MC13203FCR2 - Freescale Semiconductor / Motorola

Freescale Semiconductor

Technical Data

Freescale reserves the right to change th e detail specificatio ns as may be required to p ermit improvements in the design of i ts

products.

Document Number: MC13202

Rev. 1.5, 12/2008

MC13202

Package Information

Plastic Package

Case 1311-03

Ordering Information

Device Device Marking Package

MC13202FC 13202 QFN-32

MC13202FCR2

(Tape and Reel) 13202 QFN-32

1 Introduction

The MC13202 is a short range, low power, 2.4 GHz

Industrial, Scientific, and Medical (ISM) band

transceivers. The MC13202 contains a complete

802.15.4 physical layer (PHY) modem designed for the

IEEE® 802.15.4 Standard which supports peer-to-peer,

star, and mesh networking.

The MC13202 includes the 802.15.4 PHY/MAC for use

with the HCS08 Family of MCUs. The MC13202 can be

used with Freescale’s IEEE 802.15.4 MAC and

BeeStack, which is Freescale’s ZigBee® compliant

protocol stack.

When combined with an appropriate microcontroller

(MCU), the MC13202 provides a cost-effective solution

for short-range data links and networks. Interface with

the MCU is accomplished using a four wire serial

peripheral interface (SPI) connection and an interrupt

request output which allows for the use of a variety of

processors. The software and processor can be scaled to

fit applications ranging from simple point-to-point

systems, through complete ZigBee networking. For

MC13202

2.4 GHz Low Power Transceiver

for the IEEE® 802.15.4 Standard

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . 4

4 Data Transfer Modes . . . . . . . . . . . . . . . . . . . 5

5 Electrical Characteristics . . . . . . . . . . . . . . . 8

6 Functional Description . . . . . . . . . . . . . . . . 12

7 Pin Connections . . . . . . . . . . . . . . . . . . . . . . 15

8 Crystal Oscillator Reference Frequency . . 19

9 Transceiver RF Co nfigurations

and External Con ne ctions 22

10Packaging Information . . . . . . . . . . . . . . . . 28

MC13202 Technical Data, Rev. 1.5

2Freescale Semiconductor

more detailed information about MC13202 operation, refer to the MC13202 Reference Manual,

(MC13202RM).

Applications include, but are not limited to, the following:

• Residential and commercial automation

— Lighting control

— Security

— Access control

— Heating, ventilation, air-conditioning (HVAC)

— Automated meter reading (AMR)

• Industrial Control

— Asset tracking and monitoring

— Homeland security

— Process management

— Environmental monitoring and control

—HVAC

— Automated meter reading

• Health Care

— Patient monitoring

— Fitness monitoring

• Consumer

— Human interface devices (keyboard, mice, etc.)

— Remote control

— Wireless toys

The transceiver includes a low noise amplifier, 1.0 mW power amplifiers (PA), onboard RF

transmit/receive (T/R) switch for single port use, PLL with internal voltage controlled oscillator (VCO),

on-board power supply regulation, and full spread-spectrum encoding and decoding. The device supports

250 kbps Offset-Quadrature Phase Shift Keying (O-QPSK) data in 2.0 MHz channels with 5.0 MHz

channel spacing per the 802.15.4 Standard. The SPI port and interrupt request output are used for receive

(RX) and transmit (TX) data transfer and control.

2Features

• Recommended power supply range: 2.0 to 3.4 V

• Fully compliant 802.15.4 Standard transceiver supports 250 kbps O-QPSK data in 5.0 MHz

channels and full spread-spectrum encode and decode

• Operates on one of 16 selectable channels in the 2.4 GHz band

• -1 to 0 dBm nominal output power, programmable from -27 dBm to +3 dBm typical

• Receive sensitivity of <-92 dBm (typical) at 1% PER, 20-byte packet, much better than the

802.15.4 Standard of -85 dBm

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 3

• Integrated transmit/receive switch

• Dual PA output pairs which can be programmed for full differential single port or dual port

operation that supports an external LNA and/or PA

• Three power down modes for increased battery life

— < 1 µA Off current

— 1.0 µA Typical Hibernate current

— 35 µA Typical Doze current (no CLKO)

• Programmable frequency clock output (CLKO) for use by MCU

• Onboard trim capability for 16 MHz crystal reference oscillator eliminates need for external

variable capacitors and allows for automated production frequency calibration

• Four internal timer comparators available to supplement MCU timer resources

• Supports both Packet Mode and Streaming Mode data transfer

• Buffered transmit and receive data packets for simplified use with low cost MCUs

• Seven GPIO to supplement MCU GPIO

• Operating temperature range: -40 °C to 85 °C

• Small form factor QFN-32 Package

— Meets moisture sensitivity level (MSL) 3

— 260 °C peak reflow temperature

— Meets lead-free requirements

2.1 Software Features

Freescale provides a wide range of software functionality to complement the MC13202 hardware. There

are three levels of application solutions:

1. Simple proprietary wireless connectivity.

2. User networks built on the 802.15.4 MAC standard.

3. ZigBee-compliant network stack.

2.1.1 Simple MAC (SMAC)

• Small memory footprint (about 3 Kbytes typical)

• Supports point-to-point and star network configurations

• Proprietary networks

• Source code and application examples provided

MC13202 Technical Data, Rev. 1.5

4Freescale Semiconductor

2.1.2 802.15.4 Standard-Compliant MAC

• Supports star, mesh and cluster tree topologies

• Supports beaconed networks

• Supports GTS for low latency

• Multiple power saving modes (idle doze, hibernate)

2.1.3 ZigBee-Compliant Network Stack

• Supports all ZigBee specifications

• Supports star, mesh and tree networks

• Advanced Encryption Standard (AES) 128-bit security

3 Block Diagrams

Figure 1 shows a simplified block diagram of the MC13202 which is an 802.15.4 Standard compatible

transceiver that provides the functions required in the physical layer (PHY) specification.

Figure 1. 802.15.4 Mode m Simplified Block Diagram

Phase Shift M odulator

RST

GPIO1

GPIO2

GPIO3

GPIO4

XTAL2

XTAL1

RFIN_M

(PAO_M)

PAO_P

PAO_M

MOSI

MISO

SPICLK

RXTXEN

ATTN

GPIO5

GPIO6

GPIO7

Receive

Packet RAM

Transmit

Pack et RAM 1

Trans m it RAM

Arbiter

Receive RAM

Arbiter

VCO

Crystal

Oscillator

Symbol

Generation

FCS

Generation Header

Generation

MUX

Sequence

Manager

(Control Logic)

VDDLO2 ÷4

256 MHz

2.45 GHz

LNA 1st IF Mix e r

IF = 65 MHz

2nd IF Mixer

IF = 1 MHz PMA Decimation

Filter Matched

Filter

Baseband

Mixer

DCD

Correlator

Symbol

Sy nch & D et

CCA Packet

Processor

IRQ

Arbiter

24 B i t E v e n t Timer

IRQ

16 MHz

AGC

Analog

Regulator VBATT

Digital

Regulator L

Digital

Regulator H

Power-Up

Control

Logic

Crystal

Regulator

VCO

Regulator

VDDINT

Programmable

Prescaler

CLKO

4 Programm able

T imer Com parators

Synthesizer

VDDD

VDDVCO

SERIAL

PERIPHERAL

INTERFACE

(SPI)

VDDA

VDDLO1

Transmit

Pack et RAM 2

T / R

RFIN_P

(PAO_P)

CT_Bias

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 5

Figure 2 shows the basic system block diagram for the MC13202 in an application. Interface with the

transceiver is accomplished through a 4-wire SPI port and interrupt request line. The media access control

(MAC), drivers, and network and application software (as required) reside on the host processor. The host

can vary from a simple 8-bit device up to a sophisticated 32-bit processor depending on application

requirements.

Figure 2. System Level Block Diagram

4 Data Transfer Modes

The MC13202 has two data transfer modes:

1. Packet Mode — Data is buffered in on-chip RAM

2. Streaming Mode — Data is processed word-by-word

The Freescale 802.15.4 MAC software only supports the streaming mode of data transfer. For proprietary

applications, packet mode can be used to conserve MCU resources.

4.1 Packet Structure

Figure 3 shows the packet structure of the MC13202. Payloads of up to 125 bytes are supported. The

MC13202 adds a four-byte preamble, a one-byte Start of Frame Delimiter (SFD), and a one-byte Frame

Length Indicator (FLI) before the data. A Frame Check Sequence (FCS) is calculated and appended to the

end of the data.

Figure 3. MC13202 Packet Structure

Analog Receiv er

MC13202

Frequency

Generation

Analog

Transmitter

Voltage

Regulators Power Up

Management

Control

Logic

Buffer RAM

Digital Tr ansceiver

SPI

and GPIO

Microcontroller

SPI ROM

(Flash)

RAM

CPU A/D

Timer

Application

IRQ Arbi ter

RAM Arbiter

Timer

Network

MAC

PHY Driver

Preamble SFD FLI Payload Data FCS

4 bytes 1 byte 1 byte 125 bytes maximum 2 bytes

MC13202 Technical Data, Rev. 1.5

6Freescale Semiconductor

4.2 Receive Path Description

In the receive signal path, the RF input is converted to low IF In-phase and Quadrature (I & Q) signals

through two down-conversion stages. A Clear Channel Assessment (CCA) can be performed based upon

the baseband energy integrated over a specific time interval. The digital backend performs Differential

Chip Detection (DCD), the correlator “de-spreads” the Direct Sequence Spread Spectrum (DSSS) Offset

QPSK (O-QPSK) signal, determines the symbols and packets, and detects the data.

The preamble, SFD, and FLI are parsed and used to detect the payload data and FCS which are stored in

RAM. A two-byte FCS is calculated on the received data and compared to the FCS value appended to the

transmitted data, which generates a Cyclical Redundancy Check (CRC) result. Link Quality is measured

over a 64 µs period after the packet preamble and stored in RAM.

If the MC13202 is in packet mode, the data is processed as an entire packet. The MCU is notified that an

entire packet has been received via an interrupt.

If the MC13202 is in streaming mode, the MCU is notified by an interrupt on a word-by-word basis.

Figure 4 shows CCA reported power level versus input power. Note that CCA reported power saturates at

about -57 dBm input power which is well above 802.15.4 Standard requirements. Figure 5 shows energy

detection/LQI reported level versus input power.

NOTE

For both graphs, the required 802.15.4 Standard accuracy and range limits

are shown. A 3.5 dBm offset has been programmed into the CCA reporting

level to center the level over temperature in the graphs.

Figure 4. Reported Power Level versus Input Power in CCA Mode

-100

-90

-80

-70

-60

-50

-90 -80 -70 -60 -50

Input Power (dBm)

R eported Pow er L evel (dBm)

80 2.15 . 4 Accura cy

an d range R e quiremen t s

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 7

Figure 5. Reported Power Level Versus Input Power for Energy Detect or Link Quality Indicator

4.3 Transmit Path Description

For the transmit path, the TX data that was previously stored in RAM is retrieved (packet mode) or the TX

data is clocked in via the SPI (stream mode), formed into packets per the 802.15.4 PHY, spread, and then

up-converted to the transmit frequency.

If the MC13202 is in packet mode, data is processed as an entire packet. The data are first loaded into the

TX buffer. The MCU then requests that the MC13202 transmit the data. The MCU is notified via an

interrupt when the whole packet has successfully been transmitted.

In streaming mode, the data is fed to the MC13202 on a word-by-word basis with an interrupt serving as

a notification that the MC13202 is ready for more data. This continues until the whole packet is

transmitted.

-85

-75

-65

-55

-45

-35

-25

-15

-85 -75 -65 -55 -45 -35 -25 -15

Input Power Level (dBm)

Reported Power Level (dBm)

802.15.4 Accuracy

and Range Requirements

MC13202 Technical Data, Rev. 1.5

8Freescale Semiconductor

5 Electrical Characteristics

5.1 Maximum Ratings

5.2 Recommended Operating Conditions

Table 1. Maximum Ratings

Rating Symbol Value Unit

Power Supply Voltage VBATT, VDDINT -0.3 to 3.6 Vdc

Digital Input Volt age Vin -0.3 to (VDDINT + 0.3)

RF Input Power Pmax 10 dBm

Junction Temperature TJ125 °C

Storage Temperature Range Tstg -55 to 125 °C

Note: Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation shoul d be restricted to the limits in the Electrical Characteristics

or Recommended Operating Conditio ns tables.

Note: Meets Human Body Model (HBM) = 2 kV. RF input/output pins have no ESD protection.

Table 2. Recommended Operating Conditions

Characteristic Symbol Min Typ Max Unit

Power Supply Voltage (VBATT = VDDINT)1

1If the supply voltage is produced by a switching DC-DC converter , ripple should be less than 100 mV peak-to-peak.

VBATT,

VDDINT

2.0 2.7 3.4 Vdc

Input Frequency fin 2.405 - 2.480 GHz

Ambient Temperature Range TA-40 25 85 °C

Logic Input V oltage Low VIL 0-30%

VDDINT

Logic Input V oltage High VIH 70%

VDDINT

-V

DDINT V

SPI Clock Rate fSPI --8.0MHz

RF Input Power Pmax --10dBm

Crystal Reference Oscillator Frequency (±40 ppm over

operating conditions to meet the 802.15.4 Standard.) fref 16 MHz Only

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 9

5.3 DC Electrical Characteristics

Table 3. DC Electrical Characteristics

(VBATT, VDDINT = 2.7 V, TA = 25 °C, unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

Power Supply Current (VBATT + VDDINT)

Off1

Hibernate1

Doze (No CLKO)1 2

Idle

Transmit Mode (0 dBm nominal output power)

Receive Mode

1To attain specified low power current, all GPIO and other digital IO must be handled properly. See Section 8.3, “Low

Power Considerations”.

2CLKO frequency at default value of 32.786 kHz.

Ileakage

ICCH

ICCD

ICCI

ICCT

ICCR

0.2

1.0

500

1.0

6.0

102

800

µA

Input Current (VIN = 0 V or VDDINT) (All digital inputs) IIN --±1µA

Input Low Voltage (All digital inputs) VIL 0-30%

VDDINT

Input High Voltage (all digital inputs) VIH 70%

VDDINT

-V

DDINT V

Output High Voltage (IOH = -1 mA) (All digital outputs) VOH 80%

VDDINT

-V

DDINT V

Output Low Voltage (IOL = 1 mA) (All digital outputs) VOL 0-20%

VDDINT

MC13202 Technical Data, Rev. 1.5

10 Freescale Semiconductor

5.4 AC Electrical Characteristics

Table 4. Receiver AC Electrical Characteristics

(VBATT, VDDINT = 2.7 V, TA = 25 °C, fref = 16 MHz, unless otherwise noted.)

Characteristic Symbol Min Typ Max Unit

Sensitivity for 1% Packet Error Rate (PER) (-40 to +85 °C) SENSper --92-dBm

Sensitivity for 1% Packet Error Rate (PER) (+25 °C) - -92 -87 dBm

Saturation (maximum input level) SENSmax -10-dBm

Channel Rejection for dual port mode (1% PER and desired signal -82 dBm)

+5 MHz (adjacent channel)

-5 MHz (adjacent channel)

+10 MHz (alternate channel)

-10 MHz (alternate channel)

>= 15 MHz

Frequency Error Tolerance - - 200 kHz

Symbol Rate Error Tolerance - - 80 ppm

Table 5. Transmitter AC Electrical Characteristics

(VBATT, VDDINT = 2.7 V, TA = 25 °C, fref = 16 MHz, unless otherwise noted.)

Characteristic Symbol Min Typ Max Unit

Power Spectral Density (-40 to +85 °C) Absolute limit - -47 - dBm

Power Spectral Density (-40 to +85 °C) Relative limit - 47 -

Nominal Output Power 1

1SPI Register 12 programmed to 0x00BC which sets output power to nominal (-1 dBm typical).

Pout -4 -1 2 dBm

Maximum Output Power2

2SPI Register 12 programmed to 0x00FF which sets output power to maximum.

4dBm

Error Vector Magnitude EVM - 20 35 %

Output Power Control Range - 30 - dB

Over the Air Data Rate - 250 - kbps

2nd Harmonic3

3Measured with output power set to nominal (0 dBm) and temperature @ 25 °C

--48-dBc

3rd Harmonic3--70-dBc

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 11

Figure 6 shows an RF parameter evaluation circuit.

Figure 6. RF Parametric Evaluation Circuit

Table 6. Digital Ti ming Specifications

(VBATT, VDDINT = 2.7 V, TA = 25 °C, frequency = 16 MHz, unless otherwise noted.

SPI timing parameters are referenced to Figure 8.

Symbol Parameter Min Typ Max Unit

T0 SPICLK period 125 nS

T1 Pulse width, SPICLK low 50 nS

T2 Pulse width, SPICLK high 50 nS

T3 Delay time, MISO data valid from falling SPICLK 15 nS

T4 Setup time, CE low to rising SPICLK 15 nS

T5 Delay time, MISO valid from CE low 15 nS

T6 Setup time, MOSI valid to rising SPICLK 15 nS

T7 Hold time, MOSI valid from rising SPICLK 15 nS

RST minimum pulse width low (asserted) 250 nS

Table 7. RF Port Impedance

Characteristic Symbol Typ Unit

RFIN Pins for internal T/R switch configuration, TX mode

2.405 GH z

2.442 GH z

2.480 GH z

Zin 16.1 - j126

16.0 – j123

15.8 – j121

RFIN Pins for internal or external T/R switch configuration, RX mode

2.405 GH z

2.442 GH z

2.480 GH z

Zin 14.4 – j77.2

14.5 – j74.8

14.6 – j72.5

PAO Pins for external T/R switch configuration, TX mode

2.405 GH z

2.442 GH z

2.480 GH z

Zin 18.5 – j148

18.3 – j146

18.2 – j143

LDB212G4005C-001

L10

4.7nH

L11

4.7nH

C12

10pF

VDDA

VDD 6

IN 5

VCONT 4

OUT1

1OUT2

GND

IC2

µPG2012TK-E2

C13

10pF

C14

10pF

LDB212G4005C-001

L12

2.2nH C15

1.8pF

4J3

SMA_edge_Receptacle_Female

L13

3.3nH

L14

3.3nH

C16

10pF

C17

1.0pF

C18

1.8pF

GPIO1 44

PAO_M 39

PAO_P 38

RFIN_P 36

RFIN_M 35

CT_Bias 34

MC1320x

MC13202 Technical Data, Rev. 1.5

12 Freescale Semiconductor

6 Functional Description

The following sections provide a detailed description of the MC13202 functionality including the

operating modes and Serial Peripheral Interface (SPI).

6.1 MC13202 Operational Modes

The MC13202 has a number of operational modes that allow for low-current operation. Transition from

the Off to Idle mode occurs when RST is nega ted. Once in Idle, the SPI is active and is used to con trol the

IC. Transition to Hibernate and Doze modes is enabled via the SPI. These modes are summarized, along

with the transition times, in Table 8. Current drain in the various modes is listed in Table 3, DC Electrical

Characteristics.

6.2 Serial Peripheral Interface (SPI)

The host microcontroller directs the MC13202, checks its status, and reads/writes data to the device

through the 4-wire SPI port. The transceiver operates as a SPI slave device only. A transaction between

the host and the MC13202 occurs as multiple 8-bit bursts on the SPI. The SPI signals are:

1. Chip Enable (CE) - A transaction on the SPI port is framed by the active low CE input signal. A

transaction is a minimum of 3 SPI bursts and can extend to a greater number of bursts.

2. SPI Clock (SPICLK) - The host drives the SPICLK input to the MC13202. Data is clocked into the

master or slave on the leading (rising) edge of the return-to-zero SPICLK and data out changes

state on the trailing (falling) edge of SPICLK.

NOTE

For Freescale microcontrollers, the SPI clock format is the clock phase

control bit CPHA = 0 and the clock polarity control bit CPOL = 0.

3. Master Out/Slave In (MOSI) - Incoming data from the host is presented on the MOSI input.

4. Master In/Slave Out (MISO) - The MC13202 presents data to the master on the MISO output.

Table 8. MC13202 Mode Definitions and Transition Times

Mode Definition Transitio n Time

To or From Idle

Off All IC functions Off, Leakage on ly. RST asserted. Digital outputs are tri-stated

including IRQ 10 - 25 ms to Idle

Hibernate Crystal Reference Oscillator Off. (SPI not functional.) IC Responds to ATTN. Data is

retained. 7 - 20 ms to Idle

Doze Crystal Reference Oscillator On but CLKO output available only if Register 7, Bit 9 =

1 for frequencies of 1 MHz or less. (SPI not functional.) Responds to ATTN and can

be programmed to enter Idle Mode through an internal timer comparator.

(300 + 1/CLKO) µs to Idle

Idle Crystal Reference Oscillator On with CL KO output available. SPI active.

Receive Crystal Reference Oscillator On. Receiver On. 144 µs from Idle

Transmit Crystal Reference Oscillator On. Transmitter On. 144 µs from Idle

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 13

A typical interconnection to a microcontroller is shown in Figure 7.

Figure 7. SPI Interface

Although the SPI port is fully static, internal memory, timer and interrupt arbiters require an internal clock

(CLKcore), derived from the crystal reference oscillator , to communicate from the SPI register s to internal

registers and memory.

6.2.1 SPI Burst Operation

The SPI port of an MCU transfers data in bursts of 8 bits with most significant bit ( MSB) first. The master

(MCU) can send a byte to the slave (transceiver) on the MOSI line and the slave can send a byte to the

master on the MISO line. Although an MC13202 transaction is three or more SPI bursts long, the timing

of a single SPI burst is shown in Figure 8.

Figure 8. SPI Single Burst Timing Diagram

SPI digital timing specifications are shown in Table 6.

Shift Regis ter

Baud Rate

Generator

Shift Register

Chip Enable (CE)

RxD MISO

TxD MOSI

Sclk SPICLK

MCU MC13202

12345 678

SPICLK

SPI B urst

Valid

T5 T6 T3

Valid

MISO

MOSI

Valid

MC13202 Technical Data, Rev. 1.5

14 Freescale Semiconductor

6.2.2 SPI Transaction Operation

Although the SPI port of an MCU transfers data in bursts of 8 bits, the MC13202 requires that a complete

SPI transaction be framed by CE, and there will be three (3) or more bursts per transaction. The assertion

of CE to low signals the start of a transaction. The first SPI burst is a write of an 8-bit header to the

transceiver (MOSI is valid) that defines a 6-bit address of the internal resource being accessed and

identifies the access as being a read or write operation. In this context, a write is data written to the

MC13202 and a read is data written to the SPI master. The following SPI bursts will be either the write

data (MOSI is valid) to the transceiver or read data from the transceiver (MISO is valid).

Although the SPI bus is capable of sending data simultaneously between master and slave, the MC13202

never uses this mode. The number of data bytes (payload) will be a minimum of 2 bytes and can extend to

a larger number depending on the type of access. The number of payload bytes sent will always be an even

integer. After the final SPI burst, CE is negated to high to signal the end of the transaction. Refer to the

MC13202 Reference Manual, (MC13202RM) for more details on SPI registers and transaction types.

An example SPI read transaction with a 2-byte payload is shown in Figure 9.

Figure 9. SPI Read Transaction Diagram

SPICLK

MISO

MOSI Valid

Valid Valid

C lock B urst

H eader R ead data

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 15

7 Pin Connections

Table 8. Pin Function Description

Pin # Pin Name Type Description Functionality

1RFIN_M RF Input RF input/output ne gative. When used with internal T/R switch, this is

a bi-directional RF port for the internal LNA

and PA

2RFIN_P RF Input RF input/output po sitive. When used with internal T/R switch, this is

a bi-directional RF port for the internal LNA

and PA

3CT_Bias Control voltage Bias voltage/control signal for external

RF components When used with internal T/R switch ,

provides RX ground reference and TX

VDDA reference for use with external

balun. Can also be used as a control signal

for external LNA, PA, or T/R switch.

4NC Tie to Ground.

5PAO_P RF Output /DC Input RF Power Amplifier Output Positive. Open drain. Connect to VDDA through a

bias network when used with an external

balun. Not used when internal T/R switch is

used.

6PAO_M RF Output/DC Input RF Power Amplifier Output Negative. Open drain. Connect to VDDA through a

bias network when used with an external

balun. Not used when internal T/R switch is

used.

7SM Input Test mode pi n. Must be grounded for normal operation.

8GPIO41Digital Input/ Output General Purpose Input/Output 4. See Footnote 1

9GPIO31Digital Input/ Output General Purpose Input/Output 3. See Footnote 1

10 GPIO21Digital Input/ Output General Purpose Input/Output 2.

When gpio_alt_en, Register 9, Bit 7 =

1, GPIO2 funct i on s as a “C RC Valid”

indicator.

See Footnote 1

11 GPIO11Digital Input/ Output General Purpose Input/Output 1.

When gpio_alt_en, Register 9, Bit 7 =

1, GPIO1 functions as an “Out of Idle”

indicator.

See Footnote 1

12 RST Digital Input Active Low Reset. While held low , the

IC is in Off Mode and all internal

information is lost from RAM and SPI

registers. When high, IC goes to IDLE

Mode, with SPI in default state.

MC13202 Technical Data, Rev. 1.5

16 Freescale Semiconductor

13 RXTXEN2Digital Input Active High. Low to high transition

initiates RX or TX sequence

depending on SPI setting. Should be

taken high after SPI programming to

start RX or TX sequence and should

be held high through the sequence.

After sequence is complete, return

RXTXEN to low. When held low,

forces Idle Mode.

See Footnote 2

14 ATTN2Digital Input Active Low Attention. Tr ansitions IC

from either Hibernate or Doze Modes

to Idle.

See Footnote 2

15 CLKO Digital Output Clock output to host MCU.

Programmable frequencies of:

16 MHz, 8 MHz, 4 MHz, 2 MHz, 1

MHz, 62.5 kHz, 32.786+ kHz

(default),

and 16.393+ kHz.

16 SPICLK2Digital Clock Input External clock input for the SPI

interface. See Footnote 2

17 MOSI2Digital Input Master Out/Slave In. Dedicated SPI

data input. See Footnote 2

18 MISO3Digital Output Master In/Slave Out. Dedica ted SPI

data output. See Footnote 3

19 CE2Digital Input Active Low Chip Enable. Enables SPI

transfers. See Footnote 2

20 IRQ Digital Output Active Low Interrupt Request. Open drain device.

Programmable 40 kΩ internal pull-up .

Interrupt can be serviced every 6 µs with

<20 pF load.

Optional external pull-up mu st be >4 kΩ.

21 VDDD Power Output Digital regulated supply bypass. Decouple to ground.

22 VDDINT Power Input Digital interface supply & digital

regulator input. Co nnect to Battery. 2.0 to 3.4 V. Decouple to ground.

23 GPIO51Digital Input/ Output General Purpose Input/Output 5. See Footnote 1

24 GPIO61Digital Input/ Output General Purpose Input/Output 6. See Footnote 1

25 GPIO71Digital Input/ Output General Purpose Input/Output 7. See Footnote 1

26 XTAL1 Input Crystal Reference oscillator input. Connect to 16 MHz crystal and load

capacitor.

Table 8. Pin Function Description (continued)

Pin # Pin Name Type Description Functionality

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 17

27 XTAL2 Input/Output Crystal Reference oscillator output

Note: Do not load this pin by using it

as a 16 MHz source. Measure

16 MHz output at Pin 15,

CLKO, programmed for 16

MHz. See the MC13202

Reference Manual for details.

Connect to 16 MHz crystal and load

capacitor.

28 VDDLO2 Power Input LO2 VDD supply. Connect to VDDA

externally.

29 VDDLO1 Power Input LO1 VDD supply. Connect to VDDA

externally.

30 VDDVCO Power Output VCO re gulated supply bypass. Decouple to ground.

31 VBATT Power Input Analog voltage regulators Input.

Connect to Battery. Decouple to ground.

32 VDDA Power Output Analog regulated supply Output.

Connect to directly VDDLO1 and

VDDLO2 externally and to PAO±

through a bias network.

Note: Do not use this pin to supply

circuitry external to the chip.

Decouple to ground. Only active high when

CCA, RX, or TX sequences in progress.

EP Ground External paddle / flag ground. Connect to ground.

1The transceiver GPIO pins default to inputs at reset. There are no programmable pullups on these pins. Unused GPIO pins

should be tied to ground if left as inputs, or if left unconnected, they should be programmed as outputs set to the low state.

2During low power modes, input must remain driven by MCU.

3By default MISO is tri-stated when CE is negated. For low power operation, miso_hiz_en (Bit 11, Register 07) should be set

to zero so that MISO is driven low when CE is negated.

Table 8. Pin Function Description (continued)

Pin # Pin Name Type Description Functionality

MC13202 Technical Data, Rev. 1.5

18 Freescale Semiconductor

Figure 10. Pin Connections (Top View)

GPIO3

GPIO2

GPIO1

RST

RXTXEN

ATTN

CLKO

SPICLK

CT_Bias

RFIN_P

PAO_P

PAO_M

GPIO4

RFIN_M

VDDINT

GPIO5

VDDD

IRQ

MISO

MOSI

GPIO6

12 13 14 15 1611109

VDDA

VBATT

VDDVCO

VDDLO1

VDDLO2

XTAL2

XTAL1

GPIO7

29 28 27 26 25303132

MC13202

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 19

8 Crystal Oscillator Reference Frequency

This section provides application specific information regarding crystal oscillator reference design and

recommended crystal usage.

8.1 Crystal Oscillator Design Considerations

The 802.15.4 Standard requires that several frequency tolerances be kept within ± 40 ppm accuracy. This

means that a total offset up to 80 ppm between transmitter and receiver will still result in acceptable

performance. The MC13202 transceiver provides onboard crystal trim capacitors to assist in meeting this

performance.

The primary determining factor in meeting this specification is the tolerance of the crystal oscillator

reference frequency. A number of factors can contribute to this tolerance and a crystal specification will

quantify each of them:

1. The initial (or make) tolerance of the crystal resonant frequency itself.

2. The variation of the crystal resonant frequency with temperature.

3. The variation of the crystal resonant frequency with time, also commonly known as aging.

4. The variation of the crystal resonant frequency with load capacitance, also commonly known as

pulling. This is affected by:

a) The external load capacitor values - initial tolerance and variation with temperature.

b) The internal trim capacitor values - initial tolerance and variation with temperature.

c) S tray capacitance on the crystal pin nodes - including stray on-chip capacitance, stray package

capacitance and stray board capacitance; and its initial tolerance and variation with

temperature.

5. Whether or not a frequency trim step will be performed in production

Freescale requires the use of a 16 MHz crystal with a <9 pF load capacitance. The MC13202 does not

contain a reference divider, so 16 MHz is the only frequency that can be used. A crystal requiring higher

load capacitance is prohibited because a higher load on the amplifier circuit may compromise its

performance. The crystal manufacturer defines the load capacitance as that total external capacitance seen

across the two terminals of the crystal. The oscillator amplifier configuration used in the MC13202

requires two balanced load capacitors from each terminal of the crystal to ground. As such, the capacitors

are seen to be in series by the crystal, so each must be <18 pF for proper loading.

In the Figure 11 crystal reference schematic, the external load capacitors are shown as 6.8 pF each, used

in conjunction with a crystal that requires an 8 pF load capacitance. The default internal trim capacitor

value (2.4 pF) and stray capacitance total value (6.8 pF) sum up to 9.2 pF giving a total of 16 pF. The value

for the stray capacitance was determined empirically assuming the default internal trim capacitor value and

for a specific board layout. A diff erent board layout may require a dif ferent external load capacitor value.

The on-chip trim capability may be used to determine the closest standard value by adjusting the trim value

via the SPI and observing the frequency at CLKO. Each internal trim load capacitor has a trim range of

approximately 5 pF in 20 fF steps.

MC13202 Technical Data, Rev. 1.5

20 Freescale Semiconductor

Figure 11. MC13202 Modem Crystal Circuit

Initial tolerance for the internal trim capacitance is approximately ±15%.

Since the MC13202 contains an on-chip reference frequency trim capability, it is possible to trim out

virtually all of the initial tolerance factors and put the frequency within 0.12 ppm on a board-by-board

basis. Individual trimming of each board in a production environment allows use of the lowest cost crystal,

but requires that each board go through a trimming procedure. This step can be avoided by

using/specifying a crystal with a tighter stability tolerance, but the crystal will be slightly higher in cost.

A tolerance analysis budget may be created using all the previously stated factors. It is an engineering

judgment whether the worst case tolerance will assume that all factors will vary in the same direction or if

the various factors can be statistically rationalized using RSS (Root-Sum-Square) analysis. The aging

factor is usually specified in ppm/year and the product designer can determine how many years are to be

assumed for the product lifetime. T aking all of the factors into account, the product designer can determine

the needed specifications for the crystal and external load capacitors to meet the 802.15.4 Standard.

8.2 Crystal Requirements

The suggested crystal specification for the MC13202 is shown in Table 9. A number of the stated

parameters are related to desired package, desired temperature range and use of crystal capacitive load

trimming. For more design details and suggested crystals, see application note AN3251, Reference

Oscillator Crystal Requirements for MC1319x, MC1320x, MC1321x and MC1322x.

Ta ble 9. MC13202 Crystal Specifications1

1User must be sure manufacturer specifications apply to the desired package.

Parameter Value Unit Condition

Frequency 16.000000 MHz

Frequency tolerance (cut tolerance)2

2A wider frequency tolerance may acceptable if application uses trimming at production final test.

± 10 ppm at 25 °C

Frequency stability (temperature drift)3± 15 ppm Over desired temperature range

Aging4± 2 ppm max

Equivalent series resistance543 Ωmax

Load capacitance65 - 9 pF

Shunt capacitance <2 pF max

Mode of oscillation fundamental

16MHz C10

6.8pF

C11

6.8pF

Y1 = Daishinku KDS - DSX321G ZD00882

XTAL1 26

XTAL2 27

MC1320x

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 21

8.3 Low Power Considerations

• Program and use the modem IO pins properly for low power operation

— All unused modem GPIOx signals must be used one of 2 ways:

– If the Off mode is to be used as a long term low power m ode, unused GPIO should be tied

to ground. The default GPIO mode is an input and there will be no conflict.

– If only Hibernate and/or Doze modes are used as long term low power modes, the GPIO

should programmed as outputs in the low state.

— When modem GPIO are used as outputs:

– Pullup resistors should be provided (can be provided by the MCU IO pin if tied to the MCU)

if the modem Off condition is to be used as a long term low power mode.

– During Hibernate and/or Doze modes, the GPIO will retain its programmed output state.

— If the modem GPIO is used as an input, the GPIO should be driven by its source during all low

power modes or a pullup resistor should be provided.

— Digital outputs IRQ, MISO, and CLKO:

– MISO - is always an output. During Hibernate, Doze, and active modes, the default

condition is for the MISO output to go to tristate when CE is de-asserted, and this can cause

a problem with the MCU because one of its inputs can float. Program Control_B Register

07, Bit 1 1, miso_hiz_en = 0 so that MISO is driven low when CE is de-asserted. As a result,

MISO will not float when Doze or Hibernate Mode is enabled.

–IRQ - is an open drain output (OD) and should always have a pullup resistor (typically

provided by the MCU IO). IRQ acts as the interrupt request output.

NOTE

It is good practice to have the IRQ interrupt input to the MCU disabled

during the hardware reset to the modem. After releasing the modem

hardware reset, the interrupt request input to the MCU can then be enabled

to await the IRQ that signifies the modem is ready and in Idle mode; this can

prevent a possible extraneous false interrupt request.

– CLKO - is always an output. During Hibernate CLKO retains its output state, but does not

toggle. During Doze, CLKO may toggle depending on whether it is being used.

• If the MCU is also going to be used in low power modes, be sure that all unused IO are programmed

properly for low power operation (typically best case is as outputs in the low state). The MC13202

is commonly used with the Freescale MC9S08GT/GB 8-bit devices. For these MCUs:

— Use only STOP2 and STOP3 modes (not STOP1) with these devices where the GPIO states are

retained. The MCU must retain control of the MC13202 IO during low power operation.

— As stated above all unused GPIO should be programmed as outputs low for lowest power and

no floating inputs.

3A wider frequency stability may be acceptable if application uses trimming at production final test.

4A wider aging tolerance may be acceptable if application uses trimming at production final test.

5Higher ESR may be acceptable with lower load capacitance.

6Lower load capacitance can allow higher ESR and is better for low temperature operation in Doze mode.

MC13202 Technical Data, Rev. 1.5

22 Freescale Semiconductor

— MC9S08GT devices have IO signals that are not pinned-out on the package. These signals must

also be initialized (even though they cannot be used) to prevent floating inputs.

9 Transceiver RF Configurations and External

Connections

The MC13202 radio has features that allow for a flexible as well as low cost RF interface:

• Programmable output power — 0 dBm nominal output power , programmable from -27 dBm to +4

dBm typical

• <-94 dBm (typical) receive sensitivity — At 1% PER, 20-byte packet (well above 802.15.4

Standard of -85 dBm)

• Optional integrated transmit/receive (T/R) switch for low cost operation — W ith internal PAs and

LNA, the internal T/R switch allows a minimal part count radio interface using only a single balun

to interface to a single-ended antenna

• Maximum flexibility — There are full differential RF I/O pins for use with the internal T/R switch.

Optionally, these pins become the RF_IN signals and a separate set of full differential PA outputs

are also provided. Separate inputs and outputs allow for a variety of RF configurations including

external LNA and PA for increased range

• CT_Bias Output — The CT_Bias signal provides a switched bias reference for use with the internal

T/R switch, and alternatively can be programmed as an antenna switch signal for use with an

external antenna switch

• Onboard trim capability for 16 MHz crystal reference oscillator — The 802.15.4 Standard puts a

+/- 40 ppm requirement on the carrier frequency . The onboard trim capability of the modem crystal

oscillator eliminates need for external variable capacitors and allows for automated production

frequency calibration. Also tighter tolerance can produce greater receive sensitivity

9.1 RF Interface Pins

Figure 12 shows the RF interface pins and the associated analog blocks. Notice that separate PA blocks are

associated with RFIN_x and PAO_x signal pairs. The RF interface allows both single port differential

operation and dual port differential operation.

Figure 12. RF Interface Pins

SWITCH

PA1 ENABLE

CT_Bias CONTROL

PA1

PA2

FRO M TX P SM

RX ENABLE

LNA RX

SIGNAL

RFIN_P (PA O_P )

RFIN_M (P AO _M )

CT_Bias

PAO_P

PAO_M

PA2 ENABLE

CT_Bias G enerator

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 23

9.1.1 Single Port Operation

The integrated RF switch allows users to operate in a single port configuration. For Single Port Mode:

• An internal RX switch and separate PA are used and pins RFIN_P (PAO_P) and RFIN_M

(PAO_M) become bidirectional and connect both for TX and RX

• When receiving, the RX switch is enabled to the internal LNA and the TX PA is disabled.

• When transmitting, the RX switch is disabled (isolating the LNA) and a TX PA is enabled.

• The optional CT_Bias pin provides a control signal or bias voltage

— Switches between VDDA (nominal 1.8Vdc) and ground

— When used with a balun provides a high reference or bias voltage which is at VDDA for

transmit and is at ground for receive. This is the proper bias voltage to the balun that converts

a single-ended antenna to the differential interface required by the transceiver.

— Can also be used a control signal for external components (note VDDA is only active high

when a CCA, RX, or TX sequence is in progress)

Figure 13 shows a single port example with a balun.

Figure 13. Single Port RF Operation with a Balun

The CT_Bias is connected to the balun center-tap providing the proper DC bias voltage to the balun

depending on RX or TX.

9.1.2 Dual Port Operation

A second set of pins designated PAO_P and PAO_N allow operation in a dual port configuration. There

are separate paths for transmit and receive with the optional CT_Bias pin providing a signal that indicates

if the radio is in TX or RX Mode which then can be used to drive an external low noise amplifier, power

amplifier, or antenna switch.

In dual port operation, the RFIN_P and RFIN_N are inputs only, the internal RX switch to the LNA is

enabled to receive, and the associated TX PA stays disabled. Pins PAO_P and PAO_N become the

differential output pins and the associated TX PA is enabled for transmit.

Balun

Bypass

RFIN_P (PAO_P)

RFIN_M (PAO_M)

CT_Bias

PAO_P

PAO_M

MC13202/03

MC13202 Technical Data, Rev. 1.5

24 Freescale Semiconductor

Figure 14 shows two dual port configurations. First is a single antenna configuration with an external low

noise amplifier (LNA) for greater range. An external antenna switch is used to multiplex the antenna

between receive and transmit. An LNA is in the receive path to add gain for greater receive sensitivity.

Two external baluns are required to convert the single-ended antenna switch signals to the differential

signals required by the radio. Separate RFIN and PAO signals are provided for connection with the baluns.

The CT_bias signal is programmed to provide the external switch control, and the polarity of CT_Bias for

the switch control is selectable. CT_bias has a high voltage of VDDA (nominal 1.8Vdc) and may require

a buffer transistor if the antenna switch requires a higher voltage control signal.

Figure 14 also shows a dual antenna configuration where there is a RX an tenna and a TX antenna. For the

receive side, the RX antenna is ac-coupled to the dif ferential RFIN inputs and these capacitors along with

inductor L1 form a matching network. Inductors L2 and L3 are ac-coupled to ground to form a frequency

trap. For the transmit side, the TX antenna is connected to the dif ferential PAO outputs, and inductors L4

and L5 provide DC-biasing to VDDA but are ac-isolated. CT_Bias is not required or used.

Figure 14. Dual Port RF Configuration Examples

Balun

Bypass

R F IN_ P (P A O_ P )

RFIN_M (PAO _M)

CT_Bias

(A nt S w C tl)

PAO_P

PAO_M

MC13202/03

LNA

Ant

Balun

VDD

VDDA

Bypass

Using External Antenna Switch with LNA

RFIN_P (PAO_P)

RFIN_M (PAO_M)

CT_Bias

PAO_P

PAO_M

MC13202/03

VDDA

TX Antenna

Bypass Bypass

L2 L3

L4 L5

RX Antenna

Using Dual An te nna

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 25

9.2 Controlling RF Modes of Operation

Use of the RF interface pins and RF modes of operation are controlled through several bits of modem

Control_B Register 07. Figure 15 shows the model for Register 07 with the RF interface control bits

highlighted.

Figure 15. Control_B Register 07 Model

The RF interface control bits include:

• RF_switch_mode (Bit 12) — This bit selects Dual Port Mode versus Single Port Mode:

— The default condition (Bit 12 = 0) is Dual Port Mode where the RF inputs are RFIN_M and

RFIN_P and the RF outputs are PAO_M and PAO_P, and operation is as described in

Section 9.1.2, “Dual Port Operation”. The use of CT_Bias pin in Dual Port Mode is controlled

by Bit 13 and Bit 12.

— When Bit = 1, the Single Port Mode is selected where RFIN_M (PAO_M) and RFIN_P

(PAO_P) become bidirectional pins and operation is as described in Section 9.1.1, “Single Port

Operation”. The use of CT_Bias pin in Dual Port Mode in controlled by Bit 13 and Bit 12.

• Ct_bias_en (Bit 14) — This bit is the enable for the CT_Bias output. When Bit 14 = 0 (default),

the CT_Bias is disabled and stays in a Hi-Z or tri-stated condition. When Bit 14 = 1, the CT_Bias

output is active and its state is controlled by the selected mode (Bit 12), ct_bias_inv, and operation

of the radio.

• Ct_bias_inv (Bit 13) — This bit only affects the state of CT_Bias when Dual Port Mode is selected

and CT_bias is active. The CT_Bias changes state in Dual Port Mode based on the TX or RX state

of the radio. The ct_bias_inv bit causes the sense of the active state to change or invert based on

Bit 13’s setting. In this manner, the user can select the CT_Bias as a control signal for external

components and make the control signal active high or active low.

BIT 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

tmr_load

ct_bias_en

ct_bias_inv

RF_switch_mode

miso_hiz_en

clko_doze_en

tx_done_mask

rx_done_mask

use_strm_mode

hib_en

doze_en

TYPE r/w r/w r/w r/w r/w r/w r/w r/w r/w r/w r/w

RESET 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0

0x0C00

MC13202 Technical Data, Rev. 1.5

26 Freescale Semiconductor

Table 10 summarizes the operation of the RF interface control bits.

9.3 RF Control Output CT_Bias

CT_Bias is a useful signal for interface with external RF components. It must be enabled via the ct_bias_en

control bit, and then its state is determined first by the selected RF mode and then by the active state of the

radio, i.e., whether a TX or RX operation is active:

• Single Port Operation — In this mode, the CT_Bias can be used to establish the proper DC bias

voltage to a balun depending on the RX state versus TX state as described in Section 9.1.1, “Single

Port Operation”. Note that in single port operation, the ct_bias_inv has no ef fect and CT_Bias is at

VDDA for TX and is at ground for RX

• Dual Port Operation — In this mode, the CT_Bias can be used as a control sign al to enable a LNA

or PA or to determine the direction of an antenna switch as described in Section 9.1.2, “Dual Port

Operation”. In dual port operation, ct-bias_inv is used to control the sense of the output control,

i.e., CT_Bias can be active high or active low for TX and vice-versa for RX

Table 11 defines the CT_Bias output state depending on control bits and operation mode of the modem.

Note that the output state is also defined in Idle, Hibernate, and Doze state as well as RX and TX operation.

Table 10. RF Interface Control Bits

Bit Designation Default Operation

14 ct_bias_en 0 1 = CT_Bias enabled. Output state is defined by Table 11.

0 = CT_Bias disabled. Output state is tri-stated.

13 ct_bias_inv 0 The output state of CT_Bias under varying conditions is defined in Table 11. This bit only

has effect for dual port operation.

1 = CT_Bias inve rted.

0 = CT_Bias not in verted

12 RF_switch_mode 0 1= Single Port Mode selected where RF switch is active and RFIN_M and RFIN_P and

bidirectional signals.

0 = Dual Port Mode selected where RFIN_M and RFIN_P are inputs only and PAO_P

and PAO_N are separate outputs.

(This is default operation).

Table 11. CT_Bias Output vs. Register Set tings

Mode CT_Bias_en RF_switch_mode CT_Bias_inv CT_Bias

RX 1 1 0 0

RX 1 1 1 0

RX 1 0 0 0

RX 0 X X Hi-Z

RX 1 1 0 1

TX 1 1 0 1

TX 1 1 1 1

TX 1 0 0 1

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor 27

9.4 RF Single Port Application with an F Antenna

Figure 16 shows a typical single port RF application in which part count is minimized and a printed copper

F antenna is used for low cost. Only the RFIN port of the MC13202 is required because the differential

port is bi-directional and uses the on-chip T/R switch. Matching to near 50 Ohms is accomplished with L1,

L2, L3, and the traces on the PCB. A balun transforms the differential signal to single-ended to interface

with the F antenna.

The proper DC bias to the RFIN_x (PAO_x) pins is provided through the balun. The CT_Bias pin provides

the proper bias voltage point to the balun depending on operation, that is, CT_Bias is at VDDA voltage for

transmit and is at ground for receive. CT_Bias is switched between these two voltages based on the

operation. Capacitor C2 provides some high frequency bypass to the DC bias point. The L3/C1 network

provides a simple bandpass filter to limit out-of-band harmonics from the transmitter.

Figure 16. RF Single Port Application with an F-Antenna

TX 1 0 1 0

TX 0 X X Hi-Z

Idle 1 X X 0

Idle 0 X X Hi-Z

Doze 1 X X 0

Doze 0 X X Hi-Z

Hibernate 1 X X 0 (Low-Z)

Hibernate 0 X X Hi-Z

OffXXXUnknown

Table 11. CT_Bias Output vs. Register Settings (continued)

Mode CT_Bias_en RF_switch_mode CT_Bias_inv CT_Bias

6.8nH 5

LDB212G4005C-001 L3

3.9nH C1

1.0pF

No t Mou nte d

4J1

SMA_edge_Recepta

10pF

ANT1

F_Antenna

PAO_M 6

PAO_P 5

RFIN_P 2

RFIN_M 1

CT_Bias 3

MC 132 0x

1.8nH

MC13202 Technical Data, Rev. 1.5

28 Freescale Semiconductor

10 Packaging Information

Figure 17. Outline Dimensions for QFN-32, 5x5 mm

(Case 1311-03, Issue E)

EXPOSED DIE

ATTACH PAD

2.95

3.25

32X 0.18

0.30

16 9

0.5

0.1 C

0.05 C

A B

32X 0.5

0.3

0.1 A B

VIEW M -M

0.25

28X

DETAIL M

PIN 1 INDE X

2.95

3.25

PIN 1

INDEX AREA

0.1

1.0 1.00

0.05

C0.1

C0.05

CSEATING PLANE

DETAIL G

VIEW ROTATED 90° CLOCKWISE

(0.5)

(0.25)

0.8 0.75

0.00

(1.73)

(0.25)

0.065

32X 0.015

(45 )

PREFERRED CORNER CONFIGURATION

DETAIL N

0.60

0.24

0.60

0.24

DETAIL N

CORNER CONFIGURATION OPTION

DETAIL T

DETAIL M

BACKSIDE PIN 1 INDEX OPTION

DETAIL T

BACKSIDE PIN 1 INDEX OPTION

(90 )

2X 0.39

0.31

0.1

0.0

DETAIL M

BACKSIDE PIN 1 INDEX OPTION

1.6

0.475

0.425

1.5 BACKSIDE

PIN 1 INDEX

0.25

0.15

DETAIL S

DETAIL M

PREFERRED BACKSIDE PIN 1 INDEX

0.217

0.137

(0.25)

0.217

0.137

(0.1)

DETAIL S

PREFERRED BACKSIDE PIN 1 INDEX

NOTES:

1. AL L D IME NS IO NS ARE IN MILLIM ETE RS .

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

3. THE COMPLETE JEDEC DESIGNATOR FOR THIS

PACKAGE IS: HF-PQFP-N.

4. CORNER CHAMFER MAY NOT BE PRESENT.

DIMENSIONS OF OPTIONAL FEATURES ARE FOR

REFERE NCE ONLY .

5. COPLANARITY APPLIES TO LEADS, CORNER

LEADS, AND DIE ATTACH PAD.

6. FOR ANVIL SINGULATED QFN P ACKAGES,

MAXIMUM DRAFT ANGLE IS 12°.

NOTES

MC13202 Technical Data, Rev. 1.5

Freescale Semiconductor

Do c um e nt N u mb e r: MC13202

Rev. 1.5

12/2008

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Semiconductor was negligent regarding the design or manufacture of the part.

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