Board Level Heat Sinks P/N: 833202B03300 TO-220 PRODUCT SPECIFICATIONS * No Hardware Device Attachment * Constant Spring Force Tension * Vertical Mounting via Solderable Tabs * RoHS Compliant CUSTOMIZED HEATSINKS 0 400 600 800 1000 100 20 80 16 60 12 40 8 20 4 0 0 0 * Specialized Tabs, Plating * Specialized Body Configurations * Contact Applications Engineering 200 1 2 3 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 Thermal Resistance - oC/ Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient -oC (Mounting Surface) * Devices: TO-220 * Size: 10.0 x 21.2 x 19.0 mm * Material: Aluminum, 0.8 mm Thick * Type: Stamped * IC Mounting: Integrated Spring * PCB Mounting: Solderable Tabs * Finish: Black Anodize * Package: Bulk