Ceramic Discriminators Notice
68
18
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
■ CDBKB Series Notice (Handling)
■ CDBLA/CDBLB Series Notice (Handling)
■ CDSCB Series Notice (Handling)
1. The component mounted on the PCB may be damaged if
excessive mechanical stress is applied.
2. Layout the components on the PCB to minimize the
stress imposed on the warp or flexure of the board.
3. After installing components, if solder is excessively
applied to the circuit board, mechanical stress will cause
destruction resistance characteristics to lower. To prevent
this, be extremely careful in determining shape and
dimension before designing the circuit board diagram.
4. The component may be damaged during mounting
process if some part of mounter such as positioning
claws or nozzle are worn down. The regular maintenance
recommended for mounters should be done to prevent
troubles.
5. When correcting component's position with a soldering
iron, the tip of the soldering iron should not directly touch
the chip component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. The use of solder containing Ag should be
considered to prevent the electrode erosion.
6. Do not clean or wash the component as it is not
hermetically sealed.
7. In case of overcoating the part, coating conditions such
as material of resin, curing temperature, and so on
should be evaluated carefully.
8. Accurate test circuit values are required to measure
electrical characteristics.
It may be a cause of miscorrelation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
9. For safety purposes, avoid applying a direct current
between the terminals.
[Component Direction]
[Component Layout Close to Board]
Put the
component
laterally to the
direction in
which stress
acts.
Susceptibility to
stress is in the order
of : A>C>B
B
AC
Slit
Perforation
1. The component will be damaged when an excessive
stress is applied.
2. In the case that the component is cleaned, confirm
no reliability degradation is created.
3. In case of covering filter with over coat,
conditions such as material of resin, cure
temperature, and so on should be evaluated
carefully.
4. Do not use strong acidity flux, more than 0.2wt%
chlorine content, in re-flow soldering.
5. The product, packed in the moisture-proof bag (dry
pack), is sensitive to moisture.
The following treatment is required before
applying re-flow soldering, to avoid package
cracks or reliability degradation caused by
thermal stress. When unpacked, store the component
in an atmosphere of below 25 degrees C. and below
65%R.H., and solder within 48 hours.
1. Do not use this product with bend. The component
may be damaged if excess mechanical stress is
applied to it mounted on the printed circuit board.
2. The component will be damaged when an excessive
stress is applied.
3. All kinds of re-flow soldering must not be applied
on the component.
4. Do not clean or wash the component as it is not
hermetically sealed.
5. Do not use strong acidity flux, more than 0.2wt%
chlorine content, in flow soldering.
6. In case of covering discriminator with over coat,
conditions such as material of resin, cure
temperature, and so on should be evaluated
carefully.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note P05E.pdf
11.1.11