Multilayer Ceramic Chip Capacitors
Kyocera's series of Multilayer Ceramic Chip Capacitors
are designed to meet a wide variety of needs. We offer a
complete range of products for both general and
specialized applications, including the general-purpose
CM series, the high-voltage CF series , the low profile CT
series, and the DM series for automotive uses.
Please contact your local AVX, Kyocera sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an sales representative to confirm compatibility with
your application.
Structure
Tape and Reel
Bulk Cassette
External Termination
Electrodes
Internal Electrodes
(Pd, Pd/Ag or Ni)
Dielectric Ceramic Layer
Temperature compensation :Titanate family
High dielectric constant :
Barium Titanate family
Nickel Barrier Termination Products
Ag or Cu or
CuNi
Ni Plating
Sn Plating
Features
• We have factories worldwide in order to supply our global customer
bases quickly and efficiently and to maintain our reputation as one of
the highest-volume producers in the industry.
• All our products are highly reliable due to their monolithic structure of
high-purity and superfine uniform ceramics and their integral internal
electrodes.
• By combining superior manufacturing technology and materials with
high dielectric constants, we produce extremely compact components
with exceptional specifications.
• Our stringent quality control in every phase of production from material
procurement to shipping ensures consistent manufacturing and super
quality.
• Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to meet
specific configurational requirements.
CM
series
DM
series
CT
series
CF
series
CA
series
General
Automotive
Arrays
High-Voltage
Low Profile
Multilayer
Ceramic Chip
Capacitors
Pb Free
RoHS Conforming
Multilayer Ceramic Chip Capacitors
Series Dieletric Options Typical Applications Features Terminations Available Size
CM
CF
CT
DM
CA
C0G (NP0)
X5R
X7R 0201, 0402, 0603
X6S General Purpose Wide Cap Range Nickel Barrier 0805, 1206, 1210
X7S 1812, 2220
Y5V
0805, 1206, 1210
C0G (NP0) High Voltage High Voltage 1812, 2208, 1808
& 250VDC, 630VDC Nickel Barrier
X7R Power Circuits 1000VDC, 2000VDC 2220
3000VDC, 4000VDC
C0G (NP0)
X5R PLCC 0402, 0603, 0805
X7R (Decoupling) Low Profile Nickel Barrier 1206, 1210
Y5V
Thermal shock
X7R Automotive Resistivity Nickel Barrier 0603, 0805, 1206
High Reliability
C0G (NP0) Digital Signal Reduction in
X5R, X7R Pass line Placing Costs Nickel Barrier 0405, 0508
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:
Multilayer Ceramic Chip Capacitors
Tape & Reel
• T (Thickness) depends on capacitance value.
Standard thickness is shown on the appropriate product pages.
• CA series (please refer applicable page)
Note) Regarding support for Bulk cases, please contact us for further information.
Bulk Cassette
Size EIA CODE EIAJ CODE
Dimensions (mm)
L W P min P max P to P min T max
03
05
105
21
316
32
42
43
52
53
55
0201 0603 0.6±0.03 0.3±0.03 0.10 0.20 0.20 0.33
0402 1005 1.0±0.05 0.5±0.05 0.15 0.35 0.30 0.55
0603 1608 1.6±0.10 0.8±0.10 0.20 0.60 0.50 0.90
0805 2012 2.0±0.10 1.25±0.10 0.20 0.75 0.70 1.35
1206 3216 3.2±0.20 1.60±0.15 0.30 0.85 1.40 1.75
1210 3225 3.2±0.20 2.50±0.20 0.30 1.00 1.40 2.70
1808 4520 4.5±0.20 2.00±0.20 0.15 0.85 2.60 2.20
1812 4532 4.5±0.30 3.20±0.20 0.30 1.10 2.00 3.0
2208 5720 5.7±0.40 2.00±0.20 0.15 0.85 4.20 2.20
2211 5728 5.7±0.40 2.80±0.20 0.15 0.85 4.20 2.80
2220 5750 5.7±0.40 5.00±0.40 0.30 1.40 2.50 2.70
Size EIA CODE EIAJ CODE L W T
P P to P
min max min
05
105
21
0402 1005 1.0±0.05 0.5±0.05 0.5±0.05 0.15 0.35 0.30
0603 1608 1.6±0.07 0.8±0.07 0.8±0.07 0.20 0.60 0.50
0805 2012 2.0±0.1 1.25±0.1 0.6±0.1/1.25±0.1 0.20 0.75 0.70
Dimensions
External
Electrode
Dimensions
P
P
T
W
L
P~P
Multilayer Ceramic Chip Capacitors
Ordering Information
KYOCERA PART NUMBER: CM 21 X7R 104 K 50 A T
SERIES CODE
CM = General Purpose CA = Capacitor Arrays
CF = High Voltage
CT = Low Profile
DM
= Automotive
SIZE CODE
SIZE EIA (EIAJ) SIZE EIA (EIAJ) SIZE EIA (EIAJ)
03 = 0201 (0603) 21 = 0805 (2012) 52 = 2208 (5720)
05 = 0402 (1005) 316 = 1206 (3216) 53 = 5728 (2211)
105 = 0603 (1608) 32 = 1210 (3225) 55 = 2220 (5750)
F12 = 0508 (1220)/4cap 42 = 1808 (4520) D11 = 0405 (1012)/2cap
43 = 1812 (4532) D12 = 0508 (1220)/2cap
CODE EIA CODE
CG = C0G (NPO) X7S = X7S
X5R = X5R X6S = X6S (Option)
X7R = X7R Y5V = Y5V
Negative dielectric types are available on request.
DIELECTRIC CODE
Capacitance expressed in pF. 2 significant digits plus
number of zeros.
For Values < 10pF, Letter R denotes decimal point,
eg. 100000pF = 104 1.5pF = 1R5
0.1µF = 104 0.5pF = R50
4700pF = 472 100µF = 107
CAPACITANCE CODE
Thickness max value is indicated in CT series
EX. 125 → 1.25mm max
095 → 0.95mm max
OPTION
A =
±
0.05pF D =
±
0.5pF J =
±
5% Z = -20 to +80%
B =
±
0.1pF F =
±
1pF K =
±
10%
C =
±
0.25pF G =
±
2% M =
±
20%
TOLERANCE CODE
04 = 4VDC 100 = 100VDC 1000 = 1000VDC
06 = 6.3VDC 250 = 250VDC 2000 = 2000VDC
10 = 10VDC 400 = 400VDC 3000 = 3000VDC
16 = 16VDC 630 = 630VDC 4000 = 4000VDC
25 = 25VDC
35 = 35VDC
50 = 50VDC
VOLTAGE CODE
A = Nickel Barrier C = Silver (∗option)
B = Silver Palladium (∗option)
TERMINATION CODE
B = Bulk L = 13" Reel Taping & 4mm Cavity pitch
C = Bulk Cassette (option) H = 7" Reel Taping & 2mm Cavity pitch
T = 7" Reel Taping & 4mm Cavity pitch N = 13" Reel Taping & 2mm Cavity pitch
PACKAGING CODE
Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
High Dielectric Constant
Temperature Compensation Type
K = ±250ppm/°C, J = ±120ppm/°C, H = ±60ppm/°C, G = ±30ppm/°C
e.g. CG = 0±30ppm/°C
Note: All parts will be marked as "CG" but will conform to the above table.
Available Tolerances
Dielectric materials, capacitance values and tolerances are
available in the following combinations only:
EIA Dielectric Temperature Range ∆Cmax
X5R −55 to 85°C
X7R −55 to 125°C ±15%
X7S −55 to 125°C ±22%
X6S −55 to 105°C
Y5V −30 to 85°C −82 to +22%
Electric Code C0G U∆ SL
Value (pF) N750 +350 to −1000
0.5-2.7 CK UK SL
3.0-3.9 CJ UJ SL
4.0-9.0 CH UJ SL
≥10 CG UJ SL
Note:
∗1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF
∗2 J = ±5% for X7R(X5R) is available on request.
∗3 option
EIA Dielectric Tolerance Capacitance
COG
X5R
X6R
X7R
Y5V
∗3 A=±0.05pF <0.5pF
B=±0.1pF ≤5pF
C=±0.25pF
D=±0.50pF ∗1 <10pF
F=±1pF
G=±2% ≥10pF
J=±5%
K=±10% E12 Series
∗2 K=±10% E6 Series
M=±20%
Z=−20% to +80% E3 Series
E Standard Number
E3 E6 E12 E24 (Option)
1.0 1.0 1.1
1.2 1.2 1.3
1.5 1.5 1.6
1.8 1.8 2.0
2.2 2.2 2.4
2.7 2.7 3.0
3.3 3.3 3.6
3.9 3.9 4.3
4.7 4.7 5.1
5.6 5.6 6.2
6.8 6.8 7.5
8.2 8.2 9.1
1.0
1.0
1.5
2.2
2.2
3.3
4.7
4.7
6.8
CA Series
Capacitor Arrays
Nickel Barrier Terminations
Features
Applications
• Digital signal pass line for CPU
•
High Frequency noise reduction for I/O cable etc.
• PC • Printer
• Hard Disk Drive • CD-ROM
• Mobile telecommunication equipment
• Down sizing of digital circuit
• Reduction in assemble costs
• Reflow solderable
• First class auto placement
Capacitance Range
Dimensions
Note : E8 = 8mm width plastic tape
Recommended Land Pattern(Unit : mm) (Unit : mm)
How to Order
CA F12 X7R 103 K 25 A T
qSeries
wSize EIA(EIAJ)
F12 = 0508(1220)
eDielectric
rCapacitance Value
tTolerance
yVoltage
uTermination
iPackaging
qw e rt y u i
L W P A B
F12
1.25±0.15 2.00±0.15
0.1min
0.50±0.10 0.25±0.10
D11
1.00±0.15 1.37±0.15
0.1min
0.64±0.10 0.36±0.10
D12
1.25±0.15 2.00±0.15
0.1min
1.00±0.10 0.60±0.20
L
F12
T
P
A
W
B
L
D11, D12 F12 D11, D12
T
P
A
W
B
cccc
d
a
b
a
cc
d
a
b
a
a b c d
F12 0.5 0.5 0.3 0.5
D11 0.69 0.28 0.3 0.64
D12 0.68 0.64 0.46 1.0
• Capacitances other than indicated in the above chart are optional.
Size
Rated Voltage (VDC)
Capacitance (pF)
100 10
15
22
33
47
68
101 100
220
470
102 1000
2200
4700
103 10000
22000
47000
104 100000
220000
470000
105 1000000
2200000
4700000
D11
(1014)
2 elements 4 elements
D12
(1220)
F12
(1220)
X7R
25
C
C
Y5V
16
C
X5R
10
C
C∆C∆
50
C
A
X5R
10
D
X5R
6.325
B
10
A
X7R
16
A
A
Numbers of
elements
Temperature
Characteristics
A C DB
Size
Thickness
(mm)
Taping(180 dia reel)
Taping(330 dia reel)
D11、D12、F12
0.66max 0.9max 0.95max 1.0max
4kp(P8) 4kp(P8) 4kp(P8) 4kp(E8)
10kp(P8) 10kp(P8) 10kp(P8) 10kp(E8)
CA Series
Capacitor Arrays
Cross Talk Characteristics
X7R Dielectric COG Dielectric
Test Circuit
*
-
W
W
W
W
!"#$%&' (!()*"& )%'%($( "$"## ,(-'(&. / 01-
2 ,(&("#"& #"# "# )%'%($( "$"## ,(-'(&. / 01
31&
45
- 6
7 ( 58 &" 5
-
9: ;66 5
-(,: (&&() -&%4#(' :0 1
-
9: ; 5
-%
45
- 6
7 ( 58 &" 5
-(,: (&&() -&%4#(' :0 1
Multilayer Ceramic Chip Capacitors
Electrical Characteristics
10
-10 -60 -40 -20 0 20 40 60 80 100 120
-5
0
5
DCapacitance(%)
Temperature(°C)
at 1MHz, 1Vrms
C∆
U∆
Aging
(change of capacitance over time)
Capacitance-Temperature
(temperature compensation)
Impedance-Frequency
10
-30
10 100 1,000 100,00010,000
-20
-10
0
DCapacitance(%)
Duration(hrs)
For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms
C∆
X7R
Y5V
∗Initial value should be after 48hr of Heat treatment.
AC Voltage
DC Bias
For temperature compensation at 1MHz, 1Vrms
For high dielectric constant at 1kHz, 1Vrms
Rated at 25V : C∆, X7R, Y5V
25
-10 12345
0
-5
5
10
15
20
DCapacitance(%)
AC Voltage(Vrms)
For temperature compensation : 1MHz
1 Vrms/for high dielectric constant : 1kHz
Rated at 25V : C∆, X7R, Y5V
Y5V X7R
C∆
Capacitance-Temperature
(high dielectric constant)
Please verify individual characteristics at the desi
g
n sta
g
e to ensure total suitability
20
−1000 5 10 15 20 25
−60
−80
−40
−20
0
∆C/C(%)
VDC
C∆
X7R
Y5V
100
0.001
0.1 1 10 100 1,000 10,000
0.01
0.1
10
1
Impedance(Ω)
Frequency(MHz)
at 1Vrms
X7R 10µF
X7R 1µF
X7R 0.1µF
X7R 0.01µF
X7R1000pF
C
∆
1000pF
C
∆
100pF
C∆ 10pF
C∆ 1pF
20
-100 -60 -40 -20 0 20 40 60 80 100 120
-60
-80
-40
-20
0
∆Capacitance(%)
at 1kHz, 1Vrms
X7R, Y5V
X7R at RV/2
X7R at 0VDC
Y5V at 0VDC
Y5V at RV/2
Temperature(˚C)
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Conditions and Specification for Temperature Compensation type(C∗ to U∗ • SL Characteristics)
Test Items Specification (C: nominal capacitance) Test Conditions
Capacitance Value Within tolerance
Q C≥30pF: Q≥1000
C<30pF: Q≥400+20C
Insulation resistance (IR) 10,000MΩ or 500MΩ•µF min, whichever is less
Dielectric Resistance No problem observed
Appearance No problem observed Microscope(10×magnification)
Termination strength No problem observed
Bending strength No mechanical damage at 1mm bent
Vibration Appearance No significant change is detected.
test
∆C Within tolerance
Q C≥30pF: Q≥1000
C<30pF: Q≥400+20C
Soldering Appearance No significant change is detected.
heat
∆C ±2.5% or ±0.25pF max, whichever is larger.
resistance
Q C≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR 10,000MΩ or 500MΩ•µF min, whichever is smaller
Withstand voltage Resists without problem
Solderability Ni/Br termination: 90% min Soaking Condition
Temperature Appearance No significant change is detected.
cycle
∆C ±2.5% or ±0.25pF max, whichever is larger.
Q C≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR 10,000MΩ or 500MΩ•µF min, whichever is samller
Withstand voltage Resists without problem
Humidity Appearance No significant change is detected.
test ∆C ±7.5% or ±0.75pF max, whichever is larger.
Q C≥30pF: Q≥200
C<30pF: Q≥100+10C/3
IR 500MΩ or 25MΩ•µF min, whichever is smaller
High- Appearance No significant change is detected.
temperature
∆C ±3% or ±0.3pF max, whichever is larger.
with
C≥30pF: Q≥350
Q 10pF≤C<30pF: Q≥275+5C/2
loading
C<10pF: Q≥200+10C
IR 1,000MΩ or 50MΩ•µF min, whichever is smaller
C≤1000pF 1MHz±10% 0.5 to
C>1000pF 1kHz±10% 5Vrms
Order Temperature Time
1 80 to 100°C 2minutes
2 150 to 200°C 2minutes
Sn63 Solder 235±5°C 2±0.5sec.
Sn-3Ag-0.5Cu 245±5°C 3±0.5sec.
Measured after the rated voltage is applied for one
minute at normal room temperature and humidity. (∗4)
Apply a sideward force of 500g(5N) (∗3) to a PCB-mounted
sample.
Glass epoxy PCB (t=1.6mm); fulcrum
Spacing: 90mm; for 10 seconds.
Vibration frequency: 10 to 55(Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/min
In X, Y and Z directions:
2 hours each Total 6 hours
Soak the sample in 260°C±5°C
solder for 10±0.5seconds
and place in a room at normal temperature
and humidity; measure after 24±2hours.
(Preheating Conditions)
(Cycle)
Normal room temperature (3min)→
Lowest operation temperature (30min)→
Normal room temperature (3min)→
Highest operation temperature (30min)→
After five cycles, measure after
24±2hours.
Measure the test sample after storing it
24±2hours at a temperature of 40°C±2°C
and a relative humidity of 90-95% Rh.
for 500+24/−0hours.
After applying (∗1) twice of the rated voltage
at a temperature of 125±3°C for
1000+48/−0hours, measure the sample
after storing 24±2hours.
(∗1) Apply 3 times of the rated voltage for 1 to 5 seconds.
∗1 For the CF series, use 1.5 times when the rated voltage is 250V; use/1.2 times when
the rated voltage exceeds 630V.
∗2 Except CT series
∗3 2N at 0201 Size
∗4 Apply 500V for 1minite in case the rated voltage is 1000V or higher.
∗5 Except CF series.
∗6 The charge and discharge current of the capacitor must not exceed 50mA.
(∗5)
(∗6)
(∗6)
(∗2)
(∗2)
(∗6)
(∗6)
(∗6)
(∗6)
(∗6)
(∗6)
Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Items Specification
X7R/X5R Y5V Test Condition
Capacitance Value Within tolerance Do previous treatment (∗8, ∗14)
tanδ(%)
2.5%max, 3.5%max
(∗2)
,
7.0%
max
(∗12)
5.0%max, 7.0%max (∗13)
5.0%max (∗3), 7.5%max (∗17) 9.0%max (∗4), 12.5%max (∗5)
Insulation resistance (IR) 10,000MΩ or 500MΩ•µF min, whichever is less
Dielectric Resistance No problem observed
Appearance No problem observed Microscope(10×magnification)
Termination strength No problem observed
Bending strength test No problem observed at 1mm bent
Vibration Appearance No significant change is detected.
test ∆C Within tolerance
tanδ(%) Satisfies the initial value.
Soldering Appearance No significant change is detected.
heat
∆C Within ±7.5% Within ±20%
resistance
tanδ(%) Satisfies the initial value.
IR 10,000MΩ or 500MΩ•µF min, whichever is smaller
Withstand voltage Resists without problem
Solderability Ni/Br termination: 90% min Soaking Condition
Temperature Appearance No significant change is detected.
cycle
∆C Within ±7.5% Within ±20%
tanδ(%) Satisfies the initial value.
IR 10,000MΩ or 500MΩ•µF min, whichever is smaller
Withstand voltage Resists without problem
Humidity Appearance No significant change is detected.
test
∆C Within ±12.5% Within ±30%
tanδ(%) 200% max of 150% max of
initial value initial value
IR 500MΩ or 25MΩ•µF min, whichever is smaller
High- Appearance No significant change is detected.
temperature
∆C Within ±12.5% Within ±30%
with
tanδ(%) 200% max of 150% max of
initial value initial value
loading
IR 1,000MΩ or 50MΩ•µF min, whichever is smaller
Order Temperature Time
1 80 to 100°C 2minutes
2 150 to 200°C 2minutes
Capacitance Fire Vol
C≤10µF 1kHz±10% 1.0±0.1Vrms
C>10µF 120Hz±10% 0.5±0.1Vrms
Measured after the rated voltage is applied for 2minutes
at normal room temperature and humidity. (∗10)
Apply a sideward force of 500g(5N) (∗16) to a
PCB-mounted sample.
Glass epoxy PCB (∗03,05 type and CA Series : T=0.8mm); fulcrum
Spacing: 90mm; for 10 seconds.
Vibration frequency: 10 to 55(Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/min
In X, Y and Z directions:
2 hours each Total 6 hours
Do previous treatment (∗8)
Soak the sample in 260°C±5°C
solder for 10±0.5seconds
and place in a room at normal temperature
and humidity; measure after 48±4hours.
(Preheating Conditions)
Do previous treatment (∗8)
(Cycle)
Normal room temperature (3min)→
Lowest operation temperature (30min)→
Normal room temperature (3min)→
Highest operation temperature (30min)→
After five cycles, measure after
48±4hours.
Do previous treatment (∗9)
After storing it at a temperature of
40°C±2°C and a relative humidity of
90-95% for 500+24/−0hours, measure
the sample after storing 48±4hours.
Do previous treatment (∗9)
After applying twice (∗7) of the rated
voltage at the highest operating temperature
for 1000+48/−0hours, measure the sample
after storing 48±4hours.
(∗1) Apply 2.5 times of the rated voltage for 1 to 5 seconds.
Test Conditions and Specification for High Dielectric Type (X5R, X7R, Y5V)
initial value
*1 Use 1.5 times when the rated voltage is 250V or over.
Use 1.2 times when the rated voltage is 630V or over.
*2
Apply to X5R 35V type, X7R 16V/25V type.
*3 Apply to X5R16V/25V type, X7R/X7S 6.3V/10V type.
*4 Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type).
*5 Apply to Y5V 6.3V/10V type. Apply 16% to CM21Y5V106/CM316Y5V226.
*6 Exclude CT series with thickness of less than 0.66mm and CA series.
*7 Use 1.5times when the rated voltage is 4V/6.3V/10V/250V and 100V (32X7R474/43X7R105/55X7R105).
Use 1.2times when the rated voltage is 630V or over.
*8 Keep specimen at 150°C+0/−10°C for one hour, leave specimen at room ambient for 48±4 hours.
*9 Apply the same test condition for one hour, then leave the specimen at room ambient for 48±4 hours.
*10 For the CF series over 1000V, apply 500V for 1 minutes at room ambient.
*11 Except CF series.
*12 Apply to X5R 10V type, X7S 4V type.
*13 Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over.
*14 Measurement condition 1kHz, 1Vrms for Y5V, C < 47µF type.
*15 The charge/discharge current of the capacitor must not exceed 50mA.
*16 2N at 0201 Size
*17 Apply to X5R 4V and 6.3V type.
(∗15)
(∗15)
(∗6)
(∗6)
(∗15)
(∗15)
(∗15)
(∗15)
(∗15)
(∗15)
(∗11)
Sn63 Solder 235±5°C 2±0.5sec.
Sn-3Ag-0.5Cu 245±5°C 3±0.5sec.
Multilayer Ceramic Chip Capacitors
Packaging Options
Tape and Reel
Reel
Carrier Tape
Bulk Cassette
*
!" #$ % !
±
&$
! '
(
()
*
"
+,
Code
Reel
7-inch Reel
(CODE : T, H)
13-inch Reel
(CODE : L, N)
Code
Reel
7-inch Reel
(CODE : T, H)
13-inch Reel
(CODE : L, N)
ABCD
"
f
," +
±
"&
±
"
++"
±
"
f
""
±
"
EW
1W2R
""
±
&
"
±
"& ,&' "
.&
±
"
Type ABF
03 (0.6
´
0.3)
"+/
±
""+ ",/
±
""+ "
±
""&
05 (1.0
´
0.5)
",&
±
" &
±
" "
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105 (1.6
´
0.8)
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±
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D11 (1.37
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D12 (1.25
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2.0)
&
±
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Multilayer Ceramic Chip Capacitors
Precautions
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and
performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior
performance or cause a short, open, smoking, or flaming to occur, etc.
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical
devices; devices which are highly public orientated; and devices which demand a high standard of liability.
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate
grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high
reliability design different from that of general purpose capacitors.
3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and
specifications is exceeded, the capacitorÕs insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur.
The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As
this effect becomes especially pronounced in high frequency circuits, please exercise caution.
When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature
for usage. Also, please make certain temperature rises remain below 20¼C.
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the
rated voltage when AC voltage is super-imposed to the DC voltage.
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case
situations, may cause the capacitor to smoke or flame.
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage,
even though it is within the rated voltage, please inquire to the manufacturer.
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is
within the rated voltage, it is possible capacitor reliability will deteriorate.
6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load
voltage at the time of operation.
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in
the catalog and specifications.
In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to
Voltage change. Please contact sales in such case.
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the
respective product in order that the assembled product function appropriately.
9. Please contact us upon using conductive adhesives.
1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has
been opened, reseal it or store it in a desiccator.
2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH.
3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product
is exposed to such atmospheres, the terminals will oxidize and solderability will be effected.
4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases.
5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are
followed.
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Dimensions for recommended typical land
Typical mounting problems
Ideal Solder Thickness
Automotive Series
(Unit : mm)
When mounting the capacitor to the substrate, it is important to
consider carefully that the amount of solder (size of fillet) used has a
direct effect upon the capacitor once it is mounted.
a) The greater the amount of solder, the greater the stress to the
elements. As this may cause the substrate to break or crack, it is
important to establish the appropriate dimensions with regard to
the amount of solder when designing the land of the substrate.
b) In the situation where two or more devices are mounted onto a
common land, separate the device into exclusive pads by using
soldering resist
Land Pattern
Sample capacitor
Soldering resist
ba
c
Size L×W a b c
03 0.6×0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40
05 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
105 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80
21 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10
316 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30
32 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30
42 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80
43 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00
52 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80
53 5.7×2.8 4.20 to 4.70 2.00 to 2.50 2.20 to 2.60
55 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70
Chip Capacitor
PCB
Solder
T/3 to T/2
T
Item Not recommended example Recommended example/Separated by solder
Multiple parts mount
Mount with
leaded parts
Wire soldering
after mounting
Overview
Solder resist
Leaded parts Leaded parts
Solder resist
Soldering iron
Wire
Solder resist
Solder resist Solder resist
∗ CA series : Please refer applicable page.
Size L×W a b c
105 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00
21 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40
316 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80
(Unit : mm)
Standard
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
The chip could crack if the PCB warps during processing after the chip has been soldered.
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips
capacitors.
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a
low shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.
Such gases may crack the chip capacitor or damage the device itself.
(Not recommended) (Ideal)
Crack
Support pin
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference
(Delta T) to within 130 degree Celsius.
2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of over 3.2×2.5mm, 0.6×0.3mm,
and capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free.
Sodering iron
1) Temperature of iron chip 350°C max
2) Wattage 30W max
3) Tip shape of soldering iron φ3.0mm max
4) Soldering Time 3sec. max
5) Cautions
a) Pre-heating is necessary Rapid heating must be avoided.
Delta T≤150˚C.
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
Recommended Temperature Profile(62Sn Solder)
Reflow
Wave
∆T
300
250
200
150
100
50
0
Preheat
60seconds
Temperature
Peak temperature
230°C±5°C
15seconds maximum
60seconds
More than180°C,
40seconds maximum
Cool at normal room
temperature after
removing from
furnace.
q Ensure that the chip capacitor is preheated adequately.
w Ensure that the temperature difference (∆T) does not exceed 150°C.
e Cool naturally after soldering.
r Wave soldering is not applicable for chips with size of 3.2x2.5mm or larger.
Recommended Temperature Profile(Sn-3Ag-0.5Cu)
Reflow
Wave
300
250
200
150
100
50
0
Preheat
Temperature
250°C±5°C
5 to 10sec. Max.
90±30sec.
220°C Max.
90 sec Max
170 to 180°C1 to 3°C/sec.
q Ensure that the chip capacitor is preheated adequately.
w Ensure that the temperature difference (∆T) does not exceed 150°C.
e Cool naturally after soldering.
r Wave soldering is not applicabel for chips with size of 3.2x2.5mm or lager.
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 150˚C.
e Ensure that allowable temperature difference does not exceed 130˚C for 3.2×2.5mm size or larger.
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 150˚C.
e Ensure that allowable temperature difference does not exceed 130˚C for 3.2×2.5mm size or larger.
300
250
200
150
100
50
0
Preheat
Temperature
60 to 120sec.
5sec. max
Cool at normal
room temperature Cool at normal
room temperature
△T
Preheat
5sec. max
300
250
200
150
100
Temperature
60 to 120sec.
△T
245℃
260℃
〜
230℃
260℃
〜
