MCP19122/3 Digitally Enhanced Power Analog Controller with Integrated Synchronous Driver Synchronous Buck Features Microcontroller Features * Input Voltage: 4.5V to 40V (operating), 48V (non-operating) * Output Voltage: 0.3V to 16V - 0.1% typical output voltage accuracy - Greater than 16V requires external divider * Switching Frequency: 100 kHz to 1.6 MHz * Shutdown Quiescent Current: 50 A Typical * High-Drive: - +5V Gate Drive - 2A Source Current - 2A Sink Current * Low-Drive: - +5V Gate Drive - 2A Source Current - 4A Sink Current * Emulated Average Current Mode Control * Differential Remote Output Sense * Multi-Phase Systems: - Master or Slave - Frequency Synchronized - Common Current Sense Signal * Multiple Output Systems: - Master or Slave - Frequency Synchronized * AEC-Q100 Qualified * Configureable Parameters: - Overcurrent Limit - Input Undervoltage Lockout - Input Overvoltage - Output Overvoltage - Output Undervoltage - Internal Analog Compensation - Soft Start Profile - Synchronous Driver Dead Time - Switching Frequency * Thermal Shutdown * Precision 8 MHz Internal Oscillator Block: - Factory Calibrated * Interrupt Capable - Firmware - Interrupt-on-Change Pins * Only 35 Instructions to Learn * 4096 Words On-Chip Program Memory * High Endurance Flash: - 100,000 Write Flash Endurance - Flash Retention: >40 years * Watchdog Timer (WDT) with Independent Oscillator for Reliable Operation * Programmable Code Protection * In-Circuit Debug (ICD) via Two Pins (MCP19123) * In-Circuit Serial ProgrammingTM (ICSPTM) via Two Pins * 12 I/O Pins and One Input-Only Pin (MCP19122) - 3 Open Drain Pins - 2 Weak Current Source Pins * 16 I/O Pins and One Input-Only Pin (MCP19123) - 3 Open Drain Pins - 2 Weak Current Source Pins * Analog-to-Digital Converter (ADC): - 10-bit Resolution - 24 Internal Channels - 8 External Channels * Timer0: 8-bit Timer/Counter with 8-Bit Prescaler * Enhanced Timer1: - 16-bit Timer/Counter with Prescaler - 2 Selectable Clock Sources - External Gate Input Mode * Timer2: 8-Bit Timer/Counter with Prescaler - 8-bit Period Register * Capture, Compare Module * I2CTM Communication: - 7-bit Address Masking - 2 Dedicated Address Registers - SMBus/PMBusTM Compatibility 2017 Microchip Technology Inc. DS20005750A-page 1 MCP19122/3 Pin Diagram - 24-Pin 4X4 QFN (MCP19122) GPB3 VDD VIN 21 20 19 3 GPB0 GPA2 22 2 GPB1 GPA1 23 1 GPB2 GPA0 24 MCP19122 24-pin QFN 4 x 4 mm 18 BOOT 17 HDRV 16 PHASE 15 LDRV 14 PGND 13 ISP MCP19122 GPA3 4 GPA7 5 EXP-25 DS20005750A-page 2 7 8 9 10 11 12 GPA4 GND -VSEN +VSEN ISN 6 GPA5/MCLR GPA6 2017 Microchip Technology Inc. MCP19122/3 Timers MSSP 1 Y AN0 -- -- GPA1 2 Y AN1 -- -- GPA2 3 Y AN2 T0CKI GPA3 4 Y AN3 GPA4 8 N -- -- Pull-up A/D GPA0 Interrupt I/O ANSEL 24-PIN QFN (MCP19122) SUMMARY 24-Pin QFN TABLE 1: Basic Additional IOC Y -- Analog Debug Output (1) IOC Y -- Sync Signal In/Out (2, 3) -- IOC INT -- -- Weak Current Source -- IOC -- -- Weak Current Source Timer1 Gate Input 1 -- IOC N -- -- MCLR -- -- (4) IOC (5) Y GPA5 7 N -- -- GPA6 6 N -- -- -- IOC N ICSPDAT -- GPA7 5 N -- -- SCL IOC N ICSPCLK -- GPB0 22 N -- -- SDA IOC N -- -- GPB1 23 Y AN4 -- -- IOC Y -- Current Sense Output Current Reference Input (3) GPB2 24 Y AN5 -- -- IOC Y -- Timer1 Gate Input 2 GPB3 21 N -- -- -- IOC Y -- Clock Signal In/Out (2, 3) VIN 19 N -- -- -- -- -- VIN Device Input Voltage VDD 20 N -- -- -- -- -- VDD Internal Regulator Output GND 9 N -- -- -- -- -- GND Small Signal Ground PGND 14 N -- -- -- -- -- -- Large Signal Ground LDRV 15 N -- -- -- -- -- -- Low-Side MOSFET Connection HDRV 17 N -- -- -- -- -- -- High-Side MOSFET Connection PHASE 16 N -- -- -- -- -- -- Switch Node BOOT 18 N -- -- -- -- -- -- Floating Bootstrap Supply +VSEN 11 N -- -- -- -- -- -- Output Voltage Differential Sense -VSEN 10 N -- -- -- -- -- -- Output Voltage Differential Sense ISP 13 N -- -- -- -- -- -- Current Sense Input ISN 12 N -- -- -- -- -- -- Current Sense Input EP -- -- -- -- -- -- -- -- Exposed Pad Note 1: 2: 3: 4: 5: The Analog Debug Output is selected when the BUFFCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. The IOC is disabled when MCLR is enabled. Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. 2017 Microchip Technology Inc. DS20005750A-page 3 MCP19122/3 Pin Diagram - 28-Pin 5X5 QFN (MCP19123) GPB5 GPB1 GPB7 GPB0 GPB3 VDD 26 25 24 23 22 GPA1 27 1 GPB2 GPA0 28 MCP19123 28-pin QFN 5 x 5 mm 21 VIN 2 20 BOOT GPA2 3 19 HDRV GPB4 4 18 PHASE GPA3 5 17 LDRV GPA7 6 16 PGND 15 ISP MCP19123 EXP-29 DS20005750A-page 4 8 9 10 11 12 13 14 GPA4 GPB6 GND -VSEN +VSEN ISN 7 GPA5/MCLR GPA6 2017 Microchip Technology Inc. MCP19122/3 Timers MSSP 1 Y AN0 -- -- GPA1 2 Y AN1 -- -- GPA2 3 Y AN2 T0CKI GPA3 5 Y AN3 GPA4 9 N -- GPA5 8 N -- Pull-up A/D GPA0 Interrupt I/O ANSEL 28-PIN QFN (MCP19123) SUMMARY 28-Pin QFN TABLE 2: Basic Additional IOC Y -- Analog Debug Output (1) IOC Y -- Sync Signal In/Out (2, 3) -- IOC INT Y -- Weak Current Source -- -- IOC Y -- Weak Current Source Timer1 Gate Input 1 -- -- IOC N -- -- -- IOC(4) MCLR -- -- (5) Y GPA6 7 N -- -- -- IOC N -- CCD Input 1 GPA7 6 N -- -- SCL IOC N -- -- GPB0 24 N -- -- SDA IOC N -- -- GPB1 26 Y AN4 -- -- IOC Y -- Current Sense Output Current Reference Input(3) GPB2 28 Y AN5 -- -- IOC Y -- Timer1 Gate Input 2 GPB3 23 N -- -- -- IOC Y -- Clock Signal In/Out (2, 3) GPB4 4 Y AN6 -- -- IOC Y ICSPDAT ICDDAT -- GPB5 27 Y AN7 -- -- IOC Y ICSPCLK ICDCLK -- GPB6 10 N -- -- -- IOC Y -- CCD Input 2 GPB7 25 N -- -- -- IOC Y -- External A/D Reference VIN 21 N -- -- -- -- -- VIN Device Input Voltage VDD 22 N -- -- -- -- -- VDD Internal Regulator Output GND 11 N -- -- -- -- -- GND Small Signal Ground PGND 16 N -- -- -- -- -- -- Large Signal Ground LDRV 17 N -- -- -- -- -- -- Low-Side MOSFET Connection HDRV 19 N -- -- -- -- -- -- High-Side MOSFET Connection PHASE 18 N -- -- -- -- -- -- Switch Node BOOT 20 N -- -- -- -- -- -- Floating Bootstrap Supply +VSEN 13 N -- -- -- -- -- -- Output Voltage Differential Sense -VSEN 12 N -- -- -- -- -- -- Output Voltage Differential Sense ISP 15 N -- -- -- -- -- -- Current Sense Input ISN 14 N -- -- -- -- -- -- Current Sense Input -- -- -- -- -- -- -- -- Exposed Pad EP Note 1: 2: 3: 4: 5: The Analog Debug Output is selected when the BUFFCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. The IOC is disabled when MCLR is enabled. Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. 2017 Microchip Technology Inc. DS20005750A-page 5 MCP19122/3 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 Pin Description ........................................................................................................................................................................... 12 3.0 Functional Description ................................................................................................................................................................ 17 4.0 Electrical Characteristics ............................................................................................................................................................ 39 5.0 Digital Electrical Characteristics ................................................................................................................................................. 45 6.0 Typical Performance Curves. ..................................................................................................................................................... 55 7.0 Test Mux Control ........................................................................................................................................................................ 57 8.0 Relative Efficiency Measurement ............................................................................................................................................... 59 9.0 Device Calibration ...................................................................................................................................................................... 61 10.0 Memory Organization ................................................................................................................................................................. 75 11.0 Special Features of the CPU ...................................................................................................................................................... 87 12.0 Resets ........................................................................................................................................................................................ 91 13.0 Interrupts .................................................................................................................................................................................... 99 14.0 Power-Down Mode (Sleep) ...................................................................................................................................................... 109 15.0 Watchdog Timer (WDT)............................................................................................................................................................. 111 16.0 Oscillator Modes........................................................................................................................................................................113 17.0 I/O Ports ....................................................................................................................................................................................115 18.0 Interrupt-On-Change ................................................................................................................................................................ 129 19.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 133 20.0 Flash Program Memory Control ............................................................................................................................................... 145 21.0 Timer0 Module.......................................................................................................................................................................... 151 22.0 Timer1 Module With Gate Control ............................................................................................................................................ 153 23.0 Timer2 Module.......................................................................................................................................................................... 163 24.0 Dual Capture/Compare (CCD) Module..................................................................................................................................... 165 25.0 Internal Temperature Indicator Module..................................................................................................................................... 169 26.0 Enhanced PWM Module........................................................................................................................................................... 171 27.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 175 28.0 Instruction Set Summary .......................................................................................................................................................... 217 29.0 In-Circuit Serial ProgrammingTM (ICSPTM) ............................................................................................................................... 227 30.0 Development Support............................................................................................................................................................... 229 31.0 Packaging Information.............................................................................................................................................................. 233 Appendix A: Revision History............................................................................................................................................................. 239 INDEX ................................................................................................................................................................................................ 241 The Microchip Web Site ..................................................................................................................................................................... 247 Customer Change Notification Service .............................................................................................................................................. 247 Customer Support .............................................................................................................................................................................. 247 Product Identification System............................................................................................................................................................. 249 Trademarks ........................................................................................................................................................................................ 251 Worldwide Sales and Service ............................................................................................................................................................ 252 DS20005750A-page 6 2017 Microchip Technology Inc. MCP19122/3 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via e-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2017 Microchip Technology Inc. DS20005750A-page 7 MCP19122/3 NOTES: DS20005750A-page 8 2017 Microchip Technology Inc. MCP19122/3 1.0 used to provide complete customization of device operating parameters, start-up and shut-down profiles, protection levels and fault handling procedures. DEVICE OVERVIEW The MCP19122/3 is a stand-alone mixed signal synchronous buck pulse-width modulated (PWM) current mode controller that features an integrated microcontroller core, high-endurance flash memory, communication and configurable analog circuitry. It features integrated synchronous drivers, bootstrap device, internal linear regulator and 4k words of nonvolatile memory. The devices are capable of efficiently converting 4.5V-40V to 0.3V-16V. After initial device configuration using Microchip's MPLAB(R) X Integrated Development Environment (IDE) software, PMBus commands or I2C can be used by a host to communicate with, or modify, the operation of the MCP19122/3. Since the MCP19122/3 uses traditional analog control circuitry to regulate the output of the DC/DC converter, the integration of the PIC(R) microcontroller mid-range core is FIGURE 1-1: TYPICAL APPLICATION CIRCUIT VIN BOOT VIN HDRV 8 I/O DATA I/O CLK I/O SMBALERT I/O ENABLE I/O PGOOD I/O TRACK I/O ADDR1 ADDR2 ADDR2 MCP19123 VDD PHASE VOUT LDRV PGND ISP ISN GPA2 GPA3 -VSEN +VSEN GND 2017 Microchip Technology Inc. DS20005750A-page 9 MCP19122/3 SYNCHRONOUS BUCK BLOCK DIAGRAM VIN Sample +6dB Bias Gen ISP ISN 320: To ADC LDO1 ISENSE LDO2 BGAP AVDD 500mV CSGSCON VINUVLO REF VDD VIN VDD AVDD VINUVLO 4 VINUVLO REF VINUVLO REF Comp Ramp 4 VINOVLO REF VINOVLO BOOT VINOVLO REF VINOVLO REF 4 VOTOVLO REF 5 VOUT + 4 VOTUVLO REF VIN VOTOVLO OC Comp VOUT HIGHDR VOTUVLO - PHASE 10 VREGREF LOWDR ISENSE +VSEN DLY 4 500mV VDD + -VSEN VOUT LVL_SFT 2017 Microchip Technology Inc. VOUT ISP ISN 3 4 MODECON<CNSG> 4 DLY 4 +VSEN -VSEN OV UV UVLO OVLO OCFLAG Debug MUX A/D Mux I/O(Digital Signals) 1 () PGND PIC CORE I/O GND MCP19122/3 DS20005750A-page 10 FIGURE 1-2: MCP19122/3 FIGURE 1-3: MICROCONTROLLER CORE BLOCK DIAGRAM Configuration 13 Flash 8 Data Bus Program Counter PORTA GPA0 GPA1 GPA2 GPA3 GPA4 GPA5 4K x 14 Program Memory Program Bus RAM 256 bytes 8 Level Stack (13-bit) 14 File Registers RAM Addr GPA6 GPA7 9 Addr MUX Instruction reg 7 Direct Addr 8 Indirect Addr PORTB GPB0 GPB1 GPB2 GPB3 FSR reg STATUS reg 8 Instruction Decode & Control Timing Generation CLKIN CLKOUT 3 Power-up Timer GPB4(1) GPB5(1) MUX GPB6(1) GPB7(1) Power-on Reset ALU 8 Watchdog Timer W reg Brown-out Reset MSSP SDA SCL 8 MHz Internal Oscillator T1G MCLR T2G T0CKI Timer0 PMDATL Self read/ write flash memory VIN VSS Timer1 OUV COMP Timer2 CCD Analog interface registers CCD1 EEADDR PWM CCD2 Note 1: Not implemented on the MCP19122. 2017 Microchip Technology Inc. DS20005750A-page 11 MCP19122/3 2.0 PIN DESCRIPTION The MCP19122/3 family of devices features pins that have multiple functions associated with each pin. Table 2-1 provides a description of the different functions. See Section 2.1 "Detailed Pin Description" for more detailed information. TABLE 2-1: MCP19122/3 PINOUT DESCRIPTION Name GPA0/AN0/ANALOG_TEST GPA1/AN1/SYC_SIGNAL GPA2/AN2/T0CKI/INT GPA3/AN3/T1G1 Function Input Type Output Type GPA0 TTL CMOS General purpose I/O AN0 AN -- A/D Channel 0 input. ANALOG_TEST -- -- Internal analog signal multiplexer output (1) GPA1 TTL CMOS General purpose I/O Description AN1 AN -- A/D Channel 1 input SYC_SIGNAL -- -- Switching clock synchronization signal input and output (2 ,3) GPA2 TTL CMOS General purpose I/O AN2 AN -- A/D Channel 2 input T0CKI ST -- Timer0 clock input INT ST -- External interrupt GPA3 TTL CMOS General purpose I/O AN3 AN -- A/D Channel 3 input T1G1 ST -- Timer1 gate input 1 GPA4 GPA4 TTL OD General purpose I/O GPA5/MCLR GPA5 TTL -- General purpose input only MCLR ST -- Master Clear with internal pull-up GPA6 ST CMOS General purpose I/O CCD1 ST CMOS Capture/Compare input 1 (4) CMOS Serial Programming Data I/O (5) GPA6/CCD1(4)/ICSPDAT(5) ICSPDAT GPA7/SCL/ICSPCLK(5) GPB0/SDA GPB1/AN4/CON_SIGNAL Legend: Note 1: 2: 3: 4: 5: GPA7 ST OD General purpose open drain I/O SCL I2C OD I2C clock ICSPCLK ST -- Serial Programming Clock (5) GPB0 TTL OD General purpose I/O SDA I2C OD I2C data input/output GPB1 TTL CMOS General purpose I/O AN4 AN -- A/D Channel 4 input CON_SIGNAL -- -- Current sense output or current reference input (3) AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST =Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C Analog Test is selected when the BUFFCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. Feature only available on the MCP19123. Feature only available on the MCP19122. DS20005750A-page 12 2017 Microchip Technology Inc. MCP19122/3 TABLE 2-1: MCP19122/3 PINOUT DESCRIPTION (CONTINUED) Name GPB2/AN5/T1G2 GPB3/CLOCK GPB4(4)/AN6(4)/ICSPDAT(4)/ ICDDAT(4) GPB5(4)/AN7(4)/ICSPCLK(4)/ ICDCLK(4) GPB6/CCD2(4) GPB7/VADC(4) Function Input Type Output Type GPB2 TTL CMOS General purpose I/O Description AN5 AN -- A/D Channel 5 input T1G2 ST -- Timer1 gate input 2 GPB3 TTL CMOS CLOCK -- -- General purpose I/O GPB4 TTL CMOS General purpose I/O(4) AN6 AN -- A/D Channel 6 input(4) ICSPDAT ST -- Serial Programming Data I/O(4) ICDDAT ST -- In-circuit debug data(4) GPB5 TTL CMOS General purpose I/O(4) AN7 AN -- A/D Channel 7 input(4) ISCPCLK ST -- Serial Programming Clock(4) ICDCLK ST -- In-circuit debug clock(4) GPB6 TTL CMOS General purpose I/O CCD2 ST CMOS Capture/Compare input 2(4) CMOS General purpose I/O Clock signal input/output (2 ,3) GPB7 TTL VADC AN VIN VIN -- -- Device input supply voltage VDD VDD -- -- Internal +5V LDO output pin GND GND -- -- Small signal quiet ground PGND PGND -- -- Large signal power ground LDRV LDRV -- -- High-current drive signal connected to the gate of the low-side MOSFET HDRV HDRV -- -- Floating high-current drive signal connected to the gate of the high-side MOSFET PHASE PHASE -- -- Synchronous buck switch node connection External voltage reference for A/D(4) BOOT BOOT -- -- Floating bootstrap supply +VSEN +VSEN -- -- Positive input of the output voltage sense differential amplifier -VSEN -VSEN -- -- Negative input of the output voltage sense differential amplifier ISP ISP -- -- Current sense input ISN ISN -- -- Current sense input -- -- -- Exposed Thermal Pad EP Legend: Note 1: 2: 3: 4: 5: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST =Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C Analog Test is selected when the BUFFCON<BNCHEN> bit is set. Selected when device is functioning as multiple output master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC<2:0> bits in the MODECON register. Feature only available on the MCP19123. Feature only available on the MCP19122. 2017 Microchip Technology Inc. DS20005750A-page 13 MCP19122/3 2.1 2.1.1 Detailed Pin Description GPA0 PIN AN3 is an input to the A/D. To configure this pin to be read by the A/D on channel 3, bits TRISA3 and ANSA3 must be set. GPA0 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. T1G1 is an input to the TIMER1 gate. To configure this pin to be an external source to the TIMER1 gate circuitry, see Section 22.0 "Timer1 Module With Gate Control". AN0 is an input to the A/D. To configure this pin to be read by the A/D on channel 0, bits TRISA0 and ANSA0 must be set. 2.1.5 When the BUFFCON<BNCHEN> bit is set, this pin is configured as the ANALOG_TEST function. It is a buffered output of the internal analog and digital signal multiplexer. Analog signals present on this pin are controlled by the ADCON0 register; see Register 19-1. Digital signals present on this pin are controlled by the BUFFCON register; see Register 7-1. 2.1.2 GPA1 PIN GPA1 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. AN1 is an input to the A/D. To configure this pin to be read by the A/D on channel 1, bits TRISA1 and ANSA1 must be set. When the MCP19122/3 is configured as a multiple output or multi-phase MASTER or SLAVE, this pin is configured to be the switching frequency synchronization input or output, SYN_SIGNAL. See Section 3.12 "System Configuration Control" for more information. 2.1.3 GPA2 PIN GPA2 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak current source and interrupt-on-change are also available. AN2 is an input to the A/D. To configure this pin to be read by the A/D on channel 2, bits TRISA2 and ANSA2 must be set. When bit T0CS is set, the T0CKI function is enabled. See Section 21.0 "Timer0 Module" for more information. GPA2 can also be configured as an external interrupt by setting of the INTE bit. See Section 13.0.1 "GPA2/ INT Interrupt" for more information. 2.1.4 GPA3 PIN GPA3 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak current source and interrupt-on-change are also available. DS20005750A-page 14 GPA4 PIN GPA4 is a true open drain general purpose pin whose data direction is controlled in TRISGPA. There is no internal connection between this pin and device VDD, making this pin ideal to be used as an SMBus Alert pin. This pin does not have a weak pull-up, but interrupt-onchange is available. 2.1.6 GPA5 PIN GPA5 is a general purpose TTL input-only pin. An internal weak pull-up and interrupt-on-change are also available. For programming purposes, this pin is to be connected to the MCLR pin of the serial programmer. See Section 29.0 "In-Circuit Serial ProgrammingTM (ICSPTM)" for more information. 2.1.7 GPA6 PIN GPA6 is a general purpose CMOS input/output pin whose data direction is controlled in TRISGPA. An interrupt-on-change is also available. On the MCP19122, the ISCPDAT is the primary serial programming data input function. This is used in conjunction with ICSPCLK to serial program the device. This pin function is only implemented on the MCP19122. On the MCP19123, this pin can be configured as an input to the CCD module. For more information refer to Section 24.0 "Dual Capture/Compare (CCD) Module". 2.1.8 GPA7 PIN GPA7 is a true open drain general purpose pin whose data direction is controlled in TRISGPA. There is no internal connection between this pin and device VDD. This pin does not have a weak pull-up, but interrupt-onchange is available. When the MCP19122/3 is configured for I2C communication (see Section 27.2 "I2C Mode Overview"), GPA7 functions as the I2C clock, SCL. On the MCP19122, the ISCPCLK is the serial programming clock function. This is used in conjunction with ICSPDAT to serial program the device. This pin function is only implemented on the MCP19122. 2017 Microchip Technology Inc. MCP19122/3 2.1.9 GPB0 PIN GPB0 is a true open drain general purpose pin whose data direction is controlled in TRISGPB. There is no internal connection between this pin and device VDD. This pin does not have a weak pull-up, but interrupt-on-change is available. When the MCP19122/3 is configured for I2C communication (see Section 27.2 "I2C Mode Overview"), GPB0 functions as the I2C clock, SDA. 2.1.10 GPB1 PIN GPB1 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN4 is an input to the A/D. To configure this pin to be read by the A/D on channel 4, bits TRISB1 and ANSB1 must be set. When the MCP19122/3 is configured as a multi-phase MASTER or SLAVE, this pin is configured to be the sensed current input or output signal. On a device configured to be a MASTER, this is an output signal of the sensed current that is to be shared with the SLAVE devices. On a device configured as a SLAVE, this is an input signal used to as a current regulation point. See Section 3.12 "System Configuration Control", for more information. 2.1.11 GPB2 PIN GPB2 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN5 is an input to the A/D. To configure this pin to be read by the A/D on channel 5, bits TRISB2 and ANSB2 must be set. T1G2 is an input to the TIMER1 gate. To configure this pin to be an external source to the TIMER1 gate circuitry, see Section 22.0 "Timer1 Module With Gate Control". 2.1.12 GPB3 PIN GPB3 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. When the MCP19122/3 is configured as a multiple output or multi-phase Master or Slave, this pin is configured to be the switching frequency clock input or output. See Section 3.12 "System Configuration Control". 2.1.13 GPB4 PIN This pin and associated functions are only available on the MCP19123 device. 2017 Microchip Technology Inc. GPB4 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN6 is an input to the A/D. To configure this pin to be read by the A/D on channel 6, bits TRISB4 and ANSB4 must be set. On the MCP19123, the ISCPDAT is the primary serial programming data input function. This is used in conjunction with ICSPCLK to serial program the device. The ICDDAT is the in-circuit debug data function. This pin function is only implemented on the MCP19123. See Section 29.2 "In-Circuit Debugger" 2.1.14 GBP5 PIN This pin and associated functions is only available on the MCP19123 device. GPB5 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN7 is an input to the A/D. To configure this pin to be read by the A/D on channel 7, bits TRISB5 and ANSB5 must be set. On the MCP19123, the ISCPCLK is the primary serial programming clock function. This is used in conjunction with ICSPDAT to serial program the device. The ICDDLK is the in-circuit debug clock function. This pin function is only implemented on the MCP19123. See Section 29.2 "In-Circuit Debugger" 2.1.15 GPB6 PIN This pin and associated functions is only available on the MCP19123 device. GPB6 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. CCD2 is an input to the CCD module. For more information refer to Section 24.0 "Dual Capture/Compare (CCD) Module". 2.1.16 GPB7 PIN This pin and associated functions is only available on the MCP19123 device. GPB7 is a general purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. VADC is an external A/D reference voltage input. See Section 19.0 "Analog-to-Digital Converter (ADC) Module". DS20005750A-page 15 MCP19122/3 2.1.17 VIN PIN Device input power connection pin. It is recommended that capacitance be placed between this pin and the GND pin of the device. 2.1.18 VDD PIN The output of the internal +5.0V regulator is connected to this pin. It is recommended that a 1.0 F bypass capacitor be connected between this pin and the GND pin of the device. The bypass capacitor should be placed physically close to the device. 2.1.19 GND PIN 2.1.27 ISP PIN The non-inverting input of the current sense amplifier is connected to the ISP pin. 2.1.28 ISN PIN The inverting input of the current sense amplifier is connected to the ISN pin. 2.1.29 EXPOSED PAD (EP) There is no internal connection to the Exposed Thermal Pad. The EP should be connected to the GND pin and to the GND PCB plane to aid in the removal of the heat. GND is the small signal ground connection pin. This pin should be connected to the exposed pad, on the bottom of the package. 2.1.20 PGND PIN Connect all large signal level ground returns to PGND. These large-signal level ground traces should have a small loop area and minimal length to prevent coupling of switching noise to sensitive traces. 2.1.21 LDRV PIN The gate of the low-side or rectifying MOSFET is connected to LDRV. The PCB trace connecting LDRV to the gate must be of minimal length and appropriate width to handle the high peak drive currents and fast voltage transitions. 2.1.22 HDRV PIN The gate of the high-side MOSFET is connected to HDRV. This is a floating driver referenced to PHASE. The PCB trace connecting HDRV to the gate must be of minimal length and appropriate width to handle the high peak drive current and fast voltage transitions. 2.1.23 PHASE PIN The PHASE pin provides the return path for the highside gate driver. The source of the high-side MOSFET, drain of the low-side MOSFET and the inductor are connected to this pin. 2.1.24 BOOT PIN The BOOT pin is the floating bootstrap supply pin for the high-side gate driver. A capacitor is connected between this pin and the PHASE pin to provide the necessary charge to turn on the high-side MOSFET. 2.1.25 +VSEN PIN The non-inverting input of the unity gain amplifier used for output voltage remote sensing is connected to the +VSEN pin. 2.1.26 -VSEN PIN The inverting input of the unity gain amplifier used for output voltage remote sensing is connected to the -VSEN pin. DS20005750A-page 16 2017 Microchip Technology Inc. MCP19122/3 3.0 FUNCTIONAL DESCRIPTION 3.1 Internal Supplies The operating input voltage of the MCP19122/3 ranges from 4.5V to 40V. There are two internal Low Dropout (LDO) voltage regulators. A 5V LDO (VDD) is used to power the internal microcontroller, the internal gate driver circuitry and provide a 5V output for external use. It is recommended that a 1 F ceramic capacitor be placed between the VDD pin and the PGND pin. The MODECON<VDDEN> bit controls the state of the 5V VDD LDO when the SLEEP command is issued to the MCP19122/3. See Section 3.12.3 "VDD LDO Control" for more information. The gate drive current required to drive the external power MOSFETs must be added to the MCP19122/3 quiescent current IQ(max). This total current must be less than the maximum current, IDD-OUT, available from VDD that is specified in Section 4.0 "Electrical Characteristics". 3.2 Switching Frequency The switching frequency is configurable over the range of 100 kHz to 1.6 MHz. The Timer2 module is used to generate the HDRV/LDRV switching frequency. Refer to Section 26.0, Enhanced PWM Module for more information. Example 3-1 shows how to configure the MCP19122/3 for a switching frequency of 300 kHz. EXAMPLE 3-1: BANKSEL CLRF CLRF MOVLW MOVWF MOVLW MOVWF MOVWF MOVLW MOVWF MOVWF MOVLW MOVWF CONFIGURING FSW T2CON T2CON TMR2 0x19 PR2 0x0A PWMRL PWMRH 0x00 PWMPHL PWMPHH 0x04 T2CON ;Turn off Timer2 ;Initialize module ;Fsw=300 kHz ;Max duty cycle=40% ;No phase shift ;Turn on Timer2 A second 4V LDO (AVDD) is used to power the internal analog circuitry. The AVDD is not available externally. AVDD is calibrated to 4.096V and is the default ADC reference voltage. EQUATION 3-1: TOTAL REGULATOR CURRENT I DD - OUT > I Q + I DRIVE + I EXT Where: - IDD-OUT is the total current available from VDD - IQ is the device quiescent current - IDRIVE is the current required to drive the external MOSFETs - IEXT is the amount of current used to power additional external circuitry. EQUATION 3-2: GATE DRIVE CURRENT I DRIVE = Q gHIGH + Q gLOW FSW Where: - IDRIVE is the current required to drive the external MOSFETs - QgHIGH is the total gate charge of the high-side MOSFET - QgLOW is the total gate charge of the low-side MOSFET - FSW is the switching frequency 2017 Microchip Technology Inc. DS20005750A-page 17 MCP19122/3 3.3 Input Voltage Monitoring The input voltage to the MCP19122/3 is monitored to determine an input undervoltage or an input overvoltage. It can also be measured by the ADC and reported as telemetry data. 3.3.1 INPUT UNDERVOLTAGE LOCKOUT The VINUVLO register contains the digital value that sets the input under voltage lockout. When the input voltage on the VIN pin to the MCP19122/3 is below this programmed level, the PIR2<UVLOIF> status flag will be set. This bit is automatically cleared when the MCP19122/3 VIN voltage rises above this programmed level. The VINUVLO shall operate on a rising or falling input voltage. Hysteresis shall exist between the rising threshold that clears the flag and the failing threshold that sets the flag. A hardware under voltage lockout path can be enabled by setting the VINCON<UVLOEN> bit. When this bit is set and the voltage on the VIN pin is below the threshold set by the VINUVLO register, hardware will keep REGISTER 3-1: the high-side and low-side MOSFET drivers off. Once the voltage on the VIN pin is greater than the threshold set by the VINUVLO register, the high-side and lowside MOSFET drivers are enabled. To function properly, the VIN under voltage lockout setting must be lower than the VIN over voltage lockout setting. The state of the VINUVLO and VINOVLO registers are unknown at power-up. Therefore if only the VIN under voltage lockout is desired, the VIN over voltage lockout threshold still must be set in the VINOVLO register. Note: The UVLOIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. Note: The UVLOIF interrupt flag bit is set when an interrupt condition occurs regardless of the state of the VINCON<UVLOEN> bit. VINUVLO: INPUT UNDER VOLTAGE LOCKOUT CONTROL REGISTER U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x -- -- -- -- UVLO3 UVLO2 UVLO1 UVLO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-4 Unimplemented: Read as `0' bit 3-0 UVLO<3:0>: Under Voltage Lockout Configuration bits 0000 = 4.0V 0001 = 6.0V 0010 = 8.0V 0011 = 10.0V 0100 = 12.0V 0101 = 14.0V 0110 = 16.0V 0111 = 18.0V 1000 = 20.0V 1001 = 22.0V 1010 = 24.0V 1011 = 26.0V 1100 = 28.0V 1101 = 30.0V 1110 = 32.0V 1111 = 34.0V DS20005750A-page 18 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.3.2 INPUT OVER VOLTAGE LOCKOUT The VINOVLO register contains the digital value that sets the input over voltage lockout. When the input voltage on the VIN pin to the MCP19122/3 is above this programmed level, the PIR2<OVLOIF> status flag will be set. This bit is automatically cleared when the MCP19122/3 VIN voltage falls below this programmed level. The VINOVLO shall operate on a rising or falling input voltage. Hysteresis shall exist between the rising threshold that sets the flag and the failing threshold that clears the flag. A hardware over voltage lockout path can be enabled by setting the VINCON<OVLOEN> bit. When this bit is set and the voltage on the VIN pin is above the threshold set by the VINOVLO register, hardware will keep the high-side and low-side MOSFET drivers off. Once the voltage on the VIN pin is lower than the threshold set by the VINOVLO register, the high-side and lowside MOSFET drivers are enabled. REGISTER 3-2: To function properly, the VIN overvoltage lockout setting must be lower than the VIN undervoltage lockout setting. The state of the VINUVLO and VINOVLO registers are unknown at power-up. Therefore if only the VIN overvoltage lockout is desired, the VIN undervoltage lockout threshold still must be set in the VINUVLO register. Note: The OVLOIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. Note: The OVLOIF interrupt flag bit is set when an interrupt condition occurs regardless of the state of the VINCON<OVLOEN> bit. VINOVLO: INPUT OVERVOLTAGE LOCKOUT CONTROL REGISTER U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x -- -- -- -- OVLO3 OVLO2 OVLO1 OVLO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-4 Unimplemented: Read as `0' bit 3-0 OVLO<3:0>: Overvoltage Lockout Configuration bits 0000 = 12.0V 0001 = 14.0V 0010 = 16.0V 0011 = 18.0V 0100 = 20.0V 0101 = 22.0V 0110 = 24.0V 0111 = 26.0V 1000 = 28.0V 1001 = 30.0V 1010 = 32.0V 1011 = 34.0V 1100 = 36.0V 1101 = 38.0V 1110 = 40.0V 1111 = 42.0V 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 19 MCP19122/3 3.3.3 INPUT UNDER/OVERVOLTAGE CONTROL REGISTER <OVLOOUT> overvoltage lockout status output bit in the VINCON register indicates if an OVLO event has occurred. The VINCON register is the comparator control register for both the input undervoltage lockout and input overvoltage lockout. It contains the enable bits, the polarity edge detection bits and the status output bits for both protection circuits. The interrupt flags <UVLOIF> and <OVLOIF> in the PIR2 register are independent of the enable <UVLOEN> and <OVLOEN> bits in the VINCON register. The <UVLOOUT> undervoltage lockout status output bit in the VINCON register indicates if an UVLO event has occurred. The REGISTER 3-3: When the input voltage on the VIN pin to the MCP19122/3 is below the threshold programmed by the VINUVLO register and the <UVLOEN> bit is set, both the HDRV and LDRV gate drivers are disabled. When the input voltage on the VIN pin to the MCP19122/3 is above the threshold programmed by the VINOVLO register and the <OVLOEN> bit is set, both the HDRV and LDRV gate drivers are disabled. VINCON: INPUT VOLTAGE UVLO AND OVLO CONTROL REGISTER R/W-0 R-0 R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 UVLOEN UVLOOUT UVLOINTP UVLOINTN OVLOEN OVLOOUT OVLOINTP OVLOINTN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 UVLOEN: UVLO Comparator Module Logic Enable bit 1 = UVLO Comparator Module Logic enabled 0 = UVLO Comparator Module Logic disabled bit 6 UVLOOUT: Undervoltage Lock Out Status bit 1 = UVLO event has occurred 0 = UVLO event has not occurred bit 5 UVLOINTP: UVLO Comparator Interrupt-on-Positive Going Edge Enable bit 1 = UVLOIF will be set upon a positive going edge of the UVLO 0 = No UVLOIF will be set upon a positive going edge of the UVLO bit 4 UVLOINTN: UVLO Comparator Interrupt on Negative Going Edge Enable bit 1 = UVLOIF will be set upon a negative going edge of the UVLO 0 = No UVLOIF will be set upon a negative going edge of the UVLO bit 3 OVLOEN: OVLO Comparator Module Logic Enable bit 1 = OVLO Comparator Module Logic enabled 0 = OVLO Comparator Module Logic disabled bit 2 OVLOOUT: Overvoltage Lock Out Status bit 1 = OVLO event has occurred 0 = OVLO event has not occurred bit 1 OVLOINTP: OVLO Comparator Interrupt on Positive Going Edge Enable bit 1 = OVLOIF will be set upon a positive going edge of the OVLO 0 = No OVLOIF will be set upon a positive going edge of the OVLO bit 0 OVLOINTN: OVLO Comparator Interrupt on Negative Going Edge Enable bit 1 = OVLOIF will be set upon a negative going edge of the OVLO 0 = No OVLOIF will be set upon a negative going edge of the OVLO DS20005750A-page 20 2017 Microchip Technology Inc. MCP19122/3 3.4 Output Overcurrent The MCP19122/3 features a cycle-by-cycle peak current limit. By monitoring the OCIF interrupt flag, custom over current fault handling can be implemented. To detect an output overcurrent, the MCP19122/3 senses the voltage drop across the high-side MOSFET while it is conducting. Leading-edge blanking is incorporated to mask the overcurrent measurement for a given amount of time. This helps prevent false overcurrent readings. When an output overcurrent is sensed, the OCIF flag is set and the high-side drive signal is immediately terminated. Without any custom overcurrent handling implemented, the high-side drive signal will be asserted high at the beginning of the next clock cycle. If the overcurrent condition still exists, the high-drive signal will again be terminated. The OCIF interrupt flag must be cleared in software. It can only be cleared once a switching cycle without an overcurrent condition has occurred. Register OCCON contains the bits used to configure both the output overcurrent limit and the amount of leading edge blanking (see Register 3-4). The OCCON<OCEN> bit must be set to enable the input overcurrent circuitry. Note: The OCIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. 2017 Microchip Technology Inc. DS20005750A-page 21 MCP19122/3 REGISTER 3-4: OCCON: OUTPUT OVERCURRENT CONTROL REGISTER R/W-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x OCEN OCLEB1 OCLEB0 OOC4 OOC3 OOC2 OOC1 OOC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 OCEN: Output Overcurrent Control bit 1 = Output Overcurrent comparator is enabled 0 = Output Overcurrent comparator is disabled bit 6-5 OCLEB<1:0>: Leading Edge Blanking 00 = 110 ns blanking 01 = 200 ns blanking 10 = 380 ns blanking 11 = 740 ns blanking bit 4-0 OOC<4:0>: Output Overcurrent Configuration bits 00000 = 91 mV drop 00001 = 112 mV drop 00010 = 134 mV drop 00011 = 155 mV drop 00100 = 177 mV drop 00101 = 198 mV drop 00110 = 220 mV drop 00111 = 241 mV drop 01000 = 263 mV drop 01001 = 284 mV drop 01010 = 306 mV drop 01011 = 327 mV drop 01100 = 350 mV drop 01101 = 370 mV drop 01110 = 392 mV drop 01111 = 413 mV drop 10000 = 435 mV drop 10001 = 456 mV drop 10010 = 478 mV drop 10011 = 500 mV drop 10100 = 521 mV drop 10101 = 542 mV drop 10111 = 585 mV drop 11000 = 607 mV drop 11001 = 628 mV drop 11010 = 650 mV drop 11011 = 671 mV drop 11100 = 693 mV drop 11101 = 714 mV drop 11110 = 736 mV drop 11111 = 757 mV drop DS20005750A-page 22 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.5 3.5.2 Current Sensing The system output current can be sensed by using either a low value resistor placed in series with the output or for applications that require the highest possible efficiency the series resistance (DCR) of the inductor. For applications that use DCR sensing, a resistor in series with a capacitor are placed around the inductor, as shown in Figure 3-1. If the value of RS and CS are chosen so the RC time constant matches the inductor time constant, the voltage appearing across CS will equal the voltage across the DCR and therefore the current flowing through the inductor. Equation 3-3 can be used to select RS and CS. FIGURE 3-1: INDUCTOR CURRENT SENSE FILTER VIN ISN ISP RS CS HIGHDR INDUCTOR OR SENSE RESISTOR SELECTION The DCR of the inductor or the value of the sense resistor are to be selected so the output of the internal current sense amplifier output does not exceed 3.0V at full load current. The internal current sense amplifier has a fixed gain of 32. See Equation 3-4. EQUATION 3-4: SENSE ELEMENT RESISTANCE AMP VOUT R SENSE = -----------------------------------------AMPGAIN I MAX Where: - RSENSE is the resistance of the sense element - AMPVOUT is the maximum output voltage of the current sense amplifier - AMPGAIN is the fixed gain of the current sense amplifier - IMAX is the maximum application load current To Load PHASE L DCR LOWDR 3.5.3 EQUATION 3-3: CALCULATING FILTER VALUES L ------------ = R S C S DCR MEASURING SYSTEM LOAD CURRENT The system load current can be measured by the internal ADC. Before being measured by the ADC, the sampled current is gained by a fixed +6 dB. It is recommended that multiple ADC readings of the sampled current be taken and averaged together to provide a more uniform measurement. Where: - L is the inductance value of the output inductor - DCR is the series resistance of the output inductor - RS is the current sense filter resistor - CS is the current sense filter capacitor 3.5.1 CURRENT SENSE GAIN The entire current sense path has a fixed gain of 32. Additional gain or attenuation can be added. The amount added is controlled by the CSGSCON register, Register 3-5. The gain added to this current sense signal does not change the +6 dB of current sense gain added before being read by the A/D. 2017 Microchip Technology Inc. DS20005750A-page 23 MCP19122/3 REGISTER 3-5: CSGSCON: CURRENT SENSE GAIN CONTROL REGISTER U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x -- -- -- CSGS4 CSGS3 CSGS2 CSGS1 CSGS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-5 Unimplemented: Read as `0' bit 4-0 CSGS<4:0>: Current Sense Gain Setting bits 000000 = -3.0 dB 000001 = -2.8 dB 000010 = -2.6 dB 000011 = -2.4 dB 000100 = -2.2 dB 000101 = -2.0 dB 000110 = -1.8 dB 000111 = -1.6 dB 001000 = -1.4 dB 001001 = -1.2 dB 001010 = -1.0 dB 001011 = -0.8 dB 001100 = -0.6 dB 001101 = -0.4 dB 001110 = -0.2 dB 001111 = 0.0 dB 010000 = 0.2 dB 010001 = 0.4 dB 010010 = 0.6 dB 010011 = 0.8 dB 010100 = 1.0 dB 010101 = 1.2 dB 010110 = 1.4 dB 010111 = 1.6 dB 011000 = 1.8 dB 011001 = 2.0 dB 011010 = 2.2 dB 011011 = 2.4 dB 011100 = 2.6 dB 011101 = 2.8 dB 011110 = 3.0 dB 011111 = 3.2 dB DS20005750A-page 24 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.6 FIGURE 3-2: Control Parameters 3.6.1 SIMPLIFIED COMPENSATION COMPENSATION SETTING +VSEN The MCP19122/3 is an emulated current mode controller with integrated compensation. The desired response of the overall loop can be tuned by proper placement of the compensation zero frequency and gain. The CMPZCON register, Register 3-6, is used to adjust the compensation zero frequency and gain. Figure 3-2 shows a simplified drawing of the internal compensation with and the adjustable gain differential amplifier. REGISTER 3-6: xG -VSEN VREF CMPZCON: COMPENSATION SETTING CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x CMPZF3 CMPZF2 CMPZF1 CMPZF0 CMPZG3 CMPZG2 CMPZG1 CMPZG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-4 x = Bit is unknown CMPZF<3:0>: Compensation Zero Frequency Setting bits 0000 = 1500 Hz 0001 = 1850 Hz 0010 = 2300 Hz 0011 = 2840 Hz 0100 = 3460 Hz 0101 = 4300 Hz 0110 = 5300 Hz 0111 = 6630 Hz 1000 = 8380 Hz 1001 = 9950 Hz 1010 = 12200 Hz 1011 = 14400 Hz 1100 = 18700 Hz 1101 = 23000 Hz 1110 = 28400 Hz 1111 = 35300 Hz bit 3-0 CMPZG<3:0>: Compensation Gain Setting bits 0000 = 30.13 dB 0001 = 27.73 dB 0010 = 24.66 dB 0011 = 22.41 dB 0100 = 20.08 dB 0101 = 17.78 dB 0110 = 15.42 dB 0111 = 13.06 dB 1000 = 10.75 dB 1001 = 8.30 dB 1010 = 6.02 dB 1011 = 3.52 dB 1100 = 1.21 dB 1101 = -1.41 dB 1110 = -3.74 dB 1111 = -6.02 dB 2017 Microchip Technology Inc. DS20005750A-page 25 MCP19122/3 3.6.2 SLOPE COMPENSATION RAMP The difference between the average inductor current and the DC value of the sampled inductor current can cause instability for certain operating conditions. This instability occurs when the inductor ripple current does not return to its initial value by the start of the next switching cycle. Adding slope compensation ramp to REGISTER 3-7: the current sense signal prevents this oscillation. The amount of slope added is controlled by the RAMPCON register, Register 3-7. Note 1: To enable the slope compensation circuitry, the RAMPCON<RAMPEN> bit must be cleared. RAMPCON: COMPENSATION RAMP CONTROL REGISTER R/W-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x RMPEN -- -- RMP4 RMP3 RMP2 RMP1 RMP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 RMPEN: Compensation Ramp Disable bit 1 = Compensation ramp is disabled 0 = Compensation ramp is enabled bit 6-5 Unimplemented: Read as `0' bit 4-0 RMP<4:0>: Compensation Ramp Configuration bits RMP<4:0> = (dV/dt * 200/VIN); Where dV/dt is in V/s DS20005750A-page 26 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.7 accomplished by the settings contained in the VOUTH and VOUTL registers. See Equation 3-5 for more information. Determining System Output Voltage 3.7.1 REFERENCE VOLTAGE CONFIGURATION The control system reference voltage is determined by the setting contained in the 10-bit VREF DAC. The system reference is adjustable in 2 mV typical increments. The configuring of this DAC is REGISTER 3-8: Note 1: To enable the slope compensation circuitry, the RAMPCON<RAMPEN> bit must be cleared. See Section 4.0, Electrical Characteristics for more information regarding the DAC specification. VOUTL: OUTPUT VOLTAGE SET POINT LSB CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 VOUT7 VOUT6 VOUT5 VOUT4 VOUT3 VOUT2 VOUT1 VOUT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown VOUT<7:0>: Output Voltage Set Point LSB Configuration bits REGISTER 3-9: VOUTH: OUTPUT VOLTAGE SET POINT MSB CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 -- -- -- -- -- -- VOUT9 VOUT8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-2 Unimplemented: Read as `0' bit 1-0 OVOUT<9:8>: Output Voltage Set Point MSB Configuration bits 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 27 MCP19122/3 3.7.2 DIFFERENTIAL AMPLIFIER GAIN CONTROL EQUATION 3-5: The MCP19122/3 contains a low offset programmable gain differential amplifier used for remote sensing of the output voltage. Connect the +VSEN and -VSEN pins directly at the load for better load regulation. The +VSEN and -VSEN are the positive and negative inputs, respectively, of the programmable gain differential amplifier. SYSTEM OUTPUT VOLTAGE V OUT V REFDAC = -------------------------------------------------DA GAIN DAC STEP Where: - VREFDAC is the concatenated decimal value of VOUTH and VOUTL - DAGAIN is the programmable gain of the differential amplifier. - DACStep is the volts/step of the reference voltage DAC, typically 2 mV/step - VOUT is the desired output voltage The programmable gain settings are controlled by the DAGCON register, Register 3-10. Note 1: If the hexadecimal VREFDAC value calculated is larger than 10-bits, the programmable gain differential amplifier gain must be adjusted. REGISTER 3-10: DAGCON: DIFFERENTIAL AMPLIFIER GAIN CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 -- -- -- -- -- DAG2 DAG1 DAG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-3 Unimplemented: Read as `0' bit 2-0 DAG<2:0>: Differential Amplifier Gain control bit 000 = Gain of 1 001 = Gain of 1/2 010 = Gain of 1/4 011 = Gain of 1/8 100 = Gain of 2 101 = Gain of 4 110 = Gain of 8 111 = Gain of 1 DS20005750A-page 28 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.8 System Output Voltage Protection The MCP19122/3 provides the option for hardware and/or software protection for a system output under voltage as well as a system output over voltage. 3.8.1 OUTPUT UNDERVOLTAGE The output voltage is monitored and compared to an adjustable undervoltage (UV) reference. When the output voltage is below UV reference the PIR2<UVIF> flag is set. If the hardware UV accelerator response circuitry (see Register 3-14) is enabled, the high-side MOSFET is turned on until the maximum programmed duty cycle is reached. Then the low-side MOSFET is turned on for the remainder of the switching period. REGISTER 3-11: Once the output voltage is above the UV reference the MCP19122/3 returns to normal operation. The UVIF flag must be cleared in software. The output undervoltage reference is controlled by the VOTUVLO register, Register 3-11. A fixed voltage is subtracted from the adjustable system output voltage reference. Note 1: The system output voltage reference is determined by the setting in the VOUTH and VOUTL registers. 2: The UVIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. VOTUVLO: OUTPUT UNDER VOLTAGE DETECT LEVEL CONTROL REGISTER U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x -- -- -- -- OUV3 OUV2 OUV1 OUV0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-4 Unimplemented: Read as `0' bit 3-0 OUV<3:0>: Output Under Voltage Detect Level Configuration bits 0000 = VREF - 50 mV 0001 = VREF - 80 mV 0010 = VREF - 110 mV 0011 = VREF - 140 mV 0100 = VREF - 170 mV 0101 = VREF - 200 mV 0110 = VREF - 230 mV 0111 = VREF - 260 mV 1000 = VREF - 290 mV 1001 = VREF - 320 mV 1010 = VREF - 350 mV 1011 = VREF - 380 mV 1100 = VREF - 410 mV 1101 = VREF - 440 mV 1110 = VREF - 470 mV 1111 = VREF - 500 mV 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 29 MCP19122/3 3.8.2 OUTPUT OVER VOLTAGE The output voltage is monitored and compared to an adjustable over voltage (OV) reference. When the output voltage is above OV reference the PIR2<OVIF> flag is set. If the hardware OV accelerator response circuitry, see Register 3-14, is enabled the high-side and low-side MOSFETs are turned off until the output voltage fails below the output over voltage reference. Once the output voltage is below the OV reference the MCP19122/3 returns to normal operation. The OVIF flag must be cleared in software. REGISTER 3-12: The output under voltage reference is controlled by the VOTOVLO register, Register 3-12. A fixed voltage is added to the adjustable system output voltage reference. Note 1: The system output voltage reference is determined by the setting in the VOUTH and VOUTL registers. 2: The OVIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. VOTOVLO: OUTPUT OVER VOLTAGE DETECT LEVEL CONTROL REGISTER U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x -- -- -- -- OOV3 OOV2 OOV1 OOV0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-4 Unimplemented: Read as `0' bit 3-0 OOV<3:0>: Output Over Voltage Detect Level Configuration bits 0000 = VREF + 50 mV 0001 = VREF + 80 mV 0010 = VREF + 110 mV 0011 = VREF + 140 mV 0100 = VREF + 170 mV 0101 = VREF + 200 mV 0110 = VREF + 230 mV 0111 = VREF + 260 mV 1000 = VREF + 290 mV 1001 = VREF + 320 mV 1010 = VREF + 350 mV 1011 = VREF + 380 mV 1100 = VREF + 410 mV 1101 = VREF + 440 mV 1110 = VREF + 470 mV 1111 = VREF + 500 mV DS20005750A-page 30 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.9 Internal Synchronous Driver FIGURE 3-3: The internal synchronous driver is capable of driving two N-Channel MOSFETs in a synchronous rectified buck converter topology. The gate of the floating MOSFET is connected to the HDRV pin. The source of this MOSFET is connected to the PHASE pin. This pin is capable is sourcing and sinking 2A of peak current. HDRV HDLY LDLY The MOSFET connected to the LDRV pin is not floating. The low-side MOSFET gate is connected to the LDRV pin and the source of this MOSFET is connected to PGND. This pin is capable of sourcing a peak current of 2A. The peak sink current is 4A. This helps keep the low-side MOSFET off when the high-side MOSFET is turning on. LDRV 3.9.2 3.9.1 MOSFET DRIVER DEAD TIME The MOSFET driver dead time is defined as the time between one drive signal going low and the complimentary drive signal going high. Refer to Figure 3-3. The MCP19122/3 has the capability to adjust both the high-side and low-side driver dead time independently. The adjustment of the driver dead time is controlled by the DEADCON register. MOSFET DRIVER CONTROL The MCP19122/3 has the ability to independently disable high-side or low-side driver circuitry. This control of the HDRV or LDRV signal is accomplished by setting or clearing the HIDIS or LODIS bits in the PE1 register. When either driver is disabled, the output signal is set low. The default power-on or reset state is to have the high-side and low-side drivers disabled. 3.10 Note 1: The DEADCON register controls the amount of dead time added to the HDRV or LDRV signal. MOSFET DRIVER DEAD TIME High-Side MOSFET Driver Supply A floating voltage is required by the high-side driver. An external bootstrap capacitor connected between the BOOT and PHASE pins supplies this gate drive voltage. This capacitor is charged by internally connecting the BOOT pin to VDD when the PHASE pin is low. The selection of the bootstrap capacitor is based upon the total charge of the high-side power MOSFET and the allowable droop in the voltage applied to the gate of the high-side power MOSFET. EQUATION 3-6: BOOTSTRAP CAPACITOR Q G Total C BOOT = -----------------------V DROOP Where: - QG(Total) = High-side MOSFET Total Gate Charge (C) - VDROOP = Allowable Gate Drive Voltage Droop (V) 2017 Microchip Technology Inc. DS20005750A-page 31 MCP19122/3 REGISTER 3-13: DEADCON: DRIVER DEAD TIME CONTROL REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 HDLY3 HDLY2 HDLY1 HDLY0 LDLY3 LDLY2 LDLY1 LDLY0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-4 HDLY<3:0>: High-Side Dead Time Configuration bits 0000 = 14 ns delay 0001 = 18 ns delay 0010 = 22 ns delay 0011 = 26 ns delay 0100 = 30 ns delay 0101 = 34 ns delay 0110 = 38 ns delay 0111 = 42 ns delay 1000 = 46 ns delay 1001 = 50 ns delay 1010 = 54 ns delay 1011 = 58 ns delay 1100 = 62 ns delay 1101 = 66 ns delay 1110 = 70 ns delay 1111 = 74 ns delay bit 3-0 LDLY<3:0>: Low-Side Dead Time Configuration bits 0000 = -4 ns delay 0001 = 0 ns delay 0010 = 4 ns delay 0011 = 8 ns delay 0100 = 12 ns delay 0101 = 16 ns delay 0110 = 20 ns delay 0111 = 24 ns delay 1000 = 28 ns delay 1001 = 32 ns delay 1010 = 36 ns delay 1011 = 40 ns delay 1100 = 44 ns delay 1101 = 48 ns delay 1110 = 52 ns delay 1111 = 56 ns delay DS20005750A-page 32 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.11 Analog Peripheral Control The MCP19122/3 has various analog peripherals. These peripherals can be configured to allow customizable operation. Refer to Register 3-14 more information. 3.11.1 DIODE EMULATION MODE The MCP19122/3 can operate in either diode emulation or synchronous rectification mode. When operating in diode emulation mode, the LDRV signal is terminated when the voltage across the low-side MOSFET is approximately 0V. This provides better light load efficiency by preventing reverse current from flowing through the inductor. Both the HDRV and LDRV signals are low until the beginning of the next switching cycle. At that time, the HDRV signal is asserted high, turning on the high-side MOSFET. The PE1<DECON> bit controls the diode emulation operating mode of the MCP19122/3. 3.11.2 HIGH-SIDE DRIVER CONTROL The high-side driver is enabled by clearing the PE1<HIDIS> bit. Setting this bit disables the high-side driver. Note: 3.11.3 The HIDIS bit is reset to `1' so the highside driver is in a known state after reset. This bit must be cleared by software for normal operation. 3.11.5 OUTPUT OVER VOLTAGE ACCELERATOR The MCP19122/3 has additional control circuitry to allow it to respond quickly to an output overvoltage condition. The enabling of this circuitry is handled by the PE1<OVTEE> bit. When this bit is set, the MCP19122/3 will respond to an output overvoltage condition by turning off the high-side and low-side MOSFETs until the output voltage is below the output overvoltage threshold set by the OOVCON register. The overvoltage reference is controlled by the VOTOVLO register, Register 3-12. 3.11.6 RELATIVE EFFICIENCY RAMP MEASUREMENT CONTROL The PE1<SPAN> bit determines what portion of the Relative Efficiency Measurement timing ramp is connected to A/D channel 0x08h. When the PE1<MEASEN> bit is low and the PE1<SPAN> bit is low, the RELEFF channel of the A/D (channel 0x08h) will measure the valley of the relative efficiency timing ramp. When the PE1<MEASEN> is low and the PE1<SPAN> bit is hit, the RELEFF channel of the A/D will measure the peak of the relative efficiency timing ramp. LOW-SIDE DRIVE CONTROL The low-side driver is enabled by clearing the PE1<LODIS> bit. Setting this bit disables the low-side driver. Note: 3.11.4 The LODIS bit is reset to `1' so the lowside driver is in a known state after reset. This bit must be cleared by software for normal operation. OUTPUT UNDERVOLTAGE ACCELERATOR The MCP19122/3 has additional control circuitry to allow it to respond quickly to an output undervoltage condition. The enabling of this circuitry is handled by the PE1<UVTEE> bit. When this bit is set, the MCP19122/3 will respond to an output under voltage condition by turning on the high-side MOSFET until the output voltage is above the output undervoltage threshold set by the OUVCON register. The low-side MOSFET is off during this time. The undervoltage reference is controlled by the VOTUVLO register, Register 3-11. 2017 Microchip Technology Inc. DS20005750A-page 33 MCP19122/3 REGISTER 3-14: PE1: ANALOG PERIPHERAL ENABLE 1 CONTROL REGISTER R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 DECON TOPO HIDIS LODIS MEASEN SPAN UVTEE OVTEE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 DECON: Diode Emulation Mode bit 1 = Diode emulation mode enabled 0 = Synchronous rectification mode enabled bit 6 TOPO: Topology selection control bit 1 = Boost topology is enabled 0 = Buck topology is enabled bit 5 HIDIS: High-side driver control bit 1 = High-side driver is disabled 0 = High-side driver is enabled bit 4 LODIS: Low-side driver control bit 1 = Low-side driver is disabled 0 = Low-side driver is enabled bit 3 MEASEN: Relative efficiency measurement control bit 1 = Initiate relative efficiency measurement 0 = Relative efficiency measurement not in progress bit 2 SPAN: Relative efficiency ramp measurement control bit 1 = A/D channel 0x08h measures the peak of the RELEFF signal 0 = A/D channel 0x08h measures the valley of the RELEFF signal bit 1 UVTEE: Output Undervoltage Accelerator Enable bit 1 = Output undervoltage accelerator is enabled 0 = Output undervoltage accelerator is disabled bit 0 OVTEE: Output Overvoltage Accelerator Enable bit 1 = Output overvoltage accelerator is enabled 0 = Output overvoltage accelerator is disabled DS20005750A-page 34 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 3.12 System Configuration Control The MCP19122/3 is capable of operating in a variety of different configurations. The MODECON register controls the system configuration of the MCP19122/3. 3.12.1 ERROR AMPLIFIER CLAMP The internal error amplifier is a rail-to-rail amplifier. However, the output of the error amplifier can be clamped to an adjustable level. The MODECON<EACLMP> is the error amplifier clamp control bit. Setting this bit enables the error amplifier clamp. The bit is cleared on a reset making the error amplifier clamp disabled by default. The error amplifier clamp source is controlled by the MODECON<CLMPSEL> bit. When this bit is set, the voltage present on GPA3 will set the error amplifier clamp voltage. The clamp voltage can also be determined by a combination of the GPA3 pin voltage and the sampled output current. This is achieved by clearing the MODECON<CLMPSEL> bit. Note: 3.12.2 The GPA3 pin can be configured as a weak current source by setting the WPUGPA<WCS1> bit. See Register 173. INTERNAL PEDESTAL VOLTAGE To improve accuracy at low voltages, a pedestal voltage is implemented throughout the analog control loop. This voltage is typically 500 mV and can be enabled or disabled by the MODECON<VGNDEN> bit. This pedestal voltage is enabled on any reset. The VGNDEN bit must be cleared to disable the pedestal. When the MCP19122/3 is disabled, the system output voltage may float up. If the pedestal voltage is also disabled under this condition, the output voltage will not float up. It is recommended that the pedestal voltage always be enabled while operating the MCP19122/3. Operating with the pedestal voltage disabled may cause the MCP19122/3 to not meet all of the electrical specifications contained in the specification table. See Section 4.0 "Electrical Characteristics". 3.12.3 VDD LDO CONTROL The VDDEN bit controls the state of the internal 5V VDD LDO when the SLEEP command is issued to the microcontroller core. If the VDDEN bit is set and the SLEEP command is issued the 5V VDD LDO will remain operational and capable of supporting a load. 3.12.4 VOLTAGE/CURRENT SOURCE The system output voltage or load current can be controlled by the MCP19122/3. The MODECON<CNSG> is the control system configuration bit. When the CNSG bit is cleared, the MCP19122/3 functions as a voltage source. The system output voltage is regulated by comparing the sensed voltage to the adjustable reference voltage. When the CNSG bit is set, the MCP19122/3 is configured to control the system output current. The output current is regulated by adjusting the high-side duty cycle according to the amount of error that exists between the sampled load current and the adjustable reference. 3.12.5 MULTIPLE OUTPUT SYSTEM CONFIGURATION The MCP19122/3 is capable of being configured as a Master or Slave in a multiple output system. The device configuration is set by the MODECON<MSC2:0> bits. 3.12.5.1 Multiple Output System Master When configured as a Master, the GPA1 pin is automatically set to output the switching frequency synchronization signal. The frequency of this synchronization signal sets the converters switching frequency. The GPB3 pin is automatically set to output the system clock signal frequency of 8 MHz. 3.12.5.2 Multiple Output System Slave The are two different multiple output Slave configurations. The first configuration, MSC<2:0> = 010, requires the Slave to receive a switching frequency synchronization signal and system clock signal from a Master device. For this configuration GPA1 and GPB3 are automatically set as an input. The switching frequency synchronization signal from the Master is connected to the GPA1 pin. Phase shift from this synchronization signal can be applied. See Equation 26-2. The 8 MHz system clock from the Master is connected to the GPB3 pin. This multiple output Slave mode results in less switching waveform frequency jitter when compared to the Master's switching waveforms. The second multiple output system Slave configuration, MSC<2:0> = 110, requires the Slave to only receive a switching frequency synchronization signal from the Master. GPA1 is automatically set as an input and the switching frequency synchronization signal from the Master is connected to this pin. Phase shift When the SLEEP command is issued and the VDDEN bit is clear, the 5V VDD LDO will be commanded to a low current consumption state. The voltage will drop to approximately 3V and will not be able to supply any external current. 2017 Microchip Technology Inc. DS20005750A-page 35 MCP19122/3 from the synchronization signal can be applied. See Equation 26-2. No system clock is required in this mode. Note 1: The TMR2 register should be initialized to 0 to allow proper synchronization. 2: The PWMPHL and PWMPHH register control the amount of phase shift applied. 3.12.6 MULTI-PHASE SYSTEM The MCP19122/3 is capable of being configured as a Master or Slave in a multi-phase system. The MODECON<MSC2:0> bits determine the device configuration. 3.12.6.1 Multi-phase System Master When configured as a Master, the GPA1 pin is automatically set to output the switching frequency synchronization signal. The frequency of this synchronization signal sets the converters switching frequency. The GPB3 pin is automatically set to output the system clock signal frequency of 8 MHz. The GPB1 pin is automatically set to output the sampled current sense signal. 3.12.6.2 Multi-phase System Slave When configured as a Slave, GPA1 is set to be the switching frequency synchronization signal input pin. The Master's switching frequency synchronization signal is to be connected to this pin. Phase shift from the synchronization signal can be applied. See Register 26-2. To ensure proper synchronization between the Master and Slave, GPB3 of the Slave is set to be the system clock input pin. Both the Master and Slave GPB3 pins must be connected together. To properly balance the system output current between the phases, all devices need to regulate to the same current. On the Slave devices, GPB1 is set to be the current sense input signal from the Master. Both the Master and Slave GPB1 pins must be connected together. The MODECON<CNSG> must also be set to a `1' so the Slave device is set to control the system output current. Note 1: The TMR2 register should be initialized to 0 to allow proper synchronization. 2: The PWMPHL and PWMPHH register control the amount of phase shift applied. DS20005750A-page 36 2017 Microchip Technology Inc. MCP19122/3 REGISTER 3-15: MODECON: SYSTEM CONFIGURATION CONTROL REGISTER R/W-0 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CLMPSEL VGNDEN VDDEN CNSG EACLMP MSC2 MSC1 MSC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 CLMPSEL: Error Amplifier Clamp Configuration bit 1 = EA Clamp current set by GPA3 pin voltage 0 = EA Clamp current set by GPA3 pin voltage and average output current bit 6 VGNDEN: Virtual Ground Control bit 1 = Virtual Ground is enabled 0 = Virtual Ground is disabled bit 5 VDDEN: VDD LDO control bit 0 = VDD LDO is disabled when SLEEP command issued 1 = VDD LDO remains enabled when SLEEP command issued bit 4 CNSG: Control Signal configuration bit 0 = Device set to control system output voltage 1 = Device set to control system output current bit 3 EACLMP: Error Amplifier Clamp control bit 1 = Error amplifier output clamp enabled 0 = Error amplifier output clamp disabled bit 2-0 MSC<2:0>: System configuration control bit 000 = Device set as a stand alone unit 001 = Device set as multiple output Master (GPB3: clock signal out, GPA1: synchronization signal out) 010 = Device set as multiple output Slave (GPB3: clock signal in, GPA1:synchronization signal in) 011 = Device set as multi-phase Master (GPB3: clock signal out,GPA1: synchronization signal out, GPB1: demand out) 100 = Device set as multi-phase Slave (GPB3: clock signal in, GPA1: synchronization signal in, GPB1: demand in) 101 = Device set as multiple output Master (GPA1: synchronization signal out) 110 = Device set as multiple output Slave (GPA1: synchronization signal in) 111 = Unimplemented 2017 Microchip Technology Inc. DS20005750A-page 37 MCP19122/3 3.13 Miscellaneous Features 3.13.1 OVERTEMPERATURE The MCP19122/3 features a hardware overtemperature shutdown protection typically set at +160C. No firmware fault-handling procedure is required to shutdown the MCP19122/3 for an over temperature condition. 3.13.2 DEVICE ADDRESSING The communication address of the MCP19122/3 is stored in the SSPADD register. This value can be loaded when the device firmware is programmed or configured by external components. By reading a voltage on a GPIO with the ADC, a device specific address can be stored into the SSPADD register. EXAMPLE 3-2: BANKSEL BSF BANKSEL BCF : : : WAIT_ENABLE: BANKSEL BTFSS GOTO BANKSEL BSF : : : 3.13.4 3.13.3 DEVICE ENABLE A GPIO pin can be configured to be a device enable pin. By configuring the pin as an input, the PORT register or the interrupt on change (IOC) can be used to enable the device. Example 3-2 shows how to configure a GPIO as an enable pin by testing the PORT register. CONFIGURING GPA3 AS DEVICE ENABLE TRISGPA TRISGPA, 3 ANSELA ANSELA, 3 ;Set GPA3 as input ;Set GPA3 as digital input ;Insert additional user code here PORTGPA PORTGPA, 3 WAIT_ENABLE ATSTCON ATSTCON, 0 ;Test GPA3 to see if pulled high ;A high on GPA3 indicated device to be enabled ;Stay in loop waiting for device enable ;Enable the device by enabling drivers ;Insert additional code here OUTPUT POWER GOOD The output voltage measured between the +VSEN and -VSEN pins can be monitored by the internal ADC. In firmware, when this ADC reading matches a userdefined power good value, a GPIO can be toggled to indicate the system output voltage is within a specified range. Delays, hysteresis and time out values can all be configured in firmware. 3.13.5 The MCP19122/3 contains a second address register, SSPADD2. This is a 7-bit address that can be used as the SMBus alert address when PMBus communication is used. See Section 27.0, Master Synchronous Serial Port (MSSP) Module for more information. voltage applied to it. The firmware then handles the tracking of the internal output voltage reference to this ADC reading. OUTPUT VOLTAGE SOFT-START During start-up, soft start of the output voltage is accomplished in firmware. By using one of the internal timers and incrementing the OVCCON or OVFCON register on a timer overflow, very long soft start times can be achieved. 3.13.6 OUTPUT VOLTAGE TRACKING The MCP19122/3 can be configured to track another voltage signal at start-up or shutdown. The ADC is configured to read a GPIO that has the desired tracking DS20005750A-page 38 2017 Microchip Technology Inc. MCP19122/3 4.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings () VIN - VGND ................................................................................................................................................. -0.3V to +43V VIN - VGND (non-switching) .........................................................................................................................-0.3V to +48V VBOOT - VIN .......................................................................................................................................-0.3V to +VDDMAXV VPHASE (continuous) ....................................................................................................................... GND - 0.3V to +VINV VPHASE (transient < 100 ns)............................................................................................................ GND - 5.0V to +VINV VDD internally generated .....................................................................................................................................+5V 8% VHDRV, HDRV Pin..........................................................................................................+VPHASE - 0.3V to VBOOT + 0.3V VLDRV, LDRV Pin............................................................................................................. +(VGND - 0.3V) to (VDD + 0.3V) Voltage on MCLR with respect to GND ................................................................................................... -0.3V to +13.5V +VSEN, ISP, ISN pins.......................................................................................................................(VGND- 0.3V) to +16V Maximum Voltage: any other pin..................................................................................... +(VGND - 0.3V) to (VDD + 0.3V) Maximum output current sunk by any single I/O pin ...............................................................................................25 mA Maximum output current sourced by any single I/O pin ..........................................................................................25 mA Maximum current sunk by all GPIO ........................................................................................................................65 mA Maximum current sourced by all GPIO ...................................................................................................................45 mA ESD protection on all pins (HBM) ........................................................................................................................... 1.0 kV ESD protection on all pins (MM) 200 V Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2017 Microchip Technology Inc. DS20005750A-page 39 MCP19122/3 ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25C. Boldface specifications apply over the TA range of -40C to +125C Parameter Sym. Min. Typ. Max. Units Conditions Input Voltage VIN 4.5 -- 40 V Input Quiescent Current IQ -- 5 10 mA Not Switching, +VSEN > VREF MODECON<VGNDEN> = 0 Input Shutdown Current ISHDN -- 50 150 A SLEEP Command, VDD disabled VDD 4.6 5.0 5.4 IDD_OUT 35 Line Regulation VDD-OUT/ (VDDOUT*VIN) -- 0.1 Load Regulation VDD-OUT/VDD- -0.5 IDD-OUT_SC Input Internal Regulator VDD Bias Voltage Maximum external VDD output current V Vin = 6V to 40V mA Vin = 6V to 40V 0.45 %/V (VDD-OUT+1.0V) VIN 40V Note 2 0.1 +0.5 % -- 45 -- mA VIN - VDD-OUT -- 0.5 1 V IDD-OUT = 35 mA, VIN = VDD-OUT + 1.0V Note 2 PSRRLDO -- 60 -- dB f 1000 Hz, IDD-OUT = 35mA CIN = 0 F, CDD-OUT = 1 F BG 1.205 1.230 1.254 V AVDD 3.97 4.096 4.23 V OCMIN 90 -- 755 mV OCSTEP_SIZE 15 21 25 mV OUT Output Short Circuit Current Dropout Voltage Power Supply Rejection Ratio IDD-OUT = 1 mA to 20 mA Note 2 VIN = (VDD-OUT + 1.0V) Note 2 Band Gap Band Gap Voltage Internal Regulator AVDD Internal Analog Supply Voltage Overcurrent Adjustable Overcurrent Range Overcurrent Step Size Adjustable Leading Edge Blanking Time LEB 90 110 135 ns 150 200 250 ns 250 380 480 ns 500 740 950 ns ISENSE_GAIN 30 32 34 V/V ISENSE_OFFSET -10 0 10 mV Current Sense Current Sense Fixed Gain Current Sense Amplifier Offset Note 1: 2: 3: 4: 5: Fixed gain removed These parameters are characterized but not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the voltage measured between the PHASE pin and GND. When measured voltage is between 2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low This is the total source current for all GPIO pins combined. Individually each pin can source a maximum of 15 mA. System output voltage tolerance specified when 1.024V VREF 2.046V. DS20005750A-page 40 2017 Microchip Technology Inc. MCP19122/3 ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25C. Boldface specifications apply over the TA range of -40C to +125C Parameter Sym. Min. Typ. Max. Units VPEDESTAL -- 500 -- mV VOUT_RANGE 0.5 -- 16 V VREFSTEP -- 2 -- mV System Output Voltage Tolerance VTOL -3% +3% Differential amplifier gain setting of 1/8, 1/4, 1/2, 1 and 2 Note 5 System Output Voltage Tolerance VTOL -5% +5% Differential amplifier gain setting of 4 Note 5 System Output Voltage Tolerance VTOL -6.5% +6.5% Differential amplifier gain setting of 8 Note 5 OVSTEP 27 31 35 mV UVSTEP 27 31 35 mV RIN -- 12 -- kOh ms Common Mode Voltage Range VCMR -0.5 -- +0.5 V Differential Feedback Voltage Range VDIFF 0 16 V Internal Oscillator Frequency FOSC 7.60 8.00 8.40 MHz Switching Frequency FSW -- FOSC/ N -- kHz Switching Frequency Range Select N 4 -- 80 -- Maximum Duty Cycle -- -- (N-1)/ N -- %/ 100 LDRV Dead Time Adjustable Range DTRANGE_L -4 -- 56 ns Labeled LDLY in Figure 3-3 HDRV Dead Time Adjustable Range DTRANGE_H 14 -- 74 ns Labeled HDLY in Figure 3-3 DTSTEP -- 4 -- ns For both HDLY and LDLY -- 1.4 2.7 Measured at 100mA Note 1 Pedestal Voltage Conditions Voltage Reference Adjustable VOUT Range Reference Voltage Step Size VOUT range with no external voltage divider Output Over Voltage Reference Output Over Voltage Step Size Output Under Voltage DAC Output Under Voltage Step Size Remote Sense Differential Amplifier Input Impedance Oscillator/PWM FSW = 100 kHz to 2 MHz Dead Time Adjustment Dead Time Step Size HDRV Output Driver HDRV Source Resistance Note 1: 2: 3: 4: 5: RHIDRV-SCR These parameters are characterized but not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the voltage measured between the PHASE pin and GND. When measured voltage is between 2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low This is the total source current for all GPIO pins combined. Individually each pin can source a maximum of 15 mA. System output voltage tolerance specified when 1.024V VREF 2.046V. 2017 Microchip Technology Inc. DS20005750A-page 41 MCP19122/3 ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25C. Boldface specifications apply over the TA range of -40C to +125C Parameter Sym. Min. Typ. Max. Units -- 1.2 2.5 Measured at 100mA Note 1 2 -- A Note 1 HDRV Sink Resistance RHIDRV-SINK HDRV Source Current IHIDRV-SCR -- HDRV Sink Current IHIDRV-SINK -- HDRV Minimum On Time tMIN Conditions 2 -- A Note 1 75 95 ns Note 1 LDRV Output Driver LDRV Source Resistance RLODRV-SCR -- 1.8 3.2 Measured at 100mA Note 1 LDRV Sink Resistance RLODRV-SINK -- 0.6 2 Measured at 100mA Note 1 LDRV Source Current ILODRV-SCR -- 2 -- A Note 1 LDRV Sink Current ILODRV-SINK -- 4 -- A Note 1 tMIN -- 167 -- ns Note 1 20 40 Note 1 LDRV Minimum On Time Bootstrap Blocking Device Blocking Device Resistance RBLOCK GPIO Pins GPIO Weak Current Source -- 45 50.0 55 A Selected current source on GPA2, GPA3. Maximum GPIO Sink Current ISINK_GPIO -- -- 35 mA Note 1,Note 4 Maximum GPIO Source Current ISOURCE_GPIO -- -- 35 mA Note 1,Note 4 GPIO Weak Pull-up Current IPULL-UP_GPIO 50 250 400 A VDD = 5V GPIO Input Leakage Current GPIO_IIL -- 0.1 1 A Negative current is defined as current sourced by the pin. TA = +90C VIL GND -- 0.8 V I/O Port with TTL buffer VDD = 5V, TA = +90C GND -- 0.2VDD V I/O Port with Schmitt Trigger buffer, VDD = 5V, TA = +90C GND -- 0.2VDD V MCLR, TA = +90C 2.0 -- VDD V I/O Port with TTL buffer VDD = 5V, TA = +90C 0.8VDD -- VDD V I/O Port with Schmitt Trigger buffer, VDD = 5V, TA = +90C 0.8VDD -- VDD V MCLR, TA = +90C -- 160 -- C GPIO Input Low Voltage GPIO Input High Voltage VIH Thermal Shutdown Thermal Shutdown Note 1: 2: 3: 4: 5: TSHD These parameters are characterized but not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the voltage measured between the PHASE pin and GND. When measured voltage is between 2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low This is the total source current for all GPIO pins combined. Individually each pin can source a maximum of 15 mA. System output voltage tolerance specified when 1.024V VREF 2.046V. DS20005750A-page 42 2017 Microchip Technology Inc. MCP19122/3 ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25C. Boldface specifications apply over the TA range of -40C to +125C Parameter Thermal Shutdown Hysteresis Note 1: 2: 3: 4: 5: Sym. Min. Typ. Max. Units TSHD_HYS -- 20 -- C Conditions These parameters are characterized but not production tested. VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. This is the voltage measured between the PHASE pin and GND. When measured voltage is between 2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low This is the total source current for all GPIO pins combined. Individually each pin can source a maximum of 15 mA. System output voltage tolerance specified when 1.024V VREF 2.046V. THERMAL SPECIFICATIONS Parameter Symbol Min Typ Max Units Specified Temperature Range TA -40 -- +125 C Operating Temperature Range TA -40 -- +125 C Maximum Junction Temperature TJ -- -- +150 C TA -65 -- +150 C Thermal Resistance, 24L-QFN 4x4 JA -- 42 -- C/W Thermal Resistance, 28L-QFN 5x5 JA -- 35.3 -- C/W Conditions Temperature Ranges Storage Temperature Range Thermal Package Resistances Note 1: Note 1 The parameter is determined using a High K 2S2P 4-layer board as described in JESD51-7, as well as JESD 51-5 for packages with exposed pads. 2017 Microchip Technology Inc. DS20005750A-page 43 MCP19122/3 NOTES: DS20005750A-page 44 2017 Microchip Technology Inc. MCP19122/3 5.0 DIGITAL ELECTRICAL CHARACTERISTICS 5.1 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (high-impedance) L Low I2C only AA output access BUF Bus free TCC:ST (I2C specifications only) CC HD Hold ST DAT DATA input hold STA START condition FIGURE 5-1: 3. TCC:ST 4. Ts (I2C specifications only) (I2C specifications only) T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance High Low High Low SU Setup STO STOP condition LOAD CONDITIONS Load Condition 1 Load Condition 2 VDD/2 RL CL Pin VSS CL Pin VSS RL = 464 CL = 50 pF for all GPIO pins 2017 Microchip Technology Inc. DS20005750A-page 45 MCP19122/3 5.2 AC Characteristics: MCP19122/3 FIGURE 5-2: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC 1 2 TABLE 5-1: Param No. EXTERNAL CLOCK TIMING REQUIREMENTS Sym. Characteristic Min. Typ. Max. Units FOSC Oscillator Frequency(1) -- 8 -- MHz 1 TOSC 2 TCY Oscillator Period(1) Instruction Cycle Time(1) -- 250 -- ns -- 1000 -- ns Conditions * These parameters are characterized but not tested. Data in "Typ" column is at VIN = 12V (VDD = 5V), +25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. FIGURE 5-3: I/O TIMING Q1 Q4 Q2 Q3 OSC 22 23 19 18 I/O Pin (input) 17 I/O Pin (output) new value old value 20, 21 DS20005750A-page 46 2017 Microchip Technology Inc. MCP19122/3 TABLE 5-2: Param No. I/O TIMING REQUIREMENTS Sym. Characteristic Min. Typ. Max. Units Conditions 17 TosH2ioV OSC1 (Q1 cycle) to Port out valid -- 50 70* ns 18 TosH2ioI 50 -- -- ns 19 TioV2osH Port input valid to OSC1 (I/O in setup time) 20 -- -- ns -- 32 40 ns 20 TioR OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port output rise time 21 TioF Port output fall time -- 15 30 ns 22* Tinp INT pin high or low time 25 -- -- ns 23* Trbp GPIO Interrupt-on-change new input level time TCY -- -- ns * These parameters are characterized but not tested. Data in "Typ" column is at VIN = 12V (VDD = 5V), +25C unless otherwise stated. FIGURE 5-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal Reset Watchdog Timer Reset 34 31 34 I/O Pins 2017 Microchip Technology Inc. DS20005750A-page 47 MCP19122/3 FIGURE 5-5: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR + BVHY BVHY VBOR 35 Reset (Due to BOR) (Device not in Brown-out Reset) TABLE 5-3: Param No. (Device in Brown-out Reset) 72 ms Time Out (if PWRTE) RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, AND POWER-UP TIMER REQUIREMENTS Sym. Characteristic Min. Typ. Max. Units Conditions 30 TMCL MCLR Pulse Width (low) 2 -- -- s VDD = 5V, -40C to +85C 31 TWDT Watchdog Timer Time-out Period (No Prescaler) 7 18 33 ms VDD = 5V, -40C to +85C 32 TOST Oscillation Start-up Timer Period -- 1024TOSC -- -- TOSC = OSC1 period 33* TPWRT Power-up Timer Period (4 x TWDT) 28 72 132 ms VDD = 5V, -40C to +85C 34 TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset -- -- 2.0 s * VPOR Power-on Reset Voltage -- 2.13 -- V * VPOR_HYS Power-on Reset Voltage Hysteresis -- 100 -- mV * VBOR Brown-out Reset voltage -- 2.7 -- V * BVHY Brown-out Hysteresis -- 100 -- mV TBCR Brown-out Reset pulse width 100* -- -- s 2TOSC -- 7TOSC 35 TCKEZ-TMR Delay from clock edge to timer 48 increment * VDD Rising VDD Falling VDD VBOR (D005) These parameters are characterized but not tested. Data in "Typ." column is at VIN = 12V (VDD = 5V), +25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS20005750A-page 48 2017 Microchip Technology Inc. MCP19122/3 FIGURE 5-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 41 40 42 48 TMR0 FIGURE 5-7: PNW TIMING PWM (CLKPIN) 53 Note: TABLE 5-4: Param No. Sym. 40* Tt0H 41* Tt0L 42* Refer to Figure 5-1 for load conditions. TABLE5-4: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Characteristic T0CKI High Pulse Width T0CKI Low Pulse Width Tt0P * 54 T0CKI Period Min. Typ. Max. Units No Prescaler 0.5TCY + 20 -- -- ns With Prescaler 10 -- -- ns No Prescaler 0.5TCY + 20 -- -- ns With Prescaler 10 -- -- ns Greater of: 20 or TCY + 40 N -- -- ns Conditions N = prescale value (2, 4, ..., 256) These parameters are characterized but not tested. Data in "Typ" column is at VIN = 12V (VDD = 5V), +25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2017 Microchip Technology Inc. DS20005750A-page 49 MCP19122/3 TABLE 5-5: MCP19122/3 A/D CONVERTER (ADC) CHARACTERISTICS: Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. Sym. Characteristic Min. Typ. Max. Units Conditions AD01* NR Resolution -- -- 10 bit AD02* EIL Integral Error -- -- 1 LSb VREF_ADC=AVDD VREF_ADC=VDD AD03* EDL Differential Error -- -- 1 LSb No missing codes to 10 bits VREF_ADC=AVDD VREF_ADC=VDD AD04 EOFF Offset Error -- +3.0 +7.0 LSb VREF_ADC=AVDD VREF_ADC=VDD AD07 EGN Gain Error -- 2 6 LSb VREF_ADC=AVDD VREF_ADC=VDD AD07* VAIN Full-Scale Range GND -- AVDD V AVDD Selected as ADC Reference GND -- VDD V VDD Selected as ADC Reference -- -- 10 k AD08* ZAIN Recommended Impedance of Analog Voltage Source * These parameters are characterized but not tested. Data in `Typ' column is at VIN = 12V (AVDD = 4.096V), +25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. To minimize Sleep current the ADC Reference must be set to the (default) AVDD. DS20005750A-page 50 2017 Microchip Technology Inc. MCP19122/3 TABLE 5-6: MCP19122/3 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. Min. Typ. A/D Clock Period 1.6 -- 9.0 s TOSC-based A/D Internal RC Oscillator Period 1.6 4.0 6.0 s ADCS<1:0> = 11 (ADRC mode) -- 11 -- TAD Set GO/DONE bit to new data in A/D Result register AD132* TACQ Acquisition Time -- 11.5 -- s AD133* TAMP Amplifier Settling Time -- -- 5 s AD134 -- TOSC/2 -- -- Sym. AD130* TAD AD131 Characteristic TCNV Conversion Time (not including Acquisition Time)(1) TGO Q4 to A/D Clock Start Max. Units Conditions * These parameters are characterized but not tested. Data in `Typ' column is at VIN = 12V (VDD = 5V), +25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle. FIGURE 5-8: A/D CONVERSION TIMING BSF ADCON0, GO 134 1/2 TCY 131 Q4 130 A/D CLK 9 A/D DATA 8 7 6 3 OLD_DATA ADRES 2 1 0 NEW_DATA ADIF GO SAMPLE DONE 132 SAMPLING STOPPED Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 2017 Microchip Technology Inc. DS20005750A-page 51 MCP19122/3 NOTES: DS20005750A-page 52 2017 Microchip Technology Inc. MCP19122/3 6.0 TYPICAL PERFORMANCE CURVES. The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. Note: FIGURE 6-1: IQ VS. TEMPERATURE (VIN = 12.0V) VIN = 12.0V 6.5 513 6.4 512 VOUTL = 0x00h VOUTH = [K VREF (mV) Quiescent Current (mA) VREF VS. TEMPERATURE (VREF = 0.512V) 514 6.6 511 6.3 6.2 510 6.1 509 508 6 -40 -25 -10 5 FIGURE 6-2: -40 -25 -10 20 35 50 65 80 95 110 125 Temperature (C) ISHDN VS. TEMPERATURE (VIN = 12.0V) 50 5 20 35 50 65 80 95 110 125 Temperature (C) VREF VS. TEMPERATURE (VREF = 1.024V) FIGURE 6-5: 1.030 VIN = 12.0V 48 VOUTL = 0x00h VOUTH = [K 1.028 1.026 45 VREF (V) SLEEP Current (uA) FIGURE 6-4: 1.024 43 1.022 40 1.020 38 1.018 1.016 35 -40 -25 -10 5 FIGURE 6-3: -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (C) VDD VS. VIN 20 35 50 65 80 95 110 125 Temperature (C) VREF VS. TEMPERATURE (VREF = 2.048V) FIGURE 6-6: 5.25 2.060 5.20 VOUTL =0xFFh VOUTH = [K 2.055 VREF (V) VDD (V) 2.050 5.15 2.045 -40C 5.10 25 2.040 2.035 125 5.05 2.030 6 8 10121416182022242628303234363840 Input Voltage, VIN (V) 2017 Microchip Technology Inc. -40 -25 -10 5 20 35 50 65 80 Temperature (C) 95 110 125 DS20005750A-page 55 MCP19122/3 FIGURE 6-7: HDRV RDS-ON VS. TEMPERATURE FIGURE 6-10: 1.6 32.6 1.5 1.4 RHDRV_source RHDRV_sink 1.3 1.2 1.1 Current Sense Gain (V/V) 32.6 HDRV RDS-on () 1.7 1.0 CURRENT SENSE GAIN VS. TEMPERATURE 32.5 32.5 32.4 32.4 32.3 32.3 32.2 -40 -25 -10 5 FIGURE 6-8: 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 20 35 50 65 80 95 110 125 Temperature (C) LDRV RDS-ON VS. TEMPERATURE -40 -25 -10 5 FIGURE 6-11: 20 35 50 65 80 95 110 125 Temperture (C) GPA2/3 SOURCE CURRENT VS. TEMPERATURE 60.0 GPA2 59.5 Source Current (uA) LDRV RDS-on () RLDRV_source RLDRV_sink 59.0 GPA3 58.5 58.0 57.5 57.0 56.5 -40 -25 -10 5 FIGURE 6-9: 20 35 50 65 80 95 110 125 Temperature (C) 56.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (C) OSCILLATOR FREQUENCY VS. TEMPERATURE Oscillator Frequency (MHz) 8.10 8.08 8.06 8.04 8.02 8.00 7.98 7.96 7.94 7.92 -40 -25 -10 5 DS20005750A-page 56 20 35 50 65 80 95 110 125 Temperature (C) 2017 Microchip Technology Inc. MCP19122/3 7.0 TEST MUX CONTROL To allow for easier system design and bench testing, the MCP19122/3 feature a multiplexer used to output various internal analog and digital signals. These signals can be measured on the GPA0 pin through a unity gain buffer. The configuration control of the GPA0 pin is found in the BUFFCON register. When the BUFFCON<BNCHEN> bit is set, the analog multiplexer output is connected to the GPA0 pin and the CHS<4:0> bits of the ADCON0 register determine which internal analog signal can be measured on the GPA0 pin. Refer to the ADCON0 register (Register 19-1) for analog signals that can be view on GPA0 while BNCHEN is set. REGISTER 7-1: When the BUFFCON<DIGOEN> bit is set, the digital multiplexer output is connected to the GPA0 pin. The DSEL<4:0> bits of the BUFFCON register determine which internal digital signal can be measured on the GPA0 pin. If a conflict exist where both the BNCHEN and DIGOEN bits are set, the DIGOEN bit takes priority. When measuring signals with the unity gain buffer, the buffer offset must be added to the measured signal. The factory measured buffer offset can be read from memory location 2087h. Refer to Section 10.1.1 "Reading Program Memory as Data" for more information. BUFFCON: TEST MUX CONTROL REGISTER R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BNCHEN DIGOEN -- DSEL4 DSEL3 DSEL2 DSEL1 DSEL0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 BNCHEN: GPA0 analog multiplexer configuration control bit 1 = GPA0 is configured to be analog multiplexer output 0 = GPA0 is configured for normal operation bit 6 DIGOEN: GPA0 digital multiplexer configuration control bit 1 = GPA0 is configured to be digital multiplexer output 0 = GPA0 is configured for normal operation bit 5 Unimplemented: Read as `0' bit 4-0 DSEL<4:0>: Multiplexer output control bit 00000 = 50% period signal 00001 = System clock 00010 = Inductor current SAMPLE signal 00011 = OV Comparator Output 00100 = UV Comparator Output 00101 = OVLO Comparator Output 00110 = UVLO Comparator Output 00111 = OC Comparator Output 01000 = high_on signal 01001 = Low-side on signal before the delay block * * * 10000 = Output of PWM Comparator 10001 = SWFRQ Signal 10010 = T2_EQ_PR2 Signal 10011 = PWM_OUT Signal 10100 = Clock Select / Switchover Waveform 10101 = DEM Comparator Output 10111 = DEM Blanking Time 10111 = Auto Zero Time Or'ed Signal 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 57 MCP19122/3 NOTES: DS20005750A-page 58 2017 Microchip Technology Inc. MCP19122/3 8.0 RELATIVE EFFICIENCY MEASUREMENT With a constant input voltage, output voltage and load current, any change in the high-side MOSFET on-time represents a change in the system efficiency. The MCP19122/3 is capable of measuring the on-time of the high-side MOSFET. Therefore, the relative efficiency of the system can be measured and optimized by changing the system parameters' driver dead time, such as switching frequency. 8.1 Relative Efficiency Measurement Procedure To measure the relative efficiency, the RELEFF register, PE1<MEASEN> bit, and the ADC RELEFF input are used. The following steps outlines the measurement process: 1. 2. 3. 4. 5. 6. 7. Clear the PE1<MEASEN> bit. Set the PE1<SPAN> bit. With the ADC, read the RELEFF channel and store this reading as the High. Clear the PE1<SPAN> bit. With the ADC, read the RELEFF channel and store this reading as the Low. Set the PE1<MEASEN> bit to initiate a measurement cycle. Monitor the RELEFF<MSDONE> bit. When set, it indicates the measurement is complete. 8. When the measurement is complete, use the ADC to read the RELEFF channel. This value becomes the Fractional variable in Equation 10 1. This reading should be accomplished within 50ms of the RELEFF<MSDONE> bit is set. 9. Read the value of the RE<6:0> bits in the RELEFF register and store the reading as Whole. 10. Clear the PE1<MEASEN> bit. 11. The relative efficiency is then calculated by the following equation: EQUATION 8-1: Fractional - Low Whole + ------------------------------------------------ High - Low Duty_Cycle = ------------------------------------------------------------------------------- PR2 + 1 Where: Whole = Value obtained in Step 9 of the measurement procedure Fractional = Value obtained in Step 8 of the measurement procedure High = Value obtained in Step 3 of the measurement procedure Low = Value obtained in Step 5 of the measurement procedure Note 1: The RELEFF<MSDONE> bit is set and cleared automatically. REGISTER 8-1: RELEFF: RELATIVE EFFICIENCY MEASUREMENT REGISTER R-0 R-x R-x R-x R-x R-x R-x R-x MSDONE RE6 RE5 RE4 RE3 RE2 RE1 RE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 MSDONE: Relative efficiency measurement done bit 1 = Relative efficiency measurement is complete 0 = Relative efficiency measurement is not complete bit 6-0 RE<6:0>: Whole clock counts for relative efficiency measurement result 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 59 MCP19122/3 NOTES: DS20005750A-page 60 2017 Microchip Technology Inc. MCP19122/3 9.0 DEVICE CALIBRATION Read-only memory locations 2080h through 208Fh contain factory calibration data. Refer to Section 20.0 "Flash Program Memory Control" for information on how to read from these memory locations. 9.1 Calibration Word 1 The TTA<3:0> bits at memory location 2080h calibrate the over temperature shutdown threshold point. Firmware must read these values and write them to the TTACAL register for proper calibration. The FCAL<6:0> bits at memory location 2080h set the internal oscillator calibration. Firmware must read these values and write them to the OSCCAL register for proper calibration. REGISTER 9-1: CALWD1: CALIBRATION WORD 1 REGISTER U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 -- -- TTA3 TTA2 TTA1 TTA0 bit 13 bit 8 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- FCAL6 FCAL5 FCAL4 FCAL3 FCAL2 FCAL1 FCAL0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13-12 Unimplemented: Read as `0' bit 11-8 TTA<3:0>: Overtemperature shutdown calibration bits. bit 7 Unimplemented: Read as `0' bit 6-0 FCAL<6:0>: Internal oscillator calibration bits 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 61 MCP19122/3 9.2 Calibration Word 2 The BGT<3:0> bits at memory location 2081h calibrate the internal band gap over temperature. Firmware must read these values and write them to the BGTCAL register for proper calibration. The BGR<5:0> bits at memory location 2081h calibrate the internal band gap. Firmware must read these values and write them to the BGRCAL register for proper calibration. REGISTER 9-2: CALWD2: CALIBRATION WORD 2 REGISTER U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 -- -- BGT3 BGT2 BGT1 BGT0 bit 13 bit 8 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- BGR5 BGR4 BGR3 BGR2 BGR1 BGR0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13-12 Unimplemented: Read as `0' bit 11-8 BGT<3:0>: Internal band gap temperature calibration bits. bit 7-6 Unimplemented: Read as `0' bit 5-0 BGR<5:0>: Internal band gap calibration bits. DS20005750A-page 62 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 9.3 Calibration Word 3 The AVDD<3:0> bits at memory location 2082h calibrate the internal 4.096V bias voltage. Firmware must read these values and write them to the AVDDCAL register for proper calibration. REGISTER 9-3: The VOUR<4:0> bits at memory location 2082h calibrate the output overvoltage and undervoltage reference. Firmware must read these values and write them to the VOURCAL register for proper calibration. CALWD3: CALIBRATION WORD 3 REGISTER U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 -- -- AVDD3 AVDD2 AVDD1 AVDD0 bit 13 bit 8 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- VOUR4 VOUR3 VOUR2 VOUR1 VOUR0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13-12 Unimplemented: Read as `0' bit 11-8 AVDD<3:0>: Internal 4V bias voltage calibration bits. bit 7-5 Unimplemented: Read as `0' bit 4-0 VOUR<4:0>: Output overvoltage and undervoltage reference calibration bits. 2017 Microchip Technology Inc. DS20005750A-page 63 MCP19122/3 9.4 Calibration Word 4 The DOV<5:0> bits at memory location 2083h set the offset calibration for the output voltage remote sense differential amplifier. Firmware must read these values and write them to the DOVCAL register for proper calibration. REGISTER 9-4: The VEAO<4:0> bits at memory location 2083h calibrate the offset of the error amplifier. Firmware must read these values and write them to the VEAOCAL register for proper calibration. CALWD4: CALIBRATION WORD 4 REGISTER U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- DOV4 DOV3 DOV2 DOV1 DOV0 bit 13 bit 8 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- VEAO4 VEAO3 VEAO2 VEAO1 VEAO0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13 Unimplemented: Read as `0' bit 12-8 DOV<4:0>: Output voltage remote sense differential amplifier offset calibration bits bit 7-5 Unimplemented: Read as `0' bit 4-0 VEAO<4:0>: Error amplifier offset voltage calibration bits DS20005750A-page 64 2017 Microchip Technology Inc. MCP19122/3 9.5 Calibration Word 5 The VREF<4:0> bits at memory location 2084h calibrate the reference to the DAC that sets the output voltage reference. Firmware must read these values and write them to the VREFCAL register for proper calibration. REGISTER 9-5: The VRFS<4:0> bits at memory location 2084h calibrate the full scale range of reference to the DAC that sets the output voltage reference. Firmware must read these values and write them to the VRFSCAL register for proper calibration. The VRFS<4:0> bits are to be loaded in to the VRFSCAL register when the DAGCON = 0x00h or 0x07h. CALWD5: CALIBRATION WORD 5 REGISTER U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- VREF4 VREF3 VREF2 VREF1 VREF0 bit 13 bit 8 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- VRFS4 VRFS3 VRFS2 VRFS1 VRFS0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13 Unimplemented: Read as `0' bit 12-8 VREF<4:0>: Output voltage reference DAC calibration bits bit 7-5 Unimplemented: Read as `0' bit 4-0 VRFS<4:0>: Output voltage reference DAC full scale range calibration bits 2017 Microchip Technology Inc. DS20005750A-page 65 MCP19122/3 9.6 Calibration Word 6 The RAMP<4:0> bits at memory location 2085h calibrate the span of the slope compensation ramp. Firmware must read these values and write them to the RAMPCAL register for proper calibration. REGISTER 9-6: The CSR<4:0> bits at memory location 2085h are used to calibrate the gain of the current sense amplifier. Firmware must read these values and write them to the CSRCAL register for proper calibration. CALWD6: CALIBRATION WORD 6 REGISTER U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- RAMP4 RAMP3 RAMP2 RAMP1 RAMP0 bit 13 bit 8 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- CSR4 CSR3 CSR2 CSR1 CSR0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13 Unimplemented: Read as `0' bit 12-8 RAMP<4:0>:Slope compensation ramp span calibration bits bit 7-5 Unimplemented: Read as `0' bit 4-0 CSR<4:0>: Current sense amplifier gain calibration bits DS20005750A-page 66 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 9.7 Calibration Word 7 Calibration Word 7 at memory location 2086h contains the offset calibration for the output overvoltage and undervoltage comparators. The OVCO<3:0> bits contain the output overvoltage comparator offset voltage calibration. The UVCO<3:0> bits contain the output undervoltage comparator offset voltage calibration. Firmware must read these values and write them to the OVUVCAL register for proper operation. REGISTER 9-7: CALWD7: CALIBRATION WORD 7 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 UVCO3 UVCO2 UVCO1 UVCO0 OVCO3 OVCO2 OVCO1 OVCO0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13-8 Unimplemented: Read as `0' bit 7-4 UVCO<3:0>: Output Undervoltage Comparator Offset calibration bits bit 3-0 OVCO<3:0>: Output Overvoltage Comparator Offset calibration bits 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 67 MCP19122/3 9.8 Calibration Word 8 The DEMOV<4:0> bits at memory location 2087h contain the diode emulation mode comparator offset voltage. Firmware must read these values and write them to the DEMCAL register for proper operation. REGISTER 9-8: CALWD8: CALIBRATION WORD 8 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- bit 13 bit 8 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- DEMOV4 DEMOV3 DEMOV2 DEMOV1 DEMOV0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13-5 Unimplemented: Read as `0' bit 4-0 DEMOV<4:0>: Diode Emulation Mode Comparator Offset Voltage calibration bits DS20005750A-page 68 2017 Microchip Technology Inc. MCP19122/3 9.9 Calibration Word 9 The HCSOV<4:0> bits at memory location 2088h contain the calibration values for the offset voltage on the high-side current sense amplifier. Firmware must read these values and write them to the HCSOVCAL register for proper operation. REGISTER 9-9: CALWD9: CALIBRATION WORD 9 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- bit 13 bit 8 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- HCSOV6 HCSOV5 HCSOV4 HCSOV3 HCSOV2 HCSOV1 HCSOV0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13-7 Unimplemented: Read as `0' bit 6-0 HCSOV<6:0>: High-side Current Amplifier Offset Voltage calibration bits 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 69 MCP19122/3 9.10 Calibration Word 10 The TANA<7:0> bits at memory location 2089h contain the ADC reading from the internal temperature sensor when the silicon temperature is at +25C. REGISTER 9-10: This 10-bit reading can be used to calculate the silicon die temperature. See Section 25.0 "Internal Temperature Indicator Module" for more details. CALWD10: CALIBRATION WORD 10 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- TANA9 TANA8 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 TANA7 TANA6 TANA5 TANA4 TANA3 TANA2 TANA1 TANA0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13-8 Unimplemented: Read as `0' bit 7-0 TANA<9:0>: ADC internal temperature sensor at +25C calibration bits DS20005750A-page 70 2017 Microchip Technology Inc. MCP19122/3 9.11 Calibration Word 11 The BUFF<7:0> bits at memory location 208Ah represent the offset voltage of the unity gain buffer in units of millivolts. This is an 8-bit two's complement number. The MSB is the sign bit. If the MSB is set to 1, the resulting number is negative. REGISTER 9-11: CALWD11: CALIBRATION WORD 11 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 BUFF7 BUFF6 BUFF5 BUFF4 BUFF3 BUFF2 BUFF1 BUFF0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13-8 Unimplemented: Read as `0' bit 7-0 BUFF<7:0>: Unity gain buffer offset voltage calibration bits 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 71 MCP19122/3 9.12 Calibration Word 12 The ADCCAL<13:0> bits at memory location 208Bh contain the calibration bits for the A/D converter. Calibration Word 12 contains the factory measurement of the full scale ADC reference. The value represents the number of A/D converter counts per volt. REGISTER 9-12: ADCC<4:0> represent the fraction of an A/D converter count, which can provide additional precision when oversampling the ADC for enhanced resolution. This calibration word can be used to calibrate signals read by the A/D converter. CALWD12: CALIBRATION WORD 12 REGISTER R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 ADCC13 ADCC12 ADCC11 ADCC10 ADCC9 ADCC8 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 ADCC7 ADCC6 ADCC5 ADCC4 ADCC3 ADCC2 ADCC1 ADCC0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13-5 ADCC<13:5>: Whole number of A/D converter counts 111111111 = 511 * * * 000000000 = 0 bit 4-0 ADCC<4:0>: Fraction number of A/D converter counts 1111 = 0.96875 * * * 0001 = 0.03125 0000 = 0 DS20005750A-page 72 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 9.13 Calibration Word 13 Calibration Word 13 at memory location 208Ch contain the offset of the A/D converter. This calibration word can be used to calibrate signals read by the A/D converter. REGISTER 9-13: CALWD13: CALIBRATION WORD 13 REGISTER R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 ADCO13 ADCO12 ADCO11 ADCO10 ADCO9 ADCO8 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 ADCO7 ADCO6 ADCO5 ADCO4 ADCO3 ADCO2 ADCO1 ADCO0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 13-0 9.14 x = Bit is unknown ADCO<13:0>: A/D converter offset 9.14.1 Calibration Words 14-16 Memory locations 208Dh to 208Fh contain reference voltage span adjustment (VRFSCAL) calibration values to be used with different settings of the differential amplifier gain. The appropriate VRFSCAL value must be used to achieve the system output voltage tolerance specification listed in the Section "Electrical characteristics". REGISTER 9-14: CALIBRATION WORD 14 The VRS18<4:0> bits in CALWD 14 at memory location 208Dh are to be loaded into the VRFSCAL register when the DAGCON = 0x03h. The VRS14<4:0> bits of CALWD14 are to be loaded into the VRFSCAL register when the DAGCON = 0x02h. CALWD14: CALIBRATION WORD 14 REGISTER R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- VRS144 VRS143 VRS142 VRS141 VRS140 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- VRS184 VRS183 VRS182 VRS181 VRS180 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13 Unimplemented: Read as `0' bit 12-8 VRS14<4:0>: VRFSCAL calibration with Differential Amplifier gain of 1/4 (DAGCON = 0x02h) bit 7-5 Unimplemented: Read as `0' bit 4-0 VRS18<4:0>: VRFSCAL calibration with Differential Amplifier gain of 1/8 (DAGCON = 0x03h) 2017 Microchip Technology Inc. DS20005750A-page 73 MCP19122/3 9.14.2 CALIBRATION WORD 15 The VSR12<4:0> bits in CALWD 15 at memory location 208Eh are to be loaded into the VRFSCAL register when the DAGCON = 0x01h. The VRS2<4:0> bits of CALWD15 are to be loaded into the VRSFCAL register when the DAGCON = 0x04h. REGISTER 9-15: CALWD15: CALIBRATION WORD 15 REGISTER R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- VRS24 VRS23 VRS22 VRS21 VRS20 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- VRS124 VRS123 VRS122 VRS121 VRS120 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13 Unimplemented: Read as `0' bit 12-8 VRS2<4:0>: VRFSCAL calibration with Differential Amplifier gain of 2 (DAGCON = 0x04h) bit 7-5 Unimplemented: Read as `0' bit 4-0 VRS12<4:0>: VRFSCAL calibration with Differential Amplifier gain of 1/2 (DAGCON = 0x01h) DS20005750A-page 74 2017 Microchip Technology Inc. MCP19122/3 9.14.3 CALIBRATION WORD 16 The VSR4<4:0> bits in CALWD 16 at memory location 208Fh are to be loaded into the VRFSCAL register when the DAGCON = 0x05h. The VRS8<4:0> bits of CALWD16 are to be loaded into the VRSFCAL register when the DAGCON = 0x06h. REGISTER 9-16: CALWD16: CALIBRATION WORD 16 REGISTER R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- VRS84 VRS83 VRS82 VRS81 VRS80 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 -- -- -- VRS44 VRS43 VRS42 VRS84 VRS40 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13 Unimplemented: Read as `0' bit 12-8 VRS8<4:0>: VRFSCAL calibration with Differential Amplifier gain of 8 (DAGCON = 0x06h) bit 7-5 Unimplemented: Read as `0' bit 4-0 VRS4<4:0>: VRFSCAL calibration with Differential Amplifier gain of 4 (DAGCON = 0x05h) 2017 Microchip Technology Inc. DS20005750A-page 75 MCP19122/3 DS20005750A-page 76 2017 Microchip Technology Inc. MCP19122/3 10.0 MEMORY ORGANIZATION FIGURE 10-1: PROGRAM MEMORY MAP AND STACK FOR MCP19122/3 There are two types of memory in the MCP19122/3: * Program Memory * Data Memory - Special Function Registers (SFRs) - General-Purpose RAM 10.1 Program Memory Organization The MCP19122/3 has a 13-bit program counter capable of addressing an 8K x 14 program memory space. Only the first 4K x 14 (0000h-0FFFh) is physically implemented. Addressing a location above this boundary will cause a wrap-around within the first 4K x 14 space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 10-1). The width of the program memory bus (instruction word) is 14-bits. Since all instructions are a single word, the MCP19122/3 has space for 4K of instructions. PC<12:0> CALL, RETURN RETFIE, RETLW 13 Stack Level 1 Stack Level 8 Reset Vector 0000h Interrupt Vector 0004h 0005h On-Chip Program Memory 0FFFh 1000h Shadows 000-FFFh 1FFFh User IDs(1) 2000h 2003h ICD Instruction(1) 2004h Revision ID (hardcoded)(1) 2005h Device ID (hardcoded)(1) 2006h Config Word(1) 2007h Reserved 2008h 200Ah 200Bh Reserved for Manufacturing & Test(1) Calibration Words(1) Unimplemented 207Fh 2080h 208Fh 2090h 20FFh 2100h Shadows 2000-20FFh 3FFFh Note 1: Not code protected. 2017 Microchip Technology Inc. DS20005750A-page 75 MCP19122/3 10.1.1 READING PROGRAM MEMORY AS DATA There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set a Files Select Register (FSR) to point to the program memory. 10.1.1.1 RETLW Instruction The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 10-1. EXAMPLE 10-1: RETLW INSTRUCTION constants ADDWF_PCL RETLW DATA0 RETLW DATA1 RETLW DATA2 RETLW DATA3 ;Index0 data ;Index1 data my_function ;... LOTS OF CODE... MOVLW DATA_INDEX call constants ;... THE CONSTANT IS IN W Indirect REgister Pointer (IRP) bit inthe STATUS register for access to the Bank0/Bank1 or the Bank2/Bank3 areas of data memory. 10.2.1 The register file is organized as 64 x 8 in the MCP19122/3. Each register is accessed, either directly or indirectly, through the FSR (refer to Section 10.5 "Indirect Addressing, INDF and FSR Registers"). 10.2.2 Data Memory Organization The data memory (see Table 10-1) is partitioned into four banks, which contain the General Purpose Registers (GPR) and the Special Function Registers (SFR). The Special Function Registers are located in the first 32 locations of each bank. Register locations 20h-7Fh in Bank 0, A0h-EFh in Bank 1 and 120h-16Fh in Bank 2 are General Purpose Registers, implemented as static RAM. All other RAM is unimplemented and returns `0' when read. The RP<1:0> bits of the STATUS register are the bank select bits. RP1 RP0 0 0 -> Bank 0 is selected 0 1 -> Bank 1 is selected 1 0 -> Bank 2 is selected 1 1 -> Bank 3 is selected To move values from one register to another register, the value must pass throught the W register. This means that for all register-to-register moves, two instruction cycles are required. The entire data memory can be accessed either directly or indirectly. Direct addressing may require the use of the RP<1:0> bits. Indirect addressing uses the DS20005750A-page 76 CORE REGISTERS The core registers contain the registers that directly affect the basic operation. The core registers can be addressed from any bank. These registers are listed in Table 10-1. For detailed information refer to Table 10-2. TABLE 10-1: CORE REGISTERS Addresses BANKx x00h, x80h, x100h, or x180h INDF x02h, x82h, x102h, or x182h PCL x03h, x83h, x103h, or x183h STATUS x04h, x84h, x104h, or x184h FSR x0Ah, x8Ah, x10Ah, or x18Ah PCLATH x0Bh, x8Bh, x10Bh, or x18Bh INTCON 10.2.3 10.2 GENERAL PURPOSE REGISTER FILE STATUS REGISTER The STATUS register, contains: shown in Register 10-1, * the arithmetic status of the ALU * the Reset status * the bank select bits for data memory (RAM) The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as `000u u1uu' (where u = unchanged). Therefore, it is recommended that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits, see the Section 28.0 "Instruction Set Summary". Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. 2017 Microchip Technology Inc. MCP19122/3 REGISTER 10-1: R/W-0 STATUS: STATUS REGISTER R/W-0 IRP RP1 R/W-0 RP0 R-1 TO R-1 PD R/W-x Z R/W-x R/W-x (1) DC bit 7 C(1) bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 IRP: Register Bank Select bit (used for Indirect addressing) 1 = Bank 2 & 3 (100h - 1FFh) 0 = Bank 0 & 1 (00h - FFh) bit 6-5 RP<1:0>: Register Bank Select bits (used for Direct addressing) 00 = Bank 0 (00h - 7Fh) 01 = Bank 1 (80h - FFh) 10 = Bank 2 (100h - 17Fh) 11 = Bank 3 (180h - 1FFh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: 10.2.4 For Borrow, the polarity is reversed. A subtraction is executed by adding the two's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Table 10-2). These registers are static RAM. The special registers can be classified into two sets: * core * peripheral The Special Function Registers associated with the microcontroller core are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature. 2017 Microchip Technology Inc. DS20005750A-page 77 MCP19122/3 10.3 DATA MEMORY TABLE 10-2: MCP19122/3 DATA MEMORY MAP File Address File Address File Address File Address Indirect addr.(1) 00h Indirect addr. (1) 80h Indirect addr.(1) 100h Indirect addr. (1) TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h PCL 02h PCL 82h PCL 102h PCL 182h STATUS 03h STATUS 83h STATUS 103h STATUS 183h 184h 180h FSR 04h FSR 84h FSR 104h FSR PORTGPA 05h TRISGPA 85h WPUGPA 105h IOCA 185h PORTGPB 06h TRISGPB 86h WPUGPB 106h IOCB 186h PIR1 07h PIE1 87h PE1 107h ANSELA 187h PIE2 88h MODECON 108h ANSELB 188h PIR2 08h PCON 09h PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh 89h 109h 189h (2) TMR1L 0Ch 8Ch 10Ch PORTICD TMR1H 0Dh 8Dh 10Dh TRISICD(2) 18Ch 18Dh T1CON 0Eh 8Eh 10Eh ICKBUG(2) 18Eh TMR2 0Fh 8Fh 10Fh BIGBUG(2) 18Fh 190h T2CON 10h VINUVLO 90h SSPADD 110h PMCON1 PR2 11h VINOVLO 91h SSPBUF 111h PMCON2 191h T1GCON 12h VINCON 92h SSPCON1 112h PMADRL 192h PWMPHL 13h DAGCON 93h SSPCON2 113h PMADRH 193h 194h PWMPHH 14h VOUTL 94h SSPCON3 114h PMDATL PWMRL 15h VOUTH 95h SSPMSK 115h PMDATH 195h PWMRH 16h OSCTUNE 96h SSPSTAT 116h TTACAL 196h CC1RL(3) 17h 97h SSPADD2 117h OSCCAL 197h (3) 18h CMPZCON 98h SSPMSK2 118h BGTCAL 198h CC2RL(3) 19h VOTUVLO 99h VREFCAL 119h BGRCAL 199h CC2RH(3) 1Ah VOTOVLO 9Ah VRFSCAL 11Ah AVDDCAL 19Ah CCDCON(3) 1Bh DEADCON 9Bh RAMPCAL 11Bh VOURCAL 19Bh 19Ch CC1RH ADRESL 1Ch RAMPCON 9Ch CSRCAL 11Ch DOVCAL ADRESH 1Dh OCCON 9Dh OVUVCAL 11Dh VEAOCAL 19Dh ADCON0 1Eh CSGSCON 9Eh DEMCAL 11Eh BUFFCON 19Eh ADCON1 1Fh RELEFF 9Fh HCSOVCAL 11Fh Reserved 19Fh General Purpose Register 20h General Purpose Register 80 Bytes A0h General Purpose Register 120h 96 Bytes 80 bytes EFh Accesses Bank 0 7Fh Bank 0 Note 1: 2: 3: 1A0h F0h 16F Accesses Bank 0 FFh Bank 1 170h 1EF Accesses Bank 0 17Fh Bank2 1F0h 1FFh Bank3 Unimplemented data memory locations, read as '0'. Not a physical register. Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1. Only in MCP19123 and DSTEMP. DS20005750A-page 78 2017 Microchip Technology Inc. 2017 Microchip Technology Inc. TABLE 10-3: Addr. Name MCP19122/3 SPECIAL REGISTERS SUMMARY BANK 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset BOR Reset Value on all other resets(1) Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx 01h TMR0 Timer0 Module's Register xxxx xxxx uuuu uuuu 02h PCL Program Counter's (PC) Least Significant byte 0000 0000 0000 0000 03h STATUS 0001 1xxx 000q quuu 04h FSR 05h RP1 RP0 TO PORTGPA GPA7 GPA6 GPA5 GPA4 06h PORTGPB GPB7 GPB6 GPB5 07h PIR1 TMR1GIF ADIF 08h PIR2 UVIF 09h PCON 0Ah PCLATH 0Bh INTCON 0Ch TMR1L 0Dh TMR1H 0Eh T1CON 0Fh TMR2 10h T2CON 11h PR2 12h T1GCON 0000 0x00 uuuu uuuu 13h PWMPHL SLAVE Phase Shift Register xxxx xxxx uuuu uuuu 14h PWMPHH SLAVE Phase Shift Register xxxx xxxx uuuu uuuu 15h PWMRL PWM Register Low Byte xxxx xxxx uuuu uuuu 16h PWMRH PWM Register High Byte xxxx xxxx uuuu uuuu 17h CC1RL Capture1/Compare1 Register 1 x Low Byte (LSB) xxxx xxxx uuuu uuuu 18h CC1RH Capture1/Compare1 Register 1 x High Byte (MSB) xxxx xxxx uuuu uuuu 19h CC2RL Capture2/Compare2 Register 2 x Low Byte (LSB) xxxx xxxx uuuu uuuu 1Ah CC2RH Capture2/Compare2 Register 2 x High Byte (MSB) xxxx xxxx uuuu uuuu 1Bh CCDCON 0000 0000 0000 0000 1Ch ADRESL xxxx xxxx uuuu uuuu ---- --xx uuuu uuuu PD Z DC C xxxx xxxx uuuu uuuu GPA3 GPA2 GPA1 GPA0 xxxx xxxx uuuu uuuu GPB4 GPB3 GPB2 GPB1 GPB0 xxxx xxxx uuuu uuuu BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF 0000 0000 0000 0000 OTIF OCIF OVIF -- -- OVLOIF UVLOIF 0000 --00 0000 --00 -- -- -- -- BOR ---- --qq ---- --uu -- -- -- ---0 0000 ---0 0000 GIE PEIE T0IE IOCF(2) 0000 000x 0000 000u Holding register for the Least Significant byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu Holding register for the Most Significant byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu Indirect data memory address pointer -- -- -- -- POR Write buffer for upper 5 bits of program counter INTE T1CKPS1 T1CKPS0 IOCE T0IF -- -- INTF TMR1CS TMR1ON Timer2 Module Register -- -- -- -- -- TMR2ON T2CKPS1 T2CKPS0 Timer2 Module Period Register TMR1GE CC2M3 T1GPOL CC2M2 T1GTM CC2M1 T1GSPM CC2M0 T1GGO/DONE T1GVAL CC1M3 CC1M2 T1GSS1 CC1M1 T1GSS0 CC1M0 Least significant 8 bits of the right-shifted result (3) 3 --uu --uu xxxx xxxx uuuu uuuu ---- -000 ---- -000 1111 1111 1111 1111 1Dh ADRESH 1Eh ADCON0 CHS5 CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 0000 0000 0000 0000 1Fh ADCON1 -- ADCS2 ADCS1 ADCS0 -- ADFM VCFG1 VCFG0 -000 -000 -000 -000 Legend: Note 1: 2: 3: Most significant 2 bits of right-shifted result ( ) --00 --00 -- = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. Results of ADC reading maybe left- or right-shifted. Results shown here are for right-shifted results. MCP19122/3 DS20005750A-page 79 IRP Addr. MCP19122/3 SPECIAL REGISTERS SUMMARY BANK 1 Name Value on POR Reset Values on all other resets(1) Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu RAPU INTEDG T0CS 1111 1111 1111 1111 0000 0000 0000 0000 IRP RP1 RP0 0001 1xxx 000q quuu xxxx xxxx uuuu uuuu Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bank 1 80h INDF 81h OPTION_REG T0SE PSA PS2 PS1 PS0 Z DC C 82h PCL 83h STATUS Program Counter's (PC) Least Significant byte 84h FSR 85h TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111 86h TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111 87h PIE1 TMR1GIE ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 0000 0000 0000 0000 88h PIE2 UVIE OTIE OCIE OVIE -- -- OVLOIE UVLOIE 0000 --00 000 --00 ---0 0000 ---0 0000 IOCF(3) 0000 000x 0000 000u TO PD Indirect data memory address pointer 89h 8Ah PCLATH -- -- -- 8Bh INTCON GIE PEIE T0IE Write buffer for upper 5 bits of program counter INTE IOCE T0IF INTF 8Ch -- Unimplemented -- -- 8Dh -- Unimplemented -- -- 8Eh -- Unimplemented -- -- 8Fh -- Unimplemented -- -- 2017 Microchip Technology Inc. 90h VINUVLO -- -- -- -- UVLO3 UVLO2 UVLO1 UVLO0 ---- xxxx ---- uuuu 91h VINOVLO -- -- -- -- OVLO3 OVLO2 OVLO1 OVLO0 ---- xxxx ---- uuuu 92h VINCON UVLOEN UVLOOUT UVLOINTP UVLOINTN OVLOEN OVLOOUT OVLOINTP OVLOINTN 0000 0000 0000 0000 93h DAGCON -- -- -- -- -- DAG2 DAG1 DAG0 ---- -000 ---- -000 94h VOUTL VOUT7 VOUT6 VOUT5 VOUT4 VOUT3 VOUT2 VOUT1 VOUT0 0000 0000 0000 0000 95h VOUTH -- -- -- -- -- -- VOUT9 VOUT8 ---- --00 ---- --00 96h OSCTUNE -- -- -- TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---0 0000 -- -- 97h -- 98h CMPZCON CMPZF3 CMPZF2 CMPZF1 CMPZF0 CMPZG3 CMPZG2 CMPZG1 CMPZG0 xxxx xxxx uuuu uuuu 99h VOTUVLO -- -- -- -- OUV3 OUV2 OUV1 OUV0 ---- xxxx ---- uuuu 9Ah VOTOVLO -- -- -- -- OOV3 OOV2 OOV1 OOV0 ---- xxxx ---- uuuu 9Bh DEADCON HDLY3 HDLY2 HDLY1 HDLY0 LDLY3 LDLY2 LDLY1 LDLY0 1111 1111 1111 1111 9Ch RAMPCON RMPEN -- -- RMP4 RMP3 RMP2 RMP1 RMP0 x--x xxxx u--u uuuu 9Dh OCCON OCEN OCLEB1 OCLEB0 OOC4 OOC3 OOC2 OOC1 OOC0 0xxx xxxx 0uuu uuuu 9Eh CSGSCON -- -- -- CSGS4 CSGS3 CSGS2 CSGS1 CSGS0 ---x xxxx ---u uuuu 9Fh RELEFF MSDONE RE6 RE5 RE4 RE3 RE2 RE1 RE0 0xxx xxxx 0uuu uuuu Legend: Note 1: 2: 3: Unimplemented -- = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. GPA5 pull-up is enabled when pin is configured as MCLR in Configuration Word. MCLR and WDT Reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. MCP19122/3 DS20005750A-page 80 TABLE 10-4: 2017 Microchip Technology Inc. TABLE 10-5: Addr. MCP19122/3 SPECIAL REGISTERS SUMMARY BANK 2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other resets(1) Bank 2 100h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx 101h TMR0 Timer0 Module's Register xxxx xxxx uuuu uuuu 102h PCL Program Counter's (PC) Least Significant byte 0000 0000 0000 0000 103h STATUS 0001 1xxx 000q quuu 104h FSR 105h WPUGPA -- -- WPUA5 -- WCS1 WCS0 WPUA1 106h WPUGPB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 107h PE1 DECON TOPO HIDIS LODIS MEASEN SPAN UVTEE 108h MODECON CLMPSEL VGNDEN VDDEN CNSG EACLMP MSC2 MSC1 MSC0 IRP RP1 RP0 TO PD Z DC C Indirect data memory address pointer 109h -- 10Ah PCLATH -- -- -- 10Bh INTCON GIE PEIE T0IE 10Ch -- Unimplemented 10Dh -- 10Eh xxxx xxxx uuuu uuuu WPUA0 --1- 0011 --u- 00uu -- 1111 111- uuuu uuu- OVTEE 0011 0000 0011 0000 0000 0000 0000 0000 Unimplemented -- ---0 0000 0000 000x 0000 000u -- -- Unimplemented -- -- -- Unimplemented -- -- 10Fh -- Unimplemented -- -- 110h SSPADD ADD<7:0> 0000 0000 0000 0000 111h SSPBUF xxxx xxxx uuuu uuuu 112h SSPCON1 WCOL SSPOV SSPEN CKP 0000 0000 0000 0000 113h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 114h SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 115h SSPMSK 116h SSPSTAT 117h SSPADD2 118h SSPMSK2 119h VREFCAL -- -- -- 11Ah VRFSCAL -- -- -- VRFS4 VRFS3 VRFS2 11Bh RAMPCAL -- -- -- RAMP4 RAMP3 RAMP2 11Ch CSRCAL -- -- -- CSR4 CSR3 CSR2 CSR1 INTE IOCE T0IF IOCF(2) INTF Synchronous Serial Port Receive Buffer/Transmit Register SSPM>3:0> MSK<7:0> SMP CKE D/A 1111 1111 1111 1111 0000 0000 0000 0000 ADD2<7:0> 0000 0000 0000 0000 MSK2<7:0> 1111 1111 1111 1111 VREF0 ---0 0000 ---0 0000 VRFS1 VRFS0 ---0 0000 ---0 0000 RAMP1 RAMP0 ---x xxxx ---u uuuu CSR0 ---x xxxx ---u uuuu P S VREF4 VREF3 R/W VREF2 UA BF VREF1 11Dh OVUVCAL UVCO3 UVCO2 UVCO1 UVCO0 OVCO3 OVCO2 OVCO1 OVCO0 xxxx xxxx uuuu uuuu 11Eh DEMCAL -- -- -- DEMOV4 DEMOV3 DEMOV2 DEMOV1 DEMOV0 ---x xxxx ---u uuuu 11Fh HCSOVCAL -- HCSOV6 HCSOV5 HCSOV4 HCSOV3 HCSOV2 HCSOV1 HCSOV0 -xxx xxxx -uuu uuuu Legend: Note 1: 2: -- = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. MCP19122/3 DS20005750A-page 81 -- ---0 0000 Write buffer for upper 5 bits of program counter Addr. PIC18FXXXX SPECIAL REGISTERS SUMMARY BANK 3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Values on all other resets(1) xxxx xxxx uuuu uuuu 1111 1111 Bank 3 180h INDF 181h OPTION_REG Addressing this location uses contents of FSR to address data memory (not a physical register) RAPU INTEDG T0CS IRP RP1 RP0 T0SE PSA PS1 PS0 1111 1111 0000 0000 0000 0000 Z DC C 0001 1xxx 000q quuu PS2 182h PCL 183h STATUS 184h FSR xxxx xxxx uuuu uuuu 185h IOCA IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 0000 0000 0000 0000 186h IOCB IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0 0000 0000 0000 0000 187h ANSELA -- -- -- -- ANSA3 ANSA2 ANSA1 ANSA0 ---- 1111 ---- 1111 188h ANSELB -- -- ANSB5 ANSB4 -- ANSB2 ANSB1 -- --11 -11- --11 -11- 189h Program Counter's (PC) Least Significant byte TO Indirect data memory address pointer -- 18Ah PCLATH 18Bh INTCON PD Unimplemented -- -- -- GIE PEIE T0IE Write buffer for upper 5 bits of program counter INTE IOCE T0IF INTF IOCF(3) -- -- ---0 0000 ---0 0000 0000 000x 0000 000u In-Circuit Debug Port Register -- -- TRISICD(4) In-Circuit Debug TRIS Register -- -- 18Eh ICKBUG(4) In-Circuit Debug Register 0--- ---- 0--- ---- 18Fh BIGBUG(4) 190h PMCON1 18Ch PORTICD 18Dh (4) In-Circuit Debug Breakpoint Register -- CALSEL -- -- -- WREN WR RD ---- ---- -0-- -000 -0-- -000 ---- ---- ---- ---- 2017 Microchip Technology Inc. 191h PMCON2 192h PMADRL PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 0000 0000 193h PMADRH -- -- -- -- PMADRH3 PMADRH2 PMADRH1 PMADRH0 ---- 0000 ---- 0000 194h PMDATL PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 0000 0000 195h PMDATH -- -- PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0 --00 0000 --00 0000 196h TTACAL -- -- -- -- TTA3 TTA2 TTA1 TTA0 ---- xxxx ---- uuuu 197h OSCCAL -- FACL6 FCAL5 FCAL4 FCAL3 FCAL2 FCAL1 FCAL0 -xxx xxxx -uuu uuuu 198h BGTCAL -- -- -- -- BGT3 BGT2 BGT1 BGT0 ---- xxxx ---- uuuu 199h BGRCAL -- -- BGR5 BGR4 BGR3 BGR2 BGR1 BGR0 --00 0000 --00 0000 19Ah AVDDCAL -- -- -- -- AVDD3 AVDD2 AVDD1 AVDD0 ---- xxxx ---- uuuu 19Bh VOURCAL -- -- -- VOUR4 VOUR3 VOUR2 VOUR1 VOUR0 ---x xxxx ---u uuuu 19Ch DOVCAL -- -- -- DOV4 DOV3 DOV2 DOV1 DOV0 ---x xxxx ---u uuuu 19Dh VEAOCAL -- -- -- VEAO4 VEAO3 VEAO2 VEAO1 VEAO0 ---x xxxx ---u uuuu 19Eh BUFFCON BNCHEN DIGOEN -- DSEL4 DSEL3 DSEL2 DSEL1 DSEL0 00-0 0000 00-0 0000 19Fh -- -- -- Legend: Note 1: 2: 3: 4: Program Memory Control Register 2 (not a physical register) ---- ---- Reserved -- = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. GPA5 pull-up is enabled when pin is configured as MCLR in Configuration Word. MCLR and WDT Reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists. Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1. MCP19122/3 DS20005750A-page 82 TABLE 10-6: MCP19122/3 10.3.0.1 OPTION Register Note 1: To achieve a 1:1 prescaler assignment for Timer0, assign the prescaler to the WDT by setting PSA bit to `1' of the OPTION register. See Section 21.1.3 "Software Programmable Prescaler" The OPTION register is a readable and writable register, which contains various control bits to configure: * * * * Timer0/WDT prescaler External GPA2/INT interrupt Timer0 Weak pull-ups on PORTGPA and PORTGPB REGISTER 10-2: OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RAPU(1) INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 RAPU: Port GPx Pull-up Enable bit 1 = Port GPx pull-ups are disabled 0 = Port GPx pull-ups are enabled bit 6 INTEDG: Interrupt Edge Select bit 0 = Interrupt on rising edge of INT pin 1 = Interrupt on falling edge of INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Note 1: Bit Value TMR0 Rate WDT Rate 000 001 010 011 100 101 110 111 1: 2 1: 4 1: 8 1: 16 1: 32 1: 64 1: 128 1: 256 1: 1 1: 2 1: 4 1: 8 1: 16 1: 32 1: 64 1: 128 x = Bit is unknown Individual WPUx bit must also be enabled. 2017 Microchip Technology Inc. DS20005750A-page 83 MCP19122/3 10.4 10.4.3 PCL and PCLATH COMPUTED FUNCTION CALLS The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 10-2 shows the two situations for loading the PC. The upper example in Figure 10-2 shows how the PC is loaded on a write to PCL (PCLATH<4:0> PCH). The lower example in Figure 10-2 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> PCH). A computed function CALL allows programs to maintain tables of functions and provide another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). FIGURE 10-2: The MCP19122/3 has an 8-level x 13-bit wide hardware stack (refer to Figure 10-1). The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. LOADING OF PC IN DIFFERENT SITUATIONS PCH 12 PCL 8 7 0 PC 5 8 PCLATH<4:0> Instruction with Destination ALU Result PCLATH PCH 12 11 10 8 7 PCL 0 PC GOTO, CALL 2 PCLATH<4:3> 11 Opcode <10:0> PCLATH 10.4.1 10.4.4 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). Care should be exercised when jumping into a look-up table or program branch table (computed GOTO) by modifying the PCL register. Assuming that PCLATH is set to the table start address, if the table length is greater than 255 instructions or if the lower 8 bits of the memory address rolls over from 0xFFh to 0X00h in the middle of the table, then PCLATH must be incremented for each address rollover that occurs between the table beginning and the table location within the table. STACK The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 1: There are no Status bits to indicate Stack Overflow or Stack Underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<12:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire content of the program counter to be changed by writing the desired upper 5 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 13 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 10.4.2 If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<4:3> is loaded with PCLATH<4:3>. 10.5 Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register directly results in a no operation (although Status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR and the IRP bit of the STATUS register, as shown in Figure 10-3. A simple program to clear RAM location 40h-7Fh using indirect addressing is shown in Example 10-2. For more information, refer to Application Note AN556 - "Implementing a Table Read" (DS00556). DS20005750A-page 84 2017 Microchip Technology Inc. MCP19122/3 EXAMPLE 10-2: MOVLW MOVWF NEXT CLRF INCF BTFSS GOTO CONTINUE FIGURE 10-3: INDIRECT ADDRESSING 0x40 FSR INDF FSR FSR,7 NEXT ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next ;yes continue DIRECT/INDIRECT ADDRESSING Direct Addressing RP1 RP0 6 Bank Select From Opcode Indirect Addressing 0 IRP Bank Select Location Select 00h 7 File Select Register 00 01 10 0 Location Select 11 180h Data Memory 7Fh 1FFh Bank 0 Bank 1 Bank 2 Bank 3 For memory map detail, see Figure 10-2. 2017 Microchip Technology Inc. DS20005750A-page 85 MCP19122/3 NOTES: DS20005750A-page 86 2017 Microchip Technology Inc. MCP19122/3 11.0 SPECIAL FEATURES OF THE CPU The MCP19122/3 has a host of features intended to maximize system reliability, minimize cost through elimination of external components, provide powersaving features and offer code protection. These features are: * Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Brown-out Reset (BOR) * Interrupts * Watchdog Timer (WDT) * Oscillator selection * Sleep * Code protection * ID Locations * In-Circuit Serial Programming 11.1 Configuration Bits The Configuration bits can be programmed (read as `0'), or left unprogrammed (read as `1') to select various device configurations as shown in Register 11-1. These bits are mapped in program memory location 2007h. Note: Address 2007h is beyond the user program memory space. It belongs to the special configuration memory space (2000h3FFFh), which can be accessed only during programming. See "Memory Programming Specification" (DS41561) for more information. The Power-up Timer (PWRT), which provides a fixed delay of 72 ms (nominal) on power-up only, is designed to keep the part in Reset while the power supply stabilizes. There is also circuitry to reset the device if a brown-out occurs, which can use the Power-up Timer to provide at least a 72 ms Reset. With these functionson-chip, most applications need no external Reset circuitry. The Sleep mode is designed to offer a very low-current Power-Down mode. The user can wake-up from Sleep through: * External Reset * Watchdog Timer Wake-up * An interrupt 2017 Microchip Technology Inc. DS20005750A-page 87 MCP19122/3 REGISTER 11-1: CONFIGURATION WORD REGISTER R/P-1 U-1 DEBUG -- R/P-1 R/P-1 U-1 R/P-1 -- BOREN WRT<1:0> bit 13 bit 8 U-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1 U-1 U-1 -- CP MCLRE PWRTE WDTE -- -- -- bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `1' `0' = Bit is cleared `1' = Bit is set -n = Value when blank or after Bulk Erase bit 13 DEBUG: Debug Mode Enable bit(2) 1 = Background debugger is disabled 0 = Background debugger is enabled bit 12 Unimplemented: Read as `1'. bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bits 11 = Write protection off 10 = 000h to FFh write-protected, 100h to 3FFh may be modified by PMCON1 control 01 = 000h to 1FFh write-protected, 200h to 3FFh may be modified by PMCON1 control 00 = 000h to 3FFh write-protected, entire program is write-protected bit 9 Unimplemented: Read as `1'. bit 8 BOREN: Brown-out Reset Enable bit 1 = BOR enabled during operation and disabled in Sleep 0 = BOR disabled bit 7 Unimplemented: Read as `1'. bit 6 CP: Code Protection bit 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 5 MCLRE: MCLR/VPP Pin Function Select bit 1 = MCLR pin is MCLR function and weak internal pull-up is enabled 0 = MCLR pin is input function, MCLR function is internally disabled bit 4 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 Unimplemented: Read as `1'. Note 1: 2: Enabling Brown-out Reset does not automatically enable Power-up Timer. The Configuration bit is managed automatically by the device development tools. The user should not attempt to manually write this bit location. However, the user should ensure that this location has been programmed to a `1' and the device checksum is correct for proper operation of production software. DS20005750A-page 88 2017 Microchip Technology Inc. MCP19122/3 11.2 Code Protection Code protection allows the device to be protected from unauthorized access. Internal access to the program memory is unaffected by any code protection setting. 11.2.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in the Configuration Word. When CP = 0, external reads and writes of program memory are inhibited and a read will return all `0's. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. 11.3 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as boot loader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in the Configuration Word define the size of the program memory block that is protected. 11.4 ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution but are readable and writable during Program/Verify mode. Only the Least Significant 7 bits of the ID locations are reported when using MPLAB Integrated Development Environment (IDE). 2017 Microchip Technology Inc. DS20005750A-page 89 MCP19122/3 NOTES: DS20005750A-page 90 2017 Microchip Technology Inc. MCP19122/3 12.0 RESETS The reset logic is used to place the MCP19122/3 into a known state. The source of the reset can be determined by using the device status bits. There are multiple ways to reset this device: * * * * * * Power-on Reset (POR) WDT Reset during normal operation WDT Reset during Sleep MCLR Reset during normal operation MCLR Reset during Sleep Brown-out Reset (BOR) To allow VDD to stabilize, an optional power-up timer can be enabled to extend the Reset time after a POR event. Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a "Reset state" on: * * * * * Power-on Reset MCLR Reset MCLR Reset during Sleep WDT Reset Brown-out Reset (BOR) WDT wake-up does not cause register resets in the same manner as a WDT Reset since wake-up is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different Reset situations, as indicated in Table 12-1. Software can use these bits to determine the nature of the Reset. See Table 12-2 for a full description of Reset states of all registers. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 12-1. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Section 5.0, Digital Electrical Characteristics for pulse-width specifications. FIGURE 12-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR pin (1) Sleep WDT Module WDT Time-out Reset VIN Rise Detect VIN Power-on Reset Brown-out(1) Reset BOREN S PWRT On-Chip RC OSC Chip_Reset R 11-bit Ripple Counter Q Enable PWRT Note 1: Refer to the Configuration Word register (Register 11-1). 2017 Microchip Technology Inc. DS20005750A-page 91 MCP19122/3 TABLE 12-1: TIME-OUT IN VARIOUS SITUATIONS Power-up Brown-out Reset PWRTE = 0 PWRTE = 1 PWRTE = 0 PWRTE = 1 Wake-up from Sleep TPWRT -- TPWRT -- -- Oscillator Configuration INTOSC TABLE 12-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE POR BOR TO PD Condition 0 x 1 1 Power-on Reset u 0 1 1 Brown-out Reset u u 0 u WDT Reset u u 0 0 WDT Wake-up u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during Sleep Legend: u = unchanged, x = unknown 12.1 Power-on Reset (POR) The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply connect the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. If the BOR is enabled, the maximum rise time specification does not apply. The BOR circuitry will keep the device in Reset until VDD reaches VBOR (see Section 12.3 "Brown-out Reset (BOR)"). When the device starts normal operation (exits the Reset condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure proper operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. 12.2 MCLR MCP19122/3 has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. Voltages applied to the MCLR pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RC network, as shown in Figure 12-2, is suggested. An internal MCLR option is enabled by clearing the MCLRE bit in the Configuration Word register. When MCLRE = 0, the Reset signal to the chip is generated internally. When the MCLRE = 1, the MCLR pin becomes an external Reset input. In this mode, the MCLR pin has a weak pull-up to VDD. FIGURE 12-2: RECOMMENDED MCLR CIRCUIT VDD R2 MCLR SW1 (optional) 100 (needed with capacitor) MCP19122/3 R1 1 k (or greater) C1 0.1 F (optional, not critical) DS20005750A-page 92 2017 Microchip Technology Inc. MCP19122/3 12.3 VDD + VDROPOUT. During power-down with BOR enabled, the MCU operation will be held in Reset when VDD falls below the VBOR threshold. With BOR disabled or while operating in Sleep mode, the POR will hold the part in Reset when VDD falls below the VPOR threshold. Brown-out Reset (BOR) The BOREN bit in the Configuration Word register enables or disables the BOR mode. See Register 11-1 for the Configuration Word definition. A brown-out occurs when VDD falls below VBOR for greater than 100 s minimum. On a Reset (Power-On, Brown-Out, Watchdog Timer, etc.), the chip will remain in Reset until VDD rises above VBOR (refer to Figure 123). If enabled, the Power-up Timer will be invoked by the Reset and will keep the chip in Reset an additional 72 ms. During power-up, it is recommended that the BOR configuration bit is enabled, holding the MCU in Reset (OSC turned off and no code execution) until VDD exceeds the VBOR threshold. Users have the option of adding an additional 72 ms delay be clearing the PWRTE bit. At this time, the VDD voltage level is high enough to operate the MCU functions only; all other device functionality is not operational. This is independent of the value of VIN, which is typically FIGURE 12-3: A brown-out occurs when VIN falls below VBOR for greater than parameter TBOR. The brown-out condition will reset the device. This will occur regardless of VIN slew rate. A Brown-out Reset may not occur if VIN falls below VBOR for less than parameter TBOR. Note: If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be re-initialized. Once VDD rises above VBOR, the Power-up Timer will execute a 72 ms Reset. BROWN-OUT SITUATIONS VDD Internal Reset VBOR 72 ms(1) VDD Internal Reset VBOR < 72 ms 72 ms(1) VDD Internal Reset Note 1: The Power-up Timer is enabled by the PWRTE bit in the Configuration Word register. VBOR 72 ms(1) 72 ms delay only if PWRTE bit is programmed to `0'. 2017 Microchip Technology Inc. DS20005750A-page 93 MCP19122/3 12.4 Power-up Timer (PWRT) The Power-up Timer provides a fixed 64 ms (nominal) time-out on power-up only, from POR Reset. The Power-up Timer operates from an internal RC oscillator. The chip is kept in Reset as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A Configuration bit (PWRTE), can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer delay will vary from chip to chip due to: * VDD variation * Temperature variation * Process variation The Power-Up Timer optionally delays device execution after a POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. The Power-up Timer is controlled by the PWRTE bit of the Configuration Word. Note: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR pin, rather than pulling this pin directly to VSS. FIGURE 12-4: 12.5 Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section 15.0, Watchdog Timer (WDT) for more information. 12.6 Start-up Sequence Upon the release of a POR, the following must occur before the device will begin executing: * Power-up Timer runs to completion (if enabled) * Oscillator start-up timer runs to completion * MCLR must be released (if enabled) The total time-out will vary based on PWRTE bit status. For example, with PWRTE bit erased (PWRT disabled), there will be no time-out at all. Figures 12-4, 12-5 and 12-6 depict time-out sequences. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then, bringing MCLR high will begin execution immediately (see Figure 12-5). This is useful for testing purposes or to synchronize more than one MCP19122/3 device operating in parallel. 12.6.1 POWER CONTROL (PCON) REGISTER The Power Control register PCON (address 8Eh) has two Status bits to indicate what type of Reset occurred last. TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1 VDD MCLR Internal POR TPWRT PWRT Time-out TIOSCST OST Time-out Internal Reset DS20005750A-page 94 2017 Microchip Technology Inc. MCP19122/3 FIGURE 12-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2 VDD MCLR Internal POR TPWRT PWRT Time-out TIOSCST OST Time-out Internal Reset FIGURE 12-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD) VDD MCLR Internal POR TPWRT PWRT Time-out TIOSCST OST Time-out Internal Reset 2017 Microchip Technology Inc. DS20005750A-page 95 MCP19122/3 12.7 Determining the Cause of a Reset TABLE 12-3: Upon any Reset, multiple bits in the STATUS and PCON register are updated to indicate the cause of the Reset. Table 12-3 and Table 12-4 show the Reset conditions of these registers. TABLE 12-4: RESET STATUS BITS AND THEIR SIGNIFICANCE POR BOR TO PD Condition 0 x 1 1 Power-on Reset u 0 1 1 Brown-out Reset u u 0 u WDT Reset u u 0 0 WDT Wake-up from Sleep u u 1 0 Interrupt Wake-up from Sleep u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during Sleep 0 u 0 x Not allowed. TO is set on POR 0 u x 0 Not allowed. PD is set on POR RESET CONDITION FOR SPECIAL REGISTERS (Note 2) Program Counter STATUS Register PCON Register Power-on Reset 0000h 0001 1xxx ---- --0u Brown-out Reset 000 0001 1xxx ---- --u0 MCLR Reset during normal operation 0000h 000u uuuu ---- --uu MCLR Reset during Sleep 0000h 0001 0uuu ---- --uu WDT Reset 0000h 0000 uuuu ---- --uu Condition WDT Wake-up from Sleep Interrupt Wake-up from Sleep Legend: Note 1: 2: PC + 1 uuu0 0uuu ---- --uu PC + 1(1) uuu1 0uuu ---- --uu u = unchanged, x = unknown, - = unimplemented bit, reads as `0'. When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. If a Status bit is not implemented, that bit will be read as `0'. DS20005750A-page 96 2017 Microchip Technology Inc. MCP19122/3 12.8 The PCON register bits are shown in Register 12-1. Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: * Power-on Reset (POR) * Over Temperature (OT) * Brown-out Reset (BOR) REGISTER 12-1: PCON: POWER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 -- -- -- -- -- -- POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as '0' bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 Unimplemented: Read as '0' TABLE 12-5: Name PCON STATUS SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page -- -- -- -- -- -- POR BOR 97 IPR RP1 RP0 TO PD Z DC C 77 Legend: -- = unimplemented bit, reads as `0'. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. 2017 Microchip Technology Inc. DS20005750A-page 97 MCP19122/3 NOTES: DS20005750A-page 98 2017 Microchip Technology Inc. MCP19122/3 13.0 INTERRUPTS The MCP19122/3 has multiple sources of interrupt: * * * * * * * * * * * * * * * * * External Interrupt (INT pin) Interrupt-on-Change (IOC) Interrupts Timer0 Overflow Interrupt Timer1 Overflow Interrupt Timer1 Gate Interrupt Timer2 Match Interrupt ADC Interrupt SSP BCL Input Undervoltage Interrupt Input Overvoltage Interrupt System Output Overvoltage Interrupt System Output Undervoltage Interrupt System Output Overcurrent Interrupt Overtemperature CC1 CC2 The Interrupt Control register (INTCON) and Peripheral Interrupt Request Registers (PIRx) record individual interrupt requests in flag bits. The INTCON register also has individual and global interrupt enable bits. The Global Interrupt Enable bit, GIE of the INTCON register, enables (if set) all unmasked interrupts, or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in the INTCON register and PIEx registers. GIE is cleared on Reset. When an interrupt is serviced, the following actions occur automatically: * The GIE is cleared to disable any further interrupt. * The return address is pushed onto the stack. * The PC is loaded with 0004h. Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid multiple interrupt requests. Note 1: Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The interrupts, which were ignored, are still pending to be serviced when the GIE bit is set again. For additional information on Timer1, Timer2, comparators, ADC, CCD modules, refer to the respective peripheral section. 13.0.1 GPA2/INT INTERRUPT The external interrupt on the GPA2/INT pin is edgetriggered; either on the rising edge if the INTEDG bit of the OPTION register is set, or the falling edge, if the INTEDG bit is clear. When a valid edge appears on the GPA2/INT pin, the INTF bit of the INTCON register is set. This interrupt can be disabled by clearing the INTE control bit of the INTCON register. The INTF bit must be cleared by software in the Interrupt Service Routine before re-enabling this interrupt. The GPA2/INT interrupt can wake-up the processor from Sleep, if the INTE bit was set prior to going into Sleep. See Section 14.0 "Power-Down Mode (Sleep)" for details on Sleep. Note: The ANSELx register must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read `0' and cannot generate an interrupt. The Return from Interrupt instruction, RETFIE, exits the interrupt routine, as well as sets the GIE bit, which re-enables unmasked interrupts. The following interrupt flags are contained in the INTCON register: * INT Pin Interrupt * Interrupt-on-Change (IOC) Interrupts * Timer0 Overflow Interrupt The peripheral interrupt flags are contained in the PIR1 and PIR2 registers. The corresponding interrupt enable bit is contained in the PIE1 and PIE2 registers. For external interrupt events, such as the INT pin or PORTGPx change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends upon when the interrupt event occurs (see Figure 13-2). The latency is the same for one or twocycle instructions. Once in the Interrupt Service 2017 Microchip Technology Inc. DS20005750A-page 99 MCP19122/3 13.0.2 TIMER0 INTERRUPT 13.0.3 An overflow (FFh 00h) in the TMR0 register will set the T0IF bit of the INTCON register. The interrupt can be enabled/disabled by setting/clearing T0IE bit of the INTCON register. See Section 21.0 "Timer0 Module" for operation of the Timer0 module. An input change on PORTGPx sets the IOCIF bit of the INTCON register. The interrupt can be enabled/ disabled by setting/clearing the IOCIE bit of the INTCON register. Plus, individual pins can be configured through the IOC register. Note: FIGURE 13-1: PORTGPX INTERRUPT-ONCHANGE If a change on the I/O pin should occur when any PORTGPx operation is being executed, then the IOCIF interrupt flag may not get set. INTERRUPT LOGIC UVIF UVIE OVIF OVIE OCIF OCIE OVLOIF OVLOIE UVLOIF UVLOIE OTIF OTIE T0IF T0IE ADIF ADIE BCLIF BCLIE SSPIF SSPIE CC1IF CC1IE CC2IF CC2IE INTF INTE IOCF IOCE Wake-up (If in Sleep mode) Interrupt to CPU PEIF PEIE GIE TMR2IF TMR2IE TMR1IF TMR1IE TMR1GIF TMR1GIE DS20005750A-page 100 2017 Microchip Technology Inc. MCP19122/3 FIGURE 13-2: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN (3) CLKOUT (4) INT pin (1) INTF flag (INTCON reg.) (1) (5) Interrupt Latency(2) GIE bit (INTCON reg.) INSTRUCTION FLOW PC PC Instruction Fetched Instruction Executed Inst (PC) Inst (PC - 1) PC + 1 Inst (PC + 1) Inst (PC) PC + 1 -- Dummy Cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT is available only in INTOSC and RC Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section 5.0, Digital Electrical Characteristics. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. 13.1 13.1.1 Interrupt Control Registers INTCON REGISTER The INTCON register is a readable and writable register, that contains the various enable and flag bits for the TMR0 register overflow, interrupt-on-change and external INT pin interrupts. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2017 Microchip Technology Inc. DS20005750A-page 101 MCP19122/3 REGISTER 13-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE PEIE T0IE INTE IOCE T0IF INTF IOCF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCE: Interrupt-on-Change Enable bit(1) 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 T0IF: TMR0 Overflow Interrupt Flag bit(2) 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: External Interrupt Flag bit 1 = The external interrupt occurred (must be cleared in software) 0 = The external interrupt did not occur bit 0 IOCF: Interrupt-on-Change Interrupt Flag bit 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: 2: x = Bit is unknown IOC register must also be enabled. T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before clearing T0IF bit. DS20005750A-page 102 2017 Microchip Technology Inc. MCP19122/3 13.1.1.1 PIE1 Register The PIE1 register contains the Peripheral Interrupt Enable bits, as shown in Register 13-1. Note 1: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 13-1: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TMR1GIE ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 gate interrupt 1 = Disables the Timer1 gate interrupt bit 6 ADIE: ADC Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 BCLIE: MSSP Bus Collision Interrupt Enable bit 1 = Enables the MSSP Bus Collision Interrupt 0 = Disables the MSSP Bus Collision Interrupt bit 4 SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 3 CC2IE: Capture2/Compare2 Interrupt Enable bit 1 = Enables the Capture2/Compare2 interrupt 0 = Disables the Capture2/Compare2 interrupt bit 2 CC1IE: Capture1/Compare1 Interrupt Enable bit 1 = Enables the Capture1/Compare1 interrupt 0 = Disables the Capture1/Compare1 interrupt bit 1 TMR2IE: Timer2 Interrupt Enable 1 = Enables the Timer2 interrupt 0 = Disables the Timer2 interrupt bit 2 TMR1IE: Timer1 Interrupt Enable 1 = Enables the Timer1 interrupt 0 = Disables the Timer1 interrupt 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 103 MCP19122/3 13.1.1.2 PIE2 Register The PIE2 register contains the Peripheral Interrupt Enable bits, as shown in Register 13-2. Note 1: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 13-2: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 UVIE OTIE OCIE OVIE -- -- OVLOIE UVLOIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 UVIE: Output Undervoltage Interrupt enable bit 1 = Enables the UV interrupt 0 = Disables the UV interrupt bit 6 OTIE: Overtemperature Interrupt enable bit 1 = Enables over temperature interrupt 0 = Disables over temperature interrupt bit 5 OCIE: Output Overcurrent Interrupt enable bit 1 = Enables the OC interrupt 0 = Disables the OC interrupt bit 4 OVIE: Output Overvoltage Interrupt enable bit 1 = Enables the OV interrupt 0 = Disables the OV interrupt bit 3-2 Unimplemented: Read as '0' bit 1 OVLOIE: VIN Overvoltage Lock Out Interrupt Enable bit 1 = Enables the VIN OVLO interrupt 0 = Disables the VIN OVLO interrupt bit 0 UVLOIE: VIN Undervoltage Lock Out Interrupt Enable bit 1 = Enables the VIN UVLO interrupt 0 = Disables the VIN UVLO interrupt DS20005750A-page 104 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 13.1.1.3 PIR1 Register The PIR1 register contains the Peripheral Interrupt Flag bits, as shown in Register 13-3. Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 13-3: PIR1: PERIPHERAL INTERRUPT FLAG REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TMR1GIF ADIF BCLIF SSPIF CC2IF CC1IE TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: ADC Interrupt Flag bit 1 = ADC conversion complete 0 = ADC conversion has not completed or has not been started bit 5 BCLIF: MSSP Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 CC2IF: Capture2/Compare2 Interrupt Flag bit 1 = Capture or Compare has occurred 0 = Capture or Compare has not occurred bit 2 CC1IF: Capture2/Compare2 Interrupt Flag bit 1 = Capture or Compare has occurred 0 = Capture or Compare has not occurred bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag 1 = Timer2 to PR2 match occurred (must be cleared in software) 0 = Timer2 to PR2 match did not occur bit 0 TMR1IF: Timer1 Interrupt Flag 1 = Timer1 rolled over (must be cleared in software) 0 = Timer1 has not rolled over 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 105 MCP19122/3 13.1.1.4 PIR2 Register The PIR2 register contains the Peripheral Interrupt Flag bits, as shown in Register 13-4. Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 13-4: PIR2: PERIPHERAL INTERRUPT FLAG REGISTER 2 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 UVIF OTIF OCIF OVIF -- -- OVLOIF UVLOIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 UVIF: Output Undervoltage error interrupt flag bit 1 = Output undervoltage error has occurred 0 = Output undervoltage error has not occurred bit 6 OTIF: Overtemperature interrupt flag bit 1 = Overtemperature error has occurred 0 = Overtemperature error has not occurred bit 5 OCIF: Output over current error interrupt flag bit 1 = Output overcurrent error has occurred 0 = Output overcurrent error has not occurred bit 4 OVIF: Output overvoltage error interrupt flag bit 1 = Output overvoltage error has occurred 0 = Output overvoltage error has not occurred bit 3-2 Unimplemented: Read as '0' bit 1 OVLOIF: VIN Overvoltage Lock Interrupt Flag bit With OVLOINTP bit set 1 = A VIN NOT overvoltage to VIN overvoltage edge has been detected 0 = A VIN NOT overvoltage to VIN overvoltage edge has NOT been detected With OVLOINTN bit set 1 = A VIN overvoltage to VIN NOT overvoltage edge has been detected 0 = A VIN overvoltage to VIN NOT overvoltage edge has NOT been detected bit 0 UVLOIF: VIN Undervoltage Lock Out Interrupt Flag bit With UVLOINTP bit set 1 = A VIN NOT undervoltage to VIN undervoltage edge has been detected 0 = A VIN NOT undervoltage to VIN undervoltage edge has NOT been detected With UVLOINTN bit set 1 = A VIN undervoltage to VIN NOT undervoltage edge has been detected 0 = A VIN undervoltage to VIN NOT undervoltage edge has NOT been detected DS20005750A-page 106 2017 Microchip Technology Inc. MCP19122/3 TABLE 13-5: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Name INTCON Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 102 RAPU INTEDG T0CE T0SE PSA PS2 PS1 PS0 83 PIE1 -- ADIE BCLIE SSPIE -- -- TMR2IE TMR1IE 103 PIE2 UVIE -- OCIE OVIE -- -- VINIE -- 104 PIR1 -- ADIF BCLIF SSPIF -- -- TMR2IF TMR1IF 105 UVIF -- OCIF OVIF -- -- VINIF -- 106 OPTION_REG PIR2 Legend: -- = unimplemented locations read as `0'. Shaded cells are not used by Interrupts. 13.2 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (e.g., W and STATUS registers). This must be implemented in software. Temporary holding registers W_TEMP and STATUS_TEMP should be placed in the last 16 bytes of GPR. These 16 locations are common to all banks and do not require banking. This makes context save and restore operations simpler. The code shown in Example 13-1 can be used to: * * * * * Store the W register Store the STATUS register Execute the ISR code Restore the Status (and Bank Select Bit register) Restore the W register Note: The MCP19122/3 device does not require saving the PCLATH. However, if computed GOTOs are used in both the ISR and the main code, the PCLATH must be saved and restored in the ISR. EXAMPLE 13-1: MOVWF SWAPF SAVING STATUS AND W REGISTERS IN RAM W_TEMP STATUS,W MOVWF STATUS_TEMP : :(ISR) : SWAPF STATUS_TEMP,W MOVWF SWAPF SWAPF STATUS W_TEMP,F W_TEMP,W 2017 Microchip Technology Inc. ;Copy W to TEMP ;Swap status to ;Swaps are used ;Save status to register be saved into W because they do not affect the status bits bank zero STATUS_TEMP register ;Insert user code here ;Swap STATUS_TEMP register into W ;(sets bank to original state) ;Move W into STATUS register ;Swap W_TEMP ;Swap W_TEMP into W DS20005750A-page 107 MCP19122/3 NOTES: DS20005750A-page 108 2017 Microchip Technology Inc. MCP19122/3 14.0 POWER-DOWN MODE (SLEEP) The Power-down mode is entered by executing a SLEEP instruction. Upon entering SLEEP, the following conditions exist: * WDT will be cleared but keeps running, if enabled for operation during SLEEP. * PD bit of the STATUS register is cleared. * TO bit of the STATUS register is set. * CPU clock is disabled. * The ADC is inoperable due to the absence of the 4V LDO power (AVDD) while the ADC reference is set to AVDD. To minimize sleep current the ADC reference must be set to the default AVDD. * I/O Ports maintain the status they had before SLEEP was executed (driving high, low or highimpedance). * Resets other than WDT and BOR are not affected by SLEEP mode. * Analog circuitry power (AVDD) is removed during SLEEP. Refer to individual chapters for more details on peripheral operation during SLEEP. To minimize current consumption, conditions should be considered: the following * * * * I/O pins should not be floating. External circuitry sinking current from I/O pins. Internal circuitry sourcing current from I/O pins. Current draw from pins with internal weak pullups. * Modules using Timer1 oscillator. * ADC reference must be set to default condition (AVDD). * I/O pins that are high-impedance inputs should be pulled to VDD or GND externally to avoid switching currents caused by floating inputs. If the VDDEN bit is set, the SLEEP instruction removes power from the analog circuitry. AVDD is shut down to minimize current draw in SLEEP Mode and to achieve the 50A typical shutdown current. Shutdown current specifications can only be met with no current draw from external loads. The 5V VDD voltage drops to 2.5V-3.0V and is only capable of supplying >1mA in SLEEP Mode. If more than 1mA of current are drawn form VDD while in the low current SLEEP Mode, VDD will collapse causing a reset of the device and the device coming back out of SLEEP. A POR event during SLEEP will wake the device from SLEEP. The enable state of the analog circuitry does not change with the execution of the SLEEP command. 2017 Microchip Technology Inc. 14.0.1 WAKE-UP FROM SLEEP The device can wake-up from SLEEP through one of the following events: 1. 2. 3. 4. 5. External Reset input on MCLR pin, if enabled. POR Reset. Watchdog Timer, if enabled. Any external interrupt. Interrupts by peripherals capable of running during SLEEP (see individual peripheral for more information). The first two events will cause a device reset. The last three events are considered a continuation of program execution. To determine whether a device reset or wake-up event occurred, refer to Section 12.7 "Determining the Cause of a Reset" The following peripheral interrupts can wake the device from SLEEP: * Interrupt-on-change * External interrupt from INT pin When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction, the device will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from SLEEP, regardless of the source of the wake-up. 14.0.2 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: * If the interrupt occurs before the execution of the SLEEP instruction - SLEEP instruction will execute as a NOP. - WDT and WDT prescaler will not be cleared. - TO bit in the STATUS register will not be set. - PD bit in the STATUS register will not be cleared. * If the interrupt occurs during or after the execution of a SLEEP instruction - SLEEP instruction will be completely executed - Device will immediately wake up from SLEEP - WDT and WDT prescaler will be cleared - TO bit in STATUS register will be set - PD bit in the STATUS register will be cleared DS20005750A-page 109 MCP19122/3 Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flags bits to become set before the SLEEP instruction completes. To FIGURE 14-1: determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC TOST Interrupt Latency (1) Interrupt flag GIE bit (INTCON reg.) Processor in Sleep Instruction Flow PC Instruction Fetched Instruction Executed Note 1: PC Inst(PC) = Sleep Inst(PC - 1) INTCON PC + 2 PC + 2 Inst(PC + 2) Sleep Inst(PC + 1) PC + 2 Dummy Cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy Cycle Inst(0004h) GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. TABLE 14-1: Name PC + 1 Inst(PC + 1) SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 102 IOCA IOCA7 IOCA6 IOCA5 -- IOCA3 IOCA2 IOCA1 IOCA0 130 IOCB IOCB7 IOCB6 IOCB5 IOCB4 -- -- IOCB1 IOCB0 130 PIE1 TXIE RCIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 103 PIE2 CDSIE ADIE -- OTIE OVIE DRUVIE OVLOIE UVLOIE 104 PIR1 TXIF RCIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF 105 PIR2 CDSIF ADIF -- OTIF OVIF DRUVIF OVLOIF UVLOIF 106 IRP RP1 RP0 TO PD Z DC C 77 STATUS Legend: -- = unimplemented, read as `0'. Shaded cells are not used in Power-down mode. DS20005750A-page 110 2017 Microchip Technology Inc. MCP19122/3 15.0 WATCHDOG TIMER (WDT) 15.2 The WDT has a nominal time-out period of 18 ms (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see DC specs). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT under software control by writing to the OPTION register. Thus, time-out periods up to 2.3 seconds can be realized. The Watchdog Timer is a free-running timer, using the on chip RC oscillator as its clock source. The WDT is enabled by setting the WDTE bit of the Configuration Word (default setting). When WDTE is set, the on-chip RC oscillator will always be enabled to provide a clock source to the WDT module. 15.1 WDT Period Watchdog Timer (WDT) Operation The CLRWDT and SLEEP instructions clear the WDT and the prescaler, if assigned to the WDT, and prevent it from timing out and generating a device Reset. During normal operation, a WDT time-out generates a device Reset. If the device is in Sleep mode, a WDT time-out causes the device to wake-up and continue with normal operation; this is known as a WDT wakeup. The WDT can be permanently disabled by clearing the WDTE configuration bit. The TO bit in the STATUS register will be cleared upon a Watchdog Timer time-out. 15.3 The postscaler assignment is fully under software control and can be changed during program execution. WDT Programming Considerations It should also be taken in account that under worstcase conditions (i.e., VDD = Min., Temperature = Max., Max. WDT prescaler) it may take several seconds before a WDT time-out occurs. FIGURE 15-1: WATCHDOG TIMER WITH SHARED PRESCALE BLOCK DIAGRAM FOSC/4 Data Bus 0 8 1 1 Sync 2 TCY Shared Prescale T0CKI pin TMR0 0 0 T0CS T0SE Set Flag bit T0IF on Overflow PSA 8-bit Prescaler 1 PSA PS<2:0> Watchdog Timer RC OSC 8 1 WDT Time-out 2 0 PSA PSA WDTE Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION_REG register. 2: WDTE bit is in the Configuration Word register. 2017 Microchip Technology Inc. DS20005750A-page 111 MCP19122/3 TABLE 15-1: WDT STATUS Conditions WDT WDTE = 0 CLRWDT Command Cleared Exit Sleep SLEEP Command TABLE 15-2: Name OPTION_REG SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page RAPU INTEDG T0CE T0SE PSA PS2 PS1 PS0 83 Legend: -- = unimplemented locations read as `0'. Shaded cells are not used by Watchdog Timer. TABLE 15-3: Name Bits CONFIG 13:8 7:0 SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH WATCHDOG TIMER Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 -- -- DBGEN -- WRT1 -- CP MCLRE PWRTE WDTE Bit 9/1 Bit 8/0 Register on Page WRT0 -- BOREN 88 -- -- -- Bit 11/3 Bit 10/2 Legend: -- = unimplemented locations read as `0'. Shaded cells are not used by Watchdog Timer. DS20005750A-page 112 2017 Microchip Technology Inc. MCP19122/3 16.0 OSCILLATOR MODES 16.3 The MCP19122/3 has one oscillator configuration, which is an 8 MHz internal oscillator. 16.1 Internal Oscillator (INTOSC) The Internal Oscillator module provides a system clock source of 8 MHz. The frequency of the internal oscillator can be trimmed with a calibration value in the OSCTUNE register. 16.2 Frequency Tuning in User Mode In addition to the factory calibration, the base frequency can be tuned in the user's application. This frequency tuning capability allows the user to deviate from the factory calibrated frequency. The user can tune the frequency by writing to the OSCTUNE register (see Register 16-1). Oscillator Calibration The 8 MHz internal oscillator is factory calibrated. The factory calibration values reside in the read-only Calibration Word 1 register. These values must be read from the Calibration Word 1 register and stored in the OSCCAL register. Refer to Section 20.0 "Flash Program Memory Control" for the procedure on reading from program memory. Note 1: The FCAL<6:0> bits from the Calibration Word 1 register must be written into the OSCCAL register to calibrate the internal oscillator. REGISTER 16-1: OSCTUNE: - OSCILLATOR TUNING REGISTER U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- -- TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as `0' bit 4-0 TUN<4:0>: Frequency Tuning bits 01111 = Maximum frequency 01110 = * * * 00001 = 00000 = Center frequency. Oscillator Module is running at the calibrated frequency. 11111 = * * * 10000 = Minimum frequency 2017 Microchip Technology Inc. DS20005750A-page 113 MCP19122/3 16.3.1 OSCILLATOR DELAY UPON POWER-UP, WAKE-UP AND BASE FREQUENCY CHANGE On power-up, the device is held in reset by the power-up time, if the power-up timer is enabled. In applications where the OSCTUNE register is used to shift the frequency of the internal oscillator, the user should not expect the frequency of the internal oscillator to stabilize immediately. In this case, the frequency may shift gradually toward the new value. The time for this frequency shift is less than eight cycles of the base frequency. TABLE 16-1: Following a wake-up from Sleep mode or POR, an internal delay of ~10 s is invoked to allow the memory bias to stabilize before program execution can begin. SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page OSCTUNE -- -- -- TUN4 TUN3 TUN2 TUN1 TUN0 113 Legend: -- = unimplemented locations read as `0'. Shaded cells are not used by clock sources. TABLE 16-2: SUMMARY OF CALIBRATION WORD ASSOCIATED WITH CLOCK SOURCES Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 CALWD1 13:8 -- -- BGR5 BGR4 BGR3 BGR2 BGR1 BGR0 7:0 -- FCAL6 FCAL5 FCAL4 FCAL3 FCAL2 FCAL1 FCAL0 Register on Page 61 Legend: -- = unimplemented locations read as `0'. Shaded cells are not used by clock sources. DS20005750A-page 114 2017 Microchip Technology Inc. MCP19122/3 17.0 I/O PORTS 17.1 In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Each port has two registers for its operation. These registers are: * TRISGPx registers (data direction register) * PORTGPx registers (reads the levels on the pins of the device) Some ports may have one or more of the following additional registers. These registers are: * ANSELx (analog select) * WPUx (weak pull-up) Ports with analog functions also have an ANSELx register, which can disable the digital input and save power. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 17-1. FIGURE 17-1: GENERIC I/O PORTGPX OPERATION Read D Write PORTx TRISx Data Register Data Bus I/O pin Read PORTx To peripherals ANSELx EXAMPLE 17-1: ; ; ; ; VSS INITIALIZING PORTA This code example illustrates initializing the PORTGPA register. The other ports are initialized in the same manner. BANKSEL CLRF BANKSEL CLRF BANKSEL MOVLW MOVWF PORTGPA; PORTGPA;Init PORTA ANSELA; ANSELA;digital I/O TRISGPA; B'00011111';Set GPA<4:0> as ;inputs TRISGPA;and set GPA<7:6> as ;outputs 2017 Microchip Technology Inc. Reading the PORTGPA register (Register 17-1) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modifywrite operations. The TRISGPA register (Register 17-2) controls the PORTGPA pin output drivers, even when they are being used as analog inputs. The user must ensure the bits in the TRISGPA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read `0'. If the pin is configured for a digital output (either port or alternate function), the TRISGPA bit must be cleared in order for the pin to drive the signal, and a read will reflect the state of the pin. INTERRUPT-ON-CHANGE Each PORTGPA pin is individually configurable as an interrupt-on-change pin. Control bits IOCA<7:0> enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-on Reset. Reference Section 18.0 "InterruptOn-Change" for more information. VDD CK PORTGPA is an 8-bit wide, bidirectional port consisting of five CMOS I/O, two open drain I/O, and one open drain input-only pin. The corresponding data direction register is TRISGPA (Register 17-2). Setting a TRISGPA bit (= 1) will make the corresponding PORTGPA pin an input (i.e., disable the output driver). Clearing a TRISGPA bit (= 0) will make the corresponding PORTGPA pin an output (i.e., enables output driver). The exception is GPA5, which is input only and its TRISGPA bit will always read as `1'. Example 17-1 shows how to initialize an I/O port. 17.1.1 Q PORTGPA and TRISGPA Registers 17.1.2 WEAK PULL-UPS PORTGPA <1:0> and PORTGPA5 have an internal weak pull-up. PORTGPA<7:6> are special ports for the SSP module and do not have weak pull-ups. PORTGPA<3:2> are special current source ports and do not have weak pull-ups. PORTGPA4 is a true open drain pin and does not have a weak pull-up. Individual control bits can enable or disable the internal weak pull-ups (see Register 17-3). The weak pull-up is automatically turned off when the port pin is configured as an output or on a Power-on Reset setting the RAPU bit of the OPTION register. The weak pull-up on GPA5 is enabled when configured as MCLR pin by setting bit 5 of the Configuration Word or when controlled by software. 17.1.3 WEAK CURRENT SOURCE PORTGPA<3:2> are capable of being configured as weak current sources. Setting WPUGPA<3:2> allow each pin to source 50 A (typical). By connecting GPA2 or GPA3 to ground with a resistor The voltage on the pin can be read with the A/D to determine device I2C/ PMBus address. The value of the resistor to ground shall be 3 k to 50 k. DS20005750A-page 115 MCP19122/3 The current source on GPA3 also functions as the Error Amplifier clamp control source. 17.1.5 17.1.4 Each PORTGPA pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 17-1. For additional information, refer to the appropriate section in this data sheet. ANSELA REGISTER The ANSELA register (Register 17-4) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as `0' and allows analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on the digital output functions. A pin with TRISGPA clear and ANSELA set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSELA bits must be initialized to `0' by user software. DS20005750A-page 116 PORTGPA FUNCTIONS AND OUTPUT PRIORITIES PORTGPA pins GPA7 and GPA4 are true open-drain pins with no connection back to VDD. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC, are not shown in the priority lists. These inputs are active when the I/O pin is set for Analog mode using the ANSELA registers. Digital output functions may control the pin when it is in Analog mode with the priority shown in Table 17-1. 2017 Microchip Technology Inc. MCP19122/3 TABLE 17-1: Pad Name GPA0 GPA1 GPA2 GPA3 GPA4 GPA5 PORTGPA FUNCTIONS2 Function I/O Type & Priority(1) Description The GPA0 pad has basic port, peripheral and test mode features. The test mode outputs of the ALT_ICSPDAT and ANALOG_TEST take priority over the port data. The TRISGPA bit is overridden when configured as ALT_ICSPDAT or analog test output. The pad is an output only when configured so by the user. Enabling the AN0 input disables the input buffers and forces PORTGPA<0> to read `0'. OUT CMOS-4 PORTGPA<0> data output GPA0 IN TTL PORTGPA<0> data input AN0 IN ANA Channel 0 A/D input ANALOG_TE OUT ANA-3 Analog test mode output ST The GPA1 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user. Enabling the AN1 input disables the input buffers and forces PORTGPA<1> to read `0'. OUT CMOS-2 PORTGPA<1> data output GPA1 IN TTL PORTGPA<1> data input AN1 IN ANA Channel 1 A/D input IN ST Synchronization signal input SYC_SIGNAL OUT CMOS-1 Synchronization signal output The GPA2 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user. Enabling the AN2 input disables the input buffers and forces PORTGPA<2> to read `0'. OUT CMOS-1 PORTGPA<2> data output GPA2 IN ST PORTGPA<2> data input AN2 IN ANA Channel 2 A/D input T0CKI IN ST Timer 0 input INT IN ST External interrupt input The GPA3 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user. Enabling the AN3 input disables the input buffers and forces PORTGPA<3> to read `0'. OUT CMOS-1 PORTGPA<3> data output GPA3 IN ST PORTGPA<3> data input AN3 IN ANA Channel 3 A/D input T1G1 IN ST Input 1 to Timer1 gate The GPA4 pad is a high voltage port. The TRISGPA bit is always set. OUT OD PORTGPA<4> open drain data output GPA4 IN TTL PORTGPA<4> open drain date input The GPA5 pad is an input-only high voltage port. The TRISGPA bit is always set. GPA5 IN TTL PORTGPA<5> open drain data input MCLR IN ST MCLR input TEST IN HV ICSP and test mode entry high voltage pin Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage Note 1:Output priority number determines the precedence of data into the MUX when multiple outputs are available at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same priority number are mutually exclusive. 2: Pad module signal connections reflect only the module input signals. Output connections are addressed in the corresponding consumer module. 2017 Microchip Technology Inc. DS20005750A-page 117 MCP19122/3 TABLE 17-1: Pad Name PORTGPA FUNCTIONS2 (CONTINUED) Function I/O Type & Priority(1) Description The GPA6 pad has basic port, peripheral and test mode features. The ICSPDAT output signal takes priority over the port data. The TRISGPA bit is overridden to `0' when configured to output ICSPDAT, otherwise, the pad is an output only when configured so by the user. OUT CMOS-3 PORTGPA<6> data output GPA6 IN ST PORTGPA<6> data input OUT CMOS-1 ICSP Data output (MCP19122 Only) ICSPDAT IN ST ICSP Data input (MCP19122 Only) OUT CMOS-2 CCD1 output CCD1 IN ST CCD1 input GPA7 The GPA7 pad has basic port, peripheral and test mode features. OUT OD-2 PORTGPA<7> open drain GPA7 IN ST PORTGPA<7> data input IN I2C I2C slave mode clock input with selectable I2C or SMBus input levels SCL OUT OD-1 I2C master mode clock output ICSPCLK IN ST ICSPCK input (MCP19122 Only) Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage Note 1:Output priority number determines the precedence of data into the MUX when multiple outputs are available at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same priority number are mutually exclusive. 2: Pad module signal connections reflect only the module input signals. Output connections are addressed in the corresponding consumer module. GPA6 DS20005750A-page 118 2017 Microchip Technology Inc. MCP19122/3 REGISTER 17-1: PORTGPA: PORTGPA REGISTER R/W-x R/W-x R-x R-x R/W-x R/W-x R/W-x R/W-x GPA7 GPA6 GPA5 GPA4 GPA3 GPA2 GPA1 GPA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 GPA7: General Purpose Open Drain I/O pin bit 6 GPA6: General Purpose I/O pin 1 = Port pin is > VIH 0 = Port pin is < VIL bit 5 GPA5/MCLR: General Purpose Open Drain Input pin bit 4 GPA4: General Purpose Open Drain I/O pin bit 3-0 GPA<3:0>: General Purpose I/O pin 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 17-2: x = Bit is unknown TRISGPA: PORTGPA TRI-STATE REGISTER R/W-1 R/W-1 R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 TRISA<7:6>: PORTGPA Tri-State Control bit 1 = PORTGPA pin configured as an input (tri-stated) 0 = PORTGPA pin configured as an output bit 5 TRISA5: GPA5 Port Tri-State Control bit This bit is always `1' as GPA5 is an input only bit 4-0 TRISA<4:0>: PORTGPA Tri-State Control bit 1 = PORTGPA pin configured as an input (tri-stated) 0 = PORTGPA pin configured as an output 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 119 MCP19122/3 REGISTER 17-3: WPUGPA: WEAK PULL-UP PORTGPA REGISTER U-0 U-0 R/W-1 U-0 R/W-1 R/W-1 R/W-1 R/W-1 -- -- WPUA5 -- WCS1 WCS0 WPUA1 WPUA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5 WPUA5: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 4 Unimplemented: Read as `0' bit 3-2 WCS<1:0>: Weak Current Source bit 1 = Pull-up enabled 0 = Pull-up disabled bit 1-0 WPUA<1:0>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled Note 1: 2: 3: x = Bit is unknown The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in input mode (TRISGPA = 1), and the individual WPUA bit is enabled (WPUA = 1), and the pin is not configured as an analog input. GPA5 weak pull-up is also enabled when the pin is configured as MCLR in Configuration word. GPA2 and GPA3 weak current sources are not dependant on the global RAPU. REGISTER 17-4: ANSELA: ANALOG SELECT PORTGPA REGISTER U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 -- -- -- -- ANSA3 ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-4 Unimplemented: Read as `0' bit 3-0 ANSA<3:0>: Analog Select PORTGPA Register bit 1 = Analog input. Pin is assigned as analog input.(1) 0 = Digital I/O. Pin is assigned to port or special function. Note 1: x = Bit is unknown Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. DS20005750A-page 120 2017 Microchip Technology Inc. MCP19122/3 TABLE 17-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPA Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page -- -- -- -- ANSA3 ANSA2 ANSA1 ANSA0 120 OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 83 IOCA IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 130 Name ANSELA PORTGPA GPA7 GPA6 GPA5 GPA4 GPA3 GPA2 GPA1 GPA0 119 TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 119 WPUGPA -- -- WPUA5 -- WCS1 WCS0 WPUA1 WPUA0 120 Legend: -- = unimplemented locations read as `0'. Shaded cells are not used by PORTGPA. 2017 Microchip Technology Inc. DS20005750A-page 121 MCP19122/3 17.2 PORTGPB and TRISGPB Registers PORTGPB is an 8-bit wide, bidirectional port consisting of seven general purpose I/O ports. The corresponding data direction register is TRISGPB (Register 17-6). Setting a TRISGPB bit (= 1) will make the corresponding PORTGPB pin an input (i.e., disable the output driver). Clearing a TRISGPB bit (= 0) will make the corresponding PORTGPB pin an output (i.e., enable the output driver). Example 17-1 shows how to initialize an I/O port. Some pins for PORTGPB are multiplexed with an alternate function for the peripheral, or a clock function. In general, when a peripheral or clock function is enabled, that pin may not be used as a general purpose I/O pin. Reading the PORTGPB register (Register 17-5) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. The TRISGPB register (Register 17-6) controls the PORTGPB pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISGPB register are maintained set when using them as analog inputs. I/O pins configured as analog input always read `0'. If the pin is configured for a digital output (either port or alternate function), the TRISGPB bit must be cleared in order for the pin to drive the signal and a read will reflect the state of the pin. 17.2.1 Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: 17.2.4 The ANSELB bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSELB bits must be initialized to `0' by the user's software. PORTGPB FUNCTIONS AND OUTPUT PRIORITIES Each PORTGPB pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 17-3. For additional information, refer to the appropriate section in this data sheet. PORTGPB pin GPB0 is a true open drain pin with no connection back to VDD. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC, and some digital input functions are not included in the list below. These inputs are active when the I/O pin is set for Analog mode using the ANSELB registers. Digital output functions may control the pin when it is in Analog mode, with the priority shown in Table 17-3. INTERRUPT-ON-CHANGE Each PORTGPB pin is individually configurable as an interrupt-on-change pin. Control bits IOCB<7:4> and IOCB<2:0> enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-on Reset. Reference Section 18.0 "Interrupt-On-Change" for more information. 17.2.2 WEAK PULL-UPS Each of the PORTGPB pins, except GPB0, has an individually configurable internal weak pull-up. Control bits WPUB<7:4> and WPUB<2:1> enable or disable each pull-up (see Register 17-7). Each weak pull-up is automatically turned off when the port pin is configured as an output. All pull-ups are disabled on a Power-on Reset by the RAPU bit of the OPTION register. 17.2.3 ANSELB REGISTER The ANSELB register (Register 17-8) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELB bit high will cause all digital reads on the pin to be read as `0' and allows analog functions on the pin to operate correctly. The state of the ANSELB bits has no effect on the digital output functions. A pin with TRISGPB clear and ANSELB set will still operate as a digital output, but the DS20005750A-page 122 2017 Microchip Technology Inc. MCP19122/3 TABLE 17-3: Pad Name PORTGPB FUNCTIONS(2) Function I/O Type & Priority (1) Description The GPB0 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user. OUT OD-2 PORTGPB<0> data output, open drain GPB0 IN TTL PORTGPB<0> data input, open drain I2C slave mode data input with selectable I2C or SMBus IN I2C input levels SDA OUT OD-1 I2C master mode data open drain output GPB1 The GPB1 pad has basic port, peripheral and test mode features. The pad is an output only when sp configured by the user. Enabling the AN4 input disables the input buffers and forces PORTGPB<1> to read `0'. OUT CMOS-2 PORTGPB<1> data output GPB1 IN TTL PORTGPB<1> data input AN4 IN ANA Channel 4 A/D input CON_SIGNAL IN ANA Slave mode Current Reference input OUT ANA-1 Master mode Current Sense output GPB2 The GPB2 pad has basic port and peripheral features. The pad is an output only when so configured by the user. Enabling the AN5 input disables the input buffers and forces PORTGPB<2> to read `0'. OUT CMOS PORTGPB<2> data output GPB2 IN TTL PORTGPB<2> data input AN5 IN ANA Channel 5 A/D input T1G2 IN ST Input 2 to TIMER1 gate GPB3 The GPB3 pad has basic port and peripheral features. The pad is an output only when so configured by the user. OUT CMOS PORTGPB<3> data output GBP3 IN TTL PORTGPA<3> data input OUT CMOS Oscillator output CLOCK IN ST Oscillator input GPB4 The GPB4 pad has basic port, peripheral and test mode features. The test mode outputs of ICSPDAT take priority over the port data. The TRISGPB bit is overridden to `0' when configured as ICSPDAT. The pad is an output only when configured so by the user. Enabling the AN6 input disables the input buffers and forces PORTGPB<4> to read `0'. This pin is only available on the MCP19123. OUT CMOS-3 PORTGPB<4> data output GPB4 IN TTL PORTGPB<4> data input AN6 IN ANA Channel 6 A/D input OUT CMOS-2 Serial programming data output ICSPDAT IN ST Serial programming data input OUT CMOS-1 In-Circuit debug data output ICDDAT IN ST In-Circuit debug data input Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage Note 1: Output priority number determines the precedence of data into the MUX when multiple outputs are available at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same priority number are mutually exclusive. 2: Pad module signal connections reflect only the module input signals. Output connections are addressed in the corresponding consumer module. GPB0 2017 Microchip Technology Inc. DS20005750A-page 123 MCP19122/3 Pad Name Function I/O Type & Priority (1) Description The GPB5 pad has basic port and peripheral features. The pad is an output only when configured so by the user. This pin is only available on the MCP19123. OUT CMOS PORTGPB<5> data output GPB5 IN TTL PORTGPB<5> data input AN7 IN ANA Channel 7 A/D input ICSPCLK IN ST Serial programming clock input ICDCLK IN ST In-Circuit debugger clock input GPB6 The GPB6 pad has basic port and peripheral features. The pad is an output only when so configured by the user. This pin is only available on the MCP19123. OUT CMOS-2 PORTGPB<6> data output GPB6 IN TTL PORTGPB<6> data input OUT CMOS-1 CCD2 output CCD2 IN ST CCD2 input GPB7 The GPB7 pad has basic port and peripheral features. The pad is an output only when so configured by the user. This pin is only available on the MCP19123. OUT CMOS-1 PORTGPB<7> data output GPB7 IN TTL PORTGPB<7> data input VDAC IN ANA External ADC reference Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage Note 1: Output priority number determines the precedence of data into the MUX when multiple outputs are available at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same priority number are mutually exclusive. 2: Pad module signal connections reflect only the module input signals. Output connections are addressed in the corresponding consumer module. GPB5 DS20005750A-page 124 2017 Microchip Technology Inc. MCP19122/3 REGISTER 17-5: R/W-x GPB7 PORTGPB: PORTGPB REGISTER R/W-x (1) (1) GPB6 R/W-x GPB5 R/W-x (1) (1) GPB4 R/W-x R/W-x R/W-x R/W-x GPB3 GPB2 GPB1 GPB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 Note 1: x = Bit is unknown GPB<7:0>: General Purpose I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL Not implemented on MCP19122. REGISTER 17-6: TRISGPB: PORTGPB TRI-STATE REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 TRISB7(1) TRISB6(1) TRISB5(1) TRISB4(1) TRISB3 TRISB2 TRISB1 TRISB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 Note 1: x = Bit is unknown TRISB<7:0>: PORTGPB Tri-State Control bit 1 = PORTGPB pin configured as an input (tri-stated) 0 = PORTGPB pin configured as an output Not implemented on MCP19122. 2017 Microchip Technology Inc. DS20005750A-page 125 MCP19122/3 REGISTER 17-7: R/W-1 WPUGPB: WEAK PULL-UP PORTGPB REGISTER R/W-1 (2) WPUB7 WPUB6 (2) R/W-1 WPUB5 (2) R/W-1 WPUB4 (2) R/W-0 R/W-1 R/W-1 U-0 WPUB3 WPUB2 WPUB1 -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-3 WPUB<7:3>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 2-1 WPUB<2:1>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 0 x = Bit is unknown Unimplemented: Read as `0' Note 1: 2: The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in Input mode (TRISGPA = 1), the individual WPUB bit is enabled (WPUB = 1), and the pin is not configured as an analog input. Not implemented on MCP19122. REGISTER 17-8: ANSELB: ANALOG SELECT PORTGPB REGISTER U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 U-0 -- -- ANSB5(2) ANSB4(2) -- ANSB2 ANSB1 -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-4 ANSB<5:4>: Analog Select PORTGPB Register bit 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 3 Unimplemented: Read as `0' bit 2-1 ANSB<2:1>: Analog Select PORTGPB Register bit 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 0 Unimplemented: Read as `0' Note 1: 2: x = Bit is unknown Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. Not implemented on MCP19122. DS20005750A-page 126 2017 Microchip Technology Inc. MCP19122/3 TABLE 17-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPB Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page -- -- ANSB5 ANSB4 -- ANSB2 ANSB1 -- 126 OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 83 IOCB IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0 130 Name ANSELB PORTGPB GPB7 GPB6 GPB5 GPB4 GPB3 GPB2 GPB1 GPB0 125 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 125 WPUB1 -- 126 WPUGPB Legend: WPUB7 -- WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 = unimplemented locations read as `0'. Shaded cells are not used by PORTGPB. 2017 Microchip Technology Inc. DS20005750A-page 127 MCP19122/3 NOTES: DS20005750A-page 128 2017 Microchip Technology Inc. MCP19122/3 18.0 INTERRUPT-ON-CHANGE Each PORTGPA and PORTGPB pin is individually configurable as an interrupt-on-change pin. Control bits IOCA and IOCB enable or disable the interrupt function for each pin. Refer to Register 18-1 and Register 18-2. The interrupt-on-change is disabled on a Power-on Reset. The interrupt-on-change on GPA5 is disabled when configured as MCLR pin in the Configuration Word. For enabled interrupt-on-change pins, the values are compared with the old value latched on the last read of PORTGPA or PORTGPB. The mismatched outputs of the last read of all the PORTGPA and PORTGPB pins are OR'ed together to set the Interrupt-on-Change Interrupt Flag bit (IOCF) in the INTCON register. 18.1 Enabling the Module To allow individual port pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. 18.2 Individual Pin Configuration To enable a pin to detect an interrupt-on-change, the associated IOCAx or IOCBx bit of the IOCA or IOCB register is set. 2017 Microchip Technology Inc. 18.3 Clearing Interrupt Flags The user, in the Interrupt Service Routine, clears the interrupt by: a) Any read of PORTGPA or PORTGPB AND Clear flag bit IOCF. This will end the mismatch condition; b) Any write of PORTGPA or PORTGPB AND Clear flag bit IOCF will end the mismatch condition. OR A mismatch condition will continue to set flag bit IOCF. Reading PORTGPA or PORTGPB will end the mismatch condition and allow flag bit IOCF to be cleared. The latch holding the last read value is not affected by a MCLR Reset. After this Reset, the IOCF flag will continue to be set if a mismatch is present. Note: 18.4 If a change on the I/O pin should occur when any PORTGPA or PORTGPB operation is being executed, then the IOCF interrupt flag may not get set. Operation in Sleep The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCE bit is set. DS20005750A-page 129 MCP19122/3 18.5 Interrupt-On-Change Registers REGISTER 18-1: IOCA: INTERRUPT-ON-CHANGE PORTGPA REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 IOCA<7:6>: Interrupt-on-Change PORTGPA Register bits. 1 = Interrupt-on-change enabled on the pin 0 = Interrupt-on-change disabled on the pin bit 5 IOCA<5>: Interrupt-on-Change PORTGPA Register bits(1). 1 = Interrupt-on-change enabled on the pin 0 = Interrupt-on-change disabled on the pin bit 4-0 IOCA<4:0>: Interrupt-on-Change PORTGPA Register bits. 1 = Interrupt-on-change enabled on the pin 0 = Interrupt-on-change disabled on the pin Note 1: x = Bit is unknown The Interrupt-on-change on GPA5 is disabled if GPA5 is configured as MCLR. REGISTER 18-2: IOCB: INTERRUPT-ON-CHANGE PORTGPB REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IOCB7(1) IOCB6(1) IOCB5(1) IOCB4(1) IOCB3 IOCB2 IOCB1 IOCB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 Note 1: x = Bit is unknown IOCB<7:0>: Interrupt-on-Change PORTGPB Register bits. 1 = Interrupt-on-change enabled on the pin 0 = Interrupt-on-change disabled on the pin Not implemented on MCP19122. DS20005750A-page 130 2017 Microchip Technology Inc. MCP19122/3 TABLE 18-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA -- -- -- -- ANSA3 ANSA2 ANSA1 ANSA0 120 ANSELB -- -- ANSB5 ANSB4 -- ANSB2 ANSB1 -- 126 Name INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 102 IOCA IOCA7 IOCA6 IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 130 IOCB IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0 130 TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 119 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 125 Legend: -- = unimplemented locations read as `0'. Shaded cells are not used by interrupt-on-change. 2017 Microchip Technology Inc. DS20005750A-page 131 MCP19122/3 NOTES: DS20005750A-page 132 2017 Microchip Technology Inc. MCP19122/3 19.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 19-1 shows the block diagram of the ADC. On the MCP19122/3 devices the 4.096V AVDD or 5V VDD can be used for the ADC reference. On the MCP19123 device an external reference can be used by selecting the ADREF pin as the ADC voltage reference source. The ADCON1<ACFG> bit controls the ADC reference source. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. Note: Once VIN is greater than AVDD + VDROPOUT, AVDD is in regulation, allowing A/D readings to be accurate. Once VIN is greater than VDD + VDROPOUT, VDD is in regulation. Setting the ADC reference to VDD allows accurate ratiometric measurements. 2017 Microchip Technology Inc. DS20005750A-page 133 MCP19122/3 FIGURE 19-1: ADC BLOCK DIAGRAM RELEFF 001000 VIN/16 001001 INT_VREG 001010 VREF_REG 001011 E/A Output 001100 IAVE after S&H 001101 ISENSE after Ramp Comp 001110 IOUT w/ 6dB gain 001111 TEMP_SNS 010000 Band Gap Ref 010001 VREF_REP 010010 VOTUVLO Ref 010011 VOTOVLO Ref 010100 VINUVLO Ref 010101 VINOVLO Ref 010110 OC Ref MASTER ISENSE Input VBGR_REP 010111 GPA3 Buffered 011010 Internal Virtual GND 011011 ISENSE After S&H and Added Gain 011100 E/A Output After Clamp Raw ISENSE Error Amp Clamp Ref TRISTATE 011000 VCFG 011001 ADREF Pin 11 ADREF Pin 10 011101 011110 VDD 01 AVDD 00 011111 CHS5:CHS0 GPA0/AN0 000000 GPA1/AN1 000001 GPA2/AN2 000010 GPA3/AN3 000011 GPB1/AN4 000100 GPB2/AN5 000101 (MCP19123 Only) GPB4/AN6 000110 (MCP19123 Only) GPB5/AN7 000111 ADC 10 GO/DONE 10 ADON ADRESH ADRESL VSS CHS5:CHS0 DS20005750A-page 134 2017 Microchip Technology Inc. MCP19122/3 19.1 ADC Configuration When configuring and using the ADC, the following functions must be considered: * * * * * Port configuration Channel selection ADC conversion clock source Interrupt control Result formatting 19.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. Refer to Section 17.0 "I/O Ports" for more information. Note: 19.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION There are up to 30 channel selections available on the MCP19122 and 32 channel selections available on the MCP19123. See Figure 19-1 and Register 19-1 for channel information. 19.1.3 ADC CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ADCON1 register. There are five possible clock options: * * * * * FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (clock derived from internal oscillator with a divisor of 16) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11 TAD periods as shown in Figure 19-2. For a correct conversion, the appropriate TAD specification must be met. Refer to the A/D conversion requirements in Section 5.0 "Digital Electrical Characteristics" for more information. Table 19-1 gives examples of appropriate ADC clock selections. Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. TABLE 19-1: The CHS<4:0> bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 19.2 "ADC Operation" for more information. ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES Device Frequency (FOSC) ADC Clock Period (TAD) ADC Clock Source ADCS<2:0> 8 MHz FOSC/8 001 1.0 s(2) FOSC/16 101 2.0 s FOSC/32 010 4.0 s FOSC/64 110 8.0 s(3) FRC x11 2.0 - 6.0 s(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 4 s for VDD > 3.0V. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: The FRC clock source is only recommended if the conversion will be preformed during Sleep. 2017 Microchip Technology Inc. DS20005750A-page 135 MCP19122/3 FIGURE 19-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b3 b1 b2 b0 Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO/DONE bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. 19.1.4 INTERRUPTS This interrupt can be generated while the device is operating, or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 19.1.5 RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON0 register controls the output format. Figure 19-3 shows the output format. FIGURE 19-3: 10-BIT A/D CONVERSION RESULT FORMAT ADRESH (ADFM = 0) ADRESL MSB LSB bit 7 bit 0 bit 7 10-bit A/D Result (ADFM = 1) Unimplemented: Read as `0' MSB bit 7 Unimplemented: Read as `0' DS20005750A-page 136 bit 0 LSB bit 0 bit 7 bit 0 10-bit A/D Result 2017 Microchip Technology Inc. MCP19122/3 19.2 19.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a `1'. Setting the GO/ DONE bit of the ADCON0 register to a `1' will start the Analog-to-Digital conversion. Note: 19.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 19.2.4 "A/D Conversion Procedure". COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: * Clear the GO/DONE bit * Set the ADIF Interrupt Flag bit * Update the ADRESH:ADRESL registers with new conversion result 19.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete Analog-to-Digital conversion sample. Instead, the ADRESH:ADRESL register pair will retain the value of the previous conversion. Additionally, a two TAD delay is required before another acquisition can be initiated. Following the delay, an input acquisition is automatically started on the selected channel. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. 19.2.4 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: * Disable pin output driver (Refer to the TRIS register) * Configure pin as analog (Refer to the ANSEL register) Configure the ADC module: * Select ADC conversion clock * Select ADC input channel * Turn on ADC module Configure ADC interrupt (optional): * Clear ADC interrupt flag * Enable ADC interrupt * Enable peripheral interrupt * Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: * Polling the GO/DONE bit * Waiting for the ADC interrupt (interrupts enabled) Read ADC Result. Clear the ADC interrupt flag (required if interrupt is enabled). Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section 19.4 "A/D Acquisition Requirements". EXAMPLE 19-1: A/D CONVERSION ;This code block configures the ADC ;for polling, Frc clock and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL ADCON1 ; MOVLW B'01110000' ;Frc clock MOVWF ADCON1 ; BANKSEL TRISGPA ; BSF TRISGPA,0 ;Set GPA0 to input BANKSEL ANSELA ; BSF ANSELA,0 ;Set GPA0 to analog BANKSEL ADCON0 ; MOVLW B'01000001' ;Select channel AN0 MOVWF ADCON0 ;Turn ADC On CALL SampleTime ;Acquisiton delay BSF ADCON0,1 ;Start conversion BTFSC ADCON0,1 ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space 2017 Microchip Technology Inc. DS20005750A-page 137 MCP19122/3 19.3 ADC Register Definitions REGISTER 19-1: R/W-0 ADCON0: A/D CONTROL REGISTER 0 R/W-0 CHS5 CHS4 R/W-0 CHS3 R/W-0 CHS2 R/W-0 CHS1 R/W-0 CHS0 R/W-0 R/W-0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-2 CHS<5:0>: Analog Channel Select bits 000000 = GPA0 000001 = GPA1 000010 = GPA2 000011 = GPA3 000100 = GPB1 000101 = GPB2 000110 = GPB4(1) 000111 = GPB5(1) 001000 = RELEFF (see Section 3.11.6 "Relative Efficiency Ramp Measurement Control") 001001 = Ratio of input voltage (VIN/16) 001010 = Output voltage measured after differential amplifier 001011 = VREF_REG 001100 = Error amplifier output 001101 = Average current after Sample & Hold and gain trim 001110 = ISENSE signal after gain and slope compensation signal 001111 = Average output current with +6dB gain added 010000 = Internal temperature sensor 010001 = Band gap voltage reference 010010 = VREF_REP: Center of the two VOUT floating references 010011 = Output under voltage comparator reference 010100 = Output over voltage comparator reference 010101 = Input under voltage comparator reference 010110 = Input over voltage comparator reference 010111 = Over current reference 011000 = Master's current sense signal input (measured on Slave unit) 011001 = VBGR_REP: DAC reference voltage amplifier output 011010 = GPA3 Buffered 011011 = Internal virtual ground (~500mV) 011100 = RAWI after Sample & Hold and added gain, but before slope is added 011101 = E/A output after the clamp, input to the PWM comparator 011110 = Raw ISENSE (input to Sample & Hold) 011111 = Error Amplifier clamp reference level shifted by 500mV * 111111 = Unimplemented bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: Not implemented on MCP19122. DS20005750A-page 138 2017 Microchip Technology Inc. MCP19122/3 REGISTER 19-2: ADCON1: A/D CONTROL REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 -- ADCS2 ADCS1 ADCS0 -- ADFM VCFG1 VCFG0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 = Reserved 001 = FOSC/8 010 = FOSC/32 x11 = FRC (clock derived from internal oscillator with a divisor of 16) 100 = Reserved 101 = FOSC/16 110 = FOSC/64 bit 3 Unimplemented: Read as `0' bit 2 ADFM: A/D Result Format Select 1 = Right justified 0 = Left justified bit 1-0 VCFG<1:0>: A/D Voltage Reference bit 11 = ADREF pin 10 = ADREF pin 01 = Internal Vdd Reference 00 = Internal A/D Reference 2017 Microchip Technology Inc. x = Bit is unknown DS20005750A-page 139 MCP19122/3 REGISTER 19-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x -- -- -- -- -- -- ADRES9 ADRES8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-2 Unimplemented: Read as `0' bit 1-0 Note 1: x = Bit is unknown ADRES<9:8>: Most Significant A/D Results Only for ADFM = 1. REGISTER 19-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) R-x R-x R-x R-x R-x R-x R-x R-x ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 Note 1: x = Bit is unknown ADRES<7:0>: Least Significant A/D results Only for ADFM = 1. DS20005750A-page 140 2017 Microchip Technology Inc. MCP19122/3 19.4 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 19-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), refer to Figure 19-4. EQUATION 19-1: The maximum recommended impedance for analog sources is 10 k. As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 19-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Assumptions: Temperature = +50C and external impedance of 10 k 5.0V V DD T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2 s + T C + Temperature - 25C 0.05 s/C The value for TC can be approximated with the following equations: V 1 1 - ------------------------------ = V APPLIED CHOLD n+1 2 - 1 -T C ---------- RC VAPPLIED 1 - e = VCHOLD -T C ---------- RC 1 VAPPLIED 1 - e = VAPPLIED 1 - ------------------------------ n+1 2 - 1 ;[1] VCHOLD charged to within 1/2 lsb ;[2] VCHOLD charge response to VAPPLIED ;combining [1] and [2] Note: Where n = number of bits of the ADC. Solving for TC: T C = - C HOLD R IC + R SS + R S ln(1/2047) = - 10 pF 1 k + 7 k + 10 k ln(0.0004885) = 1.37 s Therefore: T ACQ = 2 s + 1.37s + 50C- 25C 0.05s/C = 4.67 s Note 1: The charge holding capacitor (CHOLD) is not discharged after each conversion. 2: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. 2017 Microchip Technology Inc. DS20005750A-page 141 MCP19122/3 FIGURE 19-4: ANALOG INPUT MODEL RS VA VDD Analog Input pin CPIN 5 pF Sampling Switch VT 0.6V RIC 1k VT 0.6V ILEAKAGE(1) SS RSS CHOLD = 10 pF VSS/VREF- 6V 5V VDD 4V 3V 2V Legend: CHOLD = Sample/Hold Capacitance CPIN = Input Capacitance ILEAKAGE = Leakage current at the pin due to various junctions RSS 5 6 7 8 91011 Sampling Switch (k) RIC = Interconnect Resistance RSS = Resistance of Sampling Switch SS = Sampling Switch VT = Threshold Voltage Note 1: Refer to Section 5.0 "Digital Electrical Characteristics". FIGURE 19-5: ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh 3FDh ADC Output Code 3FCh 3FBh 03h 02h 01h 00h Analog Input Voltage 0.5 LSB VREF- DS20005750A-page 142 Zero-Scale Transition 1.5 LSB Full-Scale Transition VREF+ 2017 Microchip Technology Inc. MCP19122/3 TABLE 19-2: Name SUMMARY OF REGISTERS ASSOCIATED WITH ADC Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ADCON0 -- CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 138 ADCON1 -- ADCS2 ADCS1 ADCS0 -- ADFM VCFG1 VCFG0 139 140 ADRESH -- -- -- -- -- -- ADRES9 ADRES8 ADRESL ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 140 ANSELA -- -- -- -- ANSA3 ANSA2 ANSA1 ANSA0 120 ANSELB -- -- ANSB5 ANSB4 -- ANSB2 ANSB1 -- 126 INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 102 -- ADIE BCLIE SSPIE -- -- TMR2IE TMR1IE 103 105 PIE1 PIR1 -- ADIF BCLIF SSPIF -- -- TMR2IF TMR1IF TRISGPA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 119 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 -- TRISB2 TRISB1 TRISB0 125 Legend: -- = unimplemented read as `0'. Shaded cells are not used for ADC module. 2017 Microchip Technology Inc. DS20005750A-page 143 MCP19122/3 NOTES: DS20005750A-page 144 2017 Microchip Technology Inc. MCP19122/3 20.0 FLASH PROGRAM MEMORY CONTROL The Flash program memory is readable and writable during normal operation (full VIN range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers (see Registers 20-1 to 20-5). There are six SFRs used to read and write this memory: * * * * * * PMCON1 PMCON2 PMDATL PMDATH PMADRL PMADRH When interfacing the program memory block, the PMDATL and PMDATH registers form a two-byte word, which holds the 14-bit data for read/write, and the PMADRL and PMADRH registers form a two-byte word, which holds the 13-bit address of the FLASH location being accessed. These devices have 4K words of program Flash with an address range from 0000h to 0FFFh. The program memory allows single-word read and a by four word write. A four-word write automatically erases the row of the location and writes the new data (erase before write). The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump rated to operate over the voltage range of the device for byte or word operations. 20.1 PMADRH and PMADRL Registers The PMADRH and PMADRL registers can address up to a maximum of 4K words of program memory. When selecting a program address value, the Most Significant Byte (MSB) of the address is written to the PMADRH register and the Least Significant Byte (LSB) is written to the PMADRL register. 20.2 PMCON1 and PMCON2 Registers PMCON1 is the control register for the data program memory accesses. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The CALSEL bit allows the user to read locations in test memory in case there are calibration bits stored in the calibration word locations that need to be transferred to SFR trim registers. The CALSEL bit is only for reads, and if a write operation is attempted with CALSEL = 1, no write will occur. PMCON2 is not a physical register. Reading PMCON2 will read all '0's. The PMCON2 register is used exclusively in the flash memory write sequence. When the device is code protected, the CPU may continue to read and write the Flash program memory. Depending on the settings of the Flash Program Memory Enable (WRT<1:0>) bits, the device may or may not be able to write certain blocks of the program memory, however, reads of the program memory are allowed. When the Flash Program Memory Code Protection (CP) bit is enabled, the program memory is code protected, and the device programmer (ICSP) cannot access data or program memory. 2017 Microchip Technology Inc. DS20005750A-page 145 MCP19122/3 20.3 Flash Program Memory Control Registers REGISTER 20-1: R/W-0 PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMDATL<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown PMDATL<7:0>: 8 Least Significant Data bits Read from Program Memory REGISTER 20-2: R/W-0 PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMADRL<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown PMADRL<7:0>: 8 Least Significant Address bits for Program Memory Read/Write Operation REGISTER 20-3: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMDATH<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as `0' bit 5-0 PMDATH<5:0>: 6 Most Significant Data bits Read from Program Memory DS20005750A-page 146 2017 Microchip Technology Inc. MCP19122/3 REGISTER 20-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER U-0 U-0 U-0 U-0 -- -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 PMADRH<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-4 Unimplemented: Read as `0' bit 3-0 PMADRH<3:0>: Specifies the 4 Most Significant Address bits or High bits for Program Memory Reads. REGISTER 20-5: PMCON1: PROGRAM MEMORY CONTROL REGISTER 1 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/S-0 R/S-0 -- CALSEL -- -- -- WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as '0' bit 6 CALSEL: Program Memory calibration space select bit 1 = Select test memory area for reads only, for loading calibration (excluding Configuration Word and Device ID) 0 = Select user area for reads bit 5-3 Unimplemented: Read as '0' bit 2 WREN: Program Memory Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the Flash Program Memory bit 1 WR: Write Control bit 1 = Initiates a write cycle to program memory. (The bit is cleared by hardware when write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the Flash memory is complete bit 0 RD: Read Control bit 1 = Initiates a program memory read. (The read takes one cycle. The RD is cleared in hardware; the RD bit can only be set (not cleared) in software). 0 = Does not initiate a Flash memory read 2017 Microchip Technology Inc. DS20005750A-page 147 MCP19122/3 20.3.1 READING THE FLASH PROGRAM MEMORY To read a program memory location, the user must write two bytes of the address to the PMADRL and PMADRH registers, and then set control bit RD (PMCON1<0>). Once the read control bit is set, the program memory Flash controller will use the second instruction cycle after to read the data. This causes the second instruction immediately following the "BSF PMCON1,RD" instruction to be ignored. The data is available, in the very next cycle, in the PMDATL and PMDATH registers; it can be read as two bytes in the following instructions. PMDATL and PMDATH registers will hold this value until another read or until it is written to by the user (during a write operation). EXAMPLE 20-1: FLASH PROGRAM READ BANKSELPM_ADR; Change STATUS bits RP1:0 to select bank with PMADR MOVLWMS_PROG_PM_ADDR; MOVWFPMADRH; MS Byte of Program Address to read MOVLWLS_PROG_PM_ADDR; MOVWFPMADRL; LS Byte of Program Address to read BANKSELPMCON1; Bank to containing PMCON1 BSF PMCON1, RD; EE Read NOP ; First instruction after BSF PMCON1,RD executes normally NOP ; Any instructions here are ignored as program ; memory is read in second cycle after BSF PMCON1,RD ; BANKSELPMDATL; Bank to containing PMADRL MOVFPMDATL, W; W = LS Byte of Program PMDATL MOVFPMDATH, W; W = MS Byte of Program PMDATL FIGURE 20-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION - NORMAL MODE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Flash ADDR PC Flash DATA PC + 1 INSTR (PC) PMADRH,PMADRL INSTR (PC + 1) PC+3 PC +3 PMDATH,PMDATL INSTR (PC - 1) BSF PMCON1,RD INSTR (PC + 1) Executed here Executed here Executed here PC + 4 PC + 5 INSTR (PC + 3) INSTR (PC + 4) NOP Executed here INSTR (PC + 3) Executed here INSTR (PC + 4) Executed here RD bit PMDATH PMDATL Register EERHLT DS20005750A-page 148 2017 Microchip Technology Inc. MCP19122/3 20.3.2 WRITING TO THE FLASH PROGRAM MEMORY A word of the Flash program memory may only be written to if the word is in an unprotected segment of memory, as defined in Section 11.1 "Configuration Bits" (bits WRT1:WRT0). Note: The write protect bits are used to protect the users' program from modification by the user's code. They have no effect when programming is performed by ICSP. The code-protect bits, when programmed for code protection, will prevent the program memory from being written via the ICSP interface. Flash program memory must be written in four-word blocks. See Figures 20-2 and 20-3 for more details. A block consists of four words with sequential addresses, with a lower boundary defined by an address, where PMADRL<1:0> = 00. All block writes to program memory are done as 16-word erase by four-word write operations. The write operation is edge-aligned and cannot occur across boundaries. To write program data, the WREN bit must be set and the data must first be loaded into the buffer registers (see Figure 20-2). This is accomplished by first writing the destination address to PMADRL and PMADRH, and then writing the data to PMDATL and PMDATH. After the address and data have been set, then the following sequence of events must be executed: 1. 2. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set the WR control bit of the PMCON1 register. All four buffer register locations should be written to with correct data. If less than four words are being written to in the block of four words, then a read from the program memory location(s) not being written to must be performed. This takes the data from the program memory location(s) not being written and loads it into the PMDATL and PMDATH registers. Then the sequence of events to transfer data to the buffer registers must be executed. To transfer data from the buffer registers to the program memory, the PMADRL and PMADRH must point to the last location in the four-word block (PMADRL<1:0> = 11). Then the following sequence of events must be executed: 1. 2. The user must follow the same specific sequence to initiate the write for each word in the program block, writing each program word in sequence (000, 001, 010, 011). When the write is performed on the last word (PMADRL<1:0> = 11), a block of 16 words is automatically erased and the content of the four-word buffer registers are written into the program memory. After the "BSF PMCON1,WR" instruction, the processor requires two cycles to set up the erase/write operation. The user must place two NOP instructions after the WR bit is set. Since data is being written to buffer registers, the writing of the first three words of the block appears to occur immediately. The processor will halt internal operation for the typical 2ms to write to the memory only when the PMADRL<3:0> = xx11. The halt time will be 4ms typical if the part is also erasing which only occurs if the PMADRL<3:0> = 0011. Refer to Figure 20-2 for a block diagram of the buffer registers and the control signals for test mode. 20.3.3 PROTECTION AGAINST SPURIOUS WRITE There are conditions when the device should not write to the program memory. To protect against spurious writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-up Timer (72 ms duration) prevents program memory writes. The write initiate sequence, and the WREN bit, help prevent an accidental write during a power glitch or software malfunction. 20.3.4 OPERATION DURING CODE PROTECT When the device is code protected, the CPU is able to read and write unscrambled data to the program memory. The test mode access is disabled. 20.3.5 OPERATION DURING WRITE PROTECT When the program memory is write protected, the CPU can read and execute from the program memory. The portions of program memory that are write protected can not be modified by the CPU using the PMCON registers. The write protection has no effect in ICSP mode. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set control bit WR of the PMCON1 register to begin the write operation. 2017 Microchip Technology Inc. DS20005750A-page 149 MCP19122/3 FIGURE 20-2: BLOCK WRITES TO 4K FLASH PROGRAM MEMORY 7 6 8 If at new row sixteen words of Flash are erased, then four buffers are transferred to Flash automatically after this word is written 14 14 14 5 0 07 PMDATH PMDATL First word of block to be written 14 PMADRL<1:0> = 00 PMADRL<1:0> = 01 Buffer Register PMADRL<1:0> = 10 Buffer Register PMADRL<1:0> = 11 Buffer Register Buffer Register Program Memory FIGURE 20-3: FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Flash ADDR PMADRH,PMADRL PC + 1 INSTR (PC) Flash DATA Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 INSTR (PC + 1) ignored read BSF PMCON1,WR INSTR (PC + 1) Executed here Executed here PMDATH,PMDATL Processor halted EE Write Time PC + 2 PC + 3 PC + 4 INSTR (PC+2) INSTR (PC+3) (INSTR (PC + 2) NOP INSTR (PC + 3) NOP Executed here Executed here Executed here Flash Memory Location WR bit PMWHLT DS20005750A-page 150 2017 Microchip Technology Inc. MCP19122/3 21.0 TIMER0 MODULE The Timer0 module is an 8-bit timer/counter with the following features: * * * * * 8-bit timer/counter register (TMR0) 8-bit prescaler (shared with Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow Figure 21-1 is a block diagram of the Timer0 module. FIGURE 21-1: BLOCK DIAGRAM OF THE TIMER0 FOSC/4 Data Bus 0 8 T0CKI 1 1 Sync 2 TCY TMR0 0 TMR0SE TMR0CS 8-bit Prescaler PSA Set Flag bit TMR0IF on Overflow Overflow to Timer1 8 PS<2:0> 21.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 21.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-Bit Timer mode is selected by clearing the T0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: 21.1.2 The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. 8-BIT COUNTER MODE 21.1.3 SOFTWARE PROGRAMMABLE PRESCALER A single software programmable prescaler is available for use with either Timer0 or the Watchdog Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit of the OPTION_REG register. To assign the prescaler to Timer0, the PSA bit must be cleared to `0'. There are 8 prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register will clear the prescaler. In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. The incrementing edge is determined by the T0SE bit of the OPTION_REG register. 8-Bit Counter mode using the T0CKI pin is selected by setting the T0CS bit in the OPTION_REG register to `1'. 2017 Microchip Technology Inc. DS20005750A-page 151 MCP19122/3 21.1.4 21.1.5 SWITCHING PRESCALER BETWEEN TIMER0 AND WDT MODULES The prescaler is shared between the Timer0 and the WDT. As a result of having the prescaler assigned to either Timer0 or the WDT, it is possible to generate an unintended device Reset when switching prescaler values. When changing the prescaler assignment from Timer0 to the WDT module, the instruction sequence shown in Example 21-1 must be executed. EXAMPLE 21-1: CHANGING PRESCALER (TIMER0 WDT) BANKSELTMR0 CLRWDT CLRFTMR0 ; ;Clear WDT ;Clear TMR0 and ;prescaler BANKSELOPTION_REG; BSF OPTION_REG,PSA;Select WDT CLRWDT ; ; MOVLWb'11111000';Mask prescaler ANDWFOPTION_REG,W;bits IORLWb'00000101';Set WDT prescaler MOVWFOPTION_REG;to 1:32 Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The T0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The T0IF bit can only be cleared in software. The Timer0 interrupt enable is the T0IE bit of the INTCON register. Note: 21.1.6 The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. USING TIMER0 WITH AN EXTERNAL CLOCK When Timer0 is in Counter mode, the synchronization of the T0CKI input and the Timer0 register is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, the high and low periods of the external clock source must meet the timing requirements as shown in Section 5.0 "Digital Electrical Characteristics". 21.1.7 When changing the prescaler assignment from the WDT to the Timer0 module, the following instruction sequence must be executed (see Example 21-2). EXAMPLE 21-2: TIMER0 INTERRUPT OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. CHANGING PRESCALER (WDT TIMER0) CLRWDT ;Clear WDT and ;prescaler BANKSEL OPTION_REG ; MOVLW b'11110000' ;Mask TMR0 select and ANDWF OPTION_REG,W ;prescaler bits IORLW b'00000011' ;Set prescale to 1:16 MOVWF OPTION_REG ; TABLE 21-1: Name INTCON OPTION_REG SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 102 RAUP INTEDG T0CS T0SE PSA PS2 PS1 PS0 TMR0 TRISGPA Timer0 Module Register TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 83 151* TRISA2 TRISA1 TRISA0 119 Legend: -- = Unimplemented locations, read as `0'. Shaded cells are not used by the Timer0 module. * Page provides register information. DS20005750A-page 152 2017 Microchip Technology Inc. MCP19122/3 22.0 * * * * * * * * TIMER1 MODULE WITH GATE CONTROL The Timer1 module is a 16-bit timer with the following features: * * * * * 16-bit timer/counter register pair (TMR1H:TMR1L) Two selectable internal clock sources 2-bit prescaler Synchronous or asynchronous operation Multiple Timer1 gate (count enable) sources FIGURE 22-1: Interrupt on overflow Time base for the Capture/Compare function Special Event Trigger (with CCD) Selectable Gate Source Polarity Gate Toggle mode Gate Single-pulse mode Gate Value Status Gate Event Interrupt Figure 22-1 is a block diagram of the Timer1 module. TIMER1 BLOCK DIAGRAM T1GSS<1:0> T1G1 From Timer0 Overflow T1G2 Output of UV Comparator T1GSPM 00 0 T1G_IN 01 0 Single Pulse Acq. Control 10 D Q CK R Q 11 1 1 Q1 D Q EN Interrupt T1GGO/DONE det T1GPOL TMR1ON T1GTM Data Bus RD T1GCON TMR1GIF TMR1GE TMR1ON TMR1(1) Set flag bit TMR1IF on Overflow T1GVAL TMR1H TMR1L R CCD Special Event Trigger EN Q D T1CLK TMR1CS FOSC Internal Clock 1 FOSC/4 Internal Clock 0 Prescaler 1, 2, 4, 8 2 T1CKPS<1:0> Note 1:Timer1 register increments on rising edge. 2017 Microchip Technology Inc. DS20005750A-page 153 MCP19122/3 22.1 Timer1 Operation 22.2 The Timer1 module is a 16-bit incrementing timer, which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the timer. The module is a timer and increments on every instruction cycle. Timer1 is enabled by configuring the TMR1ON and TMR1GE bits in the T1CON and T1GCON registers, respectively. Table 22-1 displays the Timer1 enable selections. TABLE 22-1: TIMER1 ENABLE SELECTIONS The TMR1CS bit of the T1CON register is used to select the clock source for Timer1. Table 22-2 displays the clock source selections. TABLE 22-2: TMR1CS 22.2.1 Timer1 Operation TMR1ON TMR1GE 0 0 Off 0 1 Off 1 0 Always On 1 1 Externally Enabled Clock Source Selection CLOCK SOURCE SELECTIONS Clock Source 1 8 MHz System Clock (FOSC) 0 2 MHz Instruction Clock (FOSC/4) INTERNAL CLOCK SOURCE When the internal clock source is selected, the TMR1H:TMR1L register pair will increment on multiples of FOSC or FOSC/4 as determined by the Timer1 prescaler. As an example, when the FOSC internal claok source is selected, the TIMER1 register value will increment by four counts every instruction clock cycle. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge (see Figure 22-2) after any one or more of the following conditions: * Timer1 enabled after POR Reset * Write to TMR1H or TMR1L * Timer1 is disabled * Timer1 is disabled (TMR1ON = 0) when T1CKI is high then Timer1 is enabled (TMR1ON=1) when T1CKI is low. DS20005750A-page 154 2017 Microchip Technology Inc. MCP19122/3 22.3 Timer1 Prescaler TABLE 22-4: Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 22.4 Timer1 Gate Timer1 can be configured to increment freely or the incrementing can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 gate increment enable. Timer1 gate can also be driven by multiple selectable sources. 22.4.1 TIMER1 GATE INCREMENT ENABLE The Timer1 gate is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 gate is configured using the T1GPOL bit of the T1GCON register. When Timer1 Gate (T1Gx) input is active, Timer1 will increment on the rising edge of the Timer1 clock source. When Timer1 gate input is inactive, no incrementing will occur and Timer1 will hold the current count. See Figure 22-3 for timing details. TABLE 22-3: TIMER1 GATE ENABLE SELECTIONS T1CLK T1GPOL T1Gx 0 0 Increments 0 1 Holds Count 1 0 Holds Count 1 1 Increments 22.4.2 Timer1 Operation TIMER1 GATE SOURCE SELECTION The Timer1 gate source can be selected from one of three different sources. Source selection is controlled by the T1GSS bits of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled by the T1GPOL bit of the T1GCON register. T1GSS TIMER1 GATE SOURCES Timer1 Gate Source 11 Output of UV Comparator 10 Timer1 Gate Pin T1G2 01 Overflow of Timer0 (TMR0 increments from FFh to 00h) 00 Timer1 Gate Pin T1G1 22.4.2.1 T1G1 Pin Gate Operation The GPBA3/T1G1 pin is one source for Timer1 gate control. It can be used to supply an external source to the Timer1 gate circuitry. 22.4.2.2 Timer0 Overflow Gate Operation When Timer0 increments from FFh to 00h, a low-tohigh pulse will automatically be generated and internally supplied to the Timer1 gate circuitry. 22.4.2.3 T1G2 Pin Gate Operation The GPB2/T1G2 pin is one source for the Timer1 gate control. It can be used to supply an external source to the Timer1 gate circuitry. 22.4.2.4 UV Comparator Output The output of the output under voltage comparator is one source for the Timer1 gate control. A low-to-high transition of the comparator output shall stop TIMER1. 22.4.3 TIMER1 GATE TOGGLE MODE When Timer1 Gate Toggle mode is enabled, it is possible to measure the full-cycle length of a Timer1 gate signal, as opposed to the duration of a single level pulse. The Timer1 gate source is routed through a flip-flop that changes state on every incrementing edge of the signal. See Figure 22-4 for timing details. Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. Note: 22.4.4 Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation. TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the 2017 Microchip Technology Inc. DS20005750A-page 155 MCP19122/3 pulse, the T1GGO/DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. In Compare mode, an event is triggered when the value CCxRH:CCxRL register pair matches the value in the TMR1H:TMR1L register pair. This event can be a Special Event Trigger. Clearing the T1GSPM bit of the T1GCON register will also clear the T1GGO/DONE bit. See Figure 22-5 for timing details. For more information, see Section 24.0, Dual Capture/ Compare (CCD) Module. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure 22-6 for timing details. 22.7 22.4.5 TIMER1 GATE VALUE STATUS When Timer1 gate value status is utilized, it is possible to read the most current level of the gate control value. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 22.4.6 TIMER1 GATE EVENT INTERRUPT When Timer1 gate event interrupt is enabled, it is possible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. CCD Special Event Trigger When the CCD is configured to trigger a special event, the trigger will clear the TMR1H:TMR1L register pair. This special event does not cause a Timer1 interrupt. The CCD module may still be configured to generate a CCD interrupt. In this mode of operation, the CCxRH:CCxRL register pair becomes the period register for Timer1. Timer1 should be clocked by FOSC/4 to utilize the Special Event Trigger. In the event that a write to TMR1H or TMR1L coincides with a Special Event Trigger from the CCD, the write will take precedence. For more information, see Section 24.2.3, Special Event Trigger. The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 22.5 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: * * * * TMR1ON bit of the T1CON register TMR1IE bit of the PIE1 register PEIE bit of the INTCON register GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. Note: 22.6 The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. CCD Capture/Compare Time Base The CCD module uses the TMR1H:TMR1L register pair as the time base when operating in Capture or Compare mode. In Capture mode, the value in the TMR1H:TMR1L register pair is copied into the CCxRH:CCxRL register pair on a configured event. DS20005750A-page 156 2017 Microchip Technology Inc. MCP19122/3 FIGURE 22-2: TIMER1 INCREMENTING EDGE T1CLK T1CLK TMR1 enabled Note 1: Arrows indicate counter increments. FIGURE 22-3: TIMER1 GATE COUNT ENABLE MODE TMR1GE T1GPOL T1G_IN T1CLK T1GVAL TIMER1 N 2017 Microchip Technology Inc. N+1 N+2 N+3 N+4 DS20005750A-page 157 MCP19122/3 FIGURE 22-4: TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM T1G_IN T1CLK T1GVAL TIMER1 N FIGURE 22-5: N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G T1G_IN T1CLK T1GVAL TIMER1 TMR1GIF DS20005750A-page 158 N Cleared by software N+1 N+2 Set by hardware on falling edge of T1GVAL Cleared by software 2017 Microchip Technology Inc. MCP19122/3 FIGURE 22-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G T1G_IN T1CLK T1GVAL TIMER1 TMR1GIF N Cleared by software 2017 Microchip Technology Inc. N+1 N+2 N+3 Set by hardware on falling edge of T1GVAL N+4 Cleared by software DS20005750A-page 159 MCP19122/3 22.8 Timer1 Control Registers REGISTER 22-1: T1CON: TIMER1 CONTROL REGISTER U-0 U-0 -- -- R/W-0 R/W-0 T1CKPS<1:0> U-0 U-0 R/W-0 R/W-0 -- -- TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3-2 Unimplemented: Read as `0' bit 1 TMR1CS: Timer1 Clock Source Select bits 1 = Timer1 clock source is 8 MHz system clock (FOSC) 0 = Timer1 clock source is 2 MHz instruction clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Clears Timer1 gate flip-flop DS20005750A-page 160 x = Bit is unknown 2017 Microchip Technology Inc. MCP19122/3 REGISTER 22-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-x TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL R/W-0 R/W-0 T1GSS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 incrementing is controlled by the Timer1 gate function 0 = Timer1 increments regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle mode bit 1 = Timer1 Gate Toggle mode is enabled. 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single Pulse mode bit 1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 Gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started This bit is automatically cleared when T1GSPM is cleared. bit 2 T1GVAL: Timer1 Gate Current State bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits 11 = UV Comparator Output 10 = Timer1 gate pin T1G2 01 = Timer0 overflow output 00 = Timer1 gate pin T1G1 2017 Microchip Technology Inc. DS20005750A-page 161 MCP19122/3 NOTES: DS20005750A-page 162 2017 Microchip Technology Inc. MCP19122/3 23.0 TIMER2 MODULE The Timer2 module is an 8-bit timer with the following features: * * * * 8-bit timer register (TMR2) 8-bit period register (PR2) Interrupt on TMR2 match with PR2 Software programmable prescaler (1:1, 1:4, 1:16) See Figure 23-1 for a block diagram of Timer2. 23.1 Timer2 Operation The clock input to the Timer2 module is the system clock (FOSC). The clock is fed into the Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:16. The output of the prescaler is then used to increment the TMR2 register. The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, TMR2 is reset to 00h on the next increment cycle. FIGURE 23-1: The match output of the Timer2/PR2 comparator is used to set the TMR2IF interrupt flag bit in the PIR1 register. The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to 00h and the PR2 register is set to FFh. Timer2 is turned on by setting the TMR2ON bit in the T2CON register to a `1'. Timer2 is turned off by clearing the TMR2ON bit to a `0'. The Timer2 prescaler is controlled by the T2CKPS bits in the T2CON register. The prescaler counter are cleared when: * A write to TMR2 occurs. * A write to T2CON occurs. * Any device Reset occurs (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset). Note: TMR2 is not cleared when T2CON is written. TIMER2 BLOCK DIAGRAM TMR2 Output FOSC Prescaler 1:1, 1:4, 1:8, 1:16 2 TMR2 Comparator Sets Flag bit TMR2IF Reset EQ T2CKPS<1:0> PR2 2017 Microchip Technology Inc. DS20005750A-page 163 MCP19122/3 23.2 Timer2 Control Register REGISTER 23-1: T2CON: TIMER2 CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 -- -- -- -- -- TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-3 Unimplemented: Read as `0' bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 10 = Prescaler is 8 11 = Prescaler is 16 TABLE 23-1: x = Bit is unknown SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 102 PIE1 -- ADIE BCLIE SSPIE -- -- TMR2IE TMR1IE 103 PIR1 -- ADIF BCLIF SSPIF -- -- TMR2IF TMR1IF 105 -- -- -- PR2 T2CON Timer2 Module Period Register TMR2 -- -- 163* TMR2ON T2CKPS1 T2CKPS0 Holding Register for the 8-bit TMR2 Time Base 164 163* Legend: -- = unimplemented read as `0'. Shaded cells are not used for Timer2 module. * Page provides register information. DS20005750A-page 164 2017 Microchip Technology Inc. MCP19122/3 24.0 DUAL CAPTURE/COMPARE (CCD) MODULE The Dual Capture/Compare module is a peripheral that allows the user to time and control different events. In Capture mode, the peripheral allows the timing of the duration of an event. The Compare mode allows the user to trigger an external event when a predetermined amount of time has expired. This module is only available in the MCP19123 device. 24.1 Every falling edge Every rising edge Every 4th rising edge Every 16th rising edge When a capture is made, the Interrupt Request Flag bit CCDxIF of the PIR2 register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCxRH:CCxRL register pair is read, the old captured value is overwritten by the new captured value. Figure 24-1 shows a simplified diagram of the Capture operation. 24.1.1 CCDX PIN CONFIGURATION In Capture mode, the CCDx pin should be configured as an input by setting the associated TRIS control bit. Note: SOFTWARE INTERRUPT MODE When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCDxIE interrupt enable bit of the PIE2 register clear to avoid false interrupts. Additionally, the user should clear the CCDxIF interrupt flag bit of the PIR2 register following any change in Operating mode. Note: Capture Mode Capture mode makes use of the 16-bit Timer1 resource. When an event occurs on the CCDx pin, the 16-bit CCxRH:CCxRL register pair captures and stores the 16-bit value of the TMR1H:TMR1L register pair, respectively. An event is defined as one of the following and is configured by the CCxM<3:0> bits of the CCDCON register: * * * * 24.1.2 24.1.3 Clocking Timer1 from the system clock (FOSC) should not be used in Capture mode. In order for Capture mode to recognize the trigger event on the CCDx pin, Timer1 must be clocked from the instruction clock (FOSC/4). CCP1 PRESCALER There are four prescaler settings specified by the CCxM<3:0> bits of the CCDCON register. Whenever the CCDx module is turned off, or the CCDx module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the CCDCON register before changing the prescaler. Example 24-1 demonstrates the code to perform this function. EXAMPLE 24-1: CHANGING BETWEEN CAPTURE PRESCALERS BANKSEL CCDCON CLRF MOVLW MOVWF ;Set Bank bits to point ;to CCDCON CCDCON ;Turn CCDx module off NEW_CAPT_PS ;Load the W reg with ;the new prescaler ;move value and CCDx ON CCDCON ;Load CCDCON with this ;value If the CCDx pin is configured as an output, a write to the port can cause a capture condition. FIGURE 24-1: Prescaler 1, 4, 16 CAPTURE MODE OPERATION BLOCK DIAGRAM Set Flag bit CCDxIF (PIR2 register) CCDx pin CCxRH and Edge Detect CCxRL Capture Enable TMR1H TMR1L CCxM<3:0> System Clock (FOSC) 2017 Microchip Technology Inc. DS20005750A-page 165 MCP19122/3 24.2 Compare Mode Compare mode makes use of the 16-bit Timer1 resource. The 16-bit value of the CCxRH:CCxRL register pair is constantly compared against the 16-bit value of the TMR1H:TMR1L register pair. When a match occurs, one of the following events can occur: * * * * * Toggle the CCDx output Set the CCDx output Clear the CCDx output Generate a Special Event Trigger Generate a Software Interrupt The Special Event Trigger output of the CCDx occurs immediately upon a match between the TMR1H, TMR1L register pair and the CCxRH, CCxRL register pair. The TMR1H, TMR1L register pair is not reset until the next rising edge of the Timer1 clock. The Special Event Trigger output starts an A/D conversion (if the A/ D module is enabled). This allows the CCxRH, CCxRL register pair to effectively provide a 16-bit programmable period register for Timer1. TABLE 24-1: The action on the pin is based on the value of the CCXM<3:0> control bits of the CCDCON register. At the same time, the interrupt flag CCDxIF bit is set. All Compare modes can generate an interrupt. Figure 24-2 shows a simplified diagram of the Compare operation. FIGURE 24-2: The CCD module does not assert control of the CCDx pin in this mode. COMPARE MODE OPERATION BLOCK DIAGRAM CCxM<3:0> Mode Select SPECIAL EVENT TRIGGER Device MCP19123 CCD1/CCD2 CCD1/CCD2 Refer to A/D Section for more information. Note 1: The Special Event Trigger from the CCD module does not set interrupt flag bit TMR1IF of the PIR1 register. 24.2.4 COMPARE DURING SLEEP The Compare mode is dependent upon the system clock (FOSC) for proper operation. Since FOSC is shut down during Sleep mode, the Compare mode will not function properly during Sleep. Set CCDxIF Interrupt Flag (PIR2) 4 CCxRH CCxRL CCDx Pin Q S R Output Logic Match TRIS Output Enable Comparator TMR1H TMR1L Special Event Trigger 24.2.1 CCDX PIN CONFIGURATION The user must configure the CCDx pin as an output by clearing the associated TRIS bit. Note: 24.2.2 Clearing the CCDCON register will force the CCDx compare output latch to the default low level. This is not the PORT I/O data latch. SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (CCxM<3:0> = 1010), the CCD module does not assert control of the CCDx pin (see the CCP1CON register). 24.2.3 SPECIAL EVENT TRIGGER When Special Event Trigger mode is chosen (CCxM<3:0> = 1011), the CCD module does the following: * Starts an ADC conversion if ADC is enabled DS20005750A-page 166 2017 Microchip Technology Inc. MCP19122/3 24.3 CCP Control Registers REGISTER 24-1: CCDCON: DUAL CAPTURE/COMPARE CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 CC2M3 CC2M2 CC2M1 CC2M0 CC1M3 CC1M2 CC1M1 CC1M0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset `1' = Bit is set `0' = Bit is cleared bit 7-4 CC2M<3:0>: Capture/Compare Register Set 2 Mode Select bits 00xx = Capture/Compare off (resets module) 0100 = Capture mode: every falling edge 0101 = Capture mode: every rising edge 0110 = Capture mode: every 4th rising edge 0111 = Capture mode: every 16th rising edge 1000 = Compare mode: set output on match (CC2IF bit is set) 1001 = Compare mode: clear output on match (CC2IF bit is set) 1010 = Compare mode: toggle output on match (CC2IF bit is set) 1011 = Reserved 11xx = Compare mode: generate software interrupt on match (CC2IF bit is set, CMP2 pin is unaffected and configured as an I/O port) 1111 = Compare mode: trigger special event (CC2IF bit is set; CCD2 does not rest TMR1 and starts an A/D conversion, if the A/D module is enabled. CMP2 pin is unaffected and configured as an I/O port). bit 3-0 CC1M<3:0>: Capture/Compare Register Set 1 Mode Select bits 00xx = Capture/Compare off (resets module) 0100 = Capture mode: every falling edge 0101 = Capture mode: every rising edge 0110 = Capture mode: every 4th rising edge 0111 = Capture mode: every 16th rising edge 1000 = Compare mode: set output on match (CC1IF bit is set) 1001 = Compare mode: clear output on match (CC1IF bit is set) 1010 = Compare mode: toggle output on match (CC1IF bit is set) 1011 = Reserved 11xx = Compare mode: generate software interrupt on match (CC1IF bit is set, CMP1 pin is unaffected and configured as an I/O port) 1111 = Compare mode: trigger special event (CC1IF bit is set; CCD1 does not rest TMR1 and starts an A/D conversion, if the A/D module is enabled. CMP1 pin is unaffected and configured as an I/O port). Note: When a Compare interrupt is set, the TMR1 is not rest. This is different than standard Microchip microcontroller operation. 2017 Microchip Technology Inc. DS20005750A-page 167 MCP19122/3 NOTES: DS20005750A-page 168 2017 Microchip Technology Inc. MCP19122/3 25.0 INTERNAL TEMPERATURE INDICATOR MODULE The MCP19122/3 is equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit's range of the operating temperature falls between -40C and +125C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. 25.1 Temperature Output The output of the circuit is measured using the internal analog-to-digital converter. Channel 10 is reserved for the temperature circuit output. Refer to Section 19.0 "Analog-to-Digital Converter (ADC) Module" for detailed information. The temperature of the silicon die can be calculated by the ADC measurement by using Equation 25-1. EQUATION 25-1: FIGURE 25-1: TEMPERATURE CIRCUIT DIAGRAM VDD SILICON DIE TEMPERATURE ADC READING - 305 TEMP_DIE = --------------------------------------------------------3.08mV/ C The 10-bit ADC value located at memory address 2089h can be used to obtain a more accurate reading of the silicon die. This factory stored ADC value is obtained by measuring the silicon die temperature with an ambient temperature of 25C (+/-5C). Equation 252 shows how to use this stored value. VOUT ADC MUX n CHS bits (ADCON0 register) 2017 Microchip Technology Inc. ADC EQUATION 25-2: USING CALWD 10 TO OBTAIN SILICON DIE TEMPERATURE ADC_READING(counts) - ADC25 C_READING (counts TEMP_DIE( C = -----------------------------------------------------------------------------------------------------------------------------------------------+ 25 C * 3(counts/ C DS20005750A-page 169 MCP19122/3 DS20005750A-page 170 2017 Microchip Technology Inc. MCP19122/3 26.0 ENHANCED PWM MODULE The PWM module implemented on the MCP19122/3 is a modified version of the Capture/Compare/PWM (CCP) module found in standard mid-range microcontrollers. The module only features the PWM module, which is slightly modified from standard midrange microcontrollers. In the MCP19122/3, the PWM module is used to generate the system clock or system oscillator. This system clock will control the MCP19122/3 switching frequency, as well as set the maximum allowable duty cycle. The PWM module does not continuously adjust the duty cycle to control the output voltage. This is accomplished by the analog control loop and associated circuitry. 26.1 Standard Pulse-Width Modulation (PWM) Mode The PWM module output signal is used to set the operating switching frequency and maximum allowable duty cycle of the MCP19122/3. The actual duty cycle on the HDRV and LDRV is controlled by the analog PWM control loop. However, this duty cycle cannot be greater than the value in the PWMRL register. There are two modes of operation that concern the system clock PWM signal. These modes are stand-alone (non-frequency synchronization) and frequency synchronization. 26.1.1 STAND-ALONE (NON-FREQUENCY SYNCHRONIZATION) MODE 26.1.2 SWITCHING FREQUENCY SYNCHRONIZATION MODE The MCP19122/3 can be programmed to be a switching frequency MASTER or SLAVE device. The MASTER device functions as described in Section 26.1.1 "Stand-Alone (Non-Frequency Synchronization) Mode" with the exception of the 8 MHz system clock also being applied to GPB3 and the synchronization signal applied to GPA1. A SLAVE device will receive the MASTER 8 MHz system clock on GPB3 and synchronization signal on GPA1. The synchronization signal will be ORed with the output of the TIMER2 module. This ORed signal will latch PWMRL into PWMRH and PWMPHL into PWMPHH. Figure 26-1 shows a simplified block diagram of the CCP module in PWM mode. The PWMPHL register allows for a phase shift to be added to the SLAVE system clock. It is desired to have the MCP19122/3 SLAVE devices system clock start point shifted by a programmed amount from the MASTER system clock. This SLAVE phase shift is specified by writing to the PWMPHL register. The SLAVE phase shift can be calculated by using the following equation. EQUATION 26-2: SLAVE PHASE SHIFT=PWMPHL*TOSC*(T2 PRESCALE VALUE) When the MCP19122/3 is running stand-alone, the PWM signal functions as the system clock. It is operating at the programmed switching frequency with a programmed maximum duty cycle (DCLOCK). The programmed maximum duty cycle is not adjusted on a cycle-by-cycle basis to control the MCP19122/3 system output. The required duty cycle (DBUCK) to control the output is adjusted by the MCP19122/3 analog control loop and associated circuitry. DCLOCK does, however, set the maximum allowable DBUCK. EQUATION 26-1: D BUCK 1 - D CLOCK 2017 Microchip Technology Inc. DS20005750A-page 171 MCP19122/3 FIGURE 26-1: SIMPLIFIED PWM BLOCK DIAGRAM PWMRL PWMPHL 8 8 PWMPHH (SLAVE) PWMRH (SLAVE) LATCH DATA LATCH DATA 8 8 Comparator Comparator 8 8 Q SYSTEM CLOCK RESET TIMER Comparator 8 8 PWMPHH + (PR2+1)/2 Shift Right 1 bit PWM OUTPUT CLKPIN_IN PR2 + 1 8 A PWM output (Figure 26-2) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period). FIGURE 26-2: S OSC 8 Comparator 8 Q 8 TMR2 (Note 1) 50% Period R NOTE 1: TIMER 2 should be clocked by FOSC (8MHz) 26.1.3 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following equation: EQUATION 26-3: Period PWM PERIOD=[(PR2)+1] x TOSC x (T2 PRESCALE VALUE) Duty Cycle TMR2 = PR2 + 1 TMR2 = PWMRH TMR2 = PR2 + 1 DS20005750A-page 172 When TMR2 is equal to PR2, the following two events occur on the next increment cycle: * TMR2 is cleared * The PWM duty cycle is latched from PWMRL into PWMRH 2017 Microchip Technology Inc. MCP19122/3 26.1.4 PWM DUTY CYCLE (DCLOCK) 26.2 The PWM duty cycle (DCLOCK) is specified by writing to the PWMRL register. Up to 8-bit resolution is available. The following equation is used to calculate the PWM duty cycle (DCLOCK): Operation during Sleep When the device is placed in Sleep, the allocated timer will not increment and the state of the module will not change. If the CLKPIN pin is driving a value, it will continue to drive that value. When the device wakes up, it will continue from this state. EQUATION 26-4: PWM DUTY CYCLE=PWMRL x TOSC x (T2 PRESCALE VALUE) The PWMRL bits can be written to at any time, but the duty cycle value is not latched into PWMRH until after a match between PR2 and TMR2 occurs. TABLE 26-1: Name T2CON SUMMARY OF REGISTERS ASSOCIATED WITH PWM MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 -- -- -- -- -- PR2 Bit 2 Bit 1 Bit 0 TMR2ON T2CKPS1 T2CKPS0 Register on Page 164 Timer2 Module Period Register 172* PWMRL PWM Register Low Byte 171* PWMPHL SLAVE Phase Shift Byte 171* Legend: -- = Unimplemented locations, read as `0'. Shaded cells are not used by Capture mode. * Page provides register information. 2017 Microchip Technology Inc. DS20005750A-page 173 MCP19122/3 NOTES: DS20005750A-page 174 2017 Microchip Technology Inc. MCP19122/3 27.0 27.1 The I2C interface supports the following modes and features: MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE * * * * * * * * * * * * * MSSP Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be Serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module in the MCP19122/3 only operates in Inter-Integrated Circuit (I2C) mode. Master mode Slave mode Byte NACKing (Slave mode) Limited Multi-Master support 7-bit and 10-bit addressing Start and Stop interrupts Interrupt masking Clock stretching Bus collision detection General call address matching Dual Address masking Address Hold and Data Hold modes Selectable SDA hold times Figure 27-1 is a block diagram of the I2C interface module in Master mode. Figure 27-2 is a diagram of the I2C interface module in Slave mode. FIGURE 27-1: MSSP BLOCK DIAGRAM (I2C MASTER MODE) Internal Data Bus Read [SSPxM 3:0] Write SSPBUF Baud rate generator (SSPADD) Shift Clock SDA SDA in Start bit, Stop bit, Acknowledge Generate (SSPCON2) SCL in Bus Collision 2017 Microchip Technology Inc. Start bit detect, Stop bit detect Write collision detect Clock arbitration State counter for end of XMIT/RCV Address Match detect Clock arbitrate/BCOL detect (Hold off clock source) Receive Enable (RCEN) SCL LSb Clock Cntl SSPSR MSb Set/Reset: S, P, SSPSTAT, WCOL, SSPxOV Reset SEN, PEN (SSPCON2) Set SSPIF, BCLIF DS20005750A-page 175 MCP19122/3 FIGURE 27-2: MSSP BLOCK DIAGRAM (I2C SLAVE MODE) Internal Data Bus Read Write SSPBUF Reg SCL If the requested slave exists on the bus, it will respond with an Acknowledge bit, otherwise known as an ACK. The master then continues in either Transmit mode or Receive mode and the slave continues in the complement, either in Receive mode or Transmit mode, respectively. Shift Clock SSPSR Reg SDA LSb MSb SSPMSK1 Reg Match Detect Addr Match SSPADD Reg Start and Stop bit Detect 27.2 To begin communication, a master device starts out in Master Transmit mode. The master device sends out a Start bit followed by the address byte of the slave it intends to communicate with. This is followed by a single Read/Write bit, which determines whether the master intends to transmit to or receive data from the slave device. Set, Reset S, P bits (SSPSTAT Reg) A Start bit is indicated by a high-to-low transition of the SDA line while the SCL line is held high. Address and data bytes are sent out Most Significant bit (MSb) first. The Read/Write bit is sent out as a logical one when the master intends to read data from the slave, and is sent out as a logical zero when it intends to write data to the slave. FIGURE 27-3: I2C MODE OVERVIEW VDD The Inter-Integrated Circuit Bus (I2C) is a multi-master serial data communication bus. Devices communicate in a master/slave environment, where the master devices initiate the communication. A Slave device is controlled through addressing. The I 2C bus specifies two signal connections: * Serial Clock (SCL) * Serial Data (SDA) Both the SCL and SDA connections are bidirectional open-drain lines, each requiring pull-up resistors for the supply voltage. Pulling the line to ground is considered a logical zero; letting the line float is considered a logical one. Figure 27-3 shows a typical connection between two devices configured as master and slave. The I2C bus can operate with one or more master devices and one or more slave devices. There are four potential modes of operation for a given device: * Master Transmit mode (master is transmitting data to a slave) * Master Receive mode (master is receiving data from a slave) * Slave Transmit mode (slave is transmitting data to a master) * Slave Receive mode (slave is receiving data from a master) DS20005750A-page 176 I2C MASTER/ SLAVE CONNECTION SCL SCL VDD Master Slave SDA SDA The Acknowledge bit (ACK) is an active-low signal that holds the SDA line low to indicate to the transmitter that the slave device has received the transmitted data and is ready to receive more. The transition of a data bit is always performed while the SCL line is held low. Transitions that occur while the SCL line is held high are used to indicate Start and Stop bits. If the master intends to write to the slave, it repeatedly sends out a byte of data, with the slave responding after each byte with an ACK bit. In this example, the master device is in Master Transmit mode and the slave is in Slave Receive mode. If the master intends to read from the slave, it repeatedly receives a byte of data from the slave and responds after each byte with an ACK bit. In this example, the master device is in Master Receive mode and the slave is Slave Transmit mode. 2017 Microchip Technology Inc. MCP19122/3 On the last byte of data communicated, the master device may end the transmission by sending a Stop bit. If the master device is in Receive mode, it sends the Stop bit in place of the last ACK bit. A Stop bit is indicated by a low-to-high transition of the SDA line while the SCL line is held high. In some cases, the master may want to maintain control of the bus and re-initiate another transmission. If so, the master device may send another Start bit in place of the Stop bit or last ACK bit when it is in Receive mode. The I2C bus specifies three message protocols: * Single message where a master writes data to a slave * Single message where a master reads data from a slave * Combined message where a master initiates a minimum of two writes, or two reads, or a combination of writes and reads, to one or more slaves When one device is transmitting a logical one, or letting the line float, and a second device is transmitting a logical zero, or holding the line low, the first device can detect that the line is not a logical one. This detection, when used on the SCL line, is called clock stretching. Clock stretching gives slave devices a mechanism to control the flow of data. When this detection is used on the SDA line, it is called arbitration. Arbitration ensures that there is only one master device communicating at any single time. 27.2.1 CLOCK STRETCHING When a slave device has not completed processing data, it can delay the transfer of more data through the process of Clock Stretching. An addressed slave device may hold the SCL clock line low after receiving or sending a bit, indicating that it is not yet ready to continue. The master that is communicating with the slave will attempt to raise the SCL line in order to transfer the next bit, but will detect that the clock line has not yet been released. Because the SCL connection is open-drain, the slave has the ability to hold that line low until it is ready to continue communicating. 27.2.2 ARBITRATION Each master device must monitor the bus for Start and Stop bits. If the device detects that the bus is busy, it cannot begin a new message until the bus returns to an idle state. However, two master devices may try to initiate a transmission at or about the same time. When this occurs, the process of arbitration begins. Each transmitter checks the level of the SDA data line and compares it to the level that it expects to find. The first transmitter to observe that the two levels don't match loses arbitration and must stop transmitting on the SDA line. For example, if one transmitter holds the SDA line to a logical one (lets it float) and a second transmitter holds it to a logical zero (pulls it low), the result is that the SDA line will be low. The first transmitter then observes that the level of the line is different than expected and concludes that another transmitter is communicating. The first transmitter to notice this difference is the one that loses arbitration and must stop driving the SDA line. If this transmitter is also a master device, it must also stop driving the SCL line. It then can monitor the lines for a Stop condition before trying to reissue its transmission. In the meantime, the other device that has not noticed any difference between the expected and actual levels on the SDA line continues with its original transmission. It can do so without any complications, because so far the transmission appears exactly as expected, with no other transmitter disturbing the message. Slave Transmit mode can also be arbitrated, when a master addresses multiple slaves, but this is less common. If two master devices are sending a message to two different slave devices at the address stage, the master sending the lower slave address always wins arbitration. When two master devices send messages to the same slave address, and addresses can sometimes refer to multiple slaves, the arbitration process must continue into the data stage. Arbitration usually occurs very rarely, but it is a necessary process for proper multi-master support. Clock stretching allows receivers that cannot keep up with a transmitter to control the flow of incoming data. 2017 Microchip Technology Inc. DS20005750A-page 177 MCP19122/3 27.3 I2C MODE OPERATION All MSSP I2C communication is byte-oriented and shifted out MSb first. Six SFR registers and two interrupt flags interface the module with the PIC microcontroller and with the user's software. Two pins, SDA and SCL, are exercised by the module to communicate with other external I2C devices. 27.3.1 BYTE FORMAT All communication in I2C is done in 9-bit segments. A byte is sent from a Master to a Slave or vice versa, followed by an Acknowledge bit sent back. After the 8th falling edge of the SCL line, the device outputting data on the SDA changes that pin to an input and reads in an acknowledge value on the next clock pulse. The clock signal, SCL, is provided by the master. Data is valid to change while the SCL signal is low, and sampled on the rising edge of the clock. Changes on the SDA line while the SCL line is high define special conditions on the bus, explained in the following sections. TABLE 27-1: 27.3.2 DEFINITION OF I2C TERMINOLOGY There is language and terminology in the description of I2C communication that have definitions specific to I2C. Such word usage is defined in Table 27-1 and may be used in the rest of this document without explanation. The information in this table was adapted from the Philips I2C specification. 27.3.3 SDA AND SCL PINS Selecting any I2C mode with the SSPEN bit set forces the SCL and SDA pins to be open-drain. These pins should be set by the user to inputs by setting the appropriate TRIS bits. Note: Data is tied to output zero when an I2C mode is enabled. 27.3.4 SDA HOLD TIME The hold time of the SDA pin is selected by the SDAHT bit in the SSPCON3 register. Hold time is the time SDA is held valid after the falling edge of SCL. Setting the SDAHT bit selects a longer 300 ns minimum hold time and may help on buses with large capacitance. I2C BUS TERMS Term Description Transmitter The device that shifts data out onto the bus Receiver The device that shifts data in from the bus Master The device that initiates a transfer, generates clock signals and terminates a transfer Slave The device addressed by the master Multi-Master A bus with more than one device that can initiate data transfers Arbitration Procedure to ensure that only one master at a time controls the bus. Winning arbitration ensures that the message is not corrupted. Synchronization Procedure to synchronize the clocks of two or more devices on the bus Idle No master is controlling the bus and both SDA and SCL lines are high Active Any time one or more master devices are controlling the bus Addressed Slave Slave device that has received a matching address and is actively being clocked by a master Matching Address Address byte that is clocked into a slave that matches the value stored in SSPADDx Write Request Slave receives a matching address with R/W bit clear and is ready to clock in data Read Request Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of the Slave. This data is the next and all following bytes until a Restart or Stop. Clock Stretching When a device on the bus holds SCL low to stall communication Bus Collision Any time the SDA line is sampled low by the module while it is outputting and expected high state DS20005750A-page 178 2017 Microchip Technology Inc. MCP19122/3 27.3.5 START CONDITION 27.3.7 2 RESTART CONDITION The I C specification defines a Start condition as a transition of SDA from a high state to a low state, while the SCL line is high. A Start condition is always generated by the master and signifies the transition of the bus from an Idle to an Active state. Figure 27-4 shows the wave forms for Start and Stop conditions. A Restart is valid any time that a Stop is valid. A master can issue a Restart if it wishes to hold the bus after terminating the current transfer. A Restart has the same effect on the slave that a Start would, resetting all slave logic and preparing it to clock in an address. The master may want to address the same or another slave. A bus collision can occur on a Start condition if the module samples the SDA line low before asserting it low. This does not conform to the I2C Specification that states no bus collision can occur on a Start. In 10-bit Addressing Slave mode, a Restart is required for the master to clock data out of the addressed slave. Once a slave has been fully addressed, matching both high and low address bytes, the master can issue a Restart and the high address byte with the R/W bit set. The slave logic will then hold the clock and prepare to clock out data. 27.3.6 STOP CONDITION A Stop condition is a transition of the SDA line from low-to-high state while the SCL line is high. After a full match with R/W clear in 10-bit mode, a prior match flag is set and maintained. Until a Stop condition, a high address with R/W clear or a high address match fails. Note: At least one SCL low time must appear before a Stop is valid. Therefore, if the SDA line goes low then high again while the SCL line stays high, only the Start condition is detected. 27.3.8 START/STOP CONDITION INTERRUPT MASKING The SCIE and PCIE bits in the SSPCON3 register can enable the generation of an interrupt in Slave modes that do not typically support this function. These bits will have no effect on slave modes where interrupt on Start and Stop detect are already enabled. FIGURE 27-4: I2C START AND STOP CONDITIONS SDA SCL S Start Condition FIGURE 27-5: P Change of Data Allowed Change of Data Allowed Stop Condition I2C RESTART CONDITION Sr Change of Data Allowed 2017 Microchip Technology Inc. Restart Condition Change of Data Allowed DS20005750A-page 179 MCP19122/3 27.3.9 ACKNOWLEDGE SEQUENCE th 27.4.2 2 The 9 SCL pulse for any transferred byte in I C is dedicated as an Acknowledge. It allows receiving devices to respond back to the transmitter by pulling the SDA line low. The transmitter must release control of the line during this time to shift in the response. The Acknowledge (ACK) is an active-low signal, pulling the SDA line low, indicating to the transmitter that the device has received the transmitted data and is ready to receive more. The result of an ACK is placed in the ACKSTAT bit in the SSPCON2 register. Slave software, when the AHEN and DHEN bits are set, allows the user to set the ACK value sent back to the transmitter. The ACKDT bit in the SSPCON2 register is set/cleared to determine the response. Slave hardware will generate an ACK response if the AHEN and DHEN bits in the SSPCON3 register are clear. There are certain conditions where an ACK will not be sent by the slave. If the BF bit in the SSPSTAT register or the SSPOV bit in the SSPCON1 register are set when a byte is received, the ACK will not be sent. When the module is addressed, after the 8th falling edge of SCL on the bus, the ACKTIM bit in the SSPCON3 register is set. The ACKTIM bit indicates the acknowledge time of the active bus. The ACKTIM status bit is only active when the AHEN or DHEN bits are enabled. 27.4 I2C SLAVE MODE OPERATION The MSSP Slave mode operates in one of the four modes selected in the SSPM bits in SSPCON1 register. The modes can be divided into 7-bit and 10-bit Addressing mode. 10-bit Addressing mode operates the same as 7-bit, with some additional overhead for handling the larger addresses. Modes with Start and Stop bit interrupts operate the same as the other modes, with SSPIF additionally getting set upon detection of a Start, Restart or Stop condition. 27.4.1 SLAVE MODE ADDRESSES The SSPADD register contains the Slave mode address. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the module goes idle and no indication is given to the software that anything happened. The SSPMSK1 register affects the address matching process. Refer to Section 27.4.10 "SSPMSK1 Register" for more information. DS20005750A-page 180 SECOND SLAVE MODE ADDRESS The SSPADD2 register contains a second 7-bit Slave mode address. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the module goes idle and no indication is given to the software that anything happened. The SSPMSK2 register affects the address matching process. Refer to Section 27.4.10 "SSPMSK1 Register" for more information. 27.4.2.1 I2C Slave 7-Bit Addressing Mode In 7-bit Addressing mode, the LSb of the received data byte is ignored when determining if there is an address match. 27.4.2.2 I2C Slave 10-Bit Addressing Mode In 10-bit Addressing mode, the first received byte is compared to the binary value of `1 1 1 1 0 A9 A8 0'. A9 and A8 are the two MSb of the 10-bit address and are stored in bits 2 and 1 in the SSPADD register. After the high byte has been acknowledged, the UA bit is set and SCL is held low until the user updates SSPADD with the low address. The low address byte is clocked in, and all 8 bits are compared to the low address value in SSPADD. Even if there is no address match, SSPIF and UA are set and SCL is held low until SSPADD is updated to receive a high byte again. When SSPADD is updated, the UA bit is cleared. This ensures the module is ready to receive the high address byte on the next communication. A high and low address match as a write request is required at the start of all 10-bit addressing communication. A transmission can be initiated by issuing a Restart once the slave is addressed, and clocking in the high address with the R/W bit set. The slave hardware will then acknowledge the read request and prepare to clock out data. This is only valid for a slave after it has received a complete high and low address-byte match. 27.4.3 SLAVE RECEPTION When the R/W bit of a matching received address byte is clear, the R/W bit in the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and acknowledged. When an overflow condition exists for a received address, then Not Acknowledge is given. An overflow condition is defined as either bit BF in the SSPSTAT register is set, or bit SSPOV in the SSPCON1 register is set. The BOEN bit in the SSPCON3 register modifies this operation. For more information, refer to Register 27-4. 2017 Microchip Technology Inc. MCP19122/3 An MSSP interrupt is generated for each transferred data byte. Flag bit SSPIF must be cleared by software. 27.4.3.2 When the SEN bit in the SSPCON2 register is set, SCL will be held low (clock stretch) following each received byte. The clock must be released by setting the CKP bit in the SSPCON1 register, except sometimes in 10-bit mode. Slave device reception with AHEN and DHEN set operates the same as without these options with extra interrupts and clock stretching added after the 8th falling edge of SCL. These additional interrupts allow the slave software to decide whether it wants the ACK to receive address or data byte, rather than the hardware. 27.4.3.1 7-Bit Addressing Reception This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 7-bit Addressing mode, including all decisions made by hardware or software and their effect on reception. Figures 27-5 and 27-6 are used as a visual reference for this description. This is a step-by-step process of what typically must be done to accomplish I2C communication. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Start bit detected. S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. Matching address with R/W bit clear is received. The slave pulls SDA low, sending an ACK to the master, and sets SSPIF bit. Software clears the SSPIF bit. Software reads received address from SSPBUF clearing the BF flag. If SEN = 1, Slave software sets CKP bit to release the SCL line. The master clocks out a data byte. Slave drives SDA low sending an ACK to the master, and sets SSPIF bit. Software clears SSPIF. Software reads the received byte from SSPBUF clearing BF. Steps 8-12 are repeated for all received bytes from the Master. Master sends Stop condition, setting P bit in the SSPSTAT register, and the bus goes idle. 2017 Microchip Technology Inc. 7-Bit Reception with AHEN and DHEN This list describes the steps that need to be taken by slave software to use these options for I2C communication. Figure 27-7 displays a module using both address and data holding. Figure 27-8 includes the operation with the SEN bit in the SSPCON2 register set. 1. S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. 2. Matching address with R/W bit clear is clocked in. SSPIF is set and CKP cleared after the 8th falling edge of SCL. 3. Slave clears the SSPIF. 4. Slave can look at the ACKTIM bit in the SSPCON3 register to determine if the SSPIF was after or before the ACK. 5. Slave reads the address value from SSPBUF, clearing the BF flag. 6. Slave sets ACK value clocked out to the master by setting ACKDT. 7. Slave releases the clock by setting CKP. 8. SSPxIF is set after an ACK, not after a NACK. 9. If SEN = 1 the slave hardware will stretch the clock after the ACK. 10. Slave clears SSPIF. Note: SSPIF is still set after the 9th falling edge of SCL even if there is no clock stretching and BF has been cleared. Only if NACK is sent to Master is SSPIF not set. 11. SSPIF set and CKP cleared after 8th falling edge of SCL for a received data byte. 12. Slave looks at ACKTIM bit in the SSPCON3 register to determine the source of the interrupt. 13. Slave reads the received data from SSPBUF clearing BF. 14. Steps 7-14 are the same for each received data byte. 15. Communication is ended by either the slave sending an ACK = 1 or the master sending a Stop condition. If a Stop is sent and Interrupt on Stop Detect is disabled, the slave will only know by polling the P bit in the SSPSTAT register. DS20005750A-page 181 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0) Bus Master sends Stop condition From Slave to Master Receiving Address SDA A7 A6 A5 A4 SCL S 1 2 3 4 Receiving Data A3 A2 A1 5 6 7 ACK 8 9 Receiving Data ACK = 1 D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 SSPIF Cleared by software BF SSPBUF is read SSPOV Cleared by software First byte of data is available in SSPBUF SSPOV set because SSPBUF is still full. ACK is not sent. 8 9 P SSPIF set on 9th falling edge of SCL MCP19122/3 DS20005750A-page 182 FIGURE 27-6: 2017 Microchip Technology Inc. 2017 Microchip Technology Inc. I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) FIGURE 27-7: Bus Master sends Stop condition Receive Address SDA SCL A7 A6 A5 A4 A3 A2 A1 S 1 2 3 4 5 6 7 R/W=0 8 9 Receive Data ACK Receive Data D7 D6 D5 D4 D3 D2 D1 D0 ACK SEN 1 2 3 4 5 6 7 8 Clock is held low until CKP is set to `1' 9 ACK D7 D6 D5 D4 D3 D2 D1 D0 SEN 1 2 3 4 5 6 7 8 SSPIF Cleared by software BF SSPBUF is read SSPOV Cleared by software 9 P SSPIF set on 9th falling edge of SCL First byte of data is available in SSPBUF SSPOV set because SSPBUF is still full. ACK is not sent. CKP CKP is written to `1' in software, releasing SCL CKP is written to `1' in software, releasing SCL DS20005750A-page 183 MCP19122/3 SCL is not held low because ACK = 1 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1) Master Releases SDAx to slave for ACK sequence Receiving Address SDA A7 A6 A5 A4 A3 A2 A1 Master sends Stop condition Receiving Data ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK Received Data ACK = 1 D7 D6 D5 D4 D3 D2 D1 D0 SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SSPIF If AHEN = 1, SSPIF is set BF ACKDT CKP Address is read from SSBUF ACKTIM ACKTIM set by hardware on 8th falling edge of SCL 2017 Microchip Technology Inc. P Cleared by software Data is read from SSPBUF Slave software clears ACKDT to ACK the received byte When AHEN = 1: CKP is cleared by hardware and SCL is stretched S SSPIF is set on 9th falling edge of SCL, after ACK Slave software sets ACKDT to not ACK When DHEN = 1: CKP is cleared by hardware on 8th falling edge of SCL ACKTIM cleared by hardware on 9th rising edge of SCL CKP set by software, SCL is released ACKTIM set by hardware on 8th falling edge of SCL No interrupt after not ACK from Slave MCP19122/3 DS20005750A-page 184 FIGURE 27-8: 2017 Microchip Technology Inc. I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1) FIGURE 27-9: R/W = 0 Receiving Address SDA A7 A6 A5 A4 A3 A2 A1 SCL S 1 2 3 4 5 6 7 Master sends Stop condition Master releases SDA to slave for ACK sequence Receive Data ACK D7 D6 D5 D4 D3 D2 D1 D0 8 9 1 2 3 4 5 6 7 8 ACK Receive Data D7 D6 D5 D4 D3 D2 D1 D0 9 1 2 3 4 5 6 7 8 SSPIF Received address is loaded into SSPBUF ACKDT Slave software clears ACKDT to ACK the received byte CKP When AHEN = 1: on the 8th falling edge of SCL of an address byte, CKP is cleared ACKTIM ACKTIM is set by hardware on 8th falling edge of SCL P SSPBUF can be read any time before next byte is loaded Slave sends not ACK When DHEN = 1: on the 8th falling edge of SCL of a received data byte, CKP is cleared Set by software, release SCL CKP is not cleared if not ACK ACKTIM is cleared by hardware on 9th rising edge of SCL DS20005750A-page 185 MCP19122/3 S Received data is available on SSPBUF P No interrupt after if not ACK from Slave Cleared by software BF 9 MCP19122/3 27.4.4 SLAVE TRANSMISSION 27.4.4.2 7-Bit Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit in the SSPSTAT register is set. The received address is loaded into the SSPBUF register and an ACK pulse is sent by the slave on the 9th bit. A master device can transmit a read request to a slave, and then it clocks data out of the slave. The list below outlines what software for a slave will need to do to accomplish a standard transmission. Figure 27-10 can be used as a reference to this list. Following the ACK, slave hardware clears the CKP bit and the SCL pin is held low. Refer to Section 27.4.7 "Clock Stretching" for more details. By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. 1. The transmit data must be loaded into the SSPBUF register, which also loads the SSPSR register. Then the SCL pin should be released by setting the CKP bit in the SSPCON1 register. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time. The ACK pulse from the master-receiver is latched on the rising edge of the 9th SCL input pulse. This ACK value is copied to the ACKSTAT bit in the SSPCON2 register. If ACKSTAT is set (not ACK), the data transfer is complete. In this case, when the not ACK is latched by the slave, the slave goes idle and waits for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, the SCL pin must be released by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared by software, and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the 9th clock pulse. 27.4.4.1 Slave Mode Bus Collision A slave receives a Read request and begins shifting data out on the SDA line. If a bus collision is detected and the SBCDE bit in the SSPCON3 register is set, the BCLIF bit in the PIR register is set. Once a bus collision is detected, the slave goes idle and waits to be addressed again. The user's software can use the BCLIF bit to handle a slave bus collision. DS20005750A-page 186 Master sends a Start condition on SDA and SCL. 2. S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. 3. Matching address with R/W bit set is received by the Slave setting SSPIF bit. 4. Slave hardware generates an ACK and sets SSPIF. 5. SSPIF bit is cleared by user. 6. Software reads the received address from SSPBUF, clearing BF. 7. R/W is set so CKP was automatically cleared after the ACK. 8. The slave software loads the transmit data into SSPBUF. 9. CKP bit is set releasing SCL, allowing the master to clock the data out of the slave. 10. SSPIF is set after the ACK response from the master is loaded into the ACKSTAT register. 11. SSPIF bit is cleared. 12. The slave software checks the ACKSTAT bit to see if the master wants to clock out more data. Note 1: If the master ACKs, the clock will be stretched. 2: ACKSTAT is the only bit updated on the rising edge of SCL (9th) rather than on the falling edge. 13. Steps 9-13 are repeated for each transmitted byte. 14. If the master sends a not ACK, the clock is not held but SSPIF is still set. 15. The master sends a Restart condition or a Stop. 16. The slave is no longer addressed. 2017 Microchip Technology Inc. 2017 Microchip Technology Inc. FIGURE 27-10: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0) Master sends Stop condition Receiving Address R/W = 1 Automatic Transmitting Data Automatic Transmitting Data ACK ACK A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SSPIF Cleared by software BF Received address is read from SSPBUF Data to transmit is loaded into SSPBUF BF is automatically cleared after 8th falling edge of SCL CKP ACKSTAT When R/W is set, SCL is always held low after 9th SCL falling edge Master's not ACK is copied to ACKSTAT R/W D/A R/W is copied from the matching address byte DS20005750A-page 187 P MCP19122/3 Indicates an address has been received S Set by software CKP is not held for not ACK MCP19122/3 27.4.4.3 7-Bit Transmission with Address Hold Enabled Setting the AHEN bit in the SSPCON3 register enables additional clock stretching and interrupt generation after the 8th falling edge of a received matching address. Once a matching address has been clocked in, CKP is cleared and the SSPIF interrupt is set. Figure 27-11 displays a standard waveform of a 7-bit Address Slave Transmission with AHEN enabled. 1. 2. Bus starts idle. Master sends Start condition; the S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. 3. Master sends matching address with R/W bit set. After the 8th falling edge of the SCL line, the CKP bit is cleared and SSPIF interrupt is generated. 4. Slave software clears SSPIF. 5. Slave software reads ACKTIM bit in the SSPCON3 register and R/W and D/A bits in the SSPSTAT register to determine the source of the interrupt. 6. Slave reads the address value from the SSPBUF register, clearing the BF bit. 7. Slave software decides from this information if it wishes to ACK or not ACK, and sets ACKDT bit in the SSPCON2 register accordingly. 8. Slave sets the CKP bit releasing SCL. 9. Master clocks in the ACK value from the slave. 10. Slave hardware automatically clears the CKP bit and sets SSPIF after the ACK if the R/W bit is set. 11. Slave software clears SSPIF. 12. Slave loads value to transmit to the master into SSPBUF setting the BF bit. Note: SSPBUF cannot be loaded until after the ACK. 13. Slave sets CKP bit releasing the clock. 14. Master clocks out the data from the slave and sends an ACK value on the 9th SCL pulse. 15. Slave hardware copies the ACK value into the ACKSTAT bit in the SSPCON2 register. 16. Steps 10-15 are repeated for each byte transmitted to the master from the slave. 17. If the master sends a not ACK, the slave releases the bus, allowing the master to send a Stop and end the communication. Note: Master must send a not ACK on the last byte to ensure that the slave releases the SCL line to receive a Stop. DS20005750A-page 188 2017 Microchip Technology Inc. 2017 Microchip Technology Inc. I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1) FIGURE 27-11: Master sends Stop condition Receiving Address R/W = 1 SDA SCL A7 A6 A5 A4 A3 A2 A1 S 1 2 3 4 5 6 7 8 9 SSPIF BF Automatic Transmitting Data Automatic Transmitting Data ACK ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Cleared by software Received address is read from SSPBUF Data to transmit is loaded into SSPBUF BF is automatically cleared after 8th falling edge of SCL ACKDT Slave clears ACKDT to ACK address ACKSTAT Master's ACK response is copied to SSPSTAT CKP ACKTIM DS20005750A-page 189 D/A ACKTIM is set on 8th falling edge of SCL When R/W = 1: CKP is always cleared after ACK Set by software, releases SCL ACKTIM is set on 9th rising edge of SCL CKP not cleared after not ACK MCP19122/3 R/W When AHEN = 1: CKP is cleared by hardware after receiving matching address. MCP19122/3 27.4.5 SLAVE MODE 10-BIT ADDRESS RECEPTION This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 10-bit Addressing mode. Figure 27-12 is used as a visual reference for this description. This is a step-by-step process of what must be done by slave software to accomplish I2C communication: 1. 2. 3. 4. 5. 6. 7. 8. Bus starts idle. Master sends Start condition; S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. Master sends matching high address with R/W bit clear; UA bit in the SSPSTAT register is set. Slave sends ACK and SSPIF is set. Software clears the SSPIF bit. Software reads received address from SSPBUF, clearing the BF flag. Slave loads low address into SSPADD, releasing SCL. Master sends matching low-address byte to the Slave; UA bit is set. 27.4.6 10-BIT ADDRESSING WITH ADDRESS OR DATA HOLD Reception using 10-bit addressing with AHEN or DHEN set is the same as with 7-bit modes. The only difference is the need to update the SSPADD register using the UA bit. All functionality, specifically when the CKP bit is cleared and the SCL line is held low, is the same. Figure 27-13 can be used as a reference of a slave in 10-bit addressing with AHEN set. Figure 27-14 shows a standard waveform for a slave transmitter in 10-bit Addressing mode. Note: Updates to the SSPADD register are not allowed until after the ACK sequence. 9. Slave sends ACK and SSPIF is set. Note: If the low address does not match, SSPIF and UA are still set so that the slave software can set SSPADD back to the high address. BF is not set because there is no match. CKP is unaffected. 10. Slave clears SSPIF. 11. Slave reads the received matching address from SSPBUF, clearing BF. 12. Slave loads high address into SSPADD. 13. Master clocks a data byte to the slave and clocks out the slave's ACK on the 9th SCL pulse; SSPIF is set. 14. If SEN bit in the SSPCON2 register is set, CKP is cleared by hardware and the clock is stretched. 15. Slave clears SSPIF. 16. Slave reads the received byte from SSPBUF, clearing BF. 17. If SEN is set, the slave sets CKP to release the SCL. 18. Steps 13-17 are repeated for each received byte. 19. Master sends Stop to end the transmission. DS20005750A-page 190 2017 Microchip Technology Inc. 2017 Microchip Technology Inc. I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) FIGURE 27-12: Master sends Stop condition Receive First Address Byte SDA S SSPIF BF UA ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK 1 1 1 1 0 A9 A8 SCL 1 2 3 4 5 6 7 Receive Data Receive Data Receive Second Address Byte 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SCL is held low while CKP = 0 Set by hardware on 9th falling edge Cleared by software Receive address is read from SSPBUF If address matches SSPADD, it is loaded into SSPBUF When UA = 1: SCL is held low Data is read from SSPBUF Software updates SSPADD and releases SCL CKP Set by software, releasing SCL DS20005750A-page 191 MCP19122/3 When SEN = 1: CKP is cleared after 9th falling edge of received byte Receive First Address Byte SDA SCL S 1 1 1 1 0 A9 A8 1 2 3 4 5 6 7 R/W = 0 Receive Second Address Byte ACK A7 A6 A5 A4 A3 A2 A1 A0 8 9 UA 1 2 3 4 5 6 7 8 Receive Data Receive Data ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 9 UA 1 2 3 4 5 6 7 8 9 1 2 SSPIF Set by hardware on 9th falling edge Cleared by software Cleared by software BF ACKDT Slave software clears ACKDT to ACK the received byte SSPBUF can be read anytime before the next received cycle Received data is read from SSPBUF UA Update to SSPADD is not allowed until 9th falling edge of SCL If when AHEN = 1: on the 8th falling edge of SCL of an address byte, CKP is ACKTIM cleared ACKTIM is set by hardware on 8th falling edge of SCL CKP Update of SSPADD, clears UA and releases SCL 2017 Microchip Technology Inc. Set CKP with software releases SCL MCP19122/3 DS20005750A-page 192 I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0) FIGURE 27-13: 2017 Microchip Technology Inc. FIGURE 27-14: I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0) Master sends Master sends Stop condition not ACK Master sends Restart event Receiving Address R/W = 0 Receiving Second Address Byte 1 1 1 1 0 A9 A8 ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK SDA SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 Receive First Address Byte 1 1 1 1 0 A9 A8 ACK 1 2 3 4 5 6 7 8 9 Transmitting Data Byte ACK = 1 D7 D6 D5 D4D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 Sr P SSPIF Set by hardware BF UA CKP Cleared by software Received address is read from SSPBUF SSPBUF loaded with received address UA indicates SSPADD must be updated ACKSTAT Set by hardware After SSPADD is updated. UA is cleared and SCL is released Data to transmit is loaded into SSPBUF High address is loaded back into SSPADD When R/W = 1: CKP is cleared on 9th falling edge of SCLx Set by software releases SCL Master's not ACK is copied R/W Indicates an address has been received DS20005750A-page 193 MCP19122/3 R/W is copied from the matching address byte D/A MCP19122/3 27.4.7 CLOCK STRETCHING 27.4.7.2 Clock stretching occurs when a device on the bus holds the SCL line low, effectively pausing communication. The slave may stretch the clock to allow more time to handle data or prepare a response for the master device. A master device is not concerned with stretching, as it is stretching anytime it is active on the bus and not transferring data. Any stretching done by a slave is invisible to the master software and handled by the hardware that generates SCL. The CKP bit in the SSPCON1 register is used to control stretching in software. Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. Setting CKP will release SCL and allow more communication. 27.4.7.1 Normal Clock Stretching Following an ACK, if the R/W bit in the SSPSTAT register is set, causing a read request, the slave hardware will clear CKP. This allows the slave time to update SSPBUF with data to transfer to the master. If the SEN bit in the SSPCON2 register is set, the slave hardware will always stretch the clock after the ACK sequence. Once the slave is ready, CKP is set by software and communication resumes. Note 1: The BF bit has no effect on whether the clock will be stretched or not. This is different than previous versions of the module that would not stretch the clock or clear CKP if SSPBUF was read before the 9th falling edge of SCL. 2: Previous versions of the module did not stretch the clock for a transmission if SSPBUF was loaded before the 9th falling edge of SCL. It is now always cleared for read requests. FIGURE 27-15: 10-Bit Addressing Mode In 10-bit Addressing mode, when the UA bit is set, the clock is always stretched. This is the only time the SCL is stretched without CKP being cleared. SCL is released immediately after a write to SSPADD. Note: 27.4.7.3 Previous versions of the module did not stretch the clock if the second address byte did not match. Byte NACKing When AHEN bit in the SSPCON3 register is set, CKP is cleared by hardware after the 8th falling edge of SCL for a received matching address byte. When DHEN bit in the SSPCON3 register is set, CKP is cleared after the 8th falling edge of SCL for received data. Stretching after the 8th falling edge of SCL allows the slave to look at the received address or data and decide if it wants to ACK the received data. 27.4.8 CLOCK SYNCHRONIZATION AND THE CKP BIT Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have released SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (refer to Figure 27-16). CLOCK SYNCHRONIZATION TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SDA DX DX - 1 SCL CKP Master device asserts clock Master device releases clock WR SSPCON1 DS20005750A-page 194 2017 Microchip Technology Inc. MCP19122/3 27.4.9 GENERAL CALL ADDRESS SUPPORT In 10-bit Address mode, the UA bit will not be set on the reception of the general call address. The slave will prepare to receive the second byte as data, just as it would in 7-bit mode. The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master device. The exception is the general call address, which can address all devices. When this address is used, all devices should, in theory, respond with an acknowledge. If the AHEN bit in the SSPCON3 register is set, just as with any other address reception, the slave hardware will stretch the clock after the 8th falling edge of SCL. The slave must then set its ACKDT value and release the clock with communication progressing as it would normally. The general call address is a reserved address in the I2C protocol, defined as address 0x00. When the GCEN bit in the SSPCON2 register is set, the slave module will automatically ACK the reception of this address regardless of the value stored in SSPADD. After the slave clocks in an address of all zeros with the R/W bit clear, an interrupt is generated and slave software can read SSPBUF and respond. Figure 27-17 shows a general call reception sequence. FIGURE 27-16: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE Address is compared to General Call Address after ACK, set interrupt Receiving Data ACK R/W = 0 ACK D7 D6 D5 D4 D3 D2 D1 D0 General Call Address SDA SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SSPIF BF (SSPSTAT<0>) GCEN (SSPCON2<7>) Cleared by software SSPBUF is read `1' 27.4.10 SSPMSK1 REGISTER An SSP Mask (SSPMSK1) register is available in I2C Slave mode as a mask for the value held in the SSPSR register during an address comparison operation. A zero (`0') bit in the SSPMSK1 register has the effect of making the corresponding bit of the received address a "don't care". This register is reset to all `1's upon any Reset condition and, therefore, has no effect on standard SSP operation until written with a mask value. The SSPMSK1 register is active during: * 7-bit Address mode: address compare of A<7:1>. * 10-bit Address mode: address compare of A<7:0> only. The SSP mask has no effect during the reception of the first (high) byte of the address. 2017 Microchip Technology Inc. DS20005750A-page 195 MCP19122/3 27.5 I2C MASTER MODE Master mode is enabled by setting and clearing the appropriate SSPM bits in the SSPCON1 register and by setting the SSPEN bit. In Master mode, the SDA and SCK pins must be configured as inputs. The MSSP peripheral hardware will override the output driver TRIS controls when necessary, to drive the pins low. The Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit is set or the bus is idle. In Firmware-Controlled Master mode, user code conducts all I 2C bus operations based on Start and Stop bit condition detection. Start and Stop condition detection is the only active circuitry in this mode. All other communication is done by the user's software directly manipulating the SDA and SCL lines. The following events will cause the SSP Interrupt Flag bit (SSPIF) to be set (SSP interrupt, if enabled): * * * * * Start condition detected Stop condition detected Data transfer byte transmitted/received Acknowledge transmitted/received Repeated Start generated Note 1: The MSSP module, when configured in I2C Master mode, does not allow queuing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. 2: When in Master mode, Start/Stop detection is masked and an interrupt is generated when the SEN/PEN bit is cleared and the generation is complete. DS20005750A-page 196 27.5.1 I2C MASTER MODE OPERATION The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer ends with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmit mode, serial data is output through SDA while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic `0'. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic `1'. Thus, the first byte transmitted is a 7-bit slave address followed by a `1' to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. A Baud Rate Generator is used to set the clock frequency output on SCL. Refer to Section 27.6 "Baud Rate Generator" for more details. 27.5.2 CLOCK ARBITRATION Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, releases the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 27-17). 2017 Microchip Technology Inc. MCP19122/3 FIGURE 27-17: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA DX DX - 1 SCL deasserted but slave holds SCL low (clock arbitration) SCL allowed to transition high SCL BGR decrements on Q2 and Q4 cycles BRG Value 03h 02h 01h 00h (hold off) 03h 02h SCL is sampled high, reload takes place and BRG starts its count BRG Reload 27.5.3 WCOL STATUS FLAG If the user writes the SSPBUF when a Start, Restart, Stop, Receive or Transmit sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write does not occur). Any time the WCOL bit is set, it indicates that an action on SSPBUF was attempted while the module was not idle. Note: 27.5.4 Because queuing of events is not allowed, writing to the lower 5 bits in the SSPCON2 register is disabled until the Start condition is complete. I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start Enable bit, SEN, in the SSPCON2 register. If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action FIGURE 27-18: of the SDA being driven low while SCL is high is the Start condition and causes the S bit in the SSPSTAT1 register to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit in the SSPCON2 register will be automatically cleared by hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. Note 1: If, at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if, during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2C module is reset into its idle state. 2: The Philips I2C Specification states that a bus collision cannot occur on a Start. FIRST START BIT TIMING Write to SEN bit occurs here Set S bit (SSPSTAT<3>) At completion of Start bit, SDA = 1, hardware clears SEN bit SCL = 1 and sets SSPIF bit TBRG TBRG SDA Write to SSPBUF occurs here 1st bit 2nd bit TBRG SCL S 2017 Microchip Technology Inc. TBRG DS20005750A-page 197 MCP19122/3 27.5.5 I2C MASTER MODE REPEATED START CONDITION TIMING Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. A Repeated Start condition occurs when the RSEN bit in the SSPCON2 register is programmed high and the Master state machine is no longer active. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. SCL is asserted low. Following this, the RSEN bit in the SSPCON2 register will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit in the SSPSTAT register will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. FIGURE 27-19: 2: A bus collision during the Repeated Start condition occurs if: *SDA is sampled low when SCL goes from low to high. *SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data `1'. REPEAT START CONDITION WAVEFORM Write to SSPCON2 occurs here SDA = 1, SCL (no change) S bit set by hardware At completion of Start bit, hardware clears RSEN bit and sets SSPIF SDA = 1, SCL = 1 TBRG TBRG TBRG 1st bit SDA Write to SSPBUF occurs here TBRG SCL Sr Repeated Start DS20005750A-page 198 TBRG 2017 Microchip Technology Inc. MCP19122/3 27.5.6 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full (BF) flag bit and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high. When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the 8th bit is shifted out (the falling edge of the 8th clock), the BF flag is cleared and the master releases the SDA. This allows the slave device being addressed to respond with an ACK bit during the 9th bit time if an address match occurred or if data was received properly. The status of ACK is written into the ACKSTAT bit on the rising edge of the 9th clock. If the master receives an Acknowledge, the Acknowledge Status bit (ACKSTAT) is cleared. If not, the bit is set. After the 9th clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 27-20). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the 8th clock, the master will release the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the 9th clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit in the SSPCON2 register. Following the falling edge of the 9th clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 27.5.6.1 27.5.6.2 If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write does not occur). WCOL must be cleared by software before the next transmission. 27.5.6.3 2017 Microchip Technology Inc. ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit in the SSPCON2 register is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call) or when the slave has properly received its data. 27.5.6.4 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. BF Status Flag In Transmit mode, the BF bit in the SSPSTAT register is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. WCOL Status Flag 12. 13. Typical Transmit Sequence: The user generates a Start condition by setting the SEN bit in the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. The MSSP module will wait the required start time before any other operation takes place. The user loads the SSPBUF with the slave address to transmit. Address is shifted out the SDA pin until all 8 bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit in the SSPCON2 register. The MSSP module generates an interrupt at the end of the 9th clock cycle by setting the SSPIF bit. The user loads the SSPBUF with 8 bits of data. Data is shifted out the SDA pin until all 8 bits are transmitted. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit in the SSPCON2 register. Steps 8-11 are repeated for all transmitted data bytes. The user generates a Stop or Restart condition by setting the PEN or RSEN bits in the SSPCON2 register. Interrupt is generated once the Stop/Restart condition is complete. DS20005750A-page 199 ACKSTAT in SSPCON2 = 1 Write SSPCON2<0> SEN = 1 From slave, clear ACKSTAT bit SSPCON2<6> Transmitting Data or Second Half of 10-bit Address Start condition begins SEN = 0 Transmit Address to Slave SDA A7 A6 A5 A4 A3 R/W = 0 A2 ACK = 0 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 SSPBUF written with 7-bit address and R/W start transmit SCL S 1 2 3 4 5 6 7 8 9 SCL held low while CPU responds to SSPIF 9 P SSPIF Cleared by software Cleared by software service routine from SSP interrupt BF (SSPSTAT<0>) SSPBUF written SEN After Start condition, SEN cleared by hardware 2017 Microchip Technology Inc. PEN R/W SSPBUF is written by software Cleared by software MCP19122/3 DS20005750A-page 200 I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) FIGURE 27-20: MCP19122/3 27.5.7 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable (RCEN) bit in the SSPCON2 register. 27.5.7.4 1. 2. Note: The MSSP module must be in an idle state before the RCEN bit is set or the RCEN bit will be disregarded. The Baud Rate Generator begins counting and, upon each rollover, the state of the SCL pin changes (high-to-low/low-to-high) and data is shifted into the SSPSR. After the falling edge of the 8th clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable (ACKEN) bit in the SSPCON2 register. 27.5.7.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 27.5.7.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 27.5.7.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). 2017 Microchip Technology Inc. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. Typical Receive Sequence: The user generates a Start condition by setting the SEN bit in the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. User writes SSPBUF with the slave address to transmit and the R/W bit set. Address is shifted out the SDA pin until all 8 bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit in the SSPCON2 register. The MSSP module generates an interrupt at the end of the 9th clock cycle by setting the SSPIF bit. User sets the RCEN bit in the SSPCON2 register and the Master clocks in a byte from the slave. After the 8th falling edge of SCL, SSPIF and BF are set. Master clears SSPIF and reads the received byte from SSPUF, then clears BF. Master sets ACK value sent to slave in ACKDT bit in the SSPCON2 register and initiates the ACK by setting the ACKEN bit. Masters ACK is clocked out to the Slave and SSPIF is set. The user clears SSPIF. Steps 8-13 are repeated for each received byte from the slave. Master sends a not ACK or Stop to end communication. DS20005750A-page 201 I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 Write to SSPCON2<0> (SEN = 1), ACK from Master begin Start condition Master configured as a receiver SDA = ACKDT = 0 SEN = 0 by programming SSPCON2<3> (RCEN = 1) Write to SSPBUF RCEN = 1, start RCEN cleared ACK from Slave occurs here, start XMIT next receive automatically A7 A6 A5 A4 A3 A2 A1 R/W ACK D7 D6 D5 D4 D3 D2 D1 RCEN cleared automatically PEN bit = 1 written here Receiving Data from Slave Receiving Data from Slave SDA Set ACKEN, start Acknowledge sequence SDA = ACKDT = 1 ACK D0 D7 D6 D5 D4 D3 D2 D1 D0 ACK ACK is not sent SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 9 8 SSPIF Cleared by software Cleared by software Cleared by software BF (SSPSTAT<0>) 2 3 4 5 6 7 8 9 Data shifted in on falling edge of CLK Set SSPIF Set SSPIF interrupt at end of receive at end of Acknowledge sequence Set SSPIF interrupt at end of receive SDA = 0, SCLx = 1 while CPU responds to SSPxIR 1 Cleared by software Cleared in software P Bus master terminates transfer Set SSPIF interrupt at end of Acknowledge sequence Set P bit (SSPSTAT<4>) and SSPIF Last bit is shifted into SSPSR and contents are unloaded into SSPBUF SSPOV SSPOV is set because SSPBUF is still full ACKEN 2017 Microchip Technology Inc. RCEN Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) RCEN cleared automatically ACK from Master SDA = ACKDT = 0 RCEN cleared automatically MCP19122/3 DS20005750A-page 202 FIGURE 27-21: MCP19122/3 27.5.8 ACKNOWLEDGE SEQUENCE TIMING 27.5.9 A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN, in the SSPCON2 register. At the end of a receive/transmit, the SCL line is held low after the falling edge of the 9th clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to `0'. When the Baud Rate Generator times out, the SCL pin will be brought high and then, one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit in the SSPSTAT register, is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 27-23). An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable (ACKEN) bit in the SSPCON2 register. When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 27-22). 27.5.8.1 STOP CONDITION TIMING 27.5.9.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, WCOL is set and the contents of the buffer are unchanged (the write does not occur). FIGURE 27-22: ACKNOWLEDGE SEQUENCE WAVEFORM Acknowledge sequence starts here, write to SSPCON2 ACKEN = 1, ACKDT = 0 SDA ACKEN automatically cleared SCL TBRG TBRG D0 ACK 8 9 SSPIF SSPIF set at the end of receive Note: TBRG = one Baud Rate Generator period. FIGURE 27-23: Cleared in software STOP CONDITION RECEIVE OR TRANSMIT MODE SCL = 1 for TBRG, followed by SDA = 1 for TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set Write to SSPCON2, set PEN Falling edge of 9th clock TBRG SCL SDA ACK TBRG Note: Cleared in software SSPIF set at the end of Acknowledge sequence P TBRG TBRG SCL brought high after TBRG TBRG = one Baud Rate Generator period. 2017 Microchip Technology Inc. DS20005750A-page 203 MCP19122/3 27.5.10 SLEEP OPERATION 27.5.13 2 While in Sleep mode, the I C slave module can receive addresses or data and, when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 27.5.11 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 27.5.12 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSPx module is disabled. Control of the I 2C bus may be taken when the P bit in the SSPSTAT register is set or the bus is idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed by hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: * * * * * Address Transfer Data Transfer A Start Condition A Repeated Start Condition An Acknowledge Condition MULTI-MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a `1' on SDA by letting SDA float high, and another master asserts a `0'. When the SCL pin floats high, data should be stable. If the expected data on SDA is a `1' and the data sampled on the SDA pin is `0', a bus collision has taken place. The master will set the Bus Collision Interrupt Flag (BCLIF) and reset the I2C port to its Idle state (Figure 27-24). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is idle and the S and P bits are cleared. FIGURE 27-24: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE Data changes while SCL = 0 SDA line pulled low Sample SDA. While SCL is high, by another source data does not match what is driven by the master. Bus collision has occurred. SDA released by master SDA SCL Set Bus Collision Interrupt (BCLIF) BCLIF DS20005750A-page 204 2017 Microchip Technology Inc. MCP19122/3 27.5.13.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) b) SDA or SCL are sampled low at the beginning of the Start condition (Figure 27-25) SCL is sampled low before SDA is asserted low (Figure 27-26) During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 27-27). If, however, a `1' is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to zero; if the SCL pin is sampled as `0' during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. Note: If the SDA pin is already low or the SCL pin is already low, all of the following occur: * the Start condition is aborted * the BCLIF flag is set and * the MSSP module is reset to its Idle state (Figure 27-25) The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded and counts down. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data `1' during the Start condition. FIGURE 27-25: The reason why bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. BUS COLLISION DURING A START CONDITION (SDA ONLY) SDA goes low before the SEN bit is set. Set BCLIF, S bit and SSPIF set because SDA = 0, SCL = 1. SDA SCL Set SEN, enable Start condition if SDA = 1, SCL = 1 SEN BCLIF SEN cleared automatically because of bus collision. SSP module reset into Idle state. SDA sampled low before Start condition. Set BCLIF. S bit and SSPIF set because SDA = 0, SCL = 1. SSPIF and BCLIF are cleared by software S SSPIF SSPIF and BCLIF are cleared by software 2017 Microchip Technology Inc. DS20005750A-page 205 MCP19122/3 FIGURE 27-26: BUS COLLISION DURING A START CONDITION (SCL = 0) SDA = 0, SCL = 1 TBRG TBRG SDA SCL Set SEN, enable Start sequence if SDA = 1, SCL = 1 SCL = 0 before SDA = 0, bus collision occurs. Set BCLIF. SEN SCL = 0 before BRG time out, bus collision occurs. Set BCLIF. BCLIF S `0' SSPIF `0' FIGURE 27-27: Interrupt cleared by software `0' `0' BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA = 0, SCL = 1 Set S Less than Tbrg T Set SSPIF BRG SDA SDA pulled low by other master. Reset BRG and assert SDAx. SCL s SCLx pulled low after BRG time out SEN BCLIF Set SEN, enable Start sequence if SDA = 1, SCL = 1 `0' S SSPIF DS20005750A-page 206 SDAx = 0, SCL = 1, set SSPIF Interrupts cleared by software 2017 Microchip Technology Inc. MCP19122/3 27.5.13.2 Bus Collision During a Repeated Start Condition If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data `0'; see Figure 27-28). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high to low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. During a Repeated Start condition, a bus collision occurs if: a) b) A low level is sampled on SDA when SCL goes from low level to high level SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data `1' If SCL goes from high to low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data `1' during the Repeated Start condition (refer to Figure 27-29). When the user releases SDA and the pin is allowed to float high, the BRG is loaded with SSPADD and counts down to zero. The SCL pin is then deasserted and, when sampled high, the SDA pin is sampled. FIGURE 27-28: If, at the end of the BRG time out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) SDA SCL Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. RSEN BCLIF Cleared by software `0' S `0' SSPIF FIGURE 27-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 2) TBRG TBRG SDA SCL BCLIF SCL goes low before SDA, set BCLIF. Release SDA and SCL. RSEN Interrupt cleared by software S `0' SSPIF `0' 2017 Microchip Technology Inc. DS20005750A-page 207 MCP19122/3 27.5.13.3 Bus Collision During a Stop Condition The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data `0' (Figure 27-30). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data `0' (Figure 27-31). Bus collision occurs during a Stop condition if: a) b) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. After the SCL pin is deasserted, SCL is sampled low before SDA goes high. FIGURE 27-30: BUS COLLISION DURING A STOP CONDITION (CASE 1) TBRG TBRG SDA sampled low after TBRG, set BCLIF TBRG SDA SCL SDA asserted low PEN BCLIF P `0' SSPIF `0' FIGURE 27-31: BUS COLLISION DURING A STOP CONDITION (CASE 2) TBRG SDA Assert SDA TBRG TBRG SCL goes low before SDA goes high, set BCLIF SCL PEN BCLIF P `0' SSPIF `0' DS20005750A-page 208 2017 Microchip Technology Inc. MCP19122/3 TABLE 27-2: SUMMARY OF REGISTERS ASSOCIATED WITH I2C OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page: INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 102 PIE1 TXIE RCIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 103 TXIF RCIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF 105 TRISGPA PIR1 TRISA7 TRISA6 TRISA5 -- TRISA3 TRISA2 TRISA1 TRISA0 119 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 -- -- TRISB1 TRISB0 125 SSPADD ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 215 WCOL SSPOV SSPEN CKP SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE SSPMSK1 MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 SSPSTAT SMP CKE D/A P S R/W SSPMSK2 MSK27 MSK26 MSK25 MSK24 MSK23 SSPADD2 ADD27 ADD26 ADD25 ADD24 ADD23 SSPBUF SSPCON1 Synchronous Serial Port Receive Buffer/Transmit Register SSPM3 SSPM2 175* SSPM1 SSPM0 212 RSEN SEN 213 AHEN DHEN 214 MSK1 MSK0 215 UA BF 211 MSK22 MSK21 MSK20 216 ADD22 ADD21 ADD20 216 Legend: -- = unimplemented, read as `0'. Shaded cells are not used by the MSSP module in I * Page provides register information. 2017 Microchip Technology Inc. 2C mode. DS20005750A-page 209 MCP19122/3 27.6 Baud Rate Generator The MSSP module has a Baud Rate Generator available for clock generation in the I2C Master mode. The Baud Rate Generator (BRG) reload value is placed in the SSPADD register. When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting down. Once the given operation is complete, the internal clock will automatically stop counting and the clock pin will remain in its last state. An internal signal "Reload" in Figure 27-32 triggers the value from SSPADD to be loaded into the BRG counter. This occurs twice for each oscillation of the module clock line. The logic dictating when the reload signal is asserted depends on the mode the MSSP is being operated in. Table 27-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. EQUATION 27-1: FOSC F CLOCK = --------------------------------------------- SSPADD + 1 4 FIGURE 27-32: BAUD RATE GENERATOR BLOCK DIAGRAM SSPM<3:0> SSPM<3:0> SCL Reload Control SSPCLK Note: Reload BRG Down Counter FOSC/2 Values of 0x00, 0x01 and 0x02 are not valid for SSPADD when used as a Baud Rate Generator for I2C. This is an implementation limitation. TABLE 27-3: Note 1: SSPADD<7:0> MSSP CLOCK RATE W/BRG FOSC FCY BRG Value FCLOCK (2 Rollovers of BRG) 8 MHz 2 MHz 04h 400 kHz(1) 8 MHz 2 MHz 0Bh 166 kHz 8 MHz 2 MHz 13h 100 kHz The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. DS20005750A-page 210 2017 Microchip Technology Inc. MCP19122/3 REGISTER 27-1: SSPSTAT: SSP STATUS REGISTER R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 SMP: Data Input Sample bit 1 = Slew rate control disabled for standard-speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high-speed mode (400 kHz) bit 6 CKE: Clock Edge Select bit 1 = Enable input logic so that thresholds are compliant with SM bus specification 0 = Disable SM bus specific inputs bit 5 D/A: Data/Address bit 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit (This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Stop bit has been detected last (this bit is `0' on Reset) 0 = Stop bit was not detected last bit 3 S: Start bit (This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Start bit has been detected last (this bit is `0' on Reset) 0 = Start bit was not detected last bit 2 R/W: Read/Write bit information This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit, or not ACK bit. In I2 C Slave mode: 1 = Read 0 = Write In I2 C Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode. bit 1 UA: Update Address bit (10-bit I2C mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full status bit Receive: 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Transmit: 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty 2017 Microchip Technology Inc. DS20005750A-page 211 MCP19122/3 REGISTER 27-2: SSPCON1: SSP CONTROL REGISTER 1 R/C/HS-0 R/C/HS-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP R/W-0 R/W-0 R/W-0 R/W-0 SSPM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n = Value at POR `1' = Bit is set `0' = Bit is cleared HS = Bit is set by hardware C = User cleared bit 7 WCOL: Write Collision Detect bit Master mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started 0 = No collision Slave mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) 1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a "don't care" in Transmit mode (must be cleared in software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit In both modes, when enabled, these pins must be properly configured as input or output 1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins(2) 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit In I2 C Slave mode: SCL release control 1 = Enable clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In I2 C Master mode: Unused in this mode bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits 0000 = Reserved 0001 = Reserved 0010 = Reserved 0011 = Reserved 0100 = Reserved 0101 = Reserved 0110 = I2C Slave mode, 7-bit address 0111 = I2C Slave mode, 10-bit address 1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD+1))(3) 1001 = Reserved 1010 = Reserved 1011 = I2C Firmware-Controlled Master mode (Slave idle) 1100 = Reserved 1101 = Reserved 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled Note 1: 2: 3: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, the SDA and SCL pins must be configured as inputs. SSPADD values of 0, 1 or 2 are not supported for I2C mode. DS20005750A-page 212 2017 Microchip Technology Inc. MCP19122/3 REGISTER 27-3: SSPCON2: SSP CONTROL REGISTER 2 R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared H = Bit is set by hardware S = User set bit 7 GCEN: General Call Enable bit (in I2C Slave mode only) 1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR register 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only) 1 = Acknowledge was not received 0 = Acknowledge was received bit 5 ACKDT: Acknowledge Data bit (in I2C mode only) In Receive mode: Value transmitted when the user initiates an Acknowledge sequence at the end of a receive 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only) In Master Receive mode: 1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence idle bit 3 RCEN: Receive Enable bit (in I2C Master mode only) 1 = Enables Receive mode for I2C 0 = Receive idle bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only) SCK Release Control: 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition idle bit 1 RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition idle bit 0 SEN: Start Condition Enabled bit (in I2C Master mode only) In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition idle In Slave mode: 1 = Clock stretching is enabled for both Slave Transmit and Slave Receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). 2017 Microchip Technology Inc. DS20005750A-page 213 MCP19122/3 REGISTER 27-4: SSPCON3: SSP CONTROL REGISTER 3 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets `1' = Bit is set `0' = Bit is cleared bit 7 ACKTIM: Acknowledge Time status bit (I2C mode only)(2) 1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8th falling edge of SCL clock 0 = Not an Acknowledge sequence, cleared on 9th rising edge of SCL clock bit 6 PCIE: Stop Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are disabled(1) bit 5 SCIE: Start Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Start or Restart conditions 0 = Start detection interrupts are disabled(1) bit 4 BOEN: Buffer Overwrite Enable bit In I2C Master mode: This bit is ignored. In I2C Slave mode: 1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state of the SSPOV bit only if the BF bit = 0. 0 = SSPBUF is only updated when SSPOV is clear. bit 3 SDAHT: SDA Hold Time Selection bit 1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL 0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only) If, on the rising edge of SCL, SDA is sampled low when the module outputs a high state, the BCLIF bit in the PIR1 register is set and bus goes idle. 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts are disabled bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit in the SSPCON1 register will be cleared and the SCL will be held low. 0 = Address holding is disabled bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit in the SSPCON1 register and SCL is held low. 0 = Data holding is disabled Note 1: 2: This bit has no effect in Slave modes where Start and Stop condition detection is explicitly listed as enabled. The ACKTIM status bit is only active when the AHEN bit or DHEN bit is set. DS20005750A-page 214 2017 Microchip Technology Inc. MCP19122/3 REGISTER 27-5: R/W-1 SSPMSK1: SSP MASK REGISTER 1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 MSK<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-1 MSK<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 27-6: R/W-0 SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADD<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n = Value at POR `1' = Bit is set `0' = Bit is cleared Master mode: bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) * 4)/FOSC 10-Bit Slave mode -- Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a "don't care". Bit pattern sent by master is fixed by I2C specification and must be equal to `11110'. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address. bit 0 Not used: Unused in this mode. Bit state is a "don't care". 10-Bit Slave mode -- Least Significant Address byte: bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a "don't care". 2017 Microchip Technology Inc. DS20005750A-page 215 MCP19122/3 REGISTER 27-7: R/W-1 SSPMSK2: SSP MASK REGISTER 2 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 MSK2<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-1 MSK2<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD2<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK2<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD2<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 27-8: R/W-0 SSPADD2: MSSP ADDRESS 2 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADD2<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' u = Bit is unchanged x = Bit is unknown -n = Value at POR `1' = Bit is set `0' = Bit is cleared Master mode: bit 7-0 ADD2<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) * 4)/FOSC 10-Bit Slave mode -- Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a "don't care". Bit pattern sent by master is fixed by I2C specification and must be equal to `11110'. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD2<2:1>: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a "don't care". 10-Bit Slave mode -- Least Significant Address byte: bit 7-0 ADD2<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD2<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a "don't care". DS20005750A-page 216 2017 Microchip Technology Inc. MCP19122/3 28.0 INSTRUCTION SET SUMMARY The MCP19122/3 instruction set is highly orthogonal and comprises three basic categories: * Byte-oriented operations * Bit-oriented operations * Literal and control operations Each instruction is a 14-bit word divided into an opcode, which specifies the instruction type, and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 28-1, while the various opcode fields are summarized in Table 28-1. Table 28-2 lists the instructions recognized by the MPASMTM assembler. For byte-oriented instructions, `f' represents a file register designator and `d' represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If `d' is zero, the result is placed in the W register. If `d' is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, `b' represents a bit field designator, which selects the bit affected by the operation, while `f' represents the address of the file in which the bit is located. For literal and control operations, `k' represents an 8-bit or 11-bit constant, or literal value. One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 s. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as a NOP. TABLE 28-1: OPCODE FIELD DESCRIPTIONS Field f Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don't care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-Out bit C DC Z PD Carry bit Digit carry bit Zero bit Power-Down bit FIGURE 28-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-Oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-Oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address All instruction examples use the format `0xhh' to represent a hexadecimal number, where `h' signifies a hexadecimal digit. Literal and control operations 28.1 Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (RMW) operation. The register is read, the data is modified, and the result is stored according to either the instruction or the destination designator `d'. A read operation is performed on a register even if the instruction writes to that register. For example, a CLRF PORTA instruction will read PORTGPA, clear all the data bits, then write the result back to PORTGPA. This example would have the unintended consequence of clearing the condition that set the IOCF flag. 2017 Microchip Technology Inc. General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value DS20005750A-page 217 MCP19122/3 TABLE 28-2: MCP19122/3 INSTRUCTION SET 14-Bit Opcode Mnemonic, Operands Description Cycles MSb LSb Status Notes Affected BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f - f, d f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff 1, 2 ffff C, DC, Z Z 1, 2 ffff Z 2 ffff Z xxxx ffff Z 1, 2 ffff Z 1, 2 ffff 1, 2, 3 ffff Z 1, 2 ffff 1, 2, 3 ffff Z 1, 2 ffff Z 1, 2 ffff 0000 ffff C 1, 2 ffff C 1, 2 ffff C, DC, Z 1, 2 ffff 1, 2 ffff Z 1, 2 bfff bfff bfff bfff ffff ffff ffff ffff kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk C, DC, Z kkkk Z kkkk 0100 TO, PD kkkk Z kkkk kkkk 1001 kkkk 1000 0011 TO, PD kkkk C, DC, Z Z kkkk BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb 1, 2 1, 2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW Note 1: 2: 3: k k k - k k k - k - - k k Add literal and W AND literal with W Call Subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that value present on the pins themselves. For example, if the data latch is `1' for a pin configured as input and is driven low by an external device, the data will be written back with a `0'. If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. DS20005750A-page 218 2017 Microchip Technology Inc. MCP19122/3 28.2 Instruction Descriptions ADDLW Add literal and W Syntax: [ label ] ADDLW Operands: 0 k 255 Operation: (W) + k (W) Status Affected: Description: BCF k Bit Clear f Syntax: [ label ] BCF Operands: 0 f 127 0b7 C, DC, Z Operation: 0 (f<b>) The contents of the W register are added to the eight-bit literal `k' and the result is placed in the W register. Status Affected: None Description: Bit `b' in register `f' is cleared. ADDWF Add W and f BSF Bit Set f Syntax: [ label ] ADDWF Syntax: [ label ] BSF Operands: 0 f 127 d 0,1 Operands: 0 f 127 0b7 Operation: (W) + (f) (destination) Operation: 1 (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. Description: Bit `b' in register `f' is set. ANDLW AND literal with W BTFSC Bit Test f, Skip if Clear Syntax: [ label ] ANDLW Syntax: [ label ] BTFSC f,b Operands: 0 k 255 Operands: Operation: (W) .AND. (k) (W) 0 f 127 0b7 Status Affected: Z Operation: skip if (f<b>) = 0 Description: The contents of W register are AND'ed with the eight-bit literal `k'. The result is placed in the W register. Status Affected: None Description: ANDWF AND W with f If bit `b' in register `f' is `1', the next instruction is executed. If bit `b' in register `f' is `0', the next instruction is discarded, and a NOP is executed instead, making this a two-cycle instruction. Syntax: [ label ] ANDWF Operands: 0 f 127 d 0,1 Operation: (W) .AND. (f) (destination) Status Affected: Z Description: AND the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. 2017 Microchip Technology Inc. f,d k f,b f,b f,d DS20005750A-page 219 MCP19122/3 BTFSS Bit Test f, Skip if Set CLRWDT Clear Watchdog Timer Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRWDT Operands: 0 f 127 0b<7 Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. Operation: skip if (f<b>) = 1 Status Affected: None Description: If bit `b' in register `f' is `0', the next instruction is executed. If bit `b' is `1', then the next instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. CALL Call Subroutine COMF Complement f Syntax: [ label ] CALL k Syntax: [ label ] COMF Operands: 0 k 2047 Operands: Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> 0 f 127 d [0,1] Operation: (f) (destination) Status Affected: Z Status Affected: None Description: Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The 11-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. The contents of register `f' are complemented. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. CLRF Clear f DECF Decrement f Syntax: [ label ] CLRF Syntax: [ label ] DECF f,d Operands: 0 f 127 Operands: Operation: 00h (f) 1Z 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Status Affected: Z Description: The contents of register `f' are cleared and the Z bit is set. Description: Decrement register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h (W) 1Z f Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. DS20005750A-page 220 f,d 2017 Microchip Technology Inc. MCP19122/3 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register `f' are decremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. If the result is `1', the next instruction is executed. If the result is `0', then a NOP is executed instead, making it a two-cycle instruction. Description: The contents of register `f' are incremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. If the result is `1', the next instruction is executed. If the result is `0', a NOP is executed instead, making it a two-cycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 k 2047 Operands: 0 k 255 Operation: k PC<10:0> PCLATH<4:3> PC<12:11> Operation: (W) .OR. k (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. The contents of the W register are OR'ed with the 8-bit literal `k'. The result is placed in the W register. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Operation: (W) .OR. (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register `f' are incremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. Description: Inclusive OR the W register with register `f'. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. GOTO k INCF f,d 2017 Microchip Technology Inc. INCFSZ f,d IORLW k IORWF f,d DS20005750A-page 221 MCP19122/3 MOVF Move f Syntax: [ label ] Operands: 0 f 127 d [0,1] MOVF f,d Operation: (f) (dest) Status Affected: Z Description: The contents of register `f' is moved to a destination dependent upon the status of `d'. If d = 0, destination is W register. If d = 1, the destination is file register `f' itself. d = 1 is useful to test a file register since Status flag Z is affected. Words: 1 Cycles: 1 Example: MOVF MOVWF Move W to f Syntax: [ label ] MOVWF f Operands: 0 f 127 Operation: (W) (f) Status Affected: None Description: Move data from W register to register `f'. Words: 1 Cycles: 1 Example: MOVW F OPTION Before Instruction OPTION = W = After Instruction OPTION = W = FSR, 0 0xFF 0x4F 0x4F 0x4F After Instruction W = value in FSR register Z = 1 NOP No Operation Move literal to W Syntax: [ label ] Syntax: [ label ] Operands: None Operands: 0 k 255 Operation: No operation Operation: k (W) Status Affected: None Status Affected: None Description: No operation. Description: The eight-bit literal `k' is loaded into W register. The "don't cares" will assemble as `0's. Words: 1 Cycles: 1 MOVLW Words: 1 Cycles: 1 Example: MOVLW MOVLW k NOP 0x5A After Instruction W = DS20005750A-page 222 Example: NOP 0x5A 2017 Microchip Technology Inc. MCP19122/3 RETFIE Return from Interrupt RETLW Return with literal in W Syntax: [ label ] Syntax: [ label ] RETFIE RETLW k Operands: None Operands: 0 k 255 Operation: TOS PC, 1 GIE Operation: k (W); TOS PC Status Affected: None Status Affected: None Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a twocycle instruction. Description: The W register is loaded with the 8-bit literal `k'. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Words: 1 Cycles: 2 Example: Example: RETFIE After Interrupt PC = GIE = TOS 1 TABLE CALL TABLE;W contains ;table offset ;value GOTO DONE * * ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; * * * RETLW kn ;End of table DONE Before Instruction W = 0x07 After Instruction W = value of k8 RETURN 2017 Microchip Technology Inc. Return from Subroutine Syntax: [ label ] Operands: None RETURN Operation: TOS PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. DS20005750A-page 223 MCP19122/3 RLF Rotate Left f through Carry SLEEP Enter Sleep mode Syntax: [ label ] Syntax: [ label ] SLEEP Operands: 0 f 127 d [0,1] RLF f,d Operation: See description below Status Affected: C Description: The contents of register `f' are rotated one bit to the left through the Carry flag. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is stored back in register `f'. C Words: 1 Cycles: 1 Example: RLF Operands: None Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Register f REG1,0 Before Instruction REG1 = 0110 C = After Instruction REG1 = 0110 W = 1100 C = 1110 0 1110 1100 1 RRF Rotate Right f through Carry SUBLW Subtract W from literal Syntax: [ label ] Syntax: [ label ] SUBLW k Operands: 0 f 127 d [0,1] Operands: 0 k 255 Operation: See description below Operation: k - (W) W) Status Affected: C Description: The contents of register `f' are rotated one bit to the right through the Carry flag. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. RRF f,d C DS20005750A-page 224 Register f Status Affected: C, DC, Z Description: The W register is subtracted (two's complement method) from the 8-bit literal `k'. The result is placed in the W register. Result Condition C=0 Wk C=1 Wk DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> 2017 Microchip Technology Inc. MCP19122/3 SUBWF Subtract W from f XORWF Exclusive OR W with f Syntax: [ label ] SUBWF f,d Syntax: [ label ] XORWF Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - (W) destination) Operation: (W) .XOR. (f) destination) Status Affected: C, DC, Z Status Affected: Z Description: Description: Exclusive OR the contents of the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. Subtract (two's complement method) W register from register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. C=0 Wf C=1 Wf DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0> SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0 f 127 d [0,1] Operation: (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register `f' are exchanged. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed in register `f'. XORLW Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR'ed with the 8-bit literal `k'. The result is placed in the W register. 2017 Microchip Technology Inc. f,d DS20005750A-page 225 MCP19122/3 NOTES: DS20005750A-page 226 2017 Microchip Technology Inc. MCP19122/3 29.0 IN-CIRCUIT SERIAL PROGRAMMINGTM (ICSPTM) 29.1 Common Programming Interfaces Connection to a target device is typically done through an ICSP header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6-pin, 6-connector) configuration. See Figure 29-1. ICSP programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process, allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP programming: * ICSPCLK * ICSPDAT * MCLR * VDD * VSS FIGURE 29-1: In Program/Verify mode the Program Memory, User IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. The device is placed into a Program/Verify mode by holding the ICSPDAT and ICSPCLK pins low, while raising the MCLR pin from VIL to VIHH. ICD RJ-11 STYLE CONNECTOR INTERFACE ICSPDAT NC ICSPCLK 2 4 6 VDD 1 3 5 MCLR VSS Target PC Board Bottom Side Pin Description 1 = 1 = MCLR 2 = 2 = VDDTarget 3 = 3 = VSS (ground) 4 = 4 = ICSPDAT 5 = 5 = ICSPCLK 6 = 6 = No Connect Another connector often found in use with the PICkitTM programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 29-2. FIGURE 29-2: PICkit-STYLE CONNECTOR INTERFACE Pin 1 Indicator Pin Description* 1 2 3 4 5 6 * 1 = 1 = MCLR 2 = 2 = VDDTarget 3 = 3 = VSS (ground) 4 = 4 = ICSPDAT 5 = 5 = ICSPCLK 6 = 6 = No Connect The 6-pin header (0.100" spacing) accepts 0.025" square pins. 2017 Microchip Technology Inc. DS20005750A-page 227 MCP19122/3 For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices, such as resistors, diodes, or even jumpers. See Figure 29-3 for more information. FIGURE 29-3: TYPICAL CONNECTION FOR ICSP PROGRAMMING External Programming Signals VDD Device to be Programmed VDD VDD VPP MCLR VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections 29.2 * Isolation Devices (as required) In-Circuit Debugger In-circuit debugging requires access to the ICDCLK, ICDDATA and MCLR pins. These pins are only available on the MCP19123 device. DS20005750A-page 228 2017 Microchip Technology Inc. MCP19122/3 30.0 DEVELOPMENT SUPPORT The PIC(R) microcontrollers (MCU) and dsPIC(R) digital signal controllers (DSC) are supported with a full range of software and hardware development tools: * Integrated Development Environment - MPLAB(R) X IDE Software * Compilers/Assemblers/Linkers - MPLAB XC Compiler - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families * Simulators - MPLAB X SIM Software Simulator * Emulators - MPLAB REAL ICETM In-Circuit Emulator * In-Circuit Debuggers/Programmers - MPLAB ICD 3 - PICkitTM 3 * Device Programmers - MPLAB PM3 Device Programmer * Low-Cost Demonstration/Development Boards, Evaluation Kits and Starter Kits * Third-party development tools 30.1 MPLAB X Integrated Development Environment Software The MPLAB X IDE is a single, unified graphical user interface for Microchip and third-party software, and hardware development tool that runs on Windows (R), Linux and Mac OS(R) X. Based on the NetBeans IDE, MPLAB X IDE is an entirely new IDE with a host of free software components and plug-ins for high-performance application development and debugging. Moving between tools and upgrading from software simulators to hardware debugging and programming tools is simple with the seamless user interface. With complete project management, visual call graphs, a configurable watch window and a feature-rich editor that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new users. With the ability to support multiple tools on multiple projects with simultaneous debugging, MPLAB X IDE is also suitable for the needs of experienced users. Feature-Rich Editor: * Color syntax highlighting * Smart code completion makes suggestions and provides hints as you type * Automatic code formatting based on user-defined rules * Live parsing User-Friendly, Customizable Interface: * Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. * Call graph window Project-Based Workspaces: * * * * Multiple projects Multiple tools Multiple configurations Simultaneous debugging sessions File History and Bug Tracking: * Local file history feature * Built-in support for Bugzilla issue tracker 2017 Microchip Technology Inc. DS20005750A-page 229 MCP19122/3 30.2 MPLAB XC Compilers The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip's 8, 16, and 32-bit MCU and DSC devices. These compilers provide powerful integration capabilities, superior code optimization and ease of use. MPLAB XC Compilers run on Windows, Linux or MAC OS X. For easy source level debugging, the compilers provide debug information that is optimized to the MPLAB X IDE. The free MPLAB XC Compiler editions support all devices and commands, with no time or memory restrictions, and offer sufficient code optimization for most applications. MPLAB XC Compilers include an assembler, linker and utilities. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. MPLAB XC Compiler uses the assembler to produce its object file. Notable features of the assembler include: * * * * * * Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility 30.3 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code, and COFF files for debugging. The MPASM Assembler features include: 30.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 30.5 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC DSC devices. MPLAB XC Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility * Integration into MPLAB X IDE projects * User-defined macros to streamline assembly code * Conditional assembly for multipurpose source files * Directives that allow complete control over the assembly process DS20005750A-page 230 2017 Microchip Technology Inc. MCP19122/3 30.6 MPLAB X SIM Software Simulator The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB X SIM Software Simulator fully supports symbolic debugging using the MPLAB XC Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 30.7 MPLAB REAL ICE In-Circuit Emulator System The MPLAB REAL ICE In-Circuit Emulator System is Microchip's next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs all 8, 16 and 32-bit MCU, and DSC devices with the easy-to-use, powerful graphical user interface of the MPLAB X IDE. The emulator is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) or with the new high-speed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradeable through future firmware downloads in MPLAB X IDE. MPLAB REAL ICE offers significant advantages over competitive emulators including full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, logic probes, a ruggedized probe interface and long (up to 3 meters) interconnection cables. 2017 Microchip Technology Inc. 30.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost-effective, high-speed hardware debugger/programmer for Microchip Flash DSC and MCU devices. It debugs and programs PIC Flash microcontrollers and dsPIC DSCs with the powerful, yet easy-to-use graphical user interface of the MPLAB IDE. The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 30.9 PICkit 3 In-Circuit Debugger/Programmer The MPLAB PICkit 3 allows debugging and programming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB IDE. The MPLAB PICkit 3 is connected to the design engineer's PC using a full-speed USB interface and can be connected to the target via a Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the Reset line to implement in-circuit debugging and In-Circuit Serial ProgrammingTM (ICSPTM). 30.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages, and a modular, detachable socket assembly to support various package types. The ICSP cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications. DS20005750A-page 231 MCP19122/3 30.11 Demonstration/Development Boards, Evaluation Kits and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. 30.12 Third-Party Development Tools Microchip also offers a great collection of tools from third-party vendors. These tools are carefully selected to offer good value and unique functionality. * Device programmers and gang programmers from companies such as SoftLog and CCS * Software tools from companies such as Gimpel and Trace Systems * Protocol analyzers from companies such as Saleae and Total Phase * Demonstration boards from companies such as MikroElektronika, Digilent(R) and Olimex * Embedded Ethernet solutions from companies such as EZ Web Lynx, WIZnet and IPLogika(R) The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEMTM and dsPICDEMTM demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ(R) security ICs, CAN, IrDA(R), PowerSmart battery management, SEEVAL(R) evaluation system, Sigma-Delta ADC and flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. DS20005750A-page 232 2017 Microchip Technology Inc. MCP19122/3 31.0 PACKAGING INFORMATION 31.1 Package Marking Information 24-Lead QFN (4x4 mm) (MCP19122 only) Example MCP 19122 MJ e3 713256 28-Lead QFN (5x5 mm) (MCP19123 only) Example MCP 19123 MQ e3 713256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e) 3 can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2017 Microchip Technology Inc. DS20005750A-page 233 MCP19122/3 24-Lead Plastic Quad Flat, No Lead Package (MJ) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005750A-page 234 2017 Microchip Technology Inc. MCP19122/3 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2017 Microchip Technology Inc. DS20005750A-page 235 MCP19122/3 28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.10 C 2X TOP VIEW 0.10 C 0.10 C C SEATING PLANE A1 A 28X A3 SIDE VIEW 0.08 C 0.10 C A B D2 0.10 C A B E2 28X K 2 1 NOTE 1 N 28X L e BOTTOM VIEW 28X b 0.10 0.05 C A B C Microchip Technology Drawing C04-140C Sheet 1 of 2 DS20005750A-page 236 2017 Microchip Technology Inc. MCP19122/3 28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 Contact Thickness A3 Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 b Contact Width Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 3.15 3.15 0.18 0.35 0.20 MILLIMETERS NOM 28 0.50 BSC 0.90 0.02 0.20 REF 5.00 BSC 3.25 5.00 BSC 3.25 0.25 0.40 - MAX 1.00 0.05 3.35 3.35 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-140C Sheet 2 of 2 2017 Microchip Technology Inc. DS20005750A-page 237 MCP19122/3 28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-2140A DS20005750A-page 238 2017 Microchip Technology Inc. MCP19122/3 APPENDIX A: REVISION HISTORY Revision A (May 2017) * Original Release of this Document. 2017 Microchip Technology Inc. DS20005750A-page 239 MCP19122/3 NOTES: DS20005750A-page 240 2017 Microchip Technology Inc. MCP19122/3 INDEX A C A/D C Compilers MPLAB XC ............................................................... 230 Calibration Word Associated Registers................................................ 114 Capture/Compare/PWM ........................................... 171, 173 Capture/Compare/PWM (CCP) ........................................ 165 Capture Mode........................................................... 165 CCP1 Pin Configuration ........................................... 165 Compare Mode......................................................... 166 CCP1 Pin Configuration ................................... 166 Software Interrupt Mode ........................... 165, 166 Special Event Trigger ....................................... 166 Timer1 Mode Resource .................................... 166 Prescaler .................................................................. 165 CCP1CON (CCP1) Register............................................. 167 Clock Switching ................................................................ 114 Code Examples A/D Conversion ........................................................ 137 Assigning Prescaler to Timer0.................................. 152 Assigning Prescaler to WDT..................................... 152 Changing Between Capture Prescalers ................... 165 Initializing PORTA .................................................... 115 Saving Status and W Registers in RAM ................... 107 Comparators C2OUT as T1 Gate................................................... 155 Compensation .................................................................... 17 Computed Function Calls ................................................... 84 Computed GOTO................................................................ 84 CONFIG1 Register ............................................................. 88 Configuration Bits ............................................................... 87 Current Measurement Control ................................................. 33 Current Sense .................................................................... 23 Customer Change Notification Service............................. 247 Customer Support............................................................. 247 Specifications...................................................... 3, 5, 52 A/D Conversion Requirements.............................................................. 53 Timing ......................................................................... 53 Absolute Maximum Ratings ................................................ 39 AC Characteristics .............................................................. 46 ACKSTAT Status Flag................................................................ 199 ADC .................................................................................. 133 Acquisition Requirements ......................................... 141 Associated Registers ................................................ 143 Block Diagram........................................................... 134 Calculating Acquisition Time..................................... 141 Channel Selection..................................................... 135 Configuration............................................................. 135 Configuring Interrupt ................................................. 137 Conversion Clock...................................................... 135 Conversion Procedure .............................................. 137 Internal Sampling Switch (RSS) IMPEDANCE .............. 141 Interrupts................................................................... 136 Operation .................................................................. 137 Port Configuration ..................................................... 135 Register Definitions................................................... 138 Source Impedance.................................................... 141 Starting an A/D Conversion ...................................... 136 ADCON0 Register............................................................. 138 ADCON1 Register............................................................. 139 ADRESH Register (ADFM = 0) ......................................... 140 ADRESL Register (ADFM = 0).......................................... 140 Analog Peripheral Control ................................................... 33 Analog-to-Digital Converter. See ADC ANSELA Register ............................................................. 120 ANSELB Register ............................................................. 126 Assembler MPASM Assembler................................................... 230 B BF ..................................................................................... 201 Status Flag................................................................ 199 BF Status Flag .................................................................. 201 Block Diagrams (CCP) Capture Mode Operation ............................... 165 ADC .......................................................................... 134 ADC Transfer Function ............................................. 142 Analog Input Model ................................................... 142 Baud Rate Generator................................................ 210 Compare ................................................................... 166 Generic I/O Port ........................................................ 115 Interrupt Logic ........................................................... 100 MCLR Circuit............................................................... 92 MSSP (I2C Master Mode) ......................................... 175 MSSP (I2C Slave Mode) ........................................... 176 On-Chip Reset Circuit ................................................. 91 Simplified PWM......................................................... 172 Timer0....................................................................... 151 Timer1............................................... 153, 157, 158, 159 Timer2....................................................................... 163 Watchdog Timer........................................................ 111 Block DiagramsMCP19111 ................................................. 10 D Data Memory ...................................................................... 76 Data Memory Map .............................................................. 78 DC and AC Characteristics Graphs and Tables ..................................................... 55 DC Characteristics.............................................................. 46 Development Support ....................................................... 229 Device Calibration............................................................... 61 Calibration Word 1...................................................... 61 Calibration Word 2...................................................... 62 Calibration Word 3...................................................... 63 Calibration Word 4...................................................... 64 Calibration Word 6...................................................... 70 Calibration Word 7...................................................... 72 Device Overview................................................................... 9 Digital Electrical Characteristics ......................................... 45 Diode Emulation Mode ....................................................... 33 E ECCP/CCP. See Enhanced Capture/Compare/PWM Electrical Characteristics .................................................... 39 Errata .................................................................................... 7 External Clock..................................................................... 46 F Features 2017 Microchip Technology Inc. DS20005750A-page 241 MCP19122/3 Miscellaneous ............................................................. 38 Protection .................................................................... 18 Synchronous Buck ........................................................ 1 Firmware Instructions........................................................ 217 Flash Program Memory Control ........................................ 145 Operation During Code Protect................................. 149 Operation during write Protect .................................. 149 Protecting .................................................................. 149 Reading..................................................................... 148 Writing to ................................................................... 149 Flash Program Memory Control Registers........................ 146 I I/O Ports.......................................................................... 115 I2C Mode (MSSP) Acknowledge Sequence ........................................... 180 Acknowledge Sequence Timing................................ 203 Associated Registers ................................................ 209 Bus Collision During a Repeated Start Condition ................... 207 During a Start Condition.................................... 205 During a Stop Condition.................................... 208 Effects of a Reset...................................................... 204 I2C Clock Rate w/BRG .............................................. 210 Master Mode ............................................................. 196 Clock Arbitration................................................ 196 Operation .......................................................... 196 Reception.......................................................... 201 Repeated Start Condition Timing...................... 198 Start Condition Timing ...................................... 197 Transmission..................................................... 199 Multi-Master Communication, Bus Collision and Arbitration .................................................................... 204 Multi-Master Mode .................................................... 204 Operation .................................................................. 178 Overview ................................................................... 176 Read/Write Bit Information (R/W Bit) ........................ 180 Slave Mode 10-bit Address Reception.................................. 190 Bus Collision ..................................................... 186 Clock Stretching................................................ 194 Clock Synchronization ...................................... 194 General Call Address Support .......................... 195 Operation .......................................................... 180 SSPMSK1 Register........................................... 195 Transmission..................................................... 186 Sleep Operation ........................................................ 204 Stop Condition Timing............................................... 203 In-Circuit Serial Programming (ICSP) ............................... 227 Common Programming Interfaces ............................ 227 Indirect Addressing ............................................................. 84 Input Type ............................................................................ 12 Under Voltage Lockout ............................................... 18 Instruction Format ............................................................. 217 Instruction Set ................................................................... 217 ADDLW ..................................................................... 219 ADDWF ..................................................................... 219 ANDLW ..................................................................... 219 ANDWF ..................................................................... 219 BCF ........................................................................... 219 BSF ........................................................................... 219 BTFSC ...................................................................... 219 BTFSS ...................................................................... 220 CALL ......................................................................... 220 DS20005750A-page 242 CLRF ........................................................................ 220 CLRW ....................................................................... 220 CLRWDT .................................................................. 220 COMF ....................................................................... 220 DECF ........................................................................ 220 DECFSZ ................................................................... 221 GOTO ....................................................................... 221 INCF ......................................................................... 221 INCFSZ..................................................................... 221 IORLW ...................................................................... 221 IORWF...................................................................... 221 MOVF ....................................................................... 222 MOVLW .................................................................... 222 MOVWF .................................................................... 222 NOP .......................................................................... 222 RETFIE ..................................................................... 223 RETLW ..................................................................... 223 RETURN................................................................... 223 RLF ........................................................................... 224 RRF .......................................................................... 224 SLEEP ...................................................................... 224 SUBLW ..................................................................... 224 SUBWF..................................................................... 225 SWAPF ..................................................................... 225 XORLW .................................................................... 225 XORWF .................................................................... 225 Summary Table ........................................................ 218 Internal Sampling Switch (RSS) IMPEDANCE ...................... 141 Internal Temperature Indicator Module............................. 169 Circuit Operation....................................................... 169 Temperature Output ................................................. 169 Internet Address ............................................................... 247 Interrupt-On-Change......................................................... 129 Interrupt-on-Change Associated Registers ................................................ 131 Clearing Interrupt Flags ............................................ 129 Enabling the Module ................................................. 129 Operation in Sleep .................................................... 129 Pin Configuration ...................................................... 129 Registers .................................................................. 130 Interrupts ADC .......................................................................... 137 Associated Registers ........................................ 107, 112 Context Saving ......................................................... 107 Control Registers ...................................................... 101 PORTA Interrupt-on-Change .................................... 100 RA2/INT ...................................................................... 99 Timer0 ...................................................................... 100 TMR1 ........................................................................ 156 M Master Synchronous Serial Port. See MSSP MCLR.................................................................................. 92 Internal........................................................................ 92 Memory Organization ......................................................... 75 Data ............................................................................ 76 Program ...................................................................... 75 Microchip Internet Web Site.............................................. 247 MOSFET....................................................................... 16, 59 Driver Dead Time........................................................ 31 MPLAB Assembler, Linker, Librarian................................ 230 MPLAB ICD 3 In-Circuit Debugger System ...................... 231 MPLAB Integrated Development Environment Software.. 229 MPLAB PM3 Device Programmer .................................... 231 MPLAB REAL ICE In-Circuit Emulator System ................ 231 MPLAB X SIM Software Simulator ................................... 231 2017 Microchip Technology Inc. MCP19122/3 MPLINK Object Linker/MPLIB Object Librarian ................ 230 MSSP ................................................................................ 175 Arbitration.................................................................. 177 Baud Rate Generator................................................ 210 Block Diagram (I2C Master Mode) ............................ 175 Block Diagram (I2C Slave Mode) .............................. 176 Clock Stretching........................................................ 177 I2C Bus Terms .......................................................... 178 I2C Master Mode....................................................... 196 I2C Mode................................................................... 176 I2C Mode Operation .................................................. 178 I2C Slave Mode Operation ........................................ 180 Overview ................................................................... 175 O OPCODE Field Descriptions ............................................. 217 Oscillator ........................................................................... 113 Associated Registers ................................................ 114 Calibration................................................................. 113 Delay Upon Power-up............................................... 114 Frequency Tuning ..................................................... 113 Internal Oscillator ...................................................... 113 Oscillator Module .............................................................. 114 Output ................................................................................. 33 Overcurrent ..................................................... 21, 22, 38 Overvoltage................................................................. 30 Power Good ................................................................ 38 Type ............................................................................ 12 Under Voltage ............................................................. 33 Under Voltage Accelerator.......................................... 33 Voltage Soft-Start............................................................. 38 Tracking .............................................................. 38 Overcurrent ......................................................................... 22 Overvoltage Accelerator ..................................................... 33 P Packaging ......................................................................... 233 Marking ..................................................................... 233 PCL ..................................................................................... 84 Modifying..................................................................... 84 PCLATH .............................................................................. 84 PCON Register ............................................................. 94, 97 PICkit 3 In-Circuit Debugger/PICkit 3 In-Circuit Programmer . 231 Pin Diagram .......................................................................... 4 Pinout Description Summary....................................................................... 5 Pinout Descriptions MCP19111 .................................................................. 12 PIR1 Register.................................................................... 105 PIR2 Register.................................................................... 106 PMADRH Register ............................................................ 145 PMADRL Register..................................................... 145, 146 PMCON1 Register .................................................... 145, 147 PMCON2 Register ............................................................ 145 PMDATH Register ............................................................ 146 PMDATL Register ............................................................. 146 PMDRH Register .............................................................. 147 PORTB Additional Pin Functions Weak Pull-up .................................................... 125 Pin Descriptions and Diagrams................................. 127 PORTGPA ................................................................ 115, 129 ANSELA Register ..................................................... 116 Associated Registers ................................................ 121 2017 Microchip Technology Inc. Functions and Output Priorities ................................ 116 Interrupt-on-Change ................................................. 115 Weak Pull-Ups.......................................................... 115 PORTGPA Register.......................................................... 115 PORTGPB ................................................................ 122, 129 ANSELB Register ..................................................... 122 Associated Registers................................................ 127 Functions and Output Priorities ................................ 122 Interrupt-on-Change ................................................. 122 P1B/P1C/P1D.Capture/Compare/PWM ................... 122 Weak Pull-Ups.......................................................... 122 PORTGPB Register.................................................. 122, 125 Power-Down Mode (Sleep)............................................... 112 Associated Registers................................................ 110 Power-on Reset (POR)................................................. 88, 92 Power-up Timer (PWRT) .................................................... 94 Prescaler, Timer1 Select (T1CKPS1:T1CKPS0 Bits) .............................. 32 Product Identification System ........................................... 249 Program Memory ................................................................ 75 Map and Stack (MCP19111) ...................................... 75 Programming, Device Instructions.................................... 217 Pulse-Width Modulation...................................................... 51 Associated Registers................................................ 173 Duty Cycle ................................................................ 173 Module...................................................................... 171 Operating during Sleep............................................. 173 Period ....................................................................... 172 Stand-alone Mode .................................................... 171 Standard Mode ......................................................... 171 Switching Frequency Synchronization Mode............ 171 PWM (CCP Module) PWM Steering .......................................................... 167 PWM Steering................................................................... 167 R Read-Modify-Write Operations ......................................... 217 Registers ABECON (Analog Block Enable Control) ................... 37 ADCON0 (ADC Control 0) ........................................ 138 ADCON1 (ADC Control 1) ........................................ 139 ADRESH (ADC Result High) with ADFM = 0) .......... 140 ADRESL (ADC Result Low) with ADFM = 0)............ 140 ANSELA (Analog Select GPA) ................................. 120 ANSELB (Analog Select GPB) ................................. 126 BUFFCON (Unity Gain Buffer Control) ....................... 57 CALWD1 (Calibration Word 1) ................................... 61 CALWD2 (Calibration Word 2) ................................... 62 CALWD3 (Calibration Word 3) ................................... 63 CALWD4 (Calibration Word 4) ............................. 64, 65 CALWD5 (Calibration Word 5) ................................... 66 CALWD6 (Calibration Word 6) ....................... 67, 68, 69 CCP1CON (CCP1 Control) ...................................... 167 CMPZCON (Compensation Setting Control) .............. 25 Configuration Word 1.................................................. 88 CSGSCON (Current Sense AC Gain Control)............ 24 DEADCON (Driver Dead Time Control) ..................... 32 INTCON (Interrupt Control) ...................................... 102 IOCA (Interrupt-on-Change PORTGPA) .................. 130 IOCB (Interrupt-on-Change PORTGPB) .................. 130 LPCRCON (Slope Compensation Ramp Control) ...... 26 OCCON (Output OverCurrent Control)....................... 22 OPTION_REG (Option) .............................................. 83 OSCTUNE (Oscillator Tuning).................................. 113 OUVCON (Output Under Voltage Detect Level Control) 29 DS20005750A-page 243 MCP19122/3 PCON (Power Control) ......................................... 94, 97 PE1(Analog Peripheral Enable 1 Control) .................. 34 PIE1 (Peripheral Interrupt Enable) ............................ 103 PIR1 (Peripheral Interrupt Flag) ................................ 105 PIR2 (Peripheral Interrupt Flag) ................................ 106 PMADRL (Program Memory Address)...................... 146 PMCON1 (Program Memory Control) ....................... 147 PMDATH (Program Memory Data) ........................... 146 PMDATL (Program Memory Data)............................ 146 PMDRH (Program Memory Address)........................ 147 PORTGPA ................................................................ 119 PORTGPB ................................................................ 125 RELEFF (Relative Efficiency Measurement) .............. 59 Special Registers Summary...................... 79, 80, 81, 82 SSPADD (MSSP Address and Baud Rate 1) ........... 215 SSPADD2 (MSSP Address 2) .................................. 216 SSPCON1 (SSP Control 1)....................................... 212 SSPCON2 (SSP Control 2)....................................... 213 SSPCON3 (SSP Control 3)....................................... 214 SSPMSK (SSP Mask 1) ............................................ 215 SSPMSK1 (SSP Mask) ............................................. 195 SSPMSK2 (SSP Mask 2) .......................................... 216 SSPSTAT (SSP Status) ............................................ 211 STATUS ...................................................................... 77 T1CON (Timer1 Control)........................................... 160 T1GCON (Timer1 Gate Control) ............................... 161 TRISA (Tri-State PORTA) ......................................... 119 TRISGPB ( PORTGPB Tri-State) ............................. 125 TXCON ..................................................................... 164 VINLVL (Input Under Voltage Lockout Control) ... 18, 19, 20 WPUB (Weak Pull-up PORTB) ................................. 120 WPUGPA Weak Pull-up PORTGPA .................................. 120 WPUGPB (Weak Pull-up PORTGPB)....................... 126 Relative Efficiency Measurement........................................ 59 Procedure ................................................................... 59 Reset................................................................................... 91 Determining Causes ................................................... 96 Resets ................................................................................. 91 Associated Registers .................................................. 97 S Sleep Power-Down Mode ................................................... 112 Wake-up.................................................................... 109 Software Simulator (MPLAB X SIM) ................................. 231 Special Function Registers ................................................. 77 Special Registers Summary Bank 0 ......................................................................... 79 Bank 1 ......................................................................... 80 Bank 2 ......................................................................... 81 Bank 3 ......................................................................... 82 SSPADD Register ............................................................. 215 SSPADD2 Register ........................................................... 216 SSPCON1 Register........................................................... 212 SSPCON2 Register........................................................... 213 SSPCON3 Register........................................................... 214 SSPMSK Register............................................................. 215 SSPMSK1 Register........................................................... 195 SSPMSK2 Register........................................................... 216 SSPOV.............................................................................. 201 SSPOV Status Flag........................................................... 201 SSPSTAT Register ........................................................... 211 R/W Bit ...................................................................... 180 Stack ................................................................................... 84 DS20005750A-page 244 Start-up Sequence.............................................................. 94 STATUS Register ............................................................... 77 Switching Frequency .......................................................... 17 T T1CON Register ............................................................... 160 T1CKPS1:T1CKPS0 Bits............................................ 32 T1GCON Register ............................................................ 161 Temperature Indicator Module.......................................... 169 Thermal Specifications ....................................................... 43 Timer Requirements RESET, Watchdog Timer, Oscillator Start-up Timer and Power-up ............................................................ 49 Timer0....................................................................... 151, 164 8-Bit Counter Mode................................................... 151 8-bit Timer Mode....................................................... 151 Associated Registers ................................................ 152 External Clock........................................................... 152 Operation .......................................................... 151, 154 Operation During Sleep ............................................ 152 T0CKI ....................................................................... 152 Timer0 Module.................................................................. 151 Timer1............................................................................... 163 Interrupt .................................................................... 156 Modes of Operation .................................................. 154 Operation During Sleep ............................................ 156 Prescaler .................................................................. 155 Timer1 Gate Selecting Source .............................................. 155 TMR1H Register ....................................................... 153 TMR1L Register........................................................ 153 Timer2 Associated registers ................................................. 164 Control Register........................................................ 164 Operation .................................................................. 163 Timer2 Module.................................................................. 163 Timer2/4/6 Associated Registers ................................................ 164 Timers Timer1 T1CON ............................................................. 160 T1GCON........................................................... 161 Timer2/4/6 TXCON ............................................................. 164 Timing Diagrams Acknowledge Sequence ........................................... 203 Baud Rate Generator with Clock Arbitration............. 197 BRG Reset Due to SDA Arbitration During Start Condition.................................................................... 206 Brown-out Reset Situations ........................................ 93 Bus Collision During a Repeated Start Condition (Case 1). 207 Bus Collision During a Repeated Start Condition (Case 2). 207 Bus Collision During a Start Condition (SCL = 0) ..... 206 Bus Collision During a Start Condition (SDA Only) .. 205 Bus Collision During a Stop Condition (Case 1) ....... 208 Bus Collision During a Stop Condition (Case 2) ....... 208 Bus Collision for Transmit and Acknowledge ........... 204 Capture/Compare/PWM ............................................. 51 Clock Synchronization .............................................. 194 First Start Bit ............................................................. 197 I2C Master Mode (7 or 10-Bit Transmission) ............ 200 I2C Master Mode (7-Bit Reception)........................... 202 INT Pin Interrupt ....................................................... 101 Power-up Timer .......................................................... 47 2017 Microchip Technology Inc. MCP19122/3 Repeat Start Condition.............................................. 198 Reset........................................................................... 47 Start-up Timer ............................................................. 47 Stop Condition Receive or Transmit Mode ............... 203 Time-out Sequence Case 1 ................................................................ 94 Case 2 ................................................................ 95 Case 3 ................................................................ 95 Timer0......................................................................... 49 Timer1......................................................................... 49 Timer1 Incrementing Edge........................................ 157 Wake-up from Interrupt ............................................. 110 Watchdog Timer.......................................................... 47 Timing Parameter Symbology............................................. 45 Timing Requirements CLKOUT and I/O......................................................... 47 External Clock............................................................. 46 TRISA Register ................................................................. 119 TRISGPA .......................................................................... 115 TRISGPA Register ............................................................ 115 TRISGPB Register .................................................... 122, 125 TXCON (Timer2/4/6) Register .......................................... 164 Typical Application Circuit ..................................................... 9 U Under Voltage Lockout Input ............................................................................ 18 W Watchdog Timer (WDT) ...................................................... 94 WCOL ............................................................................... 203 Status Flag........................................ 197, 199, 201, 203 WCOL Status Flag ............................................................ 203 WPUB Register ................................................................. 120 WPUGPB Register............................................................ 126 WWW Address.................................................................. 247 WWW, On-Line Support ....................................................... 7 2017 Microchip Technology Inc. DS20005750A-page 245 MCP19122/3 NOTES: DS20005750A-page 246 2017 Microchip Technology Inc. MCP19122/3 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site makes files and information easily available to customers. The web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2017 Microchip Technology Inc. DS20005750A-page 247 MCP19122/3 NOTES: DS20005750A-page 248 2017 Microchip Technology Inc. MCP19122/3 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device - X Tape and Reel Temperature Option Range Device: /XX Package MCP19122: Digitally Enhanced Power Analog Controller with Integrated Synchronous Driver MCP19123: Digitally Enhanced Power Analog Controller with Integrated Synchronous Driver Tape and Reel Option: Blank T = Standard packaging (tube) = Tape and Reel Temperature Range: E = -40C to +125C Package: MJ = 24-Lead Plastic Quad Flat, No Lead Package 4x4 mm Body (QFN) MQ = 28-Lead Plastic Quad Flat, No Lead Package 5x5x mm Body (QFN) 2017 Microchip Technology Inc. (Extended) Examples: a) MCP19122-E/MJ: b) MCP19122T-E/MJ: a) MCP19123-E/MQ: b) MCP19123T-E/MQ: Note 1: Extended temperature, 24 LD QFN 4x4 package Tape and Reel, Extended temperature, 24 LD QFN 4x4 package Extended temperature, 28 LD QFN 5x5 package Tape and Reel, Extended temperature, 28 LD QFN 5x5 package Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005750A-page 249 MCP19122/3 NOTES: DS20005750A-page 250 2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-1700-2 == ISO/TS 16949 == 2017 Microchip Technology Inc. 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