LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode Check for Samples: LM185-2.5-N, LM285-2.5-N, LM385-2.5-N FEATURES Careful design of the LM185-2.5-N has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. 1 * 2 * * * * * 20 mV (0.8%) max. Initial Tolerance (A Grade) Operating Current of 20 A to 20 mA 0.6 Dynamic Impedance (A Grade) Low Temperature Coefficient Low Voltage Reference--2.5V 1.2V Device and Adjustable Device Also Available--LM185-1.2 Series and LM185 Series, respectively DESCRIPTION The extremely low power drain of the LM185-2.5-N makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. For applications requiring 1.2V see LM185-1.2. The LM185-2.5-N/LM285-2.5-N/LM385-2.5-N are micropower 2-terminal band-gap voltage regulator diodes. Operating over a 20 A to 20 mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM-185-2.5-N band-gap reference uses only transistors and resistors, low noise and good long term stability result. The LM185-2.5-N is rated for operation over a -55C to 125C temperature range while the LM285-2.5-N is rated -40C to 85C and the LM385-2.5-N 0C to 70C. The LM185-2.5-N/LM285-2.5-N are available in a hermetic TO package and the LM285-2.5-N/LM3852.5-N are also available in a low-cost TO-92 molded package, as well as SOIC and SOT-23. The LM1852.5-N is also available in a hermetic leadless chip carrier package. Connection Diagram Figure 1. TO-92 Package (Bottom View) See Package Number LP0003A Figure 2. SOIC Package See Package Number D0008A * Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating. Figure 3. SOT-23 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2013, Texas Instruments Incorporated LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 www.ti.com Figure 4. LCCC Leadless Chip Carrier See Package Number NAJ0020A Figure 5. TO Package (Bottom View) See Package Number NDU0002A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) Reverse Current 30 mA Forward Current 10 mA Operating Temperature Range (4) LM185-2.5-N -55C to + 125C LM285-2.5-N -40C to + 85C LM385-2.5-N 0C to 70C ESD Susceptibility (5) 2kV -55C to + 150C Storage Temperature TO-92 Package (10 sec.) Soldering Information 260C TO Package (10 sec.) 300C SOIC and SOT-23 Package Vapor Phase (60 sec.) 215C Infrared (15 sec.) 220C See http://www.ti.com for other methods of soldering surface mount devices. (1) (2) (3) (4) (5) Refer to RETS185H-2.5 for military specifications. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. For elevated temperature operation, TJ MAX is: LM185-N: 150C LM285-N: 125C LM385-N: 100C See THERMAL CHARACTERISTICS. The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) LM185 Thermal Resistance ja (Junction to Ambient) 150C LM285 125C LM385 100C TO-92 TO 180C/W (0.4 Leads) SOIC-8 SOT-23 440C/W 165C/W 283C/W 80C/W N/A N/A 170C/W (0.125 Leads) jc (Junction to Case) 2 N/A Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS LM385A-2.5-N Parameter Conditions LM385AX-2.5-N Typ LM385AY-2.5-N Tested Limit (2) Reverse Breakdown IR = 100 A 2.500 Voltage Design Limit (3) 2.480 V(Min) 2.520 2.500 Minimum Operating 12 18 V(Max) 2.470 V(Min) 2.530 V(Max) 20 Current Reverse Breakdown A (Max) IMIN IR 1mA 1 1.5 Voltage Change with Current Units (Limits) mV (Max) 1 mA IR 20 mA 10 20 mV (Max) Reverse Dynamic IR = 100 A, Impedance f = 20 Hz Wideband Noise (rms) IR = 100 A 0.2 0.6 1.5 120 V 20 ppm 10 Hz f 10 kHz Long Term Stability IR = 100 A, T = 1000 Hr, TA = 25C 0.1C Average Temperature Coefficient (4) IMIN IR 20 mA X Suffix 30 Y Suffix 50 ppm/C (Max) All Others (1) (2) (3) (4) 150 Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25C. Specified and 100% production tested. Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between the operating TMAX and TMIN, divided by TMAX-TMIN. The measured temperatures are -55C, -40C, 0C, 25C, 70C, 85C, 125C. Copyright (c) 1999-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 3 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS LM185-2.5-N LM385B-2.5-N LM185BX-2.5-N LM185BY-2.5-N Parameter Conditions Typ LM385BX-2.5-N LM285-2.5-N LM285BX-2.5-N LM385-2.5-N LM385BY-2.5-N Units (Limit) LM285BY-2.5-N Tested Limit (1) (2) Design Limit (3) Reverse Breakdown TA = 25C, Voltage 2.5 20 A IR 20 mA Minimum Operating Current 13 Tested Limit (1) Design Limit (3) Reverse Dynamic IR = 100 A, Impedance f = 20 Hz Wideband Noise (rms) IR = 100 A, Long Term Stability 10 Hz f 10 kHz Design Limit (3) 2.462 2.462 2.425 V(Min) 2.538 2.538 2.575 V(Max) 30 A (Max) 20 30 20 30 20 15 20 1 1.5 2.0 2.5 2.0 2.5 mV (Max) 10 20 20 25 20 25 mV (Max) LM385M3-2.5-N Reverse Breakdown 20 A IR 1 mA Voltage Change with Current 1 mA IR 20 mA Tested Limit (1) 1 120 V 20 ppm IR = 100 A, T = 1000 Hr, TA = 25C 0.1C Average Temperature Coefficient (4) IR = 100 A X Suffix 30 30 Y Suffix 50 50 All Others 150 ppm/C ppm/C 150 150 ppm/C (Max) (1) (2) (3) (4) 4 Specified and 100% production tested. A military RETS electrical specification available on request. Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between the operating TMAX and TMIN, divided by TMAX-TMIN. The measured temperatures are -55C, -40C, 0C, 25C, 70C, 85C, 125C. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Reverse Characteristics Reverse Characteristics Figure 6. Figure 7. Forward Characteristics Temperature Drift Figure 8. Figure 9. Reverse Dynamic Impedance Reverse Dynamic Impedance Figure 10. Figure 11. Copyright (c) 1999-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 5 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Noise Voltage Filtered Output Noise Figure 12. Figure 13. Response Time Figure 14. 6 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 APPLICATIONS Figure 15. Wide Input Range Reference Figure 16. Micropower Reference from 9V Battery LM385-2.5-N Applications IQ 30 A standby current IQ 40 A Figure 17. Micropower 5V Reference Figure 18. Micropower 10V Reference PRECISION 1 A to 1 mA CURRENT SOURCES Figure 19. METER THERMOMETERS Copyright (c) 1999-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 7 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 www.ti.com Calibration Calibration 1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1A/K. 1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1.8 A/K 2. Remove short, adjust R2 for correct reading in centigrade 2. Remove short, adjust R2 for correct reading in F Figure 20. 0C-100C Thermomemter Figure 21. 0F-50F Thermomemter Adjustment Procedure 1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck coefficient. 2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2. Figure 22. Micropower Thermocouple Cold Junction Compensator (1) 8 Thermocouple Type (1) Seebeck Coefficient (V/C) R1 () R2 () Voltage Across R1 @25C (mV) Voltage Across R2 (mV) J 52.3 523 1.24k 15.60 14.32 T 42.8 432 1k 12.77 11.78 K 40.8 412 953 12.17 11.17 S 6.4 63.4 150 1.908 1.766 Typical supply current 50 A Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 Figure 23. Improving Regulation of Adjstable Regulators Schematic Diagram Copyright (c) 1999-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 9 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D - DECEMBER 1999 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D * 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM185H-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM185H2.5, LM185 H2.5) LM285BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BX M2.5 LM285BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BX M2.5 LM285BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type -40 to 85 285BX Z2.5 LM285BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BY M2.5 LM285BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BY M2.5 LM285BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type -40 to 85 285BY Z2.5 LM285M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM285 M2.5 LM285MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM285 M2.5 LM285Z-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM285Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type -40 to 85 LM285 Z-2.5 LM385BM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385 BM2.5 LM385BMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385 BM2.5 LM385BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BX M2.5 LM385BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BX M2.5 LM385BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type 0 to 70 385BX Z-2.5 LM385BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BY M2.5 Addendum-Page 1 LM285 Z-2.5 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM385BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BY M2.5 LM385BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type 0 to 70 385BY Z-2.5 LM385BZ-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM385BZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type 0 to 70 LM385 BZ2.5 LM385M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385 M2.5 LM385 BZ2.5 LM385M3-2.5 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 R12 LM385M3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 R12 LM385M3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 R12 LM385MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385 M2.5 LM385Z-2.5/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM385 Z2.5 LM385Z-2.5/LFT2 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM385 Z2.5 LM385Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type 0 to 70 LM385 Z2.5 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM285BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385M3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385M3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP SEATING PLANE (2.54) NOTE 3 2X 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 2X 2.6 0.2 3X 12.7 MIN 3X 3X 0.55 0.38 0.43 0.35 2X 1.27 0.13 FORMED LEAD OPTION STRAIGHT LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION 3X 2.67 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 0.05 MAX ALL AROUND TYP FULL R TYP METAL TYP (1.07) 3X ( 0.85) HOLE 2X METAL (1.5) 2X (1.5) 2 1 (R0.05) TYP 3 2X (1.07) (1.27) SOLDER MASK OPENING 2X SOLDER MASK OPENING (2.54) LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ALL AROUND TYP ( 1.4) 2X ( 1.4) METAL 3X ( 0.9) HOLE METAL (R0.05) TYP 2 1 (2.6) SOLDER MASK OPENING 3 2X SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 8.5 9.75 8.50 19.0 17.5 6.75 5.95 2.9 TYP 2.4 3.7-4.3 TYP 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com MECHANICAL DATA NDU0002A H02A (Rev F) www.ti.com 4203227/C PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 2.64 2.10 1.4 1.2 PIN 1 INDEX AREA 1.12 MAX B A 0.1 C 1 0.95 3.04 2.80 1.9 3X 3 0.5 0.3 0.2 2 (0.95) C A B 0.25 GAGE PLANE 0 -8 TYP 0.10 TYP 0.01 0.20 TYP 0.08 0.6 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 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