THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 1 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
NOTES:
1. MATERIALS: HOUSING: LCP, UL94V-0, BLACK
CONTACTS: HIGH PERFORMANCE COPPER ALLOY
2. FINISH: 0.76 µm MIN SELECT GOLD IN CONTACT AREA,
SELECT MATTE TIN IN TAIL AREA, OVERALL NICKEL.
3. PRODUCT SPECIFICATION: PS-171446-0001
4. PACKAGING SPECIFICATION: PK-70873-6002
5. MATES WITH SPEEDSTACK PLUGS: 171446 & 171810
6. APPLICATION SPECIFICATION: AS-171450-9999
7. COSMETIC SPECIFICATION: PS-45499-002 CLASS B
8. PART STATUS: CONTACT MOLEX
9. DIM D ON THIS DRAWING PLUS DIM D ON DRAWING # SD-171446-1000
EQUALS THE SYSTEM MATED STACK HEIGHT
10. PARTS SHIPPED WITH PICK AND PLACE COVERS.
PART NUMBER CKT SIZE DIFF PAIRS SPARE CKTS DIM A DIM B DIM C DIM E DIM D
22 6 2 13.6 12.40 11.90 11.0
171450-5102 4.10
60 16 8 28.8 27.60 27.10 26.2
171450-5106 4.10
82 22 10 41.6 40.40 39.90 11.0/
26.2
171450-5114 4.10 6.95.6
DIM E
DIM A
DIM C
DIM B
0.10
SOLDER TAIL
COPLANARITY
3.6
2X
0.5
DIM D
SEE NOTE 9
1.3
1.5
0.75
0.8
2X0.80
3.96
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 2 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
171450-5114
SHOWN
171450-5106
SHOWN
171450-5102
SHOWN
(WITHOUT
COVER)
MEZZANINE (PLUG & RECEPTACLE) STACKING CHART
RECEPTACLE
OPTIONS
PLUG OPTIONS (1mm WIPE) PLUG OPTIONS (2mm WIPE)
HEIGHT 1mm 2mm 3mm 4mm 1mm 2mm 3mm 4mm
22 CKT 171446-1101 171446-1102 171446-1103 171446-1104 171446-1105 171446-1106 171446-1107 171446-1108
60 CKT 171446-1109 171446-1110 171446-1111 171446-1112 171446-1113 171446-1114 171446-1115 171446-1116
5/1 6/1 7/1 8/1 5/2 6/2 7/2 8/2
22 CKT 171450-5102
4mm
60 CKT 171450-5106
82 CKT 171450-5114
CIRCUITS MOLEX P/N HEIGHT STACK HEIGHT (DIM E)/WIPE (DIM F)
EDGE CARD APPLICATION
WIPE
2.0
0.3
DIM E
STACK HEIGHT
DIM F
WIPE
MEZZANINE APPLICATION
(PLUG & RECEPTACLE)
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 3 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
7.76 6.06
3.03
2X1.98
0.85
2X
8.00
4X
4.00
PITCH
0.80
22X
0.05 ABC
0.45
0.02
3.05
22X
0.05 ABC
1.10
0.02
0.05 ABC
UNPLATED, 2X
1.05
0.05
PTH, 2X
0.05 ABC
1.15 DRILL
1.35 PAD
SEE NOTE 2
1.00
0.05
KEEP-OUT ZONE
14.10
12.40
11.90
PCB LAYOUT (COMPONENT SIDE)
NOTES:
1. PIN NUMBERING IS FOR REFERENCE ONLY.
OTHER PIN NUMBERS WILL NOT AFFECT THE
OPERATION OF THE CONNECTOR.
2. RETENTION NAIL MUST BE SOLDERED ONTO THE
PCB FOR PROPER CONNECTOR FUNCTION.
SOLDER PASTE THICKNESS: 0.15 MIN
DATUM IS THE BOTTOM SURFACE OF THE PCBA
GGGGE
S
S
S
S
S
S
PIN 1 PIN 11
PIN 22
PIN 12
EGGGG
S
S
S
S
S
S
PCB LAYOUT - 22 CKT
BC
PINOUT LEGEND
E = EXTRA
G = GROUND
S = SIGNAL
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 4 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
2X
23.20
4X
11.60
PITCH
0.80 3.05
60X
0.05 ABC
1.10
0.02
0.05 ABC
UNPLATED, 2X
1.05
0.05
PTH 2X
0.05 ABC
1.15 DRILL
1.35 PAD
SEE NOTE 2
1.00
0.05
KEEP-OUT
ZONE
29.30
60X
0.05 ABC
0.45
0.02
7.76 6.06
2X
1.98
3.03
0.85
27.60
27.10
C
B
NOTES:
1. PIN NUMBERING IS FOR REFERENCE ONLY.
OTHER PIN NUMBERS WILL NOT AFFECT THE
OPERATION OF THE CONNECTOR.
2. RETENTION NAIL MUST BE SOLDERED ONTO THE
PCB FOR PROPER CONNECTOR FUNCTION.
PCB LAYOUT (COMPONENT SIDE)
SOLDER PASTE THICKNESS: 0.15 MIN
DATUM IS THE BOTTOM SURFACE OF THE PCBA
PINOUT LEGEND
E = EXTRA
G = GROUND
S = SIGNAL
PIN 1
PIN 30
PIN 60
PIN 31
GGGGGGGGGG
GGGGGGGGGGS
S
S
S
S
S
SS
EEE
SS
S
S
S
S
SS
S S SSSSSSE E ESSSSSSSSE
PCB LAYOUT - 60 CKT
E
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
6:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 5 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
NOTES:
1. PIN NUMBERING IS FOR REFERENCE ONLY.
OTHER PIN NUMBERS WILL NOT AFFECT THE
OPERATION OF THE CONNECTOR.
2. RETENTION NAIL MUST BE SOLDERED ONTO THE
PCB FOR PROPER CONNECTOR FUNCTION.
PCB LAYOUT - 82 CKT
PINOUT LEGEND
E = EXTRA
G = GROUND
S = SIGNAL
7.76 6.06
3.03
2X
1.98
0.85 1.95
40.40
39.90
42.10
2.20
2X
36.00
2X
12.80
2X
23.20
2X
8.00
4X
4.00
0.05 ABC
0.45
0.02
PITCH
0.80
PIN 1 PIN 11
PIN 12
PIN 52
PIN 42
4X
11.60
B
C
0.05 ABC
1.10
0.02
3.05
0.05 ABC
NPTH, 2X
1.05
0.05
KEEP-OUT
ZONE
PTH, 2X
1.15 DRILL
1.35 PAD
SEE NOTE 2
1.00
0.05
0.05 ABC
PIN 41
PIN 82
SOLDER PASTE THICKNESS: 0.15 MIN
DATUM IS THE BOTTOM SURFACE OF THE PCB
PCB LAYOUT (COMPONENT SIDE)
A
GGGGGGGGGGGGGG
SSSSSSSSEESSSSSS
ES
S
ES S SSSSE
E
GGGGGGGGGGGGGGE
SSSSSSSSSSSSS S EEESSSSSSSS
PIN 53
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
7:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 6 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
EDGECARD LAYOUT - 22 CKT
NOTES:
1. PIN NUMBERING IS FOR REFERENCE ONLY. OTHER PIN NUMBERS WILL
NOT AFFECT THE OPERATION OF THE CONNECTOR.
2. EDGE CARD SHOULDERS STOP ON RECEPTACLE SHOULDERS. EDGE
CARD BOTTOM DOES NOT CONTACT RECEPTACLE PCB.
3. PAD SET BACK FROM CHAMFER ENOUGH TO ACCOMMODATE LARGEST
CHAMFER WITHOUT DAMAGE TO PAD EDGE.
4. CHAMFER DEPTH SHOULD BE AS LARGE AS PRACTICAL TO ENSURE
CORRECT MATING TO THE RECEPTACLE.
5. ALL CHAMFERED EDGES SHOULD BE ROUNDED WHERE POSSIBLE.
6. INTERNAL PLATING BRIDGES ARE PREFERRED TO ELIMINATE PAD STUB.
22X
0.05 AB
1.60
0.02
22X
0.05 AB
0.94
0.02
0.75 CHAMFER
2X
PIN 12 PIN 22
2.37
1.00
2X
3.86
0.05
B2X
10.80
0.05
C
44X
0.05 AC
0.55
0.02
0.00
0.04
0.76
1.60
2.44
3.16
4.00
0.80
1.64
2.36
3.20
4.00
FRONT SIDE
DATUM IS THE OPPOSITE
SIDE OF THE PCB
A
PIN 1 PIN 11
GSS S SSSGE
G
G
GGGG
SS
SS
S
S
E
MAX PAD STUB
SEE NOTE 6
0.25
MIN13.60
0.00 0.04
0.80
1.64
2.36
3.20
4.00
0.76
1.60
2.44
3.16
4.00
BACK SIDE
DATUM IS THE OPPOSITE
SIDE OF THE PCB
A
PINOUT LEGEND
E = EXTRA
G = GROUND
S = SIGNAL
10%
1.57
OVER CONTACT PADS
BOTH SIDES
CHAMFER
SEE NOTE 4
0.75 SEE NOTE 4
BOTH SIDES
CHAMFER
0.53
BOTH SIDES
CHAMFER
35
5
SEE NOTE 4
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
7:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 7 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
NOTES:
1. PIN NUMBERING IS FOR REFERENCE ONLY. OTHER PIN NUMBERS WILL
NOT AFFECT THE OPERATION OF THE CONNECTOR.
2. EDGE CARD SHOULDERS STOP ON RECEPTACLE SHOULDERS. EDGE
CARD BOTTOM DOES NOT CONTACT RECEPTACLE PCB.
3. PAD SET BACK FROM CHAMFER ENOUGH TO ACCOMMODATE LARGEST
CHAMFER WITHOUT DAMAGE TO PAD EDGE.
4. CHAMFER DEPTH SHOULD BE AS LARGE AS PRACTICAL TO ENSURE
CORRECT MATING TO THE RECEPTACLE.
5. ALL CHAMFERED EDGES SHOULD BE ROUNDED WHERE POSSIBLE.
6. INTERNAL PLATING BRIDGES ARE PREFERRED TO ELIMINATE PAD STUB.
EDGECARD LAYOUT - 60 CKT
60X
0.05 AB
1.60
0.02
60X
0.05 AB
0.94
0.02
26.00
0.05
C
MAX PAD STUB
SEE NOTE 6
0.25 120X
0.05 AC
0.55
0.02
PIN 31 PIN 60
1.00
2.37
2X
3.86
0.05
B2X
0.00
0.40
0.40
1.20
2.00
2.84
3.56
4.40
5.24
5.96
6.80
7.64
8.36
9.20
10.04
10.76
11.60
1.20
2.04
2.76
3.60
4.44
5.16
6.00
6.84
7.56
8.40
9.24
9.96
10.80
11.60
DATUM IS THE OPPOSITE
SIDE OF THE PCB
FRONT SIDE
A
EGGGGGGGGGG
SS
S
S
S
S
SS
S
S
S
S
S
S
SS EEE
10%
OVER CONTACT PADS
1.57
CHAMFER
BOTH SIDES
35
5
SEE NOTE 4
SEE NOTE 4
BOTH SIDES
CHAMFER
0.53
BOTH SIDES
CHAMFER
SEE NOTE 4
0.75
PINOUT LEGEND
E = EXTRA
G = GROUND
S = SIGNAL
4X
0.50R
2X0.30R
PIN 1
0.75 CHAMFER 2X
PIN 30
MIN28.80
GSSGGGGGGGGGE
S
S
S
S
SS
SS
EE
E
SS
S
SSS
0.00 0.40
1.20
0.40
1.20
2.04
2.76
3.60
4.44
5.16
6.00
6.84
7.56
8.40
9.24
9.96
10.80
11.60
2.00
2.84
3.56
4.40
5.24
5.96
6.80
7.64
8.36
9.20
10.04
10.76
11.60
DATUM IS THE OPPOSITE
SIDE OF THE PCB
A
BACK SIDE
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
6:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
0.5 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.13
1 PLACE
±
0.25
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SPEEDSTACK
RECEPTACLE ASSEMBLY SALES DRAWING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-171450-5000
PSD
001
A1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE CHART GENERAL MARKET 8 OF 8
CURRENT REV DESC: MIGRATED TO NX
EC NO: 608773
DRWN:
TMARRI
2018/11/15
CHK'D:
DMCGOWAN
2018/12/10
APPR:
DMCGOWAN
2018/12/10
INITIAL REVISION:
DRWN:
JBINGHAM
2016/08/25
APPR:
JBINGHAM
2016/09/07
THIRD ANGLE PROJECTION
DRAWING SERIES
B-SIZE
171450
FORMAT: master-tb-prod-B
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/12/10 20:12:30
EDGECARD LAYOUT - 82 CKT
NOTES:
1. PIN NUMBERING IS FOR REFERENCE ONLY. OTHER PIN NUMBERS WILL
NOT AFFECT THE OPERATION OF THE CONNECTOR.
2. EDGE CARD SHOULDERS STOP ON RECEPTACLE SHOULDERS. EDGE
CARD BOTTOM DOES NOT CONTACT RECEPTACLE PCB.
3. PAD SET BACK FROM CHAMFER ENOUGH TO ACCOMMODATE LARGEST
CHAMFER WITHOUT DAMAGE TO PAD EDGE.
4. CHAMFER DEPTH SHOULD BE AS LARGE AS PRACTICAL TO ENSURE
CORRECT MATING TO THE RECEPTACLE.
5. ALL CHAMFERED EDGES SHOULD BE ROUNDED WHERE POSSIBLE.
6. INTERNAL PLATING BRIDGES ARE PREFERRED TO ELIMINATE PAD STUB.
0.00
2.40
3.20
4.04
4.76
5.60
6.44
7.16
8.00
8.84
9.56
10.40
11.24
11.96
12.80
13.60
14.40
15.20
16.00
16.84
17.56
18.40
19.24
19.96
20.80
21.64
22.36
23.20
24.04
24.76
25.60
2.40
3.24
3.96
4.80
5.64
6.36
7.20
8.04
8.76
9.60
10.40
MIN41.60
PIN 52 PIN 53
2.00
0.05
C
164X
0.05 AC
0.55
0.02
0.05 AB
82X
1.60
0.02
0.05 AB
82X
0.94
0.02
3X3.86
0.05
PIN 42 PIN 82
1.00
2.37
8X
0.50R
MAX PAD STUB
SEE NOTE 6
0.25
26.00
0.10
10.80
0.10
B
GGGGGGGGGGGGGG
S
S
S
S
S
S
S
S
E
E
E
S
S
S
S
SS
S
S
E
E
G
G
G
GGGG G GGGGGGE
S
S
S
S
S
S
S
S
E
E
E
S
S
S
S
S
S
S
S
S
S
S
S
S
S
PIN 1
PINOUT LEGEND
E = EXTRA
G = GROUND
S = SIGNAL
0.00
2.40
3.20
4.04
4.76
5.60
6.44
7.16
8.00
8.84
9.56
10.40
2.40
3.24
3.96
4.80
5.64
6.36
7.20
8.04
8.76
9.60
10.44
11.16
12.00
12.80
13.60
14.40
15.20
16.04
16.76
17.60
18.44
19.16
20.00
20.84
21.56
22.40
23.24
23.96
24.80
25.60
0.75 X 45
CHAMFER, 4X
PIN 41
4X
0.30R
DATUM IS THE OPPOSITE
SIDE OF THE PCB
A
FRONT SIDE
ESSSSSS
DATUM IS THE OPPOSITE
SIDE OF THE PCB
A
BACK SIDE
10%
OVER CONTACT PADS
1.57
SEE
NOTE 4
BOTH SIDES
35
5
BOTH SIDES
SEE NOTE 4
0.53
BOTH SIDES
SEE NOTE 4
0.75
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E