LM285BYZ-2.5 NOPB - NATIONAL SEMICONDUCTOR

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode

Check for Samples: LM185-2.5-N,LM285-2.5-N,LM385-2.5-N

Careful design of the LM185-2.5-N has made the

1FEATURES device exceptionally tolerant of capacitive loading,

2• ±20 mV (±0.8%) max. Initial Tolerance (A making it easy to use in almost any reference

Grade) application. The wide dynamic operating range allows

• Operating Current of 20 μA to 20 mA its use with widely varying supplies with excellent

regulation.

• 0.6ΩDynamic Impedance (A Grade) The extremely low power drain of the LM185-2.5-N

• Low Temperature Coefficient makes it useful for micropower circuitry. This voltage

• Low Voltage Reference—2.5V reference can be used to make portable meters,

• 1.2V Device and Adjustable Device Also regulators or general purpose analog circuitry with

Available—LM185-1.2 Series and LM185 battery life approaching shelf life. Further, the wide

Series, respectively operating current allows it to replace older references

with a tighter tolerance part. For applications requiring

1.2V see LM185-1.2.

DESCRIPTION

The LM185-2.5-N/LM285-2.5-N/LM385-2.5-N are The LM185-2.5-N is rated for operation over a −55°C

micropower 2-terminal band-gap voltage regulator to 125°C temperature range while the LM285-2.5-N is

diodes. Operating over a 20 μA to 20 mA current rated −40°C to 85°C and the LM385-2.5-N 0°C to

range, they feature exceptionally low dynamic 70°C. The LM185-2.5-N/LM285-2.5-N are available in

impedance and good temperature stability. On-chip a hermetic TO package and the LM285-2.5-N/LM385-

trimming is used to provide tight voltage tolerance. 2.5-N are also available in a low-cost TO-92 molded

Since the LM-185-2.5-N band-gap reference uses package, as well as SOIC and SOT-23. The LM185-

only transistors and resistors, low noise and good 2.5-N is also available in a hermetic leadless chip

long term stability result. carrier package.

Connection Diagram

Figure 1. TO-92 Package Figure 2. SOIC Package

(Bottom View) See Package Number D0008A

See Package Number LP0003A

* Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating.

Figure 3. SOT-23

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

Figure 4. LCCC Leadless Chip Carrier Figure 5. TO Package

See Package Number NAJ0020A (Bottom View)

See Package Number NDU0002A

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS(1)(2)(3)

Reverse Current 30 mA

Forward Current 10 mA

LM185-2.5-N −55°C to + 125°C

Operating Temperature Range(4) LM285-2.5-N −40°C to + 85°C

LM385-2.5-N 0°C to 70°C

ESD Susceptibility(5) 2kV

Storage Temperature −55°C to + 150°C

TO-92 Package (10 sec.) 260°C

TO Package (10 sec.) 300°C

Soldering Information Vapor Phase (60 sec.) 215°C

SOIC and SOT-23 Package Infrared (15 sec.) 220°C

See http://www.ti.com for other methods of soldering surface mount devices.

(1) Refer to RETS185H-2.5 for military specifications.

(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.

(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4) For elevated temperature operation, TJ MAX is:

LM185-N: 150°C

LM285-N: 125°C

LM385-N: 100°C

See THERMAL CHARACTERISTICS.

(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.

THERMAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

LM185 150°C

LM285 125°C

Thermal Resistance SOIC-8 SOT-23

LM385 100°C

TO-92 TO

θja (Junction to Ambient) 180°C/W (0.4″Leads) 440°C/W 165°C/W 283°C/W

170°C/W (0.125″Leads)

θjc (Junction to Case) N/A 80°C/W N/A N/A

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

ELECTRICAL CHARACTERISTICS

LM385A-2.5-N

LM385AX-2.5-N Units

Parameter Conditions Typ (Limits)

LM385AY-2.5-N

Tested Limit(2) Design Limit(3)

Reverse Breakdown IR= 100 μA 2.500 2.480 V(Min)

Voltage 2.520 V(Max)

2.500 2.470 V(Min)

2.530 V(Max)

Minimum Operating 12 18 20 μA

Current (Max)

Reverse Breakdown IMIN ≤IR≤1mA 1 1.5 mV

Voltage Change with (Max)

Current 1 mA ≤IR≤20 mA 10 20 mV

(Max)

Reverse Dynamic IR= 100 μA, 0.2 0.6 Ω

Impedance f = 20 Hz 1.5

Wideband Noise (rms) IR= 100 μA 120 μV

10 Hz ≤f≤10 kHz

Long Term Stability IR= 100 μA, T = 1000 Hr, 20 ppm

TA= 25°C ±0.1°C

Average Temperature Coefficient(4) IMIN ≤IR≤20 mA

X Suffix 30 ppm/°C

Y Suffix 50 (Max)

All Others 150

(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA= TJ= 25°C.

(2) Specified and 100% production tested.

(3) Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.

(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between

the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

ELECTRICAL CHARACTERISTICS LM185-2.5-N LM385B-2.5-N

LM185BX-2.5-N

LM185BY-2.5-N LM385BX-2.5-N LM385-2.5-N

LM285-2.5-N Units

Parameter Conditions Typ (Limit)

LM285BX-2.5-N LM385BY-2.5-N

LM285BY-2.5-N

Tested Limit(1)(2) Design Tested Design Tested Design

Limit(3) Limit(1) Limit(3) Limit(1) Limit(3)

Reverse Breakdown TA= 25°C, 2.5 2.462 2.462 2.425 V(Min)

Voltage 20 μA≤IR≤20 mA 2.538 2.538 2.575 V(Max)

Minimum Operating 13 20 30 20 30 20 30 μA

Current (Max)

LM385M3-2.5-N 15 20

Reverse Breakdown 20 μA≤IR≤1 mA 1 1.5 2.0 2.5 2.0 2.5 mV

Voltage Change (Max)

with Current 1 mA ≤IR≤20 mA 10 20 20 25 20 25 mV

(Max)

Reverse Dynamic IR= 100 μA, 1 Ω

Impedance f = 20 Hz

Wideband Noise IR= 100 μA, 120 μV

(rms) 10 Hz ≤f≤10 kHz

Long Term Stability IR= 100 μA,

T = 1000 Hr, 20 ppm

TA= 25°C ±0.1°C

Average IR= 100 μA

Temperature X Suffix 30 30 ppm/°C

Coefficient(4) Y Suffix 50 50 ppm/°C

All Others 150 150 150 ppm/°C

(Max)

(1) Specified and 100% production tested.

(2) A military RETS electrical specification available on request.

(3) Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.

(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between

the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

TYPICAL PERFORMANCE CHARACTERISTICS

Reverse Characteristics Reverse Characteristics

Figure 6. Figure 7.

Forward Characteristics Temperature Drift

Figure 8. Figure 9.

Reverse Dynamic Reverse Dynamic

Impedance Impedance

Figure 10. Figure 11.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Noise Voltage Filtered Output Noise

Figure 12. Figure 13.

Response Time

Figure 14.

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

APPLICATIONS

Figure 15. Wide Input Range Reference Figure 16. Micropower Reference from 9V Battery

LM385-2.5-N Applications

IQ≃30 μA standby current

IQ≃40 μAFigure 17. Micropower 5V Reference Figure 18. Micropower 10V Reference

PRECISION 1 μA to 1 mA CURRENT SOURCES

Figure 19.

METER THERMOMETERS

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

Calibration

Calibration 1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1.8 μA/°K

1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1μA/°K. 2. Remove short, adjust R2 for correct reading in °F

2. Remove short, adjust R2 for correct reading in centigrade

Figure 20. 0°C–100°C Thermomemter Figure 21. 0°F–50°F Thermomemter

Adjustment Procedure

1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck

coefficient.

2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.

Figure 22. Micropower Thermocouple Cold Junction Compensator

Thermocouple Type(1) Seebeck R1 R2 Voltage Across R1 Voltage Across R2

Coefficient (Ω) (Ω) @25°C (mV)

(μV/°C) (mV)

J 52.3 523 1.24k 15.60 14.32

T 42.8 432 1k 12.77 11.78

K 40.8 412 953Ω12.17 11.17

S 6.4 63.4 150Ω1.908 1.766

(1) Typical supply current 50 μA

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

www.ti.com

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

Figure 23. Improving Regulation of Adjstable Regulators

Schematic Diagram

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

LM185-2.5-N, LM285-2.5-N, LM385-2.5-N

SNVS743D –DECEMBER 1999–REVISED MARCH 2013

www.ti.com

REVISION HISTORY

Changes from Revision C (March 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format ............................................................................................................ 9

Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N

PACKAGE OPTION ADDENDUM

www.ti.com 6-Feb-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM185H-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS

& no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM185H2.5, LM185

H2.5)

LM285BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BX

M2.5

LM285BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BX

M2.5

LM285BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type -40 to 85 285BX

Z2.5

LM285BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BY

M2.5

LM285BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 285BY

M2.5

LM285BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type -40 to 85 285BY

Z2.5

LM285M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM285

M2.5

LM285MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM285

M2.5

LM285Z-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type LM285

Z-2.5

LM285Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type -40 to 85 LM285

Z-2.5

LM385BM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385

BM2.5

LM385BMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385

BM2.5

LM385BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BX

M2.5

LM385BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BX

M2.5

LM385BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type 0 to 70 385BX

Z-2.5

LM385BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BY

M2.5

PACKAGE OPTION ADDENDUM

www.ti.com 6-Feb-2020

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM385BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 385BY

M2.5

LM385BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type 0 to 70 385BY

Z-2.5

LM385BZ-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type LM385

BZ2.5

LM385BZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type 0 to 70 LM385

BZ2.5

LM385M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385

M2.5

LM385M3-2.5 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 R12

LM385M3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 R12

LM385M3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 R12

LM385MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM385

M2.5

LM385Z-2.5/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type LM385

Z2.5

LM385Z-2.5/LFT2 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type LM385

Z2.5

LM385Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN N / A for Pkg Type 0 to 70 LM385

Z2.5

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

PACKAGE OPTION ADDENDUM

www.ti.com 6-Feb-2020

Addendum-Page 3

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM285BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM285BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM285MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385M3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM285BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM285BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM285MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385M3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM385MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

3X 2.67

2.03

5.21

4.44

5.34

4.32

12.7 MIN

2X 1.27 0.13

3X 0.55

0.38

4.19

3.17

3.43 MIN

3X 0.43

0.35

(2.54)

NOTE 3

2.6 0.2

4 MAX

SEATING

PLANE

0.076 MAX

(0.51) TYP

(1.5) TYP

TO-92 - 5.34 mm max heightLP0003A

TO-92

4215214/B 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Lead dimensions are not controlled within this area.

4. Reference JEDEC TO-226, variation AA.

5. Shipping method:

a. Straight lead option available in bulk pack only.

b. Formed lead option available in tape and reel or ammo pack.

c. Specific products can be offered in limited combinations of shipping medium and lead options.

d. Consult product folder for more information on available options.

EJECTOR PIN

OPTIONAL

PLANE

SEATING

STRAIGHT LEAD OPTION

321

SCALE 1.200

FORMED LEAD OPTION

OTHER DIMENSIONS IDENTICAL

TO STRAIGHT LEAD OPTION

SCALE 1.200

www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

TYP

(1.07)

(1.5) 2X (1.5)

2X (1.07)

(1.27)

(2.54)

FULL R

TYP

( 1.4)0.05 MAX

ALL AROUND

TYP

(2.6)

(5.2)

(R0.05) TYP

3X ( 0.9) HOLE

2X ( 1.4)

METAL

3X ( 0.85) HOLE

(R0.05) TYP

4215214/B 04/2017

TO-92 - 5.34 mm max heightLP0003A

TO-92

LAND PATTERN EXAMPLE

FORMED LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

SOLDER MASK

OPENING

METAL

SOLDER MASK

OPENING

123

LAND PATTERN EXAMPLE

STRAIGHT LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

METAL

TYP

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL

12 3

www.ti.com

TAPE SPECIFICATIONS

19.0

17.5

13.7

11.7

11.0

8.5

0.5 MIN

TYP-4.33.7

9.75

8.50

TYP

2.9

2.4 6.75

5.95

13.0

12.4

(2.5) TYP

16.5

15.5

4215214/B 04/2017

TO-92 - 5.34 mm max heightLP0003A

TO-92

FOR FORMED LEAD OPTION PACKAGE

www.ti.com

PACKAGE OUTLINE

.228-.244 TYP

[5.80-6.19]

.069 MAX

[1.75]

6X .050

[1.27]

8X .012-.020

[0.31-0.51]

.150

[3.81]

.005-.010 TYP

[0.13-0.25]

0 - 8 .004-.010

[0.11-0.25]

.010

[0.25]

.016-.050

[0.41-1.27]

4X (0 -15 )

.189-.197

[4.81-5.00]

NOTE 3

B .150-.157

[3.81-3.98]

NOTE 4

4X (0 -15 )

(.041)

[1.04]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MS-012, variation AA.

.010 [0.25] C A B

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

www.ti.com

EXAMPLE BOARD LAYOUT

.0028 MAX

[0.07]

ALL AROUND

.0028 MIN

[0.07]

ALL AROUND

(.213)

[5.4]

6X (.050 )

[1.27]

8X (.061 )

[1.55]

8X (.024)

[0.6]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

EXPOSED

METAL

OPENING

SOLDER MASK METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

SYMM

SEE

DETAILS

SYMM

www.ti.com

EXAMPLE STENCIL DESIGN

8X (.061 )

[1.55]

8X (.024)

[0.6]

6X (.050 )

[1.27] (.213)

[5.4]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL

SCALE:8X

SYMM

MECHANICAL DATA

NDU0002A

www.ti.com

H02A (Rev F)

4203227/C

www.ti.com

PACKAGE OUTLINE

TYP

0.20

0.08

0.25

2.64

2.10 1.12 MAX

TYP

0.10

0.01

3X 0.5

0.3

TYP

0.6

0.2

1.9

0.95

TYP-80

3.04

2.80

1.4

1.2

(0.95)

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

4214838/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Reference JEDEC registration TO-236, except minimum foot length.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ALL AROUND 0.07 MIN

ALL AROUND

3X (1.3)

3X (0.6)

(2.1)

2X (0.95)

(R0.05) TYP

4214838/C 04/2017

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

www.ti.com

EXAMPLE STENCIL DESIGN

(2.1)

2X(0.95)

3X (1.3)

3X (0.6)

(R0.05) TYP

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

4214838/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL

SCALE:15X

SYMM

PKG

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