HSEC8–120–01–L–RA–A
HSEC8–160–01–L–RA–A–BL
Accepts
(1,60mm)
.062" PCB
thicknesses
Optional
Board Locks
Up to 60
Positions
per row
Rugged Edge Rate™
contacts designed
for Signal Integrity
(0,80mm)
.0315"
pitch
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OTHER
OPTION
HSEC8
10, 20, 30, 40, 50, 60
F-209-1
Mates with:
1,6mm thick cards,
EEDP, HSC8, HSF8
PLATING
OPTION RA BL
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?HSEC8-RA
Insulator Material:
Black Liquid
Crystal Polymer
Contact:
BeCu
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Current Rating:
3.1A @ 30°C Temperature Rise
Operating Temp:
-55°C to +125°C
Card Insertion Depth:
(3,15mm) .125" nominal
RoHS Compliant:
Ye s
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (10-60)
0,80mm H I - S P E E D S O C K E T HSEC8-RA
SERIES
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–TR
= Tape &
Reel
Packaging
(10 thru 60
positions
only)
1CARD
THICKNESS
–01
= (1,60mm) .062"
thick card
A
POSITIONS
PER ROW
SPECIFICATIONS
Note: Other Gold plating
options available.
Contact Samtec.
–L
= 10µ" (0,25µm)
Gold on contact,
Matte Tin on tail
–BL
= Board Locks
(40, 50, 60 only)
™
01
02
(0,80) .0315
No. of Positions x (0,80) .0315 + (8,61) .339
No. of Positions x
(0,80) .0315 + (5,38) .212
(3,00)
.118
(5,20)
.205
(0,50)
.020
(1,32)
.052
(12,05)
.474
(7,00)
.276
(1,32) .052 DIA
(1,10)
.043
A
(1,75)
.069
(1,25)
.049
(9,30)
.366
01
02
B
C
10, 20 & 30
40, 50 & 60 –BL
POSITIONS
PER ROW ABC
40 (43,80) 1.724 (18,90) .744 (36,60) 1.441
50 (51,80) 2.039 (22,90) .902 (44,60) 1.756
60 (59,80) 2.354 (26,90) 1.059 (52,60) 2.071
40-BL (51,30) 2.020 (18,90) .744 (36,60) 1.441
50-BL (59,30) 2.335 (22,90) .902 (44,60) 1.756
60-BL (67,30) 2.650 (26,90) 1.059 (52,60) 2.071
0
5 + (
5,38) .2
43
A
C
C
4
50
0
60
0-
59,80) 2
(51,30) 2
-B
9,30) 2.
B
)
2
6
9
71
(22,90
4
) 1
0
74
60) 1.4
35
02
(44,60) 1.7
(67,30) 2.65
6,90) 1.059
41
,
8,9
22,90
)
,60) 2
(52 60
