APA2120/2121 Stereo 2-W Audio Power Amplifier (with DC_Volume Control) General Description Features * * Low Operating Current with 14mA APA2120/1 is a monolithic integrated circuit, which pro- Improved Depop Circuitry to Eliminate Turn-on vides precise DC volume control, and a stereo bridged audio power amplifiers is capable of producing 2.7W(2. and Turn-off Transients in Outputs * * 0W) into 3 with less than 10% (1.0%)THD+N. The attenuator range of the volume control in APA2120/1 is from High PSRR 32 Steps Volume Adjustable by DC Voltage with 20dB (DC_Vol=0V) to -80dB (DC_Vol=3.54V) with 32 steps. The advantage of internal gain setting can be less Hysteresis * 2W Per Channel Output Power into 4 Load at components and PCB area. Both of the depop circuitry and the thermal shutdown protection circuitry are inte- 5V, BTL Mode * Two Output Modes Allowable with BTL and SE grated in APA2120/1 and reduce pops and clicks noise during power up or shutdown mode operation. It also Modes Selected by SE/BTL Pin * Low Current Consumption in Shutdown Mode improves the power off pop noise and protects the chip from being destroyed by over temperature and short cur- (50A) * * * Short Circuit Protection rent failure. To simplify the audio system design, APA2120/ 1 combines a stereo bridge-tied loads (BTL) mode for Power off Depop Circuit Integration speaker drive and a stereo single-end (SE) mode for headphone drive into a single chip, where both modes are TSSOP-24P with or without Thermal Pad Package * easily switched by the SE/BTL input control pin signal. Besides, the multiple input selection is used for portable Lead Free and Green Devices Available (RoHS Compliant) audio system. Applications * * NoteBook PC LCD Monitor or TV Ordering and Marking Information Package Code R : TSSOP-24P Operating Ambient Temperature Range I : - 40 to 85 oC Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APA2120/1 Assembly Material Handling Code Temperature Range Package Code APA2120/1 R : APA2120/1 XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.2 - Oct., 2008 1 www.anpec.com.tw APA2120/2121 Pin Configuration GND PCBEN VOLUME LOUT+ LLINEIN LHPIN PVDD RBYPASS 1 2 3 4 5 6 7 8 LOUTLBYPASS BYPASS GND 9 24 23 22 21 20 19 18 17 16 10 11 12 15 14 13 APA2120 TOP View GND RLINEIN SHUTDOWN ROUT+ RHPIN VDD PVDD CLK GND HP/LINE VOLUME LOUT+ LLINEIN LHPIN PVDD RBYPASS 1 2 3 4 5 6 7 8 ROUTSE/BTL PC-BEEP GND LOUTLBYPASS BYPASS GND 9 10 11 12 APA2121 TOP View 24 23 22 21 20 19 18 17 16 GND RLINEIN SHUTDOWN ROUT+ RHPIN VDD PVDD CLK ROUTSE/BTL PC-BEEP GND 15 14 13 Thermal Pad APA2120 APA2121 Multiple Input Selection SE/BTL HP/LINE PCBEEP Control Input PCBEN - APA2120/1 Bottom View Absolute Maximum Ratings (Note 1) (Over operating free-air temperature range unless otherwise noted.) Symbol VDD Parameter Supply Voltage Range VIN Input Voltage Range, SE/BTL, HP/LINE, SHUTDOWN, PCBEN TA Operating Ambient Temperature Range TJ Maximum Junction Temperature TSTG Storage Temperature Range TS Maximum Lead Soldering Temperature,10 Seconds PD Power Dissipation Rating Unit -0.3 to 6 V -0.3 to VDD+0.3 V -40 to 85 C Intermal Limited(Note 1) C -65 to +150 C 260 C Intermal Limited Note 1: APA2120/1 integrated internal thermal shutdown protection when junction temperature ramp up to 150C Copyright ANPEC Electronics Corp. Rev. A.2 - Oct., 2008 2 www.anpec.com.tw APA2120/2121 Recommended Operating Conditions Symbol Parameter VDD Supply Voltage VIH High Level Threshold Voltage VIL Low Level Threshold Voltage VICM Common Mode Input Voltage Range Unit 4.5 ~ 5.5 V SHUTDOWN, PCBEN 2~ SE/BTL , HP/LINE 4~ SHUTDOWN, PCBEN ~ 1.0 SE/BTL , HP/LINE V V ~3 VDD-1.0 ~ V Typical Value Unit 45 C/W Thermal Characteristics Symbol JA Parameter Thermal Resistance from Junction to Ambient in Free Air (Note 2) TSSOP-24P Note 2 : 5 in2 printed circuit board with 2oz trace and copper pad through 9 25mil diameter vias. The thermal pad on the TSSOP_P package with solder on the printed circuit board. Electrical Characteristics VDD=5V, -20C 2KV, VMM > 200V 10ms, 1tr > 100mA www.anpec.com.tw APA2120/2121 Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly Pb-Free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 217C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Note: All temperatures refer to topside of the package. Measured on the body surface. Table 1. SnPb Eutectic Process - Package Peak Reflow Temperatures 3 3 Volume mm 350 225 +0/-5C 225 +0/-5C Volume mm <350 240 +0/-5C 225 +0/-5C Package Thickness <2.5 mm 2.5 mm Table 2. Pb-free Process - Package Classification Reflow Temperatures 3 3 3 Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Package Thickness Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.2 - Oct., 2008 26 www.anpec.com.tw