SPPH2 1mm-travel Compact-sized Vertical Type 1mm short travel Detector Typical Specifications Items Specifications Ratingmax. / min. Resistive load Contact resistance Initial/ After operating life Slide 0.1A 12V DC / 50BA 3V DC 30m max. / 50m max. Operating force 21N Push Without load 10,000 cycles Operating life With load 10,000 cycles0.1A 12V DC Rotary Product Line Travel Total travel mm mm Mounting method Poles Knob style Operation Terminal type Minimum order unitpcs. Japan Export SPPH210100 Latching Straight Latching 1.5 PC board 2 100 Momentary Snap-in 10,000 SPPH260100 2 SPPH230500 1 Latching SPPH240100 Momentary SPPH240300 Short 1 3 Horizontal Type Packing Specifications Bulk Number of packagespcs. Dual-in-line Package Type Standard 1 Drawing No. SPPH210500 Momentary Non shorting Product No. Power Changeover timing 1 case / export packing Export package measurements mm 2,000 10,000 400x270x290 Vertical Type 1 case / Japan Refer to P.138 for soldering conditions. 127 SPPH2 1mm-travel Compact-sized Vertical Type Unit:mm No. PC board mounting hole dimensions Viewed from the direction A Style A 2.5 1.8 R0 .5 1 2 Push 2.3 o0.9 hole 2.5 2.5 Snap-in terminal (3.5) 6.5 Rotary 2.5 1 1.8 12.5 (1.5) Total travel 2.5 2- 0.7 6 .5 3.5 4.4 R0 (0.2) 2- Straight terminal Travel 6 3.5 3.5 1.5 Slide 6 1 Detector Dimensions o0.9 hole 0.5 Power 0.35 Terminal No.1 2.5 2.5 3.5 Thickness of PC board t=1.6mm Snap-in terminal A 6 Travel 2.5 2.5 1.8 2- R0 0.7 .5 2.3 Total travel 1.8 (3.5) 1 2 (1.5) 1 .5 o0.9 hole 2.5 2.5 Thickness of PC board t=1.6mm 3.5 3.65 6.5 Horizontal Type 12.5 6 2 4.4 R0 (0.2) 2- 1.5 Dual-in-line Package Type 6 3.5 2.5 2.5 6.5 Terminal No.1 0.35 Vertical Type 0.5 2.5 2.5 3.5 6.5 Snap-in terminal A 6 Travel 6 2.5 Total travel 4.4 (3.5) 1 2.3 6.5 2.5 3 9.5 3 (1.5) 0.7 2.5 .5 1.5 R0 (0.2) 2- 3.5 o0.9 hole 2.5 3.5 2.5 Thickness of PC board t=1.6mm Terminal No.1 0.35 0.5 3.5 2.5 2.5 6.5 0.35 3 2 1 128 4.6 t=0.5 (3.5) 2.8 R1 3.5 3.5 t=0.5 0.8 Unit:mm Snap-in terminal 1.9 6 5 4 Terminal Configuration Straight terminal (3.5) Circuit DiagramViewed from Direction A Push Switches List of Varieties Vertical Detector Series SPEH SPEG SPEJ SPPH2 SPPH4 SPPH1 W 6 7.19 7 6 6.5 10 D 6 8.39 7 6.5 8.5 10 H 5 3.5 5.95 6.5 Travelmm -- -- 1.7 1 2.2 1.5 Total travelmm 1.6 1.1 1.7 1.5 3 2.5 Number of poles 1 1 2 2 Operating temperature range -40 to 90 -10 to 60 -40 to 85 -10 to 60 Automotive use -- -- Ratingmax. Resistive load 50mA 16V DC 1mA 5V DC 0.2A 14V DC 0.1A 12V DC Ratingmin. Resistive load 10A 1V DC 50A 3V DC -- Operating life without load 100,000 cycles 400m max. 30,000 cycles 500m max. 10,000 cycles 150m max. 10,000 cycles 50m max. 10,000 cycles 100m max. 10,000 cycles 40m max. Operating life with load at max. rated load 100,000 cycles 400m max. 30,000 cycles 500m max. 10,000 cycles 150m max. 10,000 cycles 50m max. 10,000 cycles 100m max. 10,000 cycles 40m max. Initial contact resistance 200m max. 200m max. 150m max. 30m max. 100m max. 20m max. Insulation resistance 100M min. 100V DC 3M min. 100V DC 100M min. 500V DC 100M min. 500V DC Voltage proof 250V AC for 1minute 100V AC for 1minute 500V AC for 1minute 500V AC for 1minute Terminal strength -- 0.5N for 1minute -- 5N for 1minute Photo Slide Dimensions mm Push 8.5 Rotary Power -- Dual-in-line Package Type Life cycle Durability Horizontal Type Vertical Type Electrical performance Mechanical Operating performance Actuator direction strength Pulling direction Environmental performance 50N 0.1A 30V DC 50A 3V DC 49N 30N -- -- -- Cold -40 1,000h -20 96h -40 500h -20 96h Dry heat 90 1,000h 85 96h 85 500h 85 96h Damp heat 60, 90 to 95% RH 1,000h 40, 90 to 95% RH 96h 60, 90 to 95% RH 500h 40, 90 to 95%RH 96h 124 125 126 Page -- 50N 127 10N 129 -- 130 Push Switches Soldering Conditions 138 Push Switches Cautions 139 Note Indicates applicability to all products in the series. 114 Push Switches Soldering Conditions Detector Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile Push Temperature (C ) Slide 300 A max. B 200 D E 100 Rotary Room temperature Time (s) Pre-heating F max. C Power Dual-in-line Package Type SeriesReflow type A 3s max. B Cs D E Fs 260 230 40 180 150 120 SPEG SPEJ SPEF SPEH Horizontal Type Notes 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Vertical Type Reference for Hand Soldering Series Soldering temperature Soldering time SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 35010 3+1/0s SPED2, SPED4 35010 30.5s SPEJ 35010 4s max. SPEG, SPEF 3505 3s max. SPEH, SPPH2 350 max. 3s max. SPUJ 30010 3+1/0s Reference for Dip Soldering (For PC board terminal types) Series 138 For PC board Items Dip soldering Preheating temperature Preheating time Soldering temperature Duration of immersion SPPJ3 100 max. 60s max. 2605 51s SPUN 100 max. 60s max. 2605 101s SPUJ, SPPH2, SPPH4 -- 2605 51s SPPJ2, SPPH1, SPED2, SPED4, SPEF -- 2605 101s