Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 LMx35, LMx35A Precision Temperature Sensors 1 Features 3 Description * The LM135 series are precision, easily-calibrated, integrated circuit temperature sensors. Operating as a 2-terminal zener, the LM135 has a breakdown voltage directly proportional to absolute temperature at 10 mV/K. With less than 1- dynamic impedance, the device operates over a current range of 400 A to 5 mA with virtually no change in performance. When calibrated at 25C, the LM135 has typically less than 1C error over a 100C temperature range. Unlike other sensors, the LM135 has a linear output. 1 * * * * * * * Directly Calibrated to the Kelvin Temperature Scale 1C Initial Accuracy Available Operates from 400 A to 5 mA Less than 1- Dynamic Impedance Easily Calibrated Wide Operating Temperature Range 200C Overrange Low Cost 2 Applications * * * * Power Supplies Battery Management HVAC Appliances Applications for the LM135 include almost any type of temperature sensing over a -55C to 150C temperature range. The low impedance and linear output make interfacing to readout or control circuitry are especially easy. The LM135 operates over a -55C to 150C temperature range while the LM235 operates over a -40C to 125C temperature range. The LM335 operates from -40C to 100C. The LMx35 devices are available packaged in hermetic TO transistor packages while the LM335 is also available in plastic TO-92 packages. Device Information(1) PART NUMBER LM135 LM135A LM235 LM235A LM335 LM335A PACKAGE BODY SIZE (NOM) TO-46 (3) 4.699 mm x 4.699 mm TO-92 (3) 4.30 mm x 4.30 mm SOIC (8) 4.90 mm x 3.91 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Basic Temperature Sensor Simplified Schematic Calibrated Sensor 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 4 4 4 Absolute Maximum Ratings ...................................... Recommended Operating Conditions....................... Thermal Information .................................................. Temperature Accuracy: LM135/LM235, LM135A/LM235A ....................................................... 6.5 Temperature Accuracy: LM335, LM335A (1).............. 6.6 Electrical Characteristics........................................... 6.7 Typical Characteristics .............................................. 7 4 5 5 6 Detailed Description .............................................. 8 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 8 8 8 9 8 Application and Implementation ........................ 10 8.1 Application Information............................................ 10 8.2 Typical Application .................................................. 10 8.3 System Examples ................................................... 11 9 Power Supply Recommendations...................... 16 10 Layout................................................................... 16 10.1 10.2 10.3 10.4 Layout Guidelines ................................................. Layout Example .................................................... Waterproofing Sensors ......................................... Mounting the Sensor at the End of a Cable.......... 16 16 17 17 11 Device and Documentation Support ................. 18 11.1 11.2 11.3 11.4 11.5 Device Support...................................................... Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 18 18 18 18 18 12 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (March 2013) to Revision E * Page Added Pin Configuration and Functions section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1 Changes from Revision C (November 2012) to Revision D * 2 Page Changed layout of National Data Sheet to TI format ........................................................................................................... 18 Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 5 Pin Configuration and Functions TO-46 (NDV) 3 Pins Bottom View TO-92 (LP) 3 Pins Bottom View SOIC (D) 8 Pins Top View Pin Functions PIN NAME TO-46 TO-92 SO8 -- -- 1 -- -- 2 -- -- 3 - -- -- ADJ -- -- N.C. N.C. + I/O DESCRIPTION -- No Connection 4 O Negative output -- 5 I Calibration adjust pin -- 6 -- -- 7 -- -- 8 Copyright (c) 1999-2015, Texas Instruments Incorporated -- I No Connection Positive input Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 3 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) (4) MIN Reverse Current Forward Current Storage temperature, Tstg (1) (2) (3) (4) MAX UNIT 15 mA 10 mA 8-Pin SOIC Package -65 150 C TO / TO-92 Package -60 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Refer to RETS135H for military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN LM135, LM135A Specified Temperature LM235, LM235A LM335, LM335A Continuous (TMIN TA TMAX) Intermittent (1) Continuous (TMIN TA TMAX) Intermittent (1) Continuous (TMIN TA TMAX) Intermittent (1) Forward Current (1) NOM MAX UNIT -55 150 C 150 200 -40 125 125 150 -40 100 100 125 0.4 1 C C 5 mA Continuous operation at these temperatures for 5,000 hours for LP package may decrease life expectancy of the device. 6.3 Thermal Information THERMAL METRIC (1) RJA Junction-to-ambient thermal resistance RJC Junction-to-case thermal resistance (1) LM335 / LM335A LM235 / LM235A LM135 / LM135A SOIC (D) TO-92 (LP) TO-46 (NDV) 8 PINS 3 PINS 3 PINS 165 202 400 -- 170 -- UNIT C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Temperature Accuracy: LM135/LM235, LM135A/LM235A (1) PARAMETER TEST CONDITIONS LM135A/LM235A LM135/LM235 MIN TYP MAX MIN TYP MAX 2.97 2.95 UNIT Operating Output Voltage TC = 25C, IR = 1 mA 2.98 2.99 2.98 3.01 V Uncalibrated Temperature Error TC = 25C, IR = 1 mA 0.5 1 1 3 C Uncalibrated Temperature Error TMIN TC TMAX, IR = 1 mA 1.3 2.7 2 5 C Temperature Error with 25C TMIN TC TMAX, IR = 1 mA 0.3 1 0.5 1.5 C Calibration Calibrated Error at Extended TC = TMAX (Intermittent) Temperature Non-Linearity IR = 1 mA 0.5 0.3 (1) 4 2 0.3 2 C 1 C Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered. Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 6.5 Temperature Accuracy: LM335, LM335A (1) PARAMETER LM335A TEST CONDITIONS LM335 MIN TYP MAX MIN TYP MAX 2.95 2.92 UNIT Operating Output Voltage TC = 25C, IR = 1 mA 2.98 3.01 2.98 3.04 V Uncalibrated Temperature Error TC = 25C, IR = 1 mA 1 3 2 6 C Uncalibrated Temperature Error TMIN TC TMAX, IR = 1 mA 2 5 4 9 C Temperature Error with 25C TMIN TC TMAX, IR = 1 mA 0.5 1 1 2 C Calibration Calibrated Error at Extended TC = TMAX (Intermittent) Temperature Non-Linearity IR = 1 mA 1.5 0.3 (1) 2 0.3 2 C 1.5 C Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered. 6.6 Electrical Characteristics See (1) . PARAMETER TEST CONDITIONS LM135/LM235/LM135A/LM 235A MIN TYP MAX 10 LM335/LM335A UNIT MIN TYP MAX 3 14 Operating Output Voltage Change with Current 400 A IR 5 mA, At Constant Temperature 2.5 Dynamic Impedance IR = 1 mA 0.5 0.6 10 10 mV/C Still Air 80 80 sec 100 ft/Min Air 10 10 sec 1 1 0.2 0.2 Output Voltage Temperature Coefficient Time Constant Stirred Oil Time Stability (1) TC = 125C mV sec C/khr Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered. Copyright (c) 1999-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 5 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com 6.7 Typical Characteristics 6 Figure 1. Reverse Voltage Change Figure 2. Calibrated Error Figure 3. Reverse Characteristics Figure 4. Response Time Figure 5. Dynamic Impedance Figure 6. Noise Voltage Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 Typical Characteristics (continued) Figure 7. Thermal Resistance Junction To Air Figure 8. Thermal Time Constant Figure 9. Thermal Response In Still Air Figure 10. Thermal Response In Stirred Oil Bath Figure 11. Forward Characteristics Copyright (c) 1999-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 7 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com 7 Detailed Description 7.1 Overview Applications for the LM135 include almost any type of temperature sensing over a -55C to 150C temperature range. The low impedance and linear output make interfacing to readout or control circuitry especially easy. The LM135 operates over a -55C to 150C temperature range while the LM235 operates over a -40C to 125C temperature range. The LM335 operates from -40C to 100C. Operating as a 2-terminal zener, the LM135 has a breakdown voltage directly proportional to absolute temperature at 10 mV/K. With less than 1- dynamic impedance, the device operates over a current range of 400 A to 5 mA with virtually no change in performance. When calibrated at 25C, the LM135 has typically less than 1C error over a 100C temperature range. Unlike other sensors, the LM135 has a linear output. 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Temperature Calibration Using ADJ Pin Included on the LM135 chip is an easy method of calibrating the device for higher accuracies. A pot connected across the LM135 with the arm tied to the adjustment terminal (as shown in Figure 12) allows a 1-point calibration of the sensor that corrects for inaccuracy over the full temperature range. This single point calibration works because the output of the LM135 is proportional to absolute temperature with the extrapolated output of sensor going to 0-V output at 0 K (-273.15C). Errors in output voltage versus temperature are only slope (or scale factor) errors so a slope calibration at one temperature corrects at all temperatures. The output of the device (calibrated or uncalibrated) can be expressed as: where 8 Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 Feature Description (continued) * * T is the unknown temperature in degrees Kelvin To is a reference temperature in degrees Kelvin (1) By calibrating the output to read correctly at one temperature the output at all temperatures is correct. Nominally the output is calibrated at 10 mV/K. Calibrate for 2.982V at 25C Figure 12. Calibrated Sensor 7.4 Device Functional Modes The LM135 has two functional modes calibrated and uncalibrated. For optimum accuracy, a one point calibration is recommended. For more information on calibration, see Temperature Calibration Using ADJ Pin. Copyright (c) 1999-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 9 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information To insure good sensing accuracy, several precautions must be taken. Like any temperature-sensing device, selfheating can reduce accuracy. The LM135 should be operated at the lowest current suitable for the application. Sufficient current, of course, must be available to drive both the sensor and the calibration pot at the maximum operating temperature as well as any external loads. If the sensor is used in an ambient where the thermal resistance is constant, self-heating errors can be calibrated out. This is possible if the device is run with a temperature-stable current. Heating will then be proportional to zener voltage and therefore temperature. This makes the self-heating error proportional to absolute temperature the same as scale factor errors. 8.2 Typical Application Figure 13. Basic Temperature Sensor 8.2.1 Design Requirements Table 1. Design Parameters PARAMETER Accuracy at 25C Accuracy from -55 C to 150 C Forward Current Temperature Slope EXAMPLE VALUE 1C 2.7C 1 mA 10m V/K 8.2.2 Detailed Design Procedure For optimum accuracy, R1 is picked such that 1 mA flows through the sensor. Additional error can be introduced by varying load currents or varying supply voltage. The influence of these currents on the minimum and maximum reverse current flowing through the LM135 should be calculated and be maintained in the range of 0.4 mA to 5 mA. Minimizing the current variation through the LM135 will provide for the best accuracy. The Operating Output Voltage Change with Current specification can be used to calculate the additional error which could be up to 1 K maximum from the LM135A, for example. 10 Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 8.2.3 Application Curve Figure 14. Reverse Characteristics 8.3 System Examples Figure 15. Wide Operating Supply Figure 16. Minimum Temperature Sensing Wire length for 1C error due to wire drop Figure 17. Average Temperature Sensing Copyright (c) 1999-2015, Texas Instruments Incorporated Figure 18. Isolated Temperature Sensor Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 11 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com System Examples (continued) Figure 19. Simple Temperature Controller Adjust R2 for 2.554V across LM336. Figure 20. Simple Temperature Control Adjust for 2.7315V at output of LM308 Adjust R1 for correct output. Figure 21. Ground Referred Fahrenheit Thermometer Figure 22. Centigrade Thermometer To calibrate adjust R2 for 2.554V across LM336. Adjust R1 for correct output. Figure 23. Fahrenheit Thermometer 12 Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 System Examples (continued) 8.3.1 Thermocouple Cold Junction Compensation Compensation for Grounded Thermocouple Select R3 for proper thermocouple type Figure 24. Thermocouple Cold Junction Compensation THERMO-COUPLE R3 (1%) SEEBECK COEFFICIENT J 377 52.3 V/C T 308 42.8 V/C K 293 40.8 V/C S 45.8 6.4 V/C Adjustments: Compensates for both sensor and resistor tolerances 1. Short LM329B 2. Adjust R1 for Seebeck Coefficient times ambient temperature (in degrees K) across R3. 3. Short LM335 and adjust R2 for voltage across R3 corresponding to thermocouple type. J 14.32 mV K 11.17 mV T 11.79 mV S 1.768 mV 1. 2. THERMO-COUPLE R3 R4 SEEBECK COEFFICIENT J 1.05K 385 52.3 V/C T 856 315 42.8 V/C K 816 300 40.8 V/C S 128 46.3 6.4 V/C Adjustments: Adjust R1 for the voltage across R3 equal to the Seebeck Coefficient times ambient temperature in degrees Kelvin. Adjust R2 for voltage across R4 corresponding to thermocouple. J 14.32 mV T 11.79 mV K 11.17 mV S 1.768 mV Copyright (c) 1999-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 13 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com Terminate thermocouple reference junction in close proximity to LM335. Adjustments: 1. Apply signal in place of thermocouple and adjust R3 for a gain of 245.7. Select R3 and R4 for thermocouple type 2. Short non-inverting input of LM308A and output of LM329B to ground. 3. Adjust R1 so that VOUT = 2.982V @ 25C. 4. Remove short across LM329B and adjust R2 so that VOUT = 246 mV @ 25C. 5. Remove short across thermocouple. 14 Figure 25. Single Power Supply Cold Junction Compensation Figure 26. Centigrade Calibrated Thermocouple Thermometer Figure 27. Differential Temperature Sensor Figure 28. Differential Temperature Sensor Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 Adjust D1 to 50 mV greater VZ than D2. Charge terminates on 5C temperature rise. Couple D2 to battery. Adjust for zero with sensor at 0C and 10T pot set at 0C Adjust for zero output with 10T pot set at 100C and sensor at 100C Output reads difference between temperature and dial setting of 10T pot Figure 29. Fast Charger For Nickel-Cadmium Batteries Figure 30. Variable Offset Thermometer *Self heating is used to detect air flow Figure 31. Ground Referred Centigrade Thermometer Copyright (c) 1999-2015, Texas Instruments Incorporated Figure 32. Air Flow Detector Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 15 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com 9 Power Supply Recommendations Ensure the LM335 is biased properly with a current ranging 0.4 mA to 5 mA. 10 Layout 10.1 Layout Guidelines The LM135 is applied easily in the same way as other integrated-circuit temperature sensors. Glue or cement the device to a surface and the temperature should be within about 0.01C of the surface temperature. Efficient temperature transfer assumes that the ambient air temperature is almost the same as the surface temperature where the LM135 leads are attached. If there is a great difference between the air temperature and the surface temperature, the actual temperature of the LM135 die would be at an intermediate temperature between the two temperatures. For example, the TO-92 plastic package, where the copper leads are the principal thermal path to carry heat into the device, can be greatly affected by airflow. The temperature sensed by the TO92 package could greatly depend on velocity of the airflow as well. To lessen the affect of airflow, ensure that the wiring to the LM135 (leads and wires connected to the leads) is held at the same temperature as the surface temperature that is targeted for measurement. To insure that the temperature of the LM135 die is not affected by the air temperature, mechanically connect the LM135 leads with a bead of epoxy to the surface being measured. If air temperature is targeted for measurement ensure that the PCB surface temperature is close to the air temperature. Keep the LM135 away from offending PCB heat sources such as power regulators. One method commonly used for thermal isolation is to route a thermal well as shown in Figure 33 with the smallest possible geometry traces connecting back to rest of the PCB. 10.2 Layout Example VIA to ground plane VIA to power plane ADJ - N.C. N.C. N.C. N.C. + N.C. R1 Figure 33. Layout Example 16 Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 10.3 Waterproofing Sensors Meltable inner-core, heat-shrinkable tubing, such as manufactured by Raychem, can be used to make low-cost waterproof sensors. The LM335 is inserted into the tubing about 0.5 inches from the end and the tubing heated above the melting point of the core. The unfilled 0.5-inch end melts and provides a seal over the device. 10.4 Mounting the Sensor at the End of a Cable The main error due to a long wire is caused by the voltage drop across that wire caused by the reverse current biasing the LM135 on. Table 2 shows the wire AWG and the length of wire that would cause 1C error. Figure 34. Cable Connected Temperature Sensor Table 2. Wire Length for 1C Error Due to Wire Drop (1) IR = 1 mA IR = 0.5 mA (1) AWG FEET FEET 14 4000 8000 16 2500 5000 18 1600 3200 20 1000 2000 22 625 1250 24 400 800 For IR = 0.5 mA, the trim pot must be deleted. Copyright (c) 1999-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 17 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160E - MAY 1999 - REVISED FEBRUARY 2015 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 Device Nomenclature Operating Output Voltage: The voltage appearing across the positive and negative terminals of the device at specified conditions of operating temperature and current. Uncalibrated Temperature Error: The error between the operating output voltage at 10 mV/K and case temperature at specified conditions of current and case temperature. Calibrated Temperature Error: The error between operating output voltage and case temperature at 10 mV/K over a temperature range at a specified operating current with the 25C error adjusted to zero. 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM135 Click here Click here Click here Click here Click here LM135A Click here Click here Click here Click here Click here LM235 Click here Click here Click here Click here Click here LM235A Click here Click here Click here Click here Click here LM335 Click here Click here Click here Click here Click here LM335A Click here Click here Click here Click here Click here 11.3 Trademarks All trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright (c) 1999-2015, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM135AH ACTIVE TO NDV 3 500 TBD Call TI Call TI -55 to 150 ( LM135AH, LM135AH ) LM135AH/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 150 ( LM135AH, LM135AH ) LM135H ACTIVE TO NDV 3 500 TBD Call TI Call TI -55 to 150 ( LM135H, LM135H) LM135H/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 150 ( LM135H, LM135H) LM235AH ACTIVE TO NDV 3 500 TBD Call TI Call TI -40 to 125 ( LM235AH, LM235AH ) LM235AH/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM235AH, LM235AH ) LM235H ACTIVE TO NDV 3 500 TBD Call TI Call TI -40 to 125 ( LM235H, LM235H) LM235H/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM235H, LM235H) LM335A MWC ACTIVE WAFERSALE YS 0 1 TBD Call TI Call TI -40 to 85 LM335AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 100 ( LM335AH, LM335AH ) LM335AM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 100 LM335 AM LM335AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 100 LM335 AM LM335AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type -40 to 100 LM335 AZ LM335H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 100 ( LM335H, LM335H) LM335H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 100 ( LM335H, LM335H) LM335M NRND SOIC D 8 95 TBD Call TI Call TI -40 to 100 LM335 M Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM335M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335Z/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM335Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM335 Z -40 to 100 LM335 Z (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM335AMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM335AMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM335MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM335AMX SOIC D 8 2500 367.0 367.0 35.0 LM335AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM335MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE NDV0003H TO-CAN - 2.67 mm max height SCALE 1.250 TO-46 4.95 4.55 0.76 MAX 2.67 MAX 0.64 MAX UNCONTROLLED LEAD DIA 3X 12.7 MIN 3X 0.483 0.407 5.32-5.56 2 1 3 45 ( 2.54) 1.16 0.92 1.22 0.72 4219876/A 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-46. www.ti.com EXAMPLE BOARD LAYOUT NDV0003H TO-CAN - 2.67 mm max height TO-46 (2.54) 0.07 MAX ALL AROUND ( 1.2) METAL 3 3X ( 0.7) VIA SOLDER MASK OPENING (1.27) 1 (R0.05) TYP 2X ( 1.2) METAL 2 0.07 MAX TYP 2X SOLDER MASK OPENING LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:12X 4219876/A 01/2017 www.ti.com PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP SEATING PLANE (2.54) NOTE 3 2X 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 2X 2.6 0.2 3X 12.7 MIN 3X 3X 0.55 0.38 0.43 0.35 2X 1.27 0.13 FORMED LEAD OPTION STRAIGHT LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION 3X 2.67 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 0.05 MAX ALL AROUND TYP FULL R TYP METAL TYP (1.07) 3X ( 0.85) HOLE 2X METAL (1.5) 2X (1.5) 2 1 (R0.05) TYP 3 2X (1.07) (1.27) SOLDER MASK OPENING 2X SOLDER MASK OPENING (2.54) LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ALL AROUND TYP ( 1.4) 2X ( 1.4) METAL 3X ( 0.9) HOLE METAL (R0.05) TYP 2 1 (2.6) SOLDER MASK OPENING 3 2X SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 8.5 9.75 8.50 19.0 17.5 6.75 5.95 2.9 TYP 2.4 3.7-4.3 TYP 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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