DATASHEET
BoardLevelCooling–3719
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122

MECHANICAL&PERFORMANCE
Drawingdimensionsareshownas:in.,(mm)
BOARDLEVELCOOLING–3719
3719isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumberDeviceType
371924B00000GBGA,FPGA
371924B00032GBGA,FPGA
371924B00034GBGA,FPGA
HEATSINKDETAILS
PropertyDetails
MaterialAluminum
FinishBlackAnodize
DeviceAttachmentOptionsEpoxy,Tape
ThermalInterfaceMaterial:
371924B00000G‐
ThermalInterfaceMaterial:
371924B00000G
T405RChomericsTapeforMetal
Surfaces
ThermalInterfaceMaterial:
371924B00000G
T410RChomericsTapefor
PlasticSurfaces
PropertyDetails
HeatSinkWidth(mm)35.0
HeatSinkLength(mm)35.0
HeatSinkHeight(mm)14.0
HeatSinkMountingDirectionHorizontal,Vertical