© Semiconductor Components Industries, LLC, 2015
November, 2017 − Rev. 1
1Publication Order Number:
NCV4296−2C/D
NCV4296-2C
30 mA Low Dropout Voltage
Regulator with Inhibit
The NCV4296−2C is a monolithic integrated low dropout voltage
regulator with an output current capability of 30 mA available in the
TSOP–5 package.
The output voltage is accurate within ±4.0% with a maximum
dropout voltage of 250 mV with an input up to 45 V. Low quiescent
current is a feature typically drawing only 160 mA with a 1 mA load.
With Inhibit feature, the regulator can be turned off and the device
consumes less than 5 mA of quiescent current. This part is ideal for
automotive and all battery operated microprocessor equipment.
The regulator is protected against reverse battery, short circuit and
thermal overload conditions.
Features
•Output Voltage Options: 3.3 V, 5.0 V
•Output Voltage Accuracy: ±4.0%
•Output Current: up to 30 mA
•Low Quiescent Current (typ. 160 mA @ 1 mA)
•Low Dropout Voltage (typ. 65 mV @ 20 mA)
•Wide Input Voltage Operating Range: up to 45 V
•Inhibit Input
•Protection Features:
♦Current Limitation
♦Thermal Shutdown
♦Reverse Polarity Protection and Reverse Bias Protection
•AEC−Q100 Grade 1 Qualified and PPAP Capable
•This is a Pb−Free Device
Typical Applications
•Microprocessor Systems Power Supply
Figure 1. Applications Circuit
NCV4296−2C
Vin
Cout
2.2 mF
Output
Cin
100 nF
GND
Vout
Input
INH
Inhibit
TSOP−5
CASE 483
PIN CONNECTIONS
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MARKING
DIAGRAM
(Top View)
INH
Vin
GND
Vout
(Note: Microdot may be in either location)
1
5
1
5
xxxAYWG
G
xxx = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
GND
1
2
3
5
4
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 10 of this data sheet.
NCV4296−2C
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2
Figure 2. Simplified Block Diagram
GND
VOLTAGE
REFERENCE
SATURATION
PROTECTION
THERMAL
SHUTDOWN
SP
TSD
SP
TSD
Vin Vout
VREF
VREF
INHIBIT
INH
PIN FUNCTION DESCRIPTION
Pin No.
TSOP−5Pin Name Description
1 INH Inhibit Input. Low level disables the IC.
2 GND Power Supply Ground.
3 Vin Unregulated Positive Power Supply Input. Connect 0.1 mF capacitor to ground.
4 Vout Regulated Positive Output Voltage. Connect 2.2 mF capacitor with ESR < 7 W to ground.
5 GND Power Supply Ground.
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Min Max Unit
Input Voltage DC (Note 1)
DC
Vin
−42 45
V
Input Voltage (Note 2)
Load Dump − Suppressed
Us
−60
V
Output Voltage Vout −6 30 V
Inhibit Input Voltage
DC
VINH
−42 45
V
Inhibit Input Current Range
DC
Transient, −0.3 V ≤ Vin 45 V, tp < 1 ms
IINH
−0.5
−5
−
5
mA
Maximum Junction Temperature TJ(max) −40 150 °C
Storage Temperature TSTG −50 150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class A according to ISO16750−1.
ESD CAPABILITY (Note 3)
Rating Symbol Min Max Unit
ESD Capability, Human Body Model ESDHBM −2 2 kV
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes <50mm2 due to the
inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic
defined in JEDEC JS−002−2014.
NCV4296−2C
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LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating Symbol Min Max Unit
Moisture Sensitivity Level MSL 1 −
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air (Note 5) RθJA 136.2
°C/W
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
RECOMMENDED OPERATING RANGES
Rating Symbol Min Max Unit
Input Voltage (Note 6) Vin Vout, nom + 0.5 or 3.5 45 V
Inhibit Input Voltage VINH −0.3 40 V
Junction Temperature TJ−40 150 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
6. Minimum Vin = Vout, nom + 0.5 or 3.5, whichever is higher.
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ELECTRICAL CHARACTERISTICS Vin = 13.5 V, VINH > 2.5 V, Cin = 0.1 mF, C out = 2.2 mF, for typical values TJ = 25°C, for min/max
values TJ = −40°C to 150°C; unless otherwise noted. (Note 7)
Parameter Test Conditions Symbol Min Typ Max Unit
REGULATOR OUTPUT
Output Voltage 5.0 V
3.3 V
Vin = 13.5 V, Iout = 1 mA to 30 mA
Vin = 6 V to 40 V, Iout = 10 mA
Vin = 13.5 V, Iout = 1 mA to 30 mA
Vin = 4.3 V to 40 V, Iout = 10 mA
Vout 4.80
4.80
3.17
3.17
5.00
5.00
3.30
3.30
5.20
5.20
3.43
3.43
V
Line Regulation Vin = Vin, min to 36 V, Iout = 5 mA, TJ = 25°C
Vin = Vin, min to 36 V, Iout = 5 mA
Regline −
−
5
10
20
30
mV
Load Regulation Iout = 1 mA to 25 mA, TJ = 25°C
Iout = 1 mA to 25 mA
Regload −
−
3
10
20
30
mV
Dropout Voltage (Note 8) Iout = 20 mA VDO −65 250 mV
DISABLE AND QUIESCENT CURRENTS
Disable Current VINH <= 0.4 V, TJ < 85°C
VINH <= 0.4 V
IDIS −
−
0
0
1
5
μA
Quiescent Current, Iq = Iin − Iout Iout < 0.1 mA, TJ < 85°C
Iout < 1 mA
Iout < 30 mA
Iq
−
−
−
150
160
0.8
170
200
4
μA
μA
mA
CURRENT LIMIT PROTECTION
Current Limit Vout = Vout, nom – 100 mV ILIM 30 − − mA
PSRR
Power Supply Ripple Rejection f = 100 Hz, 0.5 Vpp PSRR −60 −dB
INHIBIT
Inhibit Input Threshold Voltage
Low (Off−State)
High (On−State)
Vout < 0.1 V
Vout > 0.95 x Vout, nom
VINH 0.4
−
1.76
1.82
−
2.2
V
Inhibit Input Current
Low (Off−State)
High (On−State)
VINH = 0 V
VINH = 5 V
IINH_OFF
IINH_ON
−2
−
−
6
2
12
μA
THERMAL SHUTDOWN
Thermal Shutdown Temperature
(Note 9)
TSD 151 175 195 °C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty cycle
pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.5 V. If Vout < 5 V, then VDO = Vin − Vout. Maximum dropout
voltage value is limited by minimum input voltage Vin = Vout, nom + 0.5 V recommended for guaranteed operation at maximum output current.
9. Values based on design and/or characterization.
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TYPICAL CHARACTERISTICS − 5.0 V VERSION
Figure 3. Output Stability with Output
Capacitor ESR
Iout, OUTPUT CURRENT (mA)
302520151050
0.01
0.1
1
10
100
1000
Figure 4. Output Voltage vs. Junction
Temperature
Figure 5. Output Voltage vs. Input Voltage
TJ, JUNCTION TEMPERATURE (°C) Vin, INPUT VOLTAGE (V)
16012080400−40
4.90
4.95
5.00
5.05
5.10
97653210
0
1
2
3
4
5
6
Figure 6. Dropout Voltage vs. Output Current Figure 7. Maximum Output Current vs. Input
Voltage
Iout, OUTPUT CURRENT (mA) Vin, INPUT VOLTAGE (V)
302520151050
0
50
100
150
40302520151050
0
10
20
30
40
50
60
70
ESR (W)
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
VDO, DROPOUT VOLTAGE (mV)
Iout, OUTPUT CURRENT (mA)
Unstable Region
Stable Region
Cout ≥ 2.2 mF
TJ = 25°C
Vin = 13.5 V
RL = 5 kW
RL = 166 W
TJ = 25°C
4810
Vout = 0 V
TJ = 25°C
35 45
TJ = 25°C
TJ = −40°C
TJ = 125°C
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TYPICAL CHARACTERISTICS − 5.0 V VERSION
Figure 8. Quiescent Current vs. Output Current
(High Load)
Figure 9. Quiescent Current vs. Output Current
(Low Load)
Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA)
302520151050
0
0.1
0.2
0.3
0.4
0.5
0.6
0.8
543210
0
100
200
300
Figure 10. Quiescent Current vs. Input Voltage
Vin, INPUT VOLTAGE (V)
35302520151050
0
1.0
2.0
3.0
3.5
4.0
5.0
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
Vin = 13.5 V
TJ = 25°C
RL = 166 W
TJ = 25°C
0.7
Vin = 13.5 V
TJ = 25°C
40
1.5
0.5
2.5
4.5
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TYPICAL CHARACTERISTICS − 3.3 V VERSION
Figure 11. Output Stability with Output
Capacitor ESR
Iout, OUTPUT CURRENT (mA)
302520151050
0.01
0.1
1
10
100
1000
Figure 12. Output Voltage vs. Junction
Temperature
Figure 13. Output Voltage vs. Input Voltage
TJ, JUNCTION TEMPERATURE (°C) Vin, INPUT VOLTAGE (V)
16012080400−40
3.20
3.25
3.30
3.35
3.40
97653210
0
0.5
1.0
2.0
2.5
3.5
4.0
Figure 14. Maximum Output Current vs. Input
Voltage
Figure 15. Quiescent Current vs. Input Voltage
Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V)
302520151050
0
10
50
70
40302520151050
0
0.5
1.0
2.0
3.0
3.5
4.0
5.0
ESR (W)
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
Iout, OUTPUT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
Unstable Region
Stable Region
Cout ≥ 2.2 mF
TJ = 25°C
Vin = 13.5 V
RL = 3.3 kW
RL = 110 W
TJ = 25°C
4810
35
1.5
3.0
RL = 110 W
TJ = 25°C
1.5
2.5
4.5
Vout = 0 V
TJ = 25°C
35 40 45
20
30
40
60
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TYPICAL CHARACTERISTICS − 3.3 V VERSION
Figure 16. Quiescent Current vs. Output
Current (High Load)
Figure 17. Quiescent Current vs. Output
Current (Low Load)
Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA)
302520151050
0
0.1
0.2
0.3
0.4
0.5
0.6
0.8
543210
0
100
200
300
Figure 18. RqJA vs. PCB Cu Area
PCB Cu Area (mm2)
5004003002001000
100
125
150
175
200
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
RqJA, THERMAL RESISTANCE (°C/W)
Vin = 13.5 V
TJ = 25°C
1 oz
0.7
Vin = 13.5 V
TJ = 25°C
700600
2 oz
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9
DEFINITIONS
General
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
Output voltage
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
Line Regulation
The change in output voltage for a change in input
voltage measured for specific output current over operating
ambient temperature range.
Load Regulation
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Quiescent and Disable Currents
Quiescent Current (Iq) is the difference between the input
current (measured through the LDO input pin) and the
output load current. If Inhibit pin is set to LOW the
regulator reduces its internal bias and shuts off the output,
this term is called the disable current (IDIS).
Current Limit
Current Limit is value of output current by which output
voltage drops 100 mV below its nominal value. It means
that the device is capable to supply minimum 30 mA.
PSRR
Power Supply Rejection Ratio is defined as ratio of
output voltage and input voltage ripple. It is measured in
decibels (dB).
Thermal Protection
Internal thermal shutdown circuitry is provided to
protect the integrated circuit in the event that the maximum
junction temperature is exceeded. When activated at
typically 175°C, the regulator turns off. This feature is
provided to prevent failures from accidental overheating.
Maximum Package Power Dissipation
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
NCV4296−2C
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10
APPLICATIONS INFORMATION
The NCV4296−2C low dropout regulator is
self−protected with internal thermal shutdown and internal
current limit. Typical characteristics are shown in Figure 3
to Figure 18.
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV4296−2C
package. Higher capacitance and lower ESR will improve
the overall line and load transient response.
Output Decoupling (Cout)
The NCV4296−2C is a stable component and does not
require a minimum Equivalent Series Resistance (ESR) for
the output capacitor. Stability region of ESR vs. Output
Current is shown in Figures 3 and 11. The minimum output
decoupling value is 2.2 mF and can be augmented to fulfill
stringent load transient requirements. The regulator works
with ceramic chip capacitors as well as tantalum devices.
Larger values improve noise rejection and load transient
response.
Inhibit Operation
The Inhibit pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet.
Thermal Considerations
As power in the NCV4296−2C increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. When the NCV4296−2C has good thermal
conductivity through the PCB, the junction temperature
will be relatively low with high power applications. The
maximum dissipation the NCV4296−2C can handle is
given by:
PD(MAX) +ƪTJ(MAX) *TAƫ
RqJA
(eq. 1)
Since TJ is not recommended to exceed 150°C, then the
NCV4296−2C soldered on 645 mm2, 1 oz copper area, FR4
can dissipate up to 0.92 W when the ambient temperature
(TA) is 25°C. See Figure 18 for RthJA versus PCB area. The
power dissipated by the NCV4296−2C can be calculated
from the following equations:
PD[VinǒIq@IoutǓ)IoutǒVin *VoutǓ(eq. 2)
or
Vin(MAX) [
PD(MAX) )ǒVout IoutǓ
Iout )Iq
(eq. 3)
Hints
Vin and GND printed circuit board traces should be as wide
as possible. When the impedance of these traces is high,
there is a chance to pick up noise or cause the regulator to
malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV4296−2C
and make traces as short as possible.
ORDERING INFORMATION
Device Marking Package Shipping†
NCV4296−2CSN50T1G 65V TSOP−5
(Pb−Free) 3000 / Tape & Reel
NCV4296−2CSN33T1G 63V
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A
B
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
A
G
B
D
H
C
J
__
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
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