STPS2045C Power Schottky rectifier Features A1 Very small conduction losses A2 Negligible switching losses Extremely fast switching Insulated package: TO-220FPAB Insulating voltage = 2000 V DC Capacitance = 12 pF K A2 A1 K K TO-220AB STPS2045CT Avalanche rated I2PAK STPS2045CR Description K Dual center tap Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged either in TO-220AB, TO-220FPAB, I2PAK, or D2PAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. February 2010 A2 A1 K A1 A2 TO-220FPAB STPS2045CFP Table 1. Doc ID 3506 Rev 6 A2 A1 D2PAK STPS2045CG Device summary Symbol Value IF(AV) 2 x 10 A VRRM 45 V Tj(max) 175 C VF(typ) 0.57 V 1/10 www.st.com 10 Characteristics STPS2045C 1 Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A IF(AV) Average forward current = 0.5 TO-220AB D2PAK I2PAK Tc = 155 C Per diode 10 TO-220FPAB Tc = 125 C Per device 20 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A PARM Repetitive peak avalanche power tp = 1 s Tj = 25 C 4000 W -65 to + 175 C 175 C Value Unit Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj 1. Table 3. Thermal resistances parameters Symbol Rth(j-c) Parameter TO-220AB / D2PAK / I2PAK Per diode Total 2.2 1.3 TO-220FPAB Per diode Total 4.5 3.5 Junction to case C/W TO-220AB / D2PAK / I2PAK Rth(c) Coupling 0.3 Coupling C/W TO-220FPAB 2.5 When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode 1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) Table 4. Static electrical characteristics (per diode) Symbol IR(1) Test conditions Reverse leakage current Tj = 25 C Tj = 125 C Tj = 125 C VF(1) Forward voltage drop Tj = 25 C Tj = 125 C Min. VR = VRRM IF = 10 A Typ. Max. Unit 100 A 7 15 mA 0.5 0.57 0.84 IF = 20 A 0.65 0.72 1. Pulse test : tp = 380 s, < 2% To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.015 IF2(RMS) 2/10 Doc ID 3506 Rev 6 V STPS2045C Characteristics Figure 1. Average forward power dissipation Figure 2. vs average forward current (per diode) PF(AV)(W) Average forward current vs ambient temperature ( = 0.5, per diode) IF(AV)(A) 8 = 0.1 = 0.05 7 12 = 0.2 = 0.5 TO-220AB DPAK Rth(j-a)=Rth(j-c) 10 6 TO-220FPAB 8 =1 5 Rth(j-a)=15C/W 4 6 3 4 T T 2 2 1 IF(AV)(A) =tp/T 0 0 1 2 3 Figure 3. 4 5 6 7 8 9 =tp/T tp tp Tamb(C) 0 10 11 12 Normalized avalanche power derating vs pulse duration 0 25 50 Figure 4. 75 100 125 150 175 Normalized avalanche power derating vs junction temperature PARM(Tj) PARM(25 C) PARM(tp) PARM(1s) 1.2 1 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(C) tp(s) 0.001 0 0.01 0.1 Figure 5. 1 10 100 1000 Non repetitive surge peak forward current vs overload duration (maximum values, per diode) 25 50 Figure 6. IM(A) 75 100 125 150 Non repetitive surge peak forward current vs overload duration (maximum values, per diode) IM(A) 140 100 2 2 (TO-220AB, D PAK, I PAK) (TO-220FPAB) 120 80 100 60 80 TC=75C TC=75C 60 40 TC=100C 40 20 TC=100C TC=125C IM TC=125C IM 20 t t t(s) =0.5 t(s) =0.5 0 0 1E-3 1E-2 1E-1 1E+0 1E-3 Doc ID 3506 Rev 6 1E-2 1E-1 1E+0 3/10 Characteristics Figure 7. STPS2045C Relative variation of thermal impedance junction to ambient vs pulse duration Figure 8. Zth(j-c)/Rth(j-c) Relative variation of thermal impedance junction to ambient vs pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 1.0 (TO-220AB, D2PAK, I2PAK) 0.8 0.8 0.6 0.6 = 0.5 = 0.5 0.4 0.4 T T = 0.2 0.2 = 0.2 0.2 = 0.1 = 0.1 tp(s) Single pulse =tp/T 0.0 1E-4 1E-3 Figure 9. 1E-2 tp tp(s) Single pulse =tp/T 0.0 1E-1 1E-3 1E+0 1E-2 1E-1 tp 1E+0 1E+1 Reverse leakage current vs reverse Figure 10. Junction capacitance vs reverse voltage applied voltage applied (typical values, per diode) (typical values, per diode) C(pF) IR(A) 1000 5E+4 F=1MHz VOSC=30mVRMS Tj=25C Tj=150C 1E+4 Tj=125C 500 Tj=100C 1E+3 Tj=75C 1E+2 Tj=50C 1E+1 Tj=25C 200 1E+0 VR(V) VR(V) 1E-1 100 0 5 10 15 20 25 30 35 40 45 Figure 11. Forward voltage drop vs forward current (maximum values, per diode) 1 2 5 10 20 50 Figure 12. Thermal resistance junction to ambient vs copper surface under tab Rth(j-a)(C/W) IFM(A) 100.0 80 Tj=125C (typical values) (Epoxy printed circuit board, copper thickness: 35 m) 2 (D PAK) 70 60 10.0 Tj=125C 50 Tj=25C 40 30 1.0 20 10 S(cm) VFM(V) 0 0.1 0.0 4/10 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 Doc ID 3506 Rev 6 5 10 15 20 25 30 35 40 STPS2045C 2 Package information Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.4 N*m to 0.6 N*m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 5. D2PAK dimensions Dimensions Ref. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 0.40 typ. 0 0.016 typ. 8 0 8 Figure 13. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 3506 Rev 6 3.70 5/10 Package information Table 6. STPS2045C TO-220AB dimensions Dimensions Ref. A oP F E "GATE" Notes 9-10 Q H1 D Inches Min. Max. Min. Max. A 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.60 0.62 D1 D1 Millimeters 1.27 typ. 0.05 typ. L20 L30 L1 b1(X3) J1 L 1 2 3 10 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.24 0.26 J1 2.40 2.72 0.094 0.107 L 13 14 0.51 0.55 L1 3.50 3.93 0.137 0.154 c e b (X3) e1 "GATE" Notes 9-10 6/10 E Doc ID 3506 Rev 6 L20 16.40 typ. 0.64 typ. L30 28.90 typ. 1.13 typ. oP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 STPS2045C Package information I2PAK dimensions Table 7. Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 A E c2 L2 D L1 A1 b1 L b c e e1 Doc ID 3506 Rev 6 7/10 Package information Table 8. STPS2045C TO-220FPAB dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F L2 E G1 G 8/10 Doc ID 3506 Rev 6 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 STPS2045C 3 Ordering information Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2045CT STPS2045CT TO-220AB 2.23 g 50 Tube STPS2045CR STPS2045CR I PAK 1.49 g 50 Tube STPS2045CFP STPS2045CFP TO-220FPAB 2.0 g 50 Tube STPS2045CG STPS2045CG D2PAK 50 Tube 1.48 g 1000 Tape and reel STPS2045CG-TR 4 2 STPS2045CG Revision history Table 10. Document revision history Date Revision Changes 05-Oct-2004 4F 01-Dec-2004 5 Figure 16 (I2PAK Package Mechanical Data): references b1 and b2 changed from 1.17mm to 1.70mm. 05-Feb-2010 6 Updated Table 2 (removed voltage). Updated ECOPACK statement. Updated Table 6.: TO-220AB dimensions. Last update Doc ID 3506 Rev 6 9/10 STPS2045C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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