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M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1
Power Amplifier
12.0-16.0 GHz
XP1043-QH
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Rev. V1
Features
32 dBm Saturated RF Power
41 dBm Output IP3 Linearity
17 dB Gain Control
On-Chip Power Detector
Lead-Free 4 mm 24-lead PQFN Package
100% RF Testing
RoHS* Compliant and 260°C Reflow Compatible
Description
The XP1043-QH is a packaged linear power
amplifier that operates over the 12.0-16.0 GHz
frequency band. The device provides 21.5 dB gain
and 41 dBm Output Third Order Intercept Point
(OIP3) across the band and is offered in an industry
standard, fully molded 4x4mm QFN package. The
packaged amplifier is comprised of a three stage
power amplifier with an integrated, temperature
compensated on-chip power detector. The device
includes on-chip ESD protection structures and DC
by-pass capacitors to ease the implementation and
volume assembly of the packaged part. The device
is manufactured in GaAs pHEMT device technology
with BCB wafer coating to enhance ruggedness and
repeatability of performance. This device is specially
designed for use in Point-to-Point Radio systems for
cellular backhaul applications, and is well suited for
other telecom applications such as SATCOM and
VSAT.
Ordering Information
Part Number Package
XP1043-QH-0G00 bulk quantity
XP1043-QH-0G0T tape and reel
XP1043-QH-EV1 evaluation module
Functional Schematic
Pin Configuration
Pin No. Function Pin No. Function
1-2 Ground 13-14 Not Connected
3 Not Connected 15 RF Output
4 RF Input 16 Not Connected
5-6 Ground 17-18 Ground
7 Gate 1 Bias 19 Drain 3 Bias
8 Gate 2 Bias 20 Drain 2 Bias
9 Gate 3 Bias 21 Drain 1 Bias
10 Not Connected 22-23 Ground
11 Pwr Det 24 Not Connected
12 Pwr Det Ref
Absolute Maximum Ratings 1,2
Parameter Absolute Max.
Supply Voltage (Vd1,2,3) +8.0 V
Supply Current (Id1,2,3) 1500 mA
Gate Bias Voltage (Vg1,2,3) -2.4 V
Max Power Dissipation (Pdiss) 5.5W
RF Input Power +19 dBm
Operating Temperature (Ta) -55 °C to +85 °C
Storage Temperature (Tstg) -65 °C to +150 °C
Channel Temperature (Tch) 165 °C
MSL Level (MSL) MSL3
ESD Min.-Machine Model (MM) Class A
ESD Min.-Human Body Model (HBM) Class 1A
(1) Minimum specifications are set under nominal (typ.) bias conditions.
Bias can be adjusted higher to achieve greater linearity and power;
however, maximum total power dissipated is specified at 5.5 W
(2) Channel temperature directly affects a device’s MTTF. Channel
temperature should be kept as low as possible to maximize lifetime.
1
2
3
4
16
15
14
13
10
GND
5
6
17
18
RF IN
VD3VD2VD1GND
GND
nc
GND
GND
GND
RF OUT
GND
nc
nc
nc
GNDnc
ncVG1 VG2 VG3 Vdet Vref
11
12
7
8
9
24
23
22
21
20
19