Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011
APL5603
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Low Dropout 600mA Fixed Voltage Linear Regulator
The APL5603 is a low-power and low dropout linear regu-
lators which operates from 2.9V to 6V input voltage and
delivers up to 600mA output current. Typical dropout volt-
age is only 220mV (typical) at 600mA output. The APL5603
regulators with low 140µA quiescent current are ideal for
battery-powered system appliances. The APL5603 regu-
lators are stable with a 2.2µF ceramic capacitor. The fea-
tures of current-limit, short-circuit current-limit, and over-
temperature protections can prevent the device against
currnet overload and over-temperature. The APL5603
regulators are availabe in SOT-23-5, TSOT-23-5, SOP-8,
and DFN3x3-8 packages.
FeaturesGeneral Description
Applications
•CD/DVD-ROM, CD-R/W
•Networking System, LAN Card, ADSL/Cable Modem
•Set-Top Box
•PC Peripherals
•Battery-Powered System
•Low Dropout Voltage: 220mV (Typical) @600mA
•Wide 2.9V~6V Input Voltage
•Low Quiescent Current: 140µA (Typical)
•Fixed Output Voltage with ±2% Accuracy
•Stable with Ceramic, 2.2µF Output Capacitor
•Short-Circuit Current-Limit
•Over-Temperature Protection
•Current-Limit Protection
•Internal Soft-Start
•SOT-23-5, TSOT-23-5, SOP-8, and DFN3x3-8
Packages
•Lead Free and Green Devices Available
(RoHS Compliant) Pin Configurations
GND 2 5 VOUT
EN 3 4 NC
VIN 1
SOT-23-5/TSOT-23-5
(Top View)
APL5603
VOUT 3
8 EN
VIN 1
VIN 2
VOUT 4
7 NC
5 NC
6 GND
DFN3x3-8
(Top View)
APL5603
7 GND
VOUT 3
VIN 2
NC 4 6 GND
5 GND
8 GND
EN 1
SOP-8
(Top View)
APL5603
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw2
APL5603
Marking for
SOT
-
23
-
5 package
Product Name Marking Product Name Marking Product Name Marking
APL5603-12B 635X APL5603-15B 639X APL5603-18B 63CX
APL5603-25B 63JX APL5603-28B 63MX APL5603-30B 63OX
APL5603-33B 63RX
* “X” in the marking indicates data code.
Marking for TSOT-23-5 package
Product Name Marking Product Name Marking Product Name Marking
APL5603-12BT 635X APL5603-15BT 639X APL5603-18BT 63CX
APL5603-25BT 63JX APL5603-28BT 63MX APL5603-30BT 63OX
APL5603-33BT 63RX
* “X” in the marking indicates data code.
Absolute Maximum Ratings (Note 2)
Symbol
Parameter Rating Unit
VIN VIN Supply Voltage (VIN to GND) -0.3 to 6.5 V
TJ Maximum Junction Temperature 150 oC
VOUT Output Voltage (VOUT to GND) -0.3 to VIN+0.3 V
VEN EN Pin Voltage (VEN to GND) -0.3 to 6.5 V
TSTG Storage Temperature Range -65 to 150 oC
TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 oC
PD Power Dissipation Internally Limited
Ordering and Marking Information
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Note 1: For other voltage versions please contact ANPEC for details.
Note 2: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Voltage Code (Note 1)
12 : 1.2V 15 : 1.5V 18 : 1.8V 25 : 2.5V
28 : 2.8V 30 : 3.0V 33 : 3.3V
Package Code
B : SOT-23-5 BT : TSOT-23-5
K : SOP-8 QA : DFN3x3-8
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5603
Handling Code
Temperature Range
Package Code
Assembly Material
Voltage Code
APL5603-18 K : XXXXX - Date Code ; 18 - Voltage Code
APL5603
XXXXX 18
APL5603-18 QA : XXXXX - Date Code ; 18 - Voltage Code
L5603
18
XXXXX
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw3
APL5603
Note 3: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink
values. The junction-to-ambient thermal resistance is measured on a PC board mounting with the device soldered down to minimum
copper area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal
shutdown.
Note 4: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ - TA) / θJA; TJ = 125°C.
Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Symbol
Parameter Range Unit
VIN VIN to GND 2.9 to 6 V
IOUT Output Current 0 to 0.6 A
CIN Input Capacitor 0.82 to 470 µF
COUT Output Capacitor 1 to 330 µF
TJ Junction Temperature -40 to 125 °C
TA Ambient Temperature -40 to 85 °C
Electrical Characteristics
APL5603
Symbol
Parameter Test Conditions Min. Typ. Max. Unit
SUPPLY CURRENT
VEN = 0V - - 1 µA
IQ Quiescent Current VIN=VEN=5V, IOUT=0mA - 140 200 µA
UNDER-VOLTAGE-LOCKOUT
VIN UVLO Threshold VIN rising 2.1 2.5 2.9 V
VIN UVLO Hysteresis - 0.15 - V
OUTPUT VOLTAGE
TA = 25°C -1 - +1
VOUT Output Voltage TA = -40 to 85°C (TJ = -40 to 125°C) -2 - +2 %VOUT
Line Regulation VIN = VOUT + 1V to 6V - 0.03 0.19 %/V
Load Regulation IOUT = 1mA to 600mA - 0.6 1.5 %/A
VOUT=2.8V, IOUT=600mA - 240 500
VOUT=3.3V, IOUT=600mA - 220 450
VDROP
Dropout Voltage
VOUT=5V, IOUT=600mA - 200 420
mV
PSRR
Power Supply Ripple Rejection
VIN = VOUT + 2V, f = 1kHz - 55 - dB
Recommended Operating Conditions
Symbol
Parameter Typical Value Unit
θJA
Junction to Air Thermal Resistance SOT-23-5
TSOT-23-5
SOP-8
DFN3x3-8
260
260
150
110
°C/W
Thermal Characteristics (Note 3, 4)
Refer to the typical application circuit. VIN = VOUT+1V or 2.9V (minimum), whichever is great, VEN = VIN, IOUT = 1mA,
TJ = -40 to 125 °C, TA = -40 to 85°C, unless otherwise specified. Typical values are at TA = 25°C.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw4
APL5603
Electrical Characteristics (Cont.)
APL5603
Symbol
Parameter Test Conditions Min. Typ. Max. Unit
SOFT-START AND PROTECTION
ILIM Output Current-Limit 700 - - mA
Thermal Shutdown Temperature
- 150 - °C
Thermal Shutdown Hysteresis - 40 - °C
Short-Circuit Current-Limit VOUT < 0.6V - 250 - mA
TSS Soft-Start Time - 130 300 µs
LOGIC INPUT
EN Logic Input-High Level 1.6 - - V
EN Logic Input-Low Level - - 0.4 V
EN Pull-Low Resistance VEN<3V - 2 - MΩ
Refer to the typical application circuit. VIN = VOUT+1V or 2.9V (minimum), whichever is great, VEN = VIN, IOUT = 1mA,
TJ = -40 to 125 °C, TA = -40 to 85°C, unless otherwise specified. Typical values are at TA = 25°C.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw5
APL5603
Typical Operating Characteristics
VIN to VOUT Dropout vs.
Junction Temperature
Junction Temperature, TJ (oC)
Power Supply Ripple Rejection
Frequency (Hz)
EN Threshold vs. Input VoltageQuiescent Current vs. Input Voltage
Input Voltage, VIN (V)Input Voltage, VIN (V)
Quiescent Current (µA)
EN Threshold, VHT-EN (V)
PSRR (dB)
VIN to VOUT Dropout, VDROP (V)
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
33.5 44.5 55.5 66.5
-80
-70
-60
-50
-40
-30
-20
-10
0
1000 10000 100000
VIN=3.3V, VOUT=1.8V, CIN=1µF, COUT=2.2µF,
IOUT=500mA
Current-Limit vs. Junction Temperature
Current-Limit, ILIM (A)
Junction Temperature, TJ (oC)
(Refer to the application circuit 1 in the section “Typical Application Circuits,” VIN=5V, VOUT=3.3V, COUT=2.2µF, unless
otherwise specified.)
0
50
100
150
200
250
300
350
-50 -25 0 25 50 75 100 125 150
VOUT=3.3V
IOUT=600mA
IOUT=400mA
IOUT=200mA
VIN to VOUT Dropout vs.
Junction Temperature
0
40
80
120
160
200
0 1 2 3 4 5 6
IOUT=0mA
0
50
100
150
200
250
300
-50 -25 025 50 75 100 125 150
IOUT=600mA
IOUT=400mA
IOUT=200mA
VOUT=5V
Junction Temperature, TJ (oC)
VIN to VOUT Dropout, VDROP (V)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
-50 -25 025 50 75 100 125 150
VIN=3.3V
VIN=5V
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw6
APL5603
Operating Waveforms
(Refer to the application circuit 1 in the section “Typical Application Circuits,” VIN=5V, VOUT=3.3V, COUT=2.2µF, unless
otherwise specified.)
CH1 : VIN , 2V/div
CH3 : VOUT , 2V/div
CH4 : IOUT , 500mA/div
Time : 1ms/div
Power On
2
1VIN
VOUT
IOUT
3
Power Off
CH1 : VIN , 2V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 200ms/div
2
1
3
VIN
VSET
VOUT
IOUT
VIN
VOUT
IOUT
Enable
CH1 : VEN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 100µs/div
VEN
VOUT
IOUT
2
1
3
Shutdown
CH1 : VEN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 20µs/div
2
1
3
VEN
VOUT
IOUT
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw7
APL5603
Operating Waveforms (Cont.)
(Refer to the application circuit 1 in the section “Typical Application Circuits,” VIN=5V, VOUT=3.3V, COUT=2.2µF, unless
otherwise specified.)
Current-Limit and Short-Circuit Current-Limit
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 1A/div
Time : 2ms/div
VIN
VOUT
IOUT
2
1
3
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 500ms/div
Thermal Shutdown
VIN
VOUT
IOUT
2
1
3
Load Transient
CH1 : VOUT , 100mV/div (offset=3.3V)
CH2 : IOUT , 200mV/div
Time : 200µs/div
VIN=5V, VOUT=3.3V CIN=1µF, COUT=2.2µF, IOUT rising/
falling time=1µs
2
1VOUT
IOUT
Line Transient
CH1 : VIN , 2V/div
CH2 : VOUT , 20mV/div (offset=3.3V)
Time : 200µs/div
VIN=4.5~6V, VIN rising/falling=10µs, IOUT=300mA
2
1
VOUT
VIN
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw8
APL5603
PIN NAME FUNCTION
VIN Input Supply Pin. Supply voltage can range from 2.9V to 6V. Bypass with a 1µF capacitor to GND.
VOUT Regulator Output. Sources up to 600mA. A small capacitor (2.2µF, typical) is needed from this pin to
ground to assure stability.
EN Shutdown Control Input. Driving the EN high turns on the regulator. Driving the EN pin low puts the
regulator into shutdown mode. The EN pin is pulled low by an internal resistor.
GND Ground.
Block Diagram
Pin Description
Typical Application Circuit
VIN
EN
GND
VOUT
APL5603
C2
2.2µF
C1
1µF
VINVOUT
VEN
Enable
Shutdown
UVLO and
Soft-Start
Thermal
Shutdown
VIN
GND
Current-Limit
VREF
=0.8V
Short-Circuit
Current-Limit
VOUT
EN
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw9
APL5603
Function Description
Thermal Shutdown
A thermal shutdown circuit limits the junction tempera-
ture of APL5603. When the junction temperature exceeds
+150oC, the thermal shutdown circuitry disables the
output, which allows the device to cool down. The output
circuitry is enabled again after the junction temperature
cools down by 40oC, resulting in a pulsed output during
continuous thermal overload conditions. Thermal pro-
tection is designed to protect the IC in the event of over-
temperature conditions. For reliable operation, the junc-
tion temperature cannot exceed TJ=+125 oC.
Enable and Shutdown
Driving the EN high turns on the regulator, driving the EN
low puts the regulator into shutdown mode. A logic low
also causes the output voltage to discharge to the GND.
The EN is pulled low by an internal resistor.
Under-Voltage Lockout (UVLO)
The APL5603 regulator has a built-in under-voltage lock-
out circuit to keep the output shut off until internal circuitry
is operating properly. The UVLO function initiates a soft-
start process after input voltage exceeds its rising UVLO
threshold during power on. Typical UVLO threshold is
2.4V with 0.15V hysteresis.
Soft-Start
The APL5603 provides an internal soft-start circuitry to
control rise rate of the output voltage and limit the current
surge during start-up. Approximate 20µs delay time after
the VIN is over the UVLO threshold, the output voltage
starts the soft-start. The typical soft-start interval is about
130µs.
Current-Limit
The APL5603 provides a current-limit circuitry, which
monitors and controls P-MOS’s gate voltage, limiting the
output current to 700mA. For reliable operation, the de-
vice should not be operated in current-limit for extended
period.
Short-Circuit Current-Limit
When the output voltage drops below 0.6V due to over-
load or short-circuit, the internal short-circuit current-limit
circuitry limits the output current down to 250mA. The
short-circuit current-limit is used to reduce the power dis-
sipation during short-circuit condition. In some high VIN-
VOUT conditions, if the junction temperature is over the
thermal shutdown temperature, the device will enter the
thermal shutdown. Please refer to the section on thermal
considerations for power dissipation calculations. The
short-circuit current-limit has featured with blanking time
after the UVLO threshold is reached, so that it will avoid
the output causing short-circuit current-limit protection
during start-up; the blanking time is about 600µs.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw10
APL5603
Application Information
Layout Consideration
Figure 1 illustrates the layout. Below is a checklist for
your layout:
1. Please place the input capacitors close to the VIN.
2. Ceramic capacitors for load must be placed near the
load as close as possible.
3. To place APL5603 and output capacitors near the load
is good for performance.
4. Large current paths, the bold lines in figure 1, must
have wide tracks.
Input Capacitor
The APL5603 requires proper input capacitors to supply
surge current during stepping load transients to prevent
the input rail from dropping. Because the parasitic induc-
tor from the voltage sources or other bulk capacitors to
the VIN limits the slew rate of the surge current, it is nec-
essary to place the input capacitors near VIN as close as
possible. Input capacitors should be larger than 0.82µF.
Output Capacitor
The APL5603 needs a proper output capacitor to main-
tain circuit stability and to improve transient response
over-temperature and current. In order to insure the cir-
cuit stability, the proper output capacitor value should be
larger than 1µF. With X5R and X7R dielectrics, 2.2 µF is
sufficient at all operating temperatures. Maximum output
capacitor should be less than 330µF to insure the sys-
tem can be powered on effectively.
The APL5603 maximum power dissipation depends on
the thermal resistance and temperature difference be-
tween the die junction and ambient air. The power dissi-
pation PD across the device is:
PD = (TJ - TA) / θJA
where (TJ-TA) is the temperature difference between the
junction and ambient air. θJA is the thermal resistance
between junction and ambient air. Assuming the TA=25oC
and maximum TJ=150oC (typical thermal limit threshold),
the maximum power dissipation is calculated as:
PD(max)=(150-25)/260
= 0.48(W)
For normal operation, do not exceed the maximum oper-
ating junction temperature of TJ = 125 oC. The calculated
power dissipation should be less than:
PD =(125-25)/260
= 0.38(W)
The GND provides an electrical connection to ground and
channels heat away. Connect the GND to the ground by
using a large pad or ground plane.
Operation Region and Power Dissipation Figure 1.
Large ground plane is good for heating. Optimum perfor-
mance can only be achieved when the device is mounted
on a PC board according to the Board layout diagrams
which are shown as Figure2, 3, and 4.
Figure 2.Figure 3.
Figure 4.
VIN VOUT
GND
APL5603
CIN
COUT
VIN VOUT
EN
VEN
SOT-23-5
CIN COUT
VOUT
GND
DFN3X3-8
VOUT
VIN
GND
CIN
COUT
For dissipating heat
SOP-8
GND
VOUT
VIN
GND
CIN
COUT
For dissipating heat
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw11
APL5603
Package Information
SOT-23-5
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
S
Y
M
B
O
L
A1
A2
A
0.00
0.90
SOT-23-5
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°
8
°
0
°
8
°
0
bc
e1
0
L
VIEW A
0.25
GAUGE PLANE
SEATING PLANE
A
A2A1
e
D
E
E1
SEE
VIEW A
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw12
APL5603
Package Information
TSOT-23-5
S
Y
M
B
O
LMIN. MAX.
1.00
0.01
0.08 0.22
0.10
A
A1
c
D
E
E1
e
e1
L
MILLIMETERS
b0.30 0.50
0.95 BSC
TSOT-23-5
0.30 0.60
0.037 BSC
MIN. MAX.
INCHES
0.039
0.000
0.028 0.035
0.003 0.009
0.012 0.024
0
0.004
A2 0.70 0.90
0.012 0.020
1.90BSC 0.075 BSC
°
0
°
8
°
0
°
8
1.40 1.80
2.60 3.00
2.70 3.10 0.106 0.122
0.055 0.071
0.102 0.118
Note : 1. Followed from JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per
side.
0.70 0.028
SEE VIEW A
c
E1
E
De
e1
b
A
A2A1
VIEW A
LSEATING PLANE
GAUGE PLANE
0.25
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw13
APL5603
Package Information
SOP-8
A
A1A2
L
VIEW A
0.25
SEATING PLANE
GAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
S
Y
M
B
O
LMIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0
°
8
°
0
°
8
°
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
D
e
E
E1
SEE VIEW A
cb
h X 45
°
SEATING PLANE < 4 mils-T-
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw14
APL5603
Package Information
DFN3x3-8
S
Y
M
B
O
LMIN. MAX.
1.00
0.00
0.25 0.35
1.90 2.40
0.05
1.40
A
A1
b
D
D2
E
E2
e
L
MILLIMETERS
A3 0.20 REF
DFN3x3-8
0.30 0.50
1.75
0.008 REF
MIN. MAX.
INCHES
0.039
0.000
0.010 0.014
0.075 0.094
0.055
0.012 0.020
0.80
0.069
0.031
0.002
0.65 BSC 0.026 BSC
0.20 0.008
K
2.90 3.10 0.114 0.122
2.90 3.10 0.114 0.122
D
E
Pin 1
A
A1
A3
b
D2
Pin 1 Corner
e
E2
K
L
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw15
APL5603
Carrier Tape & Reel Dimensions
A
E1
A
B
W
F
T
P0
OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Application
A H T1 C d D W E1 F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-23-5
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
Application
A H T1 C d D W E1 F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
TSOT-23-5
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
Application
A H T1 C d D W E1 F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOP- 8
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
(mm)
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw16
APL5603
Carrier Tape & Reel Dimensions (Cont.)
Application
A H T1 C d D W E1 F
178.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
DFN3x3-8
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
3.30±0.20
3.30±0.20
1.30±0.20
(mm)
Package Type Unit Quantity
SOT-23-5 Tape & Reel 3000
TSOT-23-5 Tape & Reel 3000
SOP-8 Tape & Reel 2500
DFN3x3-8 Tape & Reel 3000
Devices Per Unit
Taping Direction Information
(T)SOT-23-5
USER DIRECTION OF FEED
SOP-8
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw17
APL5603
Taping Direction Information (Cont.)
DFN3x3-8
USER DIRECTION OF FEED
Classification Profile
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw18
APL5603
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Average ramp-up rate
(Tsmax to TP) 3 °C/second max. 3 °C/second max.
Liquidous temperature (TL)
Time at liquidous (tL) 183 °C
60-150 seconds 217 °C
60-150 seconds
Peak package body Temperature
(Tp)* See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc) 20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C
Reliability Test Program
Test item Method Description
SOLDERABILITY JESD-22, B102 5 Sec, 245°C
HOLT JESD-22, A108 1000 Hrs, Bias @ Tj=125°C
PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C
TCT JESD-22, A104 500 Cycles, -65°C~150°C
HBM MIL-STD-883-3015.7 VHBM≧2KV
MM JESD-22, A115 VMM≧200V
Latch-Up JESD 78 10ms, 1tr≧100mA
Copyright ANPEC Electronics Corp.
Rev. A.6 - Mar., 2011 www.anpec.com.tw19
APL5603
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
