Specifications ispLSI and pLSI 1032
11996 ISP Encyclopedia1032_02
Functional Block Diagram
Output Routing Pool
Output Routing Pool
D7 D6 D5 D4 D3 D2 D1 D0
B0 B1 B2 B3 B4 B5 B6 B7
A0
A1
A2
A3
A4
A5
A6
A7
C7
C6
C5
C4
C3
C2
C1
C0
Output Routing Pool
CLK
Output Routing Pool
Global Routing Pool (GRP)
Logic
Array
DQ
DQ
DQ
DQ
GLB
Description
The ispLSI and pLSI 1032 are High-Density Program-
mable Logic Devices containing 192 Registers, 64
Universal I/O pins, eight Dedicated Input pins, four Dedi-
cated Clock Input pins and a Global Routing Pool (GRP).
The GRP provides complete interconnectivity between
all of these elements. The ispLSI 1032 features 5-Volt in-
system programming and in-system diagnostic
capabilities. It is the first device which offers non-volatile
"on-the-fly" reprogrammability of the logic, as well as the
interconnect to provide truly reconfigurable systems. It is
architecturally and parametrically compatible to the pLSI
1032 device, but multiplexes four of the dedicated input
pins to control in-system programming.
The basic unit of logic on the ispLSI and pLSI 1032
devices is the Generic Logic Block (GLB). The GLBs are
labeled A0, A1 .. D7 (see figure 1). There are a total of
32 GLBs in the ispLSI and pLSI 1032 devices. Each GLB
has 18 inputs, a programmable AND/OR/XOR array, and
four outputs which can be configured to be either combi-
natorial or registered. Inputs to the GLB come from the
GRP and dedicated inputs. All of the GLB outputs are
brought back into the GRP so that they can be connected
to the inputs of any other GLB on the device.
Features
HIGH-DENSITY PROGRAMMABLE LOGIC
— High Speed Global Interconnect
— 6000 PLD Gates
— 64 I/O Pins, Eight Dedicated Inputs
— 192 Registers
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Fast Random Logic
— Security Cell Prevents Unauthorized Copying
HIGH PERFORMANCE E2CMOS® TECHNOLOGY
fmax = 90 MHz Maximum Operating Frequency
fmax = 60 MHz for Industrial and Military/883 Devices
tpd = 12 ns Propagation Delay
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile E2CMOS Technology
— 100% Tested
ispLSI OFFERS THE FOLLOWING ADDED FEATURES
— In-System Programmable™ (ISP™) 5-Volt Only
— Increased Manufacturing Yields, Reduced Time-to-
Market, and Improved Product Quality
— Reprogram Soldered Devices for Faster Prototyping
COMBINES EASE OF USE AND THE FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEX-
IBILITY OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
Logic and Structured Designs
— Four Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Interconnectivity
ispLSI AND pLSI DEVELOPMENT TOOLS
pDS® Software
— Easy to Use PC Windows™ Interface
— Boolean Logic Compiler
— Manual Partitioning
— Automatic Place and Route
— Static Timing Table
ispDS+™ Software
— Industry Standard, Third Party Design
Environments
— Schematic Capture, State Machine, HDL
— Automatic Partitioning and Place and Route
— Comprehensive Logic and Timing Simulation
— PC and Workstation Platforms
ispLSI® and pLSI® 1032
High-Density Programmable Logic
Copyright © 1997 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. February 1997
Tel. (503) 681-0118; 1-800-LATTICE; FAX (503) 681-3037; http://www.latticesemi.com 1996 ISP Encyclopedia
Specifications ispLSI and pLSI 1032
21996 ISP Encyclopedia
Functional Block Diagram
Figure 1. ispLSI and pLSI 1032 Functional Block Diagram
The devices also have 64 I/O cells, each of which is
directly connected to an I/O pin. Each I/O cell can be
individually programmed to be a combinatorial input,
registered input, latched input, output or bi-directional
I/O pin with 3-state control. Additionally, all outputs are
polarity selectable, active high or active low. The signal
levels are TTL compatible voltages and the output drivers
can source 4 mA or sink 8 mA.
Eight GLBs, 16 I/O cells, two dedicated inputs and one
ORP are connected together to make a Megablock (see
figure 1). The outputs of the eight GLBs are connected to
a set of 16 universal I/O cells by the ORP. The I/O cells
within the Megablock also share a common Output
Enable (OE) signal. The ispLSI and pLSI 1032 devices
contain four of these Megablocks.
The GRP has as its inputs the outputs from all of the GLBs
and all of the inputs from the bi-directional I/O cells. All of
these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI and pLSI 1032 devices are selected
using the Clock Distribution Network. Four dedicated
clock pins (Y0, Y1, Y2 and Y3) are brought into the
distribution network, and five clock outputs (CLK 0, CLK
1, CLK 2, IOCLK 0 and IOCLK 1) are provided to route
clocks to the GLBs and I/O cells. The Clock Distribution
Network can also be driven from a special clock GLB (C0
on the ispLSI and pLSI 1032 devices). The logic of this
GLB allows the user to create an internal clock from a
combination of internal signals within the device.
Y
0Y
1Y
2Y
3
I/O 0
I/O 1
I/O 2
I/O 3
IN 5
IN 4
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 47
I/O 46
I/O 45
I/O 44
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 38
I/O 37
I/O 36
I/O 35
I/O 34
I/O 33
I/O 32
*SDI/IN 0
*MODE/IN 1
I/O
62
I/O
63 I/O
61 I/O
60 I/O
59 I/O
58 I/O
57I/O
56 I/O
55 I/O
54 I/O
53 I/O
52 I/O
51 I/O
50 I/O
49 I/O
48 IN
7IN
6
I/O
17
I/O
16 I/O
18 I/O
19 I/O
20 I/O
21 I/O
22 I/O
23 I/O
24 I/O
25 I/O
26 I/O
27 I/O
28 I/O
29 I/O
30 I/O
31
*SDO/IN 2
*SCLK/IN 3
I/O 4
I/O 5
RESET
Global
Routing
Pool
(GRP)
Output Routing Pool (ORP)
Output Routing Pool (ORP)
CLK 0
CLK 1
CLK 2
IOCLK 0
IOCLK 1
Clock
Distribution
Network
D7 D6 D5 D4 D3 D2 D1 D0
B0 B1 B2 B3 B4 B5 B6 B7
A0
A1
A2
A3
A4
A5
A6
A7
C7
C6
C5
C4
C3
C2
C1
C0
Output Routing Pool (ORP)
Generic
Logic Blocks
(GLBs)
Megablock
Output Routing Pool (ORP)
Input Bus
Input Bus
Input Bus
*ispEN/NC
lnput Bus
*ISP Control Functions for ispLSI 1032 Only
0139(1)-32-isp
Specifications ispLSI and pLSI 1032
31996 ISP Encyclopedia
Absolute Maximum Ratings 1
Supply Voltage Vcc ...................................-0.5 to +7.0V
Input Voltage Applied........................-2.5 to VCC +1.0V
Off-State Output Voltage Applied .....-2.5 to VCC +1.0V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied ..............-55 to 125°C
Max. Junction Temp. (TJ) with Power Applied ... 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
DC Recommended Operating Conditions
V
V
PARAMETERSYMBOL MIN. MAX. UNITS
5.25
5.5
5.5
0.8
Vcc + 1
Supply Voltage
V
CC
V
IL
V
IH
Table 2- 0005Aisp w/mil.eps
4.75
4.5
4.5
0
2.0
Commercial T
A
=
0°C to +70°C
Industrial T
A
= -40°C to +85°C
Military/883 T
C
= -55°C to +125°C
Input Low Voltage
Input High Voltage
V
Capacitance (TA=25oC, f=1.0 MHz)
SYMBOL PARAMETER MAXIMUM
1
UNITS TEST CONDITIONS
C
1
Commercial/Industrial 8 pf V
CC
=5.0V, V
IN
=2.0V
Military 10 pf V
CC
=5.0V, V
IN
=2.0V
C
2
I/O and Clock Capacitance 10 pf V
CC
=5.0V, V
I/O
, V
Y
=2.0V
1
.
Guaranteed but not 100% tested.
Table 2- 0006
Dedicated Input Capacitance
Data Retention Specifications
Table 2- 0008B
PARAMETER
pLSI Erase/Reprogram Cycles 100
Data Retention MINIMUM MAXIMUM UNITS
ispLSI Erase/Reprogram Cycles 20
10000
Cycles
Years
Cycles
Specifications ispLSI and pLSI 1032
41996 ISP Encyclopedia
Switching Test Conditions
Input Pulse Levels GND to 3.0V
Input Rise and Fall Time 3ns 10% to 90%
Input Timing Reference Levels 1.5V
Output Timing Reference Levels 1.5V
Output Load See figure 2
3-state levels are measured 0.5V from steady-state
active level.
Table 2
-
0003
Output Load Conditions (see figure 2)
T est Condition R1 R2 CL
A 47039035pF
B Active High 39035pF
Active Low 47039035pF
Active High to Z 3905pF
Cat V
OH
- 0.5V
Active Low to Z 4703905pF
at V
OL
+ 0.5V
Figure 2. Test Load
+ 5V
R1
R2CL
*
Device
Output Test
Point
*
CL includes Test Fixture and Probe Capacitance.
DC Electrical Characteristics
Over Recommended Operating Conditions
0.4
-10
10
-150
-150
-200
190
220
V
V
µA
µA
µA
µA
mA
mA
mA
SYMBOL
V
OL
V
OH
I
IL
I
IH
I
IL-isp
I
IL-PU
I
OS
1
I
CC
2,4
Output Low Voltage
Output High Voltage
Input or I/O Low Leakage Current
Input or I/O High Leakage Current
isp Input Low Leakage Current
I/O Active Pull-Up Current
Output Short Circuit Current
Operating Power Supply Current
I
OL
=8 mA
I
OH
=-4 mA
0V V
IN
V
IL
(MAX.)
3.5V V
IN
V
CC
0V V
IN
V
IL
(MAX.)
0V V
IN
V
IL
V
CC
= 5V, V
OUT
= 0.5V
V
IL
= 0.5V, V
IH
= 3.0V Commercial
f
TOGGLE
= 1 MHz Industrial/Military
PARAMETER CONDITION MIN. UNITS
MAX.TYP.
3
130
135
2.4
1. One output at a time for a maximum duration of one second.
2. Measured using eight 16-bit counters.
3. T ypical values are at V
CC
= 5V and T
A
= 25
o
C.
4. Maximum I
CC
varies widely with specific device configuration and operating frequency. Refer to the Power Consumption sec-
tion of this datasheet and Thermal Management section of this Data Book to estimate maximum I
CC
.
Table 2- 0007A-32-isp
Specifications ispLSI and pLSI 1032
51996 ISP Encyclopedia
USE 1032E-80
FOR NEW DESIGNS
USE 1032E-70
FOR NEW DESIGNS
External Timing Parameters
Over Recommended Operating Conditions
1. Unless noted otherwise, all parameters use a GRP load of 4 GLBs, ORP and Y0 clock.
2. Refer to Timing Model in this data sheet for further details.
3. Standard 16-Bit counter using GRP feedback.
4. fmax (Toggle) may be less than 1/(twh + twl). This is to allow for a clock duty cycle of other than 50%.
5. Reference Switching Test Conditions section.
MIN. MAX.
Data Propagation Delay, 4PT bypass, ORP bypass
Data Propagation Delay, Worst Case Path
Clock Frequency with Internal Feedback
3
Clock Frequency with External Feedback
Clock Frequency, Max Toggle
4
GLB Reg. Setup Time before Clock, 4PT bypass
GLB Reg. Clock to Output Delay, ORP bypass
GLB Reg.
Hold Time after Clock, 4 PT bypass
GLB Reg. Setup Time before Clock
GLB Reg. Clock to Output Delay
GLB Reg. Hold Time after Clock
Ext. Reset Pin to Output Delay
Ext. Reset Pulse Duration
Input to Output Enable
Input to Output Disable
Ext. Sync. Clock Pulse Duration, High
Ext. Sync. Clock Pulse Duration, Low
I/O Reg. Setup Time before Ext. Sync. Clock (Y2, Y3)
I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3)
ns
ns
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
pd1
t
pd2
f
max (Int.)
f
max (Ext.)
f
max (Tog.)
t
su1
t
co1
t
h1
t
su2
t
co2
t
h2
t
r1
t
rw1
t
en
t
dis
t
wh
t
wl
t
su5
t
h5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
A
A
A
A
A
B
C
DESCRIPTION
1
PARAMETER #
2
UNITS
TEST
5
COND.
1
tsu2 + tco1
( )
MIN. MAX.
80
50
100
7
0
10
0
10
5
5
2
6.5
15
20
10
12
17
18
18
60
38
83
9
0
13
0
13
6
6
2.5
8.5
20
25
13
16
22.5
24
24
-80 -60
MIN. MAX.
90.9
58.8
125
6
0
9
0
10
4
4
2
6.5
12
17
8
10
15
15
15
-90
Table 2-0030-32/90,80,60C
Specifications ispLSI and pLSI 1032
61996 ISP Encyclopedia
USE 1032E-80 FOR NEW DESIGNS
USE 1032E-70 FOR NEW DESIGNS
Internal Timing Parameters1
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
7.3
1.3
1.3
6.0
4.6
2.7
4.0
4.0
3.3
5.3
2.0
2.7
4.0
5.0
6.0
10.6
8.6
9.3
10.6
12.7
1.3
2.7
3.3
13.3
12.0
9.9
3.3
0.7
MIN. MAX.
DESCRIPTIONPARAMETER UNITS
-60
Inputs
t
iobp
t
iolat
t
iosu
t
ioh
t
ioco
t
ior
t
din
GRP
t
grp1
t
grp4
t
grp8
t
grp12
t
grp16
t
grp32
GLB
t
4ptbp
t
1ptxor
t
20ptxor
t
xoradj
t
gbp
t
gsu
t
gh
t
gco
t
gr
t
ptre
t
ptoe
t
ptck
ORP
t
orp
t
orpbp
#
2
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
I/O Register Bypass
I/O Latch Delay
I/O Register Setup Time before Clock
I/O Register Hold Time after Clock
I/O Register Clock to Out Delay
I/O Register Reset to Out Delay
Dedicated Input Delay
GRP Delay, 1 GLB Load
GRP Delay, 4 GLB Loads
GRP Delay, 8 GLB Loads
GRP Delay, 12 GLB Loads
GRP Delay, 16 GLB Loads
GRP Delay, 32 GLB Loads
4 Product Term Bypass Path Delay
1 Product Term/XOR Path Delay
20 Product Term/XOR Path Delay
XOR Adjacent Path Delay
3
GLB Register Bypass Delay
GLB Register Setup Time before Clock
GLB Register Hold Time after Clock
GLB Register Clock to Output Delay
GLB Register Reset to Output Delay
GLB Product Term Reset to Register Delay
GLB Product Term Output Enable to I/O Cell Delay
GLB Product Term Clock Delay
ORP Delay
ORP Bypass Delay
5.5
1.0
1.0
4.5
3.5
2.0
3.0
3.0
2.5
4.0
1.5
2.0
3.0
3.8
4.5
8.0
6.5
7.0
8.0
9.5
1.0
2.0
2.5
10.0
9.0
7.5
2.5
0.5
MIN. MAX.
-80
4.8
2.1
1.2
3.6
2.8
1.6
2.4
2.4
2.8
3.2
1.2
1.6
2.4
3.0
3.6
6.4
5.2
5.7
7.0
8.2
0.8
1.6
2.0
8.0
7.8
6.0
2.4
0.4
MIN. MAX.
-90
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
Specifications ispLSI and pLSI 1032
71996 ISP Encyclopedia
USE 1032E-80
FOR NEW DESIGNS
USE 1032E-70
FOR NEW DESIGNS
Internal Timing Parameters1
ns
ns
ns
ns
ns
ns
ns
ns
ns
6.0
4.6
1.3
4.6
1.3
4.0
6.7
6.7
6.0
7.3
6.6
7.3
6.6
12.0
Outputs
t
ob
t
oen
t
odis
Clocks
t
gy0
t
gy1/2
t
gcp
t
ioy2/3
t
iocp
Global Reset
t
gr
47
48
49
50
51
52
53
54
55
Output Buffer Delay
I/O Cell OE to Output Enabled
I/O Cell OE to Output Disabled
Clock Delay, Y0 to Global GLB Clock Line (Ref. clock)
Clock Delay, Y1 or Y2 to Global GLB Clock Line
Clock Delay, Clock GLB to Global GLB Clock Line
Clock Delay, Y2 or Y3 to I/O Cell Global Clock Line
Clock Delay, Clock GLB to I/O Cell Global Clock Line
Global Reset to GLB and I/O Registers
MIN. MAX.
DESCRIPTIONPARAMETER UNITS
-60
#
2
4.5
3.5
1.0
3.5
1.0
3.0
5.0
5.0
4.5
5.5
5.0
5.5
5.0
9.0
MIN. MAX.
-80
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3.6
2.8
0.8
2.8
0.8
2.4
4.0
4.0
3.6
4.4
4.0
4.4
4.0
8.2
MIN. MAX.
-90
Specifications ispLSI and pLSI 1032
81996 ISP Encyclopedia
ispLSI and pLSI 1032 Timing Model
GLB Reg
Delay
I/O Pin
(Output)
ORP
Delay
Feedback
4 PT Bypass
20 PT
XOR Delays
Control
PTs
GRP
Loading
Delay
Input
Register
Clock
Distribution
I/O Pin
(Input)
Y0
Y1,2,3
DQ
GRP 4 GLB Reg Bypass ORP Bypass
DQ
RST
RE
OE
CK
I/O Reg Bypass
I/O CellORPGLBGRPI/O Cell
#21 - 25 #27, 29,
30, 31, 32
#28 #33
#34, 35, 36
#51, 52,
53, 54 #42, 43,
44
#50
#45
#46
Reset
Ded. In #26
#20
RST
#55
#55
#37
#38, 39,
40, 41
#48, 49
#47
Derivations of tsu, th and tco from the Product Term Clock1
tsu = Logic + Reg su - Clock (min)
= (tiobp + tgrp4 + t20ptxor) + (tgsu) - ( tiobp + tgrp4 + tptck(min))
= (#20 + #28 + #35) + (#38) - (#20 + #28 + #44)
5.5 ns = (2.0 + 2.0 + 8.0) + (1.0) - (2.0 + 2.0 + 3.5)
th = Clock (max) + Reg h - Logic
= (tiobp + tgrp4 + tptck(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor)
= (#20 + #28 + #44) + (#39) - (#20 + #28 + #35)
4.0 ns = (2.0 + 2.0 + 7.5) + (4.5) - (2.0 + 2.0 + 8.0)
tco = Clock (max) + Reg co + Output
= (tiobp + tgrp4 + tptck(max)) + (tgco) + (torp + tob)
= (#20 + #28 + #44) + (#40) + (#45 + #47)
19.0 ns = (2.0+ 2.0 +7.5) + (2.0) + (2.5 + 3.0)
Derivations of tsu, th and tco from the Clock GLB1
tsu = Logic + Reg su - Clock (min)
= (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tgy0(min) + tgco + tgcp(min))
= (#20 + #28 + #35) + (#38) - (#50 + #40 + #52)
5.5 ns = (2.0 + 2.0 + 8.0) + (1.0) - (4.5 + 2.0 + 1.0)
th = Clock (max) + Reg h - Logic
= (tgy0(max) + tgco + tgcp(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor)
= (#50 + #40 + #52) + (#39) - (#20 + #28 + #35)
4.0 ns = (4.5 + 2.0 + 5.0) + (4.5) - (2.0 + 2.0 + 8.0)
tco = Clock (max) + Reg co + Output
= (tgy0(max) + tgco + tgcp(max)) + (tgco) + (torp + tob)
= (#50 + #40 + #52) + (#40) + (#45 + #47)
19.0 ns = (4.5 + 2.0 + 5.0) + (2.0) + (2.5 + 3.0)
1. Calculations are based upon timing specifications for the ispLSI and pLSI 1032-80.
Specifications ispLSI and pLSI 1032
91996 ISP Encyclopedia
Maximum GRP Delay vs GLB Loads
ispLSI and pLSI 1032-80
ispLSI and pLSI 1032-60
ispLSI and pLSI 1032-90
0126A-80-32-isp
1
2
3
4 8 12 16
GLB Loads
GRP Delay (ns)
4
5
6
0
Power Consumption
used. Figure 3 shows the relationship between power
and operating speed.
Power consumption in the ispLSI and pLSI 1032 device
depends on two primary factors: the speed at which the
device is operating, and the number of Product Terms
Figure 3. Typical Device Power Consumption vs fmax
50
100
150
200
250
0 10203040506070
f
max (MHz)
I
CC (mA)
80
Notes: Configuration of eight 16-bit Counters
Typical Current at 5V, 25˚C
ispLSI and pLSI 1032
0127A-32-80-isp
ICC can be estimated for the ispLSI and pLSI 1032 using the following equation:
ICC = 52 + (# of PTs * 0.30) + (# of nets * Max. freq * 0.009) where:
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max. freq = Highest Clock Frequency to the device
The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of 2 GLB loads on
average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the
program in the device, the actual ICC should be verified.
Specifications ispLSI and pLSI 1032
10 1996 ISP Encyclopedia
In-System Programmability
Figure 4. ISP Programming Interface
ispGDSispGALispLSI
SCLK
MODE
SCLK
MODE
SDI SDO SDO SDOSDI SDI
ispEN
SCLK
MODE
SDO
SDI
MODE
SCLK
ispEN
5-wire ISP
Programming
Interface
ispLSI
SCLK
MODE
SDI SDO
ispEN
0294
B
controls the programming. The interface signals are isp
Enable (ispEN), Serial Data In (SDI), Serial Data Out
(SDO), Serial Clock (SCLK) and Mode (MODE) control.
Figure 4 illustrates the block diagram of one possible
scheme for programming the ispLSI devices. For details
on the operation of the internal state machine and pro-
gramming of the device please refer to the ISP Architecture
and Programming section in this Data Book.
The device identifier for the ispLSI 1032 is 0000 0011
(03 hex). This code is the unique device identifier which
is generated when a read ID command is performed.
The ispLSI devices are the in-system programmable
versions of the Lattice Semiconductor High-Density pro-
grammable Large Scale Integration (pLSI) devices. By
integrating all the high voltage programming circuitry on-
chip, programming can be accomplished by simply shifting
data into the device. Once the function is programmed,
the non-volatile E2CMOS cells will not lose the pattern
even when the power is turned off.
All necessary programming is done via five TTL level
logic interface signals. These five signals are fed into the
on-chip programming circuitry where a state machine
Specifications ispLSI and pLSI 1032
11 1996 ISP Encyclopedia
ispLSI 1032 Shift Register Layout
E2CMOS Cell Array
High Order Shift Register
Low Order Shift Register
159...
319... ...0
...160
D
A
T
A
D
A
T
A
Data In
(SDI) SDO
107
.
.
.
Address Shift Register
.
.
.
0SDO
SDI
Note: A logic "1" in the Address Shift Register bit position enables the row for programming or verification.
A logic "0" disables it.
Specifications ispLSI and pLSI 1032
12 1996 ISP Encyclopedia
Pin Description
Input – Dedicated in-system programming enable input pin. This pin
is brought low to enable the programming mode. The MODE, SDI,
SDO and SCLK options become active.
Input – This pin performs two functions. It is a dedicated input pin when
ispEN is logic high. When ispEN is logic low, it functions as an input
pin to load programming data into the device. SDI/IN 0 also is used as
one of the two control pins for the isp state machine.
Input – This pin performs two functions. It is a dedicated input pin when
ispEN is logic high. When ispEN is logic low, it functions as a pin to
control the operation of the isp state machine.
Input/Output – This pin performs two functions. It is a dedicated input
pin when ispEN is logic high. When ispEN is logic low, it functions as
an output pin to read serial shift register data.
Input – This pin performs two functions. It is a dedicated input when
ispEN is logic high. When ispEN is logic low, it functions as a clock pin
for the Serial Shift Register.
* For ispLSI 1032 Only
Name PLCC Pin Numbers Description
Input/Output Pins - These are the general purpose I/O pins used by the
logic array.
I/O 0 - I/O 3 26, 27, 28, 29,
I/O 4 - I/O 7 30, 31, 32, 33,
I/O 8 - I/O 11 34, 35, 36, 37,
I/O 12 - I/O 15 38, 39, 40, 41,
I/O 16 - I/O 19 45, 46, 47, 48,
I/O 20 - I/O 23 49, 50, 51, 52,
I/O 24 - I/O 27 53, 54, 55, 56,
I/O 28 - I/O 31 57, 58, 59, 60,
I/O 32 - I/O 35 68, 69, 70, 71,
I/O 36 - I/O 39 72, 73, 74, 75,
I/O 40 - I/O 43 76, 77, 78, 79,
I/O 44 - I/O 47 80, 81, 82, 83,
I/O 48 - I/O 51 3, 4, 5, 6,
I/O 52 - I/O 55 7, 8, 9, 10,
I/O 56 - I/O 59 11, 12, 13, 14,
I/O 60 - I/O 63 15, 16, 17, 18
IN 4 - IN 7 67, 84, 2, 19 Dedicated input pins to the device.
Active Low (0) Reset pin which resets all of the GLB and I/O registers
in the device.
Dedicated Clock input. This clock input is connected to one of the
clock inputs of all of the GLBs on the device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB on the
device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB and/or
any I/O cell on the device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any I/O cell on the
device.
ispEN*/NC 23
SDI*/IN 0 25
MODE*/IN 1 42
SDO*/IN 2 44
SCLK*/IN 3 61
GND 1, 22, 43, 64
V
CC 21, 65 Ground (GND)
V
CC
RESET 24
Y0 20
Y1 66
Y2 63
Y3 62
Table 2-0002A-32-isp
Specifications ispLSI and pLSI 1032
13 1996 ISP Encyclopedia
Pin Description
Input – Dedicated in-system programming enable input pin. This pin
is brought low to enable the programming mode. The MODE, SDI,
SDO and SCLK options become active.
Input – This pin performs two functions. It is a dedicated input pin when
ispEN is logic high. When ispEN is logic low, it functions as an input
pin to load programming data into the device. SDI/IN 0 also is used as
one of the two control pins for the isp state machine.
Input – This pin performs two functions. It is a dedicated input pin when
ispEN is logic high. When ispEN is logic low, it functions as a pin to
control the operation of the isp state machine.
Input/Output – This pin performs two functions. It is a dedicated input
pin when ispEN is logic high. When ispEN is logic low, it functions as
an output pin to read serial shift register data.
Input – This pin performs two functions. It is a dedicated input when
ispEN is logic high. When ispEN is logic low, it functions as a clock pin
for the Serial Shift Register.
These pins are not used.
Description
TQFP Pin Numbers
Name
Input/Output Pins - These are the general purpose I/O pins used by the
logic array.
I/O 0 - I/O 3 17, 18, 19, 20,
I/O 4 - I/O 7 21, 22, 23, 28,
I/O 8 - I/O 11 29, 30, 31, 32,
I/O 12 - I/O 15 33, 34, 35, 36,
I/O 16 - I/O 19 40, 41, 42, 43,
I/O 20 - I/O 23 44, 45, 46, 47,
I/O 24 - I/O 27 48, 53, 54, 55,
I/O 28 - I/O 31 56, 57, 58, 59,
I/O 32 - I/O 35 67, 68, 69, 70,
I/O 36 - I/O 39 71, 72, 73, 78,
I/O 40 - I/O 43 79, 80, 81, 82,
I/O 44 - I/O 47 83, 84, 85, 86,
I/O 48 - I/O 51 90, 91, 92, 93,
I/O 52 - I/O 55 94, 95, 96, 97,
I/O 56 - I/O 59 98, 3, 4, 5,
I/O 60 - I/O 63 6, 7, 8, 9
IN 4 - IN 7 66, 87, 89, 10 Dedicated input pins to the device.
ispEN*/NC 14
SDI*/IN 0 16
MODE*/IN 1 37
SDO*/IN 2 39
SCLK*/IN 3 60
NC 1, 2, 24, 25,
26, 27, 49, 50,
51, 52, 74, 75
76, 77, 99, 100
Active Low (0) Reset pin which resets all of the GLB and I/O registers
in the device.
Dedicated Clock input. This clock input is connected to one of the
clock inputs of all of the GLBs on the device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB on the
device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB and/or
any I/O cell on the device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any I/O cell on the
device.
RESET 15
Y0 11
Y1 65
Y2 62
Y3 61
GND 13, 38, 63, 88
V
CC 12, 64 Ground (GND)
V
CC
Table 2- 0002B-32-isp
* For ispLSI 1032 Only
Specifications ispLSI and pLSI 1032
14 1996 ISP Encyclopedia
Pin Description
RESET G1
Y0 E1
Y1 E11
Y2 G9
Y3 G11
NC G3
GND C6, F3, F9, J6
V
CC F2, F11
I/O 0 - I/O 3 F1, H1, H2, J1,
I/O 4 - I/O 7 K1, J2, L1, K2,
I/O 8 - I/O 11 K3, L2, L3, K4,
I/O 12 - I/O 15 L4, J5, K5, L5,
I/O 16 - I/O 19 L7, K7, L6, L8,
I/O 20 - I/O 23 K8, L9, L10, K9,
I/O 24 - I/O 27 L11, K10, J10, K11,
I/O 28 - I/O 31 J11, H10, H11, F10,
I/O 32 - I/O 35 E9, D11, D10, C11,
I/O 36 - I/O 39 B11, C10, A11, B10,
I/O 40 - I/O 43 B9, A10, A9, B8,
I/O 44 - I/O 47 A8, B6, B7, A7,
I/O 48 - I/O 51 A5, B5, C5, A4,
I/O 52 - I/O 55 B4, A3, A2, B3,
I/O 56 - I/O 59 A1, B2, C2, B1,
I/O 60 - I/O 63 C1, D2, D1, E3
IN 4 - IN 7 E10, C7, A6, E2 Dedicated input pins to the device.
Input/Output Pins - These are the general purpose I/O pins used by the
logic array.
Name CPGA Pin Numbers Description
Input – Dedicated in-system programming enable input pin. This pin
is brought low to enable the programming mode. The MODE, SDI,
SDO and SCLK options become active.
Input – This pin performs two functions. It is a dedicated input pin when
ispEN is logic high. When ispEN is logic low, it functions as an input
pin to load programming data into the device. SDI/IN 0 also is used as
one of the two control pins for the isp state machine.
Input – This pin performs two functions. It is a dedicated input pin when
ispEN is logic high. When ispEN is logic low, it functions as a pin to
control the operation of the isp state machine.
Input/Output – This pin performs two functions. It is a dedicated input
pin when ispEN is logic high. When ispEN is logic low, it functions as
an output pin to read serial shift register data.
Input – This pin performs two functions. It is a dedicated input when
ispEN is logic high. When ispEN is logic low, it functions as a clock pin
for the Serial Shift Register.
ispEN*/NC G3
SDI*/IN 0 G2
MODE*/IN 1 K6
SDO*/IN 2 J7
SCLK*/IN 3 G10
Active Low (0) Reset pin which resets all of the GLB and I/O registers
in the device.
Dedicated Clock input. This clock input is connected to one of the
clock inputs of all of the GLBs on the device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB on the
device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any GLB and/or
any I/O cell on the device.
Dedicated Clock input. This clock input is brought into the clock
distribution network, and can optionally be routed to any I/O cell on the
device.
This pin should be left floating or tied to V
CC.
This pin should never be tied to GND.
Ground (GND)
V
CC
Table 2-0002-32/883
Specifications ispLSI and pLSI 1032
15 1996 ISP Encyclopedia
Pin Configuration
ispLSI and pLSI 1032 84-Pin PLCC Pinout Diagram
I/O 38
I/O 37
I/O 36
I/O 35
I/O 34
I/O 33
I/O 32
IN 4
Y1
VCC
GND
Y2
Y3
IN 3/SCLK*
I/O 31
I/O 30
I/O 29
I/O 28
I/O 27
I/O 26
I/O 25
I/O 57
I/O 58
I/O 59
I/O 60
I/O 61
I/O 62
I/O 63
IN 7
Y0
VCC
GND
*ispEN/NC
RESET
*SDI/IN 0
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
IN 6
GND
IN 5
I/O 47
I/O 46
I/O 45
I/O 44
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
*MODE/IN 1
GND
*SDO/IN 2
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
11 10
9 8 7 6 5 4 3 2 1
84 83 82 81 80 79 78 77 76 75
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
ispLSI 1032
pLSI 1032
Top View
*Pins have dual function capability for ispLSI 1032 only (except pin 23, which is ispEN only).
0123-32-isp
Specifications ispLSI and pLSI 1032
16 1996 ISP Encyclopedia
NC
NC
I/O 57
I/O 58
I/O 59
I/O 60
I/O 61
I/O 62
I/O 63
IN 7
Y0
VCC
GND
*ispEN/NC
RESET
*SDI/IN 0
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
NC
NC
NC
NC
I/O 38
I/O 37
I/O 36
I/O 35
I/O 34
I/O 33
I/O 32
IN 4
Y1
VCC
GND
Y2
Y3
IN 3/SCLK*
I/O 31
I/O 30
I/O 29
I/O 28
I/O 27
I/O 26
I/O 25
NC
NC
NC
NC
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
IN 6
GND
IN 5
I/O 47
I/O 46
I/O 45
I/O 44
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
NC
NC
NC
NC
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
*MODE/IN1
GND
*SDO/IN 2
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
57
56
55
54
53
52
51
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
58
ispLSI 1032
pLSI 1032
Top View
*Pins have dual function capability for ispLSI 1032 only (except pin 14, which is ispEN only).
0766A-32-isp
Pin Configuration
ispLSI and pLSI 1032 100-pin TQFP Pinout Diagram
Specifications ispLSI and pLSI 1032
17 1996 ISP Encyclopedia
I/O38
I/O36
I/O35
I/O33
Y1
Vcc
Y3
I/O30
I/O28
I/O27
I/O24
I/O41
I/O39
I/O37
I/O34
IN4
I/O31
*SCLK/
IN3
I/O29
I/O26
I/O25
I/O22
I/O42
I/O40
I/O32
GND
Y2
I/O23
I/O21
I/O44
I/O43
I/O20
I/O19
I/O47
I/O46
IN5
*SDO/
IN2
I/O17
I/O16
IN6
I/O45
GND
GND
*MODE/
IN1
I/O18
I/O48
I/O49
I/O50
I/O13
I/O14
I/O15
I/O51
I/O52
I/O11
I/O12
I/O53
I/O55
INDEX
I/O63
GND
*ispEN
/NC
I/O8
I/O10
I/O54
I/O57
I/O58
I/O61
IN7
Vcc
*SDI/
IN0
I/O2
I/O5
I/O7
I/O9
I/O56
I/O59
I/O60
I/O62
Y0
I/O0
RESET
I/O1
I/O3
I/O4
I/O6
ispLSI 1032/883
pLSI 1032/883
Bottom View
A
B
C
D
E
F
G
H
J
K
L
11 10 9 8 7 6 5 4 3 2 1
PIN A1
*Pins have dual function capability for ispLSI 1032/883 only (except pin G3, which is ispEN only).
0488A-32-isp/883
Pin Configuration
ispLSI and pLSI 1032/883 84-Pin CPGA Pinout Diagram
Specifications ispLSI and pLSI 1032
18 1996 ISP Encyclopedia
ispLSI and pLSI 1032 Ordering Information
Part Number Description
Device Number
Grade
Blank = Commercial
I = Industrial
/883 = 883 Military Process
1032 XX X X X
Speed
90 = 90 MHz
f
max
80 = 80 MHz
f
max
60 = 60 MHz
f
max Power
L = Low
Package
J = PLCC
T = TQFP
G = CPGA
Device Family
0212-80B-isp1032
(is)pLSI
t
pd (ns)
f
max (MHz)
Ordering Number Package
90 12 ispLSI 1032-90LT 100-Pin TQFP
80 15 ispLSI 1032-80LJ 84-Pin PLCC
COMMERCIAL
90 12 ispLSI 1032-90LJ 84-Pin PLCC
80 15 ispLSI 1032-80LT 100-Pin TQFP
60 20 ispLSI 1032-60LJ 84-Pin PLCC
60 20 ispLSI 1032-60LT 100-Pin TQFP
INDUSTRIAL
t
pd (ns)
f
max (MHz)
Ordering Number Package
60 20 ispLSI 1032-60LJI 84-Pin PLCC
Family
ispLSI
90 12 pLSI 1032-90LT 100-Pin TQFP
80 15 pLSI 1032-80LJ 84-Pin PLCC
90 12 pLSI 1032-90LJ 84-Pin PLCC
80 15 pLSI 1032-80LT 100-Pin TQFP
60 20 pLSI 1032-60LJ 84-Pin PLCC
60 20 pLSI 1032-60LT 100-Pin TQFP
pLSI
ispLSI
pLSI 60 20 pLSI 1032-60LJI 84-Pin PLCC
Family
Table 2- 0041A-32-isp
MILITARY/883
t
pd (ns)
f
max (MHz)
Ordering Number Package
60 20 ispLSI 1032-60LG/883 84-Pin CPGA
ispLSI
pLSI 60 20 pLSI 1032-60LG/883 84-Pin CPGA
Family SMD Number
5962-9308501MXC
5962-9466801MXC
Note: Lattice Semiconductor recognizes the trend in military device procurement towards
using SMD compliant devices, as such, ordering by this number is recommended.
60 20 ispLSI 1032-60LTI 100-Pin TQFP
Copyright © 1997 Lattice Semiconductor Corporation.
E2CMOS, GAL, ispGAL, ispLSI, pLSI, pDS, Silicon Forest, UltraMOS, Lattice Semiconductor, L (stylized) Lattice
Semiconductor Corp., L (stylized) and Lattice (design) are registered trademarks of Lattice Semiconductor Corporation.
Generic Array Logic, ISP, ispATE, ispCODE, ispDOWNLOAD, ispGDS, ispDS, ispDS+, ispStarter, ispSTREAM, ispTEST,
ispTURBO, Latch-Lock, pDS+, RFT, Total ISP and Twin GLB are trademarks of Lattice Semiconductor Corporation. ISP is a
service mark of Lattice Semiconductor Corporation. All brand names or product names mentioned are trademarks or
registered trademarks of their respective holders.
Lattice Semiconductor Corporation (LSC) products are made under one or more of the following U.S. and international
patents: 4,761,768 US, 4,766,569 US, 4,833,646 US, 4,852,044 US, 4,855,954 US, 4,879,688 US, 4,887,239 US, 4,896,296
US, 5,130,574 US, 5,138,198 US, 5,162,679 US, 5,191,243 US, 5,204,556 US, 5,231,315 US, 5,231,316 US, 5,237,218 US,
5,245,226 US, 5,251,169 US, 5,272,666 US, 5,281,906 US, 5,295,095 US, 5,329,179 US, 5,331,590 US, 5,336,951 US,
5,353,246 US, 5,357,156 US, 5,359,573 US, 5,394,033 US, 5,394,037 US, 5,404,055 US, 5,418,390 US, 5,493,205 US,
0194091 EP, 0196771B1 EP, 0267271 EP, 0196771 UK, 0194091 GB, 0196771 WG, P3686070.0-08 WG. LSC does not
represent that products described herein are free from patent infringement or from any third-party right.
The specifications and information herein are subject to change without notice. Lattice Semiconductor Corporation (LSC)
reserves the right to discontinue any product or service without notice and assumes no obligation to correct any errors
contained herein or to advise any user of this document of any correction if such be made. LSC recommends its customers
obtain the latest version of the relevant information to establish, before ordering, that the information being relied upon is
current.
LSC warrants performance of its products to current and applicable specifications in accordance with LSC’s standard
warranty. Testing and other quality control procedures are performed to the extent LSC deems necessary. Specific testing of
all parameters of each product is not necessarily performed, unless mandated by government requirements.
LSC assumes no liability for applications assistance, customer’s product design, software performance, or infringements of
patents or services arising from the use of the products and services described herein.
LSC products are not authorized for use in life-support applications, devices or systems. Inclusion of LSC products in such
applications is prohibited.
LATTICE SEMICONDUCTOR CORPORATION
5555 Northeast Moore Court
Hillsboro, Oregon 97124 U.S.A.
Tel.: (503) 681-0118
FAX: (503) 681-3037
http://www.latticesemi.com February 1997