TYPICAL PROPERTIES OF GAP PAD EMI 1.0
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374
Inherent Surface Tack 1 1 —
Density (Bulk Rubber) (g/cc) 2.4 2.4 ASTM D792
Heat Capacity (J/g-K) 1.3 1.3 ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1) 5 5 ASTM D2240
Young's Modulus (psi) / (kPa) (2) 10 69 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >1700 >1700 ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (3) 1.0 1.0 ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain) 10 20 30
Thermal Impedance (°C-in2/W) 0.040" 1.53 1.40 1.25
EMI PERFORMANCE (ASTM D-5568-01 TEST METHOD)
Absorption (4) dB/inch dB/cm
@ 2.4 GHz -7 -2.8
@ 5 GHz -14 -5.5
1) Thirty second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.
Relaxation stress @ 40 mil.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are
provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
4) Based on waveguide testing with 60 mil thickness testing.
www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_EMI 1_0515
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company -
Asia Headquarters
Hong Kong
Ph: 852-2690-9296
Fax: 852-2690-3408
Gap Pad
®
EMI 1.0
Features and Benefits
• Thermal Conductivity: 1.0 W/m-K
• Electromagnetic Interference (EMI) absorbing
• Highly conformable, low hardness
• Fiberglass reinforced for puncture, shear
and tear resistance
• Electrically isolating
Gap Pad®EMI 1.0 is a highly conformable,
combination gap filling material offering both
thermal conductivity performance and
Electromagnetic Energy absorption (cavity
resonances and/or cross-talk causing
Electromagnetic Interference) at frequencies
of 1GHz and higher.
The material offers EMI suppression and
1.0 W/m-K thermal conductivity performance
with low assembly stress. The soft nature of
the material enhances wet-out at the
interface resulting in better thermal
performance than harder materials with a
similar performance rating.
Gap Pad®EMI 1.0 has an inherent, natural tack
on one side of the material eliminating the
need for thermally-impeding adhesive layers
and allowing improved handling during
placement and assembly. The other side is
tack-free, again enhancing handling and rework,
if required. Gap Pad®EMI 1.0 is supplied with a
protective liner on the material’s tacky side.
Typical Applications Include:
• Consumer electronics • ASICs and DSPs
• Telecommunications • PC applications
Configurations Available:
• Sheet form and die-cut parts
Thermally Conductive, Conformable EMI Absorbing Material
Building a Part Number Standard Options
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GPEMI1.0 = Gap Pad EMI 1.0 Material with fiberglass
GPEMI1.0 0.020 01 0816 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125"
01 = Natural tack, one side (With Fiberglass)
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
––––
01.00 3.002.00 4.00 5.00 6.00
140
120
100
80
60
40
20
0
Thickness vs. Thermal Resistance
Gap Pad EMI 1.0
Thermal Resistance (C-in2/W)
Resultant Thickness (mils)
01 3245678
0
-2
-4
-6
-8
-10
-12
-14
-16
Absorption and Reflection (60 mil)
Gap Pad EMI 1.0
Frequency (GHz)
dB
