BIPOLAR ANALOG INTEGRATED CIRCUIT PC3237TK LOW NOISE WIDE BAND SILICON GERMANIUM MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The PC3237TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for the mobile digital TV etc. This device exhibits low noise figure and high power gain characteristics. This package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES * Supply voltage : VCC = 2.4 to 3.3 V (2.8 V TYP.) * Low current consumption : ICC = 5 mA TYP. @ VCC = 2.8 V * Low Noise : NF = 1.4 dB TYP. @ f = 470 MHz : NF = 1.5 dB TYP. @ f = 770 MHz * Power gain : GP = 15.3 dB TYP. @ f = 470 MHz : GP = 13.5 dB TYP. @ f = 770 MHz * High-density surface mounting : 6-pin lead-less minimold package (1.5 1.1 0.55 mm) APPLICATIONS * Low noise amplifier for the mobile digital TV etc. ORDERING INFORMATION Part Number PC3237TK-E2 Order Number Package Marking PC3237TK-E2-A 6-pin lead-less minimold (1511 PKG) (Pb-Free) 6N Supplying Form Embossed tape 8 mm wide Pin 1, 6 face the perforation side of the tape Qty 5 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office Part number for sample order: PC3237TK-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10675EJ01V0DS (1st edition) Date Published July 2007 NS PC3237TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name 1 NC 2 GND 3 INPUT 4 VCC 5 GND 6 OUTPUT ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 3.6 V Circuit Current ICC TA = +25C 10 mA Power Dissipation PD TA = +85C 203 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin +8 dBm Note TA = +25C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 2.4 2.8 3.3 V Operating Ambient Temperature TA 40 +25 +85 C 2 Data Sheet PU10675EJ01V0DS PC3237TK ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 2.8 V, ZS = ZL = 50 , unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit No input signal 3.5 5 7 mA Circuit Current ICC Power Gain 1 GP1 f = 470 MHz, Pin = 30 dBm 13.0 15.3 17.5 dB Power Gain 2 GP2 f = 770 MHz, Pin = 30 dBm 11.0 13.5 16.0 dB Noise Figure 1 NF1 f = 470 MHz 1.4 1.9 dB Noise Figure 2 NF2 f = 770 MHz 1.5 2.0 dB Input Return Loss 1 RLin1 f = 470 MHz, Pin = 30 dBm 6.5 9.5 dB Input Return Loss 2 RLin2 f = 770 MHz, Pin = 30 dBm 5.5 8.5 dB Output Return Loss 1 RLout1 f = 470 MHz, Pin = 30 dBm 9 14 dB Output Return Loss 2 RLout2 f = 770 MHz, Pin = 30 dBm 10 15 dB Isolation 1 ISL1 f = 470 MHz, Pin = 30 dBm 17 22 dB Isolation 2 ISL2 f = 770 MHz, Pin = 30 dBm 16 21 dB PO (1 dB) 1 f = 470 MHz 8 5.5 dBm PO (1 dB) 2 f = 770 MHz 8 5.5 dBm Gain 1 dB Compression Output Power 1 Gain 1 dB Compression Output Power 2 STANDARD CHARACTERISTICS FOR REFERENCE (T A = +25C, VCC = 2.8 V, ZS = ZL = 50 , unless otherwise specified) Parameter Symbol Test Conditions Reference Value Unit Saturated Output Power 1 PO (sat) 1 f = 470 MHz, Pin = +2 dBm +1.3 dBm Saturated Output Power 2 PO (sat) 2 f = 770 MHz, Pin = +2 dBm +1.3 dBm Input 3rd Order Distortion Intercept Point 1 IIP31 f1 = 470 MHz, f2 = 471 MHz 10.5 dBm Input 3rd Order Distortion Intercept Point 2 IIP32 f1 = 770 MHz, f2 = 771 MHz 9.5 dBm Output 3rd Order Distortion Intercept Point OIP31 f1 = 470 MHz, f2 = 471 MHz +4.8 dBm OIP32 f1 = 770 MHz, f2 = 771 MHz +4.0 dBm 1 Output 3rd Order Distortion Intercept Point 2 K factor 1 K1 f = 470 MHz 1.15 K factor 2 K2 f = 770 MHz 1.20 Data Sheet PU10675EJ01V0DS 3 PC3237TK TEST CIRCUIT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF 4 Data Sheet PU10675EJ01V0DS PC3237TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Notes 1. 30 30 0.4 mm double sided copper clad FR-4 board. 2. Back side: GND pattern 3. Au plated on pattern 4. : Through holes Data Sheet PU10675EJ01V0DS 5 PC3237TK TYPICAL CHARACTERISTICS (T A = +25C, VCC = 2.8 V, ZS = ZL = 50 , unless otherwise specified) Remark The graphs indicate nominal characteristics. 6 Data Sheet PU10675EJ01V0DS PC3237TK Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 7 PC3237TK Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10675EJ01V0DS PC3237TK Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 9 PC3237TK S-PARAMETERS (T A = +25C, VCC = 2.8 V, monitored at connector on board) S11FREQUENCY S22FREQUENCY 10 Data Sheet PU10675EJ01V0DS PC3237TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) Data Sheet PU10675EJ01V0DS 11 PC3237TK NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The DC cut capacitor should be attached to Input and Output pin. (5) Pin 1 (NC) should be connected to the ground pattern. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 12 Data Sheet PU10675EJ01V0DS IR260 WS260 HS350