MC100EL01MNR4G - ON Semiconductor L.L.C.

August, 2008 − Rev. 6

1Publication Order Number:

MC10EL01/D

MC10EL01, MC100EL01

5V ECL 4‐Input OR/NOR

Description

The MC10EL/100EL01 is a 4-input OR/NOR gate. The device is

functionally equivalent to the E101 device with higher performance

capabilities. With propagation delays and output transition times

significantly faster than the E101, the EL01 is ideally suited for those

applications which require the ultimate in AC performance.

The 100 series contains temperature compensation.

Features

•230 ps Propagation Delay

•ESD Protection: > 1 kV Human Body Model,

> 100 V Machine Model

•PECL Mode Operating Range: VCC = 4.2 V to 5.7 V

with VEE = 0 V

•NECL Mode Operating Range: VCC = 0 V

with VEE = −4.2 V to −5.7 V

•Internal Input Pulldown Resistors

•Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

•Moisture Sensitivity Level 1

For Additional Information, see Application Note AND8003/D

•Flammability Rating: UL 94 V−0 @ 0.125 in,

Oxygen Index: 28 to 34

•Transistor Count = 46 devices

•Pb−Free Packages are Available

D3VEE

VCC

Figure 1. Logic Diagram and Pinout Assignment

*For additional marking information, refer to

Application Note AND8002/D.

MARKING

DIAGRAMS*

KL01

ALYWG

SOIC−8

D SUFFIX

CASE 751

TSSOP−8

DT SUFFIX

CASE 948R

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

http://onsemi.com

KEL01

ALYW

DFN8

MN SUFFIX

CASE 506AA

2A M G

4M M G

HL01

ALYWG

HEL01

ALYW

(Note: Microdot may be in either location)

H = MC10

K = MC100

4M= MC10

2A = MC100

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

M= Date Code

G= Pb−Free Package

MC10EL01, MC100EL01

http://onsemi.com

PIN FUNCTION

D0−D3 ECL Data Inputs

Q, Q ECL Data Outputs

VCC Positive Supply

VEE Negative Supply

Table 1. PIN DESCRIPTION

EP (DFN8 only) Thermal exposed pad must be

connected to a sufficient thermal conduit. Elec-

trically connect to the most negative supply

(GND) or leave unconnected, floating open.

Table 2. MAXIMUM RATINGS

Symbol Parameter Condition 1 Condition 2 Rating Unit

VCC PECL Mode Power Supply VEE = 0 V 8 V

VEE NECL Mode Power Supply VCC = 0 V −8 V

VIPECL Mode Input Voltage

NECL Mode Input Voltage

VEE = 0 V

VCC = 0 V

VI  VCC

VI  VEE

−6

Iout Output Current Continuous

Surge

100

TAOperating Temperature Range −40 to +85 °C

Tstg Storage Temperature Range −65 to +150 °C

qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

8 SOIC

190

130

°C/W

qJC Thermal Resistance (Junction−to−Case) Standard Board 8 SOIC 41 to 44 °C/W

qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

8 TSSOP

185

140

°C/W

qJC Thermal Resistance (Junction−to−Case) Standard Board 8 TSSOP 41 to 44 ± 5% °C/W

qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

DFN8

129

°C/W

Tsol Wave Solder Pb

Pb−Free

<2 to 3 sec @ 248°C

<2 to 3 sec @ 260°C

265

°C

qJC Thermal Resistance (Junction−to−Case) (Note 1) DFN8 35 to 40 °C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)

MC10EL01, MC100EL01

http://onsemi.com

Table 3. 10EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 2)

−40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE Power Supply Current 14 17 14 17 14 17 mA

VOH Output HIGH Voltage (Note 3) 3920 4010 4110 4020 4105 4190 4090 4185 4280 mV

VOL Output LOW Voltage (Note 3) 3050 3200 3350 3050 3210 3370 3050 3227 3405 mV

VIH Input HIGH Voltage 3770 4110 3870 4190 3940 4280 mV

VIL Input LOW Voltage 3050 3500 3050 3520 3050 3555 mV

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current 0.5 0.5 0.3 mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V.

3. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.

Table 4. 10EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 4)

−40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE Power Supply Current 14 17 14 17 14 17 mA

VOH Output HIGH Voltage (Note 5) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV

VOL Output LOW Voltage (Note 5) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV

VIH Input HIGH Voltage −1230 −890 −1130 −810 −1060 −720 mV

VIL Input LOW Voltage −1950 −1500 −1950 −1480 −1950 −1445 mV

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current 0.5 0.5 0.3 mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

4. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V.

5. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.

MC10EL01, MC100EL01

http://onsemi.com

Table 5. 100EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 6)

−40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE Power Supply Current 14 17 14 17 16 20 mA

VOH Output HIGH Voltage (Note 7) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV

VOL Output LOW Voltage (Note 7) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV

VIH Input HIGH Voltage 3835 4120 3835 4120 3835 4120 mV

VIL Input LOW Voltage 3190 3525 3190 3525 3190 3525 mV

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current 0.5 0.5 0.5 mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

6. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.

7. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.

Table 6. 100EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 8)

−40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE Power Supply Current 14 17 14 17 16 20 mA

VOH Output HIGH Voltage (Note 9) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV

VOL Output LOW Voltage (Note 9) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV

VIH Input HIGH Voltage −1165 −880 −1165 −880 −1165 −880 mV

VIL Input LOW Voltage −1810 −1475 −1810 −1475 −1810 −1475 mV

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current 0.5 0.5 0.5 mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.

9. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.

Table 7. AC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −5.0 V (Note 10)

−40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

fMAX Maximum Toggle Frequency TBD TBD TBD GHz

tPLH

tPHL Propagation Delay to Output 70 220 370 130 230 330 150 250 350 ps

tJITTER Cycle−to−Cycle Jitter TBD TBD TBD ps

tfOutput Rise/Fall Times Q (20% − 80%) 100 225 350 100 225 350 100 225 350 ps

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

10.10 Series: VEE can vary +0.25 V / −0.5 V.

100 Series: VEE can vary +0.8 V / −0.5 V.

MC10EL01, MC100EL01

http://onsemi.com

Figure 2. Typical Termination for Output Driver and Device Evaluation

(See Application Note AND8020/D − Termination of ECL Logic Devices.)

Driver

Device

Receiver

Device

Q D

Zo = 50 W

50 W50 W

VTT

VTT = VCC − 3.0 V

ORDERING INFORMATION

Device Package Shipping†

MC10EL01D SOIC−898 Units / Rail

MC10EL01DG SOIC−8

(Pb−Free)

98 Units / Rail

MC10EL01DR2 SOIC−82500 / Tape & Reel

MC10EL01DR2G SOIC−8

(Pb−Free)

2500 / Tape & Reel

MC10EL01DT TSSOP−8 100 Units / Rail

MC10EL01DTG TSSOP−8

(Pb−Free)

100 Units / Rail

MC10EL01DTR2 TSSOP−82500 / Tape & Reel

MC10EL01DTR2G TSSOP−8

(Pb−Free)

2500 / Tape & Reel

MC10EL01MNR4 DFN8 1000 / Tape & Reel

MC10EL01MNR4G DFN8

(Pb−Free)

1000 / Tape & Reel

MC100EL01D SOIC−898 Units / Rail

MC100EL01DG SOIC−8

(Pb−Free)

98 Units / Rail

MC100EL01DR2 SOIC−82500 / Tape & Reel

MC100EL01DR2G SOIC−8

(Pb−Free)

2500 / Tape & Reel

MC100EL01DT TSSOP−8 100 Units / Rail

MC100EL01DTG TSSOP−8

(Pb−Free)

100 Units / Rail

MC100EL01DTR2 TSSOP−82500 / Tape & Reel

MC100EL01DTR2G TSSOP−8

(Pb−Free)

2500 / Tape & Reel

MC100EL01MNR4 DFN8 1000 / Tape & Reel

MC100EL01MNR4G DFN8

(Pb−Free)

1000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MC10EL01, MC100EL01

http://onsemi.com

Resource Reference of Application Notes

AN1405/D −ECL Clock Distribution Techniques

AN1406/D −Designing with PECL (ECL at +5.0 V)

AN1503/D −ECLinPSt I/O SPiCE Modeling Kit

AN1504/D −Metastability and the ECLinPS Family

AN1568/D −Interfacing Between LVDS and ECL

AN1672/D −The ECL Translator Guide

AND8001/D −Odd Number Counters Design

AND8002/D −Marking and Date Codes

AND8020/D −Termination of ECL Logic Devices

AND8066/D −Interfacing with ECLinPS

AND8090/D −AC Characteristics of ECL Devices

MC10EL01, MC100EL01

http://onsemi.com

PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AH

SEATING

PLANE

X 45_

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

0.10 (0.004)

DIM

MIN MAX MIN MAX

INCHES

4.80 5.00 0.189 0.197

MILLIMETERS

B3.80 4.00 0.150 0.157

C1.35 1.75 0.053 0.069

D0.33 0.51 0.013 0.020

G1.27 BSC 0.050 BSC

H0.10 0.25 0.004 0.010

J0.19 0.25 0.007 0.010

K0.40 1.27 0.016 0.050

M0 8 0 8

N0.25 0.50 0.010 0.020

S5.80 6.20 0.228 0.244

−X−

−Y−

0.25 (0.010)

−Z−

0.25 (0.010) ZSXS

____

1.52

0.060

7.0

0.275

0.6

0.024

1.270

0.050

4.0

0.155

ǒmm

inchesǓ

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

MC10EL01, MC100EL01

http://onsemi.com

PACKAGE DIMENSIONS

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A2.90 3.10 0.114 0.122

B2.90 3.10 0.114 0.122

C0.80 1.10 0.031 0.043

D0.05 0.15 0.002 0.006

F0.40 0.70 0.016 0.028

G0.65 BSC 0.026 BSC

L4.90 BSC 0.193 BSC

M0 6 0 6

____

SEATING

PLANE

PIN 1

DETAIL E

2X L/2

−U−

U0.15 (0.006) T

0.10 (0.004) V S

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

8x REFK

IDENT

K0.25 0.40 0.010 0.016

TSSOP−8

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948R−02

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

5. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

6. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE -W-.

MC10EL01, MC100EL01

http://onsemi.com

PACKAGE DIMENSIONS

DFN8

CASE 506AA−01

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994 .

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

ÇÇÇÇ

C0.10

PIN ONE

2 X

REFERENCE

2 X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

(A3)

C0.10

C0.08

8 X

SEATING

PLANE

e/2 e

8 X

NOTE 3

b8 X 0.10 C

0.05 C

ABB

DIM MIN MAX

MILLIMETERS

A0.80 1.00

A1 0.00 0.05

A3 0.20 REF

b0.20 0.30

D2.00 BSC

D2 1.10 1.30

E2.00 BSC

E2 0.70 0.90

e0.50 BSC

K0.20 −−−

L0.25 0.35

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

MC10EL01/D

ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loca

Sales Representative