A2I25D025NR1 A2I25D025GNR1
1
RF Device Data
Freescale Semiconductor, Inc.
RF LDMOS Wideband Integrated
Power Amplifiers
The A2I25D025N wideband integrated circuit is designed with on--chip
matching that makes it usable from 2100 to 2900 MHz. This multi--stage
structure is rated for 26 to 32 V operation and covers all typical cellular base
station modulation formats.
Typical Single--Carrier W--CDMA Characterization Performance:
VDD =28Vdc,I
DQ1(A+B) =56mA,I
DQ2(A+B) = 136 mA, Pout = 3.2 W Avg.,
Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF. (1)
Frequency
Gps
(dB)
PAE
(%)
ACPR
(dBc)
2300 MHz 32.0 19.0 –46.7
2350 MHz 31.8 19.0 –47.1
2400 MHz 31.7 19.1 –47.5
2496 MHz 31.7 19.3 –47.3
2600 MHz 32.0 19.5 –47.1
2690 MHz 32.5 20.0 –46.8
Features
On--Chip Matching (50 Ohm Input, DC Blocked)
Integrated Quiescent Current Temperature Compensation with
Enable/Disable Function (2)
Designed for Digital Predistortion Error Correction Systems
Optimized for Doherty Applications
Figure 1. Functional Block Diagram Figure 2. Pin Connections
Note: Exposed backside of the package is
the source terminal for the transistors.
Quiescent Current
Temperature Compensation (2)
VDS1A
RFinA
VGS1A
RFout1/VDS2A
VGS2A
Quiescent Current
Temperature Compensation (2)
VDS1B
RFinB
VGS1B
RFout2/VDS2B
VGS2B
VDS1A
RFinA
GND
RFinB
RFout1/VDS2A
1
2
3
4
7
8
15
VGS1B
9
10
11
VGS2A
VGS1A
N.C.
N.C.
VGS2B
GND
VDS1B
RFout2/VDS2B
13
6
12
(Top View)
5
14
GND
16
17 VBWA
VBWB
1. All data measured in fixture with device soldered to heatsink.
2. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987, Quiescent Current Control
for the RF Integrated Circuit Device Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1977 or AN1987.
Document Number: A2I25D025N
Rev. 0, 3/2015
Freescale Semiconductor
Technical Data
2100–2900 MHz, 3.2 W AVG., 28 V
AIRFAST RF LDMOS WIDEBAND
INTEGRATED POWER AMPLIFIERS
A2I25D025NR1
A2I25D025GNR1
TO--270WB--17
PLASTIC
A2I25D025NR1
TO--270WBG--17
PLASTIC
A2I25D025GNR1
Freescale Semiconductor, Inc., 2015.
A
ll rights reserved.
2
RF Device Data
Freescale Semiconductor, Inc.
A2I25D025NR1 A2I25D025GNR1
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain--Source Voltage VDSS –0.5, +65 Vdc
Gate--Source Voltage VGS –0.5, +10 Vdc
Operating Voltage VDD 32, +0 Vdc
Storage Temperature Range Tstg –65 to +150 C
Case Operating Temperature Range TC–40 to +150 C
Operating Junction Temperature Range (1,2) TJ–40 to +225 C
Input Power Pin 20 dBm
Table 2. Thermal Characteristics
Characteristic Symbol Value (2,3) Unit
Thermal Resistance, Junction to Case
Case Temperature 74C, 3.2 W, 2496 MHz
Stage 1, 28 Vdc, IDQ1(A+B) =56mA
Stage 2, 28 Vdc, IDQ2(A+B) = 136 mA
RJC
6.3
1.8
C/W
Table 3. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD22--A114) 1B
Machine Model (per EIA/JESD22--A115) A
Charge Device Model (per JESD22--C101) II
Table 4. Moisture Sensitivity Level
Test Methodology Rating Package Peak Temperature Unit
Per JESD22--A113, IPC/JEDEC J--STD--020 3260 C
Table 5. Electrical Characteristics (TA=25C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Stage 1 -- Off Characteristics (4)
Zero Gate Voltage Drain Leakage Current
(VDS =65Vdc,V
GS =0Vdc)
IDSS — — 10 Adc
Zero Gate Voltage Drain Leakage Current
(VDS =32Vdc,V
GS =0Vdc)
IDSS — — 1 Adc
Gate--Source Leakage Current
(VGS =1.0Vdc,V
DS =0Vdc)
IGSS — — 1 Adc
Stage 1 -- On Characteristics
Gate Threshold Voltage (4)
(VDS =10Vdc,I
D=2.5Adc)
VGS(th) 0.8 1.2 1.6 Vdc
Gate Quiescent Voltage
(VDS =28Vdc,I
DQ1(A+B) =59mAdc)
VGS(Q) —2.0 —Vdc
Fixture Gate Quiescent Voltage
(VDD =28Vdc,I
DQ1(A+B) = 59 mAdc, Measured in Functional Test)
VGG(Q) 4.6 5.3 6.1 Vdc
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select
Documentation/Application Notes -- AN1955.
4. Each side of device measured separately.
(continued)
A2I25D025NR1 A2I25D025GNR1
3
RF Device Data
Freescale Semiconductor, Inc.
Table 5. Electrical Characteristics (TA=25C unless otherwise noted) (continued)
Characteristic Symbol Min Typ Max Unit
Stage 2 -- Off Characteristics (1)
Zero Gate Voltage Drain Leakage Current
(VDS =65Vdc,V
GS =0Vdc)
IDSS — — 10 Adc
Zero Gate Voltage Drain Leakage Current
(VDS =32Vdc,V
GS =0Vdc)
IDSS — — 1 Adc
Gate--Source Leakage Current
(VGS =1.0Vdc,V
DS =0Vdc)
IGSS — — 1 Adc
Stage 2 -- On Characteristics
Gate Threshold Voltage (1)
(VDS =10Vdc,I
D=16Adc)
VGS(th) 0.8 1.2 1.6 Vdc
Gate Quiescent Voltage
(VDS =28Vdc,I
DQ2(A+B) = 157 mAdc)
VGS(Q) —1.9 —Vdc
Fixture Gate Quiescent Voltage
(VDD =28Vdc,I
DQ2(A+B) = 157 mAdc, Measured in Functional Test)
VGG(Q) 4.3 5.0 5.8 Vdc
Drain--Source On--Voltage (1)
(VGS =10Vdc,I
D= 200 mAdc)
VDS(on) 0.1 0.22 1.5 Vdc
Functional Tests (2,3) (In Freescale Production Test Fixture, 50 ohm system) VDD =28Vdc,I
DQ1(A+B) =59mA,I
DQ2(A+B) = 157 mA,
Pout = 3.2 W Avg., f = 2690 MHz, Single--Carrier W--CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on
CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ 5MHzOffset.
Power Gain Gps 30.5 31.9 34.5 dB
Power Added Efficiency PAE 18.0 19.7 — %
Load Mismatch (In Freescale Production Test Fixture, 50 ohm system) IDQ1(A+B) =59mA,I
DQ2(A+B) = 157 mA, f = 2600 MHz
VSWR 10:1 at 32 Vdc, 36.3 W CW Output Power
(3 dB Input Overdrive from 25 W CW Rated Power)
No Device Degradation
Typical Performance (4) (In Freescale Characterization Test Fixture, 50 ohm system) VDD =28Vdc,I
DQ1(A+B) =56mA,I
DQ2(A+B) = 136 mA,
2300–2690 MHz Bandwidth
Pout @ 1 dB Compression Point, CW P1dB —24 — W
Pout @ 3 dB Compression Point, CW (5) P3dB —35.5 — W
AM/PM
(Maximum value measured at the P3dB compression point across
the 2300–2690 MHz frequency range.)
—–9.0 —
VBW Resonance Point
(IMD Third Order Intermodulation Inflection Point)
VBWres —170 —MHz
Quiescent Current Accuracy over Temperature (6)
with 4.7 kGate Feed Resistors (–30 to 85C) Stage 1
with 4.7 kGate Feed Resistors (–30 to 85C) Stage 2
IQT
—
—
2.43
1.13
—
—
%
Gain Flatness in 390 MHz Bandwidth @ Pout =3.2WAvg. GF—0.8 —dB
Gain Variation over Temperature
(–30Cto+85C)
G — 0.036 —dB/C
Output Power Variation over Temperature
(–30Cto+85C)
P1dB —0.004 —dB/C
Table 6. Ordering Information
Device Tape and Reel Information Package
A2I25D025NR1
R1 Suffix = 500 Units, 44 mm Tape Width, 13--inch Reel
TO--270WB--17
A2I25D025GNR1 TO--270WBG--17
1. Each side of device measured separately.
2. Part internally input and output matched.
3. Measurements made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for gull
wing (GN) parts.
4. All data measured in fixture with device soldered to heatsink.
5. P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W--CDMA single--carrier input signal where
output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.
6. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987, Quiescent Current Control
for the RF Integrated Circuit Device Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1977 or AN1987.
4
RF Device Data
Freescale Semiconductor, Inc.
A2I25D025NR1 A2I25D025GNR1
Figure 3. A2I25D025NR1 Production Test Circuit Component Layout
VDD2A A2I25D025N
Rev. P1
D62771
VDD2B
VDD1B
VGG2B
VGG1B
VGG1A
VGG2A
VDD1A
Z1 Z2
R1
R2
R5
R3
R4
C1
C2
C7
C8
C9
C10
C11
C13
C14
C12
C17
C18
C3
C4
C15
C16
C19 C21
C20 C22
C5
C6 R6
CUT OUT AREA
Table 7. A2I25D025NR1 Production Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 0.9 pF Chip Capacitors ATC600F0R9BT250XT ATC
C3, C4 15 pF Chip Capacitors ATC600F150JT250XT ATC
C5, C6 30 pF Chip Capacitors ATC600F300JT250XT ATC
C7, C8, C9, C10, C15, C16,
C19, C20
4.7 F Chip Capacitors GRM31CR71H475KA12L Murata
C11, C12, C17, C18, C21,
C22
10 F Chip Capacitors GRM31CR61H106KA12L Murata
C13, C14 1 F Chip Capacitors GRM31MR71H105KA88L Murata
R1, R4 4.7 KChip Resistors CRCW12064K70FKEA Vishay
R2, R3 2.2 k, 1/4 W Chip Resistors CRCW12062K20FKEA Vishay
R5, R6 50 , 10 W Chip Resistors 060120A15Z50--2 Anaren
Z1, Z2 2300–2900 MHz Band, 3 dB Hybrid Couplers X3C26P1-03S Anaren
PCB Rogers RO4350B, 0.020,r=3.66 D62771 MTL
A2I25D025NR1 A2I25D025GNR1
5
RF Device Data
Freescale Semiconductor, Inc.
Figure 4. A2I25D025NR1 Characterization Test Circuit Component Layout
VDD2A
A2I25D025N
Rev. 2
D62833
Q1
VDD2B
VDD1B
VGG2B
VGG1B
VGG1A
VGG2A
VDD1A
R1
R3
R5
Z1 Z2
R2
R4
C1
C2
C5 C7 C9
C11
C6 C8
C12
C10
C13
C15
C14
C16
C3
C4 R6
Note: All data measured in fixture with device soldered to heatsink.
Table 8. A2I25D025NR1 Characterization Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 0.9 pF Chip Capacitors ATC600F0R9BT250XT ATC
C3, C4 20 pF Chip Capacitors ATC600F200JT250XT ATC
C5, C6, C7, C8, C15, C16 4.7 F Chip Capacitors GRM31CR71H475KA12L Murata
C9, C10, C13, C14 10 F Chip Capacitors GRM31CR61H106KA12L Murata
C11, C12 1.0 F Chip Capacitors GRM31MR71H105KA88L Murata
Q1 RF LDMOS Power Amplifier A2I25D025NR1 Freescale
R1, R2 2.2 k, 1/4 W Chip Resistors CRCW12062K20FKEA Vishay
R3, R4 4.7 k, 1/4 W Chip Resistors CRCW12064K70FKEA Vishay
R5, R6 50 , 8 W Chip Resistors C8A50Z4A Anaren
Z1, Z2 2300–2900 MHz Band, 3 dB Hybrid Couplers X3C26P1-03S Anaren
PCB Rogers RO4350B, 0.020,r=3.66 D62833 MTL
6
RF Device Data
Freescale Semiconductor, Inc.
A2I25D025NR1 A2I25D025GNR1
TYPICAL CHARACTERISTICS
PARC (dB)
-- 0 . 8
-- 0 . 4
-- 0 . 5
-- 0 . 6
-- 0 . 7
-- 0 . 9
2300
f, FREQUENCY (MHz)
Figure 5. Single--Carrier Output Peak--to--Average Ratio Compression
(PARC) Broadband Performance @ Pout = 3.2 Watts Avg.
31
33
32.8
32.6
-- 4 8
20.5
20
19.5
19
--45.5
-- 4 6
--46.5
-- 4 7
PAE, POWER ADDED
EFFICIENCY (%)
Gps, POWER GAIN (dB)
32.4
32.2
32
31.8
31.6
31.4
31.2
2350 2400 2450 2500 2550 2600 2650 2700
18.5
--47.5
ACPR (dBc)
Figure 6. Intermodulation Distortion Products
versus Two--Tone Spacing
TWO--TONE SPACING (MHz)
10
-- 7 0
-- 1 0
-- 2 0
-- 3 0
-- 5 0
1 300
IMD, INTERMODULATION DISTORTION (dBc)
-- 4 0
Figure 7. Output Peak--to--Average Ratio
Compression (PARC) versus Output Power
Pout, OUTPUT POWER (WATTS)
-- 1
-- 3
4
0
-- 2
-- 4
OUTPUT COMPRESSION AT 0.01%
PROBABILITY ON CCDF (dB)
26812
10
40
35
30
25
20
15
PAE, POWER ADDED EFFICIENCY (%)
10
ACPR
PARC
ACPR (dBc)
-- 5 0
-- 2 0
-- 2 5
-- 3 0
-- 4 0
-- 3 5
-- 4 5
32.2
Gps, POWER GAIN (dB)
32
31.8
31.6
31.4
31.2
31
Gps
-- 5
1
ACPR
PARC
Gps
IM7--L
IM7--U
IM3--L
100
--1dB=3.6W --2dB=5.4W
--3dB=7.2W
IM3--U
VDD =28Vdc,I
DQ1(A+B) =56mA,I
DQ2(A+B) = 136 mA
f = 2590 MHz, Single--Carrier W--CDMA
3.84 MHz Channel Bandwidth, Input Signal
PAR = 9.9 dB @ 0.01% Probability on CCDF
VDD =28Vdc,P
out =3.2W(Avg.),I
DQ1(A+B) =56mA
IDQ2(A+B) = 136 mA, Single--Carrier W--CDMA
3.84 MHz Channel Bandwidth PAE
PAE
VDD =28Vdc,P
out = 13.5 W (PEP), IDQ1(A+B) =56mA
IDQ2(A+B) = 136 mA, Two--Tone Measurements
(f1 + f2)/2 = Center Frequency of 2590 MHz
IM5--U
IM5--L
-- 6 0
Input Signal PAR = 9.9 dB @ 0.01%
Probability on CCDF
A2I25D025NR1 A2I25D025GNR1
7
RF Device Data
Freescale Semiconductor, Inc.
TYPICAL CHARACTERISTICS
1
Pout, OUTPUT POWER (WATTS) AVG.
Figure 8. Single--Carrier W--CDMA Power Gain, Power Added
Efficiency and ACPR versus Output Power — 2496–2690 MHz
-- 1 0
-- 2 0
24
36
0
60
50
40
30
20
Gps, POWER GAIN (dB)
34
32
10 50
10
-- 6 0
ACPR (dBc)
30
28
26
0
-- 3 0
-- 4 0
-- 5 0
ACPR
2590 MHz
VDD =28Vdc,I
DQ1(A+B) =56mA,I
DQ2(A+B) = 136 mA
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF
Gps
2690 MHz
2690 MHz
2590 MHz
2496 MHz
2496 MHz
2590 MHz
2690 MHz
PAE
PAE, POWER ADDED EFFICIENCY (%)
2496 MHz
1
Pout, OUTPUT POWER (WATTS) AVG.
Figure 9. Single--Carrier W--CDMA Power Gain, Power Added
Efficiency and ACPR versus Output Power — 2300–2400 MHz
-- 1 0
-- 2 0
24
36
0
60
50
40
30
20
Gps, POWER GAIN (dB)
34
32
10 50
10
-- 6 0
ACPR (dBc)
30
28
26
0
-- 3 0
-- 4 0
-- 5 0
ACPR
Gps
PAE
PAE, POWER ADDED EFFICIENCY (%)
2400 MHz 2350 MHz 2300 MHz
VDD =28Vdc,I
DQ1(A+B) =56mA,I
DQ2(A+B) = 136 mA
Single--Carrier W--CDMA, 3.84 MHz Channel
Bandwidth, Input Signal PAR = 9.9 dB @ 0.01%
Probability on CCDF 2300 MHz
2400 MHz
2350 MHz
2300 MHz
2350 MHz 2400 MHz
Figure 10. Broadband Frequency Response
24
36
f, FREQUENCY (MHz)
VDD =28Vdc
Pin =0dBm
IDQ1(A+B) =56mA
IDQ2(A+B) = 136 mA
32
30
28
GAIN (dB)
34
26
1500 1750 2000 2250 2500 2750 3500
Gain
3000 3250
Note: Frequency response at band edges limited by hybrid couplers.
8
RF Device Data
Freescale Semiconductor, Inc.
A2I25D025NR1 A2I25D025GNR1
Table 9. Load Pull Performance — Maximum Power Tuning
VDD =28Vdc,I
DQ1(A) =29mA,IDQ2(A) =75mA,Pulsed CW, 10 sec(on), 10% Duty Cycle
f
(MHz)
Zsource
()
Zin
()
Max Output Power
P1dB
Zload (1)
()Gain (dB) (dBm) (W)
PAE
(%)
AM/PM
()
2300 35.0 + j9.89 36.0 – j13.0 10.4 – j9.63 30.4 42.6 18 59.0 –2
2350 43.2 + j11.9 41.9 – j16.8 10.8 – j11.0 30.5 42.5 18 56.9 –2
2400 45.8 + j23.1 43.5 – j26.0 10.6 – j8.31 30.7 42.3 17 57.2 –3
2496 43.9 + j37.9 40.7 – j37.0 10.1 – j8.37 31.0 42.6 18 60.5 –3
2590 33.1 + j43.7 31.4 – j41.4 9.32 – j9.38 31.0 42.7 19 60.9 –3
2690 29.5 + j41.2 28.0 – j37.3 7.84 – j9.97 30.7 42.7 18 60.8 –4
f
(MHz)
Zsource
()
Zin
()
Max Output Power
P3dB
Zload (2)
()Gain (dB) (dBm) (W)
PAE
(%)
AM/PM
()
2300 35.0 + j9.89 37.3 – j16.5 9.84 – j10.3 28.2 43.3 21 59.2 –6
2350 43.2 + j11.9 41.5 – j20.9 10.6 – j11.4 28.5 43.2 21 58.3 –7
2400 45.8 + j23.1 41.0 – j29.4 10.6 – j8.89 28.6 43.1 21 58.9 –8
2496 43.9 + j37.9 37.0 – j37.7 10.3 – j9.50 28.8 43.4 22 61.4 –8
2590 33.1 + j43.7 28.2 – j40.5 9.50 – j10.2 28.9 43.5 23 61.3 –8
2690 29.5 + j41.2 25.3 – j35.2 8.12 – j11.0 28.5 43.4 22 61.6 –11
(1) Load impedance for optimum P1dB power.
(2) Load impedance for optimum P3dB power.
Zsource = Measured impedance presented to the input of the device at the package reference plane.
Zin = Impedance as measured from gate contact to ground.
Zload = Measured impedance presented to the output of the device at the package reference plane.
Note: Measurement made on a per side basis.
Input Load Pull
Tuner and Test
Circuit
Device
Under
Test
Zsource Zin Zload
Output Load Pull
Tuner and Test
Circuit
A2I25D025NR1 A2I25D025GNR1
9
RF Device Data
Freescale Semiconductor, Inc.
Table 10. Load Pull Performance — Maximum Power Added Efficiency Tuning
VDD =28Vdc,I
DQ1(A) =29mA,IDQ2(A) =75mA,Pulsed CW, 10 sec(on), 10% Duty Cycle
f
(MHz)
Zsource
()
Zin
()
Max Power Added Efficiency
P1dB
Zload (1)
()Gain (dB) (dBm) (W)
PAE
(%)
AM/PM
()
2300 35.0 + j9.89 38.0 – j10.9 18.2 – j1.09 31.8 40.8 12 67.0 –6
2350 43.2 + j11.9 45.1 – j14.7 16.1 – j0.71 31.9 40.9 12 64.2 –6
2400 45.8 + j23.1 46.9 – j26.5 14.9 – j0.56 31.9 41.1 13 65.4 –5
2496 43.9 + j37.9 42.8 – j38.7 12.1 – j2.47 31.9 41.6 14 67.5 –6
2590 33.1 + j43.7 32.9 – j44.4 9.72 – j2.39 32.1 41.3 14 68.8 –7
2690 29.5 + j41.2 28.3 – j41.3 7.82 – j4.78 31.8 41.4 14 67.9 –9
f
(MHz)
Zsource
()
Zin
()
Max Power Added Efficiency
P3dB
Zload (2)
()Gain (dB) (dBm) (W)
PAE
(%)
AM/PM
()
2300 35.0 + j9.89 38.7 – j13.1 17.2 – j2.23 29.7 41.7 15 66.7 –11
2350 43.2 + j11.9 44.6 – j17.7 15.8 – j2.22 29.8 41.9 15 64.7 –9
2400 45.8 + j23.1 45.2 – j28.8 14.2 – j0.88 29.9 41.9 15 65.7 –10
2496 43.9 + j37.9 40.4 – j39.4 11.9 – j2.47 29.9 42.3 17 67.9 –11
2590 33.1 + j43.7 30.3 – j43.9 9.68 – j2.97 30.0 42.1 16 68.5 –12
2690 29.5 + j41.2 25.7 – j39.0 7.97 – j5.65 29.7 42.4 17 67.4 –15
(1) Load impedance for optimum P1dB efficiency.
(2) Load impedance for optimum P3dB efficiency.
Zsource = Measured impedance presented to the input of the device at the package reference plane.
Zin = Impedance as measured from gate contact to ground.
Zload = Measured impedance presented to the output of the device at the package reference plane.
Note: Measurement made on a per side basis.
Input Load Pull
Tuner and Test
Circuit
Device
Under
Test
Zsource Zin Zload
Output Load Pull
Tuner and Test
Circuit
10
RF Device Data
Freescale Semiconductor, Inc.
A2I25D025NR1 A2I25D025GNR1
P1dB -- TYPICAL LOAD PULL CONTOURS — 2590 MHz
Figure 11. P1dB Load Pull Output Power Contours (dBm)
REAL ()
-- 1 4
0
-- 4
IMA
G
INARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
NOTE: = Maximum Output Power
= Maximum Power Added Efficiency
P
E
Gain
Power Added Efficiency
Linearity
Output Power
Figure 12. P1dB Load Pull Efficiency Contours (%)
REAL ()
Figure 13. P1dB Load Pull Gain Contours (dB)
REAL ()
Figure 14. P1dB Load Pull AM/PM Contours ()
REAL ()
-- 1 2
-- 1 4
0
-- 4
IMAGINARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
-- 1 2
-- 1 4
0
-- 4
IMA
G
INARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
-- 1 2
-- 1 4
0
-- 4
IMAGINARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
-- 1 2
40.5 41
P
E
41.5
42 42.5
41
40.5
40
39.5
P
E
52
56
54 58 60
62
64
66
68
29
29.5 P
E
30
30.5
31
31.5
32
28.5
-- 1 0
-- 1 2
-- 1 4
-- 4
-- 6
-- 8
P
E
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Freescale Semiconductor, Inc.
P3dB -- TYPICAL LOAD PULL CONTOURS — 2590 MHz
Figure 15. P3dB Load Pull Output Power Contours (dBm)
REAL ()
-- 1 4
0
-- 4
IMA
G
INARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
NOTE: = Maximum Output Power
= Maximum Power Added Efficiency
P
E
Gain
Power Added Efficiency
Linearity
Output Power
Figure 16. P3dB Load Pull Efficiency Contours (%)
REAL ()
Figure 17. P3dB Load Pull Gain Contours (dB)
REAL ()
Figure 18. P3dB Load Pull AM/PM Contours ()
REAL ()
-- 1 2
-- 1 4
0
-- 4
IMAGINARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
-- 1 2
-- 1 4
0
-- 4
IMA
G
INARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
-- 1 2
-- 1 4
0
-- 4
IMAGINARY ()
810
12416
-- 2
-- 8
-- 1 0
614
-- 6
-- 1 2
P
E
40.5
40 41 41.5
42
42.5
43
43.5
P
E
52
54
56
58
60
62
64
66
68
27.5
27 P
E
26.5
28
28.5
29
29.5
30
P
E
-- 6
-- 1 0
-- 8
-- 1 2
-- 1 4
-- 1 6
-- 1 8
-- 2 0
-- 2 2
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RF Device Data
Freescale Semiconductor, Inc.
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PACKAGE DIMENSIONS
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RF Device Data
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RF Device Data
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RF Device Data
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RF Device Data
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A2I25D025NR1 A2I25D025GNR1
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family
Engineering Bulletins
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
Electromigration MTTF Calculator
RF High Power Model
.s2p File
Development Tools
Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to
Software & Tools on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision Date Description
0Mar. 2015 Initial release of data sheet
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Document Number: A2I25D025N
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