad on its backside. The exposed pad provides a
direct heat conduction path from the die to the PCB, reducing
the thermal resistance of the package. Connect the exposed
pad to GND with a large pad and via to a large GND plane on
the bottom of the PCB for best heat distribution.
35 www.national.com
LM49450
Revision Table
Rev Date Description
1.0 12/18/07 Initial release.
1.01 09/26/08 Corrected the package drawing.
1.02 08/04/11 On Table 5 (Common DAC Clock..., col DAC MODE = 2b01... sample 8...),
changed 2.084 to 2.048.
www.national.com 36
LM49450
Physical Dimensions inches (millimeters) unless otherwise noted
32 Lead LLP
Order Number LM49450SQ
NS Package Number SQA32A
37 www.national.com
LM49450
Notes
LM49450 I2S Input, 2.5W/Channel, Low EMI, Stereo, Class D Audio Sub-System with Ground
Referenced Headphone Amplifier, 3D Enhancement, and Headphone Sense
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