www.vishay.com For technical questions, contact: efi@vishay.com Document Number: 61076
96 Revision: 14-Mar-08
MID
Vishay Electro-Films
Thin Film Microwave Resistor
MICROWAVE
RESISTORS
The MID resistor chips on alumina are designed for low shunt
capacitance applications with 200 mW power requirements.
These chips are manufactured using Vishay Electro-Films
(EFI) sophisticated Thin Film equipment and manufacturing
technology. The MIDs are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
Wire bondable
Chip size: 0.050 inches square
Microwave resistance range: 18 Ω to 500 Ω
Overall resistance range: 2 Ω to 100 kΩ
Alumina substrate
Low stray capacitance: < 0.2 pF
Power: 200 mW
Resistor material: Tantalum nitride, self passivating
Moisture resistant
High frequency
APPLICATIONS
Vishay EFI MIC chip resistors provide excellent high-frequency response and are ideally suited for prototyping.
Typical application areas are:
Amplifiers
Oscillators
Attenuators
Couplers
Filters
Note:
• Only 18 W to 500 W are standard strip line designs for microwave applications
Product may not
be to scale
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
PROCESS CODE MICROWAVE
CLASS H* CLASS K* CLASS H* CLASS K*
003 007 - -
002 006 - -
001 005 022 -
000 004 008 009
*MIL-PRF-38534 inspection criteria
2 Ω
1.0 %
Tightest Standard Tolerance Available
± 100 ppm/°C
± 50 ppm/°C
5.1 Ω10 Ω51 kΩ75 kΩ100 kΩ
± 25 ppm/°C
± 200 ppm/°C
25 Ω33 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308 - 20 dB typical
Moisture Resistance, MIL-STD-202, Method 106 ± 0.1 % max. ΔR/R
Stability, 1000 h, + 125 °C, 100 mW ± 0.2 % max. ΔR/R
Operating Temperature Range- 55 °C to + 125 °C
Thermal Shock, MIL-STD-202, Method 107, Test Condition F ± 0.1 % max. ΔR/R
High Temperature Exposure, + 150 °C, 1000 h ± 0.2 % max. ΔR/R
Dielectric Voltage Breakdown 400 V
Insulation Resistance 1012 min.
Operating Voltage100 V max.
DC Pwer Rating at + 70 °C (Derated to Zero at 150 °C) 200 mW max.
5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.1 % max. ΔR/R
Document Number: 61076 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 14-Mar-08 97
MID
Thin Film Microwave Resistor Vishay Electro-Films
MICROWAVE
RESISTORS
DIMENSIONS in inches
SCHEMATIC
Options: Terminations: Aluminum, nickel solder (62/32/2)
Gold back for solder die attach
Contact Applications Engineer
0.050
0.044
0.010
0.044
TYPICAL RANGE
18 Ω - 100 kΩ
0.050
0.050
0.016
0.044
TYPICAL RANGE
8 Ω - 17 Ω
0.050
0.050
0.044
TYPICAL RANGE
2 Ω - 7.9 Ω
0.050
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.050 x 0.050 ± 0.003 (1.27 x 1.27 ± 0.076 mm)
Chip Thickness 0.010 ± 0.002 (0.254 ± 0.05 mm)
Chip Substrate Material 99.6 % alumina, 2 - 4 microinch finish
Resistor Material Tantalum nitride, self passivating
Bonding Pad Size 0.010 x 0.044 (0.254 x 1.11 mm)
Number of Pads 2
Pad Material 25 kÅ minimum gold standard
Backing None
ORDERING INFORMATION
Example: 100 % visualled, 50 Ω, ± 10 %, ± 100 ppm/°C TCR, gold pads, class H visual inspection
W
INSPECTION/
PACK AGING
W = 100 % visually inspected
parts in matrix trays per
MIL-STD-883
X = Sample, visually inspected
parts loaded in matrix
trays (4 % AQL)
MID
PRODUCT
FAMILY
001
PROCESS
CODE
See Process Code
table
5000
RESISTANCE
VALUE
Use first 4 digits
significant digits of the
resistance
B
MULTIPLIER
CODE
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
K
TOLERANCE
CODE
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
M = 20 %
L = 25 %
N = 50 %
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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