Version 4.2
September 2003 1/47
TDA9109A
LOW-COST I2C CONTROLLED DEFLECTION PROCESSOR
FOR MULTISYNC MONITOR
FEATURES
General
SYNC PROCESSOR
12V SUPPLY VOLTAGE
8V REFERENCE VOLTAGE
HORIZONTAL LOCK/UNLOCK OUTPUT
READ/WRITE I2C INTERFACE
VERTICAL MOIRE
B+ REGULATOR
- Inter nal PWM ge nerator for B+ current mo de
step-up converter
- Switchable to step-down converter
-I
2
C ad justable B+ refere nce voltage
- Output Pulses Synchronized on Horizontal
Frequency
- Internal Maximum Current Limitation
Horizontal
Self-adaptative
Dual PLL concept
150kHz max im um fr eque nc y
X-ray protection input
I2C controls:
Horizontal duty-cycle, H-position
Vertical
Vertical ramp generator
50 to 185Hz AGC loop
Geometry tracking with Vpos & Vamp
I2C controls:
Vamp, Vpos, S-corr, C-corr
DC breathing compensation
I2C Geometry corrections
Vertical parabola generator
(Pin Cushion - E/W, Keystone, Corner
Correction)
Horizontal dynamic phase
(Side Pin Balance & Parallelogram)
Horizontal and vertical dynamic focus
(Horizontal focus amplitude, Horizontal focus
symmetry, Vertical focus amplitude)
DESCRIPTION
The TDA9109A is a monolithic integrated circuit
assembled in a 32-pin shrink dual in line plastic
package . This IC contr ols all the funct ions rel ated
to the horizontal and vertical deflection in multi-
mode or multi-frequency computer display moni-
tors.
The internal sync processor, combined with the
very powerful geometry correction block, make
the TDA9109A suitable for very high performance
monitors, using very few external components.
The horizontal jitter level is very low. It is particu-
larly well-suited to high-end 15" and 17" monitors.
Combined with the ST7275 Microcontroller family,
TDA9206 ( Vide o preamp lifie r) and STV94 2x (O n-
Screen Display controller), the TDA9109A allows
fully I2C bus-controlled computer display monitors
to be built with a reduced number of external com-
ponents.
ORDERING INFORMATION
Ordering code Package
TDA9109A Shrink 32 (plastic)
1
TABLE OF CONTENTS
3
2/47
PIN CONNECTIONS 4
PIN CONNECTIONS 5
QUICK REFERENCE DATA 6
BLOCK DIAGRAM 8
ABSOLUTE MAXIMUM RATINGS 9
THERMAL DATA 9
I2C READ/WRITE 10
SYNC PROCESSOR 10
HORIZONTAL SECTION 11
VERTICAL SECTION 13
DYNAMIC FOCUS SECTION 15
GEOMETRY CONTROL SECTION 16
B+ SECTION 18
TYPICAL OUTPUT WAVEFORMS 20
I2C BUS ADDRESS TABLE 24
I2C BUS ADDRESS TABLE 25
OPERATING DESCRIPTION 27
1 GENERAL CONSIDERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.1Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.2I2C Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.3Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.4Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.5Sync Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.6Sync Identification Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.7IC status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.8Sync Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.9Sync Processor Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2 HORIZONTAL PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.1Internal Input Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.2PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.3PLL2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.4Output Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2.5X-RAY Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2.6Horizontal and Vertical Dynamic Focus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3 VERTICAL PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.1Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.2I2C Control Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.3Vertical Moiré . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.4Basic Equations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.5E/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.6Dynamic Horizontal Phase Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2
TABLE OF CONTENTS
3
3/47
4 DC/DC CONVERTER PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.1Step-up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.2Step-down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.3Step-up and Step-down Mode Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
INTERNAL SCHEMATICS 39
PACKAGE MECHANICAL DATA 46
TDA9109A
4/47
PIN CONNECTIONS
H/HVIN
VSYNCIN
HLOCKOUT
PLL2C
C0
R0
PLL1F
HPOSITION
HFOCUSCAP
FOCUS-OUT
HGND
HFLY
HREF
COMP
REGIN
ISENSE
5V
SDA
SCL
VCC
BOUT
GND
HOUT
XRAY
EWOUT
VOUT
VCAP
VREF
VAGCCAP
VGND
BREATH
B+GND17
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TDA9109A
5/47
PIN CONNECTIONS
Pin Name Function
1 H/HVIN TTL compatible Horizontal sync Input (separate or composite)
2 VSYNCIN TTL compatible Vertical sync Input (for separated H&V)
3 HLOCKOUT First PLL Lock/Unlock Output (0 V: Unlocked - 5 V: Locked)
4 PLL2C Second PL L Loo p Filt er
5 C0 Horizont al Os cilla to r Cap ac itor
6 R0 Horizont al Os cilla to r Res isto r
7 PLL1F First PLL Loop Filter
8 HPOSI TIO N Horizont al Po siti on Fil ter (ca pa cit or to be co nn ect ed to HGN D)
9 HFOCUSCAP Horizontal Dynamic Focus Oscillator Capacitor
10 FOCUS OUT Mixed Horizontal and Vertical Dynamic Focus Output
11 HGND Horizont al Se ctio n Gro un d
12 HFLY Horizont al Fly ba ck Inp ut (po sit ive pola rity )
13 HREF Horizont al Se ctio n Re fer enc e Vo lta ge (to be filter ed )
14 COMP B+ Error Amplifier Output for frequency compensation and gain setting
15 REGIN Regulation Input of B+ control loop
16 ISENSE Sensing of external B+ switching transistor current,or switch for step-down converter
17 B+GND Ground (re late d to B+ refer en ce ad jus tm en t)
18 BREATH DC Breathing Input Control (compensation of vertical amplitude against EHV variation)
19 VGND Vertical Se ctio n Gro un d
20 VAGCCAP Memory Capacitor for Automatic Gain Control Loop in Vertical Ramp Generator
21 VREF Vertical Se ctio n Refer en ce Vo lta ge (to be filter ed )
22 VCAP Vertical Sawtooth Generator Capacitor
23 VOUT Vertical Ra mp Outp ut (w ith fre qu en cy ind ep en da nt am plit ud e and S or C Corre ctio ns if
any). It is mixed with vertical position voltage and vertical moiré.
24 EWOUT Pin Cushion - E/W Correction Parabola Output
25 XRAY X-RAY protection input (with internal latch function)
26 HOUT Horizont al Driv e Ou tpu t (NP N op en co llec to r)
27 GND General Ground (referenced to VCC)
28 BOUT B+ PWM Regulator Output
29 VCC Supply Voltage(12V typ)
30 SCL I2C Clock Input
31 SDA I2C Data Input
32 5V Supply Voltage (5V typ.)
TDA9109A
6/47
QUICK REFERENCE DATA
Parameter Value Unit
Horizontal Frequency 15 to 150 kHz
Autosynch Frequency (for given R0 and C0. Can be easily increased by application) 1 to 4.5 f0
± Ho riz ont al Sy nc Po lar ity Inp ut YES
Polarity Detection (on both Horizontal and Vertical Sections) YES
TTL Composite Sync YES
Lock/Unlock Identification (on both Horizontal 1st PLL and Vertical Section) YES
I2C Control for H-Position ±10 %
XRAY Protection YES
I2C Horizontal Duty Cycle Adjustment 30 to 65 %
I2C Free Running Frequency Adjustment NO
Stand-by Function YES
Dual Polarity H-Drive Outputs NO
Supply Voltage Monitoring YES
PLL1 Inhibition Possibility NO
Blanking Outputs NO
Vertical Frequency 35 to 200 Hz
Vertical Autosync (for 150nF on Pin 22 and 470nF on Pin 20) 50 to 185 Hz
Vertical S-Correction (optimized for super flat tube) YES
Vertical C-Correction YES
Vertical Amplitude Adjustment YES
DC Breathing Control on Vertical Amplitude YES
Vertical Position Adjustment YES
East/West (E/W) Parabola Output (also known as Pin Cushion Output) YES
E/W Correction Amplitude Adjustment YES
Keystone Adjustment YES
Corner Correction with Amplitude Adjustment YES
Internal Dynamic Horizontal Phase Control YES
Side Pin Balance Amplitude Adjustment YES
Parallelogram Adjustment YES
Tracking of Geometric Corrections with Vertical Amplitude and Position YES
Reference Voltage (both on Horizontal and Vertical) YES
Dynamic Focus (both Horizontal and Vertical) YES
I2C Horizontal Dynamic Focus Amplitude Adjustment YES
I2C Horizontal Dynamic Focus Symmetry Adjustment YES
I2C Vertical Dynamic Focus Amplitude Adjustment YES
TDA9109A
7/47
Detection of Input Sync (biased from 5V alone) YES
Vertical Moiré YES
Controlle d V-M oi ré Am pli tud e YES
Frequency Generator for Burn-in NO
Fast I2C Read/Write 400 kHz
B+ Regulation adjustable by I2CYES
Horizontal Size Control NO
Parameter Value Unit
TDA9109A
8/47
BLOCK DIAGRAM
PLL1F POSITION R0 C0 HFLY PLL2C HOUT
7865124 26
Phase/Frequency
Comparator
H-Pha se (7bits) VCO Phase
Comparator Phase
Shifter H-Duty
(7bits) Hout
Buffer
Safety
Processor
Controller
SPin bal
7bits
x
2
x
Paral
7bits
B+
Lock/Unlock
Identification
Sync
Processor
Sync Input
Select
(1bit)
Geometry
Tracking
VDFAMP
7bits Internal
reference
(7bits)
5V
Amp
Symmetry
2x7bits x
2
x
2
Corner
7bits
E/Wpcc
7bits
Keyst.
7 bits
x
Vertical Moire
Cancel
7bits+ON/OFF
TDA9109A
VSYNC
VPOS
7bits
VAMP
7bits
7 bits
7 bits
Vertical
Oscillator
Ramp Genera tor
S and C
Correction
I
2
C Interface
H
ref
V
ref
11
19
17
29
25
28
16
14
15
HGND
VGND
VCC
XRAY
BOUT
I
SENSE
COMP
REGIN
BGND
10
9
24
FOCUS
HFOCUS-
EWOUT
23182022 V
OUT
BREATHV
AGCCAP
V
CAP
21
13
32
27
30
31
1
2
3
H/HVIN
V
SYNCIN
HLOCKOUT
SDA
SCL
GND
5V
HREF
VREF
CAP
x
4
x
2
+
TDA9109A
9/47
ABSOLUTE MAXIMUM RATINGS
THERM AL DATA
Symbol Parameter Value Unit
VCC Supply Voltage (Pin 29) 13.5 V
VDD Supply Voltage (Pin 32) 5.7 V
VIN
Max Voltage on Pin 4
Pin 9
Pin 5
Pins 6, 7, 8, 14, 15, 16, 20, 22
Pins 10, 18, 23, 24, 25, 26, 28
Pins 1, 2, 3, 30, 31
4.0
5.5
6.4
8.0
VCC
VDD
V
V
V
V
V
V
VESD ESD susceptibility Human Body Model, 100pF Discharge
through 1.5k
EIAJ Norm, 200pF Discharge through 02
300 kV
V
Tstg Storage Temperature -40, +150 °C
TjJunctio n Te mp era tu re +150 °C
Toper Operating Temperature 0, +70 °C
Symbol Parameter Value Unit
Rth(j-a) Max. Junction-Ambient Thermal Resistance 65 °C/W
TDA9109A
10/47
I2C READ/WRITE
Electrical Characteristics (VDD = 5V, Tamb = 25°C)
Note: 1 See also I2C Bus Address Table.
SYNC PROCESSOR
Operating Conditions (VDD = 5V, Tamb = 25°C)
Electrical Characteristics (VDD = 5V, Tamb = 25°C)
Note: 2 TH is the Horizontal period.
Symbol Parameter Test Conditions Min. Typ. Max. Units
I2C PROCESSOR (See 1)
Fscl Maximum Clock Frequency Pin 30 400 kHz
Tlow Low period of the SCL Clock Pin 30 1.3 µs
Thigh High period of the SCL Clock Pin 30 0.6 µs
Vinth SDA and SCL Input Threshold Pins 30, 31 2.2 V
VACK Acknowledge Output Voltage on SDA
input with 3mA Pin 31 0.4 V
I2C leak Leakage current into SDA and SCL
with no logic supply VDD = 0
Pins 30, 31 = 5 V 20 µA
Symbol Parameter Test Conditions Min. Typ. Max. Units
HsVR Voltage on H/HVIN Input Pin 1 0 5 V
MinD Minimum Ho rizo nt al Inp ut Pu lse s Du-
ration Pin 1 0.7 µs
Mduty Maximum Horizontal Input Signal Duty
Cycle Pin 1 25 %
VsVR Voltage on VSYNCIN Pin 2 0 5 V
VSW Mini mum Ve rtic al Sy nc Pu lse Widt h Pin 2 5 µs
VSmD Maximum Vertical Sync Input Duty Cy-
cle Pin 2 15 %
VextM Maximum Vertical Sync Width on TTL
H/Vcomposite Pin 1 750 µs
Symbol Parameter Test Conditions Min. Typ. Max. Units
VINTH Horizontal and Vertical Input Logic
Level (Pins 1, 2) High Level
Low Level 2.2 0.8 V
V
RIN Horizontal and Vertical Pull-Up Resis-
tor Pins 1, 2 250 k
VoutT Extracted Vsync Integration Time (%
of TH) on H/V Composite (see 2)C0 = 820pF 26 35 %
TDA9109A
11/47
HORIZONTAL SECTION
Operating Conditions
Electrical Characteristics (VDD = 12V, Tamb = 25°C))
Symbol Parameter Test Conditions Min. Typ. Max. Units
VCO
I0max Max Current from Pin 6 Pin 6 1.5 mA
F(max.) Maximum Oscillator Frequency 150 kHz
OUTPUT SECTION
I12m Maximum Input Peak Current Pin 12 5 mA
HOI Horizontal Drive Output Maximum
Current Pin 26, Sunk current 30 mA
Symbol Parameter Test Conditions Min. Typ. Max. Units
SUPPLY AND REFERENCE VOLTAGES
VCC Supply Voltage Pin 29 10.8 12 13.2 V
VDD Supply Voltage Pin 32 4.5 5 5.5 V
ICC Supply Current Pin 29 50 mA
IDD Supply Current Pin 32 5 mA
VREF-H Horizontal Reference Voltage Pin 13, I = -2mA 7.6 8.2 8.8 V
VREF-V Vertical Reference Voltage Pin 21, I = -2mA 7.6 8.2 8.8 V
IREF-H Max. Sourced Current on VREF-H Pin 13 5 mA
IREF-V Max. Sourced Current on VREF-V Pin 21 5 mA
1st PLL SECTION
HpoIT D el ay Tim e for dete ctin g pol ari ty
change (see 3)Pin 1 0.75 ms
Vvco VCO Control Voltage (Pin 7) VREF-H = 8.2V fo
fH(Max.) 1.4
6.4 V
V
Vcog VCO Gain (Pin 7) R0 = 6.49k,
C0 =820pF 15.9 kHz/V
Hph Horizontal Phase Adjustment
(see 4)% of Ho rizo nt al
Period ±10 %
Vbmi
Vbtyp
Vbmax
Horizontal Phase Setting Value (Pin 8)
(see 4)
Minimum Value
Typical Value
Maximum Value
Sub-Add re ss 01
Byte x1111 11 1
Byte x1000 00 0
Byte x0000 00 0
2.9
3.5
4.2
V
V
V
IPII1U
IPII1L P LL 1 Filt er Cu rre nt Ch arg e PLL1 is Unlocked
PLL1 is Locked ±140
±1µA
mA
foFree Running Frequency R0 = 6.49k,
C0 = 820pF 22.8 kHz
dfo/dT Free Running Frequency Thermal Drift
(No drift on external components)
(see 5)-150 ppm/
C
CR PLL1 Capture Range fH(Min.)
fH(Max.) (See Note 6) fo+0.5
4.5fo
kHz
kHz
HUnlock DC level pin 3 when PLL1 is locked 5 V
TDA9109A
12/47
Note: 3 This delay is mandatory to avoid a wrong detection of polarity change in the case of a composite sync.
Note: 4 See Figure 10 for explanation of reference phase.
Note: 5 These param e ters are not teste d on ea ch unit. Th ey are meas ure d dur in g our int ernal qua lifi ca tion .
Note: 6 A larger range may be obtained by application.
Note: 7 Hjit = 106 x (Standard deviation/Horizontal period)
Note: 8 Duty Cycle is the ratio between the output transistor OFF time and the period. The power transistor is
controll ed OF F wh en the outp ut transis tor is OF F.
Note: 9 Initial Condition for Safe Operation Start Up.
2nd PLL SECTION AND HORIZONTAL OUTPUT SECTION
FBth Flyback Input Threshold Voltage (Pin
12) 0.65 0.75 V
Hjit Horizontal Jitter (See 7) At 31.4kHz 70 ppm
HDmin
HDmax
Horizontal Drive Output Duty-Cycle
(Pin 26) (see 8) Sub-Add re ss 00
Byte x1111 11 1
Byte x0000000 (see 9)30
65 %
%
XRAYth X-RAY Protection Input Threshold
Voltage, Pin 25, see Figure 14 7.6 8.2 8.8 V
Vphi2 Internal Clamping Levels on 2nd PLL
Loop Filter (Pin 4) Low Level
High Level 1.6
4.2 V
V
VSCinh Threshold Voltage to Stop H-Out, V-
Out, B- Out and Reset XRAY when VCC
< VSCinh (see Figure14) Pin 29 7.5 V
HDvd Horizontal Drive Output (low level) Pin 26, IOUT = 30mA 0.4 V
Symbol Parameter Test Conditions Min. Typ. Max. Units
TDA9109A
13/47
VERTICAL SECTION
Operating Conditions
Electrical Characteristics (VCC = 12V, Tamb = 25°C)
Symbol Parameter Test Conditions Min. Typ. Max. Units
OUTPUTS SECTION
RLOAD Minimum Load for less than 1% Verti-
cal Amplitude Drift Pin 20 65 M
Symbol Parameter Test Conditions Min. Typ. Max. Units
VERTICAL RAMP SECTION
VRB Voltage at Ramp Bottom Point Pin 22 2.1 V
VRT Voltage at Ramp Top Point (with Sync) Pin 22 5.1 V
VRTF Voltage at Ramp Top Point (without
Sync) Pin 22 VRT-
0.1 V
VSTD Vertical Sawtooth Discharge Time Pin 22, C22 = 150nF 70 µs
VFRF Vertical Free Running Frequency
(See 11)C22 = 150nF 100 Hz
ASFR AUTO-SYNC Frequency (See 12)C
22 = 150nF ±5% 50 185 Hz
RAFD Ramp Amplitude Drift Versus
Frequency at Maximum Vertical
Amplitude (see 10)
C22 = 150nF
50Hz< f < 185Hz 200 ppm/
Hz
Rlin Ramp Linearity on Pin 22 (See 11) 2.5V < V27 < 4.5V 0.5 %
VPOS Vertical Position Adjustment Voltage
(Pin 23 - VOUT mean value)
Sub Address 06
Byte 00000000
Byte 01000000
Byte 01111111
3.2
3.6
4.0
V
V
V
VOR Vertical Output Voltage
(peak-to-peak on Pin 23)
Sub Address 05
Byte 10000000
Byte 11000000
Byte 11111111
2.15
3.0
3.9
V
V
V
VOI Vertical Output Maximum Current
(Pin 23) ±5mA
dVS
Max Vertical S-Correction Amplitude
(See 13)
0xxxxxxx inhibits S-CORR
11111111 gives max S-CORR
Sub Address 07
Byte 11111111
V/VPP at TV/4
V/VPP at 3TV/4 -3.5
3.5 %
%
Ccorr Vertical C-Corr Amplitude
0xxxxxxx inhibits C-CORR
Sub Address 08
V/VPP at TV/2
Byte 10000000
Byte 11000000
Byte 11111111
-3
0
3
%
%
%
VMOIRE Vertical Moiré Sub Address 0C
Byte 01X11111 6mV
TDA9109A
14/47
Note: 10 These parameters are not tested on each unit. They are measured during our internal qualification procedure.
Note: 11 With Register 07 at Byte 0xxxxxxx (S correction is inhibited) and Register 08 at Byte 0xxxxxxx (C correction
is inhibited), the vertical sawtooth has a linear shape.
Note: 12 This is the frequency range for which the vertical oscillator will automatically synchronize, using a single
capacitor value on Pin22 and Pin 20, and with a constant ramp amplitude.
Note: 13 TV is the vertical period.
Note: 14 When not used, the DC breathing control pin must be connected to 12V.
BREATH IN G CO M PE NS AT IO N
BRRANG DC Breathing Voltage Range
(See 14)V18 112V
BRADj Vertical Output Variation versus DC
Breathing Control (Pin 23) V18 > VREF-V
1V<V18< VREF-V
0
-2.5 %/V
%/V
Symbol Parameter Test Conditions Min. Typ. Max. Units
TDA9109A
15/47
DYNAMIC FOCUS SECTION
Electrical Characteristics (VCC = 12V, Tamb = 25°C)
Note: 15 These param e ters are not tested on ea ch unit. Th ey are meas ure d du r in g our int ernal qua lifi ca tion .
Note: 16 S and C correction are inhibited so the vertical output sawtooth has a linear shape.
Symbol Parameter Test Conditions Min. Typ. Max. Units
HORIZONTAL DYNAMIC FOCUS FUNCTION
HDFst Horizontal Dynamic Focus Sawtooth
Minimu m Le vel
Maximum Level
Pin 9, capacitor on
HFOCUSCAP and
C0 = 820pF, TH =
20µs
2.2
4.9 V
V
HDFdis Horizontal Dynamic Focus Sawtooth
Discharge Width Start by HDFs tar t 400 ns
HDFstart Internal Fixed Phase Advance versus
HFLY middle Independe nt of
frequency 1µs
HDFDC Bottom DC Output Level RLOAD = 10k, Pin 10 2.1 V
TDFHD DC Output Voltage Thermal Drift
(see 15)200 ppm/
C
HDFamp
Horizontal Dynamic Focus Amplitude
Min Byte xxx11111
Typ Byte xxx10000
Max Byte xxx00000
Sub-Add re ss 03 ,
Pin 10, fH = 50kHz,
Symmetr ic Wa ve
Form
1
1.5
3.5
VPP
VPP
VPP
HDFKeyst Horizontal Dynamic Focus Position
Advance for Byte xxx11111
Delay for Byte xxx00000
Sub-address 04
For time reference
see Figure 15 16
16 %
%
VERTICAL DYNAMIC FOCUS FUNCTION (positive parabola)
AMPVDF
Vertical Dynamic Focus Parabola
(added to horizontal) Amplitude with
VAMP and VPOS Typical
Min. Byte xx000000
Typ. Byte xx100000
Max. Byte xx111111
Sub-Add re ss 0F
0
0.5
1
VPP
VPP
VPP
VDFAMP Parabola Amplitude Function of VAMP
(tracking between VAMP and VDF)
with VPOS Typ. (see Figure 1 and 16)
Sub-Add re ss 05
Byte x0000000
Byte x1000000
Byte x1111111
0.6
1
1.5
VPP
VPP
VPP
VHDFKeyt
Parabola Asymmetry Function of
VPOS Co ntr ol (tra ck ing betw ee n
VPOS and VDF) with VAMP Max.
A/B Ratio
B/A Ratio
Sub-Add re ss 06
Byte x0000000
Byte x1111111 0.52
0.52
TDA9109A
16/47
GEOMETRY CONTROL SECTION
Electrical Characteristics (VCC = 12V, Tamb = 25°C)
Symbol Parameter Test Conditions Min. Typ. Max. Units
East/West E/W FUNCTION
EWDC
DC Output Voltage with:
- typical VPOS
- Keyston e inhi bite d Pin 24, see Figure 2 2.5 V
TDEWDC DC Output Voltage Thermal Drift See 15 100 ppm/
C
EWpara
Parabola Amplitude with:
- Max. VAMP ,
- Typ. VPOS,
- Keystone and Corner inhibited
Subaddress 0A
Byte 11111111
Byte 11000000
Byte 10000000
2.5
1.25
0
VPP
VPP
VPP
EWtrack
Parabola Amplitude Function of VAMP
Control (tracking between VAMP and
E/W) with:
- Typ. VPOS,
- Typ. E/W Amplitude,
- Corner and Keystone inhibited (17)
Subaddress 05
Byte 10000000
Byte 11000000
Byte 11111111
0.45
0.80
1.45
VPP
VPP
VPP
KeyAdj
Keystone Adjustment Capability with: -
- Typ. VPOS,
- E/W inhibit ed ,
- Corner inhibited and
- Max. Vertic al Am pli tud e
(see 17 and Figure 4)
Subaddress 09
Byte 10000000
Byte 11111111 1
1VPP
VPP
EW
Corner
Corner Adjustment Capability with:
- Typ. VPOS,
- E/W inhibit ed ,
- Keyston e inh ibit ed
- Max. Vertic al Am pli tud e
Subaddress 10
Byte 11111111
Byte 11000000
Byte 10000000
+3
0
3
VPP
VPP
VPP
KeyTrack
Intrinsic Keystone Function of VPOS
Control (tracking between VPOS and
E/W) with:
- Max. E/W Am plit ud e
- Max. Vertical Amplitude
A/B Ratio
B/A Ratio
Subaddress 06
Byte 00000000
Byte 01111111 0.52
0.52
TDA9109A
17/47
Note: 17 With Register 07 at Byte 0xxxxxxx (S correction is inhibited) and Register 08 at Byte 0xxxxxxx (C correction
is inhibited), the vertical sawtooth has a linear shape.
Note: 18 TH is the horizontal period.
Note: 19 When not used, the DC breathing control pin must be connected to 12V.
INTERNAL DYNAMIC HORIZONTAL PHASE CONTROL
SPBpara
Side Pin Balance Parabola Amplitude
(Figure 3) with:
- Max. VAMP ,
- Typ. VPOS
- Parallelogram inhibited (see 17 & 19)
Subaddress 0D
Byte 11111111
Byte 10000000 +2.8
-2.8 %TH
%TH
SPBtrack
Side Pin Balance Parabola Amplitude
function of VAMP Control (tracking be-
tween VAMP and SPB) with
- Max. SPB,
- Typ. VPOS
- Parallelogram inhibited (see 17 & 19)
Subaddress 05
Byte 10000000
Byte 11000000
Byte 11111111
1
1.8
2.8
%TH
%TH
%TH
ParAdj
Parallelogram Adjustment Capability
with:
- Max. VAMP ,
- Typ. VPOS
- Max. SPB (se e 17 & 19)
Subaddress 0E
Byte 11111111
Byte 11000000 +2.8
-2.8 %TH
%TH
Partrack
Intrinsic Parallelogram Function of
VPOS Co ntr ol (tra ck ing betw ee n
VPOS and DHPC) with:
- Max. VAMP ,
- Max. SPB
- Parallelogram inhibited (see 17 & 19)
A/B Ratio
B/A Ratio
Subaddress 06
Byte x0000000
Byte x1111111 0.52
0.52
Symbol Parameter Test Conditions Min. Typ. Max. Units
TDA9109A
18/47
B+ SECTION
Operating Conditions
Electrical Characteristics (VCC = 12V, Tamb = 25°C)
Note: 20 0.5mA are sunk when B+ section is disabled. the purpose is to discharge the soft-start capacitor.
Note: 21 The external power transistor is OFF during 400ns of the HFOCUSCAP discharge
Symbol Parameter Test Conditions Min. Typ. Max. Units
FeedRe s Mini mu m Fe ed bac k Re sis tor Re sis tor be twe en
Pins 15 and 14 5k
Symbol Parameter Test Conditions Min. Typ. Max. Units
OLG Error Amplifier Open Loop Gain At low frequency (15)85dB
UGBW Unity Gain Bandwidth (see 15)6MHz
IRI Regula tio n Inp ut Bia s Cu rre nt Current sourced by
Pin 15 (PNP base) 0.2 µA
EAOI Error Amplifier Output Current
Current sourced by
Pin 14
Current sunk by Pin 14
(See 20)2
1.4 mA
mA
CSG Current Sense Input Voltage Gain Pin 16 3
MCEth Max Current Sense Input Threshold
Voltage Pin 16 1.3 V
ISI Current Sense Input Bias Current Current sunk by Pin 16
(PNP base) 1µA
Tonmax Maximum ON Time of the external
power transistor % of horizont al per iod
fo = 27kHz (See 21)100 %
B+OSV B+Output Saturation Voltage V28 with I28 = 10mA 0.25 V
IVREF Internal Reference Voltage On error amp (+) input
for Subaddress OB
Byte 1000 000 5V
V
REFADJ Internal Reference Voltage Adjustment
Range Byte 01111111
Byte 0000 000 0 +20
-20 %
%
PWMSEL Threshold for step-up/step-down
selection Pin 16 6 V
tFB+ Fall Time Pin 28 100 ns
TDA9109A
19/47
Figure 1. Vertical Dynamic Focus Function
Figure 2. E/W Output
Figure 3. Dynamic Horizontal Phase Control Output
Figure 4. Keystone Effect on E/W Output (PCC Inhibited)
TDA9109A
20/47
TYPICAL OUTPUT WAVEFORMS
Function Sub
Address Pin Byte Specification Effect on Screen
Vertical
Size 05 23
10000000
11111111
Vertical
Position
DC Con-
trol
06 23
00000000 VOUTDC = 3.2V
01000000 VOUTDC = 3.6V
01111111 VOUTDC = 4.0V
Vertical
S
Linearity 07 23
0xxxxxxx:
Inhibited
11111111 =
TDA9109A
21/47
Vertical
C
Linearity 08 23
0xxxxxxx :
Inhibited
10000000
11111111
Horizon-
tal
Dynamic
Focus
with:
Ampli-
tude
03 10 X000 0000
X111 1111 -
--
Horizon-
tal
Dynamic
Focus
with:
Symme-
try
04 10
X000 00 00
X111 1111 -
--
Function Sub
Address Pin Byte Specification Effect on Screen
= -3%
=+3%
TDA9109A
22/47
Keystone
(Trape-
zoid)
Control
09 24
(E/W + Cor-
ner
Inhibited)
10000000
11111111
E/W
(Pin
Cushion)
Control
0A 24
(Keystone
+ Corner
Inhibited)
10000000
11111111
Corner
Control 10 24
(Keystone+E/W Inhibited)
11111111
10000000
Parallel-
ogram
Control 0E
(SPB Inhibited)
10000000
11111111
Function Sub
Address Pin Byte Specification Effect on Screen
0.4V EWDC
0.4V EWDC
EWDC 0V
EWDC
1.4V
1.25V
EWDC
EWDC
1.25V
Internal
2.8% T
H
2.8% T
H
TDA9109A
23/47
Side Pin
Balance
Control 0D
(Parallelogram Inhibited)
10000000
11111111
Vertical
Dynamic
Focus
with
Horizon-
tal
0F 10 X111 1111
—X000
0000 ---
Function Sub
Address Pin Byte Specification Effect on Screen
Internal
2.8% T
H
2.8% T
H
TDA9109A
24/47
I2C BUS ADDRESS TABLE
Slave Address (8C): Write Mode
Sub Address Definition
Slave Address (8D): Read Mode
No sub address needed.
D8 D7 D6 D5 D4 D3 D2 D1
000000000Horizontal Drive Selection/Horizontal Duty Cycle
100000001X-ray Reset/Horizontal Position
200000000
3 0 - - 1 0 0 1 1 Sync. Priority/Horizontal Focus Amplitude
4 0 - - 1 0 1 0 0 Refresh/Horizontal Focus Keystone
500000101Vertical Ramp Amplitude
600000110Vertical Position Adjustment
700000111S Correction
800001000C Correction
900001001E/W Keystone
A00001010E/W Amplitude
B00001011B+ Reference Adjustment
C00001000Vertical Moiré
D00001001Side Pin Balance
E00001010Parallelogram
F00001011Vertical Dynamic Focus Amplitude
1000010000E/W Corner
TDA9109A
25/47
I2C BUS ADDRESS TABLE
D8 D7 D6 D5 D4 D3 D2 D1
WRITE MODE
00 [HDrive
0, off
[1], on0] [0] Horizontal Duty Cycle
[0] [0] [0] [0] [0]
01 Xray
1, reset
[0]
Horizontal Phase Adjustment
[1] [0] [0] [0] [0] [0] [0]
02
03 Sync
0, Comp
[1], Sep
Horizontal Focus Amplitude
[1] [0] [0] [0] [0]
04 Detect
Refresh
[0], off
Horizontal Focus Time Position
[1] [0] [0] [0] [0]
05 Vramp
0, off
[1], on
Vertical Ramp Amplitude Adjustment
[1] [0] [0] [0] [0] [0] [0]
06 Vertical Position Adjustment
[1] [0] [0] [0] [0] [0] [0]
07 S Select
1, on
[0]
S Correction
[1] [0] [0] [0] [0] [0]
08 C Select
1, on
[0]
C Correction
[1] [0] [0] [0] [0] [0]
09 E/W Key
0, off
[1]
E/W Keystone
[1] [0] [0] [0] [0] [0]
0A E/W Sel
0, off
[1]
E/W Amplitude
[1] [0] [0] [0] [0] [0] [0]
0B Test H
1, on
[0], off
B + Reference Adjustment
[1] [0] [0] [0] [0] [0] [0]
0C Test V
1, on
[0], off
Moiré
1, on [0]
Vertical Moiré
[0] [0] [0] [0] [0]
0D SPB Sel
0, off
[1]
Side Pin Balance
[1] [0] [0] [0] [0] [0]
0E Parallelo
0, off
[1]
Parallelogram
[1] [0] [0] [0] [0] [0]
TDA9109A
26/47
[x] Initial value
Data is transferred with vertical sawtooth retrace.
We recommend setting the unspecified bit to [0] in order to ensure compatibility with future devices.
0F Eq. Pulse
1, on
[0], off
Vertical Dynamic Focus Amplitude
[1] [0] [0] [0] [0] [0]
10 Corner
1, on
[0], off
Corner Amplitude Adjustment
[1] [0] [0] [0] [0] [0]
READ MODE
Hlock
0, on
[1], no
Vlock
0, on
[1], no
Xray
1, on
[0], off
Polarity Detection Sync Detec tio n
H/V pol
[1], nega-
tive
V pol
[1], nega-
tive
Vext det
[0], no det H/V det
[0], no det V det
[0], no det
D8 D7 D6 D5 D4 D3 D2 D1
TDA9109A
27/47
OPERATING DESCRIPTION
1 GENERAL CONSIDERATIONS
1.1 Power Supply
The typical values of the power supply voltages
VCC an d VDD are 12 V a nd 5 V respe ctiv ely. Opti -
mum operation is obtained for VCC between 10.8
and 13.2 V and VDD between 4.5 and 5.5 V.
In order to avoid erratic operation of the circuit dur-
ing the transient phase of VCC switching on, or off,
the value of VCC is monitored: if VCC is less than
7.5 V typ., the outputs of the circuit are inhibited.
Similar ly, before VDD rea ches 4 V, all t he I2C re g-
ister are rese t to their defau lt value (see I2C Con-
trol Table).
In order to have very good power supply rejection,
the circui t is inte rnally supp lied b y sever al vol tage
references (typ. value: 8.2 V). Two of these volt-
age references are externally accessible, one for
the vertical and one for the horizontal part. They
can be used to bias external circuitry (if ILOAD is
less than 5 mA). It is necessary to filter the voltage
references by external capacitors connected to
ground, i n o rder to mi ni mize the noise a nd conse-
quently the “jitter” on vertical and horizontal output
signals.
1.2 I2C Control
TDA9109A belongs to the I2C controlled device
family. Ins tea d o f b ein g co ntr ol led by DC vol tag es
on dedicated control pins, each adjustment can be
done via the I2C Interface.
The I2C bus is a serial bus with a clock and a data
input. The general function and the bus protocol
are specified in the Philips-bus data sheets.
The interface (Data and Clock) is a comparator
whose threshold is 2.2 V with a 5 V supply. Spikes
of up to 50 ns ar e f il tered by a n i nte gr ator and the
maximum clock speed is limited to 400 kHz.
The data line (SDA) can be used bidirectionally. In
read-mode the IC sends reply information
(1 byte) to the micro-processor.
The bus protocol prescribes a full-byte transmis-
sion in all c ases. The first by te after the start co n-
dition is u se d t o tran smit the IC-ad dr es s (h ex a 8 C
for write, 8D for read).
1.3 Write Mode
In write mode the second byte sent contains the
subaddress of the selected function to adjust (or
controls to affect) and the third byte the corre-
sponding data byte. It is possible to send more
than one dat a byte to t he IC. If afte r the thi rd byte
no stop or start condition is detected, the circuit in-
crements automatically by one the momentary
subaddress in the subaddress counter (auto-incre-
ment mode). So it is possible to transmit immedi-
ately th e following d ata bytes without sending the
IC address or subaddress. This can be useful to
reinitialize all the controls very quickly (flash man-
ner). This procedure can be finished by a stop con-
dition.
The circuit has 18 adjustment capabilities: 3 for the
horizontal part, 4 for the vertical, 3 for the
E/W correction, 2 for the dynamic horizontal phase
contro l, 2 for the vertical and h orizontal Moir é op-
tions, 3 for the horizontal and the vertical dynamic
focus and 1 for the B+ reference adjustment.
18 bits are also dedicated to several controls (ON/
OFF, Horizo ntal Forced Frequ ency, Sync P riority,
Detection Refresh and XRAY reset).
1.4 Read Mode
During the read mode the second byte transmits
the reply information.
The reply byte c ont ain s th e ho rizo ntal and ve rti c al
lock/unlock status, the XRAY activation status
and, the horizontal and vertical polarity detection.
It also c ontains the sync de tection statu s which i s
used by the MCU to assign the sync priority. A
stop condition always stops all the activities of the
bus decoder and switches to high impedance both
the data and clock line (SDA and SCL).
See I2C subaddress and control tables.
1.5 Sync Processor
The internal sync processor allows the TDA9109A
to accept:
separated hor i zontal & vertical TTL-
compatible sync signal
composite horizontal & vertical TTL-
compatible sync signal
TDA9109A
28/47
1.6 Sync Identification Status
The MCU can read (address read mode: 8D) the
status register via the I2C bus, and then select the
sync priority depending on this status.
Among other data this reg ister indic ates the pres -
ence of sync pulses on H/HVIN, VSYNCIN and
(when 12 V is su pplied) whether a Vext has been
extracted from H/HVIN. Both horizontal and verti-
cal sync are detected even if only 5 V is supplied.
In order to choo se the rig ht sync prio rity the MCU
may proceed as follows (see I2C Address Table):
refresh the status register
wait at least for 20ms (Max. vertical period)
read this status register
Sync priority choice should be:
Of course, when the choice is made, we can re-
fresh the sync detections and verify that the ex-
tracted Vsync is present and that no sync type
change has occurred. The sync processor also
gives sync polarity information.
1.7 IC status
The IC can inform the MCU about the 1st horizon-
tal PLL and vertical section status (locked or not)
and about the XRAY protection (activated or
not).Resetting the XRAY internal latch can be
done either by decreasing the VCC supply or di-
rectly resetting it via the I2C interface.
1.8 Sync Inputs
Both H/HVIN and VSYNCIN inputs are TTL com-
patible tr i ggers w ith hy st eres is t o a vo id er rati c de -
tect ion. Both i nputs inc lude a pu ll up resis tor con-
nected to VDD.
1.9 Sync Processor Output
The sync processor in dicates on the D 8 bit of the
status regi ster whet her 1s t PLL is loc ked to an in -
coming horizontal sync. Its level goes to low when
locked. This information is also av ailable on pin 3
when sub-address 02 D8 is equal to 1. When PLL1
is unlocked, pin 3 output voltage goes to 5V.
2 HORIZONTAL PART
2.1 Internal Input Conditions
A digital signal (horizontal sync pulse or TTL com-
posite) is sent by the sync processor to the hori-
zontal input. It may be positive or negative (see
Figure 5).
Using i nternal integrati on, both signa ls are recog-
nized if Z/T < 25%. Sync hron iz ati on oc cu rs on the
leading edge of the internal sync signal.
The minimum value of Z is 0.7 µs.
Another integration is able to extract the vertical
pulse from composite sync if the duty cycle is high-
er than 25% (typically d = 35%),
(see Figure 6).
Vextd
et HV
det V
det
Sync
priority
Subaddress
03 (D8)
Comment
Sync type
No Yes Yes 1 Sepa rat ed H& V
Yes Yes No 0 Composite TTL H&V
TDA9109A
29/47
Figure 5.
Figure 6.
The last feature performed is the removal of equal-
ization pulses to avoid parasitic pulses on the
phase comparator (which would be disturbed by
missing or extrane ous pulse s). This last feat ure is
switched on/off by sub -addres s 0F D8. By default
[0], equalization pulses will not be removed.
2.2 PLL1
The PLL1 consi sts of a phase comp arator, an ex-
ternal filter and a voltage-controlled oscillator
(VCO).The phase comparator is a “phase frequen-
cy” typ e designed in CMOS tech nology . This kind
of phase detector avoids locking on wrong fre-
quenci es. It is foll owed by a “charge pump” , com-
posed of two current sources : sunk and sourced
(typically I =1 mA when locked and I = 140 µA
when u nlocked ). This differe nce between lock /un-
lock allows smooth catching of the horizontal fre-
quency by PLL1. This effect is reinforced by an in-
ternal original slow down system when PLL1 is
locked, avoiding the horizontal frequency chang-
ing too quickly. The dynamic behavior of PLL1 is
fixed by an ex ter n al fi lte r whic h in tegr a tes the cur -
rent of the charge pump. A “CRC” filter is generally
used (see Figure 7)
Figure 7.
7
4
.7µF
PLL1F
10nF
1.8k
TDA9109A
30/47
The PLL1 is internally inhibited during extracted
vertical sync (if any) to avoid taking in account
missing pulses or wrong pulses on phase
comparator. Inhibition is obtained by stopping high
and low signals at the entry of the charge pump
block (see Figure 8).
Figure 8.
Figure 9.
The VCO uses an external RC network. It delivers
a linear sawto oth obtained by the charge and the
discharge of the capacitor, with a current propor-
tional to the current in the resistor. The typical
thresholds of the sawtooth are 1.6 V and 6.4 V.
The control voltage of the VCO is between 1.4 V
and 6.4 V (see Figur e 9 ). The theo retical fre quen-
cy range of this VCO is in the ratio of 1 to 4.5. The
effective frequency range has to be smaller (1 to
4.2) due to clamp intervention on the filter lowest
value.
The sync frequency must always be higher than
the free running frequency. For example, when us-
ing a sync ran ge bet ween 24.8 kHz and 100 kHz,
the suggested free running frequency is 23 kHz.
PLL1 ensures the coincidence between the lead-
ing edge of the sync signal and a phase reference
obtained by comparison between the sawtooth of
the VCO and an internal DC voltage which is I2C
adjustable between 2.9 V and 4.2 V (correspond-
ing to ±10 %) (see Figure 10).
TDA9109A
31/47
The TDA910 9A a lso i nc lud es a Lo ck /Unl oc k ide n-
tification block which senses in real time whether
PLL1 is locked or not on the incoming horizontal
sync signal.
The lock/unlock information is available through
the I2C read and the pin 3 voltage level
PLL1 Timing Diagram
Figure 10.
2.3 PLL2
PLL2 ensures a constant position of the shaped
flyback signal in comparison with the sawtooth of
the VCO, taking into account the saturation time
Ts (see Figure 11)
Figure 11. PLL2 Timing Diagram
The phas e compa rator of P LL2 (ph ase type c om-
parator) is followed by a charge pump (typical out-
put current: 0.5 mA).
The flyback input consists of an NPN transistor.
This input must be current driven. The maximum
recommended input current is 5 mA
(see Figure 12).
Figure 12. Flyback Input Electrical Diagram
The duty cycle is adjustable through I2C from 30 %
to 65 %. For a safe start-up operation, the initial
duty cycle (after power-on reset) is 65% in order to
avoid having too long a conduction period of the
horizontal scanning transistor.
The max imum storage time (Ts Max.) is ( 0.44TH-
TFLY/2). Typically, TFLY/TH is around 20 % which
means that Ts max is around 34 % of TH.
The PLL1 ensures the exact coincidence between the
signal phase REF and HSYNC. A ±10% TH phase
adjustment is possible around the 3.4V point.
Phase REF1 is obtained by comparison between
the sawtooth and a DC voltage adjustable between
2.9 V and 4.2 V.
HO
SC
Sawtooth 7/8 TH
1/8 T
H
6.4V
Ref. for H Position
Vb
(2.9V<Vb<4.2V)
1.6V
REF1
HSync
HOsc
Sawtooth 7/8TH
1/8 T
H
Flyback
Internally
shaped Flyback
HDrive Ts
Duty Cycle
1.6V
4.0V
6.4V
500
HFly 12 Q1
GND 0V
20k
TDA9109A
32/47
2.4 Output Section
The H-dri ve signal is s ent to the out put through a
shaping stage which also controls the H-drive duty
cycle (I 2C adjustab le) (see Figure 11). In order to
secure the scanning power part operation, the out-
put is inhibited in the following cases:
when VCC or VDD are too low
when the XRAY protection is activated
during the Horizontal flyback
when the HDrive I2C bit control is off
The output stage consists of a NPN bipolar tran-
sistor. Only the collector is accessible
(see Figure 13).
Figure 13.
This output stage is intended for “reverse” base
control, where setting the output NPN in off-state
will control the power scanning transistor in off-
state.
The maximum output current is 30mA, and the
corresponding voltage drop of the output VCEsat is
0.4V Max.
Obviously the power scanning transistor cannot be
directly driven by the integrated circuit. An inter-
face has to be added betwe en the circuit and the
power transistor either of bipolar or MOS type.
2.5 X-RAY Protection
The X-Ray protection is activated by application of
a high level on the X-Ray input (8.2V on Pin 25). It
inhibits the H-Drive and B+ outputs.
This activation is internally delayed by 2 lines to
avoid erratic detection (short parasitics).
This protection is latched; it may be reset either by
VCC switch off or by I2C (see Figure 14).
Figure 14. Safety Functions Block Diagram
TDA9109A
33/47
2.6 Horizontal and Vertical Dynamic Focus
The TDA9109A delivers a horizontal parabola
which is added on a vertical parabola waveform on
Pin 10. This horizontal parabola comes from a
sawtooth in phase advance with flyback pulse mid-
dle. The time advance versus horizontal flyback
middle is kept constant versus frequency (about
1µs).
Symmetry and amplitude are I2C adjustable (see
Figure 15). The vertical dynamic focus is tracked
with VPOS and VAMP. Its amplitude can be ad-
justed. It is also affected by S and C corrections.
This posi tiv e s i gnal once am pli fied i s to b e s en t to
the CRT focusing grids.
Figure 15. Phase of HFocus Parabola
TDA9109A
34/47
3 VERTICAL PART
3.1 Function
When the synchronization pulse is not present, an
internal current source sets the free running fre-
quency. For an external capacitor, COSC = 150nF,
the typical free running frequency is 100Hz.
The typical free running frequency can be calculat-
ed by:
fo(Hz) = 1.5 . 10-5 .
A negative or positive TTL level pulse applied on
Pin 2 (VSYNC) as well as a TTL composite sync
on Pin 1 can synchronize the ramp in the range
[fmin, fmax] (See Figure 16). This frequency range
depends on the external capacitor connected on
Pin 22. A 150nF (± 5%) capacitor is recommended
for 50Hz to 185Hz applications.
If a synchronization pulse is applied, the internal
oscillator is synchronized immediately but with
wrong amplitude. An internal correction then ad-
justs it in less than half a second. The top value of
the ramp (P in 22) is sam pled on the AG C capaci -
tor (Pin 20) at each clock pulse and a transcon-
ductance amplifier modifies the charge current of
the capacitor in such a way to make the amplitude
constant agai n.
The read status register provides the vertical Lock-
Unlock and the vertical sync polarity information.
We rec omm end the us e of a n A GC c ap aci tor with
low leakage current. A value lower than 100nA is
mandatory.
A good stability of the internal closed loop is
reached by a 470nF ± 5% capacitor value on Pin
20 (VAGC).
3.2 I2C Control Adjustments
S and C correction shapes can then be added to
this r amp. These fr equency- independen t S and C
corrections are generated internally. Their ampli-
tudes ar e adjus table by their respec tive I2C regis-
ters. They can also be inhibited by their "select"
bits.
Finally, the amplitude of this S and C corrected
ramp ca n be adjusted by the vertical ramp ampli-
tude control register.
The adjusted ramp is available on Pin 23 (V OUT) to
drive an external power stage.
The ga in o f this stage can b e adj ust ed (± 25%) de-
pending on its register value.
The mean value of this ramp is driven by its own
I2C register (vertical position). Its value is
VPOS = 7/16 . VREF-V ± 400mV.
Usually VOUT is sen t thro ugh a resi stiv e divid er to
the inverting input of the booster. Since VPOS de-
rives fr om VREF-V, the bias voltage sent to the non-
inverting input of the booster should also derive
from VREF-V to optimize the accuracy (see Appli-
cation Dia gram) .
3.3 Vertical Moiré
By using the vertical moiré, VPOS can be modulat-
ed from frame to frame. This function is intended
to cancel the fringes which appear when the line to
line interval is very close to the CRT vertical pitch.
The amplitude of the modulation is controlled by
register VMOIRE on sub-address 0C and can be
switched-off via the control bit D8.
1
COSC
TDA9109A
35/47
Figure 16. AGC Loop Block Diagram
3.4 Basic Equations
In first approximation, the amplitude of the ramp
on Pin 23 (VOUT) is:
VOUT - VPOS = (VOSC - VDCMID) . (1 + 0. 3 (VAMP))
where:
VDCMID = 7/16 VREF (middle va lue o f the ramp on
Pin 22, typically 3.6V)
VOSC = V22 (ramp with fixed amplitude)
VAMP = -1 for minimum vertical amplitude register
va lue and +1 f or maximum
VPOS is calculated by:
VPOS = VDCMID + 0.4 VP
where VP = -1 for mi nimum vert ical p osition r egis -
ter value and +1 for maximum.
The current available on Pin 22 is:
IOSC = . VREF . COSC . f
where COSC = capa ci tor c onn ec ted o n Pi n 22 and
f = synchronization frequency.
Geometric Corrections
The principle is represented in Figure 17.
Starting from the vertical ramp, a parabola-shaped
current is generated for E/W correction (also
known as Pin Cushion correction), dynamic hori-
zontal phase control correction, and vertical dy-
namic focus correction.
The parabola generator is made by an analog mul-
tiplier, the output current of which is equal to:
I = k . (VOUT - VDCMID)2
where VOUT is the vertical output ramp (typically
between 2 and 5V) and VDCMID is 3.6V
(for VREF-V = 8.2V). The VOUT sawtooth is typical-
ly centered on 3.6V. By changing the vertical posi-
tion, the sawtooth shifts by ±0.4V.
To provide good screen geometry for any end user
adjustment, the TDA9109A has the “geometry
tracking” feature which allows generation of a dis-
symetri c parabola d epending on th e vertical posi-
tion.
Due to the lar ge output stage voltag e range (E/W
Pin Cushion, Keystone, E/W Corner), the combi-
nation of the tracking function, maximum vertical
amplitu de, maxim um or minim um vertica l position
and maximum gain on the DAC control may lead
to output stage saturation. This must be avoided
by limi ting the output volta ge with appropriate I2C
register values.
VSYNCIN 2 Synchro
Polarity
Oscillator
Discharge.
22
OSC
CAP
Sampling Sampling
Capacitance
S Correction
VS Amp
sub-add 07/7bits
Cor_C
sub-add 08/7bits
C Correcti on
18
BREATH
23
VOut
Vert. Amp
sub-.05/7bits
VMoiré
sub.0C/7bits
V Position
sub.06/7bits
Vlow
sawth
.
disch.
REF
Charge Current Transconductance Amplifier
3
8
TDA9109A
36/47
For the E/W part and the dynamic horizontal
phase con trol part, a s awtooth-sha ped differenti al
current in the following form is generated:
I’ = k’ . (VOUT - VDCMID)
Then I and I’ are added and converted into volt-
age for the E/W part.
Each of the two E/W components or the two dy-
namic horizontal phase control components may
be inhibited by their own I2C select bit.
The E/W parabola is available on Pin 24 via an
emitter follower output stage which has to be bi-
ased by an external resistor (10k to ground).
Since stable in temperature, the device can be DC
coupled with external circuitry.
The vertical dynamic focus is combined with the
horizontal focus on Pin 10.
The dynamic horizontal phase control drives inter-
nally the H- position , moving the HFLY pos ition on
the horizont al sawtooth in the range of ± 2.8 %TH
both for side pin balance and parallelogram.
Figure 17. Geometric Corrections Principle
3.5 E/W
EWOUT = EWDC + K1 (VOUT - VDCMID) +
K2 (VOUT - VDCMID)2+ K3 (VOUT - VDCMID)4
K1 is adjustable by the keystone I2C register.
K2 is adjustable by the E/W amplitude I2C register.
K3 is adjustable by the E/W corner I2C register.
3.6 Dynamic Horizontal Phase Control
IOUT= K4 (VOUT - VDCMID) + K5 (VOUT - VDCMID)2
K4 is adjustable by the parallelogram I2C register.
K5 is adjustable by the side pin balance I2C regis-
ter.
TDA9109A
37/47
4 DC/DC CONVERTER PART
This unit controls the switch-mode DC/DC con-
verter. It converts a DC constant voltage into the
B+ voltage (roughly proportional to the horizontal
frequency) necessary for the horizontal scanning.
This DC/DC con verter can be configured either in
step-up or step-down mode. In both cases it oper-
ates very similarly to the well known UC3842.
4.1 Step-up Mode
Operating Description
The power MOS is switched-on during the
flyback (at the beginning of the positive slope
of the horizontal focus sawtooth).
The power MOS is switched-off when its
current reaches a predetermined value. For
this pu rpose , a sens e resis tor is ins erted in it s
source. The voltage on this resistor is sent to
Pin16 (ISENSE).
The feedback (coming either from the EHV or
from the flyback) is divided to a voltage close
to 5.0V and compared to the internal 5.0V
reference (IVREF). The difference is amplified
by an error amplifier, the output of which
controls the power MOS switch-off current.
Main Features
Switching synchronized on the horizontal
frequency
B+ voltage always higher than the DC source
Current limited on a pulse-by-pulse basis
The DC/DC converter is disabled:
when VCC or VDD are too low
when X-Ray protection is latched
directly through I2C bus
When disabled, BOUT is driven to GND by a
0.5mA current source. This feature allows to im-
plement externally a soft start circuit.
4.2 Step-down Mode
In step-down mode, the ISENSE information is not
used any more and therefore not sent to the
Pin16. This mode is selected by connecting Pin16
to a DC voltage higher than 6V (for example VREF-
V).
Operating Description
The power MOS is switched-on as for the
step-up mode
The feedback to the error amplifier is done as
for the step-up mode
The power MOS is switched-off when the
HFOCUSCAP voltage get higher than the
error amplifier output voltage
Main Features
Switching synchronized on the horizontal
frequency
B+ voltage always lower than the DC source
No current limitation
4.3 Step-up and Step-down Mode Comparison
In step-down mode the control signal is inverted
compared with the step-up mode.
The reason for this, is the following:
In step-up mode, the switch is a N-channel
MOS referenced to ground and made
conductive by a high level on its gate.
In step-down, a high-side switch is necessary.
It can be either a P- or a N-channel MOS .
– For a P-channel MOS, the gate is controlled
directly from Pin 28 through a capacitor (this
allows to spare a Transformer). In this case, a
negative-going pulse is needed to make the
MOS conductive. Therefore it is necessary to
invert the control signal.
– For a N-channel MOS, a transformer is
needed to control the gate. The polarity of the
transformer can be easily adapted to the neg-
ative-going control pulse.
TDA9109A
38/47
Figure 18. DC/DC Convertor
I2CDAC
7bits
6.2V
5V±20% 85dB
A
inhibit
Soft
start
Σ1/3
1.3V
1.3V
C2
C3
8V 6V C4
down
up
HDF Disc
400ns
S
RQ
inhibit
down
up
BOUT
12V
TDA9109A
REGIN COMP
15 14 16
22k1M
EHV
Feedback VB+
L
Command step-up/down
ISENSE
28
C1
-
+
Horizont al Dy nam ic
Focus Sawtooth
±Iadjust
TDA9109A
39/47
INTERNAL SCHEMATICS
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
R0
6
12V
HREF
13
TDA9109A
40/47
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
TDA9109A
41/47
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
TDA9109A
42/47
Figure 37.
Figure 38.
Figure 39.
TDA9109A
43/47
Figure 40. Demonstration Board
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16 17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
H/HVIN
VSYNCIN
HLock out
PLL2C
C0
R0
PLL1F
H
HFOCUS-
CAP
FOCUS
OUT
HGND
HFLY
HREF
COMP
REGIN
ISENSE
+5V
SDA
SCL
VCC
B+OUT
GND
HOUT
XRAY
EWOUT
VOUT
VCAP
VREF
VAGCCAP
VGND
BREATH
B+GND
POSITION
TP1
J11
TP13
TP17 J12 TP16
TP10
C7 22nF
C28
820pF 5%
R23
(***)
C13 10nF
C31 4.7µF
R36
C17 470nF
C34
820pF 5%
HREFC33
100nF
C27
47µF
C46
1nF
R50
1M
C51
22µF
JP1
R89
33k
R51
1k
ISENSE
GND
B+OUT
REGIN
C47
100pF
R58
10
+12V
C60
100nF
R77
15k
R74
10k
R73
1M
R75
10k
TP8
EHT
COMP R76
47kP1
10k
CON4
J19
1
2
3
4
DYN
FOCUS R24
10kL
47µH
R25
1k
J9
HFLY
J8 C22
33pF R8
10k
HOUT
C25
33pF
R10
10k
R35
10k
+12V
PC2
47k
CC4
47pF +12V
CC1
100nF
CC2
10µF
+12V
CC3
47pF
PC1
47k
-12V
1 234 5678
910111213141516
VCC
TB1
TB2
CDB
IB
QB
QB
IB
TA1
TA2
CDA
IA
IA
QA
QA
GND
ICC1
MC1 4528
C50
10µF
L3
22µH
Q4
BC557
Q5
BC547
C2
100nF
C3
47µF
470nF
C15
C12
150nF
+12V
R52
3.9k
R45 33k
R7 10k
C49
100nF
HOUT C48
10µF
R53
1k
+12V R56
560k
D2
1N4148
+12V
C5
100µF
C6
100nF
C30
100µFC32
100nF
L1
22µH
+5V
J16 J15
+5V
R39
4.7kR29
4.7kR42
100
J14
1234
C39
22pF
C40
22pF
R41
100SCL
SDA
C38
33pF
C45
10µFR49
22k
+5V
IC3-STV9422
TILT
J13
R43
10k
C42
1µF
R30
10k
+5V
C43
47µF
C37
33pF
X1
8MHz
123456789101112
13 14 15 16 17 18 19 20 21 22 23 24
PWM4
PWM5
SCL
SDA
RST
GND
R
G
B
TEST
PWM6
PWM7
PWM3
PWM2
XTALIN
XTALOUT
CKOUT
PXCK
VDD
HSYNC
VSYNC
FBLK
PWM1
PWM0
E/W POWER STAGE
R38
2.2
3W J1
E/W
R19
270k
C11220pF
Q3
TIP122
R18
10k
R33
4.7k
R9
470
R34
1kQ1
BC557 Q2
BC557
R37
27kR15
1kR17
43k
C36
1µF
+12V
J2
J3
J6
1
2
3
J18
VYOKE
R11
220
0.5W
R4
1
0.5W
R5
5.6
+12V
-12V
TP3
TP4
TP6
TP7
C9
100nF
C14
470µF
C10
100µF
35V
D1
1n4004
-12V C10
470µFC8
100nF
C1
220nF R3
1.5
C4
100nF
R2
5.6k
IC1
TDA8172
R40
36k
R1
12k
C41
470pF
VERTICAL DEFLECTION STAGE
J17
HOUT
C16 (*)
IC4
TDA9109A
TP14
D10
1N4148
D9
1N4148 D8
1N4148
R90
10k
R78
10
(∗∗)
R31
27k (**)
(**)
(**)
(**) see table
9109A 9111
R78 Shorted Mounted
R90 Removed Mounted
R31 Mounted Removed
R17 270k43k
R18 39k10k
(*) optional
+12V
TP22
1.8k
(***)
For R23=6.49kf0=22.8kHz typ
For R23=5.23kf0=28.3kHz typ
TDA9109A
44/47
Figure 41. PCB Layout
TDA9109A
45/47
Figure 42. Components Layout
TDA9109A
46/47
PACKAGE MECHANICAL DATA
32 PINS - PLASTIC SHRINK
Dimensions Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 3.556 3.759 5.080 0.140 0.148 0.200
A1 0.508 0.020
A2 3.048 3.556 4.572 0.120 0.140 0.180
B 0.356 0.457 0.584 0.014 0.018 0.023
B1 0.762 1.016 1.397 0.030 0.040 0.055
C .203 0.254 0.356 0.008 0.010 0.014
D 27.43 27.94 28.45 1.080 1.100 1.120
E 9.906 10.41 11.05 0.390 0.410 0.435
E1 7.620 8.890 9.398 0.300 0.350 0.370
e 1.778 0.070
eA 10.16 0.400
eB 12.70 0.500
L 2.540 3.048 3.810 0.100 0.120 0.150
eA
eB
E1
E
D
32 17
16
1
Stand-off
e
B1B
A2
A1
A
L
C
TDA9109A
47/47
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responsibility for the consequences of use of such information nor for any infringement of patents or other
rights of third parties which may result from its use. No license is granted by implication or otherwise under
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to change without notice. This publication supersedes and replaces all information previously supplied.
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