MCIMX6S7CVM08AC - NXP SEMICONDUCTORS

NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMX6SDLIEC

Rev. 9, 11/2018

Package Information

Plastic Package

BGA Case 2240 21 x 21 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 3

NXP Reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products

MCIMX6UxCxxxxxB

MCIMX6UxCxxxxxC

MCIMX6UxCxxxxxD

MCIMX6SxCxxxxxB

MCIMX6SxCxxxxxC

MCIMX6SxCxxxxxD

1 Introduction

The i.MX 6Solo/6DualLite processors represent the

latest achievement in integrated multimedia-focused

products offering high-performance processing with a

high degree of functional integration to meet the

demands of high-end, advanced industrial and medical

applications requiring graphically rich and highly

responsive user interfaces.

The processors feature advanced implementation of

single/dual Arm®Cortex®-A9 core, which operates at

speeds of up to 800 MHz. They include 2D and 3D

graphics processors, 1080p video processing, and

integrated power management. Each processor provides

a 32/64-bit DDR3/DDR3L/LPDDR2-800 memory

interface and a number of other interfaces for connecting

peripherals, such as WLAN, Bluetooth®, GPS, hard

drive, displays, and camera sensors.

i.MX 6Solo/6DualLite

Applications Processors

for Industrial Products

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.3 Updated Signal Naming Convention . . . . . . . . . . . .8

2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.1 Special Signal Considerations . . . . . . . . . . . . . . . .20

3.2 Recommended Connections for Unused Analog

Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .22

4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .22

4.2 Power Supplies Requirements and Restrictions . .32

4.3 Integrated LDO Voltage Regulator Parameters . . .33

4.4 PLL’s Electrical Characteristics . . . . . . . . . . . . . . .35

4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .36

4.6 I/O DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . .38

4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .42

4.8 Output Buffer Impedance Parameters . . . . . . . . . .46

4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . .48

4.10 General-Purpose Media Interface (GPMI) Timing .61

4.11 External Peripheral Interface Parameters . . . . . . .69

5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .127

5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . .127

5.2 Boot Device Interface Allocation . . . . . . . . . . . . .128

6 Package Information and Contact Assignments . . . . . .129

6.1 Updated Signal Naming Convention . . . . . . . . . .129

6.2 21x21 mm Package Information. . . . . . . . . . . . . .130

7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .155

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

2NXP Semiconductors

Introduction

The i.MX 6Solo/6DualLite processors are specifically useful for applications such as:

• Graphics rendering for Human Machine Interfaces (HMI)

• High-performance speech processing with large databases

• Video processing and display

• Portable medical

• Home energy management systems

• Industrial control and automation

The i.MX 6Solo/6DualLite applications processors feature:

• Multilevel memory system—The multilevel memory system of each processor is based on the L1

instruction and data caches, L2 cache, and internal and external memory. The processors support

many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash,

PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND,

including eMMC up to rev 4.4/4.41.

• Smart speed technology—The processors have power management throughout the IC that enables

the rich suite of multimedia features and peripherals to consume minimum power in both active

and various low power modes. Smart speed technology enables the designer to deliver a

feature-rich product, requiring levels of power far lower than industry expectations.

• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices

by scaling the voltage and frequency to optimize performance.

• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a

multilevel cache system, NEON™ MPE (Media Processor Engine) co-processor, a multi-standard

hardware video codec, an image processing unit (IPU), a programmable smart DMA (SDMA)

controller, and an asynchronous sample rate converter.

• Powerful graphics acceleration—Each processor provides two independent, integrated graphics

processing units: an OpenGL® ES 2.0 3D graphics accelerator with a shader and a 2D graphics

accelerator.

• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD

controller for up to two displays (including parallel display, HDMI1.4, MIPI display, and LVDS

display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with

PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host

and other), 10/100/1000 Mbps Gigabit Ethernet controller two CAN ports, ESAI audio interface,

and a variety of other popular interfaces (such as UART, I2C, and I2S serial audio, and PCIe-II).

• Advanced security—The processors deliver hardware-enabled security features that enable secure

e-commerce, digital rights management (DRM), information encryption, secure boot, and secure

software downloads. The security features are discussed in detail in the i.MX 6Solo/6DualLite

Security Reference Manual (IMX6DQ6SDLSRM).

• Integrated power management—The processors integrate linear regulators and internally generate

voltage levels for different domains. This significantly simplifies system power management

structure.

Introduction

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 3

1.1 Ordering Information

Table 1 provides examples of orderable part numbers covered by this data sheet. Table 1 does not include

all possible orderable part numbers. The latest part numbers are available on the web page

nxp.com/imx6series. If the desired part number is not listed in Table 1, go to nxp.com/imx6series or

contact a NXP representative for details.

Figure 1 describes the part number nomenclature to identify the characteristics of a specific part number

(for example, cores, frequency, temperature grade, fuse options, and silicon revision).

The primary characteristic that differentiates which data sheet applies to a specific part is the temperature

grade (junction) field. The following list describes the correct data sheet to use for a specific part:

• The i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors data sheet

(IMX6SDLAEC) covers parts listed with an “A (Automotive temp)”

• The i.MX 6Solo/6DualLite Applications Processors for Consumer Products data sheet

(IMX6SDLCEC) covers parts listed with a “D (Commercial temp)” or “E (Extended Commercial

temp)”

• The i.MX 6Solo/6DualLite Applications Processors for Industrial Products data sheet

(IMX6SDLIEC) covers parts listed with “C (Industrial temp)”

For more information go to nxp.com/imx6series or contact a NXP representative for details.

Table 1. Example Orderable Part Numbers

Part Number

i.MX6 CPU

Solo/

DualLite

Options Speed

Grade1

1If a 24 MHz clock is used (required for USB), then the maximum SoC speed is limited to 792 MHz.

Temperature

Grade Package

MCIMX6U7CVM08AB DualLite With VPU, GPU, no EPDC, no MLB

2x Arm Cortex-A9 64-bit DDR

800 MHz Industrial 21 mm x 21 mm,

0.8 mm pitch, MAPBGA

MCIMX6U7CVM08AC DualLite With VPU, GPU, no EPDC, no MLB

2x Arm Cortex-A9 64-bit DDR

800 MHz Industrial 21 mm x 21 mm,

0.8 mm pitch, MAPBGA

MCIMX6U7CVM08AD DualLite With VPU, GPU, no EPDC, no MLB

2x Arm Cortex-A9 64-bit DDR

800 MHz Industrial 21 mm x 21 mm, 0.8 mm

pitch, MAPBGA

MCIMX6S7CVM08AB Solo With VPU, GPU, no EPDC, no MLB

1x Arm Cortex-A9 32-bit DDR

800 MHz Industrial 21 mm x 21 mm,

0.8 mm pitch, MAPBGA

MCIMX6S7CVM08AC Solo With VPU, GPU, no EPDC, no MLB

1x Arm Cortex-A9 32-bit DDR

800 MHz Industrial 21 mm x 21 mm,

0.8 mm pitch, MAPBGA

MCIMX6S7CVM08AD Solo With VPU, GPU, no EPDC, no MLB

1x Arm Cortex-A9 32-bit DDR

800 MHz Industrial 21 mm x 21 mm, 0.8 mm

pitch, MAPBGA

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

4NXP Semiconductors

Introduction

Figure 1. Part Number Nomenclature—i.MX 6Solo and 6DualLite

Figure 2. Example Part Marking

1.2 Features

The i.MX 6Solo/6DualLite processors are based on Arm Cortex-A9 MPCore Platform, which has the

following features:

• The i.MX 6Solo supports single Arm Cortex-A9 MPCore (with TrustZone)

• The i.MX 6DualLite supports dual Arm Cortex-A9 MPCore (with TrustZone)

• The core configuration is symmetric, where each core includes:

— 32 KByte L1 Instruction Cache

— 32 KByte L1 Data Cache

— Private Timer and Watchdog

Temperature Tj +

Commercial: 0 to + 95°CD

Extended commercial: -20 to + 105°CE

Industrial: -40 to +105°CC

Automotive: -40 to + 125°CA

Frequency $$

800 MHz208

1 GHz310

Package type RoHS

MAPBGA 21 x 21 0.8mm VM

Qualification level MC

Prototype Samples PC

Mass Production MC

Special SC

Part # series X

i.MX 6DualLite

2x ARM Cortex-A9, 64-bit DDR

i.MX 6Solo

1x ARM Cortex-A9, 32-bit DDR

Silicon revision1A

Rev 1.1 B

Rev 1.2 (Maskset ID: 2N81E)

Rev 1.3 (Maskset ID: 3N81E)

Rev 1.4 (Maskset ID: 4N81E) D

Fusing %

Default settings A

HDCP enabled C

MC IMX6 X@+VV $$ %A

1. See the nxp.com\imx6series Web page for latest information on the ava i la ble si licon revis ion.

2. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 792 MHz.

3. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz.

Part differentiator @

Consumer VPU GPU EPDC MLB 8

Industrial VPU GPU – – 7

Automotive VPU GPU – MLB 6

Consumer VPU GPU – MLB 5

Automotive – GPU – MLB 4

Automotive – – – MLB 1

Introduction

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 5

— Cortex-A9 NEON MPE (Media Processing Engine) Co-processor

The Arm Cortex-A9 MPCore complex includes:

• General Interrupt Controller (GIC) with 128 interrupt support

• Global Timer

• Snoop Control Unit (SCU)

• 512 KB unified I/D L2 cache:

— Used by one core in i.MX 6Solo

— Shared by two cores in i.MX 6DualLite

• Two Master AXI bus interfaces output of L2 cache

• Frequency of the core (including NEON and L1 cache), as per Table 8.

• NEON MPE coprocessor

— SIMD Media Processing Architecture

— NEON register file with 32x64-bit general-purpose registers

— NEON Integer execute pipeline (ALU, Shift, MAC)

— NEON dual, single-precision floating point execute pipeline (FADD, FMUL)

— NEON load/store and permute pipeline

The SoC-level memory system consists of the following additional components:

— Boot ROM, including HAB (96 KB)

— Internal multimedia / shared, fast access RAM (OCRAM, 128 KB)

— Secure/non-secure RAM (16 KB)

• External memory interfaces: The i.MX 6Solo/6DualLite processors support latest, high volume,

cost effective handheld DRAM, NOR, and NAND Flash memory standards.

— 16/32-bit LP-DDR2-800, 16/32-bit DDR3-800 and DDR3L-800 in i.MX 6Solo; 16/32/64-bit

LP-DDR2-800, 16/32/64-bit DDR3-800 and DDR3L-800, supporting DDR interleaving mode

for 2x32 LPDDR2-800 in i.MX 6DualLite

— 8-bit NAND-Flash, including support for Raw MLC/SLC, 2 KB, 4 KB, and 8 KB page size,

BA-NAND, PBA-NAND, LBA-NAND, OneNAND™ and others. BCH ECC up to 40 bit.

— 16/32-bit NOR Flash. All WEIMv2 pins are muxed on other interfaces.

— 16/32-bit PSRAM, Cellular RAM

Each i.MX 6Solo/6DualLite processor enables the following interfaces to external devices (some of them

are muxed and not available simultaneously):

• Displays—Total of four interfaces available. Total raw pixel rate of all interfaces is up to 450

Mpixels/sec, 24 bpp. Up to two interfaces may be active in parallel.

— One Parallel 24-bit display port, up to 225 Mpixels/sec (for example, WUXGA at 60 Hz or dual

HD1080 and WXGA at 60 Hz)

— LVDS serial ports—One port up to 165 Mpixels/sec or two ports up to 85 MP/sec (for example,

WUXGA at 60 Hz) each

— HDMI 1.4 port

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

6NXP Semiconductors

Introduction

— MIPI/DSI, two lanes at 1 Gbps

• Camera sensors:

— Two parallel Camera ports (up to 20 bit and up to 240 MHz peak)

— MIPI CSI-2 Serial port, supporting from 80 Mbps to 1 Gbps speed per data lane. The CSI-2

Receiver core can manage one clock lane and up to two data lanes. Each i.MX 6Solo/6DualLite

processor has two lanes.

• Expansion cards:

— Four MMC/SD/SDIO card ports all supporting:

– 1-bit or 4-bit transfer mode specifications for SD and SDIO cards up to UHS-I SDR-104

mode (104 MB/s max)

– 1-bit, 4-bit, or 8-bit transfer mode specifications for MMC cards up to 52 MHz in both SDR

and DDR modes (104 MB/s max)

•USB:

— One high speed (HS) USB 2.0 OTG (Up to 480 Mbps), with integrated HS USB Phy

— Three USB 2.0 (480 Mbps) hosts:

– One HS host with integrated High Speed Phy

– Two HS hosts with integrated HS-IC USB (High Speed Inter-Chip USB) Phy

• Expansion PCI Express port (PCIe) v2.0 one lane

— PCI Express (Gen 2.0) dual mode complex, supporting Root complex operations and Endpoint

operations. Uses x1 PHY configuration.

• Miscellaneous IPs and interfaces:

— SSI block is capable of supporting audio sample frequencies up to 192 kHz stereo inputs and

outputs with I2S mode

— ESAI is capable of supporting audio sample frequencies up to 260 kHz in I2S mode with 7.1

multi channel outputs

— Five UARTs, up to 5.0 Mbps each:

– Providing RS232 interface

– Supporting 9-bit RS485 multidrop mode

– One of the five UARTs (UART1) supports 8-wire while others four supports 4-wire. This is

due to the SoC IOMUX limitation, since all UART IPs are identical.

— Four eCSPI (Enhanced CSPI)

— Four I2C, supporting 400 kbps

— Gigabit Ethernet Controller (IEEE1588 compliant), 10/100/10001 Mbps

— Four Pulse Width Modulators (PWM)

— System JTAG Controller (SJC)

— GPIO with interrupt capabilities

— 8x8 Key Pad Port (KPP)

1. The theoretical maximum performance of 1 Gbps ENET is limited to 470 Mbps (total for Tx and Rx) due to internal bus

throughput limitations. The actual measured performance in optimized environment is up to 400 Mbps. For details, see the

ERR004512 erratum in the i.MX 6Solo/6DualLite errata document (IMX6SDLCE).

Introduction

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 7

— Sony Philips Digital Interconnect Format (SPDIF), Rx and Tx

— Two Controller Area Network (FlexCAN), 1 Mbps each

— Two Watchdog timers (WDOG)

— Audio MUX (AUDMUX)

The i.MX 6Solo/6DualLite processors integrate advanced power management unit and controllers:

• Provide PMU, including LDO supplies, for on-chip resources

• Use Temperature Sensor for monitoring the die temperature

• Support DVFS techniques for low power modes

• Use SW State Retention and Power Gating for Arm and MPE

• Support various levels of system power modes

• Use flexible clock gating control scheme

The i.MX 6Solo/6DualLite processors use dedicated hardware accelerators to meet the targeted

multimedia performance. The use of hardware accelerators is a key factor in obtaining high performance

at low power consumption numbers, while having the CPU core relatively free for performing other tasks.

The i.MX 6Solo/6DualLite processors incorporate the following hardware accelerators:

• VPU—Video Processing Unit

• IPUv3H—Image Processing Unit version 3H

• GPU3Dv5—3D Graphics Processing Unit (OpenGL ES 2.0) version 5

• GPU2Dv2—2D Graphics Processing Unit (BitBlt)

• ASRC—Asynchronous Sample Rate Converter

Security functions are enabled and accelerated by the following hardware:

• Arm TrustZone including the TZ architecture (separation of interrupts, memory mapping, etc.)

• SJC—System JTAG Controller. Protecting JTAG from debug port attacks by regulating or blocking

the access to the system debug features.

• CAAM—Cryptographic Acceleration and Assurance Module, containing cryptographic and hash

engines, 16 KB secure RAM, and True and Pseudo Random Number Generator (NIST certified).

• SNVS—Secure Non-Volatile Storage, including Secure Real Time Clock

• CSU—Central Security Unit. Enhancement for the IC Identification Module (IIM). Will be

configured during boot and by eFUSEs and will determine the security level operation mode as

well as the TZ policy.

• A-HAB—Advanced High Assurance Boot—HABv4 with the new embedded enhancements:

SHA-256, 2048-bit RSA key, version control mechanism, warm boot, CSU, and TZ initialization.

NOTE

The actual feature set depends on the part numbers as described in Table 1,

"Example Orderable Part Numbers," on page 3. Functions, such as video

hardware acceleration, and 2D and 3D hardware graphics acceleration may

not be enabled for specific part numbers.

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

8NXP Semiconductors

Introduction

1.3 Updated Signal Naming Convention

The signal names of the i.MX6 series of products have been standardized to better align the signal names

within the family and across the documentation. Some of the benefits of these changes are as follows:

• The names are unique within the scope of an SoC and within the series of products

• Searches will return all occurrences of the named signal

• The names are consistent between i.MX 6 series products implementing the same modules

• The module instance is incorporated into the signal name

This change applies only to signal names. The original ball names have been preserved to prevent the need

to change schematics, BSDL models, IBIS models, etc.

Throughout this document, the updated signal names are used except where referenced as a ball name

(such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal

name changes is in the document, IMX 6 Series Signal Name Mapping (EB792). This list can be used to

map the signal names used in older documentation to the new standardized naming conventions.

Architectural Overview

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 9

2 Architectural Overview

The following subsections provide an architectural overview of the i.MX 6Solo/6DualLite processor

system.

2.1 Block Diagram

Figure 3 shows the functional modules in the i.MX 6Solo/6DualLite processor system.

1144 KB RAM including 16 KB RAM inside the CAAM.

2For i.MX 6Solo, there is only one A9-core platform in the chip; for i.MX 6DualLite, there are two A9-core platforms.

Figure 3. i.MX 6Solo/6DualLite System Block Diagram

NOTE

The numbers in brackets indicate number of module instances. For example,

PWM (4) indicates four separate PWM peripherals.

Application Processor

Smart DMA

(SDMA)

Shared Peripherals

AP Peripherals

Arm Cortex-A9

SSI (3) eCSPI (4)

MPCore Platform

Timers/Control

GPT

PWM (4)

EPIT (2)

GPIO

WDOG (2)

C(4)

IOMUXC

OCTP_CTRL

AUDMUX

KPP

Boot

ROM

CSU

Fuse Box

Debug

DAP

TPIU

CAAM

(16KB Ram)

Security

USB OTG +

3 HS Ports

CTIs

Internal

Host PHY2

OTG PHY1

ESAI

External

Memory I/F

RAM

(144 KB)

LDB

1 / 2 LCD

Displays

Domain (AP)

SJC 512K L2 cache

SCU, Timer

WLAN

USB OTG

JTAG

(IEEE1149.6)

Bluetooth

MMC/SD

eMMC/eSD

GPS

Audio,

Power

Mngmnt.

SPBA

CAN(2)

Digital

Audio

2xCAN i/f

5xFast-UART

SPDIF Rx/Tx

Video

Proc. Unit

(VPU + Cache)

3D Graphics

Proc. Unit

(GPU3D)

AXI and AHB Switch Fabric

1 / 2 LVDS

(WUXGA+)

Battery Ctrl

Device

NOR Flash

PSRAM

LPDDR2/DDR3

1-Gbps ENET

2x Camera

Parallel/MIPI

(96KB)

PLL (8)

CCM

GPC

SRC

XTALOSC

OSC32K

PTM’s CTI’s

HDMI 1.4

Display

GPMI

HSI/MIPI

MIPI

Display

DSI/MIPICSI2/MIPI HDMI

2xHSIC

PHY

PCIe Bus

ASRC SNVS

(SRTC)

uSDHC (4)

Modem IC

2D Graphics

Proc. Unit

(GPU2D)

MMC/SD

SDXC

Raw / ONFI 2.2

NAND Flash

MMDC

EIM

Keypad

Crystals

& Clock sources

Image Processing

Subsystem

IPUv3H

Temp Monitor

Mbps

10/100/1000

Ethernet

Clock and Reset

400 MHz (DDR800)

Power Management

Unit (LDOs)

1x/2x A9-Core

L1 I/D Cache

Timer, WDOG

(dev/host)

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10 NXP Semiconductors

Modules List

3 Modules List

The i.MX 6Solo/6DualLite processors contain a variety of digital and analog modules. Table 2 describes

these modules in alphabetical order.

Table 2. i.MX 6Solo/6DualLite Modules List

Block Mnemonic Block Name Subsystem Brief Description

APBH-DMA NAND Flash and BCH

ECC DMA controller

System Control

Peripherals

DMA controller used for GPMI2 operation

Arm Arm Platform Arm The Arm Core Platform includes 1x (Solo) Cortex-A9

core for i.MX 6Solo and 2x (Dual) Cortex-A9 cores for

i.MX 6DualLite. It also includes associated sub-blocks,

such as the Level 2 Cache Controller, SCU (Snoop

Control Unit), GIC (General Interrupt Controller), private

timers, watchdog, and CoreSight debug modules.

ASRC Asynchronous Sample

Rate Converter

Multimedia

Peripherals

The Asynchronous Sample Rate Converter (ASRC)

converts the sampling rate of a signal associated to an

input clock into a signal associated to a different output

clock. The ASRC supports concurrent sample rate

conversion of up to 10 channels of about -120dB

THD+N. The sample rate conversion of each channel is

associated to a pair of incoming and outgoing sampling

rates. The ASRC supports up to three sampling rate

pairs.

AUDMUX Digital Audio Mux Multimedia

Peripherals

The AUDMUX is a programmable interconnect for voice,

audio, and synchronous data routing between host

serial interfaces (for example, SSI1, SSI2, and SSI3)

and peripheral serial interfaces (audio and voice

codecs). The AUDMUX has seven ports with identical

functionality and programming models. A desired

connectivity is achieved by configuring two or more

AUDMUX ports.

BCH40 Binary-BCH ECC

Processor

System Control

Peripherals

The BCH40 module provides up to 40-bit ECC for

NAND Flash controller (GPMI)

CAAM Cryptographic

accelerator and

assurance module

Security CAAM is a cryptographic accelerator and assurance

module. CAAM implements several encryption and

hashing functions, a run-time integrity checker, and a

Pseudo Random Number Generator (PRNG). The

pseudo random number generator is certified by

Cryptographic Algorithm Validation Program (CAVP) of

National Institute of Standards and Technology (NIST).

Its DRBG validation number is 94 and its SHS validation

number is 1455.

CAAM also implements a Secure Memory mechanism.

In i.MX 6Solo/6DualLite processors, the security

memory provided is 16 KB.

CCM

GPC

SRC

Clock Control Module,

General Power Controller,

System Reset Controller

Clocks, Resets, and

Power Control

These modules are responsible for clock and reset

distribution in the system, and also for the system power

management.

CSI MIPI CSI-2 i/f Multimedia

Peripherals

The CSI IP provides MIPI CSI-2 standard camera

interface port. The CSI-2 interface supports from 80

Mbps to 1 Gbps speed per data lane.

Modules List

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 11

CSU Central Security Unit Security The Central Security Unit (CSU) is responsible for

setting comprehensive security policy within the i.MX

6Solo/6DualLite platform.

CTI-0

CTI-1

CTI-2

CTI-3

CTI-4

Cross Trigger Interfaces Debug / Trace Cross Trigger Interfaces allows cross-triggering based

on inputs from masters attached to CTIs. The CTI

module is internal to the Cortex-A9 Core Platform.

CTM Cross Trigger Matrix Debug / Trace Cross Trigger Matrix IP is used to route triggering events

between CTIs. The CTM module is internal to the

Cortex-A9 Core Platform.

DAP Debug Access Port System Control

Peripherals

The DAP provides real-time access for the debugger

without halting the core to:

• System memory and peripheral registers

• All debug configuration registers

The DAP also provides debugger access to JTAG scan

chains. The DAP module is internal to the Cortex-A9

Core Platform.

DCIC-0

DCIC-1

Display Content Integrity

Checker

Automotive IP The DCIC provides integrity check on portion(s) of the

display. Each i.MX 6Solo/6DualLite processor has two

such modules.

DSI MIPI DSI i/f Multimedia

Peripherals

The MIPI DSI IP provides DSI standard display port

interface. The DSI interface support 80 Mbps to 1 Gbps

speed per data lane.

eCSPI1-4 Configurable SPI Connectivity

Peripherals

Full-duplex enhanced Synchronous Serial Interface. It is

configurable to support Master/Slave modes, four chip

selects to support multiple peripherals.

ENET Ethernet Controller Connectivity

Peripherals

The Ethernet Media Access Controller (MAC) is

designed to support 10/100/1000 Mbps Ethernet/IEEE

802.3 networks. An external transceiver interface and

transceiver function are required to complete the

interface to the media. The module has dedicated

hardware to support the IEEE 1588 standard. See the

ENET chapter of the reference manual for details.

Note: The theoretical maximum performance of 1 Gbps

ENET is limited to 470 Mbps (total for Tx and Rx) due to

internal bus throughput limitations. The actual

measured performance in optimized environment is up

to 400 Mbps. For details, see the ERR004512 erratum

in the i.MX 6Solo/6DualLite errata document

(IMX6SDLCE).

EPIT-1

EPIT-2

Enhanced Periodic

Interrupt Timer

Timer Peripherals Each EPIT is a 32-bit “set and forget” timer that starts

counting after the EPIT is enabled by software. It is

capable of providing precise interrupts at regular

intervals with minimal processor intervention. It has a

12-bit prescaler for division of input clock frequency to

get the required time setting for the interrupts to occur,

and counter value can be programmed on the fly.

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

12 NXP Semiconductors

Modules List

ESAI Enhanced Serial Audio

Interface

Connectivity

Peripherals

The Enhanced Serial Audio Interface (ESAI) provides a

full-duplex serial port for serial communication with a

variety of serial devices, including industry-standard

codecs, SPDIF transceivers, and other processors.

The ESAI consists of independent transmitter and

receiver sections, each section with its own clock

generator. All serial transfers are synchronized to a

clock. Additional synchronization signals are used to

delineate the word frames. The normal mode of

operation is used to transfer data at a periodic rate, one

word per period. The network mode is also intended for

periodic transfers; however, it supports up to 32 words

(time slots) per period. This mode can be used to build

time division multiplexed (TDM) networks. In contrast,

the on-demand mode is intended for non-periodic

transfers of data and to transfer data serially at high

speed when the data becomes available.

The ESAI has 12 pins for data and clocking connection

to external devices.

FlexCAN-1

FlexCAN-2

Flexible Controller Area

Network

Connectivity

Peripherals

The CAN protocol was primarily, but not only, designed

to be used as a vehicle serial data bus, meeting the

specific requirements of this field: real-time processing,

reliable operation in the Electromagnetic interference

(EMI) environment of a vehicle, cost-effectiveness and

required bandwidth. The FlexCAN module is a full

implementation of the CAN protocol specification,

Version 2.0 B, which supports both standard and

extended message frames.

512x8 Fuse Box Electrical Fuse Array Security Electrical Fuse Array. Enables to setup Boot Modes,

Security Levels, Security Keys, and many other system

parameters.

The i.MX 6Solo/6DualLite processors consist of

512x8-bit fuse fox accessible through OCOTP_CTRL

interface.

GPIO-1

GPIO-2

GPIO-3

GPIO-4

GPIO-5

GPIO-6

GPIO-7

General Purpose I/O

Modules

System Control

Peripherals

Used for general purpose input/output to external ICs.

Each GPIO module supports 32 bits of I/O.

GPMI General Purpose

Media Interface

Connectivity

Peripherals

The GPMI module supports up to 8x NAND devices.

40-bit ECC encryption/decryption for NAND Flash

controller (GPMI2). The GPMI supports separate DMA

channels per NAND device.

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules List

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 13

GPT General Purpose Timer Timer Peripherals Each GPT is a 32-bit “free-running” or “set and forget”

mode timer with programmable prescaler and compare

and capture register. A timer counter value can be

captured using an external event and can be configured

to trigger a capture event on either the leading or trailing

edges of an input pulse. When the timer is configured to

operate in “set and forget” mode, it is capable of

providing precise interrupts at regular intervals with

minimal processor intervention. The counter has output

compare logic to provide the status and interrupt at

comparison. This timer can be configured to run either

on an external clock or on an internal clock.

GPU3Dv5 Graphics Processing

Unit, ver.5

Multimedia

Peripherals

The GPU3Dv5 provides hardware acceleration for 3D

graphics algorithms with sufficient processor power to

run desktop quality interactive graphics applications on

displays up to HD1080 resolution. The GPU3D provides

OpenGL ES 2.0, including extensions, OpenGL ES 1.1,

and OpenVG 1.1

GPU2Dv2 Graphics Processing

Unit-2D, ver 2

Multimedia

Peripherals

The GPU2Dv2 provides hardware acceleration for 2D

graphics algorithms, such as Bit BLT, stretch BLT, and

many other 2D functions.

HDMI Tx HDMI Tx i/f Multimedia

Peripherals

The HDMI module provides HDMI standard i/f port to an

HDMI 1.4 compliant display.

HSI MIPI HSI i/f Connectivity

Peripherals

The MIPI HSI provides a standard MIPI interface to the

applications processor.

I2C-1

I2C-2

I2C-3

I2C-4

I2C Interface Connectivity

Peripherals

I2C provide serial interface for external devices. Data

rates of up to 400 kbps are supported.

IOMUXC IOMUX Control System Control

Peripherals

This module enables flexible IO multiplexing. Each IO

pad has default and several alternate functions. The

alternate functions are software configurable.

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

14 NXP Semiconductors

Modules List

IPUv3H Image Processing Unit,

ver.3H

Multimedia

Peripherals

IPUv3H enables connectivity to displays and video

sources, relevant processing and synchronization and

control capabilities, allowing autonomous operation.

The IPUv3H supports concurrent output to two display

ports and concurrent input from two camera ports,

through the following interfaces:

• Parallel Interfaces for both display and camera

• Single/dual channel LVDS display interface

• HDMI transmitter

• MIPI/DSI transmitter

• MIPI/CSI-2 receiver

The processing includes:

• Image conversions: resizing, rotation, inversion, and

color space conversion

• A high-quality de-interlacing filter

• Video/graphics combining

• Image enhancement: color adjustment and gamut

mapping, gamma correction, and contrast

enhancement

• Support for display backlight reduction

KPP Key Pad Port Connectivity

Peripherals

KPP Supports 8x8 external key pad matrix. KPP

features are:

• Open drain design

• Glitch suppression circuit design

• Multiple keys detection

• Standby key press detection

LDB LVDS Display Bridge Connectivity

Peripherals

LVDS Display Bridge is used to connect the IPU (Image

Processing Unit) to External LVDS Display Interface.

LDB supports two channels; each channel has following

signals:

• One clock pair

• Four data pairs

Each signal pair contains LVDS special differential pad

(PadP, PadM).

MMDC Multi-Mode DDR

Controller

Connectivity

Peripherals

DDR Controller has the following features:

• Supports 16/32-bit DDR3-800 (LV) or LPDDR2-800

in i.MX 6Solo

• Supports 16/32/64-bit DDR3-800 (LV) or

LPDDR2-800 in i.MX 6DualLite

• Supports 2x32 LPDDR2-800 in i.MX 6DualLite

• Supports up to 4 GByte DDR memory space

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules List

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 15

OCOTP_CTRL OTP Controller Security The On-Chip OTP controller (OCOTP_CTRL) provides

an interface for reading, programming, and/or overriding

identification and control information stored in on-chip

fuse elements. The module supports

electrically-programmable poly fuses (eFUSEs). The

OCOTP_CTRL also provides a set of volatile

software-accessible signals that can be used for

software control of hardware elements, not requiring

non-volatility. The OCOTP_CTRL provides the primary

user-visible mechanism for interfacing with on-chip fuse

elements. Among the uses for the fuses are unique chip

identifiers, mask revision numbers, cryptographic keys,

JTAG secure mode, boot characteristics, and various

control signals, requiring permanent non-volatility.

OCRAM On-Chip Memory

controller

Data Path The On-Chip Memory controller (OCRAM) module is

designed as an interface between system’s AXI bus and

internal (on-chip) SRAM memory module.

In i.MX 6Solo/6DualLite processors, the OCRAM is

used for controlling the 128 KB multimedia RAM through

a 64-bit AXI bus.

OSC32KHz OSC32KHz Clocking Generates 32.768 KHz clock from external crystal.

PCIe PCI Express 2.0 Connectivity

Peripherals

The PCIe IP provides PCI Express Gen 2.0 functionality.

PMU Power-Management

functions

Data Path Integrated power management unit. Used to provide

power to various SoC domains.

PWM-1

PWM-2

PWM-3

PWM-4

Pulse Width Modulation Connectivity

Peripherals

The pulse-width modulator (PWM) has a 16-bit counter

and is optimized to generate sound from stored sample

audio images and it can also generate tones. It uses

16-bit resolution and a 4x16 data FIFO to generate

sound.

RAM

128 KB

Internal RAM Internal Memory Internal RAM, which is accessed through OCRAM

memory controller.

RAM

16 KB

Secure/non-secure RAM Secured Internal

Memory

Secure/non-secure Internal RAM, interfaced through

the CAAM.

ROM

96KB

Boot ROM Internal Memory Supports secure and regular Boot Modes. Includes read

protection on 4K region for content protection.

ROMCP ROM Controller with

Patch

Data Path ROM Controller with ROM Patch support

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

16 NXP Semiconductors

Modules List

SDMA Smart Direct Memory

Access

System Control

Peripherals

The SDMA is multi-channel flexible DMA engine. It

helps in maximizing system performance by off-loading

the various cores in dynamic data routing. It has the

following features:

• Powered by a 16-bit Instruction-Set micro-RISC

engine

• Multi-channel DMA supporting up to 32 time-division

multiplexed DMA channels

• 48 events with total flexibility to trigger any

combination of channels

• Memory accesses including linear, FIFO, and 2D

addressing

• Shared peripherals between Arm and SDMA

• Very fast Context-Switching with 2-level priority

based preemptive multi-tasking

• DMA units with auto-flush and prefetch capability

• Flexible address management for DMA transfers

(increment, decrement, and no address changes on

source and destination address)

• DMA ports can handle unit-directional and

bi-directional flows (copy mode)

• Up to 8-word buffer for configurable burst transfers

• Support of byte-swapping and CRC calculations

• Library of Scripts and API is available

SJC System JTAG Controller System Control

Peripherals

The SJC provides JTAG interface, which complies with

JTAG TAP standards, to internal logic. The i.MX

6Solo/6DualLite processors use JTAG port for

production, testing, and system debugging. In addition,

the SJC provides BSR (Boundary Scan Register)

standard support, which complies with IEEE1149.1 and

IEEE1149.6 standards.

The JTAG port must be accessible during platform initial

laboratory bring-up, for manufacturing tests and

troubleshooting, as well as for software debugging by

authorized entities. The i.MX 6Solo/6DualLite SJC

incorporates three security modes for protecting against

unauthorized accesses. Modes are selected through

eFUSE configuration.

SNVS Secure Non-Volatile

Storage

Security Secure Non-Volatile Storage, including Secure Real

Time Clock, Security State Machine, Master Key

Control, and Violation/Tamper Detection and reporting.

SPDIF Sony Philips Digital

Interconnect Format

Multimedia

Peripherals

A standard audio file transfer format, developed jointly

by the Sony and Phillips corporations. Has Transmitter

and Receiver functionality.

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules List

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 17

SSI-1

SSI-2

SSI-3

I2S/SSI/AC97 Interface Connectivity

Peripherals

The SSI is a full-duplex synchronous interface, which is

used on the AP to provide connectivity with off-chip

audio peripherals. The SSI supports a wide variety of

protocols (SSI normal, SSI network, I2S, and AC-97), bit

depths (up to 24 bits per word), and clock / frame sync

options.

The SSI has two pairs of 8x24 FIFOs and hardware

support for an external DMA controller in order to

minimize its impact on system performance. The

second pair of FIFOs provides hardware interleaving of

a second audio stream that reduces CPU overhead in

use cases where two time slots are being used

simultaneously.

TEMPMON Temperature Monitor System Control

Peripherals

The Temperature sensor IP is used for detecting die

temperature. The temperature read out does not reflect

case or ambient temperature. It reflects the temperature

in proximity of the sensor location on the die.

Temperature distribution may not be uniformly

distributed, therefore the read out value may not be the

reflection of the temperature value of the entire die.

TZASC Trust-Zone Address

Space Controller

Security The TZASC (TZC-380 by Arm) provides security

address region control functions required for intended

application. It is used on the path to the DRAM

controller.

UART-1

UART-2

UART-3

UART-4

UART-5

UART Interface Connectivity

Peripherals

Each of the UARTv2 modules support the following

serial data transmit/receive protocols and

configurations:

• 7- or 8-bit data words, 1 or 2 stop bits, programmable

parity (even, odd or none)

• Programmable baud rates up to 5 Mbps.

• 32-byte FIFO on Tx and 32 half-word FIFO on Rx

supporting auto-baud

• IrDA 1.0 support (up to SIR speed of 115200 bps)

• Option to operate as 8-pins full UART, DCE, or DTE

USBOH3 USB 2.0 High Speed

OTG and 3x HS Hosts

Connectivity

Peripherals

USBOH3 contains:

• One high-speed OTG module with integrated HS

USB PHY

• One high-speed Host module with integrated HS

USB PHY

• Two identical high-speed Host modules connected to

HSIC USB ports.

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

18 NXP Semiconductors

Modules List

uSDHC-1

uSDHC-2

uSDHC-3

uSDHC-4

SD/MMC and SDXC

Enhanced Multi-Media

Card / Secure Digital Host

Controller

Connectivity

Peripherals

i.MX 6Solo/6DualLite specific SoC characteristics:

All four MMC/SD/SDIO controller IPs are identical and

are based on the uSDHC IP. They are:

• Conforms to the SD Host Controller Standard

Specification version 3.0.

• Fully compliant with MMC command/response sets

and Physical Layer as defined in the Multimedia Card

System Specification, v4.2/4.3/4.4/4.41 including

high-capacity (size > 2 GB) cards HC MMC.

• Fully compliant with SD command/response sets and

Physical Layer as defined in the SD Memory Card

Specifications, v3.0 including high-capacity SDHC

cards up to 32 GB and SDXC cards up to 2 TB.

• Fully compliant with SDIO command/response sets

and interrupt/read-wait mode as defined in the SDIO

Card Specification, Part E1, v3.0

All four ports support:

• 1-bit or 4-bit transfer mode specifications for SD and

SDIO cards up to UHS-I SDR104 mode (104 MB/s

max)

• 1-bit, 4-bit, or 8-bit transfer mode specifications for

MMC cards up to 52 MHz in both SDR and DDR

modes (104 MB/s max)

However, the SoC level integration and I/O muxing logic

restrict the functionality to the following:

• Instances #1 and #2 are primarily intended to serve

as external slots or interfaces to on-board SDIO

devices. These ports are equipped with “Card

detection” and “Write Protection” pads and do not

support hardware reset.

• Instances #3 and #4 are primarily intended to serve

interfaces to embedded MMC memory or interfaces

to on-board SDIO devices. These ports do not have

“Card detection” and “Write Protection” pads and do

support hardware reset.

• All ports can work with 1.8 V and 3.3 V cards. There

are two completely independent I/O power domains

for Ports #1 and #2 in four bit configuration (SD

interface). Port #3 is placed in his own independent

power domain and port #4 shares power domain with

some other interfaces.

VDOA VDOA Multimedia

Peripherals

Video Data Order Adapter (VDOA): used to re-order

video data from the “tiled” order used by the VPU to the

conventional raster-scan order needed by the IPU.

VPU Video Processing Unit Multimedia

Peripherals

A high-performing video processing unit (VPU), which

covers many SD-level and HD-level video decoders and

SD-level encoders as a multi-standard video codec

engine as well as several important video processing,

such as rotation and mirroring.

See the i.MX 6Solo/6DualLite Reference Manual

(IMX6SDLRM) for complete list of VPU’s

decoding/encoding capabilities.

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules List

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 19

WDOG-1 Watch Dog Timer Peripherals The Watch Dog Timer supports two comparison points

during each counting period. Each of the comparison

points is configurable to evoke an interrupt to the Arm

core, and a second point evokes an external event on

the WDOG line.

WDOG-2

(TZ)

Watch Dog (TrustZone) Timer Peripherals The TrustZone Watchdog (TZ WDOG) timer module

protects against TrustZone starvation by providing a

method of escaping normal mode and forcing a switch

to the TZ mode. TZ starvation is a situation where the

normal OS prevents switching to the TZ mode. Such

situation is undesirable as it can compromise the

system’s security. Once the TZ WDOG module is

activated, it must be serviced by TZ software on a

periodic basis. If servicing does not take place, the timer

times out. Upon a time-out, the TZ WDOG asserts a TZ

mapped interrupt that forces switching to the TZ mode.

If it is still not served, the TZ WDOG asserts a security

violation signal to the CSU. The TZ WDOG module

cannot be programmed or deactivated by a normal

mode SW.

WEIM NOR-Flash /PSRAM

interface

Connectivity

Peripherals

The WEIM NOR-FLASH / PSRAM provides:

• Support 16-bit (in muxed IO mode only) PSRAM

memories (sync and async operating modes), at slow

frequency

• Support 16-bit (in muxed IO mode only) NOR-Flash

memories, at slow frequency

• Multiple chip selects

XTALOSC Crystal Oscillator I/F Clocks, Resets, and

Power Control

The XTALOSC module enables connectivity to external

crystal oscillator device. In a typical application

use-case, it is used for 24 MHz oscillator to provide USB

required frequency.

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

20 NXP Semiconductors

Modules List

3.1 Special Signal Considerations

Table 3 lists special signal considerations for the i.MX 6Solo/6DualLite processors. The signal names are

listed in alphabetical order.

The package contact assignments can be found in Section 6, “Package Information and Contact

Assignments.” Signal descriptions are provided in the i.MX 6Solo/6DualLite Reference Manual

(IMX6SDLRM).

Table 3. Special Signal Considerations

Signal Name Remarks

CLK1_P/CLK1_N

CLK2_P/CLK2_N

Two general purpose differential high speed clock Input/outputs are provided.

Any or both of them could be used:

• To feed external reference clock to the PLLs and further to the modules inside SoC, for example

as alternate reference clock for PCIe, Video/Audio interfaces, etc.

• To output internal SoC clock to be used outside the SoC as either reference clock or as a

functional clock for peripherals, for example it could be used as an output of the PCIe master

clock (root complex use)

See the i.MX 6Solo/6DualLite reference manual for details on the respective clock trees.

The clock inputs/outputs are LVDS differential pairs compatible with TIA/EIA-644 standard, the

maximum frequency range supported is 0...600 MHz.

Alternatively one may use single ended signal to drive CLKx_P input. In this case corresponding

CLKx_N input should be tied to the constant voltage level equal 1/2 of the input signal swing.

Termination should be provided in case of high frequency signals.

See LVDS pad electrical specification for further details.

After initialization, the CLKx inputs/outputs could be disabled (if not used). If unused any or both of

the CLKx_N/P pairs may remain unconnected.

XTALOSC_RTC_XTALI/

RTC_XTALO

If the user wishes to configure XTALOSC_RTC_XTALI and RTC_XTALO as an RTC oscillator, a

32.768 kHz crystal, (≤100 kΩ ESR, 10 pF load) should be connected between

XTALOSC_RTC_XTALI and RTC_XTALO. Remember that the capacitors implemented on either

side of the crystal are about twice the crystal load capacitor. To hit the exact oscillation frequency,

the board capacitors need to be reduced to account for board and chip parasitics. The integrated

oscillation amplifier is self biasing, but relatively weak. Care must be taken to limit parasitic leakage

from XTALOSC_RTC_XTALI and RTC_XTALO to either power or ground (>100 MΩ). This will

debias the amplifier and cause a reduction of startup margin. Typically XTALOSC_RTC_XTALI and

RTC_XTALO should bias to approximately 0.5 V.

If it is desired to feed an external low frequency clock into XTALOSC_RTC_XTALI the RTC_XTALO

pin must remain unconnected or driven with a complimentary signal. The logic level of this forcing

clock must not exceed VDD_SNVS_CAP level and the frequency must be <100 kHz under typical

conditions.

XTALI/XTALO • A 24.0 MHz crystal should be connected between XTALI and XTALO level and the frequency

should be <32 MHz under typical conditions. See the Hardware Development Guide

(IMX6DQ6SDLHDG), Design Checklist chapter, for details on crystal selection.

• NXP BSP (board support package) software requires 24 MHz on XTALI/XTALO.

• The crystal can be eliminated if an external 24 MHz oscillator is available in the system. In this

case, XTALI must be directly driven by the external oscillator and XTALO remains unconnected.

• The XTALI signal level must swing from ~0.8 x NVCC_PLL_OUT to ~0.2 V. If this clock is used

as a reference for USB and PCIe, then there are strict frequency tolerance and jitter

requirements. See OSC24M chapter and relevant interface specifications chapters for details.

Modules List

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 21

DRAM_VREF When using DDR_VREF with DDR I/O, the nominal reference voltage must be half of the

NVCC_DRAM supply. The user must tie DDR_VREF to a precision external resistor divider. Use a

1kΩ0.5% resistor to GND and a 1 kΩ0.5% resistor to NVCC_DRAM. Shunt each resistor with a

closely-mounted 0.1 µF capacitor.

To reduce supply current, a pair of 1.5 kΩ0.1% resistors can be used. Using resistors with

recommended tolerances ensures the ± 2% DDR_VREF tolerance (per the DDR3 specification) is

maintained when four DDR3 ICs plus the i.MX 6Solo/6DualLite are drawing current on the resistor

divider.

It is recommended to use regulated power supply for “big” memory configurations (more that eight

devices).

ZQPAD DRAM calibration resistor 240 Ω1% used as reference during DRAM output buffer driver

calibration should be connected between this pad and GND.

NVCC_LVDS_2P5 The DDR pre-drivers share the NVCC_LVDS_2P5 ball with the LVDS interface. This ball can be

shorted to VDD_HIGH_CAP on the circuit board.

VDD_FA

FA_ANA

These signals are reserved for NXP manufacturing use only. User must tie both connections to

GND.

GPANAIO Analog output for NXP use only. This output must remain unconnected.

JTAG_nnnn The JTAG interface is summarized in Table 4. Use of external resistors is unnecessary. However,

if external resistors are used, the user must ensure that the on-chip pull-up/down configuration is

followed. For example, do not use an external pull down on an input that has on-chip pull-up.

JTAG_TDO is configured with a keeper circuit such that the non-connected condition is eliminated

if an external pull resistor is not present. An external pull resistor on JTAG_TDO is detrimental and

must be avoided.

JTAG_MOD is referenced as SJC_MOD in the i.MX 6Solo/6DualLite reference manual. Both

names refer to the same signal. JTAG_MOD must be externally connected to GND for normal

operation. Termination to GND through an external pull-down resistor (such as 1 kΩ) is allowed.

JTAG_MOD set to hi configures the JTAG interface to mode compliant with IEEE1149.1 standard.

JTAG_MOD set to low configures the JTAG interface for common SW debug adding all the system

TAPs to the chain.

NC These signals are not functional and must remain unconnected by the user.

SRC_POR_B This cold reset negative logic input resets all modules and logic in the IC.

ONOFF In normal mode may be connected to ON/OFF button (De-bouncing provided at this input).

Internally this pad is pulled up. Short connection to GND in OFF mode causes internal power

management state machine to change state to ON. In ON mode short connection to GND

generates interrupt (intended to SW controllable power down). Long above ~5s connection to GND

causes “forced” OFF.

TEST_MODE TEST_MODE is for NXP factory use. This signal is internally connected to an on-chip pull-down

device. This signal must either be tied to Vss or remain unconnected.

PCIE_REXT The impedance calibration process requires connection of reference resistor 200 Ω1% precision

resistor on PCIE_REXT pad to ground.

CSI_REXT MIPI CSI PHY reference resistor. Use 6.04 KΩ1% resistor connected between this pad and GND

DSI_REXT MIPI DSI PHY reference resistor. Use 6.04 KΩ1% resistor connected between this pad and GND

Table 3. Special Signal Considerations (continued)

Signal Name Remarks

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

22 NXP Semiconductors

Electrical Characteristics

3.2 Recommended Connections for Unused Analog Interfaces

The recommended connections for unused analog interfaces can be found in the section, “Unused analog

interfaces,” of the Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of

Applications Processors (IMX6DQ6SDLHDG).

4 Electrical Characteristics

This section provides the device and module-level electrical characteristics for the i.MX 6Solo/6DualLite

processors.

4.1 Chip-Level Conditions

This section provides the device-level electrical characteristics for the IC. See Table 5 for a quick reference

to the individual tables and sections.

Table 4. JTAG Controller Interface Summary

JTAG I/O Type On-Chip Termination

JTAG_TCK Input 47 kΩ pull-up

JTAG_TMS Input 47 kΩ pull-up

JTAG_TDI Input 47 kΩ pull-up

JTAG_TDO 3-state output Keeper

JTAG_TRSTB Input 47 kΩ pull-up

JTAG_MOD Input 100 kΩ pull-up

Table 5. i.MX 6Solo/6DualLite Chip-Level Conditions

For these characteristics, … Topic appears …

Absolute Maximum Ratings on page 23

BGA Case 2240 Package Thermal Resistance on page 24

Operating Ranges on page 25

External Clock Sources on page 27

Maximum Supply Currents on page 28

Low Power Mode Supply Currents on page 29

USB PHY Current Consumption on page 31

PCIe 2.0 Power Consumption on page 31

Electrical Characteristics

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 23

4.1.1 Absolute Maximum Ratings

CAUTION

Stresses beyond those listed under Table 6 may cause permanent damage to

the device. These are stress ratings only. Functional operation of the device

at these or any other conditions beyond those indicated under

“recommended operating conditions” is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device

reliability.

Table 6 shows the absolute maximum operating ratings.

Table 6. Absolute Maximum Ratings

Parameter Description Symbol Min Max Unit

Core supply input voltage (LDO enabled) VDD_ARM_IN

VDD_SOC_IN -0.3 1.6 V

Core supply input voltage (LDO bypass) VDD_ARM_IN

VDD_SOC_IN -0.3 1.4 V

Core supply output voltage (LDO enabled) VDD_ARM_CAP

VDD_SOC_CAP

VDD_PU_CAP

-0.3 1.4 V

VDD_HIGH_IN supply voltage (LDO enabled) VDD_HIGH_IN -0.3 3.7 V

VDD_HIGH_CAP supply output voltage VDD_HIGH_CAP -0.3 2.85 V

DDR I/O supply voltage NVCC_DRAM -0.4 1.975 (See note 1) V

GPIO I/O supply voltage NVCC_CSI

NVCC_EIM

NVCC_ENET

NVCC_GPIO

NVCC_LCD

NVCC_NAND

NVCC_SD

NVCC_JTAG

-0.5 3.7 V

HDMI and PCIe high PHY VPH supply voltage HDMI_VPH

PCIE_VPH -0.3 2.85 V

HDMI and PCIe low PHY VP supply voltage HDMI_VP

PCIE_VP -0.3 1.4 V

LVDS and MIPI I/O supply voltage (2.5V supply) NVCC_LVDS_2P5

NVCC_MIPI -0.3 2.85 V

PCIe PHY supply voltage PCIE_VPTX -0.3 1.4 V

RGMII I/O supply voltage NVCC_RGMII -0.5 2.725 V

SNVS IN supply voltage

(Secure Non-Volatile Storage and Real Time Clock)

VDD_SNVS_IN -0.3 3.4 V

USB I/O supply voltage USB_H1_DN

USB_H1_DP

USB_OTG_DN

USB_OTG_DP

USB_OTG_CHD_B

-0.3 3.73 V

USB VBUS supply voltage USB_H1_VBUS

USB_OTG_VBUS —5.35 V

Vin/Vout input/output voltage range (non-DDR pins) Vin/Vout -0.5 OVDD+0.3 (See note 2) V

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

24 NXP Semiconductors

Electrical Characteristics

4.1.2 Thermal Resistance

NOTE

Per JEDEC JESD51-2, the intent of thermal resistance measurements is

solely for a thermal performance comparison of one package to another in a

standardized environment. This methodology is not meant to and will not

predict the performance of a package in an application-specific

environment.

4.1.2.1 BGA Case 2240 Package Thermal Resistance

Table 7 displays the thermal resistance data.

Vin/Vout input/output voltage range (DDR pins) Vin/Vout -0.5 OVDD+0.4 (See notes 1 & 2) V

ESD immunity (HBM) Vesd_HBM — 2000 V

ESD immunity (CDM) Vesd_CDM —500 V

Storage temperature range Tstorage -40 150 °C

1The absolute maximum voltage includes an allowance for 400 mV of overshoot on the IO pins. Per JEDEC standards, the

allowed signal overshoot must be derated if NVCC_DRAM exceeds 1.575V.

2OVDD is the I/O supply voltage.

Table 7. Thermal Resistance Data

Rating Test Conditions Symbol Value Unit

Junction to Ambient1

1Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

Single-layer board (1s); natural convection2

Four-layer board (2s2p); natural convection2

2Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified

package.

RθJA

oC/W

Junction to Ambient1 Single-layer board (1s); airflow 200 ft/min2,3

Four-layer board (2s2p); airflow 200 ft/min2,3

3Per JEDEC JESD51-6 with the board horizontal.

RθJA

oC/W

Junction to Board1,4

4Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—R

θJB 14 oC/W

Junction to Case1,5

5Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

—R

θJC 6oC/W

Junction to Package Top1,6

6Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Natural convection ΨJT 2oC/W

Table 6. Absolute Maximum Ratings (continued)

Parameter Description Symbol Min Max Unit

Electrical Characteristics

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NXP Semiconductors 25

4.1.3 Operating Ranges

Table 8 provides the operating ranges of the i.MX 6Solo/6DualLite processors. For details on the chip's

power structure, see the “Power Management Unit (PMU)” chapter of the i.MX 6Solo/6DualLite Reference

Manual (IMX6SDLRM).

Table 8. Operating Ranges

Parameter

Description Symbol Min Typ Max1Unit Comment2

Run mode: LDO

enabled

VDD_ARM_IN 1.2753— 1.5 V LDO Output Set Point (VDD_ARM_CAP) =

1.150 V minimum for operation up to 792MHz.

1.253— 1.5 V LDO Output Set Point (VDD_ARM_CAP) =

1.125 V minimum for operation up to 396MHz.

VDD_SOC_IN 1.2753,4 — 1.5 V VPU ≤ 328 MHz, VDD_SOC and VDD_PU

LDO outputs (VDD_SOC_CAP and

VDD_PU_CAP) = 1.225 V5 maximum and

1.15 V minimum.

Run mode: LDO

bypassed

VDD_ARM_IN 1.150 — 1.3 V LDO bypassed for operation up to 792 MHz

1.125 — 1.3 V LDO bypassed for operation up to 396 MHz

VDD_SOC_IN 1.1506—1.21

5V LDO bypassed for operation VPU ≤ 328 MHz

Standby/DSM mode VDD_ARM_IN 0.9 — 1.3 V Refer to Table 11, "Stop Mode Current and

Power Consumption," on page 29.

VDD_SOC_IN 0.9 — 1.2255V—

VDD_HIGH internal

regulator

VDD_HIGH_IN 2.8 — 3.3 V Must match the range of voltages that the

rechargeable backup battery supports.

Backup battery supply

range

VDD_SNVS_IN72.9 — 3.3 V Must be supplied from the same supply as

VDD_HIGH_IN if the system does not require

keeping real time and other data on OFF

state.

USB supply voltages USB_OTG_VBUS 4.4 — 5.25 V —

USB_H1_VBUS 4.4 — 5.25 V —

DDR I/O supply

voltage

NVCC_DRAM 1.14 1.2 1.3 V LPDDR2

1.425 1.5 1.575 V DDR3

1.283 1.35 1.45 V DDR3L

Supply for RGMII I/O

power group8

NVCC_RGMII 1.15 — 2.625 V 1.15 V–1.30 V in HSIC 1.2 V mode

1.43 V–1.58 V in RGMII 1.5 V mode

1.70 V–1.90 V in RGMII 1.8 V mode

2.25 V–2.625 V in RGMII 2.5 V mode

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26 NXP Semiconductors

Electrical Characteristics

GPIO supply

voltages8

NVCC_CSI,

NVCC_EIM,

NVCC_ENET,

NVCC_GPIO,

NVCC_LCD,

NVCC_NANDF,

NVCC_SD1,

NVCC_SD2,

NVCC_SD3,

NVCC_JTAG

1.65 1.8,

2.8,

3.3

3.6 V —

NVCC_LVDS_2P59

NVCC_MIPI

2.25 2.5 2.75 V —

HDMI supply voltages HDMI_VP 0.99 1.1 1.3 V —

HDMI_VPH 2.25 2.5 2.75 V —

PCIe supply voltages PCIE_VP 1.023 1.1 1.21 V —

PCIE_VPH 2.325 2.5 2.75 V —

PCIE_VPTX 1.023 1.1 1.21 V —

Junction temperature TJ-40 — 105 oCSee i.MX 6Solo/6DualLite Product Lifetime

Usage Estimates Application Note, AN4725,

for information on product lifetime for this

processor.

1Applying the maximum voltage results in maximum power consumption and heat generation. NXP recommends a voltage set

point = (Vmin + the supply tolerance). This results in an optimized power/speed ratio.

2See the Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors

(IMX6DQ6SDLHDG) for bypass capacitors requirements for each of the *_CAP supply outputs.

3VDD_ARM_IN and VDD_SOC_IN must be 125 mV higher than the LDO Output Set Point for correct regulator supply voltage.

4In LDO enabled mode, the internal LDO output set points must be configured such that the:

• VDD_ARM LDO output set point does not exceed the VDD_SOC LDO output set point by more than 100 mV.

• VDD_SOC LDO output set point is equal to the VDD_PU LDO output set point.

The VDD_ARM LDO output set point can be lower than the VDD_SOC LDO output set point, however, the minimum output set

points shown in this table must be maintained.

5When using VDD_SOC_CAP to supply the PCIE_VP and PCIE_VPTX, the maximum setting is 1.175V. If VDD_SOC_CAP

requires setting to 1.2V or higher, the PCIE_VP and PCIE_VPTX must use an external supply to guarantee not to exceed the

1.21V maximum operating voltage.

6In LDO bypassed mode, the external power supply must ensure that VDD_ARM_IN does not exceed VDD_SOC_IN by more

than 100 mV. The VDD_ARM_IN supply voltage can be lower than the VDD_SOC_IN supply voltage. The minimum voltages

shown in this table must be maintained.

7While setting VDD_SNVS_IN voltage with respect to Charging Currents and RTC, refer to Hardware Development Guide for i.MX

6Dual, 6Quad, 6Solo, 6DualLite Families of Applications Processors (IMX6DQ6SDLHDG).

8All digital I/O supplies (NVCC_xxxx) must be powered under normal conditions whether the associated I/O pins are in use or not

and associated IO pins need to have a pull-up or pull-down resistor applied to limit any non-connected gate current.

9This supply also powers the pre-drivers of the DDR IO pins, hence, it must be always provided, even when LVDS is not used.

Table 8. Operating Ranges (continued)

Parameter

Description Symbol Min Typ Max1Unit Comment2

Electrical Characteristics

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NXP Semiconductors 27

4.1.4 External Clock Sources

Each i.MX 6Solo/6DualLite processor has two external input system clocks: a low frequency

(RTC_XTALI) and a high frequency (XTALI).

The RTC_XTALI is used for low-frequency functions. It supplies the clock for wake-up circuit,

power-down real time clock operation, and slow system and watch-dog counters. The clock input can be

connected to either external oscillator or a crystal using internal oscillator amplifier. Additionally, there is

an internal ring oscillator, which can be used instead of the RTC_XTALI if accuracy is not important.

NOTE

The internal RTC oscillator does not provide an accurate frequency and is

affected by process, voltage, and temperature variations. NXP strongly

recommends using an external crystal as the RTC_XTALI reference. If the

internal oscillator is used instead, careful consideration must be given to the

timing implications on all of the SoC modules dependent on this clock.

The system clock input XTALI is used to generate the main system clock. It supplies the PLLs and other

peripherals. The system clock input can be connected to either external oscillator or a crystal using internal

oscillator amplifier.

Table 9 shows the interface frequency requirements.

The typical values shown in Table 9 are required for use with NXP BSPs to ensure precise time keeping

and USB operation. For XTALOSC_RTC_XTALI operation, two clock sources are available.

• On-chip 40 kHz ring oscillator—this clock source has the following characteristics:

— Approximately 25 µA more Idd than crystal oscillator

— Approximately ±50% tolerance

— No external component required

— Starts up quicker than 32 kHz crystal oscillator

• External crystal oscillator with on-chip support circuit:

— At power up, ring oscillator is utilized. After crystal oscillator is stable, the clock circuit

switches over to the crystal oscillator automatically.

— Higher accuracy than ring oscillator

— If no external crystal is present, then the ring oscillator is used

Table 9. External Input Clock Frequency

Parameter Description Symbol Min Typ Max Unit

RTC_XTALI Oscillator1,2

1External oscillator or a crystal with internal oscillator amplifier.

2The required frequency stability of this clock source is application dependent. For recommendations, see the Hardware

Development Guide for i.MX 6Dual, 6Quad, 6Solo, 6DualLite Families of Applications Processors (IMX6DQ6SDLHDG).

fckil — 32.7683/32.0

3Recommended nominal frequency 32.768 kHz.

—kHz

XTALI Oscillator2,4

4External oscillator or a fundamental frequency crystal with internal oscillator amplifier.

fxtal —24—MHz

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28 NXP Semiconductors

Electrical Characteristics

The choice of a clock source must be based on real-time clock use and precision timeout.

4.1.5 Maximum Supply Currents

The Power Virus numbers shown in Table 10 represent a use case designed specifically to show the

maximum current consumption possible. All cores are running at the defined maximum frequency and are

limited to L1 cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a

very limited practical use case, if at all, and be limited to an extremely low duty cycle unless the intention

was to specifically show the worst case power consumption.

The NXP power management IC, MMPF0100xxxx, which is targeted for the i.MX 6 series processor

family, supports the power consumption shown in Table 10, however a robust thermal design is required

for the increased system power dissipation.

See the i.MX 6Solo/6DualLite Power Consumption Measurement Application Note (AN4576) for more

details on typical power consumption under various use case definitions.

Table 10. Maximum Supply Currents

Power Line Conditions Max Current Unit

VDD_ARM_IN i.MX 6DualLite: 996 MHz Arm clock based on

Power Virus operation

2200 mA

i.MX 6Solo: 996 MHz Arm clock based on Power

Virus operation

1320 mA

VDD_SOC_IN 996 MHz Arm clock 1260 mA

VDD_HIGH_IN — 1251mA

VDD_SNVS_IN — 2752μA

USB_OTG_VBUS/

USB_H1_VBUS (LDO 3P0)

—25

3mA

Primary Interface (IO) Supplies

NVCC_DRAM — —4—

NVCC_ENET N=10 Use maximum IO equation5—

NVCC_LCD N=29 Use maximum IO equation5—

NVCC_GPIO N=24 Use maximum IO equation5—

NVCC_CSI N=20 Use maximum IO equation5—

NVCC_EIM N=53 Use maximum IO equation5—

NVCC_JTAG N=6 Use maximum IO equation5—

NVCC_RGMII N=6 Use maximum IO equation5—

NVCC_SD1 N=6 Use maximum IO equation5—

NVCC_SD2 N=6 Use maximum IO equation5—

NVCC_SD3 N=11 Use maximum IO equation5—

NVCC_NANDF N=26 Use maximum IO equation5—

Electrical Characteristics

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NXP Semiconductors 29

4.1.6 Low Power Mode Supply Currents

Table 11 shows the current core consumption (not including I/O) of i.MX 6Solo/6DualLite processors in

selected low power modes.

NVCC_LVDS2P56— NVCC_LVDS2P5 is connected to

VDD_HIGH_CAP at the board level.

VDD_HIGH_CAP is capable of

handing the current required by

NVCC_LVDS2P5.

—

MISC

DDR_VREF — 1 mA

1The actual maximum current drawn from VDD_HIGH_IN will be as shown plus any additional current drawn from the

VDD_HIGH_CAP outputs, depending upon actual application configuration (for example, NVCC_LVDS_2P5, NVCC_MIPI, or

HDMI and PCIe VPH supplies).

2Under normal operating conditions, the maximum current on VDD_SNVS_IN is shown in Table 10. The maximum

VDD_SNVS_IN current may be higher depending on specific operating configurations, such as BOOT_MODE[1:0] not equal

to 00, or use of the Tamper feature. During initial power on, VDD_SNVS_IN can draw up to 1 mA if the supply is capable of

sourcing that current. If less than 1 mA is available, the VDD_SNVS_CAP charge time will increase.

3This is the maximum current per active USB physical interface.

4The DRAM power consumption is dependent on several factors, such as external signal termination. DRAM power calculators

are typically available from the memory vendors. They take in account factors, such as signal termination. See the i.MX

6Solo/DualLite Power Consumption Measurement Application Note (AN4576) for examples of DRAM power consumption

during specific use case scenarios.

5General equation for estimated, maximum power consumption of an IO power supply:

Imax = N x C x V x (0.5 x F)

Where:

N—Number of IO pins supplied by the power line

C—Equivalent external capacitive load

V—IO voltage

(0.5 xF)—Data change rate. Up to 0.5 of the clock rate (F)

In this equation, Imax is in Amps, C in Farads, V in Volts, and F in Hertz.

6NVCC_LVDS2P5 is supplied by VDD_HIGH_CAP (by external connection) so the maximum supply current is included in the

current shown for VDD_HIGH_IN. The maximum supply current for NVCC_LVDS2P5 has not been characterized separately.

Table 11. Stop Mode Current and Power Consumption

Mode Test Conditions Supply Typical1Units

WAIT • Arm, SoC, and PU LDOs are set to 1.225

• HIGH LDO set to 2.5 V

• Clocks are gated.

• DDR is in self refresh.

• PLLs are active in bypass (24MHz)

• Supply Voltages remain ON

VDD_ARM_IN (1.4V) 4.5

mAVDD_SOC_IN (1.4V) 23

VDD_HIGH_IN (3.0V) 13.5

Total 79 mW

Table 10. Maximum Supply Currents (continued)

Power Line Conditions Max Current Unit

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30 NXP Semiconductors

Electrical Characteristics

STOP_ON • Arm LDO set to 0.9V

• SoC and PU LDOs set to 1.225 V

• HIGH LDO set to 2.5 V

• PLLs disabled

• DDR is in self refresh.

VDD_ARM_IN (1.4V) 4

mAVDD_SOC_IN (1.4V) 22

VDD_HIGH_IN (3.0V) 8.5

Total 61.9 mW

STOP_OFF • Arm LDO set to 0.9V

• SoC LDO set to: 1.225 V

• PU LDO is power gated

• HIGH LDO set to 2.5 V

• PLLs disabled

• DDR is in self refresh

VDD_ARM_IN (1.4V) 4

mAVDD_SOC_IN (1.4V) 13.5

VDD_HIGH_IN (3.0V) 7.5

Total 47 mW

STANDBY • Arm and PU LDOs are power gated

• SoC LDO is in bypass

• HIGH LDO is set to 2.5V

• PLLs are disabled

• Low Voltage

• Well Bias ON

• Crystal oscillator is enabled

VDD_ARM_IN (0.9V) 0.1

mAVDD_SOC_IN (0.9V) 5

VDD_HIGH_IN (3.0V) 5

Total 19.6 mW

Deep Sleep Mode

(DSM)

• Arm and PU LDOs are power gated

• SoC LDO is in bypass

• HIGH LDO is set to 2.5V

• PLLs are disabled

• Low Voltage

• Well Bias ON

• Crystal oscillator and bandgap are disabled

VDD_ARM_IN (0.9V) 0.1

mAVDD_SOC_IN (0.9V) 2

VDD_HIGH_IN (3.0V) 0.5

Total 3.4 mW

SNVS only • VDD_SNVS_IN powered

• All other supplies off

• SRTC running

VDD_SNVS_IN (2.8V) 41 μA

Total 115 mW

1The typical values shown here are for information only and are not guaranteed. These values are average values measured

on a typical wafer at 25°C.

Table 11. Stop Mode Current and Power Consumption (continued)

Mode Test Conditions Supply Typical1Units

Electrical Characteristics

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NXP Semiconductors 31

4.1.7 USB PHY Current Consumption

4.1.7.1 Power Down Mode

In power down mode, everything is powered down, including the USB_VBUS valid detectors in typical

condition. Table 12 shows the USB interface current consumption in power down mode.

NOTE

The currents on the VDD_HIGH_CAP and VDD_USB_CAP were

identified to be the voltage divider circuits in the USB-specific level shifters.

4.1.8 PCIe 2.0 Power Consumption

Table 13 provides PCIe PHY currents under certain Tx operating modes.

Table 12. USB PHY Current Consumption in Power Down Mode

VDD_USB_CAP (3.0 V) VDD_HIGH_CAP (2.5 V) NVCC_PLL_OUT (1.1 V)

Current 5.1 μA 1.7 μA <0.5 μA

Table 13. PCIe PHY Current Drain

Mode Test Conditions Supply Max Current Unit

P0: Normal Operation 5G Operations PCIE_VP (1.1 V) 40 mA

PCIE_VPTX (1.1 V) 20

PCIE_VPH (2.5 V) 21

2.5G Operations PCIE_VP (1.1 V) 27

PCIE_VPTX (1.1 V) 20

PCIE_VPH (2.5 V) 20

P0s: Low Recovery Time

Latency, Power Saving State

5G Operations PCIE_VP (1.1 V) 30 mA

PCIE_VPTX (1.1 V) 2.4

PCIE_VPH (2.5 V) 18

2.5G Operations PCIE_VP (1.1 V) 20

PCIE_VPTX (1.1 V) 2.4

PCIE_VPH (2.5 V) 18

P1: Longer Recovery Time

Latency, Lower Power State

— PCIE_VP (1.1 V) 12 mA

PCIE_VPTX (1.1 V) 2.4

PCIE_VPH (2.5 V) 12

Power Down — PCIE_VP (1.1 V) 1.3 mA

PCIE_VPTX (1.1 V) 0.18

PCIE_VPH (2.5 V) 0.36

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32 NXP Semiconductors

Electrical Characteristics

4.1.9 HDMI Power Consumption

Table 14 provides HDMI PHY currents for both Active 3D Tx with LFSR15 data and power-down modes.

4.2 Power Supplies Requirements and Restrictions

The system design must comply with power-up sequence, power-down sequence, and steady state

guidelines as described in this section to guarantee the reliable operation of the device. Any deviation

from these sequences may result in the following situations:

• Excessive current during power-up phase

• Prevention of the device from booting

• Irreversible damage to the processor (worst-case scenario)

4.2.1 Power-Up Sequence

The restrictions that follow must be observed:

• VDD_SNVS_IN supply must be turned on before any other power supply or be connected

(shorted) with VDD_HIGH_IN supply.

• If a coin cell is used to power VDD_SNVS_IN, then ensure that it is connected before any other

supply is switched on.

• The SRC_POR_B signal controls the processor POR and must be immediately asserted at

power-up and remain asserted until the VDD_ARM_CAP, VDD_SOC_CAP, and VDD_PU_CAP

supplies are stable. VDD_ARM_IN and VDD_SOC_IN may be applied in either order with no

restrictions.

Table 14. HDMI PHY Current Drain

Mode Test Conditions Supply Max Current Unit

Active Bit rate 251.75 Mbps HDMI_VPH 14 mA

HDMI_VP 4.1 mA

Bit rate 279.27 Mbps HDMI_VPH 14 mA

HDMI_VP 4.2 mA

Bit rate 742.5 Mbps HDMI_VPH 17 mA

HDMI_VP 7.5 mA

Bit rate 1.485 Gbps HDMI_VPH 17 mA

HDMI_VP 12 mA

Bit rate 2.275 Gbps HDMI_VPH 16 mA

HDMI_VP 17 mA

Bit rate 2.97 Gbps HDMI_VPH 19 mA

HDMI_VP 22 mA

Power-down — HDMI_VPH 49 μA

HDMI_VP 1100 μA

Electrical Characteristics

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NXP Semiconductors 33

NOTE

Ensure that there is no back voltage (leakage) from any supply on the board

towards the 3.3 V supply (for example, from the external components that

use both the 1.8 V and 3.3 V supplies).

NOTE

USB_OTG_VBUS and USB_H1_VBUS are not part of the power supply

sequence and may be powered at any time.

4.2.2 Power-Down Sequence

No special restrictions for i.MX 6Solo/6DualLite IC.

4.2.3 Power Supplies Usage

All I/O pins should not be externally driven while the I/O power supply for the pin (NVCC_xxx) is OFF.

This can cause internal latch-up and malfunctions due to reverse current flows. For information about I/O

power supply of each pin, see “Power Rail” columns in pin list tables of Section 6, “Package Information

and Contact Assignments.”

NOTE

When the PCIE interface is not used, the PCIE_VP, PCIE_VPH, and

PCIE_VPTX supplies must be powered or grounded. The input and output

supplies for the remaining ports (PCIE_REXT, PCIE_RX_N, PCIE_RX_P,

PCIE_TX_N, and PCIE_TX_P) can remain unconnected. It is

recommended not to turn the PCIE_VPH supply OFF while the PCIE_VP

supply is ON, as it may lead to excessive power consumption. If boundary

scan test is used, PCIE_VP, PCIE_VPH, and PCIE_VPTX must remain

powered.

4.3 Integrated LDO Voltage Regulator Parameters

Various internal supplies can be powered ON from internal LDO voltage regulators. All the supply pins

named *_CAP must be connected to external capacitors. The onboard LDOs are intended for internal use

only and should not be used to power any external circuitry. See the i.MX 6Solo/6DualLite Reference

Manual (IMX6SDLRM) for details on the power tree scheme.

NOTE

The *_CAP signals must not be powered externally. These signals are

intended for internal LDO or LDO bypass operation only.

4.3.1 Digital Regulators (LDO_ARM, LDO_PU, LDO_SOC)

There are three digital LDO regulators (“Digital”, because of the logic loads that they drive, not because

of their construction). The advantages of the regulators are to reduce the input supply variation because of

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

34 NXP Semiconductors

Electrical Characteristics

their input supply ripple rejection and their on-die trimming. This translates into more stable voltage for

the on-chip logics.

These regulators have three basic modes:

• Bypass. The regulation FET is switched fully on passing the external voltage, to the load unaltered.

The analog part of the regulator is powered down in this state, removing any loss other than the IR

drop through the power grid and FET.

• Power Gate. The regulation FET is switched fully off limiting the current draw from the supply.

The analog part of the regulator is powered down here limiting the power consumption.

• Analog regulation mode. The regulation FET is controlled such that the output voltage of the

regulator equals the programmed target voltage. The target voltage is fully programmable in 25 mV

steps.

For additional information, see the i.MX 6Solo/6DualLite reference manual.

4.3.2 Regulators for Analog Modules

4.3.2.1 LDO_1P1

The LDO_1P1 regulator implements a programmable linear-regulator function from VDD_HIGH_IN (see

for minimum and maximum input requirements). Typical Programming Operating Range is 1.0 V to 1.2

V with the nominal default setting as 1.1 V. The LDO_1P1 supplies the USB Phy, LVDS Phy, HDMI Phy,

MIPI Phy, and PLLs. A programmable brown-out detector is included in the regulator that can be used by

the system to determine when the load capability of the regulator is being exceeded to take the necessary

steps. Current-limiting can be enabled to allow for in-rush current requirements during start-up, if needed.

Active-pull-down can also be enabled for systems requiring this feature.

For information on external capacitor requirements for this regulator, see the Hardware Development

Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors

(IMX6DQ6SDLHDG).

For additional information, see the i.MX 6Solo/6DualLite reference manual (IMX6SDLRM).

4.3.2.2 LDO_2P5

The LDO_2P5 module implements a programmable linear-regulator function from VDD_HIGH_IN (see

for minimum and maximum input requirements). Typical Programming Operating Range is 2.25 V to

2.75 V with the nominal default setting as 2.5 V. LDO_2P5 supplies the USB Phy, LVDS Phy, HDMI Phy,

MIPI Phy, E-fuse module, and PLLs. A programmable brown-out detector is included in the regulator that

can be used by the system to determine when the load capability of the regulator is being exceeded, to take

the necessary steps. Current-limiting can be enabled to allow for in-rush current requirements during

start-up, if needed. Active-pull-down can also be enabled for systems requiring this feature. An alternate

self-biased low-precision weak-regulator is included that can be enabled for applications needing to keep

the output voltage alive during low-power modes where the main regulator driver and its associated global

bandgap reference module are disabled. The output of the weak-regulator is not programmable and is a

Electrical Characteristics

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function of the input supply as well as the load current. Typically, with a 3 V input supply the

weak-regulator output is 2.525 V and its output impedance is approximately 40 Ω.

For information on external capacitor requirements for this regulator, see the Hardware Development

Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors

(IMX6DQ6SDLHDG).

For additional information, see the i.MX 6Solo/6DualLite reference manual.

4.3.2.3 LDO_USB

The LDO_USB module implements a programmable linear-regulator function from the

USB_OTG_VBUS and USB_H1_VBUS voltages (4.4 V–5.25 V) to produce a nominal 3.0 V output

voltage. A programmable brown-out detector is included in the regulator that can be used by the system to

determine when the load capability of the regulator is being exceeded, to take the necessary steps. This

regulator has a built in power-mux that allows the user to select to run the regulator from either

USB_VBUS supply, when both are present. If only one of the USB_VBUS voltages is present, then, the

regulator automatically selects this supply. Current limit is also included to help the system meet in-rush

current targets.

For information on external capacitor requirements for this regulator, see the Hardware Development

Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors

(IMX6DQ6SDLHDG).

For additional information, see the i.MX 6Solo/6DualLite reference manual.

4.4 PLL’s Electrical Characteristics

4.4.1 Audio/Video PLL’s Electrical Parameters

4.4.2 528 MHz PLL

Table 15. Audio/Video PLL’s Electrical Parameters

Parameter Value

Clock output range 650 MHz ~1.3 GHz

Reference clock 24 MHz

Lock time <11250 reference cycles

Table 16. 528 MHz PLL’s Electrical Parameters

Parameter Value

Clock output range 528 MHz PLL output

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4.4.3 Ethernet PLL

4.4.4 480 MHz PLL

4.4.5 Arm PLL

4.5 On-Chip Oscillators

4.5.1 OSC24M

This block implements an amplifier that when combined with a suitable quartz crystal and external load

capacitors implements an oscillator. The oscillator is powered from NVCC_PLL_OUT.

Reference clock 24 MHz

Lock time <11250 reference cycles

Table 17. Ethernet PLL’s Electrical Parameters

Parameter Value

Clock output range 500 MHz

Reference clock 24 MHz

Lock time <11250 reference cycles

Table 18. 480 MHz PLL’s Electrical Parameters

Parameter Value

Clock output range 480 MHz PLL output

Reference clock 24 MHz

Lock time <383 reference cycles

Table 19. Arm PLL’s Electrical Parameters

Parameter Value

Clock output range 650 MHz ~ 1.3 GHz

Reference clock 24 MHz

Lock time <2250 reference cycles

Table 16. 528 MHz PLL’s Electrical Parameters (continued)

Parameter Value

Electrical Characteristics

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NXP Semiconductors 37

The system crystal oscillator consists of a Pierce-type structure running off the digital supply. A straight

forward biased-inverter implementation is used.

4.5.2 OSC32K

This block implements an amplifier that when combined with a suitable quartz crystal and external load

capacitors implements a low power oscillator. It also implements a power mux such that it can be powered

from either a ~3 V backup battery (VDD_SNVS_IN) or VDD_HIGH_IN such as the oscillator consumes

power from VDD_HIGH_IN when that supply is available and transitions to the back up battery when

VDD_HIGH_IN is lost.

In addition, if the clock monitor determines that the OSC32K is not present, then the source of the 32 kHz

clock will automatically switch to the internal ring oscillator.

CAUTION

The internal RTC oscillator does not provide an accurate frequency and is

affected by process, voltage, and temperature variations. NXP strongly

recommends using an external crystal as the RTC_XTALI reference. If the

internal oscillator is used instead, careful consideration must be given to the

timing implications on all of the SoC modules dependent on this clock.

The OSC32k runs from VDD_SNVS_CAP supply, which comes from VDD_HIGH_IN/VDD_SNVS_IN.

Table 20. OSC32K Main Characteristics

Characteristic Min Typ Max Comments

Fosc — 32.768 KHz — This frequency is nominal and determined mainly by the crystal selected.

32.0 K will work as well.

Current consumption — 4 μA—The 4 μA is the consumption of the oscillator alone (OSC32k). Total supply

consumption will depend on what the digital portion of the RTC consumes.

The ring oscillator consumes 1 μA when ring oscillator is inactive, 20 μA

when the ring oscillator is running. Another 1.5 μA is drawn from vdd_rtc

in the power_detect block. So, the total current is 6.5 μA on vdd_rtc when

the ring oscillator is not running.

Bias resistor — 14 MΩ — This the integrated bias resistor that sets the amplifier into a high gain

state. Any leakage through the ESD network, external board leakage, or

even a scope probe that is significant relative to this value will debias the

amp. The debiasing will result in low gain, and will impact the circuit's ability

to start up and maintain oscillations.

Crystal Properties

Cload — 10 pF — Usually crystals can be purchased tuned for different Cloads. This Cload

value is typically 1/2 of the capacitances realized on the PCB on either side

of the quartz. A higher Cload will decrease oscillation margin, but

increases current oscillating through the crystal.

ESR — 50 kΩ 100 kΩEquivalent series resistance of the crystal. Choosing a crystal with a higher

value will decrease the oscillating margin.

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Electrical Characteristics

4.6 I/O DC Parameters

This section includes the DC parameters of the following I/O types:

• General Purpose I/O (GPIO)

• Double Data Rate I/O (DDR) for LPDDR2 and DDR3 modes

•LVDS I/O

NOTE

The term ‘OVDD’ in this section refers to the associated supply rail of an

input or output.

Figure 4. Circuit for Parameters Voh and Vol for I/O Cells

4.6.1 XTALI and RTC_XTALI (Clock Inputs) DC Parameters

Table 21 shows the DC parameters for the clock inputs.

NOTE

The Vil and Vih specifications only apply when an external clock source is

used. If a crystal is used, Vil and Vih do not apply.

Table 21. XTALI and RTC_XTALI DC Parameters

Parameter Symbol Test Conditions Min Typ Max Unit

XTALI high-level DC input voltage Vih — 0.8 x NVCC_PLL — NVCC_PLL V

XTALI low-level DC input voltage Vil — 0 — 0.2V V

RTC_XTALI high-level DC input voltage Vih — 0.8 — 1.11

1This voltage specification must not be exceeded and, as such, is an absolute maximum specification.

RTC_XTALI low-level DC input voltage Vil — 0 — 0.2 V

Input capacitance CIN Simulated data — 5 — pF

XTALI input leakage current at startup IXTALI_STARTUP Power-on startup for

0.15msec with a driven

24 MHz clock at 1.1 V.2

2This current draw is present even if an external clock source directly drives XTALI. The 24 MHz oscillator cell is powered from

NVCC_PLL_OUT.

——600μA

DC input current IXTALI_DC ———2.5μA

Predriver

pdat

ovdd

pad

nmos (Rpd)

ovss

Voh min

Vol max

pmos (Rpu)

Electrical Characteristics

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4.6.2 General Purpose I/O (GPIO) DC Parameters

Table 22 shows DC parameters for GPIO pads. The parameters in Table 22 are guaranteed per the

operating ranges in Table 8, unless otherwise noted.

4.6.3 DDR I/O DC Parameters

The DDR I/O pads support LPDDR2 and DDR3/DDR3L operational modes.

4.6.3.1 LPDDR2 Mode I/O DC Parameters

For details on supported DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller

(MMDC).

Table 22. GPIO DC Parameters

Parameter Symbol Test Conditions Min Max Units

High-level output voltage1

1Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,

and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/ undershoot must be

controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other methods.

Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

VOH Ioh= -0.1mA (DSE=001,010)

Ioh= -1mA

(DSE=011,100,101,110,111)

OVDD - 0.15 — V

Low-level output voltage1VOL Iol= 0.1mA (DSE=001,010)

Iol= 1mA

(DSE=011,100,101,110,111)

—0.15V

High-Level input voltage1,2

2To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC

level through to the target DC level, Vil or Vih. Monotonic input transition time is from 0.1 ns to 1 s.

VIH — 0.7 ×OVDD OVDD V

Low-Level input voltage1,2 VIL — 0 0.3 ×OVDD V

Input Hysteresis (OVDD= 1.8V) VHYS_LowVDD OVDD=1.8V 250 — mV

Input Hysteresis (OVDD=3.3V VHYS_HighVDD OVDD=3.3V 250 — mV

Schmitt trigger VT+2,3

3Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.

VTH+ — 0.5 ×OVDD — mV

Schmitt trigger VT-2,3 VTH- — — 0.5 ×OVDD mV

Pull-up resistor (22_kΩ PU) RPU_22K Vin=0V — 212 uA

Pull-up resistor (22_kΩ PU) RPU_22K Vin=OVDD — 1 uA

Pull-up resistor (47_kΩ PU) RPU_47K Vin=0V — 100 uA

Pull-up resistor (47_kΩ PU) RPU_47K Vin=OVDD — 1 uA

Pull-up resistor (100_kΩ PU) RPU_100K Vin=0V — 48 uA

Pull-up resistor (100_kΩ PU) RPU_100K Vin=OVDD — 1 uA

Pull-down resistor (100_kΩ PD) RPD_100K Vin=OVDD — 48 uA

Pull-down resistor (100_kΩ PD) RPD_100K Vin=0V — 1 uA

Input current (no PU/PD) IIN VI = 0, VI = OVDD -1 1 uA

Keeper Circuit Resistance R_Keeper VI = 0.3 ×OVDD, VI = 0.7 ×OVDD 105 175 kΩ

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Electrical Characteristics

4.6.3.2 DDR3/DDR3L Mode I/O DC Parameters

The parameters in Table 24 are guaranteed per the operating ranges in Table 8, unless otherwise noted. For

details on supported DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller

(MMDC).

Table 23. LPDDR2 I/O DC Electrical Parameters1

1Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.

Parameters Symbol Test Conditions Min Max Unit

High-level output voltage VOH Ioh= -0.1mA 0.9 ×OVDD — V

Low-level output voltage VOL Iol= 0.1mA — 0.1 ×OVDD V

Input Reference Voltage Vref — 0.49 ×OVDD 0.51 ×OVDD V

DC High-Level input voltage Vih_DC — Vref+0.13 OVDD V

DC Low-Level input voltage Vil_DC — OVSS Vref-0.13 V

Differential Input Logic High Vih_diff — 0.26 Note2

2The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

Differential Input Logic Low Vil_diff — Note3

3The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

-0.26

Pull-up/Pull-down Impedance Mismatch Mmpupd — -15 15 %

240 Ω unit calibration resolution Rres — — 10 Ω

Keeper Circuit Resistance Rkeep — 110 175 kΩ

Input current (no pull-up/down) Iin VI = 0, VI = OVDD -2.5 2.5 μA

Table 24. DDR3/DDR3L I/O DC Electrical Characteristics1

Parameters Symbol Test Conditions Min Max Unit

High-level output voltage VOH Ioh= -0.1mA

Voh (for DSE=001)

0.8 ×OVDD2—V

Low-level output voltage VOL Iol= 0.1mA

Vol (for DSE=001)

—0.2×OVDD V

High-level output voltage VOH Ioh= -1mA

Voh (for all except DSE=001)

0.8 ×OVDD — V

Low-level output voltage VOL Iol= 1mA

Vol (for all except DSE=001)

—0.2×OVDD V

Input Reference Voltage Vref — 0.49 ×OVDD 0.51 ×OVDD V

DC High-Level input voltage Vih_DC — Vref3+0.1 OVDD V

DC Low-Level input voltage Vil_DC — OVSS Vref-0.1 V

Differential Input Logic High Vih_diff — 0.2 See Note4V

Differential Input Logic Low Vil_diff — See Note3-0.2 V

Electrical Characteristics

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4.6.4 RGMII I/O 2.5V I/O DC Electrical Parameters

The RGMII interface complies with the RGMII standard version 1.3. The parameters in Table 25 are

guaranteed per the operating ranges in Table 8, unless otherwise noted.

Termination Voltage Vtt Vtt tracking OVDD/2 0.49 ×OVDD 0.51 ×OVDD V

Pull-up/Pull-down Impedance Mismatch Mmpupd — -10 10 %

240 Ω unit calibration resolution Rres — — 10 Ω

Keeper Circuit Resistance Rkeep — 105 165 kΩ

Input current (no pull-up/down) Iin VI = 0,VI = OVDD -2.9 2.9 μA

1Note that the JEDEC DDR3 specification (JESD79_3D) supersedes any specification in this document.

2OVDD – I/O power supply (1.425 V–1.575 V for DDR3 and 1.283 V–1.45 V for DDR3L)

3Vref – DDR3/DDR3L external reference voltage.

4The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

Table 25. RGMII I/O 1.8V and 2.5V mode DC Electrical Characteristics1

Parameters Symbol Test Conditions Min Max Unit

High-level Output Voltage1VOH Ioh= -0.1mA (DSE=001,010)

Ioh= -1mA (DSE=011,100,101,110,111)

OVDD-0.15 — V

Low-level Output Voltage1VOL Iol= 0.1mA (DSE=001,010)

Iol= 1mA (DSE=011,100,101,110,111)

—0.15V

Input Reference Voltage Vref —0.49×OVDD 0.51 ×OVDD V

High-Level Input Voltage2 3VIH —0.7×OVDD OVDD V

Low-Level Input Voltage2 3VIL —00.3×OVDD V

Input Hysteresis

(OVDD=1.8V)

VHYS_HighVDD OVDD=1.8V 250 — mV

Input Hysteresis

(OVDD=2.5V)

VHYS_HighVDD OVDD=2.5V 250 — mV

Schmitt Trigger VT+3 4VTH+—0.5×OVDD — mV

Schmitt Trigger VT-3 4VTH-——0.5×OVDD mV

Pull-up Resistor (22 kΩ PU) RPU_22K Vin=0V — 212 μA

Pull-up Resistor (22 kΩ PU) RPU_22K Vin=OVDD -— 1 μA

Pull-up Resistor (47 kΩ PU) RPU_47K Vin=0V — 100 μA

Pull-up Resistor (47 kΩ PU) RPU_47K Vin=OVDD — 1 μA

Pull-up Resistor (100 kΩ PU) RPU_100K Vin=0V — 48 μA

Pull-up Resistor (100 kΩ PU) RPU_100K Vin=OVDD — 1 μA

Table 24. DDR3/DDR3L I/O DC Electrical Characteristics1 (continued)

Parameters Symbol Test Conditions Min Max Unit

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Electrical Characteristics

4.6.5 LVDS I/O DC Parameters

The LVDS interface complies with TIA/EIA 644-A standard. See TIA/EIA STANDARD 644-A,

“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.

Table 26 shows the Low Voltage Differential Signaling (LVDS) I/O DC parameters.

4.7 I/O AC Parameters

This section includes the AC parameters of the following I/O types:

• General Purpose I/O (GPIO)

• Double Data Rate I/O (DDR) for LPDDR2 and DDR3/DDR3L modes

•LVDS I/O

The GPIO and DDR I/O load circuit and output transition time waveforms are shown in Figure 5 and

Figure 6.

Pull-down Resistor (100 kΩ

PD)

RPD_100K Vin=OVDD — 48 μA

Pull-down Resistor (100 kΩ

PD)

RPD_100K Vin=0V — 1 μA

Keeper Circuit Resistance Rkeep 105 165 kΩ

Input Current (no

pull-up/down)

Iin VI = 0, VI = OVDD -2.9 2.9 μA

1Input Mode Selection "SW_PAD_CTL_GRP_DDR_TYPE_RGMII"='10' (1.8V Mode)

"SW_PAD_CTL_GRP_DDR_TYPE_RGMII"='11' (2.5V Mode).

2Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6

V, and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/ undershoot must

be controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other

methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

3To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC

level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s.

4Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled (register

IOMUXC_SW_PAD_CTL_PAD_RGMII_TXC[HYS]= 0).

Table 26. LVDS I/O DC Characteristics

Parameter Symbol Test Conditions Min Typ Max Unit

Output Differential Voltage VOD Rload-100 Ω Diff 250 350 450 mV

Output High Voltage VOH IOH = 0 mA 1.25 1.375 1.6 V

Output Low Voltage VOL IOL = 0 mA 0.9 1.025 1.25 V

Offset Voltage VOS — 1.125 1.2 1.375 V

Table 25. RGMII I/O 1.8V and 2.5V mode DC Electrical Characteristics1 (continued)

Parameters Symbol Test Conditions Min Max Unit

Electrical Characteristics

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Figure 5. Load Circuit for Output

Figure 6. Output Transition Time Waveform

4.7.1 General Purpose I/O AC Parameters

The I/O AC parameters for GPIO in slow and fast modes are presented in the Table 27 and Table 28,

respectively. Note that the fast or slow I/O behavior is determined by the appropriate control bits in the

IOMUXC control registers.

Table 27. General Purpose I/O AC Parameters 1.8 V Mode

Parameter Symbol Test Condition Min Typ Max Unit

Output Pad Transition Times, rise/fall

(Max Drive, DSE=111)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 2.72/2.79

1.51/1.54

Output Pad Transition Times, rise/fall

(High Drive, DSE=101)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 3.20/3.36

1.96/2.07

Output Pad Transition Times, rise/fall

(Medium Drive, DSE=100)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 3.64/3.88

2.27/2.53

Output Pad Transition Times, rise/fall

(Low Drive. DSE=011)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 4.32/4.50

3.16/3.17

Input Transition Times1

1Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

trm — — — 25 ns

Test Point

From Output

Under Test

CL includes package, probe and fixture capacitance

OVDD

20%

80% 80%

20%

tr tf

Output (at pad)

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4.7.2 DDR I/O AC Parameters

Table 29 shows the AC parameters for DDR I/O operating in LPDDR2 mode. For details on supported

DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller (MMDC).

Table 28. General Purpose I/O AC Parameters 3.3 V Mode

Parameter Symbol Test Condition Min Typ Max Unit

Output Pad Transition Times, rise/fall

(Max Drive, DSE=101)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 1.70/1.79

1.06/1.15

Output Pad Transition Times, rise/fall

(High Drive, DSE=011)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 2.35/2.43

1.74/1.77

Output Pad Transition Times, rise/fall

(Medium Drive, DSE=010)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 3.13/3.29

2.46/2.60

Output Pad Transition Times, rise/fall

(Low Drive. DSE=001)

tr, tf 15 pF Cload, slow slew rate

15 pF Cload, fast slew rate —— 5.14/5.57

4.77/5.15

Input Transition Times1

1Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

trm — — — 25 ns

Table 29. DDR I/O LPDDR2 Mode AC Parameters1

1Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.

Parameter Symbol Test Condition Min Max Unit

AC input logic high Vih(ac) — Vref + 0.22 OVDD V

AC input logic low Vil(ac) — 0 Vref - 0.22 V

AC differential input high voltage2

2Vid(ac) specifies the input differential voltage | Vtr - Vcp | required for switching, where Vtr is the “true” input signal and Vcp

is the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).

Vidh(ac) — 0.44 — V

AC differential input low voltage Vidl(ac) — — 0.44 V

Input AC differential cross point voltage3Vix(ac) Relative to Vref -0.12 0.12 V

Over/undershoot peak Vpeak — — 0.35 V

Over/undershoot area (above OVDD

or below OVSS)

Varea 400 MHz — 0.3 V-ns

Single output slew rate, measured between

Vol(ac) and Voh(ac)

tsr 50 Ω to Vref.

5 pF load.

Drive impedance = 40 Ω

± 30%

1.5 3.5

V/ns

50 Ω to Vref.

5pF load.Drive

impedance = 60 Ω ±

30%

12.5

Skew between pad rise/fall asymmetry + skew

caused by SSN

tSKD clk = 400 MHz —0.1 ns

Electrical Characteristics

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Table 30 shows the AC parameters for DDR I/O operating in DDR3/DDR3L mode.

4.7.3 LVDS I/O AC Parameters

The differential output transition time waveform is shown in Figure 7.

Figure 7. Differential LVDS Driver Transition Time Waveform

Table 31 shows the AC parameters for LVDS I/O.

3The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

Table 30. DDR I/O DDR3/DDR3L Mode AC Parameters1

1Note that the JEDEC JESD79_3C specification supersedes any specification in this document.

Parameter Symbol Test Condition Min Typ Max Unit

AC input logic high Vih(ac) — Vref + 0.175 — OVDD V

AC input logic low Vil(ac) — 0 — Vref - 0.175 V

AC differential input voltage2

2Vid(ac) specifies the input differential voltage | Vtr-Vcp | required for switching, where Vtr is the “true” input signal and Vcp is

the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).

Vid(ac) — 0.35 — — V

Input AC differential cross point voltage3, 4

3The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

4Extended range for Vix is only allowed for the clock and when the single-ended clock input signals CK and CK# are:

• monotonic with a single-ended swing VSEL/VSEH of at least VDD/2 ±250 mV, and

• the differential slew rate of CK - CK# is larger than 3 V/ns

Vix(ac) Relative to Vref Vref - 0.15 — Vref + 0.15 V

Over/undershoot peak Vpeak — — — 0.4 V

Over/undershoot area (above OVDD

or below OVSS)

Varea 400 MHz — — 0.5 V-ns

Single output slew rate, measured between

Vol(ac) and Voh(ac)

tsr Driver impedance = 34 Ω2.5 — 5 V/ns

Skew between pad rise/fall asymmetry + skew

caused by SSN

tSKD clk = 400 MHz ——

0.1 ns

padp

padn

VDIFF

0V (Differential)

VDIFF = {padp} - {padn}

tTLH

20%

80%

20%

80%

tTHL

VOH

VOL

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Electrical Characteristics

4.8 Output Buffer Impedance Parameters

This section defines the I/O impedance parameters of the i.MX 6Solo/6DualLite processors for the

following I/O types:

• General Purpose I/O (GPIO)

• Double Data Rate I/O (DDR) for LPDDR2, and DDR3/DDR3L modes

•LVDS I/O

NOTE

GPIO and DDR I/O output driver impedance is measured with “long”

transmission line of impedance Ztl attached to I/O pad and incident wave

launched into transmission line. Rpu/Rpd and Ztl form a voltage divider that

defines specific voltage of incident wave relative to OVDD. Output driver

impedance is calculated from this voltage divider (see Figure 8).

Table 31. I/O AC Parameters of LVDS Pad

Parameter Symbol Test Condition Min Typ Max Unit

Differential pulse skew1

1tSKD = | tPHLD -t

PLHD |, is the magnitude difference in differential propagation delay time between the positive going edge and

the negative going edge of the same channel.

tSKD

Rload = 100 Ω,

Cload = 2 pF

— — 0.25

nsTransition Low to High Time2

2Measurement levels are 20-80% from output voltage.

tTLH ——0.5

Transition High to Low Time2tTHL ——0.5

Operating Frequency f — — 600 800 MHz

Offset voltage imbalance Vos — — — 150 mV

Electrical Characteristics

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NXP Semiconductors 47

Figure 8. Impedance Matching Load for Measurement

4.8.1 GPIO Output Buffer Impedance

Table 32 shows the GPIO output buffer impedance (OVDD 1.8 V).

Table 32. GPIO Output Buffer Average Impedance (OVDD 1.8 V)

Parameter Symbol Drive Strength (DSE) Typ Value Unit

Output Driver

Impedance Rdrv

001

010

011

100

101

110

111

260

130

ipp_do

Cload = 1p

Ztl Ω, L = 20 inches

predriver

PMOS (Rpu)

NMOS (Rpd)

pad

OVDD

OVSS

t,(ns)

U,(V)

OVDD

t,(ns)

VDD

Vin (do)

Vout (pad)

U,(V)

Vref

Rpu =

Vovdd–Vref1

Vref1

× Ztl

Rpd = × Ztl

Vref2

Vovdd–Vref2

Vref1 Vref2

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Electrical Characteristics

Table 33 shows the GPIO output buffer impedance (OVDD 3.3 V).

4.8.2 DDR I/O Output Buffer Impedance

For details on supported DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller

(MMDC).

Table 34 shows DDR I/O output buffer impedance of i.MX 6Solo/6DualLite processors.

Note:

1. Output driver impedance is controlled across PVTs using ZQ calibration procedure.

2. Calibration is done against 240 Ω external reference resistor.

3. Output driver impedance deviation (calibration accuracy) is ±5% (max/min impedance) across PVTs.

4.8.3 LVDS I/O Output Buffer Impedance

The LVDS interface complies with TIA/EIA 644-A standard. See, TIA/EIA STANDARD 644-A,

“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.

4.9 System Modules Timing

This section contains the timing and electrical parameters for the modules in each i.MX 6Solo/6DualLite

processor.

Table 33. GPIO Output Buffer Average Impedance (OVDD 3.3 V)

Parameter Symbol Drive Strength (DSE) Typ Value Unit

Output Driver

Impedance Rdrv

001

010

011

100

101

110

111

150

Table 34. DDR I/O Output Buffer Impedance

Parameter Symbol Test Conditions DSE

(Drive Strength)

Typical

Unit

NVCC_DRAM=1.5 V

(DDR3)

DDR_SEL=11

NVCC_DRAM=1.2 V

(LPDDR2)

DDR_SEL=10

Output Driver

Impedance Rdrv

000

001

010

011

100

101

110

111

Hi-Z

240

120

Hi-Z

240

120

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4.9.1 Reset Timings Parameters

Figure 9 shows the reset timing and Table 35 lists the timing parameters.

Figure 9. Reset Timing Diagram

4.9.2 WDOG Reset Timing Parameters

Figure 10 shows the WDOG reset timing and Table 36 lists the timing parameters.

Figure 10. WDOG1_B Timing Diagram

NOTE

XTALOSC_RTC_XTALI is approximately 32 kHz.

XTALOSC_RTC_XTALI cycle is one period or approximately 30 μs.

NOTE

WDOG1_B output signals (for each one of the Watchdog modules) do not

have dedicated pins, but are muxed out through the IOMUX. See the

IOMUXC chapter of the i.MX 6Solo/6DualLite Reference Manual

(IMX6SDLRM).

4.9.3 External Interface Module (EIM)

The following subsections provide information on the EIM. Maximum operating frequency for EIM data

transfer is 104 MHz. Two system clocks are used with the EIM:

• ACLK_EIM_SLOW_CLK_ROOT is used to clock the EIM module.

The maximum frequency for CLK_EIM_SLOW_CLK_ROOT is 132 MHz.

• ACLK_EXSC is also used when the EIM is in synchronous mode.

The maximum frequency for ACLK_EXSC is 104 MHz.

Table 35. Reset Timing Parameters

ID Parameter Min Max Unit

CC1 Duration of SRC_POR_B to be qualified as valid. 1 — XTALOSC_RTC_XTALI cycle

Table 36. WDOG1_B Timing Parameters

ID Parameter Min Max Unit

CC3 Duration of WDOG1_B Assertion 1 — XTALOSC_RTC_XTALI cycle

SRC_POR_B

CC1

(Input)

WDOG1_B

CC3

(Output)

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Electrical Characteristics

Timing parameters in this section that are given as a function of register settings.

4.9.3.1 EIM Interface Pads Allocation

EIM supports 32-bit, 16-bit and 8-bit devices operating in address/data separate or multiplexed modes.

Table 37 provides EIM interface pads allocation in different modes.

Table 37. EIM Internal Module Multiplexing1

1For more information on configuration ports mentioned in this table, see the i.MX 6Solo/6DualLite reference manual.

Setup

Non Multiplexed Address/Data Mode Multiplexed

Address/Data mode

8 Bit 16 Bit 32 Bit 16 Bit 32 Bit

MUM = 0,

DSZ = 100

MUM = 0,

DSZ = 101

MUM = 0,

DSZ = 110

MUM = 0,

DSZ = 111

MUM = 0,

DSZ = 001

MUM = 0,

DSZ = 010

MUM = 0,

DSZ = 011

MUM = 1,

DSZ = 001

MUM = 1,

DSZ = 011

EIM_ADDR

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_DATA

[09:00]

EIM_DATA

[07:00],

EIM_EB0_B

EIM_DATA

[07:00]

———EIM_DATA

[07:00]

—EIM_DATA

[07:00]

EIM_AD

[07:00]

EIM_AD

[07:00]

EIM_DATA

[15:08],

EIM_EB1_B

—EIM_DATA

[15:08]

——EIM_DATA

[15:08]

—EIM_DATA

[15:08]

EIM_AD

[15:08]

EIM_AD

[15:08]

EIM_DATA

[23:16],

EIM_EB2_B

——EIM_DATA

[23:16]

——EIM_DATA

[23:16]

EIM_DATA

[23:16]

—EIM_DATA

[07:00]

EIM_DATA

[31:24],

EIM_EB3_B

———EIM_DATA

[31:24]

— EIM_DATA

[31:24]

EIM_DATA

[31:24]

—EIM_DATA

[15:08]

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4.9.3.2 General EIM Timing-Synchronous Mode

Figure 11, Figure 12, and Table 38 specify the timings related to the EIM module. All EIM output control

signals may be asserted and deasserted by an internal clock synchronized to the EIM_BCLK rising edge

according to corresponding assertion/negation control fields.

Figure 11. EIM Outputs Timing Diagram

Figure 12. EIM Inputs Timing Diagram

WE4

EIM_ADDRxx

EIM_CSx_B

EIM_WE_B

EIM_OE_B

EIM_BCLK

EIM_EBx_B

EIM_LBA_B

Output Data

...

WE5

WE6 WE7

WE8 WE9

WE10 WE11

WE12 WE13

WE14 WE15

WE16 WE17

WE3

WE2

WE1

Input Data

EIM_WAIT_B

EIM_BCLK

WE19

WE18

WE21

WE20

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Electrical Characteristics

4.9.3.3 Examples of EIM Synchronous Accesses

Table 38. EIM Bus Timing Parameters 1

ID Parameter

BCD = 0 BCD = 1 BCD = 2 BCD = 3

Min Max Min Max Min Max Min Max

WE1 EIM_BCLK Cycle

time2

t — 2 x t — 3 x t — 4 x t —

WE2 EIM_BCLK Low

Level Width

0.4 x t — 0.8 x t — 1.2 x t — 1.6 x t —

WE3 EIM_BCLK High

Level Width

0.4 x t — 0.8 x t — 1.2 x t — 1.6 x t —

WE4 Clock rise to

address valid3

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE5 Clock rise to

address invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE6 Clock rise to

EIM_CSx_B valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE7 Clock rise to

EIM_CSx_B invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE8 Clock rise to

EIM_WE_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE9 Clock rise to

EIM_WE_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE10 Clock rise to

EIM_OE_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE11 Clock rise to

EIM_OE_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE12 Clock rise to

EIM_EBx_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE13 Clock rise to

EIM_EBx_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE14 Clock rise to

EIM_LBA_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE15 Clock rise to

EIM_LBA_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE16 Clock rise to Output

Data Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE17 Clock rise to Output

Data Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE18 Input Data setup

time to Clock rise

2 — 4—————

WE19 Input Data hold time

from Clock rise

2 — 2—————

WE20 EIM_WAIT_B setup

time to Clock rise

2 — 4—————

WE21 EIM_WAIT_B hold

time from Clock rise

2 — 2—————

Electrical Characteristics

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Figure 13 to Figure 16 provide few examples of basic EIM accesses to external memory devices with the

timing parameters mentioned previously for specific control parameters settings.

Figure 13. Synchronous Memory Read Access, WSC=1

1t is the maximum EIM logic (ACLK_EXSC) cycle time. The maximum allowed axi_clk frequency depends on the fixed/non-fixed

latency configuration, whereas the maximum allowed EIM_BCLK frequency is:

—Fixed latency for both read and write is 104 MHz.

—Variable latency for read only is 104 MHz.

—Variable latency for write only is 52 MHz.

In variable latency configuration for write, if BCD = 0 & WBCDD = 1 or BCD = 1, axi_clk must be 104 MHz.Write BCD = 1 and

104 MHz ACLK_EXSC, will result in a EIM_BCLK of 52 MHz. When the clock branch to EIM is decreased to 104 MHz, other

buses are impacted which are clocked from this source. See the CCM chapter of the i.MX 6Solo/6DualLite Reference Manual

(IMX6SDLRM) for a detailed clock tree description.

2EIM_BCLK parameters are being measured from the 50% point, that is, high is defined as 50% of signal value and low is

defined as 50% as signal value.

3For signal measurements, “High” is defined as 80% of signal value and “Low” is defined as 20% of signal value.

Last Valid Address Address v1

D(v1)

EIM_BCLK

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE4 WE5

WE6 WE7

WE10 WE11

WE13

WE12

WE14

WE15

WE18

WE19

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Electrical Characteristics

Figure 14. Synchronous Memory, Write Access, WSC=1, WBEA=0 and WADVN=0

Figure 15. Muxed Address/Data (A/D) Mode, Synchronous Write Access, WSC=6,ADVA=0, ADVN=1, and

ADH=1

NOTE

In 32-bit muxed address/data (A/D) mode the 16 MSBs are driven on the

data bus.

Last Valid Address Address V1

D(V1)

EIM_BCLK

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE4 WE5

WE6 WE7

WE8 WE9

WE12

WE13

WE14

WE15

WE16 WE17

EIM_BCLK

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Address V1 Write Data

WE4

WE16

WE6

WE7

WE9

WE8

WE10

WE11

WE14 WE15

WE17

WE5

Last Valid Address

EIM_ADDRxx/

EIM_ADxx

Electrical Characteristics

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NXP Semiconductors 55

Figure 16. 16-Bit Muxed A/D Mode, Synchronous Read Access, WSC=7, RADVN=1, ADH=1, OEA=0

4.9.3.4 General EIM Timing-Asynchronous Mode

Figure 17 through Figure 21, and Table 39 help you determine timing parameters relative to the chip

select (CS) state for asynchronous and DTACK EIM accesses with corresponding EIM bit fields and the

timing parameters mentioned above.

Asynchronous read & write access length in cycles may vary from what is shown in Figure 17 through

Figure 20 as RWSC, OEN and CSN is configured differently. See the i.MX 6Solo/6DualLite Reference

Manual (IMX6SDLRM) for the EIM programming model.

Figure 17. Asynchronous Memory Read Access (RWSC = 5)

Last

EIM_BCLK

EIM_ADDRxx/

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Address V1 Data

Valid Address

EIM_ADxx

WE5

WE6

WE7

WE14 WE15

WE10

WE11

WE12 WE13

WE18

WE19

WE4

Last Valid Address Address V1

D(V1)

EIM_ADDRxx/

EIM_DATAxx[7:0]

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE39

WE35

WE37

WE32

WE36

WE38

WE43

WE40

WE31

WE44

INT_CLK

start of

access

end of

access

MAXDI

MAXCSO

MAXCO

EIM_ADxx

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Electrical Characteristics

Figure 18. Asynchronous A/D Muxed Read Access (RWSC = 5)

Figure 19. Asynchronous Memory Write Access

Addr. V1 D(V1)

EIM_ADDRxx/

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE39

WE35A

WE37

WE36

WE38

WE40A

WE31

WE44

INT_CLK

start of

access

end of

access

MAXDI

MAXCSO

MAXCO

WE32A

EIM_ADxx

Last Valid Address Address V1

D(V1)

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE31

WE39

WE33

WE45

WE32

WE40

WE34

WE46

WE42

WE41

Electrical Characteristics

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Figure 20. Asynchronous A/D Muxed Write Access

Figure 21. DTACK Mode Read Access (DAP=0)

EIM_WE_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE33

WE45

WE34

WE46

Addr. V1 D(V1)

EIM_ADDRxx/

WE31

WE42

WE41A

WE32A

EIM_DATAxx

EIM_LBA_B

WE39

WE40A

Last Valid Address Address V1

D(V1)

EIM_ADDRxx

EIM_DATAxx[7:0]

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE39

WE35

WE37

WE32

WE36

WE38

WE43

WE40

WE31

WE44

EIM_DTACK_B

WE47

WE48

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Figure 22. DTACK Mode Write Access (DAP=0)

Table 39. EIM Asynchronous Timing Parameters Table Relative Chip to Select

Ref No. Parameter

Determination by

Synchronous measured

parameters1

Min Max Unit

WE31 EIM_CSx_B valid to

Address Valid

WE4 - WE6 - CSA2— 3 - CSA ns

WE32 Address Invalid to

EIM_CSx_B invalid

WE7 - WE5 - CSN3 —3 - CSNns

WE32A

(muxed A/D

EIM_CSx_B valid to

Address Invalid

t4 + WE4 - WE7 + (ADVN5 +

ADVA6 + 1 - CSA)

-3 + (ADVN +

ADVA + 1 - CSA)

—ns

WE33 EIM_CSx_B Valid to

EIM_WE_B Valid

WE8 - WE6 + (WEA - WCSA) — 3 + (WEA - WCSA) ns

WE34 EIM_WE_B Invalid to

EIM_CSx_B Invalid

WE7 - WE9 + (WEN - WCSN) — 3 - (WEN_WCSN) ns

WE35 EIM_CSx_B Valid to

EIM_OE_B Valid

WE10 - WE6 + (OEA - RCSA) — 3 + (OEA - RCSA) ns

WE35A

(muxed A/D)

EIM_CSx_B Valid to

EIM_OE_B Valid

WE10 - WE6 + (OEA + RADVN

+ RADVA + ADH + 1 - RCSA)

-3 + (OEA +

RADVN+RADVA+

ADH+1-RCSA)

3 + (OEA +

RADVN+RADVA+ADH

+1-RCSA)

WE36 EIM_OE_B Invalid to

EIM_CSx_B Invalid

WE7 - WE11 + (OEN - RCSN) — 3 - (OEN - RCSN) ns

WE37 EIM_CSx_B Valid to

EIM_EBx_B Valid

(Read access)

WE12 - WE6 + (RBEA - RCSA) — 3 + (RBEA - RCSA) ns

Last Valid Address Address V1

D(V1)

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE31

WE39

WE33

WE45

WE32

WE40

WE34

WE46

WE42

WE41

EIM_DTACK_B

WE48

WE47

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WE38 EIM_EBx_B Invalid to

EIM_CSx_B Invalid (Read

access)

WE7 - WE13 + (RBEN - RCSN) — 3 - (RBEN- RCSN) ns

WE39 EIM_CSx_B Valid to

EIM_LBA_B Valid

WE14 - WE6 + (ADVA - CSA) — 3 + (ADVA - CSA) ns

WE40 EIM_LBA_B Invalid to

EIM_CSx_B Invalid (ADVL is

asserted)

WE7 - WE15 - CSN — 3 - CSN ns

WE40A

(muxed A/D)

EIM_CSx_B Valid to

EIM_LBA_B Invalid

WE14 - WE6 + (ADVN + ADVA +

1 - CSA)

-3 + (ADVN +

ADVA + 1 - CSA)

3 + (ADVN + ADVA + 1

- CSA)

WE41 EIM_CSx_B Valid to Output

Data Valid

WE16 - WE6 - WCSA — 3 - WCSA ns

WE41A

(muxed A/D)

EIM_CSx_B Valid to Output

Data Valid

WE16 - WE6 + (WADVN +

WADVA + ADH + 1 - WCSA)

— 3 + (WADVN + WADVA

+ ADH + 1 - WCSA)

WE42 Output Data Invalid to

EIM_CSx_B Invalid

WE17 - WE7 - CSN — 3 - CSN ns

MAXCO Output maximum delay from

internal driving

EIM_ADDRxx/control FFs to

chip outputs

10 — — ns

MAXCSO Output maximum delay from

CSx internal driving FFs to CSx

out

10 — — ns

MAXDI EIM_DATAxx maximum delay

from chip input data to its

internal FF

5——ns

WE43 Input Data Valid to EIM_CSx_B

Invalid

MAXCO - MAXCSO + MAXDI MAXCO -

MAXCSO +

MAXDI

—ns

WE44 EIM_CSx_B Invalid to Input

Data invalid

00—ns

WE45 EIM_CSx_B Valid to

EIM_EBx_B Valid (Write

access)

WE12 - WE6 + (WBEA - WCSA) — 3 + (WBEA - WCSA) ns

WE46 EIM_EBx_B Invalid to

EIM_CSx_B Invalid (Write

access)

WE7 - WE13 + (WBEN - WCSN) — -3 + (WBEN - WCSN) ns

MAXDTI MAXIMUM delay from

EIM_DTACK_B to its internal FF

+ 2 cycles for synchronization

10 — — —

Table 39. EIM Asynchronous Timing Parameters Table Relative Chip to Select (continued)

Ref No. Parameter

Determination by

Synchronous measured

parameters1

Min Max Unit

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Electrical Characteristics

4.9.4 Multi-Mode DDR Controller (MMDC)

The Multi-Mode DDR Controller is a dedicated interface to DDR3/DDR3L/LPDDR2 SDRAM.

4.9.4.1 MMDC Compatibility with JEDEC-compliant SDRAMs

The i.MX 6Solo/6DualLite MMDC supports the following memory types:

• LPDDR2 SDRAM compliant to JESD209-2B LPDDR2 JEDEC standard release June, 2009

• DDR3/DDR3L SDRAM compliant to JESD79-3D DDR3 JEDEC standard release April, 2008

MMDC operation with the standards stated above is contingent upon the board DDR design adherence to

the DDR design and layout requirements stated in the Hardware Development Guide for i.MX 6Quad,

6Dual, 6DualLite, 6Solo Families of Applications Processors (IMX6DQ6SDLHDG).

4.9.4.2 MMDC Supported DDR3/DDR3L/LPDDR2 Configurations

Table 40 and Table 41 show the supported DDR3/DDR3L/LPDDR2 configurations.

WE47 EIM_DTACK_B Active to

EIM_CSx_B Invalid

MAXCO - MAXCSO + MAXDTI MAXCO -

MAXCSO +

MAXDTI

—ns

WE48 EIM_CSx_B Invalid to

EIM_DTACK_B Invalid

00—ns

1For more information on configuration parameters mentioned in this table, see the i.MX 6Solo/6DualLite reference manual.

2In this table, CSA means WCSA when write operation or RCSA when read operation.

3In this table, CSN means WCSN when write operation or RCSN when read operation.

4t is ACLK_EIM_SLOW_CLK_ROOT cycle time.

5In this table, ADVN means WADVN when write operation or RADVN when read operation.

6In this table, ADVA means WADVA when write operation or RADVA when read operation.

Table 40. i.MX 6Solo Supported DDR3/DDR3L/LPDDR2 Configurations

Parameter LPDDR2 DDR3 DDR3L

Clock frequency 400 MHz 400 MHz 400 MHz

Bus width 16/32-bit 16/32-bit 16/32-bit

Channel Single Single Single

Chip selects 2 2 2

Table 39. EIM Asynchronous Timing Parameters Table Relative Chip to Select (continued)

Ref No. Parameter

Determination by

Synchronous measured

parameters1

Min Max Unit

Electrical Characteristics

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NXP Semiconductors 61

4.10 General-Purpose Media Interface (GPMI) Timing

The i.MX 6Solo/6DualLite GPMI controller is a flexible interface NAND Flash controller with 8-bit data

width, up to 200 MB/s I/O speed and individual chip select.

It supports Asynchronous timing mode, Source Synchronous timing mode and Samsung Toggle timing

mode separately described in the following subsections.

4.10.1 Asynchronous Mode AC Timing (ONFI 1.0 Compatible)

Asynchronous mode AC timings are provided as multiplications of the clock cycle and fixed delay. The

maximum I/O speed of GPMI in asynchronous mode is about 50 MB/s. Figure 23 through Figure 26

depicts the relative timing between GPMI signals at the module level for different operations under

asynchronous mode. Table 42 describes the timing parameters (NF1–NF17) that are shown in the figures.

Figure 23. Command Latch Cycle Timing Diagram

Table 41. i.MX 6DualLite Supported DDR3/DDR3L/LPDDR2 Configurations

Parameter LPDDR2

(Dual channel)

LPDDR2

(Single channel) DDR3 DDR3L

Clock frequency 400 MHz 400 MHz 400 MHz 400 MHz

Bus width 32-bit per channel 16/32-bit 16/32/64-bit 16/32/64-bit

Channel Dual Single Single Single

Chip selects 2 per channel 2 2 2

Command

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Electrical Characteristics

Figure 24. Address Latch Cycle Timing Diagram

Figure 25. Write Data Latch Cycle Timing Diagram

Figure 26. Read Data Latch Cycle Timing Diagram (Non-EDO Mode)

Figure 27. Read Data Latch Cycle Timing Diagram (EDO Mode)

Address

NF10

NF11

NF9NF8

NF7

NF6

NF5

NF1

NF3

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NF10

NF11

NF7

NF6

NF5

NF1

NF3

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NF8

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NF14

NF15

NF17

NF16

NF12

NF13

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NF14

NF15

NF17

NF16

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Electrical Characteristics

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 63

In EDO mode (Figure 26), NF16/NF17 are different from the definition in non-EDO mode (Figure 25).

They are called tREA/tRHOH (RE# access time/RE# HIGH to output hold). The typical value for them

are 16 ns (max for tREA)/15 ns (min for tRHOH) at 50 MB/s EDO mode. In EDO mode, GPMI will

sample NAND_DATAxx at rising edge of delayed NAND_RE_B provided by an internal DPLL. The delay

value can be controlled by GPMI_CTRL1.RDN_DELAY (see the GPMI chapter of the i.MX

6Solo/6DualLite reference manual). The typical value of this control register is 0x8 at 50 MT/s EDO mode.

But if the board delay is big enough and cannot be ignored, the delay value should be made larger to

compensate the board delay.

Table 42. Asynchronous Mode Timing Parameters1

1GPMI’s Async Mode output timing can be controlled by the module’s internal registers

HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.

This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min Max

NF1 NAND_CLE setup time tCLS (AS + DS) ×T - 0.12 [see 2,3]

2 AS minimum value can be 0, while DS/DH minimum value is 1.

3T = GPMI clock period -0.075ns (half of maximum p-p jitter).

NF2 NAND_CLE hold time tCLH DH ×T - 0.72 [see 2]ns

NF3 NAND_CE0_B setup time tCS (AS + DS + 1) ×T [see 3,2]ns

NF4 NAND_CE0_B hold time tCH (DH+1) ×T - 1 [see 2]ns

NF5 NAND_WE_B pulse width tWP DS ×T [see 2]ns

NF6 NAND_ALE setup time tALS (AS + DS) ×T - 0.49 [see 3,2]ns

NF7 NAND_ALE hold time tALH (DH ×T - 0.42 [see 2]ns

NF8 Data setup time tDS DS ×T - 0.26 [see 2]ns

NF9 Data hold time tDH DH ×T - 1.37 [see 2]ns

NF10 Write cycle time tWC (DS + DH) ×T [see 2]ns

NF11 NAND_WE_B hold time tWH DH ×T [see 2]ns

NF12 Ready to NAND_RE_B low tRR4

4NF12 is guaranteed by the design.

(AS + 2) ×T [see 3,2]—ns

NF13 NAND_RE_B pulse width tRP DS ×T [see 2]ns

NF14 READ cycle time tRC (DS + DH) ×T [see 2]ns

NF15 NAND_RE_B high hold time tREH DH ×T [see 2]ns

NF16 Data setup on read tDSR — (DS ×T -0.67)/18.38 [see 5,6]

5Non-EDO mode.

6EDO mode, GPMI clock ≈ 100 MHz

(AS=DS=DH=1, GPMI_CTL1 [RDN_DELAY] = 8, GPMI_CTL1 [HALF_PERIOD] = 0).

NF17 Data hold on read tDHR 0.82/11.83 [see 5,6]—ns

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Electrical Characteristics

4.10.2 Source Synchronous Mode AC Timing (ONFI 2.x Compatible)

Figure 28 to Figure 30 show the write and read timing of Source Synchronous Mode.

Figure 28. Source Synchronous Mode Command and Address Timing Diagram

NF18

NF25 NF26

NF20

NF21

NF20

NF23

NF24

NF19

NF22

NF21

CMD ADD

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NAND_ALE

NAND_WE/RE_B

NAND_CLK

NAND_DQS

Output enable

NAND_DATA[7:0]

Output enable

Electrical Characteristics

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NXP Semiconductors 65

Figure 29. Source Synchronous Mode Data Write Timing Diagram

Figure 30. Source Synchronous Mode Data Read Timing Diagram

NF23

NF18

NF25

NF26

NF27

NF25

NF26

NF28 NF28

NF29 NF29

NF23 NF24

NF24

NF19

NF27

NF22

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NF23

NF18

NF25

NF26

NF25

NF26

NF23 NF24

NF24

NF19

NF22

NF25

NF26

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Electrical Characteristics

Figure 31. NAND_DQS/NAND_DQ Read Valid Window

For DDR Source sync mode, Figure 31 shows the timing diagram of NAND_DQS/NAND_DATAxx read

valid window. The typical value of tDQSQ is 0.85ns (max) and 1ns (max) for tQHS at 200MB/s. GPMI

will sample NAND_DATA[7:0] at both rising and falling edge of an delayed NAND_DQS signal, which

can be provided by an internal DPLL. The delay value can be controlled by GPMI register

GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI chapter of the i.MX

6Solo/6DualLite reference manual). Generally, the typical delay value of this register is equal to 0x7 which

means 1/4 clock cycle delay expected. But if the board delay is big enough and cannot be ignored, the delay

value should be made larger to compensate the board delay.

Table 43. Source Synchronous Mode Timing Parameters1

1GPMI’s source synchronous mode output timing can be controlled by the module’s internal registers

GPMI_TIMING2_CE_DELAY, GPMI_TIMING_PREAMBLE_DELAY, GPMI_TIMING2_POST_DELAY. This AC timing depends

on these registers settings. In the table, CE_DELAY/PRE_DELAY/POST_DELAY represents each of these settings.

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min Max

NF18 NAND_CE0_B access time tCE CE_DELAY ×T - 0.79 [see 2]

2T = tCK(GPMI clock period) -0.075ns (half of maximum p-p jitter).

NF19 NAND_CE0_B hold time tCH 0.5 ×tCK - 0.63 [see 2]ns

NF20 Command/address NAND_DATAxx setup time tCAS 0.5 ×tCK - 0.05 ns

NF21 Command/address NAND_DATAxx hold time tCAH 0.5 ×tCK - 1.23 ns

NF22 clock period tCK — ns

NF23 preamble delay tPRE PRE_DELAY ×T - 0.29 [see 2]ns

NF24 postamble delay tPOST POST_DELAY ×T - 0.78 [see 2]ns

NF25 NAND_CLE and NAND_ALE setup time tCALS 0.5 ×tCK - 0.86 ns

NF26 NAND_CLE and NAND_ALE hold time tCALH 0.5 ×tCK - 0.37 ns

NF27 NAND_CLK to first NAND_DQS latching transition tDQSS T - 0.41 [see 2]ns

NF28 Data write setup — 0.25 ×tCK - 0.35

NF29 Data write hold — 0.25 ×tCK - 0.85

NF30 NAND_DQS/NAND_DQ read setup skew — — 2.06

NF31 NAND_DQS/NAND_DQ read hold skew — — 1.95

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Electrical Characteristics

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NXP Semiconductors 67

4.10.3 Samsung Toggle Mode AC Timing

4.10.3.1 Command and Address Timing

NOTE

Samsung Toggle Mode command and address timing is the same as ONFI

1.0 compatible Async mode AC timing. See Section 4.10.1, “Asynchronous

Mode AC Timing (ONFI 1.0 Compatible),” for details.

4.10.3.2 Read and Write Timing

Figure 32. Samsung Toggle Mode Data Write Timing

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68 NXP Semiconductors

Electrical Characteristics

Figure 33. Samsung Toggle Mode Data Read Timing

Table 44. Samsung Toggle Mode Timing Parameters1

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min Max

NF1 NAND_CLE setup time tCLS (AS + DS) ×T - 0.12 [see 2,3]

NF2 NAND_CLE hold time tCLH DH ×T - 0.72 [see 2]

NF3 NAND_CE0_B setup time tCS (AS + DS) ×T - 0.58 [see 3,2]

NF4 NAND_CE0_B hold time tCH DH ×T - 1 [see 2]

NF5 NAND_WE_B pulse width tWP DS ×T [see 2]

NF6 NAND_ALE setup time tALS (AS + DS) ×T - 0.49 [see 3,2]

NF7 NAND_ALE hold time tALH DH ×T - 0.42 [see 2]

NF8 Command/address NAND_DATAxx setup time tCAS DS ×T - 0.26 [see 2]

NF9 Command/address NAND_DATAxx hold time tCAH DH ×T - 1.37 [see 2]

NF18 NAND_CEx_B access time tCE CE_DELAY ×T [see 4,2]—ns

NF22 clock period tCK — — ns

NF23 preamble delay tPRE PRE_DELAY ×T [see 5,2]—ns

NF24 postamble delay tPOST POST_DELAY ×T +0.43 [see 2]— ns

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Electrical Characteristics

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NXP Semiconductors 69

For DDR Toggle mode, Figure 31 shows the timing diagram of NAND_DQS/NAND_DATAxx read valid

window. The typical value of tDQSQ is 1.4 ns (max) and 1.4 ns (max) for tQHS at 133 MB/s. GPMI will

sample NAND_DATA[7:0] at both rising and falling edge of an delayed NAND_DQS signal, which is

provided by an internal DPLL. The delay value of this register can be controlled by GPMI register

GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI chapter of the i.MX

6Solo/6DualLite reference manual). Generally, the typical delay value is equal to 0x7 which means 1/4

clock cycle delay expected. But if the board delay is big enough and cannot be ignored, the delay value

should be made larger to compensate the board delay.

4.11 External Peripheral Interface Parameters

The following subsections provide information on external peripheral interfaces.

4.11.1 AUDMUX Timing Parameters

The AUDMUX provides a programmable interconnect logic for voice, audio, and data routing between

internal serial interfaces (SSIs) and external serial interfaces (audio and voice codecs). The AC timing of

AUDMUX external pins is governed by the SSI module. For more information, see the respective SSI

electrical specifications found within this document.

4.11.2 ECSPI Timing Parameters

This section describes the timing parameters of the ECSPI blocks. The ECSPI have separate timing

parameters for master and slave modes.

NF28 Data write setup tDS60.25 ×tCK - 0.32 — ns

NF29 Data write hold tDH60.25 ×tCK - 0.79 — ns

NF30 NAND_DQS/NAND_DQ read setup skew tDQSQ7—3.18

NF31 NAND_DQS/NAND_DQ read hold skew tQHS7—3.27

1The GPMI toggle mode output timing can be controlled by the module’s internal registers

HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.

This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.

2 AS minimum value can be 0, while DS/DH minimum value is 1.

3T = tCK (GPMI clock period) -0.075ns (half of maximum p-p jitter).

4CE_DELAY represents HW_GPMI_TIMING2[CE_DELAY]. NF18 is guaranteed by the design. Read/Write operation is started

with enough time of ALE/CLE assertion to low level.

5PRE_DELAY+1) ≥ (AS+DS).

6Shown in Figure 32, Samsung Toggle Mode Data Write Timing diagram.

7Shown in Figure 31, NAND_DQS/NAND_DQ Read Valid Window.

Table 44. Samsung Toggle Mode Timing Parameters1 (continued)

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min Max

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Electrical Characteristics

4.11.2.1 ECSPI Master Mode Timing

Figure 34 depicts the timing of ECSPI in master mode. Table 45 lists the ECSPI master mode timing

characteristics.

Figure 34. ECSPI Master Mode Timing Diagram

Table 45. ECSPI Master Mode Timing Parameters

ID Parameter Symbol Min Max Unit

CS1 ECSPIx_SCLK Cycle Time–Read

ECSPIx_SCLK Cycle Time–Write

tclk 43

—ns

CS2 ECSPIx_SCLK High or Low Time–Read

ECSPIx_SCLK High or Low Time–Write

tSW 21.5

—ns

CS3 ECSPIx_SCLK Rise or Fall1

1See specific I/O AC parameters Section 4.7, “I/O AC Parameters.”

tRISE/FALL ——ns

CS4 ECSPIx_SS_B pulse width tCSLH Half ECSPIx_SCLK period — ns

CS5 ECSPIx_SS_B Lead Time (CS setup time) tSCS Half ECSPIx_SCLK period - 4 — ns

CS6 ECSPIx_SS_B Lag Time (CS hold time) tHCS Half ECSPIx_SCLK period - 2 — ns

CS7 ECSPIx_MOSI Propagation Delay (CLOAD =20pF) t

PDmosi -1 1 ns

CS8 ECSPIx_MISO Setup Time

•

tSmiso 18 — ns

CS9 ECSPIx_MISO Hold Time tHmiso 0—ns

CS10 RDY to ECSPIx_SS_B Time2

2SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.

tSDRY 5—ns

CS7

CS2

CS4

CS6 CS5

CS8 CS9

ECSPIx_SCLK

ECSPIx_SS_B

ECSPIx_MOSI

ECSPIx_MISO

ECSPIx_RDY_B

CS10

CS3

CS1

Note: ECSPIx_MOSI is always driven (not tri-stated) between actual data transmissions. This limits the ECSPI to be

connected between a single master and a single slave.

Electrical Characteristics

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NXP Semiconductors 71

4.11.2.2 ECSPI Slave Mode Timing

Figure 35 depicts the timing of ECSPI in slave mode. Table 46 lists the ECSPI slave mode timing

characteristics.

Figure 35. ECSPI Slave Mode Timing Diagram

Table 46. ECSPI Slave Mode Timing Parameters

ID Parameter Symbol Min Max Unit

CS1 ECSPIx_SCLK Cycle Time–Read

ECSPIx_SCLK Cycle Time–Write

tclk 43

—ns

CS2 ECSPIx_SCLK High or Low Time–Read

ECSPIx_SCLK High or Low Time–Write

tSW 21.5

—ns

CS4 ECSPIx_SS_B pulse width tCSLH Half ECSPIx_SCLK period — ns

CS5 ECSPIx_SS_B Lead Time (CS setup time) tSCS 5—ns

CS6 ECSPIx_SS_B Lag Time (CS hold time) tHCS 5—ns

CS7 ECSPIx_MOSI Setup Time tSmosi 4—ns

CS8 ECSPIx_MOSI Hold Time tHmosi 4—ns

CS9 ECSPIx_MISO Propagation Delay (CLOAD =20pF)

•

tPDmiso 419ns

CS1

CS7 CS8

CS2

CS4

CS6 CS5

CS9

ECSPIx_SCLK

ECSPIx_SS_B

ECSPIx_MISO

ECSPIx_MOSI

Note: ECSPIx_MISO is always driven (not tri-stated) between actual data transmissions. This limits the ECSPI to be con-

nected between a single master and a single slave.

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Electrical Characteristics

4.11.3 Enhanced Serial Audio Interface (ESAI) Timing Parameters

The ESAI consists of independent transmitter and receiver sections, each section with its own clock

generator. Table 47 shows the interface timing values. The number field in the table refers to timing

signals found in Figure 36 and Figure 37.

Table 47. Enhanced Serial Audio Interface (ESAI) Timing Parameters

No. Characteristics1,2 Symbol Expression2Min Max Condition3Unit

62 Clock cycle4tSSICC 4 × Tc

4 × Tc

30.0

—

i ck

63 Clock high period:

• For internal clock

• For external clock

—

2 × Tc − 9.0

2 × Tc

—

64 Clock low period:

• For internal clock

• For external clock

—

2 × Tc − 9.0

2 × Tc

—

65 ESAI_RX_CLK rising edge to ESAI_RX_FS out (bl) high —

—

17.0

7.0

x ck

i ck a

66 ESAI_RX_CLK rising edge to ESAI_RX_FS out (bl) low —

—

17.0

7.0

x ck

i ck a

67 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wr)

high5

—

19.0

9.0

x ck

i ck a

68 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wr) low5—

—

19.0

9.0

x ck

i ck a

69 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wl) high —

—

16.0

6.0

x ck

i ck a

70 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wl) low —

—

17.0

7.0

x ck

i ck a

71 Data in setup time before ESAI_RX_CLK (SCK in

synchronous mode) falling edge

—

12.0

19.0

—

x ck

i ck

72 Data in hold time after ESAI_RX_CLK falling edge —

—

3.5

9.0

—

x ck

i ck

73 ESAI_RX_FS input (bl, wr) high before ESAI_RX_CLK

falling edge5

—

2.0

12.0

—

x ck

i ck a

74 ESAI_RX_FS input (wl) high before ESAI_RX_CLK

falling edge

—

2.0

12.0

—

x ck

i ck a

75 ESAI_RX_FS input hold time after ESAI_RX_CLK falling

edge

—

2.5

8.5

—

x ck

i ck a

78 ESAI_TX_CLK rising edge to ESAI_TX_FS out (bl) high —

—

18.0

8.0

x ck

i ck

79 ESAI_TX_CLK rising edge to ESAI_TX_FS out (bl) low —

—

20.0

10.0

x ck

i ck

80 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wr)

high5

—

20.0

10.0

x ck

i ck

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NXP Semiconductors 73

81 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wr) low5 —

—

22.0

12.0

x ck

i ck

82 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wl) high —

—

19.0

9.0

x ck

i ck

83 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wl) low —

—

20.0

10.0

x ck

i ck

84 ESAI_TX_CLK rising edge to data out enable from high

impedance

—

22.0

17.0

x ck

i ck

86 ESAI_TX_CLK rising edge to data out valid —

—

18.0

13.0

x ck

i ck

87 ESAI_TX_CLK rising edge to data out high impedance 67 —

—

21.0

16.0

x ck

i ck

89 ESAI_TX_FS input (bl, wr) setup time before

ESAI_TX_CLK falling edge5

—

2.0

18.0

—

x ck

i ck

90 ESAI_TX_FS input (wl) setup time before ESAI_TX_CLK

falling edge

—

2.0

18.0

—

x ck

i ck

91 ESAI_TX_FS input hold time after ESAI_TX_CLK falling

edge

—

4.0

5.0

—

x ck

i ck

95 ESAI_RX_HF_CLK/ESAI_TX_HF_CLK clock cycle — 2 x TC15 — — ns

96 ESAI_TX_HF_CLK input rising edge to ESAI_TX_CLK

output

———18.0—ns

97 ESAI_RX_HF_CLK input rising edge to ESAI_RX_CLK

output

———18.0—ns

1i ck = internal clock

x ck = external clock

i ck a = internal clock, asynchronous mode

(asynchronous implies that ESAI_TX_CLK and ESAI_RX_CLK are two different clocks)

i ck s = internal clock, synchronous mode

(synchronous implies that ESAI_TX_CLK and ESAI_RX_CLK are the same clock)

2bl = bit length

wl = word length

wr = word length relative

3ESAI_TX_CLK(SCKT pin) = transmit clock

ESAI_RX_CLK(SCKR pin) = receive clock

ESAI_TX_FS(FST pin) = transmit frame sync

ESAI_RX_FS(FSR pin) = receive frame sync

ESAI_TX_HF_CLK(HCKT pin) = transmit high frequency clock

ESAI_RX_HF_CLK(HCKR pin) = receive high frequency clock

4For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.

5The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync

signal waveform, but it spreads from one serial clock before the first bit clock (like the bit length frame sync signal), until the

second-to-last bit clock of the first word in the frame.

6Periodically sampled and not 100% tested.

Table 47. Enhanced Serial Audio Interface (ESAI) Timing Parameters (continued)

No. Characteristics1,2 Symbol Expression2Min Max Condition3Unit

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Electrical Characteristics

Figure 36. ESAI Transmitter Timing

ESAI_TX_CLK

(Input/Output)

ESAI_TX_FS

(Bit)

Out

ESAI_TX_FS

(Word)

Out

Data Out

ESAI_TX_FS

(Bit) In

ESAI_TX_FS

(Word) In

78 79

82 83

8686

90 91

Last BitFirst Bit

Electrical Characteristics

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Figure 37. ESAI Receiver Timing

ESAI_RX_CLK

(Input/Output)

ESAI_RX_FS

(Bit)

Out

ESAI_RX_FS

(Word)

Out

Data In

ESAI_RX_FS

(Bit)

ESAI_RX_FS

(Word)

69 70

74 75

First Bit Last Bit

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Electrical Characteristics

4.11.4 Ultra High Speed SD/SDIO/MMC Host Interface (uSDHC) AC

Timing

This section describes the electrical information of the uSDHC, which includes SD/eMMC4.3 (Single

Data Rate) timing, eMMC4.4/4.41 (Dual Date Rate) timing and SDR104/50(SD3.0) timing.

4.11.4.1 SD/eMMC4.3 (Single Data Rate) AC Timing

Figure 38 depicts the timing of SD/eMMC4.3, and Table 48 lists the SD/eMMC4.3 timing characteristics.

Figure 38. SD/eMMC4.3 Timing

Table 48. SD/eMMC4.3 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency (Low Speed) fPP10 400 kHz

Clock Frequency (SD/SDIO Full Speed/High Speed) fPP20 25/50 MHz

Clock Frequency (MMC Full Speed/High Speed) fPP30 20/52 MHz

Clock Frequency (Identification Mode) fOD 100 400 kHz

SD2 Clock Low Time tWL 7—ns

SD3 Clock High Time tWH 7—ns

SD4 Clock Rise Time tTLH —3ns

SD5 Clock Fall Time tTHL —3ns

uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD6 uSDHC Output Delay tOD -6.6 3.6 ns

SD1

SD3

SD5

SD4

SD7

SDx_CLK

SD2

SD8

SD6

Output from uSDHC to card

Input from card to uSDHC

SDx_DATA[7:0]

Electrical Characteristics

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4.11.4.2 eMMC4.4/4.41 (Dual Data Rate) AC Timing

Figure 39 depicts the timing of eMMC4.4/4.41. Table 49 lists the eMMC4.4/4.41 timing characteristics.

Be aware that only DATA is sampled on both edges of the clock (not applicable to CMD).

Figure 39. eMMC4.4/4.41 Timing

uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD7 uSDHC Input Setup Time tISU 2.5 — ns

SD8 uSDHC Input Hold Time4tIH 1.5 — ns

1In low speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.

2In normal (full) speed mode for SD/SDIO card, clock frequency can be any value between 0–25 MHz. In high-speed mode,

clock frequency can be any value between 0–50 MHz.

3In normal (full) speed mode for MMC card, clock frequency can be any value between 0–20 MHz. In high-speed mode, clock

frequency can be any value between 0–52 MHz.

4To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.

Table 49. eMMC4.4/4.41 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock1

11 Clock duty cycle will be in the range of 47% to 53%.

SD1 Clock Frequency (eMMC4.4/4.41 DDR) fPP 052MHz

SD1 Clock Frequency (SD3.0 DDR) fPP 050MHz

uSDHC Output / Card Inputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD2 uSDHC Output Delay tOD 2.8 6.8 ns

uSDHC Input / Card Outputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD3 uSDHC Input Setup Time tISU 1.7 — ns

SD4 uSDHC Input Hold Time tIH 1.5 — ns

Table 48. SD/eMMC4.3 Interface Timing Specification (continued)

ID Parameter Symbols Min Max Unit

SD1

SD2

SD3

Output from eSDHCv3 to card

Input from card to eSDHCv3

SDx_DATA[7:0]

SDx_CLK

SD4

SD2

......

SDx_DATA[7:0]

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Electrical Characteristics

4.11.4.3 SDR50/SDR104 AC Timing

Figure 40 depicts the timing of SDR50/SDR104, and Table 50 lists the SDR50/SDR104 timing

characteristics.

Figure 40. SDR50/SDR104 Timing

4.11.4.4 Bus Operation Condition for 3.3 V and 1.8 V Signaling

Signaling level of SD/eMMC4.3 and eMMC4.4/4.41 modes is 3.3 V. Signaling level of SDR104/SDR50

mode is 1.8 V. The DC parameters for the NVCC_SD1, NVCC_SD2 and NVCC_SD3 supplies are

identical to those shown in Table 22, "GPIO DC Parameters," on page 39.

Table 50. SDR50/SDR104 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency Period tCLK 4.8 — ns

SD2 Clock Low Time tCL 0.46 ×tCLK 0.54 ×tCLK ns

SD3 Clock High Time tCH 0.46 ×tCLK 0.54 ×tCLK ns

uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx in SDR50 (Reference to CLK)

SD4 uSDHC Output Delay tOD –3 1 ns

uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx in SDR104 (Reference to CLK)

SD5 uSDHC Output Delay tOD –1.6 0.74 ns

uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx in SDR50 (Reference to CLK)

SD6 uSDHC Input Setup Time tISU 2.5 — ns

SD7 uSDHC Input Hold Time tIH 1.5 — ns

uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx in SDR104 (Reference to CLK)1

1Data window in SDR100 mode is variable.

SD8 Card Output Data Window tODW 0.5 ×tCLK —ns

Electrical Characteristics

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4.11.5 Ethernet Controller (ENET) AC Electrical Specifications

The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive

at timing specs/constraints for the physical interface.

4.11.5.1 ENET MII Mode Timing

This subsection describes MII receive, transmit, asynchronous inputs, and serial management signal

timings.

4.11.5.1.1 MII Receive Signal Timing (ENET_RX_DATA3,2,1,0, ENET_RX_EN,

ENET_RX_ER, and ENET_RX_CLK)

The receiver functions correctly up to an ENET_RX_CLK maximum frequency of 25 MHz + 1%. There

is no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the

ENET_RX_CLK frequency.

Figure 41 shows MII receive signal timings. Table 51 describes the timing parameters (M1–M4) shown in

the figure.

Figure 41. MII Receive Signal Timing Diagram

1 ENET_RX_EN, ENET_RX_CLK, and ENET0_RXD0 have the same timing in 10 Mbps 7-wire interface mode.

Table 51. MII Receive Signal Timing

ID Characteristic1Min Max Unit

M1 ENET_RX_DATA3,2,1,0, ENET_RX_EN, ENET_RX_ER to

ENET_RX_CLK setup

5— ns

M2 ENET_RX_CLK to ENET_RX_DATA3,2,1,0, ENET_RX_EN,

ENET_RX_ER hold

5— ns

M3 ENET_RX_CLK pulse width high 35% 65% ENET_RX_CLK period

M4 ENET_RX_CLK pulse width low 35% 65% ENET_RX_CLK period

ENET_RX_CLK (input)

ENET_RX_DATA3,2,1,0

M1 M2

ENET_RX_ER

ENET_RX_EN

(inputs)

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Electrical Characteristics

4.11.5.1.2 MII Transmit Signal Timing (ENET_TX_DATA3,2,1,0, ENET_TX_EN,

ENET_TX_ER, and ENET_TX_CLK)

The transmitter functions correctly up to an ENET_TX_CLK maximum frequency of 25 MHz + 1%.

There is no minimum frequency requirement. Additionally, the processor clock frequency must exceed

twice the ENET_TX_CLK frequency.

Figure 42 shows MII transmit signal timings. Table 52 describes the timing parameters (M5–M8) shown

in the figure.

Figure 42. MII Transmit Signal Timing Diagram

1 ENET_TX_EN, ENET_TX_CLK, and ENET0_TXD0 have the same timing in 10-Mbps 7-wire interface mode.

4.11.5.1.3 MII Asynchronous Inputs Signal Timing (ENET_CRS and ENET_COL)

Figure 43 shows MII asynchronous input timings. Table 53 describes the timing parameter (M9) shown in

the figure.

Figure 43. MII Async Inputs Timing Diagram

Table 52. MII Transmit Signal Timing

ID Characteristic1Min Max Unit

M5 ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN,

ENET_TX_ER invalid

5— ns

M6 ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN,

ENET_TX_ER valid

—20 ns

M7 ENET_TX_CLK pulse width high 35% 65% ENET_TX_CLK period

M8 ENET_TX_CLK pulse width low 35% 65% ENET_TX_CLK period

ENET_TX_CLK (input)

ENET_TX_DATA3,2,1,0

ENET_TX_ER

ENET_TX_EN

(outputs)

ENET_CRS, ENET_COL

Electrical Characteristics

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NXP Semiconductors 81

1 ENET_COL has the same timing in 10-Mbit 7-wire interface mode.

4.11.5.1.4 MII Serial Management Channel Timing (ENET_MDIO and ENET_MDC)

The MDC frequency is designed to be equal to or less than 2.5 MHz to be compatible with the IEEE 802.3

MII specification. However the ENET can function correctly with a maximum MDC frequency of

15 MHz.

Figure 44 shows MII asynchronous input timings. Table 54 describes the timing parameters (M10–M15)

shown in the figure.

Figure 44. MII Serial Management Channel Timing Diagram

Table 53. MII Asynchronous Inputs Signal Timing

ID Characteristic Min Max Unit

M91ENET_CRS to ENET_COL minimum pulse width 1.5 — ENET_TX_CLK period

Table 54. MII Serial Management Channel Timing

ID Characteristic Min Max Unit

M10 ENET_MDC falling edge to ENET_MDIO output invalid (min.

propagation delay)

0— ns

M11 ENET_MDC falling edge to ENET_MDIO output valid (max.

propagation delay)

—5 ns

M12 ENET_MDIO (input) to ENET_MDC rising edge setup 18 — ns

M13 ENET_MDIO (input) to ENET_MDC rising edge hold 0 — ns

M14 ENET_MDC pulse width high 40% 60% ENET_MDC period

M15 ENET_MDC pulse width low 40% 60% ENET_MDC period

ENET_MDC (output)

ENET_MDIO (output)

M14

M15

M10

M11

M12 M13

ENET_MDIO (input)

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Electrical Characteristics

4.11.5.2 RMII Mode Timing

In RMII mode, ENET_CLK is used as the REF_CLK, which is a 50 MHz ± 50 ppm continuous reference

clock. ENET_RX_EN is used as the ENET_RX_EN in RMII. Other signals under RMII mode include

ENET_TX_EN, ENET_TX_DATA[1:0], ENET_RX_DATA[1:0] and ENET_RX_ER.

Figure 45 shows RMII mode timings. Table 55 describes the timing parameters (M16–M21) shown in the

figure.

Figure 45. RMII Mode Signal Timing Diagram

4.11.5.3 Signal Switching Specifications

The following timing specifications meet the requirements for RGMII interfaces for a range of transceiver

devices.

Table 55. RMII Signal Timing

ID Characteristic Min Max Unit

M16 ENET_CLK pulse width high 35% 65% ENET_CLK period

M17 ENET_CLK pulse width low 35% 65% ENET_CLK period

M18 ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA invalid 4 — ns

M19 ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA valid — 15 ns

M20 ENET_RX_DATAD[1:0], ENET_RX_EN(ENET_RX_EN), ENET_RX_ER to

ENET_CLK setup

4— ns

M21 ENET_CLK to ENET_RX_DATAD[1:0], ENET_RX_EN, ENET_RX_ER hold 2 — ns

ENET_CLK (input)

ENET_TX_EN

M16

M17

M18

M19

M20 M21

ENET_RX_DATA[1:0]

ENET_TX_DATA (output)

ENET_RX_ER

ENET_RX_EN (input)

Electrical Characteristics

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Figure 46. RGMII Transmit Signal Timing Diagram Original

Figure 47. RGMII Receive Signal Timing Diagram Original

Table 56. RGMII Signal Switching Specifications1

1The timings assume the following configuration:

DDR_SEL = (11)b

DSE (drive-strength) = (111)b

Symbol Description Min Max Unit

Tcyc2

2For 10 Mbps and 100 Mbps, Tcyc will scale to 400 ns ±40 ns and 40 ns ±4 ns respectively.

Clock cycle duration 7.2 8.8 ns

TskewT3

3For all versions of RGMII prior to 2.0; This implies that PC board design will require clocks to be routed such that an additional

trace delay of greater than 1.5 ns and less than 2.0 ns will be added to the associated clock signal. For 10/100, the Max value

is unspecified.

Data to clock output skew at transmitter -500 500 ps

TskewR3Data to clock input skew at receiver 1 2.6 ns

Duty_G4

4Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domain as long

as minimum duty cycle is not violated and stretching occurs for no more than three Tcyc of the lowest speed transitioned

between.

Duty cycle for Gigabit 45 55 %

Duty_T4Duty cycle for 10/100T 40 60 %

Tr/Tf Rise/fall time (20–80%) — 0.75 ns

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84 NXP Semiconductors

Electrical Characteristics

Figure 48. RGMII Receive Signal Timing Diagram with Internal Delay

4.11.6 Flexible Controller Area Network (FLEXCAN) AC Electrical

Specifications

The Flexible Controller Area Network (FlexCAN) module is a communication controller implementing

the CAN protocol according to the CAN 2.0B protocol specification. The processor has two CAN modules

available for systems design. Tx and Rx ports for both modules are multiplexed with other I/O pins. See

the IOMUXC chapter of the i.MX 6Solo/6DualLite Reference Manual (IMX6SDLRM) to see which pins

expose Tx and Rx pins; these ports are named FLEXCAN_TX and FLEXCAN_RX, respectively.

4.11.7 HDMI Module Timing Parameters

4.11.7.1 Latencies and Timing Information

Power-up time (time between TX_PWRON assertion and TX_READY assertion) for the HDMI 3D Tx

PHY while operating with the slowest input reference clock supported (13.5 MHz) is 3.35 ms.

Power-up time for the HDMI 3D Tx PHY while operating with the fastest input reference clock supported

(340 MHz) is 133 μs.

4.11.7.2 Electrical Characteristics

The table below provides electrical characteristics for the HDMI 3D Tx PHY. The following three figures

illustrate various definitions and measurement conditions specified in the table below.

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Electrical Characteristics

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NXP Semiconductors 85

Figure 49. Driver Measuring Conditions

Figure 50. Driver Definitions

Figure 51. Source Termination

Table 57. Electrical Characteristics

Symbol Parameter Condition Min Typ Max Unit

Operating conditions for HDMI

avddtmds Termination supply voltage — 3.15 3.3 3.45 V

RTTermination resistance — 45 50 55 Ω

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Electrical Characteristics

4.11.8 Switching Characteristics

Table 58 describes switching characteristics for the HDMI 3D Tx PHY. Figure 52 to Figure 56 illustrate

various parameters specified in table.

NOTE

All dynamic parameters related to the TMDS line drivers’ performance

imply the use of assembly guidelines.

TMDS drivers DC specifications

VOFF Single-ended standby voltage RT = 50 Ω

For measurement conditions

and definitions, see the first

two figures above.

Compliance point TP1 as

defined in the HDMI

specification, version 1.3a,

section 4.2.4.

avddtmds ± 10 mV mV

VSWING Single-ended output swing

voltage

400 — 600 mV

VHSingle-ended output high

voltage

For definition, see the second

figure above

If attached sink supports

TMDSCLK < or = 165 MHz

avddtmds ± 10 mV mV

If attached sink supports

TMDSCLK > 165 MHz

avddtmds

- 200 mV

— avddtmds

+ 10 mV

VLSingle-ended output low

voltage

For definition, see the second

figure above

If attached sink supports

TMDSCLK < or = 165 MHz

avddtmds

- 600 mV

— avddtmds

- 400mV

If attached sink supports

TMDSCLK > 165 MHz

avddtmds

- 700 mV

— avddtmds

- 400 mV

RTERM Differential source termination

load (inside HDMI 3D Tx PHY)

Although the HDMI 3D Tx

PHY includes differential

source termination, the

user-defined value is set for

each single line (for

illustration, see Figure 51).

Note: RTERM can also be

configured to be open and not

present on TMDS channels.

—50—200Ω

Hot plug detect specifications

HPDVH Hot plug detect high range — 2.0 — 5.3 V

VHPDVL Hot plug detect low range — 0 — 0.8 V

HPDZHot plug detect input

impedance

—10——kΩ

HPDtHot plug detect time delay — — — 100 µs

Table 57. Electrical Characteristics (continued)

Symbol Parameter Condition Min Typ Max Unit

Electrical Characteristics

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NXP Semiconductors 87

Figure 52. TMDS Clock Signal Definitions

Figure 53. Eye Diagram Mask Definition for HDMI Driver Signal Specification at TP1

Figure 54. Intra-Pair Skew Definition

Figure 55. Inter-Pair Skew Definition

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Electrical Characteristics

Figure 56. TMDS Output Signals Rise and Fall Time Definition

Table 58. Switching Characteristics

Symbol Parameter Conditions Min Typ Max Unit

TMDS Drivers Specifications

— Maximum serial data rate — — — 3.4 Gbps

FTMDSCLK TMDSCLK frequency On TMDSCLKP/N outputs 25 — 340 MHz

PTMDSCLK TMDSCLK period RL = 50 Ω

See Figure 52.

2.94 — 40 ns

tCDC TMDSCLK duty cycle tCDC = tCPH / PTMDSCLK

RL = 50 Ω

See Figure 52.

40 50 60 %

tCPH TMDSCLK high time RL = 50 Ω

See Figure 52.

456UI

1UI means TMDS clock unit.

tCPL TMDSCLK low time RL = 50 Ω

See Figure 52.

456UI

— TMDSCLK jitter2

2Relative to ideal recovery clock, as specified in the HDMI specification, version 1.4a, section 4.2.3.

RL = 50 Ω— — 0.25 UI1

tSK(p) Intra-pair (pulse) skew RL = 50 Ω

See Figure 54.

— — 0.15 UI1

tSK(pp) Inter-pair skew RL = 50 Ω

See Figure 55.

——1UI

tRDifferential output signal rise

time

20–80%

RL = 50 Ω

See Figure 56.

75 — 0.4 UI ps

tFDifferential output signal fall time 20–80%

RL = 50 Ω

See Figure 56.

75 — 0.4 UI ps

— Differential signal overshoot Referred to 2x VSWING ——15%

— Differential signal undershoot Referred to 2x VSWING ——25%

Electrical Characteristics

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4.11.9 I2C Module Timing Parameters

This section describes the timing parameters of the I2C module. Figure 57 depicts the timing of I2C

module, and Table 59 lists the I2C module timing characteristics.

Figure 57. I2C Bus Timing

Table 59. I2C Module Timing Parameters

ID Parameter

Standard Mode Fast Mode

Unit

Min Max Min Max

IC1 I2Cx_SCL cycle time 10 — 2.5 — µs

IC2 Hold time (repeated) START condition 4.0 — 0.6 — µs

IC3 Set-up time for STOP condition 4.0 — 0.6 — µs

IC4 Data hold time 01

1A device must internally provide a hold time of at least 300 ns for I2Cx_SDA signal to bridge the undefined region of the falling

edge of I2Cx_SCL.

3.452

2The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2Cx_SCL signal.

010.92µs

IC5 HIGH Period of I2Cx_SCL Clock 4.0 — 0.6 — µs

IC6 LOW Period of the I2Cx_SCL Clock 4.7 — 1.3 — µs

IC7 Set-up time for a repeated START condition 4.7 — 0.6 — µs

IC8 Data set-up time 250 — 1003

3A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement of Set-up time (ID No IC7)

of 250 ns must be met. This automatically is the case if the device does not stretch the LOW period of the I2Cx_SCL signal.

If such a device does stretch the LOW period of the I2Cx_SCL signal, it must output the next data bit to the I2Cx_SDA line

max_rise_time (IC9) + data_setup_time (IC7) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification)

before the I2Cx_SCL line is released.

—ns

IC9 Bus free time between a STOP and START condition 4.7 — 1.3 — µs

IC10 Rise time of both I2Cx_SDA and I2Cx_SCL signals — 1000 20 + 0.1Cb4

4Cb = total capacitance of one bus line in pF.

300 ns

IC11 Fall time of both I2Cx_SDA and I2Cx_SCL signals — 300 20 + 0.1Cb4300 ns

IC12 Capacitive load for each bus line (Cb) — 400 — 400 pF

IC10 IC11 IC9

IC2 IC8 IC4 IC7 IC3

IC6

IC10

IC5

IC11 START STOP START

START

I2Cx_SDA

I2Cx_SCL

IC1

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Electrical Characteristics

4.11.10 Image Processing Unit (IPU) Module Parameters

The purpose of the IPU is to provide comprehensive support for the flow of data from an image sensor

and/or to a display device. This support covers all aspects of these activities:

• Connectivity to relevant devices—cameras, displays, graphics accelerators, and TV encoders.

• Related image processing and manipulation: sensor image signal processing, display processing,

image conversions, and other related functions.

• Synchronization and control capabilities, such as avoidance of tearing artifacts.

4.11.10.1 IPU Sensor Interface Signal Mapping

The IPU supports a number of sensor input formats. Table 60 defines the mapping of the Sensor Interface

Pins used for various supported interface formats.

Table 60. Camera Input Signal Cross Reference, Format, and Bits Per Cycle

Signal

Name1

RGB565

8 bits

2 cycles

RGB5652

8 bits

3 cycles

RGB6663

8 bits

3 cycles

RGB888

8 bits

3 cycles

YCbCr4

8 bits

2 cycles

RGB5655

16 bits

1 cycle

YCbCr6

16 bits

1 cycle

YCbCr7

16 bits

1 cycle

YCbCr8

20 bits

1 cycle

IPUx_CSIx_

DATA00

———————0C[0]

IPUx_CSIx_

DATA01

———————0C[1]

IPUx_CSIx_

DATA02

— — — — — — — C[0] C[2]

IPUx_CSIx_

DATA03

— — — — — — — C[1] C[3]

IPUx_CSIx_

DATA04

— — — — — B[0] C[0] C[2] C[4]

IPUx_CSIx_

DATA05

— — — — — B[1] C[1] C[3] C[5]

IPUx_CSIx_

DATA06

— — — — — B[2] C[2] C[4] C[6]

IPUx_CSIx_

DATA07

— — — — — B[3] C[3] C[5] C[7]

IPUx_CSIx_

DATA08

— — — — — B[4] C[4] C[6] C[8]

IPUx_CSIx_

DATA09

— — — — — G[0] C[5] C[7] C[9]

IPUx_CSIx_

DATA10

— — — — — G[1] C[6] 0 Y[0]

IPUx_CSIx_

DATA11

— — — — — G[2] C[7] 0 Y[1]

IPUx_CSIx_

DATA12

B[0], G[3] R[2],G[4],B[2] R/G/B[4] R/G/B[0] Y/C[0] G[3] Y[0] Y[0] Y[2]

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4.11.10.2 Sensor Interface Timings

There are three camera timing modes supported by the IPU.

4.11.10.2.1 BT.656 and BT.1120 Video Mode

Smart camera sensors, which include imaging processing, usually support video mode transfer. They use

an embedded timing syntax to replace the IPUx_CSIx_VSYNC and IPUx_CSIx_HSYNC signals. The

timing syntax is defined by the BT.656/BT.1120 standards.

This operation mode follows the recommendations of ITU BT.656/ ITU BT.1120 specifications. The only

control signal used is IPUx_CSIx_PIX_CLK. Start-of-frame and active-line signals are embedded in the

data stream. An active line starts with a SAV code and ends with a EAV code. In some cases, digital

blanking is inserted in between EAV and SAV code. The CSI decodes and filters out the timing-coding

from the data stream, thus recovering IPUx_CSIx_VSYNC and IPUx_CSIx_HSYNC signals for internal

use. On BT.656 one component per cycle is received over the IPUx_CSIx_DATA_EN bus. On BT.1120

two components per cycle are received over the IPUx_CSIx_DATA_EN bus.

IPUx_CSIx_

DATA13

B[1], G[4] R[3],G[5],B[3] R/G/B[5] R/G/B[1] Y/C[1] G[4] Y[1] Y[1] Y[3]

IPUx_CSIx_

DATA14

B[2], G[5] R[4],G[0],B[4] R/G/B[0] R/G/B[2] Y/C[2] G[5] Y[2] Y[2] Y[4]

IPUx_CSIx_

DATA15

B[3], R[0] R[0],G[1],B[0] R/G/B[1] R/G/B[3] Y/C[3] R[0] Y[3] Y[3] Y[5]

IPUx_CSIx_

DATA16

B[4], R[1] R[1],G[2],B[1] R/G/B[2] R/G/B[4] Y/C[4] R[1] Y[4] Y[4] Y[6]

IPUx_CSIx_

DATA17

G[0], R[2] R[2],G[3],B[2] R/G/B[3] R/G/B[5] Y/C[5] R[2] Y[5] Y[5] Y[7]

IPUx_CSIx_

DATA18

G[1], R[3] R[3],G[4],B[3] R/G/B[4] R/G/B[6] Y/C[6] R[3] Y[6] Y[6] Y[8]

IPUx_CSIx_

DATA19

G[2], R[4] R[4],G[5],B[4] R/G/B[5] R/G/B[7] Y/C[7] R[4] Y[7] Y[7] Y[9]

1IPUx_CSIx stands for IPUx_CSI0 or IPUx_CSI1.

2The MSB bits are duplicated on LSB bits implementing color extension.

3The two MSB bits are duplicated on LSB bits implementing color extension.

4YCbCr, 8 bits—Supported within the BT.656 protocol (sync embedded within the data stream).

5RGB 16 bits—Supported in two ways: (1) As a “generic data” input, with no on-the-fly processing; (2) With on-the-fly

processing, but only under some restrictions on the control protocol.

6YCbCr 16 bits—Supported as a “generic-data” input, with no on-the-fly processing.

7YCbCr 16 bits—Supported as a sub-case of the YCbCr, 20 bits, under the same conditions (BT.1120 protocol).

8YCbCr, 20 bits—Supported only within the BT.1120 protocol (syncs embedded within the data stream).

Table 60. Camera Input Signal Cross Reference, Format, and Bits Per Cycle (continued)

Signal

Name1

RGB565

8 bits

2 cycles

RGB5652

8 bits

3 cycles

RGB6663

8 bits

3 cycles

RGB888

8 bits

3 cycles

YCbCr4

8 bits

2 cycles

RGB5655

16 bits

1 cycle

YCbCr6

16 bits

1 cycle

YCbCr7

16 bits

1 cycle

YCbCr8

20 bits

1 cycle

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Electrical Characteristics

4.11.10.2.2 Gated Clock Mode

The IPUx_CSIx_VSYNC, IPUx_CSIx_HSYNC, and IPUx_CSIx_PIX_CLK signals are used in this

mode. See Figure 58.

Figure 58. Gated Clock Mode Timing Diagram

A frame starts with a rising edge on IPUx_CSIx_VSYNC (all the timings correspond to straight polarity

of the corresponding signals). Then IPUx_CSIx_HSYNC goes to high and hold for the entire line. Pixel

clock is valid as long as IPUx_CSIx_HSYNC is high. Data is latched at the rising edge of the valid pixel

clocks. IPUx_CSIx_HSYNC goes to low at the end of line. Pixel clocks then become invalid and the CSI

stops receiving data from the stream. For the next line, the IPUx_CSIx_HSYNC timing repeats. For the

next frame, the IPUx_CSIx_VSYNC timing repeats.

4.11.10.2.3 Non-Gated Clock Mode

The timing is the same as the gated-clock mode (described in Section 4.11.10.2.2, “Gated Clock Mode,”)

except for the IPUx_CSIx_HSYNC signal, which is not used (see Figure 59). All incoming pixel clocks

are valid and cause data to be latched into the input FIFO. The IPUx_CSIx_PIX_CLK signal is inactive

(states low) until valid data is going to be transmitted over the bus.

Figure 59. Non-Gated Clock Mode Timing Diagram

The timing described in Figure 59 is that of a typical sensor. Some other sensors may have a slightly

different timing. The CSI can be programmed to support rising/falling-edge triggered

IPUx_CSIx_VSYNC; active-high/low IPUx_CSIx_HSYNC; and rising/falling-edge triggered

IPUx_CSIx_PIX_CLK.

*16Y@$4*Y@@1*9@$-,

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*16Y@$4*Y@@%"5"YY JOWBMJE

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OUIGSBNF

IPUx_CSIx_VSYNC

IPUx_CSIx_PIX_CLK

IPUx_CSIx_DATA_EN[19:0] invalid

1st byte

n+1th frame

invalid

1st byte

nth frame

Start of Frame

Electrical Characteristics

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NXP Semiconductors 93

4.11.10.3 Electrical Characteristics

Figure 60 depicts the sensor interface timing. IPUx_CSIx_PIX_CLK signal described here is not

generated by the IPU. Table 61 lists the sensor interface timing characteristics.

Figure 60. Sensor Interface Timing Diagram

4.11.10.4 IPU Display Interface Signal Mapping

The IPU supports a number of display output video formats. Table 62 defines the mapping of the Display

Interface Pins used during various supported video interface formats.

Table 61. Sensor Interface Timing Characteristics

ID Parameter Symbol Min Max Unit

IP1 Sensor output (pixel) clock frequency Fpck 0.01 180 MHz

IP2 Data and control setup time Tsu 2 — ns

IP3 Data and control holdup time Thd 1 — ns

Table 62. Video Signal Cross-Reference

i.MX 6Solo/6DualLite LCD

Comment1,2

Port Name

(x=0, 1)

RGB,

Signal

Name

(General)

RGB/TV Signal Allocation (Example)

16-bit

RGB

18-bit

RGB

24 Bit

RGB

8-bit

YCrCb3

16-bit

YCrCb

20-bit

YCrCb

IPUx_DISPx_DAT00 DAT[0] B[0] B[0] B[0] Y/C[0] C[0] C[0] —

IPUx_DISPx_DAT01 DAT[1] B[1] B[1] B[1] Y/C[1] C[1] C[1] —

IPUx_DISPx_DAT02 DAT[2] B[2] B[2] B[2] Y/C[2] C[2] C[2] —

IPUx_DISPx_DAT03 DAT[3] B[3] B[3] B[3] Y/C[3] C[3] C[3] —

IPUx_DISPx_DAT04 DAT[4] B[4] B[4] B[4] Y/C[4] C[4] C[4] —

IPUx_DISPx_DAT05 DAT[5] G[0] B[5] B[5] Y/C[5] C[5] C[5] —

IPUx_DISPx_DAT06 DAT[6] G[1] G[0] B[6] Y/C[6] C[6] C[6] —

IP3

IPUx_CSIx_DATA_EN,

IPUx_CSIx_VSYNC,

IP2 1/IP1

IPUx_CSIx_PIX_CLK

(Sensor Output)

IPUx_CSIx_HSYNC

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IPUx_DISPx_DAT07 DAT[7] G[2] G[1] B[7] Y/C[7] C[7] C[7] —

IPUx_DISPx_DAT08 DAT[8] G[3] G[2] G[0] — Y[0] C[8] —

IPUx_DISPx_DAT09 DAT[9] G[4] G[3] G[1] — Y[1] C[9] —

IPUx_DISPx_DAT10 DAT[10] G[5] G[4] G[2] — Y[2] Y[0] —

IPUx_DISPx_DAT11 DAT[11] R[0] G[5] G[3] — Y[3] Y[1] —

IPUx_DISPx_DAT12 DAT[12] R[1] R[0] G[4] — Y[4] Y[2] —

IPUx_DISPx_DAT13 DAT[13] R[2] R[1] G[5] — Y[5] Y[3] —

IPUx_DISPx_DAT14 DAT[14] R[3] R[2] G[6] — Y[6] Y[4] —

IPUx_DISPx_DAT15 DAT[15] R[4] R[3] G[7] — Y[7] Y[5] —

IPUx_DISPx_DAT16 DAT[16] — R[4] R[0] — — Y[6] —

IPUx_DISPx_DAT17 DAT[17] — R[5] R[1] — — Y[7] —

IPUx_DISPx_DAT18 DAT[18] — — R[2] — — Y[8] —

IPUx_DISPx_DAT19 DAT[19] — — R[3] — — Y[9] —

IPUx_DISPx_DAT20 DAT[20] — — R[4] — — — —

IPUx_DISPx_DAT21 DAT[21] — — R[5] — — — —

IPUx_DISPx_DAT22 DAT[22] — — R[6] — — — —

IPUx_DISPx_DAT23 DAT[23] — — R[7] — — — —

DIx_DISP_CLK PixCLK —

DIx_PIN1 — May be required for anti-tearing

DIx_PIN2 HSYNC —

DIx_PIN3 VSYNC VSYNC out

Table 62. Video Signal Cross-Reference (continued)

i.MX 6Solo/6DualLite LCD

Comment1,2

Port Name

(x=0, 1)

RGB,

Signal

Name

(General)

RGB/TV Signal Allocation (Example)

16-bit

RGB

18-bit

RGB

24 Bit

RGB

8-bit

YCrCb3

16-bit

YCrCb

20-bit

YCrCb

Electrical Characteristics

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NXP Semiconductors 95

NOTE

Table 62 provides information for both the DISP0 and DISP1 ports.

However, DISP1 port has reduced pinout depending on IOMUXC

configuration and therefore may not support all the above configurations.

See the IOMUXC chapter of the i.MX 6Solo/6DualLite Reference Manual

(IMX6SDLRM).

4.11.10.5 IPU Display Interface Timing

The IPU Display Interface supports two kinds of display accesses: synchronous and asynchronous. There

are two groups of external interface pins to provide synchronous and asynchronous controls accordantly.

DIx_PIN4 — Additional frame/row synchronous

signals with programmable timing

DIx_PIN5 —

DIx_PIN6 —

DIx_PIN7 —

DIx_PIN8 —

DIx_D0_CS — —

DIx_D1_CS — Alternate mode of PWM output for

contrast or brightness control

DIx_PIN11 — —

DIx_PIN12 — —

DIx_PIN13 — Register select signal

DIx_PIN14 — Optional RS2

DIx_PIN15 DRDY/DV Data validation/blank, data enable

DIx_PIN16 — Additional data synchronous

signals with programmable

features/timing

DIx_PIN17 Q

1 Signal mapping (both data and control/synchronization) is flexible. The table provides examples.

2 Restrictions for ports IPUx_DISPx_DAT00 through IPUx_DISPx_DAT23 are as follows:

• A maximum of three continuous groups of bits can be independently mapped to the external bus. Groups must not overlap.

• The bit order is expressed in each of the bit groups, for example, B[0] = least significant blue pixel bit.

3This mode works in compliance with recommendation ITU-R BT.656. The timing reference signals (frame start, frame end, line

start, and line end) are embedded in the 8-bit data bus. Only video data is supported, transmission of non-video related data

during blanking intervals is not supported.

Table 62. Video Signal Cross-Reference (continued)

i.MX 6Solo/6DualLite LCD

Comment1,2

Port Name

(x=0, 1)

RGB,

Signal

Name

(General)

RGB/TV Signal Allocation (Example)

16-bit

RGB

18-bit

RGB

24 Bit

RGB

8-bit

YCrCb3

16-bit

YCrCb

20-bit

YCrCb

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96 NXP Semiconductors

Electrical Characteristics

4.11.10.5.1 Synchronous Controls

The synchronous control changes its value as a function of a system or of an external clock. This control

has a permanent period and a permanent wave form.

There are special physical outputs to provide synchronous controls:

• The IPP_DISP_CLK is a dedicated base synchronous signal that is used to generate a base display

(component, pixel) clock for a display.

• The IPUx_DIx_PIN01—IPUx_DIx_PIN07 are general purpose synchronous pins, that can be used

to provide HSYNC, VSYNC, DRDY or any other independent signal to a display.

The IPU has a system of internal binding counters for internal events (such as, HSYNC/VSYNC)

calculation. The internal event (local start point) is synchronized with internal DI_CLK. A suitable control

starts from the local start point with predefined UP and DOWN values to calculate control’s changing

points with half DI_CLK resolution. A full description of the counters system can be found in the IPU

chapter of the i.MX 6Solo/6DualLite Reference Manual (IMX6SDLRM).

4.11.10.5.2 Asynchronous Controls

The asynchronous control is a data-oriented signal that changes its value with an output data according to

additional internal flags coming with the data.

There are special physical outputs to provide asynchronous controls, as follows:

• The IPUx_DIx_D0_CS and IPUx_DIx_D1_CS pins are dedicated to provide chip select signals to

two displays.

• The IPUx_DIx_PIN11—IPUx_DIx_PIN17 are general purpose asynchronous pins, that can be

used to provide WR. RD, RS or any other data oriented signal to display.

NOTE

The IPU has independent signal generators for asynchronous signals

toggling. When a DI decides to put a new asynchronous data in the bus, a

new internal start (local start point) is generated. The signals generators

calculate predefined UP and DOWN values to change pins states with half

DI_CLK resolution.

4.11.10.6 Synchronous Interfaces to Standard Active Matrix TFT LCD Panels

4.11.10.6.1 IPU Display Operating Signals

The IPU uses four control signals and data to operate a standard synchronous interface:

• IPP_DISP_CLK—Clock to display

• HSYNC—Horizontal synchronization

• VSYNC—Vertical synchronization

• DRDY—Active data

All synchronous display controls are generated on the base of an internally generated “local start point”.

The synchronous display controls can be placed on time axis with DI’s offset, up and down parameters.

Electrical Characteristics

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NXP Semiconductors 97

The display access can be whole number of DI clock (Tdiclk) only. The IPP_DATA can not be moved

relative to the local start point. The data bus of the synchronous interface is output direction only.

4.11.10.6.2 LCD Interface Functional Description

Figure 61 depicts the LCD interface timing for a generic active matrix color TFT panel. In this figure,

signals are shown with negative polarity. The sequence of events for active matrix interface timing is:

• DI_CLK internal DI clock is used for calculation of other controls.

• IPP_DISP_CLK latches data into the panel on its negative edge (when positive polarity is selected).

In active mode, IPP_DISP_CLK runs continuously.

• HSYNC causes the panel to start a new line. (Usually IPUx_DIx_PIN02 is used as HSYNC.)

• VSYNC causes the panel to start a new frame. It always encompasses at least one HSYNC pulse.

(Usually IPUx_DIx_PIN03 is used as VSYNC.)

• DRDY acts like an output enable signal to the CRT display. This output enables the data to be

shifted onto the display. When disabled, the data is invalid and the trace is off.

(DRDY can be used either synchronous or asynchronous generic purpose pin as well.)

Figure 61. Interface Timing Diagram for TFT (Active Matrix) Panels

4.11.10.6.3 TFT Panel Sync Pulse Timing Diagrams

Figure 62 depicts the horizontal timing (timing of one line), including both the horizontal sync pulse and

the data. All the parameters shown in the figure are programmable. All controls are started by

123 mm-1

HSYNC

VSYNC

HSYNC

LINE 1 LINE 2 LINE 3 LINE 4 LINE n-1 LINE n

DRDY

IPP_DISP_CLK

IPP_DATA

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98 NXP Semiconductors

Electrical Characteristics

corresponding internal events—local start points. The timing diagrams correspond to inverse polarity of

the IPP_DISP_CLK signal and active-low polarity of the HSYNC, VSYNC, and DRDY signals.

Figure 62. TFT Panels Timing Diagram—Horizontal Sync Pulse

Figure 63 depicts the vertical timing (timing of one frame). All parameters shown in the figure are

programmable.

Figure 63. TFT Panels Timing Diagram—Vertical Sync Pulse

DI clock

VSYNC

DRDY

D0 D1

IP5o

IP13o

IP9o

IP8o IP8

IP9

IP10

IP7

IP5

IP6

local start point

IPP_DISP_ CLK

IPP_DATA

HSYNC

IP14

VSYNC

HSYNC

DRDY

Start of frame End of frame

IP12

IP15

IP13

IP11

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Table 63 shows timing characteristics of signals presented in Figure 62 and Figure 63.

Table 63. Synchronous Display Interface Timing Characteristics (Pixel Level)

ID Parameter Symbol Value Description Unit

IP5 Display interface clock period Tdicp (1) Display interface clock. IPP_DISP_CLK ns

IP6 Display pixel clock period Tdpcp DISP_CLK_PER_PIXEL

× Tdicp

Time of translation of one pixel to display,

DISP_CLK_PER_PIXEL—number of pixel

components in one pixel (1.n). The

DISP_CLK_PER_PIXEL is virtual

parameter to define Display pixel clock

period.

The DISP_CLK_PER_PIXEL is received by

DC/DI one access division to n

components.

IP7 Screen width time Tsw (SCREEN_WIDTH)

× Tdicp

SCREEN_WIDTH—screen width in,

interface clocks. horizontal blanking

included.

The SCREEN_WIDTH should be built by

suitable DI’s counter2.

IP8 HSYNC width time Thsw (HSYNC_WIDTH) HSYNC_WIDTH—Hsync width in DI_CLK

with 0.5 DI_CLK resolution. Defined by DI’s

counter.

IP9 Horizontal blank interval 1 Thbi1 BGXP × Tdicp BGXP—width of a horizontal blanking

before a first active data in a line (in

interface clocks). The BGXP should be built

by suitable DI’s counter.

IP10 Horizontal blank interval 2 Thbi2 (SCREEN_WIDTH -

BGXP - FW) × Tdicp

Width a horizontal blanking after a last

active data in a line (in interface clocks)

FW—with of active line in interface clocks.

The FW should be built by suitable DI’s

counter.

IP12 Screen height Tsh (SCREEN_HEIGHT)

× Tsw

SCREEN_HEIGHT— screen height in lines

with blanking.

The SCREEN_HEIGHT is a distance

between 2 VSYNCs.

The SCREEN_HEIGHT should be built by

suitable DI’s counter.

IP13 VSYNC width Tvsw VSYNC_WIDTH VSYNC_WIDTH—Vsync width in DI_CLK

with 0.5 DI_CLK resolution. Defined by DI’s

counter

IP14 Vertical blank interval 1 Tvbi1 BGYP × Tsw BGYP—width of first Vertical

blanking interval in line. The BGYP should

be built by suitable DI’s counter.

IP15 Vertical blank interval 2 Tvbi2 (SCREEN_HEIGHT -

BGYP - FH) × Tsw

Width of second Vertical

blanking interval in line. The FH should be

built by suitable DI’s counter.

IP5o Offset of IPP_DISP_CLK Todicp DISP_CLK_OFFSET

× Tdiclk

DISP_CLK_OFFSET—offset of

IPP_DISP_CLK edges from local start

point, in DI_CLK×2

(0.5 DI_CLK Resolution).

Defined by DISP_CLK counter

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100 NXP Semiconductors

Electrical Characteristics

The maximum accuracy of UP/DOWN edge of controls is:

The maximum accuracy of UP/DOWN edge of IPP_DATA is:

The DISP_CLK_PERIOD, DI_CLK_PERIOD parameters are programmed through the registers.

IP13o Offset of VSYNC Tovs VSYNC_OFFSET

× Tdiclk

VSYNC_OFFSET—offset of Vsync edges

from a local start point, when a Vsync

should be active, in DI_CLK×2

(0.5 DI_CLK Resolution). The

VSYNC_OFFSET should be built by

suitable DI’s counter.

IP8o Offset of HSYNC Tohs HSYNC_OFFSET

× Tdiclk

HSYNC_OFFSET—offset of Hsync edges

from a local start point, when a Hsync

should be active, in DI_CLK×2

(0.5 DI_CLK Resolution). The

HSYNC_OFFSET should be built by

suitable DI’s counter.

IP9o Offset of DRDY Todrdy DRDY_OFFSET

× Tdiclk

DRDY_OFFSET—offset of DRDY edges

from a suitable local start point, when a

corresponding data has been set on the

bus, in DI_CLK×2

(0.5 DI_CLK Resolution).

The DRDY_OFFSET should be built by

suitable DI’s counter.

1Display interface clock period immediate value.

DISP_CLK_PERIOD—number of DI_CLK per one Tdicp. Resolution 1/16 of DI_CLK.

DI_CLK_PERIOD—relation of between programing clock frequency and current system clock frequency

Display interface clock period average value.

2DI’s counter can define offset, period and UP/DOWN characteristic of output signal according to programed parameters of the

counter. Same of parameters in the table are not defined by DI’s registers directly (by name), but can be generated by

corresponding DI’s counter. The SCREEN_WIDTH is an input value for DI’s HSYNC generation counter. The distance

between HSYNCs is a SCREEN_WIDTH.

Table 63. Synchronous Display Interface Timing Characteristics (Pixel Level) (continued)

ID Parameter Symbol Value Description Unit

Tdicp

Tdiclk

DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------

× for integer DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------,

Tdiclk floor DISP_CLK_PERIOD

DI_CLK_PERIOD

---------------------------------------------------- 0.5 0.5±+





for fractional DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------,











Tdicp Tdiclk

DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------

×=

Accuracy 0.5 Tdiclk

×()0.62ns±=

Accuracy Tdiclk 0.62ns±=

Electrical Characteristics

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NXP Semiconductors 101

Figure 64 depicts the synchronous display interface timing for access level. The DISP_CLK_DOWN and

DISP_CLK_UP parameters are set through the Register. Table 64 lists the synchronous display interface

timing characteristics.

Figure 64. Synchronous Display Interface Timing Diagram—Access Level

Table 64. Synchronous Display Interface Timing Characteristics (Access Level)

ID Parameter Symbol Min Typ1

1The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display.

These conditions may be chip specific.

Max Unit

IP16 Display interface clock low

time

Tckl Tdicd-Tdicu-1.24 Tdicd2-Tdicu3

2Display interface clock down time

3Display interface clock up time where CEIL(X) rounds the elements of X to the nearest integers towards infinity.

Tdicd-Tdicu+1.24 ns

IP17 Display interface clock

high time

Tckh Tdicp-Tdicd+Tdicu-1.24 Tdicp-Tdicd+Tdicu Tdicp-Tdicd+Tdicu+1.2 ns

IP18 Data setup time Tdsu Tdicd-1.24 Tdicu — ns

IP19 Data holdup time Tdhd Tdicp-Tdicd-1.24 Tdicp-Tdicu — ns

IP20o Control signals offset

times (defines for each pin)

Tocsu Tocsu-1.24 Tocsu Tocsu+1.24 ns

IP20 Control signals setup time

to display interface clock

(defines for each pin)

Tcsu Tdicd-1.24-Tocsu%Tdicp Tdicu — ns

IP19 IP18

IP20

VSYNC

IP17IP16

DRDY

HSYNC

other controls

IP20o

local start point

Tdicd

Tdicu

IPP_DISP_CLK

IPP_DATA

Tdicd 1

---T

diclk ceil×2 DISP_CLK_DOWN×

DI_CLK_PERIOD

-----------------------------------------------------------





Tdicu 1

---T

diclk ceil×2 DISP_CLK_UP×

DI_CLK_PERIOD

------------------------------------------------





i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

102 NXP Semiconductors

Electrical Characteristics

4.11.11 LVDS Display Bridge (LDB) Module Parameters

The LVDS interface complies with TIA/EIA 644-A standard. For more details, see TIA/EIA STANDARD

644-A, “Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits”.

4.11.12 MIPI D-PHY Timing Parameters

This section describes MIPI D-PHY electrical specifications, compliant with MIPI CSI-2 version 1.0,

D-PHY specification Rev. 1.0 (for MIPI sensor port x2 lanes) and MIPI DSI Version 1.01, and D-PHY

specification Rev. 1.0 (and also DPI version 2.0, DBI version 2.0, DSC version 1.0a at protocol layer) (for

MIPI display port x2 lanes).

4.11.12.1 Electrical and Timing Information

Table 65. LVDS Display Bridge (LDB) Electrical Specification

Parameter Symbol Test Condition Min Max Units

Differential Voltage Output Voltage VOD 100 Ω Differential load 250 450 mV

Output Voltage High Voh 100 Ω differential load (0 V Diff—Output High

Voltage static)

1.25 1.6 V

Output Voltage Low Vol 100 Ω differential load (0 V Diff—Output Low

Voltage static)

0.9 1.25 V

Offset Static Voltage VOS Two 49.9 Ω resistors in series between N-P

terminal, with output in either Zero or One state, the

voltage measured between the 2 resistors.

1.15 1.375 V

VOS Differential VOSDIFF Difference in VOS between a One and a Zero state -50 50 mV

Output short circuited to GND ISA ISB With the output common shorted to GND -24 24 mA

VT Full Load Test VTLoad 100 Ω Differential load with a 3.74 kΩ load between

GND and IO Supply Voltage

247 454 mV

Table 66. Electrical and Timing Information

Symbol Parameters Test Conditions Min Typ Max Unit

Input DC Specifications - Apply to DSI_CLK_P/DSI_CLK_N and DSI_DATA_P/DSI_DATA_N inputs

VIInput signal voltage range Transient voltage range is

limited from -300 mV to

1600 mV

-50 — 1350 mV

VLEAK Input leakage current VGNDSH(min) = VI =

VGNDSH(max) +

VOH(absmax)

Lane module in LP Receive

Mode

-10 — 10 mA

VGNDSH Ground Shift — -50 — 50 mV

VOH(absmax) Maximum transient output

voltage level

———1.45V

Electrical Characteristics

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NXP Semiconductors 103

tvoh(absmax) Maximum transient time

above VOH(absmax)

———20ns

HS Line Drivers DC Specifications

|VOD| HS Transmit Differential

output voltage magnitude

80 Ω<= RL< = 125 Ω140 200 270 mV

Δ|VOD| Change in Differential output

voltage magnitude between

logic states

80 Ω<= RL< = 125 Ω——10mV

VCMTX Steady-state common-mode

output voltage.

80 Ω<= RL< = 125 Ω150 200 250 mV

ΔVCMTX(1,0) Changes in steady-state

common-mode output voltage

between logic states

80 Ω<= RL< = 125 Ω—— 5mV

VOHHS HS output high voltage 80 Ω<= RL< = 125 Ω——360mV

ZOS Single-ended output

impedance.

—405062.5Ω

ΔZOS Single-ended output

impedance mismatch.

———10%

LP Line Drivers DC Specifications

VOL Output low-level SE voltage — -50 50 mV

VOH Output high-level SE voltage — 1.1 1.2 1.3 V

ZOLP Single-ended output

impedance.

— 110 — — Ω

ΔZOLP(01-10) Single-ended output

impedance mismatch driving

opposite level

———20%

ΔZOLP(0-11) Single-ended output

impedance mismatch driving

same level

———5%

HS Line Receiver DC Specifications

VIDTH Differential input high voltage

threshold

———70mV

VIDTL Differential input low voltage

threshold

—-70——mV

VIHHS Single ended input high

voltage

———460mV

VILHS Single ended input low

voltage

—-40——mV

VCMRXDC Input common mode voltage — 70 — 330 mV

Table 66. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

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104 NXP Semiconductors

Electrical Characteristics

4.11.12.2 MIPI D-PHY Signaling Levels

The signal levels are different for differential HS mode and single-ended LP mode. Figure 65 shows both

the HS and LP signal levels on the left and right sides, respectively. The HS signaling levels are below

the LP low-level input threshold such that LP receiver always detects low on HS signals.

Figure 65. D-PHY Signaling Levels

ZID Differential input impedance — 80 — 125 Ω

LP Line Receiver DC Specifications

VIL Input low voltage — — — 550 mV

VIH Input high voltage — 920 — — mV

VHYST Input hysteresis — 25 — — mV

Contention Line Receiver DC Specifications

VILF Input low fault threshold — 200 — 450 mV

Table 66. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

HS Vout

Range

HS Vcm

Range

Max VOD

Min VOD

VCMTX,MIN

VOLHS

VCMTX,MAX

VOHHS

LP VIL

VOL

VIH

VOH,MAX

VOH,MIN

VIH

VIL

LP Threshold

Region

VGNDSH,MA

VGNDSH,MIN

GND

LP VOL

HS Differential Signaling LP Single-ended Signaling

Electrical Characteristics

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NXP Semiconductors 105

4.11.12.3 MIPI HS Line Driver Characteristics

Figure 66. Ideal Single-ended and Resulting Differential HS Signals

4.11.12.4 Possible ΔVCMTX and ΔVOD Distortions of the Single-ended HS Signals

Figure 67. Possible ΔVCMTX and ΔVOD Distortions of the Single-ended HS Signals

4.11.12.5 MIPI D-PHY Switching Characteristics

Table 67. Electrical and Timing Information

Symbol Parameters Test Conditions Min Typ Max Unit

HS Line Drivers AC Specifications

— Maximum serial data rate (forward

direction)

On DATAP/N outputs.

80 Ω <= RL <= 125 Ω

80 — 1000 Mbps

VOD(1)

VOD(0)

VOD = VDP - VDN

VCMTX = (VDP + VDN)/2

(Differential)

VDN

VDP

Ideal Single-Ended High Speed Signals

Ideal Differential High Speed Signals

VOD(0)

VOD (1)

VOD/2

VOD /2

VOD (SE HS Signals)

Static VCMT X (SE HS Signals)

Dynamic VCMT X (SE HS Signals)

VDN

VCM TX

VDP

VDN

VCMTX

VDP

VDN

VCM TX

VDP

VOD(0)

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106 NXP Semiconductors

Electrical Characteristics

FDDRCLK DDR CLK frequency On DATAP/N outputs. 40 — 500 MHz

PDDRCLK DDR CLK period 80 Ω<= RL< = 125 Ω2 — 25 ns

tCDC DDR CLK duty cycle tCDC = tCPH / PDDRCLK —50— %

tCPH DDR CLK high time — — 1 — UI

tCPL DDR CLK low time — — 1 — UI

— DDR CLK / DATA Jitter — — 75 — ps pk–pk

tSKEW[PN] Intra-Pair (Pulse) skew — — 0.075 — UI

tSKEW[TX] Data to Clock Skew — 0.350 — 0.650 UI

trDifferential output signal rise time 20% to 80%, RL = 50 Ω 150 — 0.3UI ps

tfDifferential output signal fall time 20% to 80%, RL = 50 Ω 150 — 0.3UI ps

ΔVCMTX(HF) Common level variation above 450 MHz 80 Ω<= RL< = 125 Ω——15mV

rms

ΔVCMTX(LF) Common level variation between 50

MHz and 450 MHz.

80 Ω<= RL< = 125 Ω——25mV

LP Line Drivers AC Specifications

trlp,tflp Single ended output rise/fall time 15% to 85%, CL<70 pF — — 25 ns

treo 30% to 85%, CL<70 pF — — 35 ns

δV/δtSR Signal slew rate 15% to 85%, CL<70 pF — — 120 mV/ns

CLLoad capacitance — 0 — 70 pF

HS Line Receiver AC Specifications

tSETUP[RX] Data to Clock Receiver Setup time — 0.15 — — UI

tHOLD[RX] Clock to Data Receiver Hold time — 0.15 — — UI

ΔVCMRX(HF) Common mode interference beyond

450 MHz

— — — 200 mVpp

ΔVCMRX(LF) Common mode interference between

50 MHz and 450 MHz.

—-50—50mVpp

CCM Common mode termination — — — 60 pF

LP Line Receiver AC Specifications

eSPIKE Input pulse rejection — — 300 Vps

TMIN Minimum pulse response — 50 — ns

VINT Pk-to-Pk interference voltage — — — 400 mV

fINT Interference frequency — 450 — — MHz

Table 67. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

Electrical Characteristics

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 107

4.11.12.6 High-Speed Clock Timing

Figure 68. DDR Clock Definition

4.11.12.7 Forward High-Speed Data Transmission Timing

The timing relationship of the DDR Clock differential signal to the Data differential signal is shown in

Figure 69:

Figure 69. Data to Clock Timing Definitions

Model Parameters used for Driver Load switching performance evaluation

CPAD Equivalent Single ended I/O PAD

capacitance.

———1pF

CPIN Equivalent Single ended Package +

PCB capacitance.

———2pF

LSEquivalent wire bond series inductance — — — 1.5 nH

RSEquivalent wire bond series resistance — — — 0.15 Ω

RLLoad resistance — 80 100 125 Ω

Table 67. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

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i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

108 NXP Semiconductors

Electrical Characteristics

4.11.12.8 Reverse High-Speed Data Transmission Timing

Figure 70. Reverse High-Speed Data Transmission Timing at Slave Side

4.11.12.9 Low-Power Receiver Timing

Figure 71. Input Glitch Rejection of Low-Power Receivers

4.11.13 HSI Host Controller Timing Parameters

This section describes the timing parameters of the HSI Host Controller which are compliant with

High-speed Synchronous Serial Interface (HSI) Physical Layer specification version1.01.

4.11.13.1 Synchronous Data Flow

Figure 72. Synchronized Data Flow READY Signal Timing (Frame and Stream Transmission)

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Electrical Characteristics

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 109

4.11.13.2 Pipelined Data Flow

Figure 73. Pipelined Data Flow Ready Signal Timing (Frame Transmission Mode)

4.11.13.3 Receiver Real-Time Data Flow

Figure 74. Receiver Real-Time Data Flow READY Signal Timing

4.11.13.4 Synchronized Data Flow Transmission with Wake

Figure 75. Synchronized Data Flow Transmission with WAKE

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i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

110 NXP Semiconductors

Electrical Characteristics

4.11.13.5 Stream Transmission Mode Frame Transfer

Figure 76. Stream Transmission Mode Frame Transfer (Synchronized Data Flow)

4.11.13.6 Frame Transmission Mode (Synchronized Data Flow)

Figure 77. Frame Transmission Mode Transfer of Two Frames (Synchronized Data Flow)

4.11.13.7 Frame Transmission Mode (Pipelined Data Flow)

Figure 78. Frame Transmission Mode Transfer of Two Frames (Pipelined Data Flow)

4.11.13.8 DATA and FLAG Signal Timing Requirement for a 15 pF Load

Table 68. DATA and FLAG Timing

Parameter Description 1 Mbit/s 100 Mbit/s 200 Mbit/s

tBit, nom Nominal bit time 1000 ns 10.0 ns 5.00 ns

tRise, min and

tFall, min

Minimum allowed rise and fall time 2.00 ns 2.00 ns 1.00 ns

tTxToRxSkew, maxfq Maximum skew between transmitter and receiver package pins 50.0 ns 0.5.0 ns 0.25 ns

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Electrical Characteristics

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 111

Figure 79. DATA and FLAG Signal Timing

4.11.14 PCIe PHY Parameters

The PCIe interface complies with PCIe specification Gen2 x1 lane and supports the PCI Express 1.1/2.0

standard.

4.11.14.1 PCIE_REXT Reference Resistor Connection

The impedance calibration process requires connection of reference resistor 200 Ω. 1% precision resistor

on PCIE_REXT pads to ground. It is used for termination impedance calibration.

4.11.15 Pulse Width Modulator (PWM) Timing Parameters

This section describes the electrical information of the PWM. The PWM can be programmed to select one

of three clock signals as its source frequency. The selected clock signal is passed through a prescaler before

being input to the counter. The output is available at the pulse-width modulator output (PWMO) external

pin.

tEageSepTx, min Minimum allowed separation of signal transitions at transmitter

package pins, including all timing defects, for example, jitter

and skew, inside the transmitter.

400 ns 4.00 ns 2.00 ns

tEageSepRx, min Minimum separation of signal transitions, measured at the

receiver package pins, including all timing defects, for example,

jitter and skew, inside the receiver.

350 ns 3.5 ns 1.75 ns

Table 68. DATA and FLAG Timing (continued)

Parameter Description 1 Mbit/s 100 Mbit/s 200 Mbit/s

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i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

112 NXP Semiconductors

Electrical Characteristics

Figure 80 depicts the timing of the PWM, and Table 69 lists the PWM timing parameters.

Figure 80. PWM Timing

4.11.16 SCAN JTAG Controller (SJC) Timing Parameters

Figure 81 depicts the SJC test clock input timing. Figure 82 depicts the SJC boundary scan timing.

Figure 83 depicts the SJC test access port. Signal parameters are listed in Table 70.

Figure 81. Test Clock Input Timing Diagram

Table 69. PWM Output Timing Parameters

ID Parameter Min Max Unit

PWM Module Clock Frequency 0 ipg_clk MHz

P1 PWM output pulse width high 15 — ns

P2 PWM output pulse width low 15 — ns

07-N?/54

0 0

JTAG_TCK

(Input) VM VM

VIH

VIL

SJ1

SJ2 SJ2

SJ3

Electrical Characteristics

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 113

Figure 82. Boundary Scan (JTAG) Timing Diagram

Figure 83. Test Access Port Timing Diagram

JTAG_TCK

(Input)

Data

Inputs

Data

Outputs

Data

Outputs

Data

Outputs

VIH

VIL

Input Data Valid

Output Data Valid

SJ4 SJ5

SJ6

SJ7

SJ6

JTAG_TCK

(Input)

JTAG_TDI

(Input)

JTAG_TDO

(Output)

JTAG_TDO

(Output)

JTAG_TDO

(Output)

VIH

VIL

Input Data Valid

Output Data Valid

JTAG_TMS

SJ8 SJ9

SJ10

SJ11

SJ10

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114 NXP Semiconductors

Electrical Characteristics

Figure 84. JTAG_TRST_B Timing Diagram

4.11.17 SPDIF Timing Parameters

The Sony/Philips Digital Interconnect Format (SPDIF) data is sent using the bi-phase marking code. When

encoding, the SPDIF data signal is modulated by a clock that is twice the bit rate of the data signal.

Table 71 and Figure 85 and Figure 86 show SPDIF timing parameters for the Sony/Philips Digital

Interconnect Format (SPDIF), including the timing of the modulating Rx clock (SPDIF_SR_CLK) for

SPDIF in Rx mode and the timing of the modulating Tx clock (SPDIF_ST_CLK) for SPDIF in Tx mode.

Table 70. JTAG Timing

ID Parameter1,2

All Frequencies

Unit

Min Max

SJ0 JTAG_TCK frequency of operation 1/(3•TDC)1

1TDC = target frequency of SJC

0.001 22 MHz

SJ1 JTAG_TCK cycle time in crystal mode 45 — ns

SJ2 JTAG_TCK clock pulse width measured at VM2

2VM = mid-point voltage

22.5 — ns

SJ3 JTAG_TCK rise and fall times — 3 ns

SJ4 Boundary scan input data set-up time 5 — ns

SJ5 Boundary scan input data hold time 24 — ns

SJ6 JTAG_TCK low to output data valid — 40 ns

SJ7 JTAG_TCK low to output high impedance — 40 ns

SJ8 JTAG_TMS, JTAG_TDI data set-up time 5 — ns

SJ9 JTAG_TMS, JTAG_TDI data hold time 25 — ns

SJ10 JTAG_TCK low to JTAG_TDO data valid — 44 ns

SJ11 JTAG_TCK low to JTAG_TDO high impedance — 44 ns

SJ12 JTAG_TRST_B assert time 100 — ns

SJ13 JTAG_TRST_B set-up time to JTAG_TCK low 40 — ns

JTAG_TCK

(Input)

JTAG_TRST_B

(Input)

SJ13

SJ12

Electrical Characteristics

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NXP Semiconductors 115

Figure 85. SPDIF_SR_CLK Timing Diagram

Figure 86. SPDIF_ST_CLK Timing Diagram

Table 71. SPDIF Timing Parameters

Characteristics Symbol

Timing Parameter Range

Unit

Min Max

SPDIF_IN Skew: asynchronous inputs, no specs apply — — 0.7 ns

SPDIF_OUT output (Load = 50pf)

• Skew

• Transition rising

• Transition falling

—

1.5

24.2

31.3

SPDIF_OUT output (Load = 30pf)

• Skew

• Transition rising

• Transition falling

—

1.5

13.6

18.0

Modulating Rx clock (SPDIF_SR_CLK) period srckp 40.0 — ns

SPDIF_SR_CLK high period srckph 16.0 — ns

SPDIF_SR_CLK low period srckpl 16.0 — ns

Modulating Tx clock (SPDIF_ST_CLK) period stclkp 40.0 — ns

SPDIF_ST_CLK high period stclkph 16.0 — ns

SPDIF_ST_CLK low period stclkpl 16.0 — ns

SPDIF_SR_CLK

(Output)

VMVM

srckp

srckph

srckpl

SPDIF_ST_CLK

(Input)

VMVM

stclkp

stclkph

stclkpl

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116 NXP Semiconductors

Electrical Characteristics

4.11.18 SSI Timing Parameters

This section describes the timing parameters of the SSI module. The connectivity of the serial

synchronous interfaces are summarized in Table 72.

NOTE

The terms WL and BL used in the timing diagrams and tables refer to

Word Length (WL) and Bit Length (BL).

4.11.18.1 SSI Transmitter Timing with Internal Clock

Figure 87 depicts the SSI transmitter internal clock timing and Table 73 lists the timing parameters for

the SSI transmitter internal clock.

Figure 87. SSI Transmitter Internal Clock Timing Diagram

Table 72. AUDMUX Port Allocation

Port Signal Nomenclature Type and Access

AUDMUX port 1 SSI 1 Internal

AUDMUX port 2 SSI 2 Internal

AUDMUX port 3 AUD3 External—AUD3 I/O

AUDMUX port 4 AUD4 External—EIM or CSPI1 I/O through IOMUXC

AUDMUX port 5 AUD5 External—EIM or SD1 I/O through IOMUXC

AUDMUX port 6 AUD6 External—EIM or DISP2 through IOMUXC

AUDMUX port 7 SSI 3 Internal

SS19

SS1

SS2 SS4

SS3

SS5

SS6 SS8

SS10 SS12

SS14

SS18

SS15

SS17

SS16

SS43

SS42

Note: AUDx_RXD input in synchronous mode only

AUDx_TXC

(Output)

AUDx_TXFS (wl)

(Output)

AUDx_TXFS (bl)

(Output)

AUDx_RXD

(Input)

AUDx_TXD

(Output)

Electrical Characteristics

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NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

AUDx_TXC/AUDx_RXC and/or the frame sync

AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).

• For internal Frame Sync operation using external clock, the frame sync

timing is same as that of transmit data (for example, during AC97 mode

of operation).

Table 73. SSI Transmitter Timing with Internal Clock

ID Parameter Min Max Unit

Internal Clock Operation

SS1 AUDx_TXC/AUDxRXC clock period 81.4 — ns

SS2 AUDx_TXC/AUDxRXC clock high period 36.0 — ns

SS4 AUDx_TXC/AUDxRXC clock low period 36.0 — ns

SS6 AUDx_TXC high to AUDx_TXFS (bl) high — 15.0 ns

SS8 AUDx_TXC high to AUDx_TXFS (bl) low — 15.0 ns

SS10 AUDx_TXC high to AUDx_TXFS (wl) high — 15.0 ns

SS12 AUDx_TXC high to AUDx_TXFS (wl) low — 15.0 ns

SS14 AUDx_TXC/AUDxRXC Internal AUDx_TXFS rise time — 6.0 ns

SS15 AUDx_TXC/AUDxRXC Internal AUDx_TXFS fall time — 6.0 ns

SS16 AUDx_TXC high to AUDx_TXD valid from high impedance — 15.0 ns

SS17 AUDx_TXC high to AUDx_TXD high/low — 15.0 ns

SS18 AUDx_TXC high to AUDx_TXD high impedance — 15.0 ns

Synchronous Internal Clock Operation

SS42 AUDx_RXD setup before AUDx_TXC falling 10.0 — ns

SS43 AUDx_RXD hold after AUDx_TXC falling 0.0 — ns

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Electrical Characteristics

4.11.18.2 SSI Receiver Timing with Internal Clock

Figure 88 depicts the SSI receiver internal clock timing and Table 74 lists the timing parameters for the

receiver timing with the internal clock.

Figure 88. SSI Receiver Internal Clock Timing Diagram

Table 74. SSI Receiver Timing with Internal Clock

ID Parameter Min Max Unit

Internal Clock Operation

SS1 AUDx_TXC/AUDx_RXC clock period 81.4 — ns

SS2 AUDx_TXC/AUDx_RXC clock high period 36.0 — ns

SS3 AUDx_TXC/AUDx_RXC clock rise time — 6.0 ns

SS4 AUDx_TXC/AUDx_RXC clock low period 36.0 — ns

SS5 AUDx_TXC/AUDx_RXC clock fall time — 6.0 ns

SS7 AUDx_RXC high to AUDx_TXFS (bl) high — 15.0 ns

SS9 AUDx_RXC high to AUDx_TXFS (bl) low — 15.0 ns

SS11 AUDx_RXC high to AUDx_TXFS (wl) high — 15.0 ns

SS13 AUDx_RXC high to AUDx_TXFS (wl) low — 15.0 ns

SS20 AUDx_RXD setup time before AUDx_RXC low 10.0 — ns

SS21 AUDx_RXD hold time after AUDx_RXC low 0.0 — ns

SS50

SS48

SS1

SS4SS2

SS51

SS20

SS21

SS49

SS7 SS9

SS11 SS13

SS47

SS3

SS5

AUDx_TXC

(Output)

AUDx_TXFS (bl)

(Output)

AUDx_TXFS (wl)

(Output)

AUDx_RXD

(Input)

AUDx_RXC

(Output)

Electrical Characteristics

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NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

AUDx_TXC/AUDx_RXC and/or the frame sync

AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).

• For internal Frame Sync operation using external clock, the frame sync

timing is same as that of transmit data (for example, during AC97 mode

of operation).

Oversampling Clock Operation

SS47 Oversampling clock period 15.04 — ns

SS48 Oversampling clock high period 6.0 — ns

SS49 Oversampling clock rise time — 3.0 ns

SS50 Oversampling clock low period 6.0 — ns

SS51 Oversampling clock fall time — 3.0 ns

Table 74. SSI Receiver Timing with Internal Clock (continued)

ID Parameter Min Max Unit

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Electrical Characteristics

4.11.18.3 SSI Transmitter Timing with External Clock

Figure 89 depicts the SSI transmitter external clock timing and Table 75 lists the timing parameters for

the transmitter timing with the external clock.

Figure 89. SSI Transmitter External Clock Timing Diagram

Table 75. SSI Transmitter Timing with External Clock

ID Parameter Min Max Unit

External Clock Operation

SS22 AUDx_TXC/AUDx_RXC clock period 81.4 — ns

SS23 AUDx_TXC/AUDx_RXC clock high period 36.0 — ns

SS24 AUDx_TXC/AUDx_RXC clock rise time — 6.0 ns

SS25 AUDx_TXC/AUDx_RXC clock low period 36.0 — ns

SS26 AUDx_TXC/AUDx_RXC clock fall time — 6.0 ns

SS27 AUDx_TXC high to AUDx_TXFS (bl) high -10.0 15.0 ns

SS29 AUDx_TXC high to AUDx_TXFS (bl) low 10.0 — ns

SS31 AUDx_TXC high to AUDx_TXFS (wl) high -10.0 15.0 ns

SS33 AUDx_TXC high to AUDx_TXFS (wl) low 10.0 — ns

SS37 AUDx_TXC high to AUDx_TXD valid from high impedance — 15.0 ns

SS38 AUDx_TXC high to AUDx_TXD high/low — 15.0 ns

SS39 AUDx_TXC high to AUDx_TXD high impedance — 15.0 ns

SS45

SS33

SS24

SS26

SS25

SS23

SS31

SS29

SS27

SS22

SS44

SS39

SS38

SS37

SS46

AUDx_TXC

(Input)

AUDx_TXFS (bl)

(Input)

AUDx_TXFS (wl)

(Input)

AUDx_TXD

(Output)

AUDx_RXD

(Input)

Note: AUDx_RXD Input in Synchronous mode only

Electrical Characteristics

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NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

AUDx_TXC/AUDx_RXC and/or the frame sync

AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

• For internal Frame Sync operation using external clock, the frame sync

timing is same as that of transmit data (for example, during AC97 mode

of operation).

4.11.18.4 SSI Receiver Timing with External Clock

Figure 90 depicts the SSI receiver external clock timing and Table 76 lists the timing parameters for the

receiver timing with the external clock.

Figure 90. SSI Receiver External Clock Timing Diagram

Synchronous External Clock Operation

SS44 AUDx_RXD setup before AUDx_TXC falling 10.0 — ns

SS45 AUDx_RXD hold after AUDx_TXC falling 2.0 — ns

SS46 AUDx_RXD rise/fall time — 6.0 ns

Table 75. SSI Transmitter Timing with External Clock (continued)

ID Parameter Min Max Unit

SS24

SS34

SS35

SS30

SS28

SS26

SS25

SS23

SS40

SS22

SS32

SS36

SS41

AUDx_TXC

(Input)

AUDx_TXFS (bl)

(Input)

AUDx_TXFS (wl)

(Input)

AUDx_RXD

(Input)

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Electrical Characteristics

NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

AUDx_TXC/AUDx_RXC and/or the frame sync

AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).

• For internal Frame Sync operation using external clock, the frame sync

timing is same as that of transmit data (for example, during AC97 mode

of operation).

Table 76. SSI Receiver Timing with External Clock

ID Parameter Min Max Unit

External Clock Operation

SS22 AUDx_TXC/AUDx_RXC clock period 81.4 — ns

SS23 AUDx_TXC/AUDx_RXC clock high period 36 — ns

SS24 AUDx_TXC/AUDx_RXC clock rise time — 6.0 ns

SS25 AUDx_TXC/AUDx_RXC clock low period 36 — ns

SS26 AUDx_TXC/AUDx_RXC clock fall time — 6.0 ns

SS28 AUDx_RXC high to AUDx_TXFS (bl) high -10 15.0 ns

SS30 AUDx_RXC high to AUDx_TXFS (bl) low 10 — ns

SS32 AUDx_RXC high to AUDx_TXFS (wl) high -10 15.0 ns

SS34 AUDx_RXC high to AUDx_TXFS (wl) low 10 — ns

SS35 AUDx_TXC/AUDx_RXC External AUDx_TXFS rise time — 6.0 ns

SS36 AUDx_TXC/AUDx_RXC External AUDx_TXFS fall time — 6.0 ns

SS40 AUDx_RXD setup time before AUDx_RXC low 10 — ns

SS41 AUDx_RXD hold time after AUDx_RXC low 2 — ns

Electrical Characteristics

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4.11.19 UART I/O Configuration and Timing Parameters

4.11.19.1 UART RS-232 I/O Configuration in Different Modes

The i.MX 6Solo/6DualLite UART interfaces can serve both as DTE or DCE device. This can be

configured by the DCEDTE control bit (default 0—DCE mode). Table 77 shows the UART I/O

configuration based on the enabled mode.

4.11.19.2 UART RS-232 Serial Mode Timing

The following sections describe the electrical information of the UART module in the RS-232 mode.

4.11.19.2.1 UART Transmitter

Figure 91 depicts the transmit timing of UART in the RS-232 serial mode, with 8 data bit/1 stop bit

format. Table 78 lists the UART RS-232 serial mode transmit timing characteristics.

Figure 91. UART RS-232 Serial Mode Transmit Timing Diagram

Table 77. UART I/O Configuration vs. Mode

Port

DTE Mode DCE Mode

Direction Description Direction Description

UARTx_RTS_B Output RTS from DTE to DCE Input RTS from DTE to DCE

UARTx_CTS_B Input CTS from DCE to DTE Output CTS from DCE to DTE

UARTx_DTR_B Output DTR from DTE to DCE Input DTR from DTE to DCE

UARTx_DSR_B Input DSR from DCE to DTE Output DSR from DCE to DTE

UARTx_DCD_ B Input DCD from DCE to DTE Output DCD from DCE to DTE

UARTx_RI_B Input RING from DCE to DTE Output RING from DCE to DTE

UARTx_TX_DATA Input Serial data from DCE to DTE Output Serial data from DCE to DTE

UARTx_RX_DATA Output Serial data from DTE to DCE Input Serial data from DTE to DCE

Table 78. RS-232 Serial Mode Transmit Timing Parameters

ID Parameter Symbol Min Max Unit

UA1 Transmit Bit Time tTbit 1/Fbaud_rate1 - Tref_clk2

1Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

2Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

1/Fbaud_rate + Tref_clk —

Start

Bit Bit 1 Bit 2Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

UARTx_TX_DATA

(output) Bit 3 STOP

BIT

Start

Bit

Possible

Parity

Bit

Par Bit

UA1

UA1 UA1

UA1

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Electrical Characteristics

4.11.19.2.2 UART Receiver

Figure 92 depicts the RS-232 serial mode receive timing with 8 data bit/1 stop bit format. Table 79 lists

serial mode receive timing characteristics.

Figure 92. UART RS-232 Serial Mode Receive Timing Diagram

4.11.19.2.3 UART IrDA Mode Timing

The following subsections give the UART transmit and receive timings in IrDA mode.

UART IrDA Mode Transmitter

Figure 93 depicts the UART IrDA mode transmit timing, with 8 data bit/1 stop bit format. Table 80 lists

the transmit timing characteristics.

Figure 93. UART IrDA Mode Transmit Timing Diagram

Table 79. RS-232 Serial Mode Receive Timing Parameters

ID Parameter Symbol Min Max Unit

UA2 Receive Bit Time1

1The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not

exceed 3/(16 x Fbaud_rate).

tRbit 1/Fbaud_rate2 - 1/(16 x Fbaud_rate)

2Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

1/Fbaud_rate + 1/(16 x Fbaud_rate)—

Table 80. IrDA Mode Transmit Timing Parameters

ID Parameter Symbol Min Max Unit

UA3 Transmit Bit Time in IrDA mode tTIRbit 1/Fbaud_rate1 - Tref_clk2

1Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

2Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

1/Fbaud_rate + Tref_clk —

UA4 Transmit IR Pulse Duration tTIRpulse (3/16) x (1/Fbaud_rate) - Tref_clk (3/16) x (1/Fbaud_rate) + Tref_clk —

Bit 1 Bit 2Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

UARTx_RX_DATA

(input)

Bit 3

Start

Bit STOP

BIT

Start

Bit

Possible

Parity

Bit

Par Bit

UA2 UA2

Bit 1 Bit 2

Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

UARTx_TX_DATA

(output)

Bit 3

Start

Bit

STOP

BIT

Possible

Parity

Bit

UA3 UA3 UA3 UA3

UA4

Electrical Characteristics

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UART IrDA Mode Receiver

Figure 94 depicts the UART IrDA mode receive timing, with 8 data bit/1 stop bit format. Table 81 lists

the receive timing characteristics.

Figure 94. UART IrDA Mode Receive Timing Diagram

4.11.20 USB HSIC Timings

This section describes the electrical information of the USB HSIC port.

NOTE

HSIC is DDR signal, following timing spec is for both rising and falling

edge.

4.11.20.1 Transmit Timing

Figure 95. USB HSIC Transmit Waveform

Table 81. IrDA Mode Receive Timing Parameters

ID Parameter Symbol Min Max Unit

UA5 Receive Bit Time1 in IrDA mode

1 The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not

exceed 3/(16 x Fbaud_rate).

tRIRbit 1/Fbaud_rate2 - 1/(16 x Fbaud_rate)

2Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

1/Fbaud_rate + 1/(16 x Fbaud_rate)—

UA6 Receive IR Pulse Duration tRIRpulse 1.41 μs (5/16) x (1/Fbaud_rate)—

Table 82. USB HSIC Transmit Parameters

Name Parameter Min Max Unit Comment

Tstrobe strobe period 4.166 4.167 ns —

Todelay data output delay time 550 1350 ps Measured at 50% point

Tslew strobe/data rising/falling time 0.7 2 V/ns Averaged from 30% – 70% points

Bit 1 Bit 2

Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

UARTx_RX_DATA

(input)

Bit 3

Start

Bit

STOP

BIT

Possible

Parity

Bit

UA5 UA5 UA5 UA5

UA6

USB_H_STROBE

USB_H_DATA

Todelay

Tstrobe

Todelay

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Electrical Characteristics

4.11.20.2 Receive Timing

Figure 96. USB HSIC Receive Waveform

4.11.21 USB PHY Parameters

This section describes the USB-OTG PHY and the USB Host port PHY parameters.

The USB PHY meets the electrical compliance requirements defined in the Universal Serial Bus Revision

2.0 OTG, USB Host with the amendments below (On-The-Go and Embedded Host Supplement to the USB

Revision 2.0 Specification is not applicable to Host port).

• USB ENGINEERING CHANGE NOTICE

— Title: 5V Short Circuit Withstand Requirement Change

— Applies to: Universal Serial Bus Specification, Revision 2.0

• Errata for USB Revision 2.0 April 27, 2000 as of 12/7/2000

• USB ENGINEERING CHANGE NOTICE

— Title: Pull-up/Pull-down resistors

— Applies to: Universal Serial Bus Specification, Revision 2.0

• USB ENGINEERING CHANGE NOTICE

— Title: Suspend Current Limit Changes

— Applies to: Universal Serial Bus Specification, Revision 2.0

• USB ENGINEERING CHANGE NOTICE

— Title: USB 2.0 Phase Locked SOFs

— Applies to: Universal Serial Bus Specification, Revision 2.0

• On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification

Table 83. USB HSIC Receive Parameters1

1The timings in the table are guaranteed when:

—AC I/O voltage is between 0.9x to 1x of the I/O supply

—DDR_SEL configuration bits of the I/O are set to (10)b

Name Parameter Min Max Unit Comment

Tstrobe strobe period 4.166 4.167 ns —

Thold data hold time 300 — ps Measured at 50% point

Tsetup data setup time 365 — ps Measured at 50% point

Tslew strobe/data rising/falling time 0.7 2 V/ns Averaged from 30% – 70% points

USB_H_STROBE

USB_H_DATA

Thold

Tstrobe

Tsetup

Boot Mode Configuration

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NXP Semiconductors 127

— Revision 2.0 plus errata and ecn June 4, 2010

• Battery Charging Specification (available from USB-IF)

— Revision 1.2, December 7, 2010

— Portable device only

5 Boot Mode Configuration

This section provides information on boot mode configuration pins allocation and boot devices interfaces

allocation.

5.1 Boot Mode Configuration Pins

Table 84 provides boot options, functionality, fuse values, and associated pins. Several input pins are also

sampled at reset and can be used to override fuse values, depending on the value of BT_FUSE_SEL fuse.

The boot option pins are in effect when BT_FUSE_SEL fuse is ‘0’ (cleared, which is the case for an

unblown fuse). For detailed boot mode options configured by the boot mode pins, see the i.MX

6Solo/6DualLite Fuse Map document and the System Boot chapter in i.MX 6Solo/6DualLite Reference

Manual (IMX6SDLRM).

Table 84. Fuses and Associated Pins Used for Boot

Pin Direction at Reset eFuse Name

Boot Mode Selection

BOOT_MODE1 Input N/A

BOOT_MODE0 Input N/A

Boot Options1

EIM_DA0 Input BOOT_CFG1[0]

EIM_DA1 Input BOOT_CFG1[1]

EIM_DA2 Input BOOT_CFG1[2]

EIM_DA3 Input BOOT_CFG1[3]

EIM_DA4 Input BOOT_CFG1[4]

EIM_DA5 Input BOOT_CFG1[5]

EIM_DA6 Input BOOT_CFG1[6]

EIM_DA7 Input BOOT_CFG1[7]

EIM_DA8 Input BOOT_CFG2[0]

EIM_DA9 Input BOOT_CFG2[1]

EIM_DA10 Input BOOT_CFG2[2]

EIM_DA11 Input BOOT_CFG2[3]

EIM_DA12 Input BOOT_CFG2[4]

EIM_DA13 Input BOOT_CFG2[5]

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Boot Mode Configuration

5.2 Boot Device Interface Allocation

Table 85 lists the interfaces that can be used by the boot process in accordance with the specific boot

mode configuration. The table also describes the interface’s specific modes and IOMUXC allocation,

which are configured during boot when appropriate.

EIM_DA14 Input BOOT_CFG2[6]

EIM_DA15 Input BOOT_CFG2[7]

EIM_A16 Input BOOT_CFG3[0]

EIM_A17 Input BOOT_CFG3[1]

EIM_A18 Input BOOT_CFG3[2]

EIM_A19 Input BOOT_CFG3[3]

EIM_A20 Input BOOT_CFG3[4]

EIM_A21 Input BOOT_CFG3[5]

EIM_A22 Input BOOT_CFG3[6]

EIM_A23 Input BOOT_CFG3[7]

EIM_A24 Input BOOT_CFG4[0]

EIM_WAIT Input BOOT_CFG4[1]

EIM_LBA Input BOOT_CFG4[2]

EIM_EB0 Input BOOT_CFG4[3]

EIM_EB1 Input BOOT_CFG4[4]

EIM_RW Input BOOT_CFG4[5]

EIM_EB2 Input BOOT_CFG4[6]

EIM_EB3 Input BOOT_CFG4[7]

1Pin value overrides fuse settings for BT_FUSE_SEL = ‘0’. Signal Configuration as Fuse Override Input at Power

Up. These are special I/O lines that control the boot up configuration during product development. In production,

the boot configuration can be controlled by fuses.

Table 85. Interface Allocation During Boot

Interface IP Instance Allocated Pads During Boot Comment

SPI ECSPI-1 EIM_D17, EIM_D18, EIM_D16, EIM_EB2, EIM_D19,

EIM_D24, EIM_D25

—

SPI ECSPI-2 CSI0_DAT10, CSI0_DAT9, CSI0_DAT8, CSI0_DAT11,

EIM_LBA, EIM_D24, EIM_D25

—

SPI ECSPI-3 DISP0_DAT2, DISP0_DAT1, DISP0_DAT0,

DISP0_DAT3, DISP0_DAT4, DISP0_DAT5, DISP0_DAT6

—

Table 84. Fuses and Associated Pins Used for Boot (continued)

Pin Direction at Reset eFuse Name

Package Information and Contact Assignments

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6 Package Information and Contact Assignments

This section includes the contact assignment information and mechanical package drawing.

6.1 Updated Signal Naming Convention

The signal names of the i.MX6 series of products have been standardized to better align the signal names

within the family and across the documentation. Some of the benefits of these changes are as follows:

• The names are unique within the scope of an SoC and within the series of products

• Searches will return all occurrences of the named signal

• The names are consistent between i.MX 6 series products implementing the same modules

• The module instance is incorporated into the signal name

This change applies only to signal names. The original ball names have been preserved to prevent the need

to change schematics, BSDL models, IBIS models, etc.

SPI ECSPI-4 EIM_D22, EIM_D28, EIM_D21, EIM_D20, EIM_A25,

EIM_D24, EIM_D25

—

EIM EIM EIM_DA[15:0], EIM_D[31:16], CSI0_DAT[19:4],

CSI0_DATA_EN, CSI0_VSYNC

Used for NOR, OneNAND boot

Only CS0 is supported

NAND Flash GPMI NANDF_CLE, NANDF_ALE, NANDF_WP_B,

SD4_CMD, SD4_CLK, NANDF_RB0, SD4_DAT0,

NANDF_CS0, NANDF_CS1, NANDF_CS2,

NANDF_CS3, NANDF_D[7:0]

8 bit

Only CS0 is supported

SD/MMC USDHC-1 SD1_CLK, SD1_CMD, SD1_DAT0, SD1_DAT1,

SD1_DAT2, SD1_DAT3, GPIO_1, NANDF_D0,

NANDF_D1, NANDF_D2, NANDF_D3, KEY_COL1

1, 4, or 8 bit

SD/MMC USDHC-2 SD2_CLK, SD2_CMD, SD2_DAT0, SD2_DAT1,

SD2_DAT2, SD2_DAT3, GPIO_4, NANDF_D4,

NANDF_D5, NANDF_D6, NANDF_D7, KEY_ROW1

1, 4, or 8 bit

SD/MMC USDHC-3 SD3_CLK, SD3_CMD, SD3_DAT0, SD3_DAT1,

SD3_DAT2, SD3_DAT3, SD3_DAT4, SD3_DAT5,

SD3_DAT6, SD3_DAT7, SD3_RST, GPIO_18

1, 4, or 8 bit

SD/MMC USDHC-4 SD4_CLK, SD4_CMD, SD4_DAT0, SD4_DAT1,

SD4_DAT2, SD4_DAT3, SD4_DAT4, SD4_DAT5,

SD4_DAT6, SD4_DAT7, NANDF_ALE, NANDF_CS1

1, 4, or 8 bit

I2CI

2C-1 EIM_D28, EIM_D21 —

I2CI

2C-2 EIM_D16, EIM_EB2 —

I2CI

2C-3 EIM_D18, EIM_D17 —

USB USB-OTG

PHY

USB_OTG_DP

USB_OTG_DN

USB_OTG_VBUS

—

Table 85. Interface Allocation During Boot (continued)

Interface IP Instance Allocated Pads During Boot Comment

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130 NXP Semiconductors

Package Information and Contact Assignments

Throughout this document, the updated signal names are used except where referenced as a ball name

(such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal

name changes is in the document, IMX 6 Series Signal Name Mapping (EB792). This list can be used to

map the signal names used in older documentation to the new standardized naming conventions.

6.2 21x21 mm Package Information

6.2.1 Case 2240, 21 x 21 mm, 0.8 mm Pitch, 25 x 25 Ball Matrix

Figure 97 shows the top, bottom, and side views of the 21×21 mm BGA package.

Package Information and Contact Assignments

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NXP Semiconductors 131

Figure 97. 21 x 21 mm BGA, Case 2240 Package Top, Bottom, and Side Views

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132 NXP Semiconductors

Package Information and Contact Assignments

Table 86 shows the 21 ×21 mm BGA package details.

Table 86. 21 x 21, 0.8 mm BGA Package Details

Parameter Symbol

Common Dimensions

Minimum Normal Maximum

Total Thickness A — — 1.6

Stand Off A1 0.36 — 0.46

Substrate Thickness A2 0.26 REF

Mold Thickness A3 0.7 REF

Body Size D 21 BSC

E 21 BSC

Ball Diameter — 0.5

Ball Opening — 0.4

Ball Width b 0.44 — 0.64

Ball Pitch e 0.8 BSC

Ball Count n 624

Edge Ball Center to Center D1 19.2 BSC

E1 19.2 BSC

Body Center to Contact Ball SD —

SE —

Package Edge Tolerance aaa 0.1

Mold Flatness bbb 0.2

Coplanarity ddd 0.15

Ball Offset (Package) eee 0.15

Ball Offset (Ball) fff 0.08

Package Information and Contact Assignments

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6.2.2 21 x 21 mm Supplies Contact Assignments and Functional Contact

Assignments

Table 87 shows supplies contact assignments for the 21 x 21 mm package.

Table 87. 21 x 21 mm Supplies Contact Assignments

Supply Rail Name Ball(s) Position(s) Remark

CSI_REXT D4 —

DRAM_VREF AC2 —

DSI_REXT G4 —

GND A4, A8, A13, A25, B4, C1, C4, C6, C10, D3, D6, D8, E5,

E6, E7, F5, F6, F7, F8, G3, G10, G19, H8, H12, H15,

H18, J2, J8, J12, J15, J18, K8, K10, K12, K15, K18, L2,

L5, L8, L10, L12, L15, L18, M8, M10, M12, M15, M18,

N8, N10, N15, N18, P8, P10, P12, P15, P18, R8, R12,

R15, R17, T8, T11, T12, T15, T17, T19, U8, U11, U12,

U15, U17, U19, V8, V19, W3, W7, W8, W9, W10, W11,

W12, W13, W15, W16, W17, W18, W19, Y5, Y24, AA7,

AA10, AA13, AA16, AA19, AA22, AB3, AB24, AD4,

AD7, AD10, AD13, AD16, AD19, AD22, AE1, AE25

—

HDMI_REF J1 —

HDMI_VP L7 —

HDMI_VPH M7 —

NVCC_CSI N7 Supply of the camera sensor interface

NVCC_DRAM R18, T18, U18, V9, V10, V11, V12, V13, V14, V15, V16,

V17, V18

Supply of the DDR interface

NVCC_EIM K19, L19, M19 Supply of the EIM interface

NVCC_ENET R19 Supply of the ENET interface

NVCC_GPIO P7 Supply of the GPIO interface

NVCC_JTAG J7 Supply of the JTAG tap controller interface

NVCC_LCD P19 Supply of the LCD interface

NVCC_LVDS2P5 V7 Supply of the LVDS display interface and DDR

pre-drivers

NVCC_MIPI K7 Supply of the MIPI interface

NVCC_NANDF G15 Supply of the raw NAND Flash memories

interface

NVCC_PLL_OUT E8 —

NVCC_RGMII G18 Supply of the ENET interface

NVCC_SD1 G16 Supply of the SD card interface

NVCC_SD2 G17 Supply of the SD card interface

NVCC_SD3 G14 Supply of the SD card interface

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Package Information and Contact Assignments

PCIE_REXT A2 —

PCIE_VP H7 —

PCIE_VPH G7 PCI PHY supply

PCIE_VPTX G8 PCI PHY supply

VDD_SNVS_CAP G9 Secondary supply for the SNVS (internal

regulator output—requires capacitor if internal

regulator is used)

VDD_SNVS_IN G11 Primary supply for the SNVS regulator

VDDARM_CAP H11, H13, J11, J13, K11, K13, L11, L13, M11, M13,

N11, N13, P11, P13, R11, R13

Secondary supply for core (internal regulator

output—requires capacitor if internal regulator

is used)

VDDARM_IN H14, J14, K9, K14, L9, L14, M9, M14, N9, N14, P9,

P14, R9, R14, T9, U9

Primary supply for the Arm core’s regulator

VDDHIGH_CAP H10, J10 Secondary supply for the 2.5 V domain

(internal regulator output—requires capacitor

if internal regulator is used)

VDDHIGH_IN H9, J9 Primary supply for the 2.5 V regulator

VDDPU_CAP H17, J17, K17, L17, M17, N17, P17 Secondary supply for VPU and GPUs

(internal regulator output—requires capacitor

if internal regulator is used)

VDDSOC_CAP R10, T10, T13, T14, U10, U13, U14 Secondary supply for SoC and PU regulators

(internal regulator output—requires capacitor

if internal regulator is used)

VDDSOC_IN H16, J16, K16, L16, M16, N16, P16, R16, T16, U16 Primary supply for SoC and PU regulators

VDDUSB_CAP F9 Secondary supply for the 3 V Domain (internal

regulator output—requires capacitor if internal

regulator is used)

USB_H1_VBUS D10 Primary supply for the 3 V regulator

USB_OTG_VBUS E9 Primary supply for the 3 V regulator

HDMI_DDCCEC K2 Analog Ground (Ground reference for the Hot

Plug Detect signal)

FA_ANA A5 —

GPANAIO C8 Analog output for NXP use only. This output

must remain unconnected.

VDD_FA B5 —

Table 87. 21 x 21 mm Supplies Contact Assignments (continued)

Supply Rail Name Ball(s) Position(s) Remark

Package Information and Contact Assignments

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NXP Semiconductors 135

Table 88 shows an alpha-sorted list of functional contact assignments for the 21 x 21 mm package.

ZQPAD AE17 Connect ZQPAD to an external 240 Ω 1%

resistor to GND. This is a reference used

during DRAM output buffer driver calibration.

NC For i.MX 6DualLite:

A9, A10, A11, A12, A14, B9, B10, B11, B12, B14, C14,

E1, E2, F1, F2, G12, G13, N12

For i.MX 6Solo:

A9, A10, A11, A12, A14, B9, B10, B11, B12, B14, C14,

E1, E2, F1, F2, G12, G13, N12, W25, Y17, Y18, Y19,

Y20, Y21, Y22, Y23, Y25, AA17, AA18, AA20, AA21,

AA23, AA24, AA25, AB18, AB19, AB20, AB21, AB22,

AB23, AB25, AC18, AC19, AC20, AC21, AC22, AC23,

AC24, AC25, AD18, AD20, AD21, AD23, AD24, AD25,

AE18, AE19, AE20, AE21, AE22, AE23, AE24

These signals are not functional and must

remain unconnected by the user.

Table 88. 21 x 21 mm Functional Contact Assignments

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

BOOT_MODE0 C12 VDD_SNVS_IN GPIO ALT0 SRC_BOOT_MODE0 Input 100 kΩ pull-down

BOOT_MODE1 F12 VDD_SNVS_IN GPIO ALT0 SRC_BOOT_MODE1 Input 100 kΩ pull-down

CLK1_N C7 VDDHIGH_CAP — — CLK1_N — —

CLK1_P D7 VDDHIGH_CAP — — CLK1_P — —

CLK2_N C5 VDDHIGH_CAP — — CLK2_N — —

CLK2_P D5 VDDHIGH_CAP — — CLK2_P — —

CSI_CLK0M F4 NVCC_MIPI ANALOG — CSI_CLK_N — —

CSI_CLK0P F3 NVCC_MIPI ANALOG — CSI_CLK_P — —

CSI_D0M E4 NVCC_MIPI ANALOG — CSI_DATA0_N — —

CSI_D0P E3 NVCC_MIPI ANALOG — CSI_DATA0_P — —

CSI_D1M D1 NVCC_MIPI ANALOG — CSI_DATA1_N — —

CSI_D1P D2 NVCC_MIPI ANALOG — CSI_DATA1_P — —

CSI0_DAT10 M1 NVCC_CSI GPIO ALT5 GPIO5_IO28 Input 100 kΩ pull-up

CSI0_DAT11 M3 NVCC_CSI GPIO ALT5 GPIO5_IO29 Input 100 kΩ pull-up

CSI0_DAT12 M2 NVCC_CSI GPIO ALT5 GPIO5_IO30 Input 100 kΩ pull-up

CSI0_DAT13 L1 NVCC_CSI GPIO ALT5 GPIO5_IO31 Input 100 kΩ pull-up

CSI0_DAT14 M4 NVCC_CSI GPIO ALT5 GPIO6_IO00 Input 100 kΩ pull-up

CSI0_DAT15 M5 NVCC_CSI GPIO ALT5 GPIO6_IO01 Input 100 kΩ pull-up

CSI0_DAT16 L4 NVCC_CSI GPIO ALT5 GPIO6_IO02 Input 100 kΩ pull-up

Table 87. 21 x 21 mm Supplies Contact Assignments (continued)

Supply Rail Name Ball(s) Position(s) Remark

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Package Information and Contact Assignments

CSI0_DAT17 L3 NVCC_CSI GPIO ALT5 GPIO6_IO03 Input 100 kΩ pull-up

CSI0_DAT18 M6 NVCC_CSI GPIO ALT5 GPIO6_IO04 Input 100 kΩ pull-up

CSI0_DAT19 L6 NVCC_CSI GPIO ALT5 GPIO6_IO05 Input 100 kΩ pull-up

CSI0_DAT4 N1 NVCC_CSI GPIO ALT5 GPIO5_IO22 Input 100 kΩ pull-up

CSI0_DAT5 P2 NVCC_CSI GPIO ALT5 GPIO5_IO23 Input 100 kΩ pull-up

CSI0_DAT6 N4 NVCC_CSI GPIO ALT5 GPIO5_IO24 Input 100 kΩ pull-up

CSI0_DAT7 N3 NVCC_CSI GPIO ALT5 GPIO5_IO25 Input 100 kΩ pull-up

CSI0_DAT8 N6 NVCC_CSI GPIO ALT5 GPIO5_IO26 Input 100 kΩ pull-up

CSI0_DAT9 N5 NVCC_CSI GPIO ALT5 GPIO5_IO27 Input 100 kΩ pull-up

CSI0_DATA_EN P3 NVCC_CSI GPIO ALT5 GPIO5_IO20 Input 100 kΩ pull-up

CSI0_MCLK P4 NVCC_CSI GPIO ALT5 GPIO5_IO19 Input 100 kΩ pull-up

CSI0_PIXCLK P1 NVCC_CSI GPIO ALT5 GPIO5_IO18 Input 100 kΩ pull-up

CSI0_VSYNC N2 NVCC_CSI GPIO ALT5 GPIO5_IO21 Input 100 kΩ pull-up

DI0_DISP_CLK N19 NVCC_LCD GPIO ALT5 GPIO4_IO16 Input 100 kΩ pull-up

DI0_PIN15 N21 NVCC_LCD GPIO ALT5 GPIO4_IO17 Input 100 kΩ pull-up

DI0_PIN2 N25 NVCC_LCD GPIO ALT5 GPIO4_IO18 Input 100 kΩ pull-up

DI0_PIN3 N20 NVCC_LCD GPIO ALT5 GPIO4_IO19 Input 100 kΩ pull-up

DI0_PIN4 P25 NVCC_LCD GPIO ALT5 GPIO4_IO20 Input 100 kΩ pull-up

DISP0_DAT0 P24 NVCC_LCD GPIO ALT5 GPIO4_IO21 Input 100 kΩ pull-up

DISP0_DAT1 P22 NVCC_LCD GPIO ALT5 GPIO4_IO22 Input 100 kΩ pull-up

DISP0_DAT10 R21 NVCC_LCD GPIO ALT5 GPIO4_IO31 Input 100 kΩ pull-up

DISP0_DAT11 T23 NVCC_LCD GPIO ALT5 GPIO5_IO05 Input 100 kΩ pull-up

DISP0_DAT12 T24 NVCC_LCD GPIO ALT5 GPIO5_IO06 Input 100 kΩ pull-up

DISP0_DAT13 R20 NVCC_LCD GPIO ALT5 GPIO5_IO07 Input 100 kΩ pull-up

DISP0_DAT14 U25 NVCC_LCD GPIO ALT5 GPIO5_IO08 Input 100 kΩ pull-up

DISP0_DAT15 T22 NVCC_LCD GPIO ALT5 GPIO5_IO09 Input 100 kΩ pull-up

DISP0_DAT16 T21 NVCC_LCD GPIO ALT5 GPIO5_IO10 Input 100 kΩ pull-up

DISP0_DAT17 U24 NVCC_LCD GPIO ALT5 GPIO5_IO11 Input 100 kΩ pull-up

DISP0_DAT18 V25 NVCC_LCD GPIO ALT5 GPIO5_IO12 Input 100 kΩ pull-up

DISP0_DAT19 U23 NVCC_LCD GPIO ALT5 GPIO5_IO13 Input 100 kΩ pull-up

DISP0_DAT2 P23 NVCC_LCD GPIO ALT5 GPIO4_IO23 Input 100 kΩ pull-up

DISP0_DAT20 U22 NVCC_LCD GPIO ALT5 GPIO5_IO14 Input 100 kΩ pull-up

DISP0_DAT21 T20 NVCC_LCD GPIO ALT5 GPIO5_IO15 Input 100 kΩ pull-up

DISP0_DAT22 V24 NVCC_LCD GPIO ALT5 GPIO5_IO16 Input 100 kΩ pull-up

DISP0_DAT23 W24 NVCC_LCD GPIO ALT5 GPIO5_IO17 Input 100 kΩ pull-up

DISP0_DAT3 P21 NVCC_LCD GPIO ALT5 GPIO4_IO24 Input 100 kΩ pull-up

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

Package Information and Contact Assignments

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DISP0_DAT4 P20 NVCC_LCD GPIO ALT5 GPIO4_IO25 Input 100 kΩ pull-up

DISP0_DAT5 R25 NVCC_LCD GPIO ALT5 GPIO4_IO26 Input 100 kΩ pull-up

DISP0_DAT6 R23 NVCC_LCD GPIO ALT5 GPIO4_IO27 Input 100 kΩ pull-up

DISP0_DAT7 R24 NVCC_LCD GPIO ALT5 GPIO4_IO28 Input 100 kΩ pull-up

DISP0_DAT8 R22 NVCC_LCD GPIO ALT5 GPIO4_IO29 Input 100 kΩ pull-up

DISP0_DAT9 T25 NVCC_LCD GPIO ALT5 GPIO4_IO30 Input 100 kΩ pull-up

DRAM_A0 AC14 NVCC_DRAM DDR ALT0 DRAM_ADDR00 Output Low

DRAM_A1 AB14 NVCC_DRAM DDR ALT0 DRAM_ADDR01 Output Low

DRAM_A10 AA15 NVCC_DRAM DDR ALT0 DRAM_ADDR10 Output Low

DRAM_A11 AC12 NVCC_DRAM DDR ALT0 DRAM_ADDR11 Output Low

DRAM_A12 AD12 NVCC_DRAM DDR ALT0 DRAM_ADDR12 Output Low

DRAM_A13 AC17 NVCC_DRAM DDR ALT0 DRAM_ADDR13 Output Low

DRAM_A14 AA12 NVCC_DRAM DDR ALT0 DRAM_ADDR14 Output Low

DRAM_A15 Y12 NVCC_DRAM DDR ALT0 DRAM_ADDR15 Output Low

DRAM_A2 AA14 NVCC_DRAM DDR ALT0 DRAM_ADDR02 Output Low

DRAM_A3 Y14 NVCC_DRAM DDR ALT0 DRAM_ADDR03 Output Low

DRAM_A4 W14 NVCC_DRAM DDR ALT0 DRAM_ADDR04 Output Low

DRAM_A5 AE13 NVCC_DRAM DDR ALT0 DRAM_ADDR05 Output Low

DRAM_A6 AC13 NVCC_DRAM DDR ALT0 DRAM_ADDR06 Output Low

DRAM_A7 Y13 NVCC_DRAM DDR ALT0 DRAM_ADDR07 Output Low

DRAM_A8 AB13 NVCC_DRAM DDR ALT0 DRAM_ADDR08 Output Low

DRAM_A9 AE12 NVCC_DRAM DDR ALT0 DRAM_ADDR09 Output Low

DRAM_CAS AE16 NVCC_DRAM DDR ALT0 DRAM_CAS Output Low

DRAM_CS0 Y16 NVCC_DRAM DDR ALT0 DRAM_CS0 Output Low

DRAM_CS1 AD17 NVCC_DRAM DDR ALT0 DRAM_CS1 Output Low

DRAM_D0 AD2 NVCC_DRAM DDR ALT0 DRAM_DATA00 Input 100 kΩ pull-up

DRAM_D1 AE2 NVCC_DRAM DDR ALT0 DRAM_DATA01 Input 100 kΩ pull-up

DRAM_D10 AA6 NVCC_DRAM DDR ALT0 DRAM_DATA10 Input 100 kΩ pull-up

DRAM_D11 AE7 NVCC_DRAM DDR ALT0 DRAM_DATA11 Input 100 kΩ pull-up

DRAM_D12 AB5 NVCC_DRAM DDR ALT0 DRAM_DATA12 Input 100 kΩ pull-up

DRAM_D13 AC5 NVCC_DRAM DDR ALT0 DRAM_DATA13 Input 100 kΩ pull-up

DRAM_D14 AB6 NVCC_DRAM DDR ALT0 DRAM_DATA14 Input 100 kΩ pull-up

DRAM_D15 AC7 NVCC_DRAM DDR ALT0 DRAM_DATA15 Input 100 kΩ pull-up

DRAM_D16 AB7 NVCC_DRAM DDR ALT0 DRAM_DATA16 Input 100 kΩ pull-up

DRAM_D17 AA8 NVCC_DRAM DDR ALT0 DRAM_DATA17 Input 100 kΩ pull-up

DRAM_D18 AB9 NVCC_DRAM DDR ALT0 DRAM_DATA18 Input 100 kΩ pull-up

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

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DRAM_D19 Y9 NVCC_DRAM DDR ALT0 DRAM_DATA19 Input 100 kΩ pull-up

DRAM_D2 AC4 NVCC_DRAM DDR ALT0 DRAM_DATA02 Input 100 kΩ pull-up

DRAM_D20 Y7 NVCC_DRAM DDR ALT0 DRAM_DATA20 Input 100 kΩ pull-up

DRAM_D21 Y8 NVCC_DRAM DDR ALT0 DRAM_DATA21 Input 100 kΩ pull-up

DRAM_D22 AC8 NVCC_DRAM DDR ALT0 DRAM_DATA22 Input 100 kΩ pull-up

DRAM_D23 AA9 NVCC_DRAM DDR ALT0 DRAM_DATA23 Input 100 kΩ pull-up

DRAM_D24 AE9 NVCC_DRAM DDR ALT0 DRAM_DATA24 Input 100 kΩ pull-up

DRAM_D25 Y10 NVCC_DRAM DDR ALT0 DRAM_DATA25 Input 100 kΩ pull-up

DRAM_D26 AE11 NVCC_DRAM DDR ALT0 DRAM_DATA26 Input 100 kΩ pull-up

DRAM_D27 AB11 NVCC_DRAM DDR ALT0 DRAM_DATA27 Input 100 kΩ pull-up

DRAM_D28 AC9 NVCC_DRAM DDR ALT0 DRAM_DATA28 Input 100 kΩ pull-up

DRAM_D29 AD9 NVCC_DRAM DDR ALT0 DRAM_DATA29 Input 100 kΩ pull-up

DRAM_D3 AA5 NVCC_DRAM DDR ALT0 DRAM_DATA03 Input 100 kΩ pull-up

DRAM_D30 AD11 NVCC_DRAM DDR ALT0 DRAM_DATA30 Input 100 kΩ pull-up

DRAM_D31 AC11 NVCC_DRAM DDR ALT0 DRAM_DATA31 Input 100 kΩ pull-up

Note: DRAM_D32 to DRAM_D63 are only available for i.MX 6DualLite chip; for i.MX 6Solo chip, these pins are NC.

DRAM_D32 AA17 NVCC_DRAM DDR ALT0 DRAM_DATA32 Input 100 kΩ pull-up

DRAM_D33 AA18 NVCC_DRAM DDR ALT0 DRAM_DATA33 Input 100 kΩ pull-up

DRAM_D34 AC18 NVCC_DRAM DDR ALT0 DRAM_DATA34 Input 100 kΩ pull-up

DRAM_D35 AE19 NVCC_DRAM DDR ALT0 DRAM_DATA35 Input 100 kΩ pull-up

DRAM_D36 Y17 NVCC_DRAM DDR ALT0 DRAM_DATA36 Input 100 kΩ pull-up

DRAM_D37 Y18 NVCC_DRAM DDR ALT0 DRAM_DATA37 Input 100 kΩ pull-up

DRAM_D38 AB19 NVCC_DRAM DDR ALT0 DRAM_DATA38 Input 100 kΩ pull-up

DRAM_D39 AC19 NVCC_DRAM DDR ALT0 DRAM_DATA39 Input 100 kΩ pull-up

DRAM_D40 Y19 NVCC_DRAM DDR ALT0 DRAM_DATA40 Input 100 kΩ pull-up

DRAM_D41 AB20 NVCC_DRAM DDR ALT0 DRAM_DATA41 Input 100 kΩ pull-up

DRAM_D42 AB21 NVCC_DRAM DDR ALT0 DRAM_DATA42 Input 100 kΩ pull-up

DRAM_D43 AD21 NVCC_DRAM DDR ALT0 DRAM_DATA43 Input 100 kΩ pull-up

DRAM_D44 Y20 NVCC_DRAM DDR ALT0 DRAM_DATA44 Input 100 kΩ pull-up

DRAM_D45 AA20 NVCC_DRAM DDR ALT0 DRAM_DATA45 Input 100 kΩ pull-up

DRAM_D46 AE21 NVCC_DRAM DDR ALT0 DRAM_DATA46 Input 100 kΩ pull-up

DRAM_D47 AC21 NVCC_DRAM DDR ALT0 DRAM_DATA47 Input 100 kΩ pull-up

DRAM_D48 AC22 NVCC_DRAM DDR ALT0 DRAM_DATA48 Input 100 kΩ pull-up

DRAM_D49 AE22 NVCC_DRAM DDR ALT0 DRAM_DATA49 Input 100 kΩ pull-up

DRAM_D50 AE24 NVCC_DRAM DDR ALT0 DRAM_DATA50 Input 100 kΩ pull-up

DRAM_D51 AC24 NVCC_DRAM DDR ALT0 DRAM_DATA51 Input 100 kΩ pull-up

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

Package Information and Contact Assignments

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DRAM_D52 AB22 NVCC_DRAM DDR ALT0 DRAM_DATA52 Input 100 kΩ pull-up

DRAM_D53 AC23 NVCC_DRAM DDR ALT0 DRAM_DATA53 Input 100 kΩ pull-up

DRAM_D54 AD25 NVCC_DRAM DDR ALT0 DRAM_DATA54 Input 100 kΩ pull-up

DRAM_D55 AC25 NVCC_DRAM DDR ALT0 DRAM_DATA55 Input 100 kΩ pull-up

DRAM_D56 AB25 NVCC_DRAM DDR ALT0 DRAM_DATA56 Input 100 kΩ pull-up

DRAM_D57 AA21 NVCC_DRAM DDR ALT0 DRAM_DATA57 Input 100 kΩ pull-up

DRAM_D58 Y25 NVCC_DRAM DDR ALT0 DRAM_DATA58 Input 100 kΩ pull-up

DRAM_D59 Y22 NVCC_DRAM DDR ALT0 DRAM_DATA59 Input 100 kΩ pull-up

DRAM_D60 AB23 NVCC_DRAM DDR ALT0 DRAM_DATA60 Input 100 kΩ pull-up

DRAM_D61 AA23 NVCC_DRAM DDR ALT0 DRAM_DATA61 Input 100 kΩ pull-up

DRAM_D62 Y23 NVCC_DRAM DDR ALT0 DRAM_DATA62 Input 100 kΩ pull-up

DRAM_D63 W25 NVCC_DRAM DDR ALT0 DRAM_DATA63 Input 100 kΩ pull-up

DRAM_D4 AC1 NVCC_DRAM DDR ALT0 DRAM_DATA04 Input 100 kΩ pull-up

DRAM_D5 AD1 NVCC_DRAM DDR ALT0 DRAM_DATA05 Input 100 kΩ pull-up

DRAM_D6 AB4 NVCC_DRAM DDR ALT0 DRAM_DATA06 Input 100 kΩ pull-up

DRAM_D7 AE4 NVCC_DRAM DDR ALT0 DRAM_DATA07 Input 100 kΩ pull-up

DRAM_D8 AD5 NVCC_DRAM DDR ALT0 DRAM_DATA08 Input 100 kΩ pull-up

DRAM_D9 AE5 NVCC_DRAM DDR ALT0 DRAM_DATA09 Input 100 kΩ pull-up

DRAM_DQM0 AC3 NVCC_DRAM DDR ALT0 DRAM_DQM0 Output Low

DRAM_DQM1 AC6 NVCC_DRAM DDR ALT0 DRAM_DQM1 Output Low

DRAM_DQM2 AB8 NVCC_DRAM DDR ALT0 DRAM_DQM2 Output Low

DRAM_DQM3 AE10 NVCC_DRAM DDR ALT0 DRAM_DQM3 Output Low

DRAM_DQM4 AB18 NVCC_DRAM DDR ALT0 DRAM_DQM4 Output Low

DRAM_DQM5 AC20 NVCC_DRAM DDR ALT0 DRAM_DQM5 Output Low

DRAM_DQM6 AD24 NVCC_DRAM DDR ALT0 DRAM_DQM6 Output Low

DRAM_DQM7 Y21 NVCC_DRAM DDR ALT0 DRAM_DQM7 Output Low

DRAM_RAS AB15 NVCC_DRAM DDR ALT0 DRAM_RAS Output Low

DRAM_RESET Y6 NVCC_DRAM DDR ALT0 DRAM_RESET Output Low

DRAM_SDBA0 AC15 NVCC_DRAM DDR ALT0 DRAM_SDBA0 Output Low

DRAM_SDBA1 Y15 NVCC_DRAM DDR ALT0 DRAM_SDBA1 Output Low

DRAM_SDBA2 AB12 NVCC_DRAM DDR ALT0 DRAM_SDBA2 Output Low

DRAM_SDCKE0 Y11 NVCC_DRAM DDR ALT0 DRAM_SDCKE0 Output Low

DRAM_SDCKE1 AA11 NVCC_DRAM DDR ALT0 DRAM_SDCKE1 Output Low

DRAM_SDCLK_0 AD15 NVCC_DRAM DDRCLK ALT0 DRAM_SDCLK0_P Output Low

DRAM_SDCLK_0_B AE15 NVCC_DRAM — — DRAM_SDCLK0_N — —

DRAM_SDCLK_1 AD14 NVCC_DRAM DDRCLK ALT0 DRAM_SDCLK1_P Output Low

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

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Package Information and Contact Assignments

DRAM_SDCLK_1_B AE14 NVCC_DRAM — — DRAM_SDCLK1_N — —

DRAM_SDODT0 AC16 NVCC_DRAM DDR ALT0 DRAM_ODT0 Output Low

DRAM_SDODT1 AB17 NVCC_DRAM DDR ALT0 DRAM_ODT1 Output Low

DRAM_SDQS0 AE3 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS0_P Input Hi-Z

DRAM_SDQS0_B AD3 NVCC_DRAM — — DRAM_SDQS0_N — —

DRAM_SDQS1 AD6 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS1_P Input Hi-Z

DRAM_SDQS1_B AE6 NVCC_DRAM — — DRAM_SDQS1_N — —

DRAM_SDQS2 AD8 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS2_P Input Hi-Z

DRAM_SDQS2_B AE8 NVCC_DRAM — — DRAM_SDQS2_N — —

DRAM_SDQS3 AC10 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS3_P Input Hi-Z

DRAM_SDQS3_B AB10 NVCC_DRAM — — DRAM_SDQS3_N — —

DRAM_SDQS4 AD18 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS4_P Input Hi-Z

DRAM_SDQS4_B AE18 NVCC_DRAM — — DRAM_SDQS4_N — —

DRAM_SDQS5 AD20 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS5_P Input Hi-Z

DRAM_SDQS5_B AE20 NVCC_DRAM — — DRAM_SDQS5_N — —

DRAM_SDQS6 AD23 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS6_P Input Hi-Z

DRAM_SDQS6_B AE23 NVCC_DRAM — — DRAM_SDQS6_N — —

DRAM_SDQS7 AA25 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS7_P Input Hi-Z

DRAM_SDQS7_B AA24 NVCC_DRAM — — DRAM_SDQS7_N — —

DRAM_SDWE AB16 NVCC_DRAM DDR ALT0 DRAM_SDWE Output Low

DSI_CLK0M H3 NVCC_MIPI ANALOG — DSI_CLK_N — —

DSI_CLK0P H4 NVCC_MIPI ANALOG — DSI_CLK_P — —

DSI_D0M G2 NVCC_MIPI ANALOG — DSI_DATA0_N — —

DSI_D0P G1 NVCC_MIPI ANALOG — DSI_DATA0_P — —

DSI_D1M H2 NVCC_MIPI ANALOG — DSI_DATA1_N — —

DSI_D1P H1 NVCC_MIPI ANALOG — DSI_DATA1_P — —

EIM_A16 H25 NVCC_EIM GPIO ALT0 EIM_ADDR16 Output Low

EIM_A17 G24 NVCC_EIM GPIO ALT0 EIM_ADDR17 Output Low

EIM_A18 J22 NVCC_EIM GPIO ALT0 EIM_ADDR18 Output Low

EIM_A19 G25 NVCC_EIM GPIO ALT0 EIM_ADDR19 Output Low

EIM_A20 H22 NVCC_EIM GPIO ALT0 EIM_ADDR20 Output Low

EIM_A21 H23 NVCC_EIM GPIO ALT0 EIM_ADDR21 Output Low

EIM_A22 F24 NVCC_EIM GPIO ALT0 EIM_ADDR22 Output Low

EIM_A23 J21 NVCC_EIM GPIO ALT0 EIM_ADDR23 Output Low

EIM_A24 F25 NVCC_EIM GPIO ALT0 EIM_ADDR24 Output Low

EIM_A25 H19 NVCC_EIM GPIO ALT0 EIM_ADDR25 Output Low

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

Package Information and Contact Assignments

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NXP Semiconductors 141

EIM_BCLK N22 NVCC_EIM GPIO ALT0 EIM_BCLK Output Low

EIM_CS0 H24 NVCC_EIM GPIO ALT0 EIM_CS0 Output High

EIM_CS1 J23 NVCC_EIM GPIO ALT0 EIM_CS1 Output High

EIM_D16 C25 NVCC_EIM GPIO ALT5 GPIO3_IO16 Input 100 kΩ pull-up

EIM_D17 F21 NVCC_EIM GPIO ALT5 GPIO3_IO17 Input 100 kΩ pull-up

EIM_D18 D24 NVCC_EIM GPIO ALT5 GPIO3_IO18 Input 100 kΩ pull-up

EIM_D19 G21 NVCC_EIM GPIO ALT5 GPIO3_IO19 Input 100 kΩ pull-up

EIM_D20 G20 NVCC_EIM GPIO ALT5 GPIO3_IO20 Input 100 kΩ pull-up

EIM_D21 H20 NVCC_EIM GPIO ALT5 GPIO3_IO21 Input 100 kΩ pull-up

EIM_D22 E23 NVCC_EIM GPIO ALT5 GPIO3_IO22 Input 100 kΩ pull-down

EIM_D23 D25 NVCC_EIM GPIO ALT5 GPIO3_IO23 Input 100 kΩ pull-up

EIM_D24 F22 NVCC_EIM GPIO ALT5 GPIO3_IO24 Input 100 kΩ pull-up

EIM_D25 G22 NVCC_EIM GPIO ALT5 GPIO3_IO25 Input 100 kΩ pull-up

EIM_D26 E24 NVCC_EIM GPIO ALT5 GPIO3_IO26 Input 100 kΩ pull-up

EIM_D27 E25 NVCC_EIM GPIO ALT5 GPIO3_IO27 Input 100 kΩ pull-up

EIM_D28 G23 NVCC_EIM GPIO ALT5 GPIO3_IO28 Input 100 kΩ pull-up

EIM_D29 J19 NVCC_EIM GPIO ALT5 GPIO3_IO29 Input 100 kΩ pull-up

EIM_D30 J20 NVCC_EIM GPIO ALT5 GPIO3_IO30 Input 100 kΩ pull-up

EIM_D31 H21 NVCC_EIM GPIO ALT5 GPIO3_IO31 Input 100 kΩ pull-down

EIM_DA0 L20 NVCC_EIM GPIO ALT0 EIM_AD00 Input 100 kΩ pull-up

EIM_DA1 J25 NVCC_EIM GPIO ALT0 EIM_AD01 Input 100 kΩ pull-up

EIM_DA10 M22 NVCC_EIM GPIO ALT0 EIM_AD10 Input 100 kΩ pull-up

EIM_DA11 M20 NVCC_EIM GPIO ALT0 EIM_AD11 Input 100 kΩ pull-up

EIM_DA12 M24 NVCC_EIM GPIO ALT0 EIM_AD12 Input 100 kΩ pull-up

EIM_DA13 M23 NVCC_EIM GPIO ALT0 EIM_AD13 Input 100 kΩ pull-up

EIM_DA14 N23 NVCC_EIM GPIO ALT0 EIM_AD14 Input 100 kΩ pull-up

EIM_DA15 N24 NVCC_EIM GPIO ALT0 EIM_AD15 Input 100 kΩ pull-up

EIM_DA2 L21 NVCC_EIM GPIO ALT0 EIM_AD02 Input 100 kΩ pull-up

EIM_DA3 K24 NVCC_EIM GPIO ALT0 EIM_AD03 Input 100 kΩ pull-up

EIM_DA4 L22 NVCC_EIM GPIO ALT0 EIM_AD04 Input 100 kΩ pull-up

EIM_DA5 L23 NVCC_EIM GPIO ALT0 EIM_AD05 Input 100 kΩ pull-up

EIM_DA6 K25 NVCC_EIM GPIO ALT0 EIM_AD06 Input 100 kΩ pull-up

EIM_DA7 L25 NVCC_EIM GPIO ALT0 EIM_AD07 Input 100 kΩ pull-up

EIM_DA8 L24 NVCC_EIM GPIO ALT0 EIM_AD08 Input 100 kΩ pull-up

EIM_DA9 M21 NVCC_EIM GPIO ALT0 EIM_AD09 Input 100 kΩ pull-up

EIM_EB0 K21 NVCC_EIM GPIO ALT0 EIM_EB0 Output High

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

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142 NXP Semiconductors

Package Information and Contact Assignments

EIM_EB1 K23 NVCC_EIM GPIO ALT0 EIM_EB1 Output High

EIM_EB2 E22 NVCC_EIM GPIO ALT5 GPIO2_IO30 Input 100 kΩ pull-up

EIM_EB3 F23 NVCC_EIM GPIO ALT5 GPIO2_IO31 Input 100 kΩ pull-up

EIM_LBA K22 NVCC_EIM GPIO ALT0 EIM_LBA Output High

EIM_OE J24 NVCC_EIM GPIO ALT0 EIM_OE Output High

EIM_RW K20 NVCC_EIM GPIO ALT0 EIM_RW Output High

EIM_WAIT M25 NVCC_EIM GPIO ALT0 EIM_WAIT Input 100 kΩ pull-up

ENET_CRS_DV U21 NVCC_ENET GPIO ALT5 GPIO1_IO25 Input 100 kΩ pull-up

ENET_MDC V20 NVCC_ENET GPIO ALT5 GPIO1_IO31 Input 100 kΩ pull-up

ENET_MDIO V23 NVCC_ENET GPIO ALT5 GPIO1_IO22 Input 100 kΩ pull-up

ENET_REF_CLK3V22 NVCC_ENET GPIO ALT5 GPIO1_IO23 Input 100 kΩ pull-up

ENET_RX_ER W23 NVCC_ENET GPIO ALT5 GPIO1_IO24 Input 100 kΩ pull-up

ENET_RXD0 W21 NVCC_ENET GPIO ALT5 GPIO1_IO27 Input 100 kΩ pull-up

ENET_RXD1 W22 NVCC_ENET GPIO ALT5 GPIO1_IO26 Input 100 kΩ pull-up

ENET_TX_EN V21 NVCC_ENET GPIO ALT5 GPIO1_IO28 Input 100 kΩ pull-up

ENET_TXD0 U20 NVCC_ENET GPIO ALT5 GPIO1_IO30 Input 100 kΩ pull-up

ENET_TXD1 W20 NVCC_ENET GPIO ALT5 GPIO1_IO29 Input 100 kΩ pull-up

GPIO_0 T5 NVCC_GPIO GPIO ALT5 GPIO1_IO00 Input 100 kΩ pull-down

GPIO_1 T4 NVCC_GPIO GPIO ALT5 GPIO1_IO01 Input 100 kΩ pull-up

GPIO_16 R2 NVCC_GPIO GPIO ALT5 GPIO7_IO11 Input 100 kΩ pull-up

GPIO_17 R1 NVCC_GPIO GPIO ALT5 GPIO7_IO12 Input 100 kΩ pull-up

GPIO_18 P6 NVCC_GPIO GPIO ALT5 GPIO7_IO13 Input 100 kΩ pull-up

GPIO_19 P5 NVCC_GPIO GPIO ALT5 GPIO4_IO05 Input 100 kΩ pull-up

GPIO_2 T1 NVCC_GPIO GPIO ALT5 GPIO1_IO02 Input 100 kΩ pull-up

GPIO_3 R7 NVCC_GPIO GPIO ALT5 GPIO1_IO03 Input 100 kΩ pull-up

GPIO_4 R6 NVCC_GPIO GPIO ALT5 GPIO1_IO04 Input 100 kΩ pull-up

GPIO_5 R4 NVCC_GPIO GPIO ALT5 GPIO1_IO05 Input 100 kΩ pull-up

GPIO_6 T3 NVCC_GPIO GPIO ALT5 GPIO1_IO06 Input 100 kΩ pull-up

GPIO_7 R3 NVCC_GPIO GPIO ALT5 GPIO1_IO07 Input 100 kΩ pull-up

GPIO_8 R5 NVCC_GPIO GPIO ALT5 GPIO1_IO08 Input 100 kΩ pull-up

GPIO_9 T2 NVCC_GPIO GPIO ALT5 GPIO1_IO09 Input 100 kΩ pull-up

HDMI_CLKM J5 HDMI — — HDMI_TX_CLK_N — —

HDMI_CLKP J6 HDMI — — HDMI_TX_CLK_P — —

HDMI_D0M K5 HDMI — — HDMI_TX_DATA0_N — —

HDMI_D0P K6 HDMI — — HDMI_TX_DATA0_P — —

HDMI_D1M J3 HDMI — — HDMI_TX_DATA1_N — —

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

Package Information and Contact Assignments

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NXP Semiconductors 143

HDMI_D1P J4 HDMI — — HDMI_TX_DATA1_P — —

HDMI_D2M K3 HDMI — — HDMI_TX_DATA2_N — —

HDMI_D2P K4 HDMI — — HDMI_TX_DATA2_P — —

HDMI_HPD K1 HDMI — — HDMI_TX_HPD — —

JTAG_MOD H6 NVCC_JTAG GPIO ALT0 JTAG_MODE Input 100 kΩ pull-up

JTAG_TCK H5 NVCC_JTAG GPIO ALT0 JTAG_TCK Input 47 kΩ pull-up

JTAG_TDI G5 NVCC_JTAG GPIO ALT0 JTAG_TDI Input 47 kΩ pull-up

JTAG_TDO G6 NVCC_JTAG GPIO ALT0 JTAG_TDO Output Low

JTAG_TMS C3 NVCC_JTAG GPIO ALT0 JTAG_TMS Input 47 kΩ pull-up

JTAG_TRSTB C2 NVCC_JTAG GPIO ALT0 JTAG_TRSTB Input 47 kΩ pull-up

KEY_COL0 W5 NVCC_GPIO GPIO ALT5 GPIO4_IO06 Input 100 kΩ pull-up

KEY_COL1 U7 NVCC_GPIO GPIO ALT5 GPIO4_IO08 Input 100 kΩ pull-up

KEY_COL2 W6 NVCC_GPIO GPIO ALT5 GPIO4_IO10 Input 100 kΩ pull-up

KEY_COL3 U5 NVCC_GPIO GPIO ALT5 GPIO4_IO12 Input 100 kΩ pull-up

KEY_COL4 T6 NVCC_GPIO GPIO ALT5 GPIO4_IO14 Input 100 kΩ pull-up

KEY_ROW0 V6 NVCC_GPIO GPIO ALT5 GPIO4_IO07 Input 100 kΩ pull-up

KEY_ROW1 U6 NVCC_GPIO GPIO ALT5 GPIO4_IO09 Input 100 kΩ pull-up

KEY_ROW2 W4 NVCC_GPIO GPIO ALT5 GPIO4_IO11 Input 100 kΩ pull-up

KEY_ROW3 T7 NVCC_GPIO GPIO ALT5 GPIO4_IO13 Input 100 kΩ pull-up

KEY_ROW4 V5 NVCC_GPIO GPIO ALT5 GPIO4_IO15 Input 100 kΩ pull-down

LVDS0_CLK_N V4 NVCC_LVDS2P5 — — LVDS0_CLK_N — —

LVDS0_CLK_P V3 NVCC_LVDS2P5 — ALT0 LVDS0_CLK_P Input Keeper

LVDS0_TX0_N U2 NVCC_LVDS2P5 — — LVDS0_TX0_N — —

LVDS0_TX0_P U1 NVCC_LVDS2P5 — ALT0 LVDS0_TX0_P Input Keeper

LVDS0_TX1_N U4 NVCC_LVDS2P5 — — LVDS0_TX1_N — —

LVDS0_TX1_P U3 NVCC_LVDS2P5 — ALT0 LVDS0_TX1_P Input Keeper

LVDS0_TX2_N V2 NVCC_LVDS2P5 — — LVDS0_TX2_N — —

LVDS0_TX2_P V1 NVCC_LVDS2P5 — ALT0 LVDS0_TX2_P Input Keeper

LVDS0_TX3_N W2 NVCC_LVDS2P5 — — LVDS0_TX3_N — —

LVDS0_TX3_P W1 NVCC_LVDS2P5 — ALT0 LVDS0_TX3_P Input Keeper

LVDS1_CLK_N Y3 NVCC_LVDS2P5 — — LVDS1_CLK_N — —

LVDS1_CLK_P Y4 NVCC_LVDS2P5 — ALT0 LVDS1_CLK_P Input Keeper

LVDS1_TX0_N Y1 NVCC_LVDS2P5 — — LVDS1_TX0_N — —

LVDS1_TX0_P Y2 NVCC_LVDS2P5 — ALT0 LVDS1_TX0_P Input Keeper

LVDS1_TX1_N AA2 NVCC_LVDS2P5 — — LVDS1_TX1_N — —

LVDS1_TX1_P AA1 NVCC_LVDS2P5 — ALT0 LVDS1_TX1_P Input Keeper

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

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144 NXP Semiconductors

Package Information and Contact Assignments

LVDS1_TX2_N AB1 NVCC_LVDS2P5 — — LVDS1_TX2_N — —

LVDS1_TX2_P AB2 NVCC_LVDS2P5 — ALT0 LVDS1_TX2_P Input Keeper

LVDS1_TX3_N AA3 NVCC_LVDS2P5 — — LVDS1_TX3_N — —

LVDS1_TX3_P AA4 NVCC_LVDS2P5 — ALT0 LVDS1_TX3_P Input Keeper

NANDF_ALE A16 NVCC_NANDF GPIO ALT5 GPIO6_IO08 Input 100 kΩ pull-up

NANDF_CLE C15 NVCC_NANDF GPIO ALT5 GPIO6_IO07 Input 100 kΩ pull-up

NANDF_CS0 F15 NVCC_NANDF GPIO ALT5 GPIO6_IO11 Input 100 kΩ pull-up

NANDF_CS1 C16 NVCC_NANDF GPIO ALT5 GPIO6_IO14 Input 100 kΩ pull-up

NANDF_CS2 A17 NVCC_NANDF GPIO ALT5 GPIO6_IO15 Input 100 kΩ pull-up

NANDF_CS3 D16 NVCC_NANDF GPIO ALT5 GPIO6_IO16 Input 100 kΩ pull-up

NANDF_D0 A18 NVCC_NANDF GPIO ALT5 GPIO2_IO00 Input 100 kΩ pull-up

NANDF_D1 C17 NVCC_NANDF GPIO ALT5 GPIO2_IO01 Input 100 kΩ pull-up

NANDF_D2 F16 NVCC_NANDF GPIO ALT5 GPIO2_IO02 Input 100 kΩ pull-up

NANDF_D3 D17 NVCC_NANDF GPIO ALT5 GPIO2_IO03 Input 100 kΩ pull-up

NANDF_D4 A19 NVCC_NANDF GPIO ALT5 GPIO2_IO04 Input 100 kΩ pull-up

NANDF_D5 B18 NVCC_NANDF GPIO ALT5 GPIO2_IO05 Input 100 kΩ pull-up

NANDF_D6 E17 NVCC_NANDF GPIO ALT5 GPIO2_IO06 Input 100 kΩ pull-up

NANDF_D7 C18 NVCC_NANDF GPIO ALT5 GPIO2_IO07 Input 100 kΩ pull-up

NANDF_RB0 B16 NVCC_NANDF GPIO ALT5 GPIO6_IO10 Input 100 kΩ pull-up

NANDF_WP_B E15 NVCC_NANDF GPIO ALT5 GPIO6_IO09 Input 100 kΩ pull-up

ONOFF D12 VDD_SNVS_IN GPIO ALT0 SRC_ONOFF Input 100 kΩ pull-up

PCIE_RXM B1 PCIE_VPH — — PCIE_RX_N — —

PCIE_RXP B2 PCIE_VPH — — PCIE_RX_P — —

PCIE_TXM A3 PCIE_VPH — — PCIE_TX_N — —

PCIE_TXP B3 PCIE_VPH — — PCIE_TX_P — —

PMIC_ON_REQ D11 VDD_SNVS_IN GPIO ALT0 SNVS_PMIC_ON_REQ Output Open drain with

PU(100K) enable

PMIC_STBY_REQ F11 VDD_SNVS_IN GPIO ALT0 CCM_PMIC_STBY_REQ Output Low

POR_B C11 VDD_SNVS_IN GPIO ALT0 SRC_POR_B Input 100 kΩ pull-up

RGMII_RD0 C24 NVCC_RGMII DDR ALT5 GPIO6_IO25 Input 100 kΩ pull-up

RGMII_RD1 B23 NVCC_RGMII DDR ALT5 GPIO6_IO27 Input 100 kΩ pull-up

RGMII_RD2 B24 NVCC_RGMII DDR ALT5 GPIO6_IO28 Input 100 kΩ pull-up

RGMII_RD3 D23 NVCC_RGMII DDR ALT5 GPIO6_IO29 Input 100 kΩ pull-up

RGMII_RX_CTL D22 NVCC_RGMII DDR ALT5 GPIO6_IO24 Input 100 kΩ pull-down

RGMII_RXC B25 NVCC_RGMII DDR ALT5 GPIO6_IO30 Input 100 kΩ pull-down

RGMII_TD0 C22 NVCC_RGMII DDR ALT5 GPIO6_IO20 Input 100 kΩ pull-up

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

Package Information and Contact Assignments

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NXP Semiconductors 145

RGMII_TD1 F20 NVCC_RGMII DDR ALT5 GPIO6_IO21 Input 100 kΩ pull-up

RGMII_TD2 E21 NVCC_RGMII DDR ALT5 GPIO6_IO22 Input 100 kΩ pull-up

RGMII_TD3 A24 NVCC_RGMII DDR ALT5 GPIO6_IO23 Input 100 kΩ pull-up

RGMII_TX_CTL C23 NVCC_RGMII DDR ALT5 GPIO6_IO26 Input 100 kΩ pull-down

RGMII_TXC D21 NVCC_RGMII DDR ALT5 GPIO6_IO19 Input 100 kΩ pull-down

RTC_XTALI D9 VDD_SNVS_CAP — — RTC_XTALI — —

RTC_XTALO C9 VDD_SNVS_CAP — — RTC_XTALO — —

SD1_CLK D20 NVCC_SD1 GPIO ALT5 GPIO1_IO20 Input 100 kΩ pull-up

SD1_CMD B21 NVCC_SD1 GPIO ALT5 GPIO1_IO18 Input 100 kΩ pull-up

SD1_DAT0 A21 NVCC_SD1 GPIO ALT5 GPIO1_IO16 Input 100 kΩ pull-up

SD1_DAT1 C20 NVCC_SD1 GPIO ALT5 GPIO1_IO17 Input 100 kΩ pull-up

SD1_DAT2 E19 NVCC_SD1 GPIO ALT5 GPIO1_IO19 Input 100 kΩ pull-up

SD1_DAT3 F18 NVCC_SD1 GPIO ALT5 GPIO1_IO21 Input 100 kΩ pull-up

SD2_CLK C21 NVCC_SD2 GPIO ALT5 GPIO1_IO10 Input 100 kΩ pull-up

SD2_CMD F19 NVCC_SD2 GPIO ALT5 GPIO1_IO11 Input 100 kΩ pull-up

SD2_DAT0 A22 NVCC_SD2 GPIO ALT5 GPIO1_IO15 Input 100 kΩ pull-up

SD2_DAT1 E20 NVCC_SD2 GPIO ALT5 GPIO1_IO14 Input 100 kΩ pull-up

SD2_DAT2 A23 NVCC_SD2 GPIO ALT5 GPIO1_IO13 Input 100 kΩ pull-up

SD2_DAT3 B22 NVCC_SD2 GPIO ALT5 GPIO1_IO12 Input 100 kΩ pull-up

SD3_CLK D14 NVCC_SD3 GPIO ALT5 GPIO7_IO03 Input 100 kΩ pull-up

SD3_CMD B13 NVCC_SD3 GPIO ALT5 GPIO7_IO02 Input 100 kΩ pull-up

SD3_DAT0 E14 NVCC_SD3 GPIO ALT5 GPIO7_IO04 Input 100 kΩ pull-up

SD3_DAT1 F14 NVCC_SD3 GPIO ALT5 GPIO7_IO05 Input 100 kΩ pull-up

SD3_DAT2 A15 NVCC_SD3 GPIO ALT5 GPIO7_IO06 Input 100 kΩ pull-up

SD3_DAT3 B15 NVCC_SD3 GPIO ALT5 GPIO7_IO07 Input 100 kΩ pull-up

SD3_DAT4 D13 NVCC_SD3 GPIO ALT5 GPIO7_IO01 Input 100 kΩ pull-up

SD3_DAT5 C13 NVCC_SD3 GPIO ALT5 GPIO7_IO00 Input 100 kΩ pull-up

SD3_DAT6 E13 NVCC_SD3 GPIO ALT5 GPIO6_IO18 Input 100 kΩ pull-up

SD3_DAT7 F13 NVCC_SD3 GPIO ALT5 GPIO6_IO17 Input 100 kΩ pull-up

SD3_RST D15 NVCC_SD3 GPIO ALT5 GPIO7_IO08 Input 100 kΩ pull-up

SD4_CLK E16 NVCC_NANDF GPIO ALT5 GPIO7_IO10 Input 100 kΩ pull-up

SD4_CMD B17 NVCC_NANDF GPIO ALT5 GPIO7_IO09 Input 100 kΩ pull-up

SD4_DAT0 D18 NVCC_NANDF GPIO ALT5 GPIO2_IO08 Input 100 kΩ pull-up

SD4_DAT1 B19 NVCC_NANDF GPIO ALT5 GPIO2_IO09 Input 100 kΩ pull-up

SD4_DAT2 F17 NVCC_NANDF GPIO ALT5 GPIO2_IO10 Input 100 kΩ pull-up

SD4_DAT3 A20 NVCC_NANDF GPIO ALT5 GPIO2_IO11 Input 100 kΩ pull-up

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

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146 NXP Semiconductors

Package Information and Contact Assignments

SD4_DAT4 E18 NVCC_NANDF GPIO ALT5 GPIO2_IO12 Input 100 kΩ pull-up

SD4_DAT5 C19 NVCC_NANDF GPIO ALT5 GPIO2_IO13 Input 100 kΩ pull-up

SD4_DAT6 B20 NVCC_NANDF GPIO ALT5 GPIO2_IO14 Input 100 kΩ pull-up

SD4_DAT7 D19 NVCC_NANDF GPIO ALT5 GPIO2_IO15 Input 100 kΩ pull-up

TAMPER E11 VDD_SNVS_IN GPIO ALT0 SNVS_TAMPER Input 100 kΩ pull-down

TEST_MODE E12 VDD_SNVS_IN GPIO ALT0 TCU_TEST_MODE Input 100 kΩ pull-down

USB_H1_DN F10 VDDUSB_CAP — — USB_H1_DN — —

USB_H1_DP E10 VDDUSB_CAP — — USB_H1_DP — —

USB_OTG_CHD_B B8 VDDUSB_CAP — — USB_OTG_CHD_B — —

USB_OTG_DN B6 VDDUSB_CAP — — USB_OTG_DN — —

USB_OTG_DP A6 VDDUSB_CAP — — USB_OTG_DP — —

XTALI A7 NVCC_PLL_OUT — — XTALI — —

XTALO B7 NVCC_PLL_OUT — — XTALO — —

1The state immediately after reset and before ROM firmware or software has executed.

2Variance of the pull-up and pull-down strengths are shown in the tables as follows:

•Table 22, "GPIO DC Parameters," on page 39

•Table 23, "LPDDR2 I/O DC Electrical Parameters," on page 40

•Table 24, "DDR3/DDR3L I/O DC Electrical Characteristics," on page 40

3ENET_REF_CLK is used as a clock source for MII and RGMII modes only. RGMII mode uses either GPIO_16 or

RGMII_TX_CTL as a clock source. For more information on these clocks, see the device Reference Manual and the Hardware

Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors (IMX6DQ6SDLHDG).

Table 89. Signals with Differing Before Reset and After Reset States

Ball Name

Before Reset State

Input/Output Value

EIM_A16 Input PD (100K)

EIM_A17 Input PD (100K)

EIM_A18 Input PD (100K)

EIM_A19 Input PD (100K)

EIM_A20 Input PD (100K)

EIM_A21 Input PD (100K)

EIM_A22 Input PD (100K)

EIM_A23 Input PD (100K)

EIM_A24 Input PD (100K)

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Ball Name Ball Power Group Ball Type

Out of Reset Condition1

Default

Mode

(Reset

Mode)

Default Function Input/

Output Value2

Package Information and Contact Assignments

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NXP Semiconductors 147

EIM_A25 Input PD (100K)

EIM_DA0 Input PD (100K)

EIM_DA1 Input PD (100K)

EIM_DA2 Input PD (100K)

EIM_DA3 Input PD (100K)

EIM_DA4 Input PD (100K)

EIM_DA5 Input PD (100K)

EIM_DA6 Input PD (100K)

EIM_DA7 Input PD (100K)

EIM_DA8 Input PD (100K)

EIM_DA9 Input PD (100K)

EIM_DA10 Input PD (100K)

EIM_DA11 Input PD (100K)

EIM_DA12 Input PD (100K)

EIM_DA13 Input PD (100K)

EIM_DA14 Input PD (100K)

EIM_DA15 Input PD (100K)

EIM_EB0 Input PD (100K)

EIM_EB1 Input PD (100K)

EIM_EB2 Input PD (100K)

EIM_EB3 Input PD (100K)

EIM_LBA Input PD (100K)

EIM_RW Input PD (100K)

EIM_WAIT Input PD (100K)

GPIO_17 Output Drive state unknown (x)

GPIO_19 Output Drive state unknown (x)

KEY_COL0 Output Drive state unknown (x)

Table 89. Signals with Differing Before Reset and After Reset States (continued)

Ball Name

Before Reset State

Input/Output Value

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Package Information and Contact Assignments

6.2.3 21 x 21 mm, 0.8 mm Pitch Ball Map

Table 90 shows the 21 x 21 mm, 0.8 mm pitch ball map for the i.MX 6Solo.

Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo

PCIE_REXT

PCIE_TXM

GND

FA_ANA

USB_OTG_DP

XTALI

GND

SD3_DAT2

NANDF_ALE

NANDF_CS2

NANDF_D0

NANDF_D4

SD4_DAT3

SD1_DAT0

SD2_DAT0

SD2_DAT2

RGMII_TD3

GND

PCIE_RXM

PCIE_RXP

PCIE_TXP

GND

VDD_FA

USB_OTG_DN

XTALO

USB_OTG_CHD_B

SD3_CMD

SD3_DAT3

NANDF_RB0

SD4_CMD

NANDF_D5

SD4_DAT1

SD4_DAT6

SD1_CMD

SD2_DAT3

RGMII_RD1

RGMII_RD2

RGMII_RXC

GND

JTAG_TRSTB

JTAG_TMS

GND

CLK2_N

GND

CLK1_N

GPANAIO

RTC_XTALO

GND

POR_B

BOOT_MODE0

SD3_DAT5

NANDF_CLE

NANDF_CS1

NANDF_D1

NANDF_D7

SD4_DAT5

SD1_DAT1

SD2_CLK

RGMII_TD0

RGMII_TX_CTL

RGMII_RD0

EIM_D16

CSI_D1M

CSI_D1P

GND

CSI_REXT

CLK2_P

GND

CLK1_P

GND

RTC_XTALI

USB_H1_VBUS

PMIC_ON_REQ

ONOFF

SD3_DAT4

SD3_CLK

SD3_RST

NANDF_CS3

NANDF_D3

SD4_DAT0

SD4_DAT7

SD1_CLK

RGMII_TXC

RGMII_RX_CTL

RGMII_RD3

EIM_D18

EIM_D23

CSI_D0P

CSI_D0M

GND

NVCC_PLL_OUT

USB_OTG_VBUS

USB_H1_DP

TAMPER

TEST_MODE

SD3_DAT6

SD3_DAT0

NANDF_WP_B

SD4_CLK

NANDF_D6

SD4_DAT4

SD1_DAT2

SD2_DAT1

RGMII_TD2

EIM_EB2

EIM_D22

EIM_D26

EIM_D27

CSI_CLK0P

CSI_CLK0M

GND

VDDUSB_CAP

USB_H1_DN

PMIC_STBY_REQ

BOOT_MODE1

SD3_DAT7

SD3_DAT1

NANDF_CS0

NANDF_D2

SD4_DAT2

SD1_DAT3

SD2_CMD

RGMII_TD1

EIM_D17

EIM_D24

EIM_EB3

EIM_A22

EIM_A24

DSI_D0P

DSI_D0M

GND

DSI_REXT

JTAG_TDI

JTAG_TDO

PCIE_VPH

PCIE_VPTX

VDD_SNVS_CAP

GND

VDD_SNVS_IN

NVCC_SD3

NVCC_NANDF

NVCC_SD1

NVCC_SD2

NVCC_RGMII

GND

EIM_D20

EIM_D19

EIM_D25

EIM_D28

EIM_A17

EIM_A19

Package Information and Contact Assignments

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 149

DSI_D1P

DSI_D1M

DSI_CLK0M

DSI_CLK0P

JTAG_TCK

JTAG_MOD

PCIE_VP

GND

VDDHIGH_IN

VDDHIGH_CAP

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

EIM_A25

EIM_D21

EIM_D31

EIM_A20

EIM_A21

EIM_CS0

EIM_A16

HDMI_REF

GND

HDMI_D1M

HDMI_D1P

HDMI_CLKM

HDMI_CLKP

NVCC_JTAG

GND

VDDHIGH_IN

VDDHIGH_CAP

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

EIM_D29

EIM_D30

EIM_A23

EIM_A18

EIM_CS1

EIM_OE

EIM_DA1

HDMI_HPD

HDMI_DDCCEC

HDMI_D2M

HDMI_D2P

HDMI_D0M

HDMI_D0P

NVCC_MIPI

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_EIM

EIM_RW

EIM_EB0

EIM_LBA

EIM_EB1

EIM_DA3

EIM_DA6

CSI0_DAT13

GND

CSI0_DAT17

CSI0_DAT16

GND

CSI0_DAT19

HDMI_VP

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_EIM

EIM_DA0

EIM_DA2

EIM_DA4

EIM_DA5

EIM_DA8

EIM_DA7

CSI0_DAT10

CSI0_DAT12

CSI0_DAT11

CSI0_DAT14

CSI0_DAT15

CSI0_DAT18

HDMI_VPH

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_EIM

EIM_DA11

EIM_DA9

EIM_DA10

EIM_DA13

EIM_DA12

EIM_WAIT

CSI0_DAT4

CSI0_VSYNC

CSI0_DAT7

CSI0_DAT6

CSI0_DAT9

CSI0_DAT8

NVCC_CSI

GND

VDDARM_IN

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

DI0_DISP_CLK

DI0_PIN3

DI0_PIN15

EIM_BCLK

EIM_DA14

EIM_DA15

DI0_PIN2

CSI0_PIXCLK

CSI0_DAT5

CSI0_DATA_EN

CSI0_MCLK

GPIO_19

GPIO_18

NVCC_GPIO

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_LCD

DISP0_DAT4

DISP0_DAT3

DISP0_DAT1

DISP0_DAT2

DISP0_DAT0

DI0_PIN4

GPIO_17

GPIO_16

GPIO_7

GPIO_5

GPIO_8

GPIO_4

GPIO_3

GND

VDDARM_IN

VDDSOC_CAP

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

GND

NVCC_DRAM

NVCC_ENET

DISP0_DAT13

DISP0_DAT10

DISP0_DAT8

DISP0_DAT6

DISP0_DAT7

DISP0_DAT5

Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

150 NXP Semiconductors

Package Information and Contact Assignments

GPIO_2

GPIO_9

GPIO_6

GPIO_1

GPIO_0

KEY_COL4

KEY_ROW3

GND

VDDARM_IN

VDDSOC_CAP

GND

VDDSOC_CAP

GND

VDDSOC_IN

GND

NVCC_DRAM

GND

DISP0_DAT21

DISP0_DAT16

DISP0_DAT15

DISP0_DAT11

DISP0_DAT12

DISP0_DAT9

LVDS0_TX0_P

LVDS0_TX0_N

LVDS0_TX1_P

LVDS0_TX1_N

KEY_COL3

KEY_ROW1

KEY_COL1

GND

VDDARM_IN

VDDSOC_CAP

GND

VDDSOC_CAP

GND

VDDSOC_IN

GND

NVCC_DRAM

GND

ENET_TXD0

ENET_CRS_DV

DISP0_DAT20

DISP0_DAT19

DISP0_DAT17

DISP0_DAT14

LVDS0_TX2_P

LVDS0_TX2_N

LVDS0_CLK_P

LVDS0_CLK_N

KEY_ROW4

KEY_ROW0

NVCC_LVDS2P5

GND

NVCC_DRAM

GND

ENET_MDC

ENET_TX_EN

ENET_REF_CLK

ENET_MDIO

DISP0_DAT22

DISP0_DAT18

LVDS0_TX3_P

LVDS0_TX3_N

GND

KEY_ROW2

KEY_COL0

KEY_COL2

GND

DRAM_A4

GND

ENET_TXD1

ENET_RXD0

ENET_RXD1

ENET_RX_ER

DISP0_DAT23

LVDS1_TX0_N

LVDS1_TX0_P

LVDS1_CLK_N

LVDS1_CLK_P

GND

DRAM_RESET

DRAM_D20

DRAM_D21

DRAM_D19

DRAM_D25

DRAM_SDCKE0

DRAM_A15

DRAM_A7

DRAM_A3

DRAM_SDBA1

DRAM_CS0

GND

LVDS1_TX1_P

LVDS1_TX1_N

LVDS1_TX3_N

LVDS1_TX3_P

DRAM_D3

DRAM_D10

GND

DRAM_D17

DRAM_D23

GND

DRAM_SDCKE1

DRAM_A14

GND

DRAM_A2

DRAM_A10

GND

LVDS1_TX2_N

LVDS1_TX2_P

GND

DRAM_D6

DRAM_D12

DRAM_D14

DRAM_D16

DRAM_DQM2

DRAM_D18

DRAM_SDQS3_B

DRAM_D27

DRAM_SDBA2

DRAM_A8

DRAM_A1

DRAM_RAS

DRAM_SDWE

DRAM_SDODT1

GND

DRAM_D4

DRAM_VREF

DRAM_DQM0

DRAM_D2

DRAM_D13

DRAM_DQM1

DRAM_D15

DRAM_D22

DRAM_D28

DRAM_SDQS3

DRAM_D31

DRAM_A11

DRAM_A6

DRAM_A0

DRAM_SDBA0

DRAM_SDODT0

DRAM_A13

Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)

Package Information and Contact Assignments

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 151

Table 91 shows the 21 x 21 mm, 0.8 mm pitch ball map for the i.MX 6DualLite.

DRAM_D5

DRAM_D0

DRAM_SDQS0_B

GND

DRAM_D8

DRAM_SDQS1

GND

DRAM_SDQS2

DRAM_D29

GND

DRAM_D30

DRAM_A12

GND

DRAM_SDCLK_1

DRAM_SDCLK_0

GND

DRAM_CS1

GND

DRAM_D1

DRAM_SDQS0

DRAM_D7

DRAM_D9

DRAM_SDQS1_B

DRAM_

DRAM_SDQS2_B

DRAM_D24

DRAM_DQM3

DRAM_D26

DRAM_A9

DRAM_A5

DRAM_SDCLK_1_B

DRAM_SDCLK_0_B

DRAM_CAS

ZQPAD

GND

Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite

PCIE_REXT

PCIE_TXM

GND

FA_ANA

USB_OTG_DP

XTALI

GND

SD3_DAT2

NANDF_ALE

NANDF_CS2

NANDF_D0

NANDF_D4

SD4_DAT3

SD1_DAT0

SD2_DAT0

SD2_DAT2

RGMII_TD3

GND

PCIE_RXM

PCIE_RXP

PCIE_TXP

GND

VDD_FA

USB_OTG_DN

XTALO

USB_OTG_CHD_B

SD3_CMD

SD3_DAT3

NANDF_RB0

SD4_CMD

NANDF_D5

SD4_DAT1

SD4_DAT6

SD1_CMD

SD2_DAT3

RGMII_RD1

RGMII_RD2

RGMII_RXC

GND

JTAG_TRSTB

JTAG_TMS

GND

CLK2_N

GND

CLK1_N

GPANAIO

RTC_XTALO

GND

POR_B

BOOT_MODE0

SD3_DAT5

NANDF_CLE

NANDF_CS1

NANDF_D1

NANDF_D7

SD4_DAT5

SD1_DAT1

SD2_CLK

RGMII_TD0

RGMII_TX_CTL

RGMII_RD0

EIM_D16

CSI_D1M

CSI_D1P

GND

CSI_REXT

CLK2_P

GND

CLK1_P

GND

RTC_XTALI

USB_H1_VBUS

PMIC_ON_REQ

ONOFF

SD3_DAT4

SD3_CLK

SD3_RST

NANDF_CS3

NANDF_D3

SD4_DAT0

SD4_DAT7

SD1_CLK

RGMII_TXC

RGMII_RX_CTL

RGMII_RD3

EIM_D18

EIM_D23

Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

152 NXP Semiconductors

Package Information and Contact Assignments

CSI_D0P

CSI_D0M

GND

NVCC_PLL_OUT

USB_OTG_VBUS

USB_H1_DP

TAMPER

TEST_MODE

SD3_DAT6

SD3_DAT0

NANDF_WP_B

SD4_CLK

NANDF_D6

SD4_DAT4

SD1_DAT2

SD2_DAT1

RGMII_TD2

EIM_EB2

EIM_D22

EIM_D26

EIM_D27

CSI_CLK0P

CSI_CLK0M

GND

VDDUSB_CAP

USB_H1_DN

PMIC_STBY_REQ

BOOT_MODE1

SD3_DAT7

SD3_DAT1

NANDF_CS0

NANDF_D2

SD4_DAT2

SD1_DAT3

SD2_CMD

RGMII_TD1

EIM_D17

EIM_D24

EIM_EB3

EIM_A22

EIM_A24

DSI_D0P

DSI_D0M

GND

DSI_REXT

JTAG_TDI

JTAG_TDO

PCIE_VPH

PCIE_VPTX

VDD_SNVS_CAP

GND

VDD_SNVS_IN

NVCC_SD3

NVCC_NANDF

NVCC_SD1

NVCC_SD2

NVCC_RGMII

GND

EIM_D20

EIM_D19

EIM_D25

EIM_D28

EIM_A17

EIM_A19

DSI_D1P

DSI_D1M

DSI_CLK0M

DSI_CLK0P

JTAG_TCK

JTAG_MOD

PCIE_VP

GND

VDDHIGH_IN

VDDHIGH_CAP

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

EIM_A25

EIM_D21

EIM_D31

EIM_A20

EIM_A21

EIM_CS0

EIM_A16

HDMI_REF

GND

HDMI_D1M

HDMI_D1P

HDMI_CLKM

HDMI_CLKP

NVCC_JTAG

GND

VDDHIGH_IN

VDDHIGH_CAP

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

EIM_D29

EIM_D30

EIM_A23

EIM_A18

EIM_CS1

EIM_OE

EIM_DA1

HDMI_HPD

HDMI_DDCCEC

HDMI_D2M

HDMI_D2P

HDMI_D0M

HDMI_D0P

NVCC_MIPI

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_EIM

EIM_RW

EIM_EB0

EIM_LBA

EIM_EB1

EIM_DA3

EIM_DA6

CSI0_DAT13

GND

CSI0_DAT17

CSI0_DAT16

GND

CSI0_DAT19

HDMI_VP

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_EIM

EIM_DA0

EIM_DA2

EIM_DA4

EIM_DA5

EIM_DA8

EIM_DA7

CSI0_DAT10

CSI0_DAT12

CSI0_DAT11

CSI0_DAT14

CSI0_DAT15

CSI0_DAT18

HDMI_VPH

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_EIM

EIM_DA11

EIM_DA9

EIM_DA10

EIM_DA13

EIM_DA12

EIM_WAIT

Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)

Package Information and Contact Assignments

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 153

CSI0_DAT4

CSI0_VSYNC

CSI0_DAT7

CSI0_DAT6

CSI0_DAT9

CSI0_DAT8

NVCC_CSI

GND

VDDARM_IN

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

DI0_DISP_CLK

DI0_PIN3

DI0_PIN15

EIM_BCLK

EIM_DA14

EIM_DA15

DI0_PIN2

CSI0_PIXCLK

CSI0_DAT5

CSI0_DATA_EN

CSI0_MCLK

GPIO_19

GPIO_18

NVCC_GPIO

GND

VDDARM_IN

GND

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

VDDPU_CAP

GND

NVCC_LCD

DISP0_DAT4

DISP0_DAT3

DISP0_DAT1

DISP0_DAT2

DISP0_DAT0

DI0_PIN4

GPIO_17

GPIO_16

GPIO_7

GPIO_5

GPIO_8

GPIO_4

GPIO_3

GND

VDDARM_IN

VDDSOC_CAP

VDDARM_CAP

GND

VDDARM_CAP

VDDARM_IN

GND

VDDSOC_IN

GND

NVCC_DRAM

NVCC_ENET

DISP0_DAT13

DISP0_DAT10

DISP0_DAT8

DISP0_DAT6

DISP0_DAT7

DISP0_DAT5

GPIO_2

GPIO_9

GPIO_6

GPIO_1

GPIO_0

KEY_COL4

KEY_ROW3

GND

VDDARM_IN

VDDSOC_CAP

GND

VDDSOC_CAP

GND

VDDSOC_IN

GND

NVCC_DRAM

GND

DISP0_DAT21

DISP0_DAT16

DISP0_DAT15

DISP0_DAT11

DISP0_DAT12

DISP0_DAT9

LVDS0_TX0_P

LVDS0_TX0_N

LVDS0_TX1_P

LVDS0_TX1_N

KEY_COL3

KEY_ROW1

KEY_COL1

GND

VDDARM_IN

VDDSOC_CAP

GND

VDDSOC_CAP

GND

VDDSOC_IN

GND

NVCC_DRAM

GND

ENET_TXD0

ENET_CRS_DV

DISP0_DAT20

DISP0_DAT19

DISP0_DAT17

DISP0_DAT14

LVDS0_TX2_P

LVDS0_TX2_N

LVDS0_CLK_P

LVDS0_CLK_N

KEY_ROW4

KEY_ROW0

NVCC_LVDS2P5

GND

NVCC_DRAM

GND

ENET_MDC

ENET_TX_EN

ENET_REF_CLK

ENET_MDIO

DISP0_DAT22

DISP0_DAT18

LVDS0_TX3_P

LVDS0_TX3_N

GND

KEY_ROW2

KEY_COL0

KEY_COL2

GND

DRAM_A4

GND

ENET_TXD1

ENET_RXD0

ENET_RXD1

ENET_RX_ER

DISP0_DAT23

DRAM_D63

LVDS1_TX0_N

LVDS1_TX0_P

LVDS1_CLK_N

LVDS1_CLK_P

GND

DRAM_RESET

DRAM_D20

DRAM_D21

DRAM_D19

DRAM_D25

DRAM_SDCKE0

DRAM_A15

DRAM_A7

DRAM_A3

DRAM_SDBA1

DRAM_CS0

DRAM_D36

DRAM_D37

DRAM_D40

DRAM_D44

DRAM_DQM7

DRAM_D59

DRAM_D62

GND

DRAM_D58

Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

154 NXP Semiconductors

Package Information and Contact Assignments

LVDS1_TX1_P

LVDS1_TX1_N

LVDS1_TX3_N

LVDS1_TX3_P

DRAM_D3

DRAM_D10

GND

DRAM_D17

DRAM_D23

GND

DRAM_SDCKE1

DRAM_A14

GND

DRAM_A2

DRAM_A10

GND

DRAM_D32

DRAM_D33

GND

DRAM_D45

DRAM_D57

GND

DRAM_D61

DRAM_SDQS7_B

DRAM_SDQS7

LVDS1_TX2_N

LVDS1_TX2_P

GND

DRAM_D6

DRAM_D12

DRAM_D14

DRAM_D16

DRAM_DQM2

DRAM_D18

DRAM_SDQS3_B

DRAM_D27

DRAM_SDBA2

DRAM_A8

DRAM_A1

DRAM_RAS

DRAM_SDWE

DRAM_SDODT1

DRAM_DQM4

DRAM_D38

DRAM_D41

DRAM_D42

DRAM_D52

DRAM_D60

GND

DRAM_D56

DRAM_D4

DRAM_VREF

DRAM_DQM0

DRAM_D2

DRAM_D13

DRAM_DQM1

DRAM_D15

DRAM_D22

DRAM_D28

DRAM_SDQS3

DRAM_D31

DRAM_A11

DRAM_A6

DRAM_A0

DRAM_SDBA0

DRAM_SDODT0

DRAM_A13

DRAM_D34

DRAM_D39

DRAM_DQM5

DRAM_D47

DRAM_D48

DRAM_D53

DRAM_D51

DRAM_D55

DRAM_D5

DRAM_D0

DRAM_SDQS0_B

GND

DRAM_D8

DRAM_SDQS1

GND

DRAM_SDQS2

DRAM_D29

GND

DRAM_D30

DRAM_A12

GND

DRAM_SDCLK_1

DRAM_SDCLK_0

GND

DRAM_CS1

DRAM_SDQS4

GND

DRAM_SDQS5

DRAM_D43

GND

DRAM_SDQS6

DRAM_DQM6

DRAM_D54

GND

DRAM_D1

DRAM_SDQS0

DRAM_D7

DRAM_D9

DRAM_SDQS1_B

DRAM_D11

DRAM_SDQS2_B

DRAM_D24

DRAM_DQM3

DRAM_D26

DRAM_A9

DRAM_A5

DRAM_SDCLK_1_B

DRAM_SDCLK_0_B

DRAM_CAS

ZQPAD

DRAM_SDQS4_B

DRAM_D35

DRAM_SDQS5_B

DRAM_D46

DRAM_D49

DRAM_SDQS6_B

DRAM_D50

GND

Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)

Revision History

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 155

7 Revision History

Table 92 provides the current revision history for this data sheet. Table 93 provides a revision history for

previous revisions.

Table 92. i.MX 6Solo/6DualLite Data Sheet Document Rev. 9 History

Rev.

Number Date Substantive Changes

9 10/2018 Changes to Revision 9 include the following:

• Table 3, "Special Signal Considerations," on page 20: Corrected,

– Row: NC, from “These signals are No Connected …” to read, “These signals are not functional and

must remain unconnected by the user.”

• Table 8, "Operating Ranges," on page 25: Corrected, Run Mode LDO enabled: VDD_ARM_IN; Corrected

minimum for operation up to 396 MHz LDO from 1.275 V to 1.25 V.

• Table 8, "Operating Ranges," on page 25: Corrected footnote 5:

– Changed from: “When VDD_SOC_IN does not supply… then maximum setting can be 1.3V.”

– Changed to: “When using VDD_SOC_CAP to supply the PCIE_VP and PCIE_VPTX, the maximum

setting is 1.175V. …”

• Table 49, "eMMC4.4/4.41 Interface Timing Specification," on page 77,

– Row: SD2, uSDHC Output Delay: Changed tOD from 2.5ns minimum to 2.8ns and 7.1ns maximum to

6.8ns.

• Table 87, "21 x 21 mm Supplies Contact Assignments," on page 133: Corrected,

– Last row: NC, from “—” to read, These signals are not functional and must remain unconnected by the

user.

8 09/2017 • Replaced ipp_dse with DSE throughout.

• Section 1, “Introduction: Replaced text “low voltage DDR3” with “DDR3L” in the features list of i.MX

6Solo/6DualLite applications processors.

• Table 1, "Example Orderable Part Numbers," on page 3: Added orderable part numbers.

• Figure 1: Updated to include Rev 1.4 in Silicon Revision section.

• Section 2.1, “Block Diagram: Updated WEIM with EIM in the block diagram.

• Table 2, "i.MX 6Solo/6DualLite Modules List," on page 10: Rearranged alphabetically.

• Table 6, "Absolute Maximum Ratings," on page 23:

– Removed VDD_HIGH_IN supply voltage (LDO bypass) parameter.

– Max. value of VDD_HIGH_CAP supply output voltage corrected to 2.85V.

• Table 21: Updated test condition of “XTALI input leakage current at startup” parameter; replaced 32KHz RTC

with 24MHz.

• Added Section 4.6.4, “RGMII I/O 2.5V I/O DC Electrical Parameters.

• Section 4.8.2, “DDR I/O Output Buffer Impedance: Modified introductory text.

• Corrected Figure 20, "Asynchronous A/D Muxed Write Access," on page 57.

• Table 49, "eMMC4.4/4.41 Interface Timing Specification," on page 77:

– Added the following footnote to Card Input Clock section: 1 Clock duty cycle will be in the range of 47% to

53%.

– Min. value of uSDHC Input Setup Time reduced to 1.7ns.

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156 NXP Semiconductors

Revision History

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories

Rev.

Number Date Substantive Changes

7 10/2016 • Table 1, "Example Orderable Part Numbers," on page 3: Added footnote.

• Figure 1, "Part Number Nomenclature—i.MX 6Solo and 6DualLite," on page 4: Added to Silicon

Revision block: Revision 1.2 and 1.3 and associated Mask ID.

• Table 6, "Absolute Maximum Ratings," on page 23:

– NVCC_DRAM maximum value changed to 1.975 V.

– Included footnote to NVCC_DRAM maximum value regarding maximum voltage allowance.

– Added row to Vin/Vout I/O supply voltage, separating DDR pins and non-DDR pins and included

footnote regarding maximum voltage allowance.

• Table 8, "Operating Ranges," on page 25: Added footnotes within the Comments column for the Run

Mode, LDO Enabled row; VDD_SOC_IN maximum values.

• Section 4.6.3, “DDR I/O DC Parameters: Added reference for more DDR details to see the MMDC

section.

Moved JEDEC standard information to footnote.

• Section 4.7.2, “DDR I/O AC Parameters: Added reference for more DDR details to see the MMDC

section.

Moved JEDEC standard information to footnote.

• Table 40, "i.MX 6Solo Supported DDR3/DDR3L/LPDDR2 Configurations," on page 60: Changed

LPDDR2 Channel column from “Dual” to “Single.”

• Table 41, "i.MX 6DualLite Supported DDR3/DDR3L/LPDDR2 Configurations," on page 61: Added

LPDDR2 Dual Channel column.

• Table 86, "21 x 21, 0.8 mm BGA Package Details," on page 132: Correction to package total thickness.

• Table 88, "21 x 21 mm Functional Contact Assignments," on page 135: DRAM_SDCKLn rows, reverted

to “Low” rather than “0” in the Value column.

Revision History

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NXP Semiconductors 157

6 8/2016 • Changed throughout:

- LVDDR3 to DDR3L

- Changed terminology from “floating” to “not connected”.

• Table 2, "i.MX 6Solo/6DualLite Modules List," on page 10:

- uSDHC1–4, SD/MMC and SDXC Enhanced Multi-Media Card/Secure Digital Host Controller row:

Added new bullet at top: “Conforms to the SD Host Controller…”.

- eCSPI1-4 row: removed from the Brief Description column, “with data rate up to 52Mbit/s.”

- BCH row, removed from Brief Description column, “encryption/decryption”.

• Table 3, "Special Signal Considerations," on page 20:

- GPANAIO row, modified remarks to be NXP use only.

- SRC_POR_B row: removed reference to internal POR which is not supported on device.

- TEST_MODE row: modified remarks to be NXP use only and added tie to Vss or remain unconnected.

• Table 6, "Absolute Maximum Ratings," on page 23” throughout table: clarified parameter descriptions

including adding LDO state. Clarified symbol names.

- Added row, RGMII I/O supply voltage.

- Added VDD_HIGH_CAP supply voltage row for LDO output.

- Added to USB supply voltage row: USB_OTG_CHD_B.

- All maximum voltages increased (improved).

• Section 4.1.2, “Thermal Resistance: added NOTE.

• Table 8, "Operating Ranges," on page 25: Changed minimum parameter of Run mode: LDO enabled

from 1.175 to 1.25 V.

• Section 4.2.1, “Power-Up Sequence”: Removed references to the internal POR function. Internal POR

is not supported. Removed fourth and fifth bullets.

• Section 4.2.3, “Power Supplies Usage”: Added NOTE, “When the PCIE interface is not used…”.

• Section 4.5.2, “OSC32K”: Removed battery resistor (coin cell) calculation.

• Section 4.6.1, “XTALI and RTC_XTALI (Clock Inputs) DC Parameters”:

- Added 3 rows: Input capacitance; Startup current; and DC input current.

- Added footnote to RTC_XTALI high-level DC input voltage at the Max parameter.

- Added NOTE following table: “The Vil and Vih only apply when external clock source is used…”.

• Section 4.9.4, “Multi-Mode DDR Controller (MMDC)”: this new section added, replacing the original

section 4.9.4 “DDR SRAM Specific Parameters (DDR3/DDR3L and LPDDR2)”.

• Figure 34, "ECSPI Master Mode Timing Diagram," on page 70: Added note, “ECSPI_MOSI always…”.

• Figure 35, "ECSPI Slave Mode Timing Diagram," on page 71: Added note, “ECSPI_MOSI always

driven…”.

• Figure 40, "SDR50/SDR104 Timing," on page 78: Aligned SD4 and SD5.

• Table 50, "SDR50/SDR104 Interface Timing Specification," on page 78:

- Corrected Clock High Time ID to SD3.

- Changed SD2 and SD3 Min and max values to 0.46 and 0.54.

- Changed SD5 Max to 0.74.

• Table 60, "Camera Input Signal Cross Reference, Format, and Bits Per Cycle," on page 90: Changed

RGB565 column heading from 2 to 1 cycle.

• Table 88, "21 x 21 mm Functional Contact Assignments," on page 135:

- Table row: DRAM_SDCLK0 and DRAM_SDCLK1 changed Out of Reset Condition from Low to 0.

- Added to ZQPAD row: requirement to add resistor to GND.

5 6/2015 • Table 8, “Operating Ranges,” Run mode: LDO enabled row; Changed comments for VDD_ARM_IN,

from “1.05V minimum for operation up to 396MHz” to “1.125V minimum for operation up to 396MHz”.

• Table 3, “Special Signal Considerations,” XTALI/XTALO row: Changed from “The crystal must be

rated...”, to “See Hardware Development Guide”.

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.

Number Date Substantive Changes

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158 NXP Semiconductors

Revision History

Rev. 4 12/2014 • Figure 1, “Part Number Nomenclature—i.MX 6Solo and 6DualLite”: Added Silicon Rev 1.3. to diagram

• Table 2, Modules List, UART 1–5 Description changed: baud rate up from 5MHz to 5Mbps.

• Added Figure 2, "Example Part Marking," on page 4.

• Section 1.2, “Features”: under, Miscellaneous IPs and interfaces: Changed UARTs bullet, from “up to

4.0 Mbps”, to “up to 5.0 Mbps”.

• Table 8, “Operating Ranges,” on page 29:

— Changed Run mode: VDD_ARM_IN minimum value from 1.05 to 1.125V; for operation up to 396

MHz. and changed LDO bypassed maximum value from 1.225V to 1.21V; for VDD_SOC_IN.

— Changed PCIe supply voltages; PCIE_VP/PCIE_VPTX maximum value from 1.225V to 1.21V

• Table 10, "Maximum Supply Currents," on page 28;

— Changed VDD_ARM_IN from single condition to include DualLite and Solo conditions with Maximum

current values of 2200 and 1320 mA, respectively.

— Added footnote for NVCC_LVDS2P5 supply.

• Table 38, “Reset Timing Parameters”: Removed footnote regarding SRC_POR_B rise and fall times.

• Section 4.9.3, “External Interface Module (EIM)”: Changed first paragraph to describe two systems

clocks used with EIM: ACLK_EIM_SLOW_CLK_ROOT and ACLK_EXSC (for synchronous mode).

• Table 31, “DDR I/O DDR3/DDR3L Mode AC Parameters”; Added footnote about extended range for Vix.

• Table 48, “DDR3/DDR3L Timing Parameter Table,” on page 76; Added DDR0, tCK(avg) and parameter

values. Changed symbol names DDR1 through DDR7 to include avg or base; changed minimum

parameter values for DDR4–DDR7. Added footnote about tIS and tIH base values.

• Figure 25, “DDR3 Command and Address Timing Parameters,” on page 76; Added DDR0.

• Table 49, “DDR3/DDR3L Write Cycle,” on page 77; Changed symbol names of DDR17 and DDR18 to

include base(AC150/DC100); Changed Units from tCK to tCK(avg).

• Table 46, “LPDDR2 Write Cycle,” on page 64; Changed LP21 min/max parameter values from

-0.25/+0.25 to 0.75/1.25.

• Table 38, "EIM Bus Timing Parameters," on page 52: Changed footnotes regarding the system clocks

used with EIM: from axi_clk to ACLK_EXSC or ACLK_EIM_SLOW_CLK_ROOT.

• Table 49, “DDR3/DDR3L Write Cycle,” on page 77: Changed DDR17 minimum value from 420 ps to

125 ps and DDR18 from 345 ps to 150 ps.

• Table 49, “DDR3/DDR3L Write Cycle,” on page 77: Added footnote 4.

• Table 65, "LVDS Display Bridge (LDB) Electrical Specification," on page 102: Corrected Units for Output

Voltage High and Output Voltage Low from mV to V.

• Table 67, "Electrical and Timing Information," on page 105: Moved rows tSETUP[RX] and tHOLD[RX]

to be directly under HS Line Receiver AC Specifications heading row.

• Table 87, "21 x 21 mm Supplies Contact Assignments," on page 133: Removed A1 pin.

• Table 88, "21 x 21 mm Functional Contact Assignments," on page 135: Moved rows DRAM_4,

DRAM_5, and DRAM_6 out of the i.MX 6DualLite section (shaded gray) to the i.MX 6Solo section above

DRAM_7 and (unshaded).

• Table 90, "21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo," on page 148: Removed “NC” from A1 pin

location.

• Table 91, "21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite," on page 151: Removed “NC” from A1

pin location.

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.

Number Date Substantive Changes

Revision History

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NXP Semiconductors 159

Rev. 3 02/2014 • Updates throughout for Silicon revision C, including:

- Figure 1 Part number nomenclature diagram

- Table 1 Example Orderable Part Numbers

• Feature descriptions updated for:

- Camera sensors: updated from one to two ports at up to 240 MHz peak.

- Miscellaneous IPs and interfaces; SSI and ESAI.

• Table 2, Modules List, uSDHC 1–4 description change: including SDXC cards up to 2 TB.

• Table 2, Modules List, UART 1–5 description change: programmable baud rate up to 5 MHz.

• Table 3, Special Signal Considerations: XTALOSC_RTC_XTALI/RTC_XTALO: ending paragraph

removed. Was: “In case when high accuracy real time clock are not required system may use internal

low frequency ring oscillator. It is recommended to connect XTALOSC_RTC_XTALI to GND and keep

RTC_XTALO floating.”

• Table 8, Operating Ranges for Run mode LDO bypassed: Added footnote regarding alternate maximum

voltage on VDD_SOC_IN … this maximum can be 1.3V.

• Table 8, Operating Ranges Standby/DSM mode: Added footnote regarding alternate maximum voltage

on VDD_SOC_IN … this maximum can be 1.3V.

• Table 8, Operating Ranges GPIO supply voltages: Corrected supply name to NVCC_NANDF

• Table 8, Operating ranges: updated table footnotes for clarity.

• Removed table “On-Chip LDOs and their On-Chip Loads.”

• Section 4.1.4, External Clock Sources; added Note, “The internal RTC oscillator does not...”.

• Section 4.1.5, Maximum Supply Currents: Reworded second paragraph about the power management

IC to explain that a robust thermal design is required for the increased system power dissipation.

• Table 10, Maximum Supply Currents: NVCC_RGMII Condition value corrected to N=6.

• Table 10, Maximum Supply Currents: Corrected supply name NVCC_NANDF.

• Table 10, Maximum Supply currents: Added row NVCC_LVDS2P5

• Section 4.2.1, Power-Up Sequence: Clarified wording of third bulleted item regarding POR control.

• Section 4.2.1, Power-Up Sequence: Removed Note.

• Section 4.2.1, Power-Up Sequence: Corrected bullet regarding VDD_ARM_CAP / VDD_SOC_CAP

difference from 50 mV to 100 mV.

• Section 4.5.2, OSC32K, second paragraph reworded to describe OSC32K automatic switching.

• Section 4.5.2, OSC32K, added Note following second paragraph to caution use of internal oscillator.

• Table 23, XTALI and RTC_XTALI DC parameters; changed RTC_XTALI Vih minimum value to 0.8.

• Table 23, XTALI and RTC_XTALI DC parameters; changed RTC_XTALI Vih maximum value to 1.1.

• Table 35, Reset Timing Parameters; removed rise/fall time requirement

• Section 4.9.3, External Interface Module; enhanced wording to first paragraph to describe operating

frequency for data transfers, and to explain register settings are valid for entire range of frequencies.

Rev. 3

continued

2/2014 • Table 38, EIM Bus Timing Parameters; reworded footnotes for clarity.

• Table 38, EIM Asynchronous Timing Parameters; removed comment from the Max heading cell.

• Figure 58, Gated Clock Mode Timing Diagram: Corrected HSYNC trace behavior

• Table 62, Video Signal Cross-Reference: Corrected naming of HSYNC and VSYNC

• Section 4.11.21, USB PHY Parameters: Updated Battery Charging Specification bullet

• Table 86, BGA Package Details: Corrected to read “21 x 21, 0.8 mm”.

• Table 87, Supplies Contact Assignments: Corrected supply name NVCC_NANDF

• Table 87, Supplies Contact Assignments: Updated NC rows to show i.MX 6DualLite vs. i.MX 6Solo

• Table 88, Functional Contact Assignments: ALT5 Default function signal names corrected

• Table 88, Functional Contact Assignments: PMIC_ON_REQ Out of Reset value corrected to “Open

Drain with PU (100K) enabled”

• Table 88, Functional Contact Assignments: TEST_MODE row included

• Table 88, Functional Contact Assignments: VDD_ARM_IN and ZQPAD row removed

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.

Number Date Substantive Changes

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

160 NXP Semiconductors

Revision History

Rev. 2.2 8/2013 • 21x21 functional contact table: changed from NAND to NANDF

• System Timing Parameters Table 35, Reset timing parameter, CC1 description, change from:

“Duration of SRC_POR_B to be qualified as valid (<= 5 ns)” to:

“Duration of SRC_POR_B to be qualified as valid”

and added a footnote to the parameter with the following text:

“SRC_POR_B rise and fall times must be 5 ns or less.”

Rev. 2.1 5/2013 Substantive changes throughout this document are as follows:

• Incorporated standardized signal names. This change is extensive throughout.

• Added reference to EB792, i.MX Signal Name Mapping.

• Figures updated to align to standardized signal names.

• Updated references to eMMC standard to include 4.41.

• Figure 1 Part Number Nomenclature: Updates to Part differentiator section to align with Table 1.

• Table 1 “Orderable Part Numbers,” added Arm core information to the Options column:

2x “Arm Cortex-A9” 64-bit to 6DualLite

1x “Arm Cortex -A9” 32-bit to 6Solo

• Table 2 Changed reference to Global Power Controller to read General Power Controller.

• Table 8 “Operating Ranges,” added reference for information on product lifetime: i.MX 6Dual/6Quad

Product Usage Lifetime Estimates Application Note, AN4725.

• Table 10 “Maximum Supply Currents,” updated footnote 2.

• Table 11 Stop Mode Current and Power Consumption: Added SNVS Only mode.

• Table 56 RGMII parameter TskewT minimum and maximum values corrected.

• Table 56 RGMII parameter TskewR units corrected.

• Table 88 Clarification of ENET_REF_CLK naming.

• Added Table 89, "Signals with Differing Before Reset and After Reset States," on page 146.

• Removed section, EIM Signal Cross Reference. Signal names are now aligned with reference manual.

• Removed table from Section 3.2, “Recommended Connections for Unused Analog Interfaces and

referenced the Hardware Development Guide.

• Section 1.2, “Features added bulleted item regarding the SOC-level memory system.

• Section 1.2, “Features Camera sensors: Changed Camera port to be up to 180 MHz peak.

• Added Section 1.3, “Updated Signal Naming Convention

• Section 4.2.1, “Power-Up Sequence” updated wording.

• Section 4.3.2, “Regulators for Analog Modules” section updates.

• Added Section 4.6.1, “XTALI and RTC_XTALI (Clock Inputs) DC Parameters.”

• Section 4.10, “General-Purpose Media Interface (GPMI) Timing” figures replaced, tables revised.

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.

Number Date Substantive Changes

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Document Number: IMX6SDLIEC

Rev. 9

11/2018

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