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DATA SHEET
SKY67021-396LF: 0.6-1.2 GHz High Linearity, Active Bias
Low-Noise Amplifier
Applications
GSM, CDMA, WCDMA, TD-SCDMA cellular infrastructure
Ultra low-noise systems
Balanced, single-ended low-noise amplifier designs
Features
Extended operating temperature range: 40 °C to +100 °C
Low Noise Figure: 0.6 dB @ 0.9 GHz
Excellent IIP3 performance: +22.5 dBm @ 0.9 GHz
Gain: 17.5 dB @ 0.9 GHz
Adjustable supply current
Integrated enable circuitry
Temperature and process-stable active bias
Miniature DFN (8-pin, 2 x 2 mm) package (MSL1 @ 260 °C per
JEDEC J-STD-020)
Figure 2. SKY67021-396LF Pinout – 8-Pin DFN
(Top View)
Figure 1. SKY67021-396LF Block Diagram
Description
The SKY67021-396LF is GaAs, pHEMT Low-Noise Amplifier (LNA)
with an active bias and high linearity performance. The advanced
GaAs pHEMT enhancement mode process provides good return
loss, low noise, and high linearity performance.
The internal active bias circuitry provides stable performance over
temperature and process variation. The device offers the ability to
externally adjust supply current and gain. Supply voltage is
applied to the RFOUT/VDD pin through an RF choke inductor. Pin 3
(VBIAS) should be connected to RFOUT/VDD through an external
resistor to control the supply current. The RFIN and RFOUT/VDD
pins should be DC blocked to ensure proper operation.
The SKY67021-396LF operates in the frequency range of 0.6 to
1.2 GHz. For higher frequency operation, the pin-compatible
SKY67022-396LF or SKY67023-396LF should be used.
The LNA is manufactured in a compact, 2 x 2 mm, 8-pin Dual Flat
No-Lead (DFN) package. A functional block diagram is shown in
Figure 1. The pin configuration and package are shown in
Figure 2. Signal pin assignments and functional pin descriptions
are provided in Table 1.
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Table 1. SKY67021-396LF Signal Descriptions
Pin # Name Description Pin # Name Description
1 N/C No connection. May be connected to ground
with no change in performance.
5 N/C No connection. May be connected to ground
with no change in performance.
2 RFIN RF input. DC blocking capacitor required. 6 ENABLE Enable pin. Active “low” (0 V) = amplifier on
state.
3 VBIAS Bias for 1st stage amplifier. External resistor
sets current consumption.
7 RFOUT/VDD RF output. Apply VDD through RF choke
inductor. DC blocking capacitor required.
4 N/C No connection. May be connected to ground
with no change in performance.
8 N/C No connection. May be connected to ground
with no change in performance.
Table 2. SKY67021-396LF Absolute Maximum Ratings
Parameter Symbol Minimum Typical Maximum Units
Supply voltage VDD 5.0 5.5 V
RF input power PIN +20 dBm
Channel temperature TCH +150 °C
Thermal resistance ΘJC 56.4 °C/W
Storage temperature TSTG 65 +25 +150 °C
Operating temperature TA 55 +25 +100 °C
Electrostatic Discharge:
Charged Device Model (CDM), Class 4
Human Body Model (HBM), Class 1A
Machine Model (MM), Class A
ESD
1000
250
30
V
V
V
Notes: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Thermal resistance = 56.4 °C/W @ 5 V bias.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY67021-396LF are
provided in Table 2. Electrical specifications are provided in
Table 3.
Typical performance characteristics of the SKY67021-396LF are
illustrated in Figures 3 through 28.
Table 4 provides noise source pull information versus frequency.
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Table 3. SKY67021-396LF Electrical Specifications (Note 1, 2)
(VDD = 5 V, IDD = 100 mA, TA = +25 °C, PIN = –20 dBm, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
RF Specifications
Noise Figure (Note 3) NF @ 0.9 GHz 0.60 0.75 dB
Small signal gain |S21| @ 0.9 GHz 16.5 17.5 18.5 dB
Input return loss |S11| @ 0.9 GHz 11.0 12.5 dB
Output return loss |S22| @ 0.9 GHz 8.0 9.5 dB
Reverse isolation |S12| @ 0.9 GHz 27 29 dB
3rd Order Input Intercept Point IIP3 @ 0.9 GHz, Δf = 1 MHz,
PIN = –20 dBm/tone
+20.8 +22.5 dBm
3rd Order Output Intercept Point OIP3 @ 0.9 GHz, Δf = 1 MHz,
PIN = –20 dBm/tone
+38.3 +40.0 dBm
1 dB Input Compression Point IP1dB @ 0.9 GHz +3.4 +5.2 dBm
1 dB Output Compression Point OP1dB @ 0.9 GHz +20.0 +21.7 dBm
Stability (Note 4) μ, μ1 Up to 18 GHz,
40 °C to +85 °C
> 1
DC Specifications
Supply voltage VDD 5.0 V
Quiescent supply current IDD Set with external resistor 85 100 115 mA
Amplifier enable off current (logic “high”) IEN 700 900 1100 μA
Enable rise time TR @ 0.9 GHz 250 500 ns
Enable fall time TF @ 0.9 GHz 250 500 ns
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Circuit topology optimized for balanced configuration with best IIP3 and NF performance.
Note 3: Loss from the input SMA connector and Evaluation Board up to component M1 has not been de-embedded from the NF measurement.
Note 4: Applies to typical application circuit and components shown in Figure 31.
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Typical Performance Characteristics
(VDD = 5 V, IDD = 100 mA, TA = +25 °C, PIN = –20 dBm, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)
Figure 3. Broadband Gain Response vs Frequency Over
Temperature
Figure 5. Broadband Input Return Loss vs Frequency Over
Temperature
Figure 7. Broadband Reverse Isolation vs Frequency Over
Temperature
Figure 4. Narrowband Gain Response vs Frequency Over
Temperature
Figure 6. Narrowband Input Return Loss vs Frequency Over
Temperature
Figure 8. Narrowband Reverse Isolation vs Frequency Over
Temperature
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 9. Broadband Output Return Loss vs Frequency Over
Temperature
Figure 11. Noise Figure vs Frequency Over Temperature
Figure 13. IIP3 vs Input Power Over Temperature
@ 700 MHz (PIN = –20 dBm, Tone Spacing = 1 MHz)
Figure 10. Narrowband Output Return Loss vs Frequency Over
Temperature
Figure 12. IIP3 vs Input Power Over Temperature
@ 600 MHz (PIN = –20 dBm, Tone Spacing = 1 MHz)
Figure 14. IIP3 vs Input Power Over Temperature
@ 800 MHz (PIN = –20 dBm, Tone Spacing = 1 MHz)
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 15. IIP3 vs Input Power Over Temperature
@ 900 MHz (PIN = –20 dBm, Tone Spacing = 1 MHz)
Figure 17. IIP3 vs Input Power Over Temperature
@ 1200 MHz (PIN = –20 dBm, Tone Spacing = 1 MHz)
Figure 19. Gain vs Input Power Over Temperature
@ 600 MHz
Figure 16. IIP3 vs Input Power Over Temperature
@ 1000 MHz (PIN = –20 dBm, Tone Spacing = 1 MHz)
Figure 18. IIP3 vs Frequency Over Temperature
(PIN = –20 dBm, Tone Spacing = 1 MHz)
Figure 20. Gain vs Input Power Over Temperature
@ 700 MHz
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 21. Gain vs Input Power Over Temperature
@ 800 MHz
Figure 23. Gain vs Input Power Over Temperature
@ 1000 MHz
Figure 25. Stability Factor (μ) vs Frequency Over Temperature
Figure 22. Gain vs Input Power Over Temperature
@ 900 MHz
Figure 24. Gain vs Input Power Over Temperature
@ 1200 MHz
Figure 26. Stability Factor (μ1) vs Frequency Over Temperature
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 27. Load Pull, @ 5 V, 900 MHz, 100 mA
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Table 4. Noise Parameters vs Frequency @ 5.0 V and 100 mA
Frequency
(GHz)
Minimum Noise
Figure (FMIN)
(dB)
Noise Resistance
(RN)
(Ω)
Γopt Associated Gain
(dB)
Maximum Gain
(GMAX)
(dB)
Magnitude Phase
0.80 0.5571 0.0600 0.1286 129.21 18.8608 19.7254
0.84 0.3977 0.1264 0.1201 72.63 18.8469 19.3559
0.89 0.543 0.0414 0.1575 111.37 18.1270 18.9171
1.20 0.7077 0.0667 0.1636 107.57 15.8561 16.6599
1.42 0.8033 0.0777 0.1466 110.34 14.5550 15.4004
1.52 0.8732 0.0767 0.1751 130.29 13.8350 14.8953
1.76 1.0127 0.1047 0.1240 122.01 12.8532 13.8256
1.84 1.1337 0.1062 0.1113 147.04 12.3242 13.5113
1.92 1.1686 0.1132 0.1137 134.44 12.1251 13.2098
1.98 1.232 0.1021 0.1260 163.51 11.6427 12.9939
2.00 1.3361 0.2648 0.1212 74.78 12.1585 12.9206
2.38 1.5989 0.1143 0.1302 158.37 10.4524 11.7369
2.52 1.6619 0.1667 0.1109 156.50 10.1114 11.3724
2.60 1.7366 0.1817 0.0974 156.70 9.9104 11.1835
2.70 1.6845 0.1032 0.1529 165.66 9.2704 10.9525
3.00 2.1342 0.1874 0.0978 171.43 8.9475 10.3251
3.60 2.6314 0.2626 0.0816 172.61 6.9070 8.3274
4.00 2.9366 0.3237 0.1187 160.48 7.3181 8.8760
5.00 3.7549 0.4659 0.2157 156.72 6.3847 8.3182
6.00 4.5836 0.4105 0.3645 149.11 5.9685 8.3084
7.00 5.4265 0.7168 0.3627 157.54 5.3432 8.5428
Evaluation Board Description
The SKY67021-396LF Evaluation Board is used to test the
performance of the SKY67021-396LF LNA. An assembly drawing
for the Evaluation Board is shown in Figure 28. The layer detail is
provided in Figure 29. An Evaluation Board schematic diagram is
provided in Figure 30. Table 5 provides the Bill of Materials (BOM)
list for Evaluation Board components.
Package Dimensions
The PCB layout footprint for the SKY67021-396LF is provided in
Figure 31. Typical case markings are shown in Figure 32.
Package dimensions for the 8-pin DFN are shown in Figure 33,
and tape and reel dimensions are provided in Figure 34.
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
THE SKY67021-396LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 °C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 28. SKY67021-396LF Evaluation Board Assembly Diagram
Figure 29. Layer Detail Physical Characteristics
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 30. SKY67021-396LF Evaluation Board Schematic
Table 5. SKY67021-396LF Evaluation Board Bill of Materials
Component Type Size Value
(5 V @ 100 mA)
Manufacturer Part #
M1 Resistor 0402 0 Ω Panasonic ERJ-2GEOROOX
M2 DNI 0402
M3 Capacitor 0402 6 pF Murata GJM1555C1H6R0CB01
M4 Inductor 0402 12 nH Coilcraft 0402HP-12NX_GLU
M5 Capacitor 0402 68 pF Murata GRM1555C1H680JZ01
M6 DNI 0402
M7 Resistor 0402 3.6 kΩ Panasonic ERJ-2GEJ362X
M8 Capacitor 0402 0.1 μF Murata GRM155R71A104KA01
M9 Capacitor 0402 1000 pF Murata GRM1555C1H102JA01
M10 DNI 0402
M11 Inductor 0402 27 nH Murata LQG15HN27NJ02D
M12 Capacitor 0402 10 pF Murata GRM1555C1H100JZ01D
M13 Capacitor 0402 1000 pF Murata GRM1555C1H102JA01
M14 Resistor 0402 0 Ω Panasonic ERJ-2GEOROOX
M15 DNI 0402
M16 Inductor 0402 4.3 nH Murata LQG15HN4N3S02D
M17 Capacitor 0402 82 pF Murata GRM1555C1H820JA01
M18 DNI 0402
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 31. SKY67021-396LF PCB Layout Footprint
(Top View)
Figure 32. Typical Case Markings
(Top View)
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 33. SKY67021-396LF 8-Pin DFN Package Dimensions
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Figure 34. SKY67021-396LF Tape and Reel Dimensions
DATA SHEET • SKY67021-396LF HIGH LINEARITY, ACTIVE BIAS LNA
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Ordering Information
Model Name Manufacturing Part Number Evaluation Board Part Number
SKY67021-396LF LNA SKY67021-396LF SKY67021-396LF-EVB
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